







| Application Number | Priority Date | Filing Date | Title | 
|---|---|---|---|
| US29/296,712USD581237S1 (en) | 2004-03-17 | 2007-10-26 | Polishing pad | 
| Application Number | Priority Date | Filing Date | Title | 
|---|---|---|---|
| JP2004008160 | 2004-03-17 | ||
| JP2004-008160 | 2004-03-17 | ||
| JP2004008159 | 2004-03-17 | ||
| JP2004-008159 | 2004-03-17 | 
| Application Number | Title | Priority Date | Filing Date | 
|---|---|---|---|
| US29/296,712DivisionUSD581237S1 (en) | 2004-03-17 | 2007-10-26 | Polishing pad | 
| Publication Number | Publication Date | 
|---|---|
| USD559063S1true USD559063S1 (en) | 2008-01-08 | 
| Application Number | Title | Priority Date | Filing Date | 
|---|---|---|---|
| US29/213,405Expired - LifetimeUSD559063S1 (en) | 2004-03-17 | 2004-09-17 | Polishing pad | 
| US29/296,712Expired - LifetimeUSD581237S1 (en) | 2004-03-17 | 2007-10-26 | Polishing pad | 
| Application Number | Title | Priority Date | Filing Date | 
|---|---|---|---|
| US29/296,712Expired - LifetimeUSD581237S1 (en) | 2004-03-17 | 2007-10-26 | Polishing pad | 
| Country | Link | 
|---|---|
| US (2) | USD559063S1 (en) | 
| Publication number | Priority date | Publication date | Assignee | Title | 
|---|---|---|---|---|
| USD571383S1 (en)* | 2005-07-29 | 2008-06-17 | Tokyo Electron Limited | Top panel for microwave introduction window of a plasma processing apparatus | 
| USD584591S1 (en)* | 2004-10-26 | 2009-01-13 | Jsr Corporation | Polishing pad | 
| USD678745S1 (en)* | 2011-07-07 | 2013-03-26 | Phuong Van Nguyen | Spinning insert polishing pad | 
| US9017140B2 (en) | 2010-01-13 | 2015-04-28 | Nexplanar Corporation | CMP pad with local area transparency | 
| USD738177S1 (en)* | 2012-10-31 | 2015-09-08 | Kwh Mirka Ltd | Backing pad | 
| US9156124B2 (en) | 2010-07-08 | 2015-10-13 | Nexplanar Corporation | Soft polishing pad for polishing a semiconductor substrate | 
| US9180570B2 (en) | 2008-03-14 | 2015-11-10 | Nexplanar Corporation | Grooved CMP pad | 
| USD795666S1 (en)* | 2014-06-06 | 2017-08-29 | Diamond Tool Supply, Inc. | Polishing pad | 
| US10011999B2 (en) | 2014-09-18 | 2018-07-03 | Diamond Tool Supply, Inc. | Method for finishing a surface using a grouting pan | 
| US10246885B2 (en) | 2014-09-18 | 2019-04-02 | Husqvarna Construction Products North America, Inc. | Grouting pan assembly with reinforcement ring | 
| USD854902S1 (en) | 2016-09-23 | 2019-07-30 | Husqvarna Construction Products North America, Inc. | Polishing or grinding pad | 
| US10414012B2 (en) | 2017-01-13 | 2019-09-17 | Husqvarna Construction Products North America, Inc. | Grinding pad apparatus | 
| USD873782S1 (en)* | 2016-05-17 | 2020-01-28 | Electro Scientific Industries, Inc | Component carrier plate | 
| US10667665B2 (en) | 2015-09-24 | 2020-06-02 | Husqvarna Ab | Method of using polishing or grinding pad assembly | 
| US10710214B2 (en) | 2018-01-11 | 2020-07-14 | Husqvarna Ab | Polishing or grinding pad with multilayer reinforcement | 
| USD919396S1 (en) | 2017-08-30 | 2021-05-18 | Husqvarna Ab | Polishing or grinding pad assembly with abrasive disks, reinforcement and pad | 
| USD927952S1 (en)* | 2017-08-30 | 2021-08-17 | Husqvarna Ab | Polishing or grinding pad assembly with abrasive disk, spacer, reinforcement and pad | 
| USD958626S1 (en)* | 2017-08-30 | 2022-07-26 | Husqvarna Ab | Polishing or grinding pad assembly with abrasive disks, reinforcement and pad | 
| USD1000928S1 (en)* | 2022-06-03 | 2023-10-10 | Beng Youl Cho | Polishing pad | 
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| US88649A (en)* | 1869-04-06 | Improvement in index for piling circular saws | ||
| US494471A (en)* | 1893-03-28 | Grinding or polishing wheel and the art of manufacturing same | ||
| US1092588A (en)* | 1914-01-05 | 1914-04-07 | Albert Monkiawicz | Grinding-wheel. | 
| US1569403A (en)* | 1922-06-03 | 1926-01-12 | Standard Appliance And Souveni | Fiber-needle sharpener for talking-machine records | 
| US3046708A (en)* | 1959-11-02 | 1962-07-31 | American Optical Corp | Lens surfacing technique | 
| US5007207A (en)* | 1987-12-22 | 1991-04-16 | Cornelius Phaal | Abrasive product | 
| US5131190A (en)* | 1990-02-23 | 1992-07-21 | C.I.C.E. S.A. | Lapping machine and non-constant pitch grooved bed therefor | 
| US5507740A (en)* | 1993-05-03 | 1996-04-16 | O'donnell, Jr.; Francis E. | Corneal topography enhancement device | 
| US5733178A (en)* | 1995-03-02 | 1998-03-31 | Minnesota Mining And Manfacturing Co. | Method of texturing a substrate using a structured abrasive article | 
| US5778481A (en)* | 1996-02-15 | 1998-07-14 | International Business Machines Corporation | Silicon wafer cleaning and polishing pads | 
| US5899799A (en)* | 1996-01-19 | 1999-05-04 | Micron Display Technology, Inc. | Method and system to increase delivery of slurry to the surface of large substrates during polishing operations | 
| US5921855A (en)* | 1997-05-15 | 1999-07-13 | Applied Materials, Inc. | Polishing pad having a grooved pattern for use in a chemical mechanical polishing system | 
| US6066266A (en)* | 1998-07-08 | 2000-05-23 | Lsi Logic Corporation | In-situ chemical-mechanical polishing slurry formulation for compensation of polish pad degradation | 
| US6217426B1 (en)* | 1999-04-06 | 2001-04-17 | Applied Materials, Inc. | CMP polishing pad | 
| US6248000B1 (en)* | 1998-03-24 | 2001-06-19 | Nikon Research Corporation Of America | Polishing pad thinning to optically access a semiconductor wafer surface | 
| US6267643B1 (en)* | 1999-08-03 | 2001-07-31 | Taiwan Semiconductor Manufacturing Company, Ltd | Slotted retaining ring for polishing head and method of using | 
| US6273806B1 (en)* | 1997-05-15 | 2001-08-14 | Applied Materials, Inc. | Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus | 
| US20010031610A1 (en)* | 2000-02-25 | 2001-10-18 | Budinger William D. | Polishing pad with a transparent portion | 
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| US6375550B1 (en)* | 2000-06-05 | 2002-04-23 | Lsi Logic Corporation | Method and apparatus for enhancing uniformity during polishing of a semiconductor wafer | 
| US6387312B1 (en) | 1999-08-17 | 2002-05-14 | Rodel Holdings Inc. | Molding a polishing pad having integral window | 
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| US6443810B1 (en)* | 2000-04-11 | 2002-09-03 | Taiwan Semiconductor Manufacturing Co., Ltd. | Polishing platen equipped with guard ring for chemical mechanical polishing | 
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| US6544111B1 (en)* | 1998-01-30 | 2003-04-08 | Ebara Corporation | Polishing apparatus and polishing table therefor | 
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| US20030068964A1 (en)* | 2001-10-05 | 2003-04-10 | Governor Of Akita Prefecture | Polishing apparatus | 
| US6561890B2 (en)* | 1999-12-28 | 2003-05-13 | Ace Inc. | Polishing pad | 
| US20030194962A1 (en)* | 2000-10-31 | 2003-10-16 | Weber Robert J. | Buffing tools and methods of making | 
| US20030199234A1 (en)* | 2000-06-29 | 2003-10-23 | Shyng-Tsong Chen | Grooved polishing pads and methods of use | 
| US20030207651A1 (en)* | 2002-05-06 | 2003-11-06 | Seung-Kon Kim | Polishing endpoint detecting method, device for detecting a polishing endpoint of a polishing process and chemical-mechanical polishing apparatus comprising the same | 
| US6659850B2 (en)* | 2000-03-31 | 2003-12-09 | Speedfam-Ipec Corporation | Work piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece | 
| US20040014413A1 (en)* | 2002-06-03 | 2004-01-22 | Jsr Corporation | Polishing pad and multi-layer polishing pad | 
| US6702651B2 (en)* | 2000-01-18 | 2004-03-09 | Applied Materials Inc. | Method and apparatus for conditioning a polishing pad | 
| US20040053570A1 (en)* | 2002-09-13 | 2004-03-18 | Markus Naujok | Novel finishing pad design for multidirectional use | 
| US20040058630A1 (en)* | 2001-08-16 | 2004-03-25 | Inha Park | Chemical mechanical polishing pad having holes and or grooves | 
| US20040082271A1 (en)* | 1999-01-25 | 2004-04-29 | Wiswesser Andreas Norbert | Polishing pad with window | 
| US20040102144A1 (en)* | 2001-07-25 | 2004-05-27 | Brown Nathan R. | Polishing systems for use with semiconductor substrates including differential pressure application apparatus | 
| US6749486B2 (en)* | 2000-02-24 | 2004-06-15 | Tokyo Electron Limited | Chemical-mechanical polishing device, damascene wiring forming device, and damascene wiring forming method | 
| US20040127145A1 (en)* | 2001-07-03 | 2004-07-01 | Shogo Takahashi | Perforated-transparent polishing pad | 
| US20050113011A1 (en)* | 2003-11-04 | 2005-05-26 | Jsr Corporation | Chemical mechanical polishing pad | 
| US6899611B2 (en)* | 1992-08-19 | 2005-05-31 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Polishing pad for a semiconductor device having a dissolvable substance | 
| US6951510B1 (en)* | 2004-03-12 | 2005-10-04 | Agere Systems, Inc. | Chemical mechanical polishing pad with grooves alternating between a larger groove size and a smaller groove size | 
| USD510850S1 (en)* | 2002-12-20 | 2005-10-25 | Production Chemical Mfg. Inc. | Polishing pad | 
| US6960123B2 (en)* | 2004-03-01 | 2005-11-01 | Oki Electric Industry Co., Ltd. | Cleaning sheet for probe needles | 
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| US20060063471A1 (en)* | 2004-09-22 | 2006-03-23 | Muldowney Gregory P | CMP pad having a streamlined windowpane | 
| US7029747B2 (en)* | 2002-09-17 | 2006-04-18 | Korea Polyol Co., Ltd. | Integral polishing pad and manufacturing method thereof | 
| US7070480B2 (en)* | 2001-10-11 | 2006-07-04 | Applied Materials, Inc. | Method and apparatus for polishing substrates | 
| US20060194530A1 (en)* | 2005-02-25 | 2006-08-31 | Thomson Clifford O | Polishing pad for use in polishing work pieces | 
| US20060199473A1 (en)* | 2003-04-03 | 2006-09-07 | Masao Suzuki | Polishing pad, process for producing the same and method of polishing therewith | 
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| US7235154B2 (en)* | 2004-01-08 | 2007-06-26 | Strasbaugh | Devices and methods for optical endpoint detection during semiconductor wafer polishing | 
| USD559064S1 (en) | 2004-03-17 | 2008-01-08 | Jsr Corporation | Polishing pad | 
| US7354334B1 (en)* | 2004-05-07 | 2008-04-08 | Applied Materials, Inc. | Reducing polishing pad deformation | 
| USD559648S1 (en)* | 2004-10-05 | 2008-01-15 | Jsr Corporation | Polishing pad | 
| USD559065S1 (en)* | 2004-10-05 | 2008-01-08 | Jsr Corporation | Polishing pad | 
| USD560457S1 (en)* | 2004-10-05 | 2008-01-29 | Jsr Corporation | Polishing pad | 
| USD559066S1 (en)* | 2004-10-26 | 2008-01-08 | Jsr Corporation | Polishing pad | 
| TW200709892A (en)* | 2005-08-18 | 2007-03-16 | Rohm & Haas Elect Mat | Transparent polishing pad | 
| USD533200S1 (en)* | 2006-02-01 | 2006-12-05 | 3M Innovative Properties Company | Abrasive article with holes | 
| USD541317S1 (en)* | 2006-02-01 | 2007-04-24 | 3M Innovative Properties Company | Abrasive article with holes | 
| WO2007104063A1 (en)* | 2006-03-09 | 2007-09-13 | Rimpad Tech Ltd. | Composite polishing pad | 
| JP2007268658A (en)* | 2006-03-31 | 2007-10-18 | Tmp Co Ltd | Polishing sheet and polishing method | 
| Publication number | Priority date | Publication date | Assignee | Title | 
|---|---|---|---|---|
| US88649A (en)* | 1869-04-06 | Improvement in index for piling circular saws | ||
| US494471A (en)* | 1893-03-28 | Grinding or polishing wheel and the art of manufacturing same | ||
| US1092588A (en)* | 1914-01-05 | 1914-04-07 | Albert Monkiawicz | Grinding-wheel. | 
| US1569403A (en)* | 1922-06-03 | 1926-01-12 | Standard Appliance And Souveni | Fiber-needle sharpener for talking-machine records | 
| US3046708A (en)* | 1959-11-02 | 1962-07-31 | American Optical Corp | Lens surfacing technique | 
| US5007207A (en)* | 1987-12-22 | 1991-04-16 | Cornelius Phaal | Abrasive product | 
| US5131190A (en)* | 1990-02-23 | 1992-07-21 | C.I.C.E. S.A. | Lapping machine and non-constant pitch grooved bed therefor | 
| US6899611B2 (en)* | 1992-08-19 | 2005-05-31 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Polishing pad for a semiconductor device having a dissolvable substance | 
| US5507740A (en)* | 1993-05-03 | 1996-04-16 | O'donnell, Jr.; Francis E. | Corneal topography enhancement device | 
| US5733178A (en)* | 1995-03-02 | 1998-03-31 | Minnesota Mining And Manfacturing Co. | Method of texturing a substrate using a structured abrasive article | 
| US5899799A (en)* | 1996-01-19 | 1999-05-04 | Micron Display Technology, Inc. | Method and system to increase delivery of slurry to the surface of large substrates during polishing operations | 
| US5778481A (en)* | 1996-02-15 | 1998-07-14 | International Business Machines Corporation | Silicon wafer cleaning and polishing pads | 
| US6645061B1 (en)* | 1997-05-15 | 2003-11-11 | Applied Materials, Inc. | Polishing pad having a grooved pattern for use in chemical mechanical polishing | 
| US20040072516A1 (en)* | 1997-05-15 | 2004-04-15 | Osterheld Thomas H. | Polishing pad having a grooved pattern for use in chemical mechanical polishing apparatus | 
| US5984769A (en)* | 1997-05-15 | 1999-11-16 | Applied Materials, Inc. | Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus | 
| US20030092371A1 (en)* | 1997-05-15 | 2003-05-15 | Applied Materials, Inc., A Delaware Corporation | Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus | 
| US6273806B1 (en)* | 1997-05-15 | 2001-08-14 | Applied Materials, Inc. | Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus | 
| US6824455B2 (en)* | 1997-05-15 | 2004-11-30 | Applied Materials, Inc. | Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus | 
| US5921855A (en)* | 1997-05-15 | 1999-07-13 | Applied Materials, Inc. | Polishing pad having a grooved pattern for use in a chemical mechanical polishing system | 
| US6520847B2 (en)* | 1997-05-15 | 2003-02-18 | Applied Materials, Inc. | Polishing pad having a grooved pattern for use in chemical mechanical polishing | 
| US6699115B2 (en)* | 1997-05-15 | 2004-03-02 | Applied Materials Inc. | Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus | 
| US20020137450A1 (en)* | 1997-05-15 | 2002-09-26 | Applied Materials, Inc., A Delaware Corporation | Polishing pad having a grooved pattern for use in chemical mechanical polishing apparatus | 
| US6544111B1 (en)* | 1998-01-30 | 2003-04-08 | Ebara Corporation | Polishing apparatus and polishing table therefor | 
| US6248000B1 (en)* | 1998-03-24 | 2001-06-19 | Nikon Research Corporation Of America | Polishing pad thinning to optically access a semiconductor wafer surface | 
| US6066266A (en)* | 1998-07-08 | 2000-05-23 | Lsi Logic Corporation | In-situ chemical-mechanical polishing slurry formulation for compensation of polish pad degradation | 
| US6332830B1 (en)* | 1998-08-04 | 2001-12-25 | Shin-Etsu Handotai Co., Ltd. | Polishing method and polishing device | 
| US6402594B1 (en)* | 1999-01-18 | 2002-06-11 | Shin-Etsu Handotai Co., Ltd. | Polishing method for wafer and holding plate | 
| US20040082271A1 (en)* | 1999-01-25 | 2004-04-29 | Wiswesser Andreas Norbert | Polishing pad with window | 
| US6217426B1 (en)* | 1999-04-06 | 2001-04-17 | Applied Materials, Inc. | CMP polishing pad | 
| US6267643B1 (en)* | 1999-08-03 | 2001-07-31 | Taiwan Semiconductor Manufacturing Company, Ltd | Slotted retaining ring for polishing head and method of using | 
| US6387312B1 (en) | 1999-08-17 | 2002-05-14 | Rodel Holdings Inc. | Molding a polishing pad having integral window | 
| US6561890B2 (en)* | 1999-12-28 | 2003-05-13 | Ace Inc. | Polishing pad | 
| US6702651B2 (en)* | 2000-01-18 | 2004-03-09 | Applied Materials Inc. | Method and apparatus for conditioning a polishing pad | 
| US6749486B2 (en)* | 2000-02-24 | 2004-06-15 | Tokyo Electron Limited | Chemical-mechanical polishing device, damascene wiring forming device, and damascene wiring forming method | 
| US20010031610A1 (en)* | 2000-02-25 | 2001-10-18 | Budinger William D. | Polishing pad with a transparent portion | 
| US6517417B2 (en)* | 2000-02-25 | 2003-02-11 | Rodel Holdings, Inc. | Polishing pad with a transparent portion | 
| US20040259476A1 (en)* | 2000-03-31 | 2004-12-23 | Korovin Nikolay N. | Work piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece | 
| US6659850B2 (en)* | 2000-03-31 | 2003-12-09 | Speedfam-Ipec Corporation | Work piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece | 
| US6443810B1 (en)* | 2000-04-11 | 2002-09-03 | Taiwan Semiconductor Manufacturing Co., Ltd. | Polishing platen equipped with guard ring for chemical mechanical polishing | 
| US6375550B1 (en)* | 2000-06-05 | 2002-04-23 | Lsi Logic Corporation | Method and apparatus for enhancing uniformity during polishing of a semiconductor wafer | 
| US20030199234A1 (en)* | 2000-06-29 | 2003-10-23 | Shyng-Tsong Chen | Grooved polishing pads and methods of use | 
| US6685548B2 (en)* | 2000-06-29 | 2004-02-03 | International Business Machines Corporation | Grooved polishing pads and methods of use | 
| US20030194962A1 (en)* | 2000-10-31 | 2003-10-16 | Weber Robert J. | Buffing tools and methods of making | 
| US20020173231A1 (en) | 2001-04-25 | 2002-11-21 | Jsr Corporation | Polishing pad for semiconductor wafer and laminated body for polishing of semiconductor wafer equipped with the same as well as method for polishing of semiconductor wafer | 
| US20040127145A1 (en)* | 2001-07-03 | 2004-07-01 | Shogo Takahashi | Perforated-transparent polishing pad | 
| US6824447B2 (en)* | 2001-07-03 | 2004-11-30 | Rodel Nitta Corporation | Perforated-transparent polishing pad | 
| US20040102144A1 (en)* | 2001-07-25 | 2004-05-27 | Brown Nathan R. | Polishing systems for use with semiconductor substrates including differential pressure application apparatus | 
| US7059937B2 (en)* | 2001-07-25 | 2006-06-13 | Micron Technology, Inc. | Systems including differential pressure application apparatus | 
| US6899607B2 (en)* | 2001-07-25 | 2005-05-31 | Micron Technology, Inc. | Polishing systems for use with semiconductor substrates including differential pressure application apparatus | 
| US6544373B2 (en)* | 2001-07-26 | 2003-04-08 | United Microelectronics Corp. | Polishing pad for a chemical mechanical polishing process | 
| US20040058630A1 (en)* | 2001-08-16 | 2004-03-25 | Inha Park | Chemical mechanical polishing pad having holes and or grooves | 
| US6875096B2 (en)* | 2001-08-16 | 2005-04-05 | Skc Co., Ltd. | Chemical mechanical polishing pad having holes and or grooves | 
| US20030068964A1 (en)* | 2001-10-05 | 2003-04-10 | Governor Of Akita Prefecture | Polishing apparatus | 
| US7070480B2 (en)* | 2001-10-11 | 2006-07-04 | Applied Materials, Inc. | Method and apparatus for polishing substrates | 
| US20030207651A1 (en)* | 2002-05-06 | 2003-11-06 | Seung-Kon Kim | Polishing endpoint detecting method, device for detecting a polishing endpoint of a polishing process and chemical-mechanical polishing apparatus comprising the same | 
| US20040014413A1 (en)* | 2002-06-03 | 2004-01-22 | Jsr Corporation | Polishing pad and multi-layer polishing pad | 
| US20040053570A1 (en)* | 2002-09-13 | 2004-03-18 | Markus Naujok | Novel finishing pad design for multidirectional use | 
| US7029747B2 (en)* | 2002-09-17 | 2006-04-18 | Korea Polyol Co., Ltd. | Integral polishing pad and manufacturing method thereof | 
| USD510850S1 (en)* | 2002-12-20 | 2005-10-25 | Production Chemical Mfg. Inc. | Polishing pad | 
| US20060199473A1 (en)* | 2003-04-03 | 2006-09-07 | Masao Suzuki | Polishing pad, process for producing the same and method of polishing therewith | 
| US20050113011A1 (en)* | 2003-11-04 | 2005-05-26 | Jsr Corporation | Chemical mechanical polishing pad | 
| US6960123B2 (en)* | 2004-03-01 | 2005-11-01 | Oki Electric Industry Co., Ltd. | Cleaning sheet for probe needles | 
| US6951510B1 (en)* | 2004-03-12 | 2005-10-04 | Agere Systems, Inc. | Chemical mechanical polishing pad with grooves alternating between a larger groove size and a smaller groove size | 
| US20050245171A1 (en)* | 2004-04-28 | 2005-11-03 | Jsr Corporation | Chemical mechanical polishing pad, manufacturing process thereof and chemical mechanical polishing method for semiconductor wafers | 
| US20060063471A1 (en)* | 2004-09-22 | 2006-03-23 | Muldowney Gregory P | CMP pad having a streamlined windowpane | 
| US20060194530A1 (en)* | 2005-02-25 | 2006-08-31 | Thomson Clifford O | Polishing pad for use in polishing work pieces | 
| US7112119B1 (en)* | 2005-08-26 | 2006-09-26 | Applied Materials, Inc. | Sealed polishing pad methods | 
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|---|---|---|---|---|
| USD584591S1 (en)* | 2004-10-26 | 2009-01-13 | Jsr Corporation | Polishing pad | 
| USD592030S1 (en)* | 2004-10-26 | 2009-05-12 | Jsr Corporation | Polishing pad | 
| USD592029S1 (en)* | 2004-10-26 | 2009-05-12 | Jsr Corporation | Polishing pad | 
| USD600989S1 (en)* | 2004-10-26 | 2009-09-29 | Jsr Corporation | Polishing pad | 
| USD571383S1 (en)* | 2005-07-29 | 2008-06-17 | Tokyo Electron Limited | Top panel for microwave introduction window of a plasma processing apparatus | 
| US9180570B2 (en) | 2008-03-14 | 2015-11-10 | Nexplanar Corporation | Grooved CMP pad | 
| US9017140B2 (en) | 2010-01-13 | 2015-04-28 | Nexplanar Corporation | CMP pad with local area transparency | 
| US9156124B2 (en) | 2010-07-08 | 2015-10-13 | Nexplanar Corporation | Soft polishing pad for polishing a semiconductor substrate | 
| USD678745S1 (en)* | 2011-07-07 | 2013-03-26 | Phuong Van Nguyen | Spinning insert polishing pad | 
| USD738177S1 (en)* | 2012-10-31 | 2015-09-08 | Kwh Mirka Ltd | Backing pad | 
| USD740637S1 (en)* | 2012-10-31 | 2015-10-13 | Kwh Mirka Ltd | Backing pad | 
| USD873108S1 (en)* | 2014-06-06 | 2020-01-21 | Husqvarna Ab | Polishing pad | 
| USD795666S1 (en)* | 2014-06-06 | 2017-08-29 | Diamond Tool Supply, Inc. | Polishing pad | 
| USD837015S1 (en)* | 2014-06-06 | 2019-01-01 | Husqvarna Construction Products North America, Inc. | Polishing pad | 
| US10011999B2 (en) | 2014-09-18 | 2018-07-03 | Diamond Tool Supply, Inc. | Method for finishing a surface using a grouting pan | 
| US10246885B2 (en) | 2014-09-18 | 2019-04-02 | Husqvarna Construction Products North America, Inc. | Grouting pan assembly with reinforcement ring | 
| US10667665B2 (en) | 2015-09-24 | 2020-06-02 | Husqvarna Ab | Method of using polishing or grinding pad assembly | 
| US11084140B2 (en) | 2015-09-24 | 2021-08-10 | Husqvarna Ab | Method of using polishing or grinding pad assembly | 
| USD873782S1 (en)* | 2016-05-17 | 2020-01-28 | Electro Scientific Industries, Inc | Component carrier plate | 
| USD854902S1 (en) | 2016-09-23 | 2019-07-30 | Husqvarna Construction Products North America, Inc. | Polishing or grinding pad | 
| USD933440S1 (en)* | 2016-09-23 | 2021-10-19 | Husqvarna Ab | Polishing or grinding pad | 
| US10414012B2 (en) | 2017-01-13 | 2019-09-17 | Husqvarna Construction Products North America, Inc. | Grinding pad apparatus | 
| USD919396S1 (en) | 2017-08-30 | 2021-05-18 | Husqvarna Ab | Polishing or grinding pad assembly with abrasive disks, reinforcement and pad | 
| USD927952S1 (en)* | 2017-08-30 | 2021-08-17 | Husqvarna Ab | Polishing or grinding pad assembly with abrasive disk, spacer, reinforcement and pad | 
| USD958626S1 (en)* | 2017-08-30 | 2022-07-26 | Husqvarna Ab | Polishing or grinding pad assembly with abrasive disks, reinforcement and pad | 
| US10710214B2 (en) | 2018-01-11 | 2020-07-14 | Husqvarna Ab | Polishing or grinding pad with multilayer reinforcement | 
| USD1000928S1 (en)* | 2022-06-03 | 2023-10-10 | Beng Youl Cho | Polishing pad | 
| Publication number | Publication date | 
|---|---|
| USD581237S1 (en) | 2008-11-25 | 
| Publication | Publication Date | Title | 
|---|---|---|
| USD581237S1 (en) | Polishing pad | |
| USD576855S1 (en) | Polishing pad | |
| USD600989S1 (en) | Polishing pad | |
| USD503697S1 (en) | Handset | |
| USD554815S1 (en) | Cleaning implement | |
| USD551503S1 (en) | Cup | |
| USD522618S1 (en) | Ball valve | |
| USD554637S1 (en) | Hand-held computer | |
| USD490835S1 (en) | Screen for projection | |
| USD537058S1 (en) | Handset | |
| USD522827S1 (en) | Angle grinder | |
| USD523308S1 (en) | Angle grinder | |
| USD517649S1 (en) | Faucet | |
| USD525015S1 (en) | Hat | |
| USD561758S1 (en) | Hand-held computer | |
| USD518566S1 (en) | Floor register | |
| USD510414S1 (en) | Handle | |
| USD526868S1 (en) | Sander | |
| USD521397S1 (en) | Euchre scoring block | |
| USD559065S1 (en) | Polishing pad | |
| USD482572S1 (en) | Mug | |
| USD559648S1 (en) | Polishing pad | |
| USD513035S1 (en) | Calculator | |
| USD560457S1 (en) | Polishing pad | |
| USD524004S1 (en) | Iron |