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USD649942S1 - Light-emitting diode - Google Patents

Light-emitting diode
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Publication number
USD649942S1
USD649942S1US29/381,737US201029381737FUSD649942SUS D649942 S1USD649942 S1US D649942S1US 201029381737 FUS201029381737 FUS 201029381737FUS D649942 SUSD649942 SUS D649942S
Authority
US
United States
Prior art keywords
light
emitting diode
view
ornamental design
elevational view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/381,737
Inventor
Satoshi Shimizu
Kazuhisa Iwashita
Tatsuo Tonedachi
Kazuhiro Inoue
Teruo Takeuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba CorpfiledCriticalToshiba Corp
Assigned to KABUSHIKI KAISHA TOSHIBAreassignmentKABUSHIKI KAISHA TOSHIBAASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).Assignors: INOUE, KAZUHIRO, IWASHITA, KAZUHISA, SHIMIZU, SATOSHI, TAKEUCHI, TERUO, TONEDACHI, TATSUO
Application grantedgrantedCritical
Publication of USD649942S1publicationCriticalpatent/USD649942S1/en
Activelegal-statusCriticalCurrent
Anticipated expirationlegal-statusCritical

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Description

FIG. 1 is a front perspective view of a light-emitting diode, showing our new design;
FIG. 2 is a rear perspective view thereof;
FIG. 3 is a front elevational view thereof;
FIG. 4 is a rear elevational view thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof;
FIG. 7 is a right side elevational view thereof; and,
FIG. 8 is a left side elevational view thereof.

Claims (1)

  1. The ornamental design for a light-emitting diode, as shown and described.
US29/381,7372010-09-292010-12-22Light-emitting diodeActiveUSD649942S1 (en)

Applications Claiming Priority (2)

Application NumberPriority DateFiling DateTitle
JP20100232992010-09-29
JP2010-0232992010-09-29

Publications (1)

Publication NumberPublication Date
USD649942S1true USD649942S1 (en)2011-12-06

Family

ID=45034741

Family Applications (1)

Application NumberTitlePriority DateFiling Date
US29/381,737ActiveUSD649942S1 (en)2010-09-292010-12-22Light-emitting diode

Country Status (2)

CountryLink
US (1)USD649942S1 (en)
TW (1)TWD143606S1 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
TWD227764S (en)2022-01-182023-10-01美商科銳Led公司 美國Light-emitting device package
USD1074628S1 (en)2021-01-202025-05-13Hamamatsu Photonics K.K.Light-emitting element module
USD1083850S1 (en)*2021-01-202025-07-15Hamamatsu Photonics K.K.Light-emitting element module
USD1089807S1 (en)2021-01-202025-08-19Hamamatsu Photonics K.K.Light-emitting element module
USD1089089S1 (en)2021-01-202025-08-19Hamamatsu Photonics K.K.Light-emitting element module
USD1089808S1 (en)2021-01-202025-08-19Hamamatsu Photonics K.K.Light-emitting element module

Citations (17)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US20040000702A1 (en)*2002-06-272004-01-01Semiconductor Components Industries, LlcIntegrated circuit and laminated leadframe package
USD506187S1 (en)*2004-10-122005-06-14Harvatek CorporationMetal base design for surface mount device LED (light emitting diode)
USD509809S1 (en)*2004-08-102005-09-20Harvatek CorporationMetal base design for surface mount device LED
USD511328S1 (en)*2004-06-232005-11-08Harvatek CorporationLight-emitting diode
US20050248336A1 (en)*2003-08-262005-11-10Nirmal SharmaCurrent sensor
US20060145318A1 (en)*2005-01-052006-07-06Xiaotian ZhangDFN semiconductor package having reduced electrical resistance
US20060214273A1 (en)*2005-03-222006-09-28Bily WangLED package structure and method making of the same
US7242076B2 (en)*2004-05-182007-07-10Fairchild Semiconductor CorporationPackaged integrated circuit with MLP leadframe and method of making same
USD576571S1 (en)*2007-06-142008-09-09Rohm Co., Ltd.Light emitting diode module
US20090174048A1 (en)*2008-01-092009-07-09Yong LiuDie package including substrate with molded device
USD599303S1 (en)*2007-12-052009-09-01Seoul Semiconductor Co., Ltd.Light emitting diode (LED)
US20090278241A1 (en)*2008-05-082009-11-12Yong LiuSemiconductor die package including die stacked on premolded substrate including die
US20100032819A1 (en)*2008-08-072010-02-11Kai LiuCompact Co-packaged Semiconductor Dies with Elevation-adaptive Interconnection Plates
US7709754B2 (en)*2003-08-262010-05-04Allegro Microsystems, Inc.Current sensor
US7714334B2 (en)*2007-08-162010-05-11Lin Peter P WPolarless surface mounting light emitting diode
US7759775B2 (en)*2004-07-202010-07-20Alpha And Omega Semiconductor IncorporatedHigh current semiconductor power device SOIC package
US7868432B2 (en)*2006-02-132011-01-11Fairchild Semiconductor CorporationMulti-chip module for battery power control

Patent Citations (17)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US20040000702A1 (en)*2002-06-272004-01-01Semiconductor Components Industries, LlcIntegrated circuit and laminated leadframe package
US7709754B2 (en)*2003-08-262010-05-04Allegro Microsystems, Inc.Current sensor
US20050248336A1 (en)*2003-08-262005-11-10Nirmal SharmaCurrent sensor
US7242076B2 (en)*2004-05-182007-07-10Fairchild Semiconductor CorporationPackaged integrated circuit with MLP leadframe and method of making same
USD511328S1 (en)*2004-06-232005-11-08Harvatek CorporationLight-emitting diode
US7759775B2 (en)*2004-07-202010-07-20Alpha And Omega Semiconductor IncorporatedHigh current semiconductor power device SOIC package
USD509809S1 (en)*2004-08-102005-09-20Harvatek CorporationMetal base design for surface mount device LED
USD506187S1 (en)*2004-10-122005-06-14Harvatek CorporationMetal base design for surface mount device LED (light emitting diode)
US20060145318A1 (en)*2005-01-052006-07-06Xiaotian ZhangDFN semiconductor package having reduced electrical resistance
US20060214273A1 (en)*2005-03-222006-09-28Bily WangLED package structure and method making of the same
US7868432B2 (en)*2006-02-132011-01-11Fairchild Semiconductor CorporationMulti-chip module for battery power control
USD576571S1 (en)*2007-06-142008-09-09Rohm Co., Ltd.Light emitting diode module
US7714334B2 (en)*2007-08-162010-05-11Lin Peter P WPolarless surface mounting light emitting diode
USD599303S1 (en)*2007-12-052009-09-01Seoul Semiconductor Co., Ltd.Light emitting diode (LED)
US20090174048A1 (en)*2008-01-092009-07-09Yong LiuDie package including substrate with molded device
US20090278241A1 (en)*2008-05-082009-11-12Yong LiuSemiconductor die package including die stacked on premolded substrate including die
US20100032819A1 (en)*2008-08-072010-02-11Kai LiuCompact Co-packaged Semiconductor Dies with Elevation-adaptive Interconnection Plates

Cited By (6)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
USD1074628S1 (en)2021-01-202025-05-13Hamamatsu Photonics K.K.Light-emitting element module
USD1083850S1 (en)*2021-01-202025-07-15Hamamatsu Photonics K.K.Light-emitting element module
USD1089807S1 (en)2021-01-202025-08-19Hamamatsu Photonics K.K.Light-emitting element module
USD1089089S1 (en)2021-01-202025-08-19Hamamatsu Photonics K.K.Light-emitting element module
USD1089808S1 (en)2021-01-202025-08-19Hamamatsu Photonics K.K.Light-emitting element module
TWD227764S (en)2022-01-182023-10-01美商科銳Led公司 美國Light-emitting device package

Also Published As

Publication numberPublication date
TWD143606S1 (en)2011-11-01

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