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USD583779S1 - Electrolytic plating anode - Google Patents

Electrolytic plating anodeDownload PDF

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Publication number
USD583779S1
USD583779S1US29/262,881US26288106FUSD583779SUS D583779 S1USD583779 S1US D583779S1US 26288106 FUS26288106 FUS 26288106FUS D583779 SUSD583779 SUS D583779S
Authority
US
United States
Prior art keywords
electrolytic plating
plating anode
anode
view
electrolytic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/262,881
Inventor
Fumio Kuriyama
Masaaki Kimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara CorpfiledCriticalEbara Corp
Priority to US29/262,881priorityCriticalpatent/USD583779S1/en
Assigned to EBARA CORPORATIONreassignmentEBARA CORPORATIONASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).Assignors: KIMURA, MASAAKI, KURIYAMA, FUMIO
Application grantedgrantedCritical
Publication of USD583779S1publicationCriticalpatent/USD583779S1/en
Anticipated expirationlegal-statusCritical
Expired - Lifetimelegal-statusCriticalCurrent

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Description

The claimed electrolytic plating anode is used to perform an electrolytic plating process in a plating bath when a voltage is applied via an anode shaft connected to the electrolytic plating anode.
FIG. 1 is a front elevation view of an electrolytic plating anode;
FIG. 2 is a rear view of the electrolytic plating anode shown inFIG. 1;
FIG. 3 is a top plan view of the electrolytic plating anode shown inFIG. 1, wherein the broken lines form no part of the claimed design;
FIG. 4 is a bottom plan view of the electrolytic plating anode shown inFIG. 1;
FIG. 5 is a right side view of the electrolytic plating anode shown inFIG. 1; and,
FIG. 6 is a left side view of the electrolytic plating anode shown inFIG. 1.

Claims (1)

    CLAIM
  1. The ornamental design for an electrolytic plating anode, as shown and described.
US29/262,8812006-07-132006-07-13Electrolytic plating anodeExpired - LifetimeUSD583779S1 (en)

Priority Applications (1)

Application NumberPriority DateFiling DateTitle
US29/262,881USD583779S1 (en)2006-07-132006-07-13Electrolytic plating anode

Applications Claiming Priority (1)

Application NumberPriority DateFiling DateTitle
US29/262,881USD583779S1 (en)2006-07-132006-07-13Electrolytic plating anode

Publications (1)

Publication NumberPublication Date
USD583779S1true USD583779S1 (en)2008-12-30

Family

ID=40138867

Family Applications (1)

Application NumberTitlePriority DateFiling Date
US29/262,881Expired - LifetimeUSD583779S1 (en)2006-07-132006-07-13Electrolytic plating anode

Country Status (1)

CountryLink
US (1)USD583779S1 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
USD606952S1 (en)*2009-01-162009-12-29Asm Genitech Korea Ltd.Plasma inducing plate for semiconductor deposition apparatus
USD703162S1 (en)*2012-10-172014-04-22Sumitomo Electric Industries, Ltd.Wafer holder for stepper
USD886739S1 (en)*2019-01-042020-06-09Libest Inc.Electrode plate
USD925532S1 (en)*2018-11-132021-07-20Smk CorporationTouch panel
USD957357S1 (en)*2021-03-152022-07-12Christopher L. MooreCap for an anode assembly

Citations (22)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US4203127A (en)*1977-07-181980-05-13Motorola, Inc.Package and method of packaging semiconductor wafers
US5429733A (en)*1992-05-211995-07-04Electroplating Engineers Of Japan, Ltd.Plating device for wafer
US5537042A (en)*1994-11-181996-07-16Eldec CorporationMethod and system for unobtrusively measuring physical properties in electrochemical processes
US5657198A (en)*1995-10-111997-08-12Flener; Jeff M.Canister for surface mount electronic components
US5869196A (en)*1996-12-201999-02-09Composite Material Technology, Inc.Constrained filament electrolytic anode and process of fabrication
USD411516S (en)*1996-03-151999-06-29Tokyo Electron LimitedGas diffusion plate for electrode of semiconductor wafer processing apparatus
US6071388A (en)*1998-05-292000-06-06International Business Machines CorporationElectroplating workpiece fixture having liquid gap spacer
US6248222B1 (en)*1998-09-082001-06-19Acm Research, Inc.Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpieces
US6251238B1 (en)*1999-07-072001-06-26Technic Inc.Anode having separately excitable sections to compensate for non-uniform plating deposition across the surface of a wafer due to seed layer resistance
US6309523B1 (en)*1997-04-022001-10-30Eltech Systems CorporationElectrode and electrolytic cell containing same
US6365020B1 (en)1998-01-122002-04-02Ebara CorporationWafer plating jig
US6383352B1 (en)*1998-11-132002-05-07Mykrolis CorporationSpiral anode for metal plating baths
US20020112953A1 (en)*2001-02-212002-08-22Kohut Stephen J.Anode for plating a semiconductor wafer
US6471847B2 (en)*1999-03-302002-10-29Nutool, Inc.Method for forming an electrical contact with a semiconductor substrate
US6613200B2 (en)*2001-01-262003-09-02Applied Materials, Inc.Electro-chemical plating with reduced thickness and integration with chemical mechanical polisher into a single platform
US20030221956A1 (en)*2002-05-282003-12-04Applied Materials, Inc.Anode slime reduction method while maintaining low current
US6716332B1 (en)1998-11-092004-04-06Ebara CorporationPlating method and apparatus
US20040231978A1 (en)*2001-09-192004-11-25White Tamara LElectrode attachment to anode assembly
US20050029641A1 (en)*2003-07-282005-02-10Sanyo Electric Co., Ltd.Semiconductor device and manufacturing method of the same
US20060124454A1 (en)*2002-12-232006-06-15Metakem Gesellschaft Fur Schichtchemie Der Metalle MbhAnode used for electroplating
US7223323B2 (en)*2002-07-242007-05-29Applied Materials, Inc.Multi-chemistry plating system
US20080017505A1 (en)*2006-07-212008-01-24Fumio KuriyamaAnode holder

Patent Citations (22)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US4203127A (en)*1977-07-181980-05-13Motorola, Inc.Package and method of packaging semiconductor wafers
US5429733A (en)*1992-05-211995-07-04Electroplating Engineers Of Japan, Ltd.Plating device for wafer
US5537042A (en)*1994-11-181996-07-16Eldec CorporationMethod and system for unobtrusively measuring physical properties in electrochemical processes
US5657198A (en)*1995-10-111997-08-12Flener; Jeff M.Canister for surface mount electronic components
USD411516S (en)*1996-03-151999-06-29Tokyo Electron LimitedGas diffusion plate for electrode of semiconductor wafer processing apparatus
US5869196A (en)*1996-12-201999-02-09Composite Material Technology, Inc.Constrained filament electrolytic anode and process of fabrication
US6309523B1 (en)*1997-04-022001-10-30Eltech Systems CorporationElectrode and electrolytic cell containing same
US6365020B1 (en)1998-01-122002-04-02Ebara CorporationWafer plating jig
US6071388A (en)*1998-05-292000-06-06International Business Machines CorporationElectroplating workpiece fixture having liquid gap spacer
US6248222B1 (en)*1998-09-082001-06-19Acm Research, Inc.Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpieces
US6716332B1 (en)1998-11-092004-04-06Ebara CorporationPlating method and apparatus
US6383352B1 (en)*1998-11-132002-05-07Mykrolis CorporationSpiral anode for metal plating baths
US6471847B2 (en)*1999-03-302002-10-29Nutool, Inc.Method for forming an electrical contact with a semiconductor substrate
US6251238B1 (en)*1999-07-072001-06-26Technic Inc.Anode having separately excitable sections to compensate for non-uniform plating deposition across the surface of a wafer due to seed layer resistance
US6613200B2 (en)*2001-01-262003-09-02Applied Materials, Inc.Electro-chemical plating with reduced thickness and integration with chemical mechanical polisher into a single platform
US20020112953A1 (en)*2001-02-212002-08-22Kohut Stephen J.Anode for plating a semiconductor wafer
US20040231978A1 (en)*2001-09-192004-11-25White Tamara LElectrode attachment to anode assembly
US20030221956A1 (en)*2002-05-282003-12-04Applied Materials, Inc.Anode slime reduction method while maintaining low current
US7223323B2 (en)*2002-07-242007-05-29Applied Materials, Inc.Multi-chemistry plating system
US20060124454A1 (en)*2002-12-232006-06-15Metakem Gesellschaft Fur Schichtchemie Der Metalle MbhAnode used for electroplating
US20050029641A1 (en)*2003-07-282005-02-10Sanyo Electric Co., Ltd.Semiconductor device and manufacturing method of the same
US20080017505A1 (en)*2006-07-212008-01-24Fumio KuriyamaAnode holder

Cited By (5)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
USD606952S1 (en)*2009-01-162009-12-29Asm Genitech Korea Ltd.Plasma inducing plate for semiconductor deposition apparatus
USD703162S1 (en)*2012-10-172014-04-22Sumitomo Electric Industries, Ltd.Wafer holder for stepper
USD925532S1 (en)*2018-11-132021-07-20Smk CorporationTouch panel
USD886739S1 (en)*2019-01-042020-06-09Libest Inc.Electrode plate
USD957357S1 (en)*2021-03-152022-07-12Christopher L. MooreCap for an anode assembly

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