USD770990S1 - Elastic membrane for semiconductor wafer polishing apparatus - Google Patents

Description

FIG. 1 is a bottom plan view of an elastic membrane for semiconductor wafer polishing apparatus showing our new design;

FIG. 2 is a top plan view thereof;

FIG. 3 is a front elevation view thereof;

FIG. 4 is an enlarged perspective view of a portion taken alongsection4 inFIG. 2;

FIG. 5 is a cross sectional view taken along line5-5 inFIG. 2; and,

FIG. 6 is an enlarged portion view taken along line6-6 inFIG. 5.

The broken lines shown in the drawings represent portions of the elastic membrane for semiconductor wafer polishing apparatus that form no part of the claimed design. The dashed-dot-dashed lines represent the boundary lines of the claimed design.

All surfaces not shown form no part of the claimed design.

Claims (1)

CLAIM
1. The ornamental design for an elastic membrane for semiconductor wafer polishing apparatus, as shown and described.

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