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USD664249S1 - Flow blocker plate - Google Patents

Flow blocker plate
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Publication number
USD664249S1
USD664249S1US29/396,608US201129396608FUSD664249SUS D664249 S1USD664249 S1US D664249S1US 201129396608 FUS201129396608 FUS 201129396608FUS D664249 SUSD664249 SUS D664249S
Authority
US
United States
Prior art keywords
blocker plate
flow blocker
flow
plate
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/396,608
Inventor
Qunhua Wang
Robin L. Tiner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials IncfiledCriticalApplied Materials Inc
Priority to US29/396,608priorityCriticalpatent/USD664249S1/en
Assigned to APPLIED MATERIALS, INC.reassignmentAPPLIED MATERIALS, INC.ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).Assignors: WANG, QUNHUA, TINER, ROBIN L.
Assigned to APPLIED MATERIALS, INC.reassignmentAPPLIED MATERIALS, INC.ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).Assignors: WANG, QUNHUA, TINER, ROBIN L.
Priority to TW100306597Fprioritypatent/TWD152036S/en
Application grantedgrantedCritical
Publication of USD664249S1publicationCriticalpatent/USD664249S1/en
Activelegal-statusCriticalCurrent
Anticipated expirationlegal-statusCritical

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Description

FIG. 1 is a top plan view of a flow blocker plate according to the invention, the bottom plan view being identical;
FIG. 2 is an enlarged, partial top plan view of the upper left quadrant of the flow blocker plate ofFIG. 1, the other quadrants of the top plan view being identical; and,
FIG. 3 is a front elevation view of the flow blocker plate ofFIG. 1, the back elevation, left elevation and right elevation being identical and unornamented.

Claims (1)

  1. The ornamental design for a flow blocker plate, as shown and described.
US29/396,6082011-07-012011-07-01Flow blocker plateActiveUSD664249S1 (en)

Priority Applications (2)

Application NumberPriority DateFiling DateTitle
US29/396,608USD664249S1 (en)2011-07-012011-07-01Flow blocker plate
TW100306597FTWD152036S (en)2011-07-012011-12-02Flow blocker plate

Applications Claiming Priority (1)

Application NumberPriority DateFiling DateTitle
US29/396,608USD664249S1 (en)2011-07-012011-07-01Flow blocker plate

Publications (1)

Publication NumberPublication Date
USD664249S1true USD664249S1 (en)2012-07-24

Family

ID=46513532

Family Applications (1)

Application NumberTitlePriority DateFiling Date
US29/396,608ActiveUSD664249S1 (en)2011-07-012011-07-01Flow blocker plate

Country Status (2)

CountryLink
US (1)USD664249S1 (en)
TW (1)TWD152036S (en)

Cited By (19)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
USD694790S1 (en)2011-09-202013-12-03Tokyo Electron LimitedBaffle plate for manufacturing semiconductor
USD697038S1 (en)*2011-09-202014-01-07Tokyo Electron LimitedBaffle plate
USD713363S1 (en)*2013-12-312014-09-16Celadon Systems, Inc.Support for a probe test core
USD722031S1 (en)*2013-12-312015-02-03Celadon Systems, Inc.Top contact layout board in an electrical system
USD752202S1 (en)*2013-08-082016-03-22Homewerks Worldwide, LLCFan grille
US9344787B2 (en)2012-12-222016-05-17Homewerks Worldwide, LLCAudio equipped fan
US9398357B2 (en)2012-12-222016-07-19Homewerks Worldwide, LLCAudio equipped fan
US9609407B2 (en)2012-12-222017-03-28Homewerks Worldwide, LLCMethod of manufacturing an audio equipped fan assembly
USD808001S1 (en)2016-03-142018-01-16Homewerks Worldwide, LLCSquare fan grille
USD873782S1 (en)*2016-05-172020-01-28Electro Scientific Industries, IncComponent carrier plate
USD931240S1 (en)*2019-07-302021-09-21Applied Materials, Inc.Substrate support pedestal
USD932612S1 (en)2019-11-262021-10-05Homewerks Worldwide, LLCFan grille
USD932611S1 (en)2019-06-242021-10-05Homewerks Worldwide, LLCFan grille
USD933195S1 (en)2019-11-262021-10-12Homewerks Worldwide, LLCFan grille
USD933194S1 (en)2019-06-242021-10-12Homewerks Worldwide, LLCFan grille
USD933809S1 (en)2019-11-262021-10-19Homewerks Worldwide, LLCFan grille
USD948025S1 (en)2019-11-262022-04-05Homewerks Worldwide, LLCFan grille
USD1071103S1 (en)*2022-04-112025-04-15Applied Materials, Inc.Gas distribution plate
USD1085029S1 (en)*2022-07-192025-07-22Applied Materials, Inc.Gas distribution plate

Citations (22)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
USD363464S (en)*1992-08-271995-10-24Tokyo Electron Yamanashi LimitedElectrode for a semiconductor processing apparatus
US5472565A (en)*1993-11-171995-12-05Lam Research CorporationTopology induced plasma enhancement for etched uniformity improvement
USD394101S (en)*1997-05-031998-05-05Matsushita Electric Industrial Co., Ltd.Ventilating fan
USD407073S (en)*1997-12-241999-03-23Applied Materials, Inc.Electrostatic chuck with improved spacing and charge migration reduction mask
US5911834A (en)*1996-11-181999-06-15Applied Materials, Inc.Gas delivery system
USD411516S (en)*1996-03-151999-06-29Tokyo Electron LimitedGas diffusion plate for electrode of semiconductor wafer processing apparatus
US6024799A (en)*1997-07-112000-02-15Applied Materials, Inc.Chemical vapor deposition manifold
US6050216A (en)*1998-08-212000-04-18M.E.C. Technology, Inc.Showerhead electrode for plasma processing
US6237528B1 (en)*2000-01-242001-05-29M.E.C. Technology, Inc.Showerhead electrode assembly for plasma processing
US6278600B1 (en)*1994-01-312001-08-21Applied Materials, Inc.Electrostatic chuck with improved temperature control and puncture resistance
US6444040B1 (en)*2000-05-052002-09-03Applied Materials Inc.Gas distribution plate
US20020159217A1 (en)*2001-01-292002-10-31Ngk Insulators, Ltd.Electrostatic chuck and substrate processing apparatus
US6782843B2 (en)*2000-04-262004-08-31Axcelis Technologies, Inc.Actively-cooled distribution plate for reducing reactive gas temperature in a plasma processing system
US6818097B2 (en)*2002-04-222004-11-16Nisshinbo Industries, Inc.Highly heat-resistant plasma etching electrode and dry etching device including the same
USD552565S1 (en)*2005-09-082007-10-09Tokyo Ohka Kogyo Co., Ltd.Supporting plate
USD553104S1 (en)*2004-04-212007-10-16Tokyo Electron LimitedAbsorption board for an electric chuck used in semiconductor manufacture
US7479304B2 (en)*2002-02-142009-01-20Applied Materials, Inc.Gas distribution plate fabricated from a solid yttrium oxide-comprising substrate
USD609655S1 (en)*2008-10-032010-02-09Ngk Insulators, Ltd.Electrostatic chuck
US7658800B2 (en)*2006-10-182010-02-09Advanced Micro-Fabrication Equipment, Inc. AsiaGas distribution assembly for use in a semiconductor work piece processing reactor
USD609652S1 (en)*2008-07-222010-02-09Tokyo Electron LimitedWafer attracting plate
US7850779B2 (en)*2005-11-042010-12-14Applied Materisals, Inc.Apparatus and process for plasma-enhanced atomic layer deposition
USD648289S1 (en)*2010-10-212011-11-08Novellus Systems, Inc.Electroplating flow shaping plate having offset spiral hole pattern

Patent Citations (22)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
USD363464S (en)*1992-08-271995-10-24Tokyo Electron Yamanashi LimitedElectrode for a semiconductor processing apparatus
US5472565A (en)*1993-11-171995-12-05Lam Research CorporationTopology induced plasma enhancement for etched uniformity improvement
US6278600B1 (en)*1994-01-312001-08-21Applied Materials, Inc.Electrostatic chuck with improved temperature control and puncture resistance
USD411516S (en)*1996-03-151999-06-29Tokyo Electron LimitedGas diffusion plate for electrode of semiconductor wafer processing apparatus
US5911834A (en)*1996-11-181999-06-15Applied Materials, Inc.Gas delivery system
USD394101S (en)*1997-05-031998-05-05Matsushita Electric Industrial Co., Ltd.Ventilating fan
US6024799A (en)*1997-07-112000-02-15Applied Materials, Inc.Chemical vapor deposition manifold
USD407073S (en)*1997-12-241999-03-23Applied Materials, Inc.Electrostatic chuck with improved spacing and charge migration reduction mask
US6050216A (en)*1998-08-212000-04-18M.E.C. Technology, Inc.Showerhead electrode for plasma processing
US6237528B1 (en)*2000-01-242001-05-29M.E.C. Technology, Inc.Showerhead electrode assembly for plasma processing
US6782843B2 (en)*2000-04-262004-08-31Axcelis Technologies, Inc.Actively-cooled distribution plate for reducing reactive gas temperature in a plasma processing system
US6444040B1 (en)*2000-05-052002-09-03Applied Materials Inc.Gas distribution plate
US20020159217A1 (en)*2001-01-292002-10-31Ngk Insulators, Ltd.Electrostatic chuck and substrate processing apparatus
US7479304B2 (en)*2002-02-142009-01-20Applied Materials, Inc.Gas distribution plate fabricated from a solid yttrium oxide-comprising substrate
US6818097B2 (en)*2002-04-222004-11-16Nisshinbo Industries, Inc.Highly heat-resistant plasma etching electrode and dry etching device including the same
USD553104S1 (en)*2004-04-212007-10-16Tokyo Electron LimitedAbsorption board for an electric chuck used in semiconductor manufacture
USD552565S1 (en)*2005-09-082007-10-09Tokyo Ohka Kogyo Co., Ltd.Supporting plate
US7850779B2 (en)*2005-11-042010-12-14Applied Materisals, Inc.Apparatus and process for plasma-enhanced atomic layer deposition
US7658800B2 (en)*2006-10-182010-02-09Advanced Micro-Fabrication Equipment, Inc. AsiaGas distribution assembly for use in a semiconductor work piece processing reactor
USD609652S1 (en)*2008-07-222010-02-09Tokyo Electron LimitedWafer attracting plate
USD609655S1 (en)*2008-10-032010-02-09Ngk Insulators, Ltd.Electrostatic chuck
USD648289S1 (en)*2010-10-212011-11-08Novellus Systems, Inc.Electroplating flow shaping plate having offset spiral hole pattern

Cited By (19)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
USD694790S1 (en)2011-09-202013-12-03Tokyo Electron LimitedBaffle plate for manufacturing semiconductor
USD697038S1 (en)*2011-09-202014-01-07Tokyo Electron LimitedBaffle plate
US9344787B2 (en)2012-12-222016-05-17Homewerks Worldwide, LLCAudio equipped fan
US9398357B2 (en)2012-12-222016-07-19Homewerks Worldwide, LLCAudio equipped fan
US9609407B2 (en)2012-12-222017-03-28Homewerks Worldwide, LLCMethod of manufacturing an audio equipped fan assembly
USD752202S1 (en)*2013-08-082016-03-22Homewerks Worldwide, LLCFan grille
USD713363S1 (en)*2013-12-312014-09-16Celadon Systems, Inc.Support for a probe test core
USD722031S1 (en)*2013-12-312015-02-03Celadon Systems, Inc.Top contact layout board in an electrical system
USD808001S1 (en)2016-03-142018-01-16Homewerks Worldwide, LLCSquare fan grille
USD873782S1 (en)*2016-05-172020-01-28Electro Scientific Industries, IncComponent carrier plate
USD932611S1 (en)2019-06-242021-10-05Homewerks Worldwide, LLCFan grille
USD933194S1 (en)2019-06-242021-10-12Homewerks Worldwide, LLCFan grille
USD931240S1 (en)*2019-07-302021-09-21Applied Materials, Inc.Substrate support pedestal
USD932612S1 (en)2019-11-262021-10-05Homewerks Worldwide, LLCFan grille
USD933195S1 (en)2019-11-262021-10-12Homewerks Worldwide, LLCFan grille
USD933809S1 (en)2019-11-262021-10-19Homewerks Worldwide, LLCFan grille
USD948025S1 (en)2019-11-262022-04-05Homewerks Worldwide, LLCFan grille
USD1071103S1 (en)*2022-04-112025-04-15Applied Materials, Inc.Gas distribution plate
USD1085029S1 (en)*2022-07-192025-07-22Applied Materials, Inc.Gas distribution plate

Also Published As

Publication numberPublication date
TWD152036S (en)2013-02-21

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