USD643819S1 - Package for light emitting diode (LED) lighting - Google Patents
Package for light emitting diode (LED) lightingDownload PDFInfo
- Publication number
- USD643819S1 USD643819S1US29/365,939US36593910FUSD643819SUS D643819 S1USD643819 S1US D643819S1US 36593910 FUS36593910 FUS 36593910FUS D643819 SUSD643819 SUS D643819S
- Authority
- US
- United States
- Prior art keywords
- package
- led
- lighting
- light emitting
- emitting diode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Classifications
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
Description
The broken lines are for illustrative purposes only and form no part of the claimed design.
Claims (1)
- The ornamental design for a package for light emitting diode (LED) lighting, as shown and described.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US29/365,939USD643819S1 (en) | 2010-07-16 | 2010-07-16 | Package for light emitting diode (LED) lighting |
| US29/397,017USD667801S1 (en) | 2010-07-16 | 2011-07-11 | Package for light emitting diode (LED) lighting |
| US29/432,988USD708156S1 (en) | 2010-07-16 | 2012-09-24 | Package for light emitting diode (LED) lighting |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US29/365,939USD643819S1 (en) | 2010-07-16 | 2010-07-16 | Package for light emitting diode (LED) lighting |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/397,017DivisionUSD667801S1 (en) | 2010-07-16 | 2011-07-11 | Package for light emitting diode (LED) lighting |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USD643819S1true USD643819S1 (en) | 2011-08-23 |
Family
ID=44455808
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/365,939Expired - LifetimeUSD643819S1 (en) | 2010-07-16 | 2010-07-16 | Package for light emitting diode (LED) lighting |
| US29/397,017ActiveUSD667801S1 (en) | 2010-07-16 | 2011-07-11 | Package for light emitting diode (LED) lighting |
| US29/432,988ActiveUSD708156S1 (en) | 2010-07-16 | 2012-09-24 | Package for light emitting diode (LED) lighting |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/397,017ActiveUSD667801S1 (en) | 2010-07-16 | 2011-07-11 | Package for light emitting diode (LED) lighting |
| US29/432,988ActiveUSD708156S1 (en) | 2010-07-16 | 2012-09-24 | Package for light emitting diode (LED) lighting |
Country Status (1)
| Country | Link |
|---|---|
| US (3) | USD643819S1 (en) |
Cited By (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110031865A1 (en)* | 2009-01-12 | 2011-02-10 | Hussell Christopher P | Light emitting device packages with improved heat transfer |
| US20110180827A1 (en)* | 2009-06-05 | 2011-07-28 | Hussell Christopher P | Solid state lighting device |
| USD659657S1 (en) | 2010-04-30 | 2012-05-15 | Cree, Inc. | Light emitting diode (LED) package |
| USD661264S1 (en) | 2009-06-05 | 2012-06-05 | Cree, Inc. | Light emiting device package |
| US8269244B2 (en) | 2010-06-28 | 2012-09-18 | Cree, Inc. | LED package with efficient, isolated thermal path |
| USD667801S1 (en)* | 2010-07-16 | 2012-09-25 | Cree, Inc. | Package for light emitting diode (LED) lighting |
| USD679842S1 (en) | 2011-01-03 | 2013-04-09 | Cree, Inc. | High brightness LED package |
| US8610140B2 (en) | 2010-12-15 | 2013-12-17 | Cree, Inc. | Light emitting diode (LED) packages, systems, devices and related methods |
| US8648359B2 (en) | 2010-06-28 | 2014-02-11 | Cree, Inc. | Light emitting devices and methods |
| US8686445B1 (en) | 2009-06-05 | 2014-04-01 | Cree, Inc. | Solid state lighting devices and methods |
| US8860043B2 (en) | 2009-06-05 | 2014-10-14 | Cree, Inc. | Light emitting device packages, systems and methods |
| USD731214S1 (en)* | 2014-01-15 | 2015-06-09 | Winston Products Llc | Merchandising containers for vehicle lights |
| USD731825S1 (en)* | 2014-01-15 | 2015-06-16 | Winston Products Llc | Merchandising containers for vehicle lights |
| USD731826S1 (en)* | 2014-01-15 | 2015-06-16 | Winston Products Llc | Merchandising containers for vehicle lights |
| US9111778B2 (en) | 2009-06-05 | 2015-08-18 | Cree, Inc. | Light emitting diode (LED) devices, systems, and methods |
| USD778848S1 (en)* | 2015-04-07 | 2017-02-14 | Cree, Inc. | Solid state light emitter component |
| US9691949B2 (en) | 2014-05-30 | 2017-06-27 | Cree, Inc. | Submount based light emitter components and methods |
| US9859471B2 (en) | 2011-01-31 | 2018-01-02 | Cree, Inc. | High brightness light emitting diode (LED) packages, systems and methods with improved resin filling and high adhesion |
| US10957736B2 (en) | 2018-03-12 | 2021-03-23 | Cree, Inc. | Light emitting diode (LED) components and methods |
| US11101408B2 (en) | 2011-02-07 | 2021-08-24 | Creeled, Inc. | Components and methods for light emitting diode (LED) lighting |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9685592B2 (en) | 2009-01-14 | 2017-06-20 | Cree Huizhou Solid State Lighting Company Limited | Miniature surface mount device with large pin pads |
| CN102934228B (en) | 2011-03-02 | 2017-09-01 | 惠州科锐半导体照明有限公司 | Light-emitting diode packages and light-emitting diodes |
| USD691100S1 (en)* | 2011-03-02 | 2013-10-08 | Cree Huizhou Solid State Lighting Company Limited | Miniature surface mount device |
| USD738027S1 (en)* | 2013-11-18 | 2015-09-01 | Koninklijke Philips N.V. | Illuminated OLED panel |
| USD796076S1 (en) | 2014-12-22 | 2017-08-29 | Lunera Lighting Inc. | Horizontal LED lamp |
| USD782989S1 (en)* | 2015-05-15 | 2017-04-04 | Citizen Electronics Co., Ltd. | Light-emitting diode |
| USD777694S1 (en)* | 2015-05-15 | 2017-01-31 | Citizen Electronics Co., Ltd. | Light-emitting diode |
| US10576557B2 (en) | 2017-11-17 | 2020-03-03 | Greenlee Tools, Inc. | Workpiece shearing apparatus |
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