



| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR30-2006-0012564 | 2006-04-05 | ||
| KR20060012564 | 2006-04-05 |
| Publication Number | Publication Date |
|---|---|
| USD563333S1true USD563333S1 (en) | 2008-03-04 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/263,736Expired - LifetimeUSD563333S1 (en) | 2006-04-05 | 2006-07-28 | Light emitting diode (LED) |
| Country | Link |
|---|---|
| US (1) | USD563333S1 (en) |
| TW (1) | TWD117963S1 (en) |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD584247S1 (en)* | 2007-09-03 | 2009-01-06 | Alti-Electronics, Co., Ltd. | Light emitting diode |
| USD584248S1 (en)* | 2007-08-20 | 2009-01-06 | Alti-Electronics, Co., Ltd. | Light emitting diode |
| USD598873S1 (en)* | 2008-11-18 | 2009-08-25 | Xicato, Inc. | LED module |
| USD599750S1 (en)* | 2008-06-20 | 2009-09-08 | Samsung Electro-Mechanics Co., Ltd. | Case for light emitting diode |
| USD600658S1 (en)* | 2008-05-13 | 2009-09-22 | Citizen Electronics Co., Ltd. | Light-emitting diode |
| USD608740S1 (en)* | 2008-08-29 | 2010-01-26 | Foxsemicon Integrated Technology, Inc. | Light-emitting diode substrate |
| USD619110S1 (en)* | 2009-11-20 | 2010-07-06 | Silitek Electronic (Guangzhou) Co., Ltd. | LED package |
| USD621798S1 (en)* | 2008-08-29 | 2010-08-17 | Foxsemicon Integrated Technology, Inc. | Light-emitting diode substrate |
| USD622677S1 (en)* | 2009-02-03 | 2010-08-31 | Everlight Electronics Co., Ltd. | Light emitting diode package device |
| USD624885S1 (en)* | 2010-01-27 | 2010-10-05 | Silitek Electronic (Guangzhou) Co., Ltd. | LED package structure |
| US20100264436A1 (en)* | 2009-04-17 | 2010-10-21 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | PLCC Package With A Reflector Cup Surrounded By A Single Encapsulant |
| US20100264437A1 (en)* | 2009-04-17 | 2010-10-21 | Avago Technologies Ecbu Ip (Singapore) Pte.Ltd. | PLCC Package With A Reflector Cup Surrounded By An Encapsulant |
| USD674361S1 (en)* | 2012-03-30 | 2013-01-15 | Silitek Electronic (Guangzhou) Co., Ltd. | LED package |
| USD691744S1 (en) | 2012-03-16 | 2013-10-15 | Xicato, Inc. | Narrow beam LED module |
| USD693780S1 (en)* | 2012-09-27 | 2013-11-19 | Lextar Electronics Corporation | Light emitting diode package |
| USD695239S1 (en)* | 2012-07-12 | 2013-12-10 | Lextar Electronics Corporation | Light emitting diode package |
| US20140110739A1 (en)* | 2007-12-06 | 2014-04-24 | Seoul Semiconductor Co., Ltd. | Led package and method for fabricating the same |
| USD744963S1 (en) | 2014-04-01 | 2015-12-08 | Xicato, Inc. | LED module |
| USD765902S1 (en) | 2014-04-01 | 2016-09-06 | Xicato, Inc. | Thin LED module |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6355946B1 (en)* | 1998-12-16 | 2002-03-12 | Rohm Co., Ltd. | Semiconductor device with reflector |
| US6586721B2 (en)* | 1998-08-28 | 2003-07-01 | Osram Opto Semiconductors Gmbh & Co. Ohg | Movement detector including a vertical resonator and receiver disposed within an open housing |
| US6624491B2 (en)* | 1998-06-30 | 2003-09-23 | Osram Opto Semiconductors Gmbh & Co. | Diode housing |
| US20040041222A1 (en)* | 2002-09-04 | 2004-03-04 | Loh Ban P. | Power surface mount light emitting die package |
| US6707069B2 (en)* | 2001-12-24 | 2004-03-16 | Samsung Electro-Mechanics Co., Ltd | Light emission diode package |
| USD491899S1 (en)* | 2002-05-22 | 2004-06-22 | Nichia Corporation | Light emitting diode |
| US6774406B2 (en)* | 2001-11-26 | 2004-08-10 | Citizen Electronics Co., Ltd. | Light emitting diode device |
| US20050051789A1 (en)* | 2003-09-09 | 2005-03-10 | Negley Gerald H. | Solid metal block mounting substrates for semiconductor light emitting devices, and oxidizing methods for fabricating same |
| USD505397S1 (en)* | 2003-09-15 | 2005-05-24 | Nichia Corporation | Light emitting diode |
| USD517026S1 (en)* | 2003-07-09 | 2006-03-14 | Nichia Corporation | Light emitting diode |
| USD521950S1 (en)* | 2004-10-19 | 2006-05-30 | Rohm Co., Ltd. | Light emitting diode |
| US20060193121A1 (en)* | 2005-02-28 | 2006-08-31 | Sharp Kabushiki Kaisha | Light-emitting diode device and method of manufacturing thereof |
| USD528997S1 (en)* | 2005-03-13 | 2006-09-26 | Seoul Semiconductor Co. Ltd. | Light emitting diode (LED) |
| USD531140S1 (en)* | 2005-11-14 | 2006-10-31 | Kabushiki Kaisha Toshiba | Light emitting semiconductor device |
| US20070030703A1 (en)* | 2005-08-08 | 2007-02-08 | Samsung Electro-Mechanics Co., Ltd. | LED package having recess in heat conducting part |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6624491B2 (en)* | 1998-06-30 | 2003-09-23 | Osram Opto Semiconductors Gmbh & Co. | Diode housing |
| US6586721B2 (en)* | 1998-08-28 | 2003-07-01 | Osram Opto Semiconductors Gmbh & Co. Ohg | Movement detector including a vertical resonator and receiver disposed within an open housing |
| US6355946B1 (en)* | 1998-12-16 | 2002-03-12 | Rohm Co., Ltd. | Semiconductor device with reflector |
| US6774406B2 (en)* | 2001-11-26 | 2004-08-10 | Citizen Electronics Co., Ltd. | Light emitting diode device |
| US6707069B2 (en)* | 2001-12-24 | 2004-03-16 | Samsung Electro-Mechanics Co., Ltd | Light emission diode package |
| USD491899S1 (en)* | 2002-05-22 | 2004-06-22 | Nichia Corporation | Light emitting diode |
| US20040041222A1 (en)* | 2002-09-04 | 2004-03-04 | Loh Ban P. | Power surface mount light emitting die package |
| USD517026S1 (en)* | 2003-07-09 | 2006-03-14 | Nichia Corporation | Light emitting diode |
| US20050051789A1 (en)* | 2003-09-09 | 2005-03-10 | Negley Gerald H. | Solid metal block mounting substrates for semiconductor light emitting devices, and oxidizing methods for fabricating same |
| USD505397S1 (en)* | 2003-09-15 | 2005-05-24 | Nichia Corporation | Light emitting diode |
| USD521950S1 (en)* | 2004-10-19 | 2006-05-30 | Rohm Co., Ltd. | Light emitting diode |
| US20060193121A1 (en)* | 2005-02-28 | 2006-08-31 | Sharp Kabushiki Kaisha | Light-emitting diode device and method of manufacturing thereof |
| USD528997S1 (en)* | 2005-03-13 | 2006-09-26 | Seoul Semiconductor Co. Ltd. | Light emitting diode (LED) |
| US20070030703A1 (en)* | 2005-08-08 | 2007-02-08 | Samsung Electro-Mechanics Co., Ltd. | LED package having recess in heat conducting part |
| USD531140S1 (en)* | 2005-11-14 | 2006-10-31 | Kabushiki Kaisha Toshiba | Light emitting semiconductor device |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD584248S1 (en)* | 2007-08-20 | 2009-01-06 | Alti-Electronics, Co., Ltd. | Light emitting diode |
| USD584247S1 (en)* | 2007-09-03 | 2009-01-06 | Alti-Electronics, Co., Ltd. | Light emitting diode |
| US9698319B2 (en)* | 2007-12-06 | 2017-07-04 | Seoul Semiconductor Co., Ltd. | LED package with lead terminals having protrusions of differing widths and method for fabricating the same |
| US20140110739A1 (en)* | 2007-12-06 | 2014-04-24 | Seoul Semiconductor Co., Ltd. | Led package and method for fabricating the same |
| USD600658S1 (en)* | 2008-05-13 | 2009-09-22 | Citizen Electronics Co., Ltd. | Light-emitting diode |
| USD599750S1 (en)* | 2008-06-20 | 2009-09-08 | Samsung Electro-Mechanics Co., Ltd. | Case for light emitting diode |
| USD608740S1 (en)* | 2008-08-29 | 2010-01-26 | Foxsemicon Integrated Technology, Inc. | Light-emitting diode substrate |
| USD621798S1 (en)* | 2008-08-29 | 2010-08-17 | Foxsemicon Integrated Technology, Inc. | Light-emitting diode substrate |
| USD598873S1 (en)* | 2008-11-18 | 2009-08-25 | Xicato, Inc. | LED module |
| USD622677S1 (en)* | 2009-02-03 | 2010-08-31 | Everlight Electronics Co., Ltd. | Light emitting diode package device |
| US20100264436A1 (en)* | 2009-04-17 | 2010-10-21 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | PLCC Package With A Reflector Cup Surrounded By A Single Encapsulant |
| US20100264437A1 (en)* | 2009-04-17 | 2010-10-21 | Avago Technologies Ecbu Ip (Singapore) Pte.Ltd. | PLCC Package With A Reflector Cup Surrounded By An Encapsulant |
| US8089075B2 (en)* | 2009-04-17 | 2012-01-03 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | LFCC package with a reflector cup surrounded by a single encapsulant |
| US8101955B2 (en)* | 2009-04-17 | 2012-01-24 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | PLCC package with a reflector cup surrounded by an encapsulant |
| USD619110S1 (en)* | 2009-11-20 | 2010-07-06 | Silitek Electronic (Guangzhou) Co., Ltd. | LED package |
| USD624885S1 (en)* | 2010-01-27 | 2010-10-05 | Silitek Electronic (Guangzhou) Co., Ltd. | LED package structure |
| USD691744S1 (en) | 2012-03-16 | 2013-10-15 | Xicato, Inc. | Narrow beam LED module |
| USD674361S1 (en)* | 2012-03-30 | 2013-01-15 | Silitek Electronic (Guangzhou) Co., Ltd. | LED package |
| USD695239S1 (en)* | 2012-07-12 | 2013-12-10 | Lextar Electronics Corporation | Light emitting diode package |
| USD693780S1 (en)* | 2012-09-27 | 2013-11-19 | Lextar Electronics Corporation | Light emitting diode package |
| USD744963S1 (en) | 2014-04-01 | 2015-12-08 | Xicato, Inc. | LED module |
| USD765902S1 (en) | 2014-04-01 | 2016-09-06 | Xicato, Inc. | Thin LED module |
| Publication number | Publication date |
|---|---|
| TWD117963S1 (en) | 2007-07-01 |
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| USD563333S1 (en) | Light emitting diode (LED) | |
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| USD605609S1 (en) | Light emitting diode | |
| USD611012S1 (en) | Light emitting diode | |
| USD606032S1 (en) | Light emitting diode | |
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| Date | Code | Title | Description |
|---|---|---|---|
| FEPP | Fee payment procedure | Free format text:ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |