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USD559063S1 - Polishing pad - Google Patents

Polishing pad
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Publication number
USD559063S1
USD559063S1US29/213,405US21340504FUSD559063SUS D559063 S1USD559063 S1US D559063S1US 21340504 FUS21340504 FUS 21340504FUS D559063 SUSD559063 SUS D559063S
Authority
US
United States
Prior art keywords
polishing pad
view
sectional
cross
taken
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/213,405
Inventor
Takahiro Okamoto
Hiroshi Shiho
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JSR Corp
Original Assignee
JSR Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JSR CorpfiledCriticalJSR Corp
Assigned to JSR CORPORATIONreassignmentJSR CORPORATIONASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).Assignors: OKAMOTO, TAKAHIRO, SHIHO, HIROSHI
Priority to US29/296,712priorityCriticalpatent/USD581237S1/en
Application grantedgrantedCritical
Publication of USD559063S1publicationCriticalpatent/USD559063S1/en
Anticipated expirationlegal-statusCritical
Expired - Lifetimelegal-statusCriticalCurrent

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FIG. 1 is a top plan view of the polishing pad;
FIG. 2 is a bottom plan view thereof;
FIG. 3 is a front elevational view thereof, the left side elevational view, the right side elevational view, and the rear elevational view being a mirror image of the front view shown;
FIG. 4 is an enlarged, partial view thereof taken atcoordinates44 inFIG. 1;
FIG. 5 is a greatly enlarged, partial view thereof taken atcoordinates55 inFIG. 1;
FIG. 6 is a cross-sectional view thereof taken alongline66 inFIG. 5;
FIG. 7 is a further enlargement of the cross-sectional view ofpart7 shown inFIG. 6;
FIG. 8 is a greatly enlarged, partial view taken atcoordinates85 inFIG. 1;
FIG. 9 is a cross-sectional view taken alongline99 inFIG. 8;
FIG. 10 is a further enlargement of the cross-sectional view ofpart10 ofFIG. 9;
FIG. 11 is a further enlargement of the cross-sectional view ofpart11 inFIG. 10; and,
FIG. 12 is a further enlargement of the cross-sectional view ofpart12 inFIG. 11.

Claims (1)

    CLAIM
  1. The ornamental design for a polishing pad, as shown and described.
US29/213,4052004-03-172004-09-17Polishing padExpired - LifetimeUSD559063S1 (en)

Priority Applications (1)

Application NumberPriority DateFiling DateTitle
US29/296,712USD581237S1 (en)2004-03-172007-10-26Polishing pad

Applications Claiming Priority (4)

Application NumberPriority DateFiling DateTitle
JP20040081602004-03-17
JP2004-0081602004-03-17
JP20040081592004-03-17
JP2004-0081592004-03-17

Related Child Applications (1)

Application NumberTitlePriority DateFiling Date
US29/296,712DivisionUSD581237S1 (en)2004-03-172007-10-26Polishing pad

Publications (1)

Publication NumberPublication Date
USD559063S1true USD559063S1 (en)2008-01-08

Family

ID=38893600

Family Applications (2)

Application NumberTitlePriority DateFiling Date
US29/213,405Expired - LifetimeUSD559063S1 (en)2004-03-172004-09-17Polishing pad
US29/296,712Expired - LifetimeUSD581237S1 (en)2004-03-172007-10-26Polishing pad

Family Applications After (1)

Application NumberTitlePriority DateFiling Date
US29/296,712Expired - LifetimeUSD581237S1 (en)2004-03-172007-10-26Polishing pad

Country Status (1)

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US (2)USD559063S1 (en)

Cited By (19)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
USD571383S1 (en)*2005-07-292008-06-17Tokyo Electron LimitedTop panel for microwave introduction window of a plasma processing apparatus
USD584591S1 (en)*2004-10-262009-01-13Jsr CorporationPolishing pad
USD678745S1 (en)*2011-07-072013-03-26Phuong Van NguyenSpinning insert polishing pad
US9017140B2 (en)2010-01-132015-04-28Nexplanar CorporationCMP pad with local area transparency
USD738177S1 (en)*2012-10-312015-09-08Kwh Mirka LtdBacking pad
US9156124B2 (en)2010-07-082015-10-13Nexplanar CorporationSoft polishing pad for polishing a semiconductor substrate
US9180570B2 (en)2008-03-142015-11-10Nexplanar CorporationGrooved CMP pad
USD795666S1 (en)*2014-06-062017-08-29Diamond Tool Supply, Inc.Polishing pad
US10011999B2 (en)2014-09-182018-07-03Diamond Tool Supply, Inc.Method for finishing a surface using a grouting pan
US10246885B2 (en)2014-09-182019-04-02Husqvarna Construction Products North America, Inc.Grouting pan assembly with reinforcement ring
USD854902S1 (en)2016-09-232019-07-30Husqvarna Construction Products North America, Inc.Polishing or grinding pad
US10414012B2 (en)2017-01-132019-09-17Husqvarna Construction Products North America, Inc.Grinding pad apparatus
USD873782S1 (en)*2016-05-172020-01-28Electro Scientific Industries, IncComponent carrier plate
US10667665B2 (en)2015-09-242020-06-02Husqvarna AbMethod of using polishing or grinding pad assembly
US10710214B2 (en)2018-01-112020-07-14Husqvarna AbPolishing or grinding pad with multilayer reinforcement
USD919396S1 (en)2017-08-302021-05-18Husqvarna AbPolishing or grinding pad assembly with abrasive disks, reinforcement and pad
USD927952S1 (en)*2017-08-302021-08-17Husqvarna AbPolishing or grinding pad assembly with abrasive disk, spacer, reinforcement and pad
USD958626S1 (en)*2017-08-302022-07-26Husqvarna AbPolishing or grinding pad assembly with abrasive disks, reinforcement and pad
USD1000928S1 (en)*2022-06-032023-10-10Beng Youl ChoPolishing pad

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US6544373B2 (en)*2001-07-262003-04-08United Microelectronics Corp.Polishing pad for a chemical mechanical polishing process
US20030068964A1 (en)*2001-10-052003-04-10Governor Of Akita PrefecturePolishing apparatus
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US20030194962A1 (en)*2000-10-312003-10-16Weber Robert J.Buffing tools and methods of making
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US6659850B2 (en)*2000-03-312003-12-09Speedfam-Ipec CorporationWork piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece
US20040014413A1 (en)*2002-06-032004-01-22Jsr CorporationPolishing pad and multi-layer polishing pad
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USD510850S1 (en)*2002-12-202005-10-25Production Chemical Mfg. Inc.Polishing pad
US6960123B2 (en)*2004-03-012005-11-01Oki Electric Industry Co., Ltd.Cleaning sheet for probe needles
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US7029747B2 (en)*2002-09-172006-04-18Korea Polyol Co., Ltd.Integral polishing pad and manufacturing method thereof
US7070480B2 (en)*2001-10-112006-07-04Applied Materials, Inc.Method and apparatus for polishing substrates
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US7112119B1 (en)*2005-08-262006-09-26Applied Materials, Inc.Sealed polishing pad methods

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US5893796A (en)*1995-03-281999-04-13Applied Materials, Inc.Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus
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USD559064S1 (en)2004-03-172008-01-08Jsr CorporationPolishing pad
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USD559648S1 (en)*2004-10-052008-01-15Jsr CorporationPolishing pad
USD559065S1 (en)*2004-10-052008-01-08Jsr CorporationPolishing pad
USD560457S1 (en)*2004-10-052008-01-29Jsr CorporationPolishing pad
USD559066S1 (en)*2004-10-262008-01-08Jsr CorporationPolishing pad
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USD533200S1 (en)*2006-02-012006-12-053M Innovative Properties CompanyAbrasive article with holes
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US494471A (en)*1893-03-28Grinding or polishing wheel and the art of manufacturing same
US1092588A (en)*1914-01-051914-04-07Albert MonkiawiczGrinding-wheel.
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US20040014413A1 (en)*2002-06-032004-01-22Jsr CorporationPolishing pad and multi-layer polishing pad
US20040053570A1 (en)*2002-09-132004-03-18Markus NaujokNovel finishing pad design for multidirectional use
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USD510850S1 (en)*2002-12-202005-10-25Production Chemical Mfg. Inc.Polishing pad
US20060199473A1 (en)*2003-04-032006-09-07Masao SuzukiPolishing pad, process for producing the same and method of polishing therewith
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US7112119B1 (en)*2005-08-262006-09-26Applied Materials, Inc.Sealed polishing pad methods

Cited By (27)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
USD584591S1 (en)*2004-10-262009-01-13Jsr CorporationPolishing pad
USD592030S1 (en)*2004-10-262009-05-12Jsr CorporationPolishing pad
USD592029S1 (en)*2004-10-262009-05-12Jsr CorporationPolishing pad
USD600989S1 (en)*2004-10-262009-09-29Jsr CorporationPolishing pad
USD571383S1 (en)*2005-07-292008-06-17Tokyo Electron LimitedTop panel for microwave introduction window of a plasma processing apparatus
US9180570B2 (en)2008-03-142015-11-10Nexplanar CorporationGrooved CMP pad
US9017140B2 (en)2010-01-132015-04-28Nexplanar CorporationCMP pad with local area transparency
US9156124B2 (en)2010-07-082015-10-13Nexplanar CorporationSoft polishing pad for polishing a semiconductor substrate
USD678745S1 (en)*2011-07-072013-03-26Phuong Van NguyenSpinning insert polishing pad
USD738177S1 (en)*2012-10-312015-09-08Kwh Mirka LtdBacking pad
USD740637S1 (en)*2012-10-312015-10-13Kwh Mirka LtdBacking pad
USD873108S1 (en)*2014-06-062020-01-21Husqvarna AbPolishing pad
USD795666S1 (en)*2014-06-062017-08-29Diamond Tool Supply, Inc.Polishing pad
USD837015S1 (en)*2014-06-062019-01-01Husqvarna Construction Products North America, Inc.Polishing pad
US10011999B2 (en)2014-09-182018-07-03Diamond Tool Supply, Inc.Method for finishing a surface using a grouting pan
US10246885B2 (en)2014-09-182019-04-02Husqvarna Construction Products North America, Inc.Grouting pan assembly with reinforcement ring
US10667665B2 (en)2015-09-242020-06-02Husqvarna AbMethod of using polishing or grinding pad assembly
US11084140B2 (en)2015-09-242021-08-10Husqvarna AbMethod of using polishing or grinding pad assembly
USD873782S1 (en)*2016-05-172020-01-28Electro Scientific Industries, IncComponent carrier plate
USD854902S1 (en)2016-09-232019-07-30Husqvarna Construction Products North America, Inc.Polishing or grinding pad
USD933440S1 (en)*2016-09-232021-10-19Husqvarna AbPolishing or grinding pad
US10414012B2 (en)2017-01-132019-09-17Husqvarna Construction Products North America, Inc.Grinding pad apparatus
USD919396S1 (en)2017-08-302021-05-18Husqvarna AbPolishing or grinding pad assembly with abrasive disks, reinforcement and pad
USD927952S1 (en)*2017-08-302021-08-17Husqvarna AbPolishing or grinding pad assembly with abrasive disk, spacer, reinforcement and pad
USD958626S1 (en)*2017-08-302022-07-26Husqvarna AbPolishing or grinding pad assembly with abrasive disks, reinforcement and pad
US10710214B2 (en)2018-01-112020-07-14Husqvarna AbPolishing or grinding pad with multilayer reinforcement
USD1000928S1 (en)*2022-06-032023-10-10Beng Youl ChoPolishing pad

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Publication numberPublication date
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