Movatterモバイル変換

[0]ホーム
URL:

USD725613S1 - LED package - Google Patents

LED packageDownload PDF

Info

Publication number
USD725613S1
USD725613S1US29/424,861US201229424861FUSD725613SUS D725613 S1USD725613 S1US D725613S1US 201229424861 FUS201229424861 FUS 201229424861FUS D725613 SUSD725613 SUS D725613S
Authority
US
United States
Prior art keywords
led package
view
elevation view
package shown
led
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/424,861
Inventor
Theodore Lowes
Eric J. Tarsa
Sten Heikman
Bernd Keller
John A. Edmond
Jesse Reiherzer
Hormoz Benjamin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
PARIS ACCESSORIES Inc
CreeLED Inc
Original Assignee
Cree Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cree IncfiledCriticalCree Inc
Priority to US29/424,861priorityCriticalpatent/USD725613S1/en
Assigned to CREE, INC.reassignmentCREE, INC.ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).Assignors: EDMOND, JOHN A., REIHERZER, JESSE, KELLER, BERND, BENJAMIN, Hormoz, HEIKMAN, STEN, LOWES, THEODORE, TARSA, ERIC J.
Assigned to PARIS ACCESSORIES, INC.reassignmentPARIS ACCESSORIES, INC.ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).Assignors: H.F. MFG. CORP.
Application grantedgrantedCritical
Publication of USD725613S1publicationCriticalpatent/USD725613S1/en
Assigned to CREELED, INC.reassignmentCREELED, INC.ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).Assignors: CREE, INC.
Assigned to CITIZENS BANK, N.A.reassignmentCITIZENS BANK, N.A.SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).Assignors: CREELED, INC., SMART EMBEDDED COMPUTING, INC., SMART High Reliability Solutions, LLC, SMART MODULAR TECHNOLOGIES, INC.
Assigned to SMART MODULAR TECHNOLOGIES, INC., SMART EMBEDDED COMPUTING, INC., CREELED, INC., SMART HIGH RELIABILITY SOLUTIONS LLCreassignmentSMART MODULAR TECHNOLOGIES, INC.RELEASE OF PATENT SECURITY INTEREST RECORDED AT R/F 058983/0001Assignors: CITIZENS BANK, N.A.
Assigned to JPMORGAN CHASE BANK, N.A.reassignmentJPMORGAN CHASE BANK, N.A.PATENT SECURITY AGREEMENTAssignors: CREELED, INC., PENGUIN COMPUTING, INC., PENGUIN SOLUTIONS CORPORATION (DE), SMART EMBEDDED COMPUTING, INC., SMART HIGH RELIABILITY SOLUTIONS LLC, SMART MODULAR TECHNOLOGIES, INC.
Activelegal-statusCriticalCurrent
Anticipated expirationlegal-statusCritical

Links

Images

Description

FIG. 1 is a top perspective view of an LED package according to the present invention.
FIG. 2 is a front elevation view of one side of the LED package shown inFIG. 1.
FIG. 3 is a back elevation view of the LED package as shown inFIG. 1.
FIG. 4 is a top view of the LED package shown inFIG. 1.
FIG. 5 is a bottom view of the LED package shown inFIG. 1.
FIG. 6 is a right elevation view of the LED package shown inFIG. 1.
FIG. 7 is a left elevation view of the LED package shown inFIG. 1.
FIG. 8 is a top perspective view of the LED package showing an alternate environment.
FIG. 9 is a front elevation view of one side of the LED package shown inFIG. 8.
FIG. 10 is a back elevation view of the LED package as shown inFIG. 8.
FIG. 11 is a top view of the LED package shown inFIG. 8.
FIG. 12 is a bottom view of the LED package shown inFIG. 8.
FIG. 13 is a right elevation view of the LED package shown inFIG. 8; and,
FIG. 14 is a left elevation view of the LED package shown inFIG. 8.
The broken lines shown in the above figures depict environmental subject matter only and form no part of the claimed design in those embodiments.

Claims (1)

    CLAIM
  1. The ornamental design for an LED package, as shown and described herein.
US29/424,8612012-06-152012-06-15LED packageActiveUSD725613S1 (en)

Priority Applications (1)

Application NumberPriority DateFiling DateTitle
US29/424,861USD725613S1 (en)2012-06-152012-06-15LED package

Applications Claiming Priority (1)

Application NumberPriority DateFiling DateTitle
US29/424,861USD725613S1 (en)2012-06-152012-06-15LED package

Publications (1)

Publication NumberPublication Date
USD725613S1true USD725613S1 (en)2015-03-31

Family

ID=52708311

Family Applications (1)

Application NumberTitlePriority DateFiling Date
US29/424,861ActiveUSD725613S1 (en)2012-06-152012-06-15LED package

Country Status (1)

CountryLink
US (1)USD725613S1 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
USD790486S1 (en)*2014-09-302017-06-27Cree, Inc.LED package with truncated encapsulant
USD826184S1 (en)*2016-03-242018-08-21Hamamatsu Photonics K.K.Optical semiconductor element
USD831592S1 (en)*2016-03-242018-10-23Hamamatsu Photonics K.K.Optical semiconductor element
USD831593S1 (en)*2016-03-242018-10-23Hamamatsu Photonics K.KOptical semiconductor element
USD832802S1 (en)*2016-03-242018-11-06Hamamatsu Photonics K.K.Optical semiconductor element
USD1079660S1 (en)*2022-09-292025-06-17Nichia CorporationLaser diode

Citations (54)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US4843280A (en)*1988-01-151989-06-27Siemens Corporate Research & Support, Inc.A modular surface mount component for an electrical device or led's
US5040868A (en)1989-05-311991-08-20Siemens AktiengesellschaftSurface-mountable opto-component
US6015719A (en)*1997-10-242000-01-18Hewlett-Packard CompanyTransparent substrate light emitting diodes with directed light output
US6061160A (en)1996-05-312000-05-09Dowa Mining Co., Ltd.Component device for optical communication
JP2000188358A (en)1998-12-222000-07-04Rohm Co Ltd Semiconductor device
JP2000223752A (en)1999-01-292000-08-11Nichia Chem Ind LtdOptical semiconductor device and its forming method
US6376902B1 (en)1997-07-292002-04-23Osram Opto Semiconductors Gmbh & Co. OhgOptoelectronic structural element
US20020056848A1 (en)*2000-11-142002-05-16Ralph WirthLight-emitting diode
US6396082B1 (en)*1999-07-292002-05-28Citizen Electronics Co., Ltd.Light-emitting diode
US20020123163A1 (en)2000-04-242002-09-05Takehiro FujiiEdge-emitting light-emitting semiconductor device and method of manufacture thereof
US20020163001A1 (en)2001-05-042002-11-07Shaddock David MulfordSurface mount light emitting device package and fabrication method
CN1417868A (en)2001-10-292003-05-14银河光电股份有限公司Multiple-chip package structure of LED chip
USD476961S1 (en)*2002-04-122003-07-08Citizen Electronics Co., Ltd.Light-emitting diode
JP2003197974A (en)2001-12-242003-07-11Samsung Electro Mech Co Ltd Light emitting diode package
US20040041222A1 (en)2002-09-042004-03-04Loh Ban P.Power surface mount light emitting die package
US20040061440A1 (en)*2002-09-302004-04-01Citizen Electronics Co., Ltd.Light emitting diode and back light unit
US20040079957A1 (en)2002-09-042004-04-29Andrews Peter ScottPower surface mount light emitting die package
US20040126913A1 (en)2002-12-062004-07-01Loh Ban P.Composite leadframe LED package and method of making the same
US6900511B2 (en)2002-06-282005-05-31Osram Opto Semiconductors GmbhOptoelectronic component and method for producing it
US20050173721A1 (en)*2004-02-052005-08-11Citizen Electronics Co. Ltd.Surface-mount type light emitting diode and method for manufacturing it
US6940704B2 (en)2001-01-242005-09-06Gelcore, LlcSemiconductor light emitting device
US20060049477A1 (en)2002-11-292006-03-09Karlheinz ArndtOptoelectronic component
US20060102917A1 (en)2002-06-192006-05-18Toshihiko OyamaSemiconductor light emitting device, method for producing the same and reflector for semiconductor light emitting device
US7066626B2 (en)2003-04-092006-06-27Citizen Electronics Co., Ltd.LED lamp
TWD112798S1 (en)2005-04-282006-09-01東芝照明技術股份有限公司 Lighting diode modules
USD536308S1 (en)*2004-10-192007-02-06Rohm Co., Ltd.Light emitting diode
USD539240S1 (en)*2004-10-192007-03-27Rohm Co., Ltd.Light emitting diode
US7224000B2 (en)2002-08-302007-05-29Lumination, LlcLight emitting diode component
CN1977399A (en)2005-04-012007-06-06松下电器产业株式会社LED component and method for manufacturing same
US7282785B2 (en)2004-01-052007-10-16Stanley Electric Co., Ltd.Surface mount type semiconductor device and lead frame structure thereof
JP2007287981A (en)2006-04-182007-11-01Konica Minolta Opto IncLight emitting device
US20070252250A1 (en)2006-04-262007-11-01Cotco Holdings Limited, A Hong Kong CorporationApparatus and method for use in mounting electronic elements
JP2007299905A (en)2006-04-282007-11-15Nichia Chem Ind Ltd Semiconductor device
US7317181B2 (en)2001-12-072008-01-08Hitachi Cable, Ltd.Light-emitting unit and method for producing same as well as lead frame used for producing light-emitting unit
USD572210S1 (en)2006-11-012008-07-01Lg Innotek Co., Ltd.Light-emitting diode (LED)
TWD123860S1 (en)2007-03-022008-07-21日亞化學工業股份有限公司 LED
EP1953834A1 (en)2005-11-212008-08-06Matsushita Electric Works, Ltd.Light-emitting device
USD576574S1 (en)2007-07-172008-09-09Rohm Co., Ltd.Light emitting diode module
USD582866S1 (en)*2007-09-072008-12-16Cree, Inc.LED chip
US7491977B2 (en)*2004-02-042009-02-17Citizen Electronics Co., Ltd.Light emitting diode
TWD128141S1 (en)2006-09-122009-04-01伊諾特有限公司Light emitting diode(led)
US20090108281A1 (en)2007-10-312009-04-30Cree, Inc.Light emitting diode package and method for fabricating same
USD591697S1 (en)2006-08-092009-05-05Cree, Inc.Lamp package
US20090283781A1 (en)2008-05-162009-11-19Cree Hong Kong LimitedMini V SMD
USD615504S1 (en)2007-10-312010-05-11Cree, Inc.Emitter package
USD631020S1 (en)2010-04-292011-01-18Edison Opto CorporationLED package
USD633631S1 (en)2007-12-142011-03-01Cree Hong Kong LimitedLight source of light emitting diode
USD634863S1 (en)2008-01-102011-03-22Cree Hong Kong LimitedLight source of light emitting diode
US20120032202A1 (en)*2009-04-142012-02-09Sharp Kabushiki KaishaPlanar light source device and display device provided with the planar light source device
US20130328074A1 (en)*2012-06-112013-12-12Cree, Inc.Led package with multiple element light source and encapsulant having planar surfaces
US20130328073A1 (en)*2012-06-112013-12-12Cree, Inc.Led package with multiple element light source and encapsulant having planar surfaces
TWD158573S (en)2012-06-112014-01-21科銳公司Led package
TWD158571S (en)2012-12-102014-01-21鴻海精密工業股份有限公司Adaptor
US20140027795A1 (en)*2012-06-112014-01-30Cree, Inc.Led package with encapsulant having curved and planar surfaces

Patent Citations (64)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US4843280A (en)*1988-01-151989-06-27Siemens Corporate Research & Support, Inc.A modular surface mount component for an electrical device or led's
EP1187227A2 (en)1989-05-312002-03-13Osram Opto Semiconductors GmbH & Co. OHGSurface-mountable optical element and method of fabrication
US5040868A (en)1989-05-311991-08-20Siemens AktiengesellschaftSurface-mountable opto-component
US6061160A (en)1996-05-312000-05-09Dowa Mining Co., Ltd.Component device for optical communication
US7183632B2 (en)1997-07-292007-02-27Osram GmbhSurface-mountable light-emitting diode structural element
US6376902B1 (en)1997-07-292002-04-23Osram Opto Semiconductors Gmbh & Co. OhgOptoelectronic structural element
US6759733B2 (en)1997-07-292004-07-06Osram Opto Semiconductors GmbhOptoelectric surface-mountable structural element
US20040238930A1 (en)1997-07-292004-12-02Osram Opto Semiconductors GmbhSurface-mountable light-emitting diode structural element
US7102215B2 (en)1997-07-292006-09-05Osram GmbhSurface-mountable light-emitting diode structural element
US6015719A (en)*1997-10-242000-01-18Hewlett-Packard CompanyTransparent substrate light emitting diodes with directed light output
JP2000188358A (en)1998-12-222000-07-04Rohm Co Ltd Semiconductor device
JP2000223752A (en)1999-01-292000-08-11Nichia Chem Ind LtdOptical semiconductor device and its forming method
US6396082B1 (en)*1999-07-292002-05-28Citizen Electronics Co., Ltd.Light-emitting diode
US20020123163A1 (en)2000-04-242002-09-05Takehiro FujiiEdge-emitting light-emitting semiconductor device and method of manufacture thereof
US20020056848A1 (en)*2000-11-142002-05-16Ralph WirthLight-emitting diode
US6940704B2 (en)2001-01-242005-09-06Gelcore, LlcSemiconductor light emitting device
US20020163001A1 (en)2001-05-042002-11-07Shaddock David MulfordSurface mount light emitting device package and fabrication method
CN1417868A (en)2001-10-292003-05-14银河光电股份有限公司Multiple-chip package structure of LED chip
US7317181B2 (en)2001-12-072008-01-08Hitachi Cable, Ltd.Light-emitting unit and method for producing same as well as lead frame used for producing light-emitting unit
JP2003197974A (en)2001-12-242003-07-11Samsung Electro Mech Co Ltd Light emitting diode package
US6707069B2 (en)2001-12-242004-03-16Samsung Electro-Mechanics Co., LtdLight emission diode package
USD476961S1 (en)*2002-04-122003-07-08Citizen Electronics Co., Ltd.Light-emitting diode
US20060102917A1 (en)2002-06-192006-05-18Toshihiko OyamaSemiconductor light emitting device, method for producing the same and reflector for semiconductor light emitting device
US6900511B2 (en)2002-06-282005-05-31Osram Opto Semiconductors GmbhOptoelectronic component and method for producing it
US7224000B2 (en)2002-08-302007-05-29Lumination, LlcLight emitting diode component
US20040079957A1 (en)2002-09-042004-04-29Andrews Peter ScottPower surface mount light emitting die package
US20040041222A1 (en)2002-09-042004-03-04Loh Ban P.Power surface mount light emitting die package
US20040061440A1 (en)*2002-09-302004-04-01Citizen Electronics Co., Ltd.Light emitting diode and back light unit
US20060049477A1 (en)2002-11-292006-03-09Karlheinz ArndtOptoelectronic component
US7271425B2 (en)2002-11-292007-09-18Osram Opto Semiconductors GmbhOptoelectronic component
US20040126913A1 (en)2002-12-062004-07-01Loh Ban P.Composite leadframe LED package and method of making the same
WO2004053933A3 (en)2002-12-062004-09-16Cree IncComposite leadframe led package and method of making the same
US7066626B2 (en)2003-04-092006-06-27Citizen Electronics Co., Ltd.LED lamp
US7282785B2 (en)2004-01-052007-10-16Stanley Electric Co., Ltd.Surface mount type semiconductor device and lead frame structure thereof
US7491977B2 (en)*2004-02-042009-02-17Citizen Electronics Co., Ltd.Light emitting diode
US20050173721A1 (en)*2004-02-052005-08-11Citizen Electronics Co. Ltd.Surface-mount type light emitting diode and method for manufacturing it
USD536308S1 (en)*2004-10-192007-02-06Rohm Co., Ltd.Light emitting diode
USD539240S1 (en)*2004-10-192007-03-27Rohm Co., Ltd.Light emitting diode
CN1977399A (en)2005-04-012007-06-06松下电器产业株式会社LED component and method for manufacturing same
TWD112798S1 (en)2005-04-282006-09-01東芝照明技術股份有限公司 Lighting diode modules
EP1953834A1 (en)2005-11-212008-08-06Matsushita Electric Works, Ltd.Light-emitting device
JP2007287981A (en)2006-04-182007-11-01Konica Minolta Opto IncLight emitting device
US20070252250A1 (en)2006-04-262007-11-01Cotco Holdings Limited, A Hong Kong CorporationApparatus and method for use in mounting electronic elements
JP2007299905A (en)2006-04-282007-11-15Nichia Chem Ind Ltd Semiconductor device
USD591697S1 (en)2006-08-092009-05-05Cree, Inc.Lamp package
TWD128141S1 (en)2006-09-122009-04-01伊諾特有限公司Light emitting diode(led)
USD572210S1 (en)2006-11-012008-07-01Lg Innotek Co., Ltd.Light-emitting diode (LED)
TWD123860S1 (en)2007-03-022008-07-21日亞化學工業股份有限公司 LED
USD576574S1 (en)2007-07-172008-09-09Rohm Co., Ltd.Light emitting diode module
USD582866S1 (en)*2007-09-072008-12-16Cree, Inc.LED chip
US20090108281A1 (en)2007-10-312009-04-30Cree, Inc.Light emitting diode package and method for fabricating same
USD615504S1 (en)2007-10-312010-05-11Cree, Inc.Emitter package
USD633631S1 (en)2007-12-142011-03-01Cree Hong Kong LimitedLight source of light emitting diode
USD662902S1 (en)2007-12-142012-07-03Cree Hong Kong LimitedLED package
USD656906S1 (en)2008-01-102012-04-03Cree Hong Kong LimitedLED package
USD634863S1 (en)2008-01-102011-03-22Cree Hong Kong LimitedLight source of light emitting diode
US20090283781A1 (en)2008-05-162009-11-19Cree Hong Kong LimitedMini V SMD
US20120032202A1 (en)*2009-04-142012-02-09Sharp Kabushiki KaishaPlanar light source device and display device provided with the planar light source device
USD631020S1 (en)2010-04-292011-01-18Edison Opto CorporationLED package
US20130328074A1 (en)*2012-06-112013-12-12Cree, Inc.Led package with multiple element light source and encapsulant having planar surfaces
US20130328073A1 (en)*2012-06-112013-12-12Cree, Inc.Led package with multiple element light source and encapsulant having planar surfaces
TWD158573S (en)2012-06-112014-01-21科銳公司Led package
US20140027795A1 (en)*2012-06-112014-01-30Cree, Inc.Led package with encapsulant having curved and planar surfaces
TWD158571S (en)2012-12-102014-01-21鴻海精密工業股份有限公司Adaptor

Non-Patent Citations (22)

* Cited by examiner, † Cited by third party
Title
Cree® XLamp® MC-E LEDs Product Info Sheets, 14 pages.
Decision of Registration from Japanese Design Patent Application No 2013-025955, dated Jun. 24, 2014.
Decision of Registration from Japanese Design Patent Application No. 2013-004502, dated Jun. 24, 2014.
Design of Registration Notice from Japanese Patent Appl. No. 2012-030304, dated Jan. 21, 2014.
Examination and Search Report from Taiwanese Patent Appl. No. 103300731, dated Jul. 21, 2014.
Examination Report from Taiwanese Patent Appl. No. 102301478, dated Sep. 6, 2013.
Examination Report from Taiwanese Patent appl. No. 102308472, dated May 14, 2014.
First Office Action from Chinese Design Patent appl. No. 201330524820.7, dated Feb. 20, 2014.
First Office Action from Chinese Patent Appl. No. 201330052393.7, dated Jan. 9. 2014.
Letter of Examination Report from Taiwanese Patent appl. No. 101307391, dated Jun. 5, 2013.
Notice of Allowance and Search Report for Taiwanese Patent Appl. No. 101307391, dated Oct. 15, 2013.
Notice of Allowance from Chinese Patent Appl. No. 201330524820.7, Dated Aug. 5, 2014.
Notice of Allowance from Korean Patent Appl. No. 30-2013-0010610, dated Oct. 17, 2014.
Notice of Issuance of Chinese Patent Appl. No. 201430021459.0, dated May 21, 2014.
Notice to Submit a Response from Korean Design Appl. No. 30-2012-0059744 dated Apr. 28, 2014.
Notice to Submit a Response from Korean Design Appl. No. 30-2014-0016126, dated Nov. 7, 2014.
Notice to Submit a Response from Korean Patent Appl. No. 30-2012-0059744, dated Nov. 26, 2013.
Office Action from Korean Patent Appl. No. 30-2014-0006603, dated Nov. 12, 2014.
Office Action from Korean Patent Design Appl. No. 30-2013-0010610, dated Jul. 8, 2014.
Office Action from U.S. Appl. No. 29/424,353, dated Dec. 26, 2013.
Patent Certificate from Chinese Design Patent Appl. No ZL 2013 3 0524820.7, dated Nov. 4, 2013.
Reasons for Rejection from Japanese Design Patent Appl. No. 2013-004502, dated Aug. 6, 2013.

Cited By (8)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
USD790486S1 (en)*2014-09-302017-06-27Cree, Inc.LED package with truncated encapsulant
USD826184S1 (en)*2016-03-242018-08-21Hamamatsu Photonics K.K.Optical semiconductor element
USD831592S1 (en)*2016-03-242018-10-23Hamamatsu Photonics K.K.Optical semiconductor element
USD831593S1 (en)*2016-03-242018-10-23Hamamatsu Photonics K.KOptical semiconductor element
USD832802S1 (en)*2016-03-242018-11-06Hamamatsu Photonics K.K.Optical semiconductor element
USD846511S1 (en)*2016-03-242019-04-23Hamamatsu Photonics K.K.Optical semiconductor element
USD846512S1 (en)*2016-03-242019-04-23Hamamatsu Photonics K.K.Optical semiconductor element
USD1079660S1 (en)*2022-09-292025-06-17Nichia CorporationLaser diode

Similar Documents

PublicationPublication DateTitle
USD711840S1 (en)LED package
USD715142S1 (en)Package
USD713716S1 (en)Package
USD718725S1 (en)LED package with encapsulant
USD690091S1 (en)Shoe upper
USD695426S1 (en)LED luminaire
USD699376S1 (en)OLED light module
USD682693S1 (en)Choke proof cap
USD677831S1 (en)LED lens
USD686044S1 (en)Container
USD701639S1 (en)Elongate lighting device
USD718258S1 (en)LED package
USD703348S1 (en)Lamp package
USD662241S1 (en)Flashlight
USD712280S1 (en)Battery package
USD699564S1 (en)Package
USD674361S1 (en)LED package
USD720858S1 (en)Dental protrusor
USD777121S1 (en)LED package
USD752438S1 (en)Package
USD673126S1 (en)LED chip
USD706626S1 (en)Box
USD910441S1 (en)Package
USD727860S1 (en)Light-emitting diode
USD790486S1 (en)LED package with truncated encapsulant
[8]ページ先頭
©2009-2025 Movatter.jp