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USD563333S1 - Light emitting diode (LED) - Google Patents

Light emitting diode (LED)
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Publication number
USD563333S1
USD563333S1US29/263,736US26373606FUSD563333SUS D563333 S1USD563333 S1US D563333S1US 26373606 FUS26373606 FUS 26373606FUS D563333 SUSD563333 SUS D563333S
Authority
US
United States
Prior art keywords
led
light emitting
emitting diode
view
ornamental design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/263,736
Inventor
Bang Hyun Kim
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seoul Semiconductor Co Ltd
Original Assignee
Seoul Semiconductor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seoul Semiconductor Co LtdfiledCriticalSeoul Semiconductor Co Ltd
Assigned to SEOUL SEMICONDUCTOR CO., LTD.reassignmentSEOUL SEMICONDUCTOR CO., LTD.ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).Assignors: KIM, BANG HYUN
Application grantedgrantedCritical
Publication of USD563333S1publicationCriticalpatent/USD563333S1/en
Anticipated expirationlegal-statusCritical
Expired - Lifetimelegal-statusCriticalCurrent

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Description

FIG. 1 is a perspective view of a light emitting diode (LED) showing my new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a left side elevational view thereof;
FIG. 4 is a top plan view thereof;
FIG. 5 is a bottom plan view thereof; and,
FIG. 6 is a sectional view taken alongline66 inFIG. 4.

Claims (1)

    CLAIM
  1. The ornamental design for light emitting diode (LED), as shown and described.
US29/263,7362006-04-052006-07-28Light emitting diode (LED)Expired - LifetimeUSD563333S1 (en)

Applications Claiming Priority (2)

Application NumberPriority DateFiling DateTitle
KR30-2006-00125642006-04-05
KR200600125642006-04-05

Publications (1)

Publication NumberPublication Date
USD563333S1true USD563333S1 (en)2008-03-04

Family

ID=39125863

Family Applications (1)

Application NumberTitlePriority DateFiling Date
US29/263,736Expired - LifetimeUSD563333S1 (en)2006-04-052006-07-28Light emitting diode (LED)

Country Status (2)

CountryLink
US (1)USD563333S1 (en)
TW (1)TWD117963S1 (en)

Cited By (19)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
USD584247S1 (en)*2007-09-032009-01-06Alti-Electronics, Co., Ltd.Light emitting diode
USD584248S1 (en)*2007-08-202009-01-06Alti-Electronics, Co., Ltd.Light emitting diode
USD598873S1 (en)*2008-11-182009-08-25Xicato, Inc.LED module
USD599750S1 (en)*2008-06-202009-09-08Samsung Electro-Mechanics Co., Ltd.Case for light emitting diode
USD600658S1 (en)*2008-05-132009-09-22Citizen Electronics Co., Ltd.Light-emitting diode
USD608740S1 (en)*2008-08-292010-01-26Foxsemicon Integrated Technology, Inc.Light-emitting diode substrate
USD619110S1 (en)*2009-11-202010-07-06Silitek Electronic (Guangzhou) Co., Ltd.LED package
USD621798S1 (en)*2008-08-292010-08-17Foxsemicon Integrated Technology, Inc.Light-emitting diode substrate
USD622677S1 (en)*2009-02-032010-08-31Everlight Electronics Co., Ltd.Light emitting diode package device
USD624885S1 (en)*2010-01-272010-10-05Silitek Electronic (Guangzhou) Co., Ltd.LED package structure
US20100264436A1 (en)*2009-04-172010-10-21Avago Technologies Ecbu Ip (Singapore) Pte. Ltd.PLCC Package With A Reflector Cup Surrounded By A Single Encapsulant
US20100264437A1 (en)*2009-04-172010-10-21Avago Technologies Ecbu Ip (Singapore) Pte.Ltd.PLCC Package With A Reflector Cup Surrounded By An Encapsulant
USD674361S1 (en)*2012-03-302013-01-15Silitek Electronic (Guangzhou) Co., Ltd.LED package
USD691744S1 (en)2012-03-162013-10-15Xicato, Inc.Narrow beam LED module
USD693780S1 (en)*2012-09-272013-11-19Lextar Electronics CorporationLight emitting diode package
USD695239S1 (en)*2012-07-122013-12-10Lextar Electronics CorporationLight emitting diode package
US20140110739A1 (en)*2007-12-062014-04-24Seoul Semiconductor Co., Ltd.Led package and method for fabricating the same
USD744963S1 (en)2014-04-012015-12-08Xicato, Inc.LED module
USD765902S1 (en)2014-04-012016-09-06Xicato, Inc.Thin LED module

Citations (15)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US6355946B1 (en)*1998-12-162002-03-12Rohm Co., Ltd.Semiconductor device with reflector
US6586721B2 (en)*1998-08-282003-07-01Osram Opto Semiconductors Gmbh & Co. OhgMovement detector including a vertical resonator and receiver disposed within an open housing
US6624491B2 (en)*1998-06-302003-09-23Osram Opto Semiconductors Gmbh & Co.Diode housing
US20040041222A1 (en)*2002-09-042004-03-04Loh Ban P.Power surface mount light emitting die package
US6707069B2 (en)*2001-12-242004-03-16Samsung Electro-Mechanics Co., LtdLight emission diode package
USD491899S1 (en)*2002-05-222004-06-22Nichia CorporationLight emitting diode
US6774406B2 (en)*2001-11-262004-08-10Citizen Electronics Co., Ltd.Light emitting diode device
US20050051789A1 (en)*2003-09-092005-03-10Negley Gerald H.Solid metal block mounting substrates for semiconductor light emitting devices, and oxidizing methods for fabricating same
USD505397S1 (en)*2003-09-152005-05-24Nichia CorporationLight emitting diode
USD517026S1 (en)*2003-07-092006-03-14Nichia CorporationLight emitting diode
USD521950S1 (en)*2004-10-192006-05-30Rohm Co., Ltd.Light emitting diode
US20060193121A1 (en)*2005-02-282006-08-31Sharp Kabushiki KaishaLight-emitting diode device and method of manufacturing thereof
USD528997S1 (en)*2005-03-132006-09-26Seoul Semiconductor Co. Ltd.Light emitting diode (LED)
USD531140S1 (en)*2005-11-142006-10-31Kabushiki Kaisha ToshibaLight emitting semiconductor device
US20070030703A1 (en)*2005-08-082007-02-08Samsung Electro-Mechanics Co., Ltd.LED package having recess in heat conducting part

Patent Citations (15)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US6624491B2 (en)*1998-06-302003-09-23Osram Opto Semiconductors Gmbh & Co.Diode housing
US6586721B2 (en)*1998-08-282003-07-01Osram Opto Semiconductors Gmbh & Co. OhgMovement detector including a vertical resonator and receiver disposed within an open housing
US6355946B1 (en)*1998-12-162002-03-12Rohm Co., Ltd.Semiconductor device with reflector
US6774406B2 (en)*2001-11-262004-08-10Citizen Electronics Co., Ltd.Light emitting diode device
US6707069B2 (en)*2001-12-242004-03-16Samsung Electro-Mechanics Co., LtdLight emission diode package
USD491899S1 (en)*2002-05-222004-06-22Nichia CorporationLight emitting diode
US20040041222A1 (en)*2002-09-042004-03-04Loh Ban P.Power surface mount light emitting die package
USD517026S1 (en)*2003-07-092006-03-14Nichia CorporationLight emitting diode
US20050051789A1 (en)*2003-09-092005-03-10Negley Gerald H.Solid metal block mounting substrates for semiconductor light emitting devices, and oxidizing methods for fabricating same
USD505397S1 (en)*2003-09-152005-05-24Nichia CorporationLight emitting diode
USD521950S1 (en)*2004-10-192006-05-30Rohm Co., Ltd.Light emitting diode
US20060193121A1 (en)*2005-02-282006-08-31Sharp Kabushiki KaishaLight-emitting diode device and method of manufacturing thereof
USD528997S1 (en)*2005-03-132006-09-26Seoul Semiconductor Co. Ltd.Light emitting diode (LED)
US20070030703A1 (en)*2005-08-082007-02-08Samsung Electro-Mechanics Co., Ltd.LED package having recess in heat conducting part
USD531140S1 (en)*2005-11-142006-10-31Kabushiki Kaisha ToshibaLight emitting semiconductor device

Cited By (22)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
USD584248S1 (en)*2007-08-202009-01-06Alti-Electronics, Co., Ltd.Light emitting diode
USD584247S1 (en)*2007-09-032009-01-06Alti-Electronics, Co., Ltd.Light emitting diode
US9698319B2 (en)*2007-12-062017-07-04Seoul Semiconductor Co., Ltd.LED package with lead terminals having protrusions of differing widths and method for fabricating the same
US20140110739A1 (en)*2007-12-062014-04-24Seoul Semiconductor Co., Ltd.Led package and method for fabricating the same
USD600658S1 (en)*2008-05-132009-09-22Citizen Electronics Co., Ltd.Light-emitting diode
USD599750S1 (en)*2008-06-202009-09-08Samsung Electro-Mechanics Co., Ltd.Case for light emitting diode
USD608740S1 (en)*2008-08-292010-01-26Foxsemicon Integrated Technology, Inc.Light-emitting diode substrate
USD621798S1 (en)*2008-08-292010-08-17Foxsemicon Integrated Technology, Inc.Light-emitting diode substrate
USD598873S1 (en)*2008-11-182009-08-25Xicato, Inc.LED module
USD622677S1 (en)*2009-02-032010-08-31Everlight Electronics Co., Ltd.Light emitting diode package device
US20100264436A1 (en)*2009-04-172010-10-21Avago Technologies Ecbu Ip (Singapore) Pte. Ltd.PLCC Package With A Reflector Cup Surrounded By A Single Encapsulant
US20100264437A1 (en)*2009-04-172010-10-21Avago Technologies Ecbu Ip (Singapore) Pte.Ltd.PLCC Package With A Reflector Cup Surrounded By An Encapsulant
US8089075B2 (en)*2009-04-172012-01-03Avago Technologies Ecbu Ip (Singapore) Pte. Ltd.LFCC package with a reflector cup surrounded by a single encapsulant
US8101955B2 (en)*2009-04-172012-01-24Avago Technologies Ecbu Ip (Singapore) Pte. Ltd.PLCC package with a reflector cup surrounded by an encapsulant
USD619110S1 (en)*2009-11-202010-07-06Silitek Electronic (Guangzhou) Co., Ltd.LED package
USD624885S1 (en)*2010-01-272010-10-05Silitek Electronic (Guangzhou) Co., Ltd.LED package structure
USD691744S1 (en)2012-03-162013-10-15Xicato, Inc.Narrow beam LED module
USD674361S1 (en)*2012-03-302013-01-15Silitek Electronic (Guangzhou) Co., Ltd.LED package
USD695239S1 (en)*2012-07-122013-12-10Lextar Electronics CorporationLight emitting diode package
USD693780S1 (en)*2012-09-272013-11-19Lextar Electronics CorporationLight emitting diode package
USD744963S1 (en)2014-04-012015-12-08Xicato, Inc.LED module
USD765902S1 (en)2014-04-012016-09-06Xicato, Inc.Thin LED module

Also Published As

Publication numberPublication date
TWD117963S1 (en)2007-07-01

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