






| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010023299 | 2010-09-29 | ||
| JP2010-023299 | 2010-09-29 |
| Publication Number | Publication Date |
|---|---|
| USD649942S1true USD649942S1 (en) | 2011-12-06 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/381,737ActiveUSD649942S1 (en) | 2010-09-29 | 2010-12-22 | Light-emitting diode |
| Country | Link |
|---|---|
| US (1) | USD649942S1 (en) |
| TW (1) | TWD143606S1 (en) |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWD227764S (en) | 2022-01-18 | 2023-10-01 | 美商科銳Led公司 美國 | Light-emitting device package |
| USD1074628S1 (en) | 2021-01-20 | 2025-05-13 | Hamamatsu Photonics K.K. | Light-emitting element module |
| USD1083850S1 (en)* | 2021-01-20 | 2025-07-15 | Hamamatsu Photonics K.K. | Light-emitting element module |
| USD1089807S1 (en) | 2021-01-20 | 2025-08-19 | Hamamatsu Photonics K.K. | Light-emitting element module |
| USD1089089S1 (en) | 2021-01-20 | 2025-08-19 | Hamamatsu Photonics K.K. | Light-emitting element module |
| USD1089808S1 (en) | 2021-01-20 | 2025-08-19 | Hamamatsu Photonics K.K. | Light-emitting element module |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040000702A1 (en)* | 2002-06-27 | 2004-01-01 | Semiconductor Components Industries, Llc | Integrated circuit and laminated leadframe package |
| USD506187S1 (en)* | 2004-10-12 | 2005-06-14 | Harvatek Corporation | Metal base design for surface mount device LED (light emitting diode) |
| USD509809S1 (en)* | 2004-08-10 | 2005-09-20 | Harvatek Corporation | Metal base design for surface mount device LED |
| USD511328S1 (en)* | 2004-06-23 | 2005-11-08 | Harvatek Corporation | Light-emitting diode |
| US20050248336A1 (en)* | 2003-08-26 | 2005-11-10 | Nirmal Sharma | Current sensor |
| US20060145318A1 (en)* | 2005-01-05 | 2006-07-06 | Xiaotian Zhang | DFN semiconductor package having reduced electrical resistance |
| US20060214273A1 (en)* | 2005-03-22 | 2006-09-28 | Bily Wang | LED package structure and method making of the same |
| US7242076B2 (en)* | 2004-05-18 | 2007-07-10 | Fairchild Semiconductor Corporation | Packaged integrated circuit with MLP leadframe and method of making same |
| USD576571S1 (en)* | 2007-06-14 | 2008-09-09 | Rohm Co., Ltd. | Light emitting diode module |
| US20090174048A1 (en)* | 2008-01-09 | 2009-07-09 | Yong Liu | Die package including substrate with molded device |
| USD599303S1 (en)* | 2007-12-05 | 2009-09-01 | Seoul Semiconductor Co., Ltd. | Light emitting diode (LED) |
| US20090278241A1 (en)* | 2008-05-08 | 2009-11-12 | Yong Liu | Semiconductor die package including die stacked on premolded substrate including die |
| US20100032819A1 (en)* | 2008-08-07 | 2010-02-11 | Kai Liu | Compact Co-packaged Semiconductor Dies with Elevation-adaptive Interconnection Plates |
| US7709754B2 (en)* | 2003-08-26 | 2010-05-04 | Allegro Microsystems, Inc. | Current sensor |
| US7714334B2 (en)* | 2007-08-16 | 2010-05-11 | Lin Peter P W | Polarless surface mounting light emitting diode |
| US7759775B2 (en)* | 2004-07-20 | 2010-07-20 | Alpha And Omega Semiconductor Incorporated | High current semiconductor power device SOIC package |
| US7868432B2 (en)* | 2006-02-13 | 2011-01-11 | Fairchild Semiconductor Corporation | Multi-chip module for battery power control |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040000702A1 (en)* | 2002-06-27 | 2004-01-01 | Semiconductor Components Industries, Llc | Integrated circuit and laminated leadframe package |
| US7709754B2 (en)* | 2003-08-26 | 2010-05-04 | Allegro Microsystems, Inc. | Current sensor |
| US20050248336A1 (en)* | 2003-08-26 | 2005-11-10 | Nirmal Sharma | Current sensor |
| US7242076B2 (en)* | 2004-05-18 | 2007-07-10 | Fairchild Semiconductor Corporation | Packaged integrated circuit with MLP leadframe and method of making same |
| USD511328S1 (en)* | 2004-06-23 | 2005-11-08 | Harvatek Corporation | Light-emitting diode |
| US7759775B2 (en)* | 2004-07-20 | 2010-07-20 | Alpha And Omega Semiconductor Incorporated | High current semiconductor power device SOIC package |
| USD509809S1 (en)* | 2004-08-10 | 2005-09-20 | Harvatek Corporation | Metal base design for surface mount device LED |
| USD506187S1 (en)* | 2004-10-12 | 2005-06-14 | Harvatek Corporation | Metal base design for surface mount device LED (light emitting diode) |
| US20060145318A1 (en)* | 2005-01-05 | 2006-07-06 | Xiaotian Zhang | DFN semiconductor package having reduced electrical resistance |
| US20060214273A1 (en)* | 2005-03-22 | 2006-09-28 | Bily Wang | LED package structure and method making of the same |
| US7868432B2 (en)* | 2006-02-13 | 2011-01-11 | Fairchild Semiconductor Corporation | Multi-chip module for battery power control |
| USD576571S1 (en)* | 2007-06-14 | 2008-09-09 | Rohm Co., Ltd. | Light emitting diode module |
| US7714334B2 (en)* | 2007-08-16 | 2010-05-11 | Lin Peter P W | Polarless surface mounting light emitting diode |
| USD599303S1 (en)* | 2007-12-05 | 2009-09-01 | Seoul Semiconductor Co., Ltd. | Light emitting diode (LED) |
| US20090174048A1 (en)* | 2008-01-09 | 2009-07-09 | Yong Liu | Die package including substrate with molded device |
| US20090278241A1 (en)* | 2008-05-08 | 2009-11-12 | Yong Liu | Semiconductor die package including die stacked on premolded substrate including die |
| US20100032819A1 (en)* | 2008-08-07 | 2010-02-11 | Kai Liu | Compact Co-packaged Semiconductor Dies with Elevation-adaptive Interconnection Plates |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD1074628S1 (en) | 2021-01-20 | 2025-05-13 | Hamamatsu Photonics K.K. | Light-emitting element module |
| USD1083850S1 (en)* | 2021-01-20 | 2025-07-15 | Hamamatsu Photonics K.K. | Light-emitting element module |
| USD1089807S1 (en) | 2021-01-20 | 2025-08-19 | Hamamatsu Photonics K.K. | Light-emitting element module |
| USD1089089S1 (en) | 2021-01-20 | 2025-08-19 | Hamamatsu Photonics K.K. | Light-emitting element module |
| USD1089808S1 (en) | 2021-01-20 | 2025-08-19 | Hamamatsu Photonics K.K. | Light-emitting element module |
| TWD227764S (en) | 2022-01-18 | 2023-10-01 | 美商科銳Led公司 美國 | Light-emitting device package |
| Publication number | Publication date |
|---|---|
| TWD143606S1 (en) | 2011-11-01 |
| Publication | Publication Date | Title |
|---|---|---|
| USD644190S1 (en) | Light-emitting diode | |
| USD631020S1 (en) | LED package | |
| USD648287S1 (en) | Light-emitting diode | |
| USD637564S1 (en) | Light emitting diode | |
| USD626097S1 (en) | Light-emitting diode | |
| USD635975S1 (en) | LED monitor | |
| USD635976S1 (en) | LED monitor | |
| USD634323S1 (en) | LED monitor | |
| USD634324S1 (en) | LED monitor | |
| USD619976S1 (en) | Light-emitting diode | |
| USD631586S1 (en) | Flashlight | |
| USD647494S1 (en) | Light-emitting diode | |
| USD630775S1 (en) | Light emitting diode | |
| USD629767S1 (en) | Light-emitting diode | |
| USD698323S1 (en) | Light emitting diode | |
| USD716238S1 (en) | Light-emitting diode array | |
| USD626922S1 (en) | Light-emitting diode | |
| USD681566S1 (en) | Light-emitting diode array | |
| USD647495S1 (en) | Light-emitting diode | |
| USD606950S1 (en) | Light-emitting diode | |
| USD681569S1 (en) | Light-emitting diode array | |
| USD698743S1 (en) | Light-emitting diode | |
| USD709840S1 (en) | Light-emitting diode | |
| USD681570S1 (en) | Light-emitting diode | |
| USD664104S1 (en) | Light emitting diode |