





| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US29/564,507USD778851S1 (en) | 2014-05-15 | 2016-05-13 | Substrate for an electronic circuit |
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014-010418 | 2014-01-23 | ||
| JPD2014-10421FJP1520124S (en) | 2014-05-15 | 2014-05-15 | |
| JPD2014-10420FJP1520123S (en) | 2014-05-15 | 2014-05-15 | |
| JP2014-010421 | 2014-05-15 | ||
| JPD2014-10419FJP1520122S (en) | 2014-05-15 | 2014-05-15 | |
| JP2014-010419 | 2014-05-15 | ||
| JPD2014-10418FJP1519751S (en) | 2014-05-15 | 2014-05-15 | |
| JP2014-010420 | 2014-05-15 | ||
| US29/500,896USD764424S1 (en) | 2014-05-15 | 2014-08-29 | Substrate for an electronic circuit |
| US29/564,507USD778851S1 (en) | 2014-05-15 | 2016-05-13 | Substrate for an electronic circuit |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/500,896DivisionUSD764424S1 (en) | 2014-05-15 | 2014-08-29 | Substrate for an electronic circuit |
| Publication Number | Publication Date |
|---|---|
| USD778851S1true USD778851S1 (en) | 2017-02-14 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/500,896ActiveUSD764424S1 (en) | 2014-05-15 | 2014-08-29 | Substrate for an electronic circuit |
| US29/564,493ActiveUSD778850S1 (en) | 2014-05-15 | 2016-05-13 | Substrate for an electronic circuit |
| US29/564,507ActiveUSD778851S1 (en) | 2014-05-15 | 2016-05-13 | Substrate for an electronic circuit |
| US29/564,531ActiveUSD778852S1 (en) | 2014-05-15 | 2016-05-13 | Substrate for an electronic circuit |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/500,896ActiveUSD764424S1 (en) | 2014-05-15 | 2014-08-29 | Substrate for an electronic circuit |
| US29/564,493ActiveUSD778850S1 (en) | 2014-05-15 | 2016-05-13 | Substrate for an electronic circuit |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/564,531ActiveUSD778852S1 (en) | 2014-05-15 | 2016-05-13 | Substrate for an electronic circuit |
| Country | Link |
|---|---|
| US (4) | USD764424S1 (en) |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD787456S1 (en)* | 2015-01-14 | 2017-05-23 | Kabushiki Kaisha Toshiba | Substrate for an electronic circuit |
| USD787457S1 (en)* | 2015-01-14 | 2017-05-23 | Kabushiki Kaisha Toshiba | Substrate for an electronic circuit |
| USD793973S1 (en)* | 2015-01-14 | 2017-08-08 | Kabushiki Kaisha Toshiba | Substrate for an electronic circuit |
| USD798251S1 (en)* | 2016-11-07 | 2017-09-26 | Transcend Information, Inc. | Printed circuit board of solid-state memory |
| TWD189698S (en) | 2017-06-21 | 2018-04-11 | 軒帆光電科技股份有限公司 | Portion of light source module |
| TWD189696S (en) | 2017-06-21 | 2018-04-11 | 軒帆光電科技股份有限公司 | Portion of light source module |
| TWD189699S (en) | 2017-06-21 | 2018-04-11 | 軒帆光電科技股份有限公司 | Portion of light source module |
| TWD189700S (en) | 2017-06-30 | 2018-04-11 | 軒帆光電科技股份有限公司 | Portion of light source module |
| TWD189697S (en) | 2017-06-21 | 2018-04-11 | 軒帆光電科技股份有限公司 | Portion of light source module |
| USD821987S1 (en)* | 2016-04-27 | 2018-07-03 | Ngk Insulators, Ltd. | Flexible printed circuits |
| TWD192227S (en) | 2017-03-16 | 2018-08-11 | 新世紀光電股份有限公司 | Part of the LED package |
| USD825499S1 (en) | 2016-09-29 | 2018-08-14 | Genesis Photonics Inc. | Light emitting diode package |
| US10070176B2 (en) | 2013-03-13 | 2018-09-04 | Nagrastar, Llc | Systems and methods for performing transport I/O |
| USD830348S1 (en)* | 2013-09-26 | 2018-10-09 | Murata Manufacturing Co., Ltd. | Wireless transmission/reception module |
| USD831009S1 (en)* | 2015-12-11 | 2018-10-16 | Gemalto M2M Gmbh | Radio module |
| USD840404S1 (en)* | 2013-03-13 | 2019-02-12 | Nagrastar, Llc | Smart card interface |
| USD843334S1 (en)* | 2016-05-11 | 2019-03-19 | Ngk Insulators, Ltd. | Flexible printed circuits |
| USD864968S1 (en) | 2015-04-30 | 2019-10-29 | Echostar Technologies L.L.C. | Smart card interface |
| USD886751S1 (en) | 2016-09-29 | 2020-06-09 | Genesis Photonics Inc. | Light emitting diode module |
| USD892774S1 (en)* | 2013-09-26 | 2020-08-11 | Murata Manufacturing Co., Ltd. | Wireless transmission/reception module |
| USD942974S1 (en)* | 2018-11-20 | 2022-02-08 | Thales Dis Ais Deutschland Gmbh | Cellular module |
| TWD236030S (en) | 2021-10-15 | 2025-01-21 | 日商信越化學工業股份有限公司 (日本) | Stamp component for transferring microstructure |
| TWD236031S (en) | 2021-10-15 | 2025-01-21 | 日商信越化學工業股份有限公司 (日本) | Stamp component for transferring microstructure |
| TWD240790S (en) | 2021-10-15 | 2025-10-01 | 日商信越化學工業股份有限公司 (日本) | Stamp component for transferring microstructure |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD742581S1 (en)* | 2013-12-09 | 2015-11-03 | Kenall Manufacturing Company | Driver housing |
| USD764424S1 (en)* | 2014-05-15 | 2016-08-23 | Kabushiki Kaisha Toshiba | Substrate for an electronic circuit |
| USD793971S1 (en) | 2015-03-27 | 2017-08-08 | Veeco Instruments Inc. | Wafer carrier with a 14-pocket configuration |
| USD778247S1 (en)* | 2015-04-16 | 2017-02-07 | Veeco Instruments Inc. | Wafer carrier with a multi-pocket configuration |
| CA169446S (en)* | 2016-01-22 | 2017-02-21 | Shenzhen Longsys Electronics Co Ltd | Ssd storage module |
| USD803169S1 (en)* | 2016-02-22 | 2017-11-21 | Heatscape.Com, Inc. | Combined liquid cooling cold plate and vapor chamber |
| USD938925S1 (en)* | 2019-10-24 | 2021-12-21 | Nuvoton Technology Corporation Japan | Semiconductor device |
| USD934820S1 (en) | 2019-10-24 | 2021-11-02 | Nuvoton Technology Corporation Japan | Semiconductor device |
| USD1031678S1 (en)* | 2021-05-13 | 2024-06-18 | Mississippi State University, Office of Technology Management | Combined electrical enclosure and mount for wearable plug and play device |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5858481A (en) | 1996-01-30 | 1999-01-12 | Matsushita Electric Industrial Co., Ltd. | Electronic circuit substrate |
| US6410355B1 (en)* | 1998-06-11 | 2002-06-25 | Sandisk Corporation | Semiconductor package using terminals formed on a conductive layer of a circuit board |
| USD459706S1 (en) | 2001-04-27 | 2002-07-02 | Taiyo Yuden Co., Ltd. | Hybrid integrated circuit device |
| US20030094628A1 (en) | 2001-11-21 | 2003-05-22 | Yeh Nai Hua | Memory module structure |
| US20060168721A1 (en) | 2005-01-28 | 2006-08-03 | Mcguire Carney J | Portable, flexible cushion for poolside use |
| USD526972S1 (en) | 2004-10-14 | 2006-08-22 | Toshiba Lighting & Technology Corporation | Light emitting diode module |
| USD531139S1 (en) | 2004-10-14 | 2006-10-31 | Toshiba Lighting & Technology Corporation | Light emitting diode module |
| US7307848B2 (en)* | 2003-07-17 | 2007-12-11 | Sandisk Corporation | Memory card with raised portion |
| US7306161B2 (en)* | 2003-07-17 | 2007-12-11 | Sandisk Corporation | Memory card with chamfer |
| US20080123318A1 (en) | 2006-11-08 | 2008-05-29 | Atmel Corporation | Multi-component electronic package with planarized embedded-components substrate |
| USD608741S1 (en) | 2008-03-13 | 2010-01-26 | Panasonic Corporation | Substrate for electric circuit |
| US20100326710A1 (en) | 2009-06-29 | 2010-12-30 | Guigen Zhang | Mono-Domain Hexagonal Arrays of Nanopillars and Processes For Preparing the Same |
| US7864540B2 (en)* | 2003-07-17 | 2011-01-04 | Sandisk Corporation | Peripheral card with sloped edges |
| USD633672S1 (en) | 2010-02-10 | 2011-03-01 | The Libman Company | Pad |
| USD633673S1 (en) | 2010-02-10 | 2011-03-01 | The Libman Company | Cloth |
| US20110051351A1 (en) | 2009-08-25 | 2011-03-03 | Elpida Memory, Inc. | Circuit board, semiconductor device including the same, memory module, memory system, and manufacturing method of circuit board |
| USD637193S1 (en) | 2010-11-19 | 2011-05-03 | Apple Inc. | Electronic device |
| USD670917S1 (en) | 2011-02-18 | 2012-11-20 | Columbia Sportswear North America, Inc. | Heat reflective lining material |
| USD673922S1 (en) | 2011-04-21 | 2013-01-08 | Kabushiki Kaisha Toshiba | Portion of a substrate for an electronic circuit |
| USD674759S1 (en) | 2010-08-19 | 2013-01-22 | Epistar Corporation | Wafer carrier |
| USD686175S1 (en) | 2012-03-20 | 2013-07-16 | Veeco Instruments Inc. | Wafer carrier having pockets |
| USD686582S1 (en) | 2012-03-20 | 2013-07-23 | Veeco Instruments Inc. | Wafer carrier having pockets |
| USD690671S1 (en) | 2012-03-20 | 2013-10-01 | Veeco Instruments Inc. | Wafer carrier having pockets |
| USD699201S1 (en) | 2012-10-01 | 2014-02-11 | Gemalto M2M Gmbh | Pad arrangement of a circuit module |
| USD702445S1 (en) | 2012-05-11 | 2014-04-15 | Columbia Sportswear North America, Inc. | Printed cooling material |
| USD716743S1 (en)* | 2014-03-25 | 2014-11-04 | Transcend Information, Inc. | Printed circuit board of solid-state memory |
| USD727861S1 (en)* | 2013-08-24 | 2015-04-28 | Apex Microelectronics Co., Ltd. | Ink cartridge chip |
| USD730304S1 (en) | 2014-05-15 | 2015-05-26 | Kabushiki Kaisha Toshiba | Substrate for an electronic circuit |
| USD753073S1 (en)* | 2014-12-30 | 2016-04-05 | Altia Systems, Inc. | Printed circuit board |
| USD757666S1 (en)* | 2014-10-16 | 2016-05-31 | Japan Aviation Electronics Industry, Limited | Flexible printed circuit |
| USD761745S1 (en)* | 2013-06-28 | 2016-07-19 | Sumitomo Electric Industries, Ltd. | Semiconductor device |
| USD764424S1 (en)* | 2014-05-15 | 2016-08-23 | Kabushiki Kaisha Toshiba | Substrate for an electronic circuit |
| USD768115S1 (en)* | 2015-02-05 | 2016-10-04 | Armen E. Kazanchian | Module |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007051495A1 (en)* | 2005-11-07 | 2007-05-10 | Telefonaktiebolaget Lm Ericsson (Publ) | Method and arrangement in a mobile telecommunication network |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5858481A (en) | 1996-01-30 | 1999-01-12 | Matsushita Electric Industrial Co., Ltd. | Electronic circuit substrate |
| US6410355B1 (en)* | 1998-06-11 | 2002-06-25 | Sandisk Corporation | Semiconductor package using terminals formed on a conductive layer of a circuit board |
| USD459706S1 (en) | 2001-04-27 | 2002-07-02 | Taiyo Yuden Co., Ltd. | Hybrid integrated circuit device |
| USD471524S1 (en) | 2001-04-27 | 2003-03-11 | Taiyo Yuden Co., Ltd. | Hybrid integrated circuit device |
| US20030094628A1 (en) | 2001-11-21 | 2003-05-22 | Yeh Nai Hua | Memory module structure |
| US7306161B2 (en)* | 2003-07-17 | 2007-12-11 | Sandisk Corporation | Memory card with chamfer |
| US7307848B2 (en)* | 2003-07-17 | 2007-12-11 | Sandisk Corporation | Memory card with raised portion |
| US7864540B2 (en)* | 2003-07-17 | 2011-01-04 | Sandisk Corporation | Peripheral card with sloped edges |
| USD526972S1 (en) | 2004-10-14 | 2006-08-22 | Toshiba Lighting & Technology Corporation | Light emitting diode module |
| USD531139S1 (en) | 2004-10-14 | 2006-10-31 | Toshiba Lighting & Technology Corporation | Light emitting diode module |
| US20060168721A1 (en) | 2005-01-28 | 2006-08-03 | Mcguire Carney J | Portable, flexible cushion for poolside use |
| US20080123318A1 (en) | 2006-11-08 | 2008-05-29 | Atmel Corporation | Multi-component electronic package with planarized embedded-components substrate |
| USD608741S1 (en) | 2008-03-13 | 2010-01-26 | Panasonic Corporation | Substrate for electric circuit |
| US20100326710A1 (en) | 2009-06-29 | 2010-12-30 | Guigen Zhang | Mono-Domain Hexagonal Arrays of Nanopillars and Processes For Preparing the Same |
| US20110051351A1 (en) | 2009-08-25 | 2011-03-03 | Elpida Memory, Inc. | Circuit board, semiconductor device including the same, memory module, memory system, and manufacturing method of circuit board |
| USD633673S1 (en) | 2010-02-10 | 2011-03-01 | The Libman Company | Cloth |
| USD633672S1 (en) | 2010-02-10 | 2011-03-01 | The Libman Company | Pad |
| USD674759S1 (en) | 2010-08-19 | 2013-01-22 | Epistar Corporation | Wafer carrier |
| USD704155S1 (en) | 2010-08-19 | 2014-05-06 | Epistar Corporation | Wafer carrier |
| USD637193S1 (en) | 2010-11-19 | 2011-05-03 | Apple Inc. | Electronic device |
| USD670917S1 (en) | 2011-02-18 | 2012-11-20 | Columbia Sportswear North America, Inc. | Heat reflective lining material |
| USD673922S1 (en) | 2011-04-21 | 2013-01-08 | Kabushiki Kaisha Toshiba | Portion of a substrate for an electronic circuit |
| USD686175S1 (en) | 2012-03-20 | 2013-07-16 | Veeco Instruments Inc. | Wafer carrier having pockets |
| USD686582S1 (en) | 2012-03-20 | 2013-07-23 | Veeco Instruments Inc. | Wafer carrier having pockets |
| USD690671S1 (en) | 2012-03-20 | 2013-10-01 | Veeco Instruments Inc. | Wafer carrier having pockets |
| USD702445S1 (en) | 2012-05-11 | 2014-04-15 | Columbia Sportswear North America, Inc. | Printed cooling material |
| USD699201S1 (en) | 2012-10-01 | 2014-02-11 | Gemalto M2M Gmbh | Pad arrangement of a circuit module |
| USD761745S1 (en)* | 2013-06-28 | 2016-07-19 | Sumitomo Electric Industries, Ltd. | Semiconductor device |
| USD727861S1 (en)* | 2013-08-24 | 2015-04-28 | Apex Microelectronics Co., Ltd. | Ink cartridge chip |
| USD716743S1 (en)* | 2014-03-25 | 2014-11-04 | Transcend Information, Inc. | Printed circuit board of solid-state memory |
| USD730304S1 (en) | 2014-05-15 | 2015-05-26 | Kabushiki Kaisha Toshiba | Substrate for an electronic circuit |
| USD764424S1 (en)* | 2014-05-15 | 2016-08-23 | Kabushiki Kaisha Toshiba | Substrate for an electronic circuit |
| USD757666S1 (en)* | 2014-10-16 | 2016-05-31 | Japan Aviation Electronics Industry, Limited | Flexible printed circuit |
| USD753073S1 (en)* | 2014-12-30 | 2016-04-05 | Altia Systems, Inc. | Printed circuit board |
| USD768115S1 (en)* | 2015-02-05 | 2016-10-04 | Armen E. Kazanchian | Module |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10070176B2 (en) | 2013-03-13 | 2018-09-04 | Nagrastar, Llc | Systems and methods for performing transport I/O |
| US10382816B2 (en) | 2013-03-13 | 2019-08-13 | Nagrastar, Llc | Systems and methods for performing transport I/O |
| USD840404S1 (en)* | 2013-03-13 | 2019-02-12 | Nagrastar, Llc | Smart card interface |
| USD892774S1 (en)* | 2013-09-26 | 2020-08-11 | Murata Manufacturing Co., Ltd. | Wireless transmission/reception module |
| USD830348S1 (en)* | 2013-09-26 | 2018-10-09 | Murata Manufacturing Co., Ltd. | Wireless transmission/reception module |
| USD787457S1 (en)* | 2015-01-14 | 2017-05-23 | Kabushiki Kaisha Toshiba | Substrate for an electronic circuit |
| USD793973S1 (en)* | 2015-01-14 | 2017-08-08 | Kabushiki Kaisha Toshiba | Substrate for an electronic circuit |
| USD787456S1 (en)* | 2015-01-14 | 2017-05-23 | Kabushiki Kaisha Toshiba | Substrate for an electronic circuit |
| USD864968S1 (en) | 2015-04-30 | 2019-10-29 | Echostar Technologies L.L.C. | Smart card interface |
| USD831009S1 (en)* | 2015-12-11 | 2018-10-16 | Gemalto M2M Gmbh | Radio module |
| USD904355S1 (en) | 2015-12-11 | 2020-12-08 | Gemalto M2M Gmbh | Radio module |
| USD821987S1 (en)* | 2016-04-27 | 2018-07-03 | Ngk Insulators, Ltd. | Flexible printed circuits |
| USD843334S1 (en)* | 2016-05-11 | 2019-03-19 | Ngk Insulators, Ltd. | Flexible printed circuits |
| USD886751S1 (en) | 2016-09-29 | 2020-06-09 | Genesis Photonics Inc. | Light emitting diode module |
| USD825499S1 (en) | 2016-09-29 | 2018-08-14 | Genesis Photonics Inc. | Light emitting diode package |
| USD843957S1 (en) | 2016-09-29 | 2019-03-26 | Genesis Photonics Inc. | Light emitting diode package |
| USD798251S1 (en)* | 2016-11-07 | 2017-09-26 | Transcend Information, Inc. | Printed circuit board of solid-state memory |
| TWD192227S (en) | 2017-03-16 | 2018-08-11 | 新世紀光電股份有限公司 | Part of the LED package |
| TWD189699S (en) | 2017-06-21 | 2018-04-11 | 軒帆光電科技股份有限公司 | Portion of light source module |
| TWD189698S (en) | 2017-06-21 | 2018-04-11 | 軒帆光電科技股份有限公司 | Portion of light source module |
| TWD189696S (en) | 2017-06-21 | 2018-04-11 | 軒帆光電科技股份有限公司 | Portion of light source module |
| TWD189697S (en) | 2017-06-21 | 2018-04-11 | 軒帆光電科技股份有限公司 | Portion of light source module |
| TWD189700S (en) | 2017-06-30 | 2018-04-11 | 軒帆光電科技股份有限公司 | Portion of light source module |
| USD942974S1 (en)* | 2018-11-20 | 2022-02-08 | Thales Dis Ais Deutschland Gmbh | Cellular module |
| USD1054404S1 (en) | 2018-11-20 | 2024-12-17 | Kontron Europe Gmbh | Cellular module |
| TWD236030S (en) | 2021-10-15 | 2025-01-21 | 日商信越化學工業股份有限公司 (日本) | Stamp component for transferring microstructure |
| TWD236031S (en) | 2021-10-15 | 2025-01-21 | 日商信越化學工業股份有限公司 (日本) | Stamp component for transferring microstructure |
| TWD240790S (en) | 2021-10-15 | 2025-10-01 | 日商信越化學工業股份有限公司 (日本) | Stamp component for transferring microstructure |
| TWD240715S (en) | 2021-10-15 | 2025-10-01 | 日商信越化學工業股份有限公司 (日本) | Stamp component for transferring microstructure |
| TWD240714S (en) | 2021-10-15 | 2025-10-01 | 日商信越化學工業股份有限公司 (日本) | Stamp component for transferring microstructure |
| Publication number | Publication date |
|---|---|
| USD778852S1 (en) | 2017-02-14 |
| USD778850S1 (en) | 2017-02-14 |
| USD764424S1 (en) | 2016-08-23 |
| Publication | Publication Date | Title |
|---|---|---|
| USD778851S1 (en) | Substrate for an electronic circuit | |
| USD988312S1 (en) | Electronic device | |
| USD917467S1 (en) | Electronic device | |
| USD897415S1 (en) | Camera mount | |
| USD809514S1 (en) | Electronic device | |
| USD876431S1 (en) | Electronic device | |
| USD816662S1 (en) | Electronic device | |
| USD769859S1 (en) | Mount for an electronic device | |
| USD773474S1 (en) | Electronic device | |
| USD790497S1 (en) | Electronic device | |
| USD795825S1 (en) | Electronic device | |
| USD784946S1 (en) | Electronic device | |
| USD802571S1 (en) | Electronic device | |
| USD763856S1 (en) | Case for an electronic device | |
| USD764703S1 (en) | Electronic cigarette | |
| USD742874S1 (en) | Wearable electronic device | |
| USD809043S1 (en) | Electronic camera | |
| USD725655S1 (en) | Electronic device | |
| USD867359S1 (en) | Electronic device | |
| USD726107S1 (en) | Electronic device | |
| USD949731S1 (en) | Electronic device | |
| USD786862S1 (en) | Wearable electronic device | |
| USD803210S1 (en) | Electronic device | |
| USD756442S1 (en) | Electronic magnifier for low vision users | |
| USD807941S1 (en) | Electronic camera |