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USD674757S1 - Package carrier of light emitting diode - Google Patents

Package carrier of light emitting diodeDownload PDF

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Publication number
USD674757S1
USD674757S1US29/410,013US201229410013FUSD674757SUS D674757 S1USD674757 S1US D674757S1US 201229410013 FUS201229410013 FUS 201229410013FUS D674757 SUSD674757 SUS D674757S
Authority
US
United States
Prior art keywords
light emitting
emitting diode
package carrier
package
carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/410,013
Inventor
Chia-Hao Wu
Chen-Hsiu Lin
Ming-Kun Weng
Yi-Chien Chang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lite On Technology Corp
Original Assignee
Silitek Electronic Guangzhou Co Ltd
Lite On Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Silitek Electronic Guangzhou Co Ltd, Lite On Technology CorpfiledCriticalSilitek Electronic Guangzhou Co Ltd
Assigned to SILITEK ELECTRONIC (GUANGZHOU) CO., LTD., LITE-ON TECHNOLOGY CORP.reassignmentSILITEK ELECTRONIC (GUANGZHOU) CO., LTD.ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).Assignors: CHANG, YI-CHIEN, LIN, CHEN-HSIU, WENG, MING-KUN, WU, CHIA-HAO
Application grantedgrantedCritical
Publication of USD674757S1publicationCriticalpatent/USD674757S1/en
Assigned to LITE-ON ELECTRONICS (GUANGZHOU) LIMITEDreassignmentLITE-ON ELECTRONICS (GUANGZHOU) LIMITEDCHANGE OF NAME (SEE DOCUMENT FOR DETAILS).Assignors: SILITEK ELECTRONIC (GUANGZHOU) CO., LTD.
Activelegal-statusCriticalCurrent
Anticipated expirationlegal-statusCritical

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Description

FIG. 1 is a perspective view of package carrier of light emitting diode showing my new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
The portions shown in dashed lines are for illustrative purposes only and form no part of the claimed design.

Claims (1)

  1. The ornamental design for package carrier of light emitting diode, as shown and described.
US29/410,0132011-10-312012-01-03Package carrier of light emitting diodeActiveUSD674757S1 (en)

Applications Claiming Priority (2)

Application NumberPriority DateFiling DateTitle
CN2011304038802011-10-31
CN2011304038802011-10-31

Publications (1)

Publication NumberPublication Date
USD674757S1true USD674757S1 (en)2013-01-22

Family

ID=47521997

Family Applications (1)

Application NumberTitlePriority DateFiling Date
US29/410,013ActiveUSD674757S1 (en)2011-10-312012-01-03Package carrier of light emitting diode

Country Status (1)

CountryLink
US (1)USD674757S1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
USD718258S1 (en)*2012-09-022014-11-25Cree, Inc.LED package
USD762596S1 (en)*2015-04-022016-08-02Genesis Photonics Inc.Light emitting diode package substrate

Citations (33)

* Cited by examiner, † Cited by third party
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US20020190262A1 (en)*2001-04-092002-12-19Koichi NittaLight emitting device
US6686609B1 (en)*2002-10-012004-02-03Ultrastar LimitedPackage structure of surface mounting led and method of manufacturing the same
US6858870B2 (en)*2003-06-102005-02-22Galaxy Pcb Co., Ltd.Multi-chip light emitting diode package
US7067848B1 (en)*2005-03-212006-06-27Wen-Jen LeeHigh intensity LED
US20090108281A1 (en)*2007-10-312009-04-30Cree, Inc.Light emitting diode package and method for fabricating same
USD615504S1 (en)*2007-10-312010-05-11Cree, Inc.Emitter package
US20100117099A1 (en)*2008-11-072010-05-13Jacob Chi Wing LeungMulti-chip light emitting diode modules
US20100123144A1 (en)*2008-11-202010-05-20Everlight Electronics Co., Ltd.Circuit structure of package carrier and multi-chip package
US20100127283A1 (en)*2008-10-242010-05-27Van De Ven Antony PArray layout for color mixing
US20100140633A1 (en)*2009-02-192010-06-10David Todd EmersonMethods for Combining Light Emitting Devices in a Package and Packages Including Combined Light Emitting Devices
US20100140634A1 (en)*2009-11-092010-06-10Cree Led Lighting Solutions, Inc.Solid state emitter package including red and blue emitters
USD622683S1 (en)*2009-04-082010-08-31Nichia CorporationLight emitting diode module
US20100252851A1 (en)*2007-10-312010-10-07Cree, Inc.Led package with increased feature sizes
US7821023B2 (en)*2005-01-102010-10-26Cree, Inc.Solid state lighting component
US20110006317A1 (en)*2007-09-252011-01-13Cree, Inc.Single multi-chip lamp sources and related methods
USD631020S1 (en)*2010-04-292011-01-18Edison Opto CorporationLED package
USD631019S1 (en)*2010-04-212011-01-18Epistar CorporationLight emitting diode packaging array
US20110062482A1 (en)*2010-01-202011-03-17Bridgelux, Inc.Apparatus And Method For Enhancing Connectability In LED Array Using Metal Traces
US7960744B2 (en)*2007-06-292011-06-14Seoul Semiconductor Co., Ltd.Multi-light emitting diode package
USD644190S1 (en)*2010-09-292011-08-30Kabushiki Kaisha ToshibaLight-emitting diode
US20110210346A1 (en)*2010-02-262011-09-01Silitek Electronic (Guangzhou) Co., Ltd.Led module
USD645416S1 (en)*2009-12-222011-09-20Panasonic CorporationLight-emitting diode
US20110248289A1 (en)*2010-04-092011-10-13Everlight Electronics Co., Ltd.Light emitting diode package, lighting device and light emitting diode package substrate
USD649944S1 (en)*2010-07-072011-12-06Panasonic CorporationLight emitting diode
USD649943S1 (en)*2010-07-072011-12-06Panasonic CorporationLight emitting diode
USD650343S1 (en)*2011-01-312011-12-13Cree, Inc.Multiple configuration light emitting device package
US8124988B2 (en)*2008-05-282012-02-28Semisilicon Technology Corp.Light emitting diode lamp package structure and assembly thereof
USD656906S1 (en)*2008-01-102012-04-03Cree Hong Kong LimitedLED package
USD658139S1 (en)*2011-01-312012-04-24Cree, Inc.High-density emitter package
USD660258S1 (en)*2011-05-042012-05-22Epistar CorporationLight emitting diode
USD660257S1 (en)*2011-01-312012-05-22Cree, Inc.Emitter package
US20120138967A1 (en)*2010-12-072012-06-07Kabushiki Kaisha ToshibaLed package and method for manufacturing the same
US20120199852A1 (en)*2011-02-042012-08-09Cree, Inc.Light-emitting diode component

Patent Citations (34)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US20020190262A1 (en)*2001-04-092002-12-19Koichi NittaLight emitting device
US6686609B1 (en)*2002-10-012004-02-03Ultrastar LimitedPackage structure of surface mounting led and method of manufacturing the same
US6858870B2 (en)*2003-06-102005-02-22Galaxy Pcb Co., Ltd.Multi-chip light emitting diode package
US7821023B2 (en)*2005-01-102010-10-26Cree, Inc.Solid state lighting component
US7067848B1 (en)*2005-03-212006-06-27Wen-Jen LeeHigh intensity LED
US7960744B2 (en)*2007-06-292011-06-14Seoul Semiconductor Co., Ltd.Multi-light emitting diode package
US20110006317A1 (en)*2007-09-252011-01-13Cree, Inc.Single multi-chip lamp sources and related methods
USD615504S1 (en)*2007-10-312010-05-11Cree, Inc.Emitter package
US20090108281A1 (en)*2007-10-312009-04-30Cree, Inc.Light emitting diode package and method for fabricating same
US20100252851A1 (en)*2007-10-312010-10-07Cree, Inc.Led package with increased feature sizes
USD656906S1 (en)*2008-01-102012-04-03Cree Hong Kong LimitedLED package
US8124988B2 (en)*2008-05-282012-02-28Semisilicon Technology Corp.Light emitting diode lamp package structure and assembly thereof
US20100127283A1 (en)*2008-10-242010-05-27Van De Ven Antony PArray layout for color mixing
US20100117099A1 (en)*2008-11-072010-05-13Jacob Chi Wing LeungMulti-chip light emitting diode modules
US20100123144A1 (en)*2008-11-202010-05-20Everlight Electronics Co., Ltd.Circuit structure of package carrier and multi-chip package
US20100140633A1 (en)*2009-02-192010-06-10David Todd EmersonMethods for Combining Light Emitting Devices in a Package and Packages Including Combined Light Emitting Devices
USD628169S1 (en)*2009-04-082010-11-30Nichia CorporationLight emitting diode module
USD622683S1 (en)*2009-04-082010-08-31Nichia CorporationLight emitting diode module
US20100140634A1 (en)*2009-11-092010-06-10Cree Led Lighting Solutions, Inc.Solid state emitter package including red and blue emitters
USD645416S1 (en)*2009-12-222011-09-20Panasonic CorporationLight-emitting diode
US20110062482A1 (en)*2010-01-202011-03-17Bridgelux, Inc.Apparatus And Method For Enhancing Connectability In LED Array Using Metal Traces
US20110210346A1 (en)*2010-02-262011-09-01Silitek Electronic (Guangzhou) Co., Ltd.Led module
US20110248289A1 (en)*2010-04-092011-10-13Everlight Electronics Co., Ltd.Light emitting diode package, lighting device and light emitting diode package substrate
USD631019S1 (en)*2010-04-212011-01-18Epistar CorporationLight emitting diode packaging array
USD631020S1 (en)*2010-04-292011-01-18Edison Opto CorporationLED package
USD649943S1 (en)*2010-07-072011-12-06Panasonic CorporationLight emitting diode
USD649944S1 (en)*2010-07-072011-12-06Panasonic CorporationLight emitting diode
USD644190S1 (en)*2010-09-292011-08-30Kabushiki Kaisha ToshibaLight-emitting diode
US20120138967A1 (en)*2010-12-072012-06-07Kabushiki Kaisha ToshibaLed package and method for manufacturing the same
USD650343S1 (en)*2011-01-312011-12-13Cree, Inc.Multiple configuration light emitting device package
USD658139S1 (en)*2011-01-312012-04-24Cree, Inc.High-density emitter package
USD660257S1 (en)*2011-01-312012-05-22Cree, Inc.Emitter package
US20120199852A1 (en)*2011-02-042012-08-09Cree, Inc.Light-emitting diode component
USD660258S1 (en)*2011-05-042012-05-22Epistar CorporationLight emitting diode

Cited By (2)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
USD718258S1 (en)*2012-09-022014-11-25Cree, Inc.LED package
USD762596S1 (en)*2015-04-022016-08-02Genesis Photonics Inc.Light emitting diode package substrate

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