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USD600222S1 - Wafer boat - Google Patents

Wafer boat
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Publication number
USD600222S1
USD600222S1US29/309,701US30970108FUSD600222SUS D600222 S1USD600222 S1US D600222S1US 30970108 FUS30970108 FUS 30970108FUS D600222 SUSD600222 SUS D600222S
Authority
US
United States
Prior art keywords
wafer boat
view
wafer
boat
enlarged
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/309,701
Inventor
Izumi Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron LtdfiledCriticalTokyo Electron Ltd
Assigned to TOKYO ELECTRON LIMITEDreassignmentTOKYO ELECTRON LIMITEDASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).Assignors: SATO, IZUMI
Application grantedgrantedCritical
Publication of USD600222S1publicationCriticalpatent/USD600222S1/en
Anticipated expirationlegal-statusCritical
Expired - Lifetimelegal-statusCriticalCurrent

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Description

FIG. 1 is a front view;
FIG. 2 is a partial enlarged perspective view of a bottom along22 of the frontal view shown inFIG. 1;
FIG. 3 is an enlarged bottom view;
FIG. 4 is a rear view;
FIG. 5 is a left side view the right side being a mirror image thereof;
FIG. 6 is a plan view;
FIG. 7 is a bottom view; and,
FIG. 8 is a partial, enlarged view, along22 of a front view shown inFIG. 1 of the wafer boat in use.
Salients are formed on a bottom board of a wafer boat to get into reentrants of a heat insulating cylinder for manufacturing a semiconductor wafer, and stabilize it in a setting condition. The portion shown in solid lines is my claimed design. The broken line showing in the figures is for illustrative purposes only and forms no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a wafer boat, as shown and described.
US29/309,7012008-03-282008-09-26Wafer boatExpired - LifetimeUSD600222S1 (en)

Applications Claiming Priority (2)

Application NumberPriority DateFiling DateTitle
JP2008-0078572008-03-28
JP20080078572008-03-28

Publications (1)

Publication NumberPublication Date
USD600222S1true USD600222S1 (en)2009-09-15

Family

ID=41059236

Family Applications (1)

Application NumberTitlePriority DateFiling Date
US29/309,701Expired - LifetimeUSD600222S1 (en)2008-03-282008-09-26Wafer boat

Country Status (2)

CountryLink
US (1)USD600222S1 (en)
TW (1)TWD133942S1 (en)

Cited By (27)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US20080000851A1 (en)*2006-06-022008-01-03Rohm And Haas Electronic Materials LlcApparatus with fillet radius joints
US20110017763A1 (en)*2005-07-142011-01-27Colelli Robert PMerchandise dispensing apparatus providing theft deterrence
USD716240S1 (en)*2013-11-072014-10-28Applied Materials, Inc.Lower chamber liner
USD716239S1 (en)*2013-11-062014-10-28Applied Materials, Inc.Upper chamber liner
USD717746S1 (en)*2013-11-062014-11-18Applied Materials, Inc.Lower chamber liner
USD734730S1 (en)*2012-12-272015-07-21Hitachi Kokusai Electric Inc.Boat of substrate processing apparatus
USD737785S1 (en)*2013-07-292015-09-01Hitachi Kokusai Electric Inc.Boat for substrate processing apparatus
USD738329S1 (en)*2013-07-292015-09-08Hitachi Kokusai Electric Inc.Boat for substrate processing apparatus
USD739831S1 (en)*2013-03-222015-09-29Hitachi Kokusai Electric Inc.Boat for substrate processing apparatus
USD740769S1 (en)*2013-03-222015-10-13Hitachi Kokusai Electric Inc.Boat for substrate processing apparatus
USD747279S1 (en)*2013-07-292016-01-12Hitachi Kokusai Electric Inc.Boat for substrate processing apparatus
USD748593S1 (en)*2014-03-052016-02-02Hzo, Inc.Boat for use in a material deposition apparatus
USD763807S1 (en)*2014-05-222016-08-16Hzo, Inc.Boat for a deposition apparatus
USD769201S1 (en)*2014-11-202016-10-18Tokyo Electron LimitedWafer boat
USD772183S1 (en)*2014-11-202016-11-22Tokyo Electron LimitedWafer boat
USD789310S1 (en)*2014-11-202017-06-13Tokyo Electron LimitedWafer boat
USD791721S1 (en)*2014-11-202017-07-11Tokyo Electron LimitedWafer boat
US10167571B2 (en)2013-03-152019-01-01Veeco Instruments Inc.Wafer carrier having provisions for improving heating uniformity in chemical vapor deposition systems
USD839219S1 (en)*2016-02-122019-01-29Kokusai Electric CorporationBoat for substrate processing apparatus
USD846514S1 (en)*2018-05-032019-04-23Kokusai Electric CorporationBoat of substrate processing apparatus
USD847105S1 (en)*2018-05-032019-04-30Kokusai Electric CorporationBoat of substrate processing apparatus
US10316412B2 (en)2012-04-182019-06-11Veeco Instruments Inc.Wafter carrier for chemical vapor deposition systems
USD908102S1 (en)*2019-02-202021-01-19Veeco Instruments Inc.Transportable semiconductor wafer rack
USD908103S1 (en)*2019-02-202021-01-19Veeco Instruments Inc.Transportable semiconductor wafer rack
USD928732S1 (en)*2020-03-202021-08-24Yubico AbBezel for attaching sensor to a printed circuit board in a security key
USD939459S1 (en)*2019-08-072021-12-28Kokusai Electric CorporationBoat for wafer processing apparatus
US20220254668A1 (en)*2021-02-082022-08-11Asm Ip Holding B.V.Wafer boat

Citations (15)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
USD411176S (en)*1997-08-201999-06-22Tokyo Electron LimitedWafer boat for use in a semiconductor wafer heat processing apparatus
US6110285A (en)*1997-04-152000-08-29Toshiba Ceramics Co., Ltd.Vertical wafer boat
US6163015A (en)*1999-07-212000-12-19Moore Epitaxial, Inc.Substrate support element
US6287112B1 (en)*2000-03-302001-09-11Asm International, N.V.Wafer boat
US6454865B1 (en)*1997-11-032002-09-24Asm America, Inc.Low mass wafer support system
US20020187023A1 (en)*2001-05-112002-12-12Itsuo ArakiVertical type wafer supporting jig
US6536608B2 (en)*2001-07-122003-03-25Saint-Gobain Ceramics & Plastics, Inc.Single cast vertical wafer boat with a Y shaped column rack
US6780251B2 (en)*2001-07-192004-08-24Hitachi Kokusai Electric, Inc.Substrate processing apparatus and method for fabricating semiconductor device
US6811040B2 (en)*2001-07-162004-11-02Rohm And Haas CompanyWafer holding apparatus
US6840767B2 (en)*2000-12-222005-01-11Asm America, Inc.Susceptor pocket profile to improve process performance
US7207763B2 (en)*2004-01-152007-04-24Terasemicon Co., LtdSemiconductor manufacturing system and wafer holder for semiconductor manufacturing system
US20070157886A1 (en)*2005-09-302007-07-12Applied Materials, Inc.Substrate support assembly with thermal isolating plate
US20080041820A1 (en)*2002-09-202008-02-21Lam Research CorporationApparatus for reducing polymer deposition on a substrate and substrate support
USD580894S1 (en)*2006-05-012008-11-18Tokyo Electron LimitedWafer boat
US7455734B2 (en)*2003-11-272008-11-25Hitachi Kokusai Electric Inc.Substrate processing apparatus, substrate holder, and manufacturing method of semiconductor device

Patent Citations (15)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US6110285A (en)*1997-04-152000-08-29Toshiba Ceramics Co., Ltd.Vertical wafer boat
USD411176S (en)*1997-08-201999-06-22Tokyo Electron LimitedWafer boat for use in a semiconductor wafer heat processing apparatus
US6454865B1 (en)*1997-11-032002-09-24Asm America, Inc.Low mass wafer support system
US6163015A (en)*1999-07-212000-12-19Moore Epitaxial, Inc.Substrate support element
US6287112B1 (en)*2000-03-302001-09-11Asm International, N.V.Wafer boat
US6840767B2 (en)*2000-12-222005-01-11Asm America, Inc.Susceptor pocket profile to improve process performance
US20020187023A1 (en)*2001-05-112002-12-12Itsuo ArakiVertical type wafer supporting jig
US6536608B2 (en)*2001-07-122003-03-25Saint-Gobain Ceramics & Plastics, Inc.Single cast vertical wafer boat with a Y shaped column rack
US6811040B2 (en)*2001-07-162004-11-02Rohm And Haas CompanyWafer holding apparatus
US6780251B2 (en)*2001-07-192004-08-24Hitachi Kokusai Electric, Inc.Substrate processing apparatus and method for fabricating semiconductor device
US20080041820A1 (en)*2002-09-202008-02-21Lam Research CorporationApparatus for reducing polymer deposition on a substrate and substrate support
US7455734B2 (en)*2003-11-272008-11-25Hitachi Kokusai Electric Inc.Substrate processing apparatus, substrate holder, and manufacturing method of semiconductor device
US7207763B2 (en)*2004-01-152007-04-24Terasemicon Co., LtdSemiconductor manufacturing system and wafer holder for semiconductor manufacturing system
US20070157886A1 (en)*2005-09-302007-07-12Applied Materials, Inc.Substrate support assembly with thermal isolating plate
USD580894S1 (en)*2006-05-012008-11-18Tokyo Electron LimitedWafer boat

Cited By (29)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US20110017763A1 (en)*2005-07-142011-01-27Colelli Robert PMerchandise dispensing apparatus providing theft deterrence
US8727179B2 (en)*2005-07-142014-05-20Rtc Industries, Inc.Merchandise dispensing apparatus providing theft deterrence
US20080000851A1 (en)*2006-06-022008-01-03Rohm And Haas Electronic Materials LlcApparatus with fillet radius joints
US10316412B2 (en)2012-04-182019-06-11Veeco Instruments Inc.Wafter carrier for chemical vapor deposition systems
USD734730S1 (en)*2012-12-272015-07-21Hitachi Kokusai Electric Inc.Boat of substrate processing apparatus
US10167571B2 (en)2013-03-152019-01-01Veeco Instruments Inc.Wafer carrier having provisions for improving heating uniformity in chemical vapor deposition systems
USD739831S1 (en)*2013-03-222015-09-29Hitachi Kokusai Electric Inc.Boat for substrate processing apparatus
USD740769S1 (en)*2013-03-222015-10-13Hitachi Kokusai Electric Inc.Boat for substrate processing apparatus
USD747279S1 (en)*2013-07-292016-01-12Hitachi Kokusai Electric Inc.Boat for substrate processing apparatus
USD737785S1 (en)*2013-07-292015-09-01Hitachi Kokusai Electric Inc.Boat for substrate processing apparatus
USD738329S1 (en)*2013-07-292015-09-08Hitachi Kokusai Electric Inc.Boat for substrate processing apparatus
USD716239S1 (en)*2013-11-062014-10-28Applied Materials, Inc.Upper chamber liner
USD717746S1 (en)*2013-11-062014-11-18Applied Materials, Inc.Lower chamber liner
USD716240S1 (en)*2013-11-072014-10-28Applied Materials, Inc.Lower chamber liner
USD748593S1 (en)*2014-03-052016-02-02Hzo, Inc.Boat for use in a material deposition apparatus
USD763807S1 (en)*2014-05-222016-08-16Hzo, Inc.Boat for a deposition apparatus
USD769201S1 (en)*2014-11-202016-10-18Tokyo Electron LimitedWafer boat
USD791721S1 (en)*2014-11-202017-07-11Tokyo Electron LimitedWafer boat
USD789310S1 (en)*2014-11-202017-06-13Tokyo Electron LimitedWafer boat
USD772183S1 (en)*2014-11-202016-11-22Tokyo Electron LimitedWafer boat
USD839219S1 (en)*2016-02-122019-01-29Kokusai Electric CorporationBoat for substrate processing apparatus
USD846514S1 (en)*2018-05-032019-04-23Kokusai Electric CorporationBoat of substrate processing apparatus
USD847105S1 (en)*2018-05-032019-04-30Kokusai Electric CorporationBoat of substrate processing apparatus
USD908102S1 (en)*2019-02-202021-01-19Veeco Instruments Inc.Transportable semiconductor wafer rack
USD908103S1 (en)*2019-02-202021-01-19Veeco Instruments Inc.Transportable semiconductor wafer rack
USD939459S1 (en)*2019-08-072021-12-28Kokusai Electric CorporationBoat for wafer processing apparatus
USD928732S1 (en)*2020-03-202021-08-24Yubico AbBezel for attaching sensor to a printed circuit board in a security key
US20220254668A1 (en)*2021-02-082022-08-11Asm Ip Holding B.V.Wafer boat
US11869786B2 (en)*2021-02-082024-01-09Asm Ip Holding B.V.Wafer boat

Also Published As

Publication numberPublication date
TWD133942S1 (en)2010-03-21

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