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USD701864S1 - UICC apparatus - Google Patents

UICC apparatus
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Publication number
USD701864S1
USD701864S1US29/418,880US201229418880FUSD701864SUS D701864 S1USD701864 S1US D701864S1US 201229418880 FUS201229418880 FUS 201229418880FUS D701864 SUSD701864 SUS D701864S
Authority
US
United States
Prior art keywords
uicc apparatus
uicc
view
ornamental design
broken lines
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/418,880
Inventor
James Randolph Winter Lepp
Jean-Philippe Paul Cormier
Sheldon Terry Schwandt
Oleg Los
Petra Braun
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BlackBerry Ltd
Original Assignee
BlackBerry Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BlackBerry LtdfiledCriticalBlackBerry Ltd
Priority to US29/418,880priorityCriticalpatent/USD701864S1/en
Priority to US29/419,286prioritypatent/USD702241S1/en
Assigned to RESEARCH IN MOTION LIMITEDreassignmentRESEARCH IN MOTION LIMITEDASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).Assignors: SCHWANDT, SHELDON TERRY, CORMIER, JEAN-PHILIPPE PAUL, LEPP, JAMES RANDOLPH WINTER
Assigned to RESEARCH IN MOTION CORPORATIONreassignmentRESEARCH IN MOTION CORPORATIONASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).Assignors: LOS, OLEG
Assigned to RESEARCH IN MOTION DEUTSCHLAND GMBHreassignmentRESEARCH IN MOTION DEUTSCHLAND GMBHASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).Assignors: BRAUN, PETRA
Assigned to RESEARCH IN MOTION LIMITEDreassignmentRESEARCH IN MOTION LIMITEDASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).Assignors: RESEARCH IN MOTION CORPORATION
Assigned to RESEARCH IN MOTION LIMITEDreassignmentRESEARCH IN MOTION LIMITEDASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).Assignors: RESEARCH IN MOTION DEUTSCHLAND GMBH
Priority to CA 147628prioritypatent/CA147628S/en
Assigned to BLACKBERRY LIMITEDreassignmentBLACKBERRY LIMITEDCHANGE OF NAME (SEE DOCUMENT FOR DETAILS).Assignors: RESEARCH IN MOTION LIMITED
Publication of USD701864S1publicationCriticalpatent/USD701864S1/en
Application grantedgrantedCritical
Activelegal-statusCriticalCurrent
Anticipated expirationlegal-statusCritical

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Description

FIG. 1 is a plan view of a UICC apparatus;
FIG. 2 is a front view of the UICC apparatus ofFIG. 1;
FIG. 3 is a right side view of the UICC apparatus ofFIG. 1;
FIG. 4 is a left side view of the UICC apparatus ofFIG. 1; and,
FIG. 5 is a rear view of the UICC apparatus ofFIG. 1.
Broken lines and portions contained within broken lines are not claimed.

Claims (1)

    CLAIM
  1. We claim the ornamental design for a UICC apparatus, as shown and described.
US29/418,8802012-04-232012-04-23UICC apparatusActiveUSD701864S1 (en)

Priority Applications (3)

Application NumberPriority DateFiling DateTitle
US29/418,880USD701864S1 (en)2012-04-232012-04-23UICC apparatus
US29/419,286USD702241S1 (en)2012-04-232012-04-26UICC apparatus
CA 147628CA147628S (en)2012-04-232012-09-28Device smart card

Applications Claiming Priority (1)

Application NumberPriority DateFiling DateTitle
US29/418,880USD701864S1 (en)2012-04-232012-04-23UICC apparatus

Related Child Applications (1)

Application NumberTitlePriority DateFiling Date
US29/419,286ContinuationUSD702241S1 (en)2012-04-232012-04-26UICC apparatus

Publications (1)

Publication NumberPublication Date
USD701864S1true USD701864S1 (en)2014-04-01

Family

ID=50349234

Family Applications (2)

Application NumberTitlePriority DateFiling Date
US29/418,880ActiveUSD701864S1 (en)2012-04-232012-04-23UICC apparatus
US29/419,286ActiveUSD702241S1 (en)2012-04-232012-04-26UICC apparatus

Family Applications After (1)

Application NumberTitlePriority DateFiling Date
US29/419,286ActiveUSD702241S1 (en)2012-04-232012-04-26UICC apparatus

Country Status (2)

CountryLink
US (2)USD701864S1 (en)
CA (1)CA147628S (en)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
USD724552S1 (en)*2013-08-062015-03-17Formosa Epitaxy IncorporationPartial semiconductor light emitting component
USD729808S1 (en)*2013-03-132015-05-19Nagrastar LlcSmart card interface
USD756317S1 (en)*2014-08-262016-05-17Féinics Amatech TeorantaLayout for contact pads and connection bridges of a transponder chip module
USD758372S1 (en)*2013-03-132016-06-07Nagrastar LlcSmart card interface
USD759022S1 (en)*2013-03-132016-06-14Nagrastar LlcSmart card interface
USD776070S1 (en)*2014-03-182017-01-10Sony CorporationNon-contact type data carrier
USD780763S1 (en)2015-03-202017-03-07Nagrastar LlcSmart card interface
US9647997B2 (en)2013-03-132017-05-09Nagrastar, LlcUSB interface for performing transport I/O
US9769521B2 (en)2013-03-132017-09-19Nagrastar, LlcSystems and methods for performing transport I/O
US20170359897A1 (en)*2016-06-132017-12-14Infineon Technologies Austria AgChip card module and method for producing a chip card module
USD816135S1 (en)*2014-12-192018-04-24Myron WalkerSpoked solder pad
USD864968S1 (en)2015-04-302019-10-29Echostar Technologies L.L.C.Smart card interface

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US10134696B2 (en)2014-12-192018-11-20Myron WalkerSpoked solder pad to improve solderability and self-alignment of integrated circuit packages
JP1647725S (en)2018-02-012019-12-09
USD930000S1 (en)*2018-10-122021-09-07Huawei Technologies Co., Ltd.Memory card
USD943024S1 (en)*2020-07-302022-02-08Federal Card Services, LLCAsymmetrical arrangement of contact pads and connection bridges of a transponder chip module
USD942538S1 (en)*2020-07-302022-02-01Federal Card Services, LLCAsymmetrical arrangement of contact pads and connection bridges of a transponder chip module

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