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USD544452S1 - Supporting plate - Google Patents

Supporting plateDownload PDF

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Publication number
USD544452S1
USD544452S1US29/255,496US25549606FUSD544452SUS D544452 S1USD544452 S1US D544452S1US 25549606 FUS25549606 FUS 25549606FUS D544452 SUSD544452 SUS D544452S
Authority
US
United States
Prior art keywords
supporting plate
elevational view
ornamental design
view
supporting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/255,496
Inventor
Akihiko Nakamura
Atsushi Miyanari
Yoshihiro Inao
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Ohka Kogyo Co Ltd
Bissell Inc
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co LtdfiledCriticalTokyo Ohka Kogyo Co Ltd
Assigned to TOKYO OHKA KOGYO CO., LTD.reassignmentTOKYO OHKA KOGYO CO., LTD.ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).Assignors: INAO, YOSHIHIRO, MIYANARI, ATSUSHI, NAKAMURA, AKIHIKO
Application grantedgrantedCritical
Publication of USD544452S1publicationCriticalpatent/USD544452S1/en
Assigned to BISSEL INC.reassignmentBISSEL INC.ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).Assignors: BISSEL HOMECARE, INC.
Assigned to BISSELL INC.reassignmentBISSELL INC.CORRECTIVE ASSIGNMENT TO CORRECT THE SPELLING OF THE CONVEYING PARTY NAME PREVIOUSLY RECORDED AT REEL: 051491 FRAME: 0052. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.Assignors: BISSELL HOMECARE, INC.
Anticipated expirationlegal-statusCritical
Expired - Lifetimelegal-statusCriticalCurrent

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Description

FIG. 1 is a top plan view of our new, original and ornamental design for a supporting plate;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a bottom plan view thereof;
FIG. 4 is a right side elevational view thereof; and,
FIG. 5 is a left side elevational view thereof.
A rear elevational view of is the same as the front elevational view ofFIG. 2.

Claims (1)

    CLAIM
  1. The ornamental design for a supporting plate, as shown.
US29/255,4962005-09-082006-03-08Supporting plateExpired - LifetimeUSD544452S1 (en)

Applications Claiming Priority (2)

Application NumberPriority DateFiling DateTitle
JP2005-0260082005-09-08
JP20050260082005-09-08

Publications (1)

Publication NumberPublication Date
USD544452S1true USD544452S1 (en)2007-06-12

Family

ID=38120961

Family Applications (1)

Application NumberTitlePriority DateFiling Date
US29/255,496Expired - LifetimeUSD544452S1 (en)2005-09-082006-03-08Supporting plate

Country Status (2)

CountryLink
US (1)USD544452S1 (en)
TW (1)TWD115746S1 (en)

Cited By (33)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US20100032310A1 (en)*2006-08-162010-02-11Novellus Systems, Inc.Method and apparatus for electroplating
US20100044236A1 (en)*2000-03-272010-02-25Novellus Systems, Inc.Method and apparatus for electroplating
USD648289S1 (en)*2010-10-212011-11-08Novellus Systems, Inc.Electroplating flow shaping plate having offset spiral hole pattern
US8540857B1 (en)2008-12-192013-09-24Novellus Systems, Inc.Plating method and apparatus with multiple internally irrigated chambers
US8623193B1 (en)2004-06-162014-01-07Novellus Systems, Inc.Method of electroplating using a high resistance ionic current source
USD703162S1 (en)*2012-10-172014-04-22Sumitomo Electric Industries, Ltd.Wafer holder for stepper
US8795480B2 (en)2010-07-022014-08-05Novellus Systems, Inc.Control of electrolyte hydrodynamics for efficient mass transfer during electroplating
USD716742S1 (en)*2013-09-132014-11-04Asm Ip Holding B.V.Substrate supporter for semiconductor deposition apparatus
USD720313S1 (en)*2014-06-162014-12-30Emcore Solar Power, Inc.Semiconductor wafer with dicing positions for solar cell fabrication
USD724553S1 (en)*2013-09-132015-03-17Asm Ip Holding B.V.Substrate supporter for semiconductor deposition apparatus
USD748593S1 (en)*2014-03-052016-02-02Hzo, Inc.Boat for use in a material deposition apparatus
USD760180S1 (en)*2014-02-212016-06-28Hzo, Inc.Hexcell channel arrangement for use in a boat for a deposition apparatus
US9449808B2 (en)2013-05-292016-09-20Novellus Systems, Inc.Apparatus for advanced packaging applications
US9523155B2 (en)2012-12-122016-12-20Novellus Systems, Inc.Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating
USD778247S1 (en)*2015-04-162017-02-07Veeco Instruments Inc.Wafer carrier with a multi-pocket configuration
US9624592B2 (en)2010-07-022017-04-18Novellus Systems, Inc.Cross flow manifold for electroplating apparatus
USD784937S1 (en)2014-11-132017-04-25Tokyo Electron LimitedDummy wafer
USD785576S1 (en)*2014-11-132017-05-02Tokyo Electron LimitedDummy wafer
USD786810S1 (en)2014-11-132017-05-16Tokyo Electron LimitedDummy wafer
US9670588B2 (en)2013-05-012017-06-06Lam Research CorporationAnisotropic high resistance ionic current source (AHRICS)
USD793971S1 (en)2015-03-272017-08-08Veeco Instruments Inc.Wafer carrier with a 14-pocket configuration
USD793972S1 (en)2015-03-272017-08-08Veeco Instruments Inc.Wafer carrier with a 31-pocket configuration
US9816194B2 (en)2015-03-192017-11-14Lam Research CorporationControl of electrolyte flow dynamics for uniform electroplating
USD809804S1 (en)*2014-12-172018-02-13Ngk Insulators, Ltd.Composite substrate for acoustic wave device
US10014170B2 (en)2015-05-142018-07-03Lam Research CorporationApparatus and method for electrodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivity
US10094034B2 (en)2015-08-282018-10-09Lam Research CorporationEdge flow element for electroplating apparatus
US10233556B2 (en)2010-07-022019-03-19Lam Research CorporationDynamic modulation of cross flow manifold during electroplating
USD849422S1 (en)2014-12-172019-05-28Ngk Insulators, Ltd.Composite substrate for acoustic wave device
US10364505B2 (en)2016-05-242019-07-30Lam Research CorporationDynamic modulation of cross flow manifold during elecroplating
USD873782S1 (en)*2016-05-172020-01-28Electro Scientific Industries, IncComponent carrier plate
US10781527B2 (en)2017-09-182020-09-22Lam Research CorporationMethods and apparatus for controlling delivery of cross flowing and impinging electrolyte during electroplating
US11001934B2 (en)2017-08-212021-05-11Lam Research CorporationMethods and apparatus for flow isolation and focusing during electroplating
USD1054388S1 (en)*2021-10-152024-12-17Shin-Etsu Chemical Co., Ltd.Carrier substrate for handling

Citations (14)

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Publication numberPriority datePublication dateAssigneeTitle
US3461537A (en)*1965-11-231969-08-19Telefunken PatentSeparation of individual wafers of a semiconductor disc
US5623214A (en)*1994-10-141997-04-22Hughes Aircraft CompanyMultiport membrane probe for full-wafer testing
US5726580A (en)*1990-08-291998-03-10Micron Technology, Inc.Universal wafer carrier for wafer level die burn-in
US20020121915A1 (en)*2001-03-052002-09-05Agere Systems Guardian Corp.Automated pattern clustering detection for wafer probe maps
US6448805B1 (en)*2001-02-122002-09-10Novalux, Inc.Method and apparatus for wafer-level testing of semiconductor lasers
US6469537B1 (en)*1997-02-242002-10-22Micron Technology, Inc.System for testing semiconductor wafers having interconnect with pressure sensing mechanism
US6483043B1 (en)*2000-05-192002-11-19Eaglestone Partners I, LlcChip assembly with integrated power distribution between a wafer interposer and an integrated circuit chip
US20030029570A1 (en)*2000-10-162003-02-13Keisuke KawamuraWafer holder, wafer support member, wafer holding device, and heat treating furnance
US6541989B1 (en)*2000-09-292003-04-01Motorola, Inc.Testing device for semiconductor components and a method of using the device
US6710611B2 (en)*2002-04-192004-03-23Ceramic Component Technologies, Inc.Test plate for ceramic surface mount devices and other electronic components
US20040124413A1 (en)*2002-12-262004-07-01Kazuhisa AraiWafer support plate
US20040259332A1 (en)*2002-04-112004-12-23Masateru FukuokaMethod for manufacturing semiconductor chip
US20060186096A1 (en)*2002-05-172006-08-24Gsi Lumonics CorporationHigh speed, laser-based marking method and system for producing machine readable marks on workpieces and semiconductor devices with reduced subsurface damage produced thereby
US7115984B2 (en)*2002-06-182006-10-03Micron Technology, Inc.Semiconductor devices including peripherally located bond pads, intermediates thereof, assemblies, and packages including the semiconductor devices, and support elements for the semiconductor devices

Patent Citations (15)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US3461537A (en)*1965-11-231969-08-19Telefunken PatentSeparation of individual wafers of a semiconductor disc
US5726580A (en)*1990-08-291998-03-10Micron Technology, Inc.Universal wafer carrier for wafer level die burn-in
US5623214A (en)*1994-10-141997-04-22Hughes Aircraft CompanyMultiport membrane probe for full-wafer testing
US6469537B1 (en)*1997-02-242002-10-22Micron Technology, Inc.System for testing semiconductor wafers having interconnect with pressure sensing mechanism
US6483043B1 (en)*2000-05-192002-11-19Eaglestone Partners I, LlcChip assembly with integrated power distribution between a wafer interposer and an integrated circuit chip
US6541989B1 (en)*2000-09-292003-04-01Motorola, Inc.Testing device for semiconductor components and a method of using the device
US20030029570A1 (en)*2000-10-162003-02-13Keisuke KawamuraWafer holder, wafer support member, wafer holding device, and heat treating furnance
US6448805B1 (en)*2001-02-122002-09-10Novalux, Inc.Method and apparatus for wafer-level testing of semiconductor lasers
US20020121915A1 (en)*2001-03-052002-09-05Agere Systems Guardian Corp.Automated pattern clustering detection for wafer probe maps
US20040259332A1 (en)*2002-04-112004-12-23Masateru FukuokaMethod for manufacturing semiconductor chip
US6710611B2 (en)*2002-04-192004-03-23Ceramic Component Technologies, Inc.Test plate for ceramic surface mount devices and other electronic components
US20060186096A1 (en)*2002-05-172006-08-24Gsi Lumonics CorporationHigh speed, laser-based marking method and system for producing machine readable marks on workpieces and semiconductor devices with reduced subsurface damage produced thereby
US7115984B2 (en)*2002-06-182006-10-03Micron Technology, Inc.Semiconductor devices including peripherally located bond pads, intermediates thereof, assemblies, and packages including the semiconductor devices, and support elements for the semiconductor devices
US20040124413A1 (en)*2002-12-262004-07-01Kazuhisa AraiWafer support plate
US6927416B2 (en)*2002-12-262005-08-09Disco CorporationWafer support plate

Cited By (49)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US8475644B2 (en)2000-03-272013-07-02Novellus Systems, Inc.Method and apparatus for electroplating
US20100044236A1 (en)*2000-03-272010-02-25Novellus Systems, Inc.Method and apparatus for electroplating
US8623193B1 (en)2004-06-162014-01-07Novellus Systems, Inc.Method of electroplating using a high resistance ionic current source
US8308931B2 (en)2006-08-162012-11-13Novellus Systems, Inc.Method and apparatus for electroplating
US20100032310A1 (en)*2006-08-162010-02-11Novellus Systems, Inc.Method and apparatus for electroplating
US8475636B2 (en)2008-11-072013-07-02Novellus Systems, Inc.Method and apparatus for electroplating
US9309604B2 (en)2008-11-072016-04-12Novellus Systems, Inc.Method and apparatus for electroplating
US20100116672A1 (en)*2008-11-072010-05-13Novellus Systems, Inc.Method and apparatus for electroplating
US8540857B1 (en)2008-12-192013-09-24Novellus Systems, Inc.Plating method and apparatus with multiple internally irrigated chambers
US8795480B2 (en)2010-07-022014-08-05Novellus Systems, Inc.Control of electrolyte hydrodynamics for efficient mass transfer during electroplating
US9394620B2 (en)2010-07-022016-07-19Novellus Systems, Inc.Control of electrolyte hydrodynamics for efficient mass transfer during electroplating
US10190230B2 (en)2010-07-022019-01-29Novellus Systems, Inc.Cross flow manifold for electroplating apparatus
US10233556B2 (en)2010-07-022019-03-19Lam Research CorporationDynamic modulation of cross flow manifold during electroplating
US9624592B2 (en)2010-07-022017-04-18Novellus Systems, Inc.Cross flow manifold for electroplating apparatus
US9464361B2 (en)2010-07-022016-10-11Novellus Systems, Inc.Control of electrolyte hydrodynamics for efficient mass transfer during electroplating
USD648289S1 (en)*2010-10-212011-11-08Novellus Systems, Inc.Electroplating flow shaping plate having offset spiral hole pattern
USD703162S1 (en)*2012-10-172014-04-22Sumitomo Electric Industries, Ltd.Wafer holder for stepper
US10662545B2 (en)2012-12-122020-05-26Novellus Systems, Inc.Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating
US9523155B2 (en)2012-12-122016-12-20Novellus Systems, Inc.Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating
US9834852B2 (en)2012-12-122017-12-05Novellus Systems, Inc.Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating
US10301739B2 (en)2013-05-012019-05-28Lam Research CorporationAnisotropic high resistance ionic current source (AHRICS)
US9670588B2 (en)2013-05-012017-06-06Lam Research CorporationAnisotropic high resistance ionic current source (AHRICS)
US9449808B2 (en)2013-05-292016-09-20Novellus Systems, Inc.Apparatus for advanced packaging applications
US9899230B2 (en)2013-05-292018-02-20Novellus Systems, Inc.Apparatus for advanced packaging applications
USD724553S1 (en)*2013-09-132015-03-17Asm Ip Holding B.V.Substrate supporter for semiconductor deposition apparatus
USD716742S1 (en)*2013-09-132014-11-04Asm Ip Holding B.V.Substrate supporter for semiconductor deposition apparatus
USD760180S1 (en)*2014-02-212016-06-28Hzo, Inc.Hexcell channel arrangement for use in a boat for a deposition apparatus
USD748593S1 (en)*2014-03-052016-02-02Hzo, Inc.Boat for use in a material deposition apparatus
USD720313S1 (en)*2014-06-162014-12-30Emcore Solar Power, Inc.Semiconductor wafer with dicing positions for solar cell fabrication
USD786810S1 (en)2014-11-132017-05-16Tokyo Electron LimitedDummy wafer
USD785576S1 (en)*2014-11-132017-05-02Tokyo Electron LimitedDummy wafer
USD784937S1 (en)2014-11-132017-04-25Tokyo Electron LimitedDummy wafer
USD809804S1 (en)*2014-12-172018-02-13Ngk Insulators, Ltd.Composite substrate for acoustic wave device
USD849422S1 (en)2014-12-172019-05-28Ngk Insulators, Ltd.Composite substrate for acoustic wave device
US9816194B2 (en)2015-03-192017-11-14Lam Research CorporationControl of electrolyte flow dynamics for uniform electroplating
USD852762S1 (en)2015-03-272019-07-02Veeco Instruments Inc.Wafer carrier with a 14-pocket configuration
USD793972S1 (en)2015-03-272017-08-08Veeco Instruments Inc.Wafer carrier with a 31-pocket configuration
USD793971S1 (en)2015-03-272017-08-08Veeco Instruments Inc.Wafer carrier with a 14-pocket configuration
USD806046S1 (en)2015-04-162017-12-26Veeco Instruments Inc.Wafer carrier with a multi-pocket configuration
USD778247S1 (en)*2015-04-162017-02-07Veeco Instruments Inc.Wafer carrier with a multi-pocket configuration
US10014170B2 (en)2015-05-142018-07-03Lam Research CorporationApparatus and method for electrodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivity
US10923340B2 (en)2015-05-142021-02-16Lam Research CorporationApparatus and method for electrodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivity
US10094034B2 (en)2015-08-282018-10-09Lam Research CorporationEdge flow element for electroplating apparatus
USD873782S1 (en)*2016-05-172020-01-28Electro Scientific Industries, IncComponent carrier plate
US10364505B2 (en)2016-05-242019-07-30Lam Research CorporationDynamic modulation of cross flow manifold during elecroplating
US11047059B2 (en)2016-05-242021-06-29Lam Research CorporationDynamic modulation of cross flow manifold during elecroplating
US11001934B2 (en)2017-08-212021-05-11Lam Research CorporationMethods and apparatus for flow isolation and focusing during electroplating
US10781527B2 (en)2017-09-182020-09-22Lam Research CorporationMethods and apparatus for controlling delivery of cross flowing and impinging electrolyte during electroplating
USD1054388S1 (en)*2021-10-152024-12-17Shin-Etsu Chemical Co., Ltd.Carrier substrate for handling

Also Published As

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