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USD645486S1 - Dielectric window for plasma processing device - Google Patents

Dielectric window for plasma processing device
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Publication number
USD645486S1
USD645486S1US29/369,644US36964410FUSD645486SUS D645486 S1USD645486 S1US D645486S1US 36964410 FUS36964410 FUS 36964410FUS D645486 SUSD645486 SUS D645486S
Authority
US
United States
Prior art keywords
processing device
plasma processing
dielectric window
dielectric
window
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/369,644
Inventor
Wataru Yoshikawa
Naoki Matsumoto
Jun Yoshikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron LtdfiledCriticalTokyo Electron Ltd
Assigned to TOKYO ELECTRON LIMITEDreassignmentTOKYO ELECTRON LIMITEDASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).Assignors: MATSUMOTO, NAOKI, YOSHIKAWA, JUN, YOSHIKAWA, WATARU
Application grantedgrantedCritical
Publication of USD645486S1publicationCriticalpatent/USD645486S1/en
Anticipated expirationlegal-statusCritical
Expired - Lifetimelegal-statusCriticalCurrent

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Description

FIG. 1 is a perspective view of a dielectric window for plasma processing device showing our new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a right side view thereof;
FIG. 5 is a top plan view thereof; and,
FIG. 6 is a cross-sectional view taken along line6-6 ofFIG. 2.

Claims (1)

  1. The ornamental design for a dielectric window for a plasma processing device, as shown and described.
US29/369,6442010-03-312010-09-10Dielectric window for plasma processing deviceExpired - LifetimeUSD645486S1 (en)

Applications Claiming Priority (2)

Application NumberPriority DateFiling DateTitle
JP2010-0081092010-03-31
JP20100081092010-03-31

Publications (1)

Publication NumberPublication Date
USD645486S1true USD645486S1 (en)2011-09-20

Family

ID=44587438

Family Applications (1)

Application NumberTitlePriority DateFiling Date
US29/369,644Expired - LifetimeUSD645486S1 (en)2010-03-312010-09-10Dielectric window for plasma processing device

Country Status (2)

CountryLink
US (1)USD645486S1 (en)
TW (1)TWD142852S1 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
USD658691S1 (en)*2011-03-302012-05-01Tokyo Electron LimitedLiner for plasma processing apparatus
USD658693S1 (en)*2011-03-302012-05-01Tokyo Electron LimitedLiner for plasma processing apparatus
USD658692S1 (en)*2011-03-302012-05-01Tokyo Electron LimitedLiner for plasma processing apparatus
USD826300S1 (en)*2016-09-302018-08-21Oerlikon Metco Ag, WohlenRotably mounted thermal plasma burner for thermalspraying
USD909439S1 (en)*2018-11-302021-02-02Ferrotec (Usa) CorporationTwo-piece crucible cover
USD921058S1 (en)*2019-08-272021-06-01Black & Decker Inc.Abrasive wheel

Citations (8)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US4391034A (en)*1980-12-221983-07-05Ibm CorporationThermally compensated shadow mask
US20010007302A1 (en)*1997-05-162001-07-12Liubo HongHybrid coil design for ionized deposition
US6280563B1 (en)*1997-12-312001-08-28Lam Research CorporationPlasma device including a powered non-magnetic metal member between a plasma AC excitation source and the plasma
US20060110546A1 (en)*2002-09-302006-05-25Vikharev Anatoly LHigh velocity method for deposing diamond films from a gaseous phase in shf discharge plasma and device for carrying out said method
US20080102538A1 (en)*2006-10-272008-05-01Taiwan Semiconductor Manufacturing Company, Ltd.Apparatus and Method For Controlling Relative Particle Concentrations In A Plasma
US20090068934A1 (en)*2007-09-042009-03-12Samsung Electronics Co., Ltd.Wafer polishing carrier apparatus and chemical mechanical polishing equipment using the same
US20090314434A1 (en)*2006-08-282009-12-24Qiaoli SongInductively coupled coil and inductively coupled plasma device using the same
US20100230273A1 (en)*2006-06-222010-09-16Shibaura Mechatronics CorporationFilm forming apparatus and film forming method

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US4391034A (en)*1980-12-221983-07-05Ibm CorporationThermally compensated shadow mask
US20010007302A1 (en)*1997-05-162001-07-12Liubo HongHybrid coil design for ionized deposition
US6280563B1 (en)*1997-12-312001-08-28Lam Research CorporationPlasma device including a powered non-magnetic metal member between a plasma AC excitation source and the plasma
US20060110546A1 (en)*2002-09-302006-05-25Vikharev Anatoly LHigh velocity method for deposing diamond films from a gaseous phase in shf discharge plasma and device for carrying out said method
US7694651B2 (en)*2002-09-302010-04-13Institute Of Applied Physics RasHigh velocity method for deposing diamond films from a gaseous phase in SHF discharge plasma and device for carrying out said method
US20100230273A1 (en)*2006-06-222010-09-16Shibaura Mechatronics CorporationFilm forming apparatus and film forming method
US20090314434A1 (en)*2006-08-282009-12-24Qiaoli SongInductively coupled coil and inductively coupled plasma device using the same
US20080102538A1 (en)*2006-10-272008-05-01Taiwan Semiconductor Manufacturing Company, Ltd.Apparatus and Method For Controlling Relative Particle Concentrations In A Plasma
US20090068934A1 (en)*2007-09-042009-03-12Samsung Electronics Co., Ltd.Wafer polishing carrier apparatus and chemical mechanical polishing equipment using the same

Cited By (6)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
USD658691S1 (en)*2011-03-302012-05-01Tokyo Electron LimitedLiner for plasma processing apparatus
USD658693S1 (en)*2011-03-302012-05-01Tokyo Electron LimitedLiner for plasma processing apparatus
USD658692S1 (en)*2011-03-302012-05-01Tokyo Electron LimitedLiner for plasma processing apparatus
USD826300S1 (en)*2016-09-302018-08-21Oerlikon Metco Ag, WohlenRotably mounted thermal plasma burner for thermalspraying
USD909439S1 (en)*2018-11-302021-02-02Ferrotec (Usa) CorporationTwo-piece crucible cover
USD921058S1 (en)*2019-08-272021-06-01Black & Decker Inc.Abrasive wheel

Also Published As

Publication numberPublication date
TWD142852S1 (en)2011-09-21

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