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USD778851S1 - Substrate for an electronic circuit - Google Patents

Substrate for an electronic circuit
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Publication number
USD778851S1
USD778851S1US29/564,507US201629564507FUSD778851SUS D778851 S1USD778851 S1US D778851S1US 201629564507 FUS201629564507 FUS 201629564507FUS D778851 SUSD778851 SUS D778851S
Authority
US
United States
Prior art keywords
substrate
electronic circuit
view
elevational view
ornamental design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/564,507
Inventor
Manabu Matsumoto
Isao Ozawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kioxia Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JPD2014-10418Fexternal-prioritypatent/JP1519751S/ja
Priority claimed from JPD2014-10421Fexternal-prioritypatent/JP1520124S/ja
Priority claimed from JPD2014-10420Fexternal-prioritypatent/JP1520123S/ja
Priority claimed from JPD2014-10419Fexternal-prioritypatent/JP1520122S/ja
Assigned to KABUSHIKI KAISHA TOSHIBAreassignmentKABUSHIKI KAISHA TOSHIBAASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).Assignors: MATSUMOTO, MANABU, OZAWA, ISAO
Priority to US29/564,507priorityCriticalpatent/USD778851S1/en
Application filed by Toshiba CorpfiledCriticalToshiba Corp
Publication of USD778851S1publicationCriticalpatent/USD778851S1/en
Application grantedgrantedCritical
Assigned to TOSHIBA MEMORY CORPORATIONreassignmentTOSHIBA MEMORY CORPORATIONASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).Assignors: KABUSHIKI KAISHA TOSHIBA
Assigned to KIOXIA CORPORATIONreassignmentKIOXIA CORPORATIONCHANGE OF NAME (SEE DOCUMENT FOR DETAILS).Assignors: TOSHIBA MEMORY CORPORATION
Activelegal-statusCriticalCurrent
Anticipated expirationlegal-statusCritical

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Description

FIG. 1 is a perspective view of a substrate for an electronic circuit showing our new design;
FIG. 2 is a rear perspective view thereof;
FIG. 3 is a front elevational view thereof;
FIG. 4 is a rear elevational view thereof;
FIG. 5 is a right side elevational view, a left side elevational view being a mirror image thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
The broken lines shown in the drawings represent portions of the substrate for an electronic circuit that form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a substrate for an electronic circuit, as shown and described.
US29/564,5072014-05-152016-05-13Substrate for an electronic circuitActiveUSD778851S1 (en)

Priority Applications (1)

Application NumberPriority DateFiling DateTitle
US29/564,507USD778851S1 (en)2014-05-152016-05-13Substrate for an electronic circuit

Applications Claiming Priority (10)

Application NumberPriority DateFiling DateTitle
JP2014-0104182014-01-23
JPD2014-10421FJP1520124S (en)2014-05-152014-05-15
JPD2014-10420FJP1520123S (en)2014-05-152014-05-15
JP2014-0104212014-05-15
JPD2014-10419FJP1520122S (en)2014-05-152014-05-15
JP2014-0104192014-05-15
JPD2014-10418FJP1519751S (en)2014-05-152014-05-15
JP2014-0104202014-05-15
US29/500,896USD764424S1 (en)2014-05-152014-08-29Substrate for an electronic circuit
US29/564,507USD778851S1 (en)2014-05-152016-05-13Substrate for an electronic circuit

Related Parent Applications (1)

Application NumberTitlePriority DateFiling Date
US29/500,896DivisionUSD764424S1 (en)2014-05-152014-08-29Substrate for an electronic circuit

Publications (1)

Publication NumberPublication Date
USD778851S1true USD778851S1 (en)2017-02-14

Family

ID=56682979

Family Applications (4)

Application NumberTitlePriority DateFiling Date
US29/500,896ActiveUSD764424S1 (en)2014-05-152014-08-29Substrate for an electronic circuit
US29/564,493ActiveUSD778850S1 (en)2014-05-152016-05-13Substrate for an electronic circuit
US29/564,507ActiveUSD778851S1 (en)2014-05-152016-05-13Substrate for an electronic circuit
US29/564,531ActiveUSD778852S1 (en)2014-05-152016-05-13Substrate for an electronic circuit

Family Applications Before (2)

Application NumberTitlePriority DateFiling Date
US29/500,896ActiveUSD764424S1 (en)2014-05-152014-08-29Substrate for an electronic circuit
US29/564,493ActiveUSD778850S1 (en)2014-05-152016-05-13Substrate for an electronic circuit

Family Applications After (1)

Application NumberTitlePriority DateFiling Date
US29/564,531ActiveUSD778852S1 (en)2014-05-152016-05-13Substrate for an electronic circuit

Country Status (1)

CountryLink
US (4)USD764424S1 (en)

Cited By (24)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
USD787456S1 (en)*2015-01-142017-05-23Kabushiki Kaisha ToshibaSubstrate for an electronic circuit
USD787457S1 (en)*2015-01-142017-05-23Kabushiki Kaisha ToshibaSubstrate for an electronic circuit
USD793973S1 (en)*2015-01-142017-08-08Kabushiki Kaisha ToshibaSubstrate for an electronic circuit
USD798251S1 (en)*2016-11-072017-09-26Transcend Information, Inc.Printed circuit board of solid-state memory
TWD189698S (en)2017-06-212018-04-11軒帆光電科技股份有限公司Portion of light source module
TWD189696S (en)2017-06-212018-04-11軒帆光電科技股份有限公司Portion of light source module
TWD189699S (en)2017-06-212018-04-11軒帆光電科技股份有限公司Portion of light source module
TWD189700S (en)2017-06-302018-04-11軒帆光電科技股份有限公司Portion of light source module
TWD189697S (en)2017-06-212018-04-11軒帆光電科技股份有限公司Portion of light source module
USD821987S1 (en)*2016-04-272018-07-03Ngk Insulators, Ltd.Flexible printed circuits
TWD192227S (en)2017-03-162018-08-11新世紀光電股份有限公司 Part of the LED package
USD825499S1 (en)2016-09-292018-08-14Genesis Photonics Inc.Light emitting diode package
US10070176B2 (en)2013-03-132018-09-04Nagrastar, LlcSystems and methods for performing transport I/O
USD830348S1 (en)*2013-09-262018-10-09Murata Manufacturing Co., Ltd.Wireless transmission/reception module
USD831009S1 (en)*2015-12-112018-10-16Gemalto M2M GmbhRadio module
USD840404S1 (en)*2013-03-132019-02-12Nagrastar, LlcSmart card interface
USD843334S1 (en)*2016-05-112019-03-19Ngk Insulators, Ltd.Flexible printed circuits
USD864968S1 (en)2015-04-302019-10-29Echostar Technologies L.L.C.Smart card interface
USD886751S1 (en)2016-09-292020-06-09Genesis Photonics Inc.Light emitting diode module
USD892774S1 (en)*2013-09-262020-08-11Murata Manufacturing Co., Ltd.Wireless transmission/reception module
USD942974S1 (en)*2018-11-202022-02-08Thales Dis Ais Deutschland GmbhCellular module
TWD236030S (en)2021-10-152025-01-21日商信越化學工業股份有限公司 (日本)Stamp component for transferring microstructure
TWD236031S (en)2021-10-152025-01-21日商信越化學工業股份有限公司 (日本)Stamp component for transferring microstructure
TWD240790S (en)2021-10-152025-10-01日商信越化學工業股份有限公司 (日本)Stamp component for transferring microstructure

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
USD742581S1 (en)*2013-12-092015-11-03Kenall Manufacturing CompanyDriver housing
USD764424S1 (en)*2014-05-152016-08-23Kabushiki Kaisha ToshibaSubstrate for an electronic circuit
USD793971S1 (en)2015-03-272017-08-08Veeco Instruments Inc.Wafer carrier with a 14-pocket configuration
USD778247S1 (en)*2015-04-162017-02-07Veeco Instruments Inc.Wafer carrier with a multi-pocket configuration
CA169446S (en)*2016-01-222017-02-21Shenzhen Longsys Electronics Co LtdSsd storage module
USD803169S1 (en)*2016-02-222017-11-21Heatscape.Com, Inc.Combined liquid cooling cold plate and vapor chamber
USD938925S1 (en)*2019-10-242021-12-21Nuvoton Technology Corporation JapanSemiconductor device
USD934820S1 (en)2019-10-242021-11-02Nuvoton Technology Corporation JapanSemiconductor device
USD1031678S1 (en)*2021-05-132024-06-18Mississippi State University, Office of Technology ManagementCombined electrical enclosure and mount for wearable plug and play device

Citations (33)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US5858481A (en)1996-01-301999-01-12Matsushita Electric Industrial Co., Ltd.Electronic circuit substrate
US6410355B1 (en)*1998-06-112002-06-25Sandisk CorporationSemiconductor package using terminals formed on a conductive layer of a circuit board
USD459706S1 (en)2001-04-272002-07-02Taiyo Yuden Co., Ltd.Hybrid integrated circuit device
US20030094628A1 (en)2001-11-212003-05-22Yeh Nai HuaMemory module structure
US20060168721A1 (en)2005-01-282006-08-03Mcguire Carney JPortable, flexible cushion for poolside use
USD526972S1 (en)2004-10-142006-08-22Toshiba Lighting & Technology CorporationLight emitting diode module
USD531139S1 (en)2004-10-142006-10-31Toshiba Lighting & Technology CorporationLight emitting diode module
US7307848B2 (en)*2003-07-172007-12-11Sandisk CorporationMemory card with raised portion
US7306161B2 (en)*2003-07-172007-12-11Sandisk CorporationMemory card with chamfer
US20080123318A1 (en)2006-11-082008-05-29Atmel CorporationMulti-component electronic package with planarized embedded-components substrate
USD608741S1 (en)2008-03-132010-01-26Panasonic CorporationSubstrate for electric circuit
US20100326710A1 (en)2009-06-292010-12-30Guigen ZhangMono-Domain Hexagonal Arrays of Nanopillars and Processes For Preparing the Same
US7864540B2 (en)*2003-07-172011-01-04Sandisk CorporationPeripheral card with sloped edges
USD633672S1 (en)2010-02-102011-03-01The Libman CompanyPad
USD633673S1 (en)2010-02-102011-03-01The Libman CompanyCloth
US20110051351A1 (en)2009-08-252011-03-03Elpida Memory, Inc.Circuit board, semiconductor device including the same, memory module, memory system, and manufacturing method of circuit board
USD637193S1 (en)2010-11-192011-05-03Apple Inc.Electronic device
USD670917S1 (en)2011-02-182012-11-20Columbia Sportswear North America, Inc.Heat reflective lining material
USD673922S1 (en)2011-04-212013-01-08Kabushiki Kaisha ToshibaPortion of a substrate for an electronic circuit
USD674759S1 (en)2010-08-192013-01-22Epistar CorporationWafer carrier
USD686175S1 (en)2012-03-202013-07-16Veeco Instruments Inc.Wafer carrier having pockets
USD686582S1 (en)2012-03-202013-07-23Veeco Instruments Inc.Wafer carrier having pockets
USD690671S1 (en)2012-03-202013-10-01Veeco Instruments Inc.Wafer carrier having pockets
USD699201S1 (en)2012-10-012014-02-11Gemalto M2M GmbhPad arrangement of a circuit module
USD702445S1 (en)2012-05-112014-04-15Columbia Sportswear North America, Inc.Printed cooling material
USD716743S1 (en)*2014-03-252014-11-04Transcend Information, Inc.Printed circuit board of solid-state memory
USD727861S1 (en)*2013-08-242015-04-28Apex Microelectronics Co., Ltd.Ink cartridge chip
USD730304S1 (en)2014-05-152015-05-26Kabushiki Kaisha ToshibaSubstrate for an electronic circuit
USD753073S1 (en)*2014-12-302016-04-05Altia Systems, Inc.Printed circuit board
USD757666S1 (en)*2014-10-162016-05-31Japan Aviation Electronics Industry, LimitedFlexible printed circuit
USD761745S1 (en)*2013-06-282016-07-19Sumitomo Electric Industries, Ltd.Semiconductor device
USD764424S1 (en)*2014-05-152016-08-23Kabushiki Kaisha ToshibaSubstrate for an electronic circuit
USD768115S1 (en)*2015-02-052016-10-04Armen E. KazanchianModule

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
WO2007051495A1 (en)*2005-11-072007-05-10Telefonaktiebolaget Lm Ericsson (Publ)Method and arrangement in a mobile telecommunication network

Patent Citations (35)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US5858481A (en)1996-01-301999-01-12Matsushita Electric Industrial Co., Ltd.Electronic circuit substrate
US6410355B1 (en)*1998-06-112002-06-25Sandisk CorporationSemiconductor package using terminals formed on a conductive layer of a circuit board
USD459706S1 (en)2001-04-272002-07-02Taiyo Yuden Co., Ltd.Hybrid integrated circuit device
USD471524S1 (en)2001-04-272003-03-11Taiyo Yuden Co., Ltd.Hybrid integrated circuit device
US20030094628A1 (en)2001-11-212003-05-22Yeh Nai HuaMemory module structure
US7306161B2 (en)*2003-07-172007-12-11Sandisk CorporationMemory card with chamfer
US7307848B2 (en)*2003-07-172007-12-11Sandisk CorporationMemory card with raised portion
US7864540B2 (en)*2003-07-172011-01-04Sandisk CorporationPeripheral card with sloped edges
USD526972S1 (en)2004-10-142006-08-22Toshiba Lighting & Technology CorporationLight emitting diode module
USD531139S1 (en)2004-10-142006-10-31Toshiba Lighting & Technology CorporationLight emitting diode module
US20060168721A1 (en)2005-01-282006-08-03Mcguire Carney JPortable, flexible cushion for poolside use
US20080123318A1 (en)2006-11-082008-05-29Atmel CorporationMulti-component electronic package with planarized embedded-components substrate
USD608741S1 (en)2008-03-132010-01-26Panasonic CorporationSubstrate for electric circuit
US20100326710A1 (en)2009-06-292010-12-30Guigen ZhangMono-Domain Hexagonal Arrays of Nanopillars and Processes For Preparing the Same
US20110051351A1 (en)2009-08-252011-03-03Elpida Memory, Inc.Circuit board, semiconductor device including the same, memory module, memory system, and manufacturing method of circuit board
USD633673S1 (en)2010-02-102011-03-01The Libman CompanyCloth
USD633672S1 (en)2010-02-102011-03-01The Libman CompanyPad
USD674759S1 (en)2010-08-192013-01-22Epistar CorporationWafer carrier
USD704155S1 (en)2010-08-192014-05-06Epistar CorporationWafer carrier
USD637193S1 (en)2010-11-192011-05-03Apple Inc.Electronic device
USD670917S1 (en)2011-02-182012-11-20Columbia Sportswear North America, Inc.Heat reflective lining material
USD673922S1 (en)2011-04-212013-01-08Kabushiki Kaisha ToshibaPortion of a substrate for an electronic circuit
USD686175S1 (en)2012-03-202013-07-16Veeco Instruments Inc.Wafer carrier having pockets
USD686582S1 (en)2012-03-202013-07-23Veeco Instruments Inc.Wafer carrier having pockets
USD690671S1 (en)2012-03-202013-10-01Veeco Instruments Inc.Wafer carrier having pockets
USD702445S1 (en)2012-05-112014-04-15Columbia Sportswear North America, Inc.Printed cooling material
USD699201S1 (en)2012-10-012014-02-11Gemalto M2M GmbhPad arrangement of a circuit module
USD761745S1 (en)*2013-06-282016-07-19Sumitomo Electric Industries, Ltd.Semiconductor device
USD727861S1 (en)*2013-08-242015-04-28Apex Microelectronics Co., Ltd.Ink cartridge chip
USD716743S1 (en)*2014-03-252014-11-04Transcend Information, Inc.Printed circuit board of solid-state memory
USD730304S1 (en)2014-05-152015-05-26Kabushiki Kaisha ToshibaSubstrate for an electronic circuit
USD764424S1 (en)*2014-05-152016-08-23Kabushiki Kaisha ToshibaSubstrate for an electronic circuit
USD757666S1 (en)*2014-10-162016-05-31Japan Aviation Electronics Industry, LimitedFlexible printed circuit
USD753073S1 (en)*2014-12-302016-04-05Altia Systems, Inc.Printed circuit board
USD768115S1 (en)*2015-02-052016-10-04Armen E. KazanchianModule

Cited By (30)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US10070176B2 (en)2013-03-132018-09-04Nagrastar, LlcSystems and methods for performing transport I/O
US10382816B2 (en)2013-03-132019-08-13Nagrastar, LlcSystems and methods for performing transport I/O
USD840404S1 (en)*2013-03-132019-02-12Nagrastar, LlcSmart card interface
USD892774S1 (en)*2013-09-262020-08-11Murata Manufacturing Co., Ltd.Wireless transmission/reception module
USD830348S1 (en)*2013-09-262018-10-09Murata Manufacturing Co., Ltd.Wireless transmission/reception module
USD787457S1 (en)*2015-01-142017-05-23Kabushiki Kaisha ToshibaSubstrate for an electronic circuit
USD793973S1 (en)*2015-01-142017-08-08Kabushiki Kaisha ToshibaSubstrate for an electronic circuit
USD787456S1 (en)*2015-01-142017-05-23Kabushiki Kaisha ToshibaSubstrate for an electronic circuit
USD864968S1 (en)2015-04-302019-10-29Echostar Technologies L.L.C.Smart card interface
USD831009S1 (en)*2015-12-112018-10-16Gemalto M2M GmbhRadio module
USD904355S1 (en)2015-12-112020-12-08Gemalto M2M GmbhRadio module
USD821987S1 (en)*2016-04-272018-07-03Ngk Insulators, Ltd.Flexible printed circuits
USD843334S1 (en)*2016-05-112019-03-19Ngk Insulators, Ltd.Flexible printed circuits
USD886751S1 (en)2016-09-292020-06-09Genesis Photonics Inc.Light emitting diode module
USD825499S1 (en)2016-09-292018-08-14Genesis Photonics Inc.Light emitting diode package
USD843957S1 (en)2016-09-292019-03-26Genesis Photonics Inc.Light emitting diode package
USD798251S1 (en)*2016-11-072017-09-26Transcend Information, Inc.Printed circuit board of solid-state memory
TWD192227S (en)2017-03-162018-08-11新世紀光電股份有限公司 Part of the LED package
TWD189699S (en)2017-06-212018-04-11軒帆光電科技股份有限公司Portion of light source module
TWD189698S (en)2017-06-212018-04-11軒帆光電科技股份有限公司Portion of light source module
TWD189696S (en)2017-06-212018-04-11軒帆光電科技股份有限公司Portion of light source module
TWD189697S (en)2017-06-212018-04-11軒帆光電科技股份有限公司Portion of light source module
TWD189700S (en)2017-06-302018-04-11軒帆光電科技股份有限公司Portion of light source module
USD942974S1 (en)*2018-11-202022-02-08Thales Dis Ais Deutschland GmbhCellular module
USD1054404S1 (en)2018-11-202024-12-17Kontron Europe GmbhCellular module
TWD236030S (en)2021-10-152025-01-21日商信越化學工業股份有限公司 (日本)Stamp component for transferring microstructure
TWD236031S (en)2021-10-152025-01-21日商信越化學工業股份有限公司 (日本)Stamp component for transferring microstructure
TWD240790S (en)2021-10-152025-10-01日商信越化學工業股份有限公司 (日本)Stamp component for transferring microstructure
TWD240715S (en)2021-10-152025-10-01日商信越化學工業股份有限公司 (日本)Stamp component for transferring microstructure
TWD240714S (en)2021-10-152025-10-01日商信越化學工業股份有限公司 (日本)Stamp component for transferring microstructure

Also Published As

Publication numberPublication date
USD778852S1 (en)2017-02-14
USD778850S1 (en)2017-02-14
USD764424S1 (en)2016-08-23

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