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USD516528S1 - Cover for a semiconductor carrier - Google Patents

Cover for a semiconductor carrier
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Publication number
USD516528S1
USD516528S1US29/229,566US22956605FUSD516528SUS D516528 S1USD516528 S1US D516528S1US 22956605 FUS22956605 FUS 22956605FUS D516528 SUSD516528 SUS D516528S
Authority
US
United States
Prior art keywords
cover
semiconductor carrier
semiconductor
carrier
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/229,566
Inventor
Yuji Nakamura
Katsumi Suzuki
Takahiro Ishibashi
Eiji Kobori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yamaichi Electronics Co Ltd
Original Assignee
Yamaichi Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US29/211,532external-prioritypatent/USD507545S1/en
Application filed by Yamaichi Electronics Co LtdfiledCriticalYamaichi Electronics Co Ltd
Priority to US29/229,566priorityCriticalpatent/USD516528S1/en
Application grantedgrantedCritical
Publication of USD516528S1publicationCriticalpatent/USD516528S1/en
Anticipated expirationlegal-statusCritical
Expired - Lifetimelegal-statusCriticalCurrent

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Description

FIG. 1 is a left, front perspective view of a cover for a semiconductor carrier showing our new design;
FIG. 2 is a front view of our new design, the rear view being a mirror image thereof;
FIG. 3 is a right-side view of our new design, the left-side view being a mirror image thereof;
FIG. 4 is a top view of our new design; and,
FIG. 5 is a bottom view of our new design.
The broken lines are for illustrative purposes only and form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a cover for a semiconductor carrier, as shown and described.
US29/229,5662004-02-202005-05-10Cover for a semiconductor carrierExpired - LifetimeUSD516528S1 (en)

Priority Applications (1)

Application NumberPriority DateFiling DateTitle
US29/229,566USD516528S1 (en)2004-02-202005-05-10Cover for a semiconductor carrier

Applications Claiming Priority (4)

Application NumberPriority DateFiling DateTitle
JP2004-0048342004-02-20
JP20040048342004-02-20
US29/211,532USD507545S1 (en)2004-02-202004-08-18Semiconductor carrier
US29/229,566USD516528S1 (en)2004-02-202005-05-10Cover for a semiconductor carrier

Related Parent Applications (1)

Application NumberTitlePriority DateFiling Date
US29/211,532DivisionUSD507545S1 (en)2004-02-202004-08-18Semiconductor carrier

Publications (1)

Publication NumberPublication Date
USD516528S1true USD516528S1 (en)2006-03-07

Family

ID=35966713

Family Applications (1)

Application NumberTitlePriority DateFiling Date
US29/229,566Expired - LifetimeUSD516528S1 (en)2004-02-202005-05-10Cover for a semiconductor carrier

Country Status (1)

CountryLink
US (1)USD516528S1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
USD594827S1 (en)*2006-12-072009-06-23Cree, Inc.Lamp package
US10256385B2 (en)2007-10-312019-04-09Cree, Inc.Light emitting die (LED) packages and related methods
USD873223S1 (en)*2017-05-242020-01-21Osram Sylvania Inc.Surface-mountable heat sink
USD878312S1 (en)*2017-05-242020-03-17Osram Sylvania Inc.Lightweight heat sink

Citations (7)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
USD359028S (en)1993-09-021995-06-06Sgs-Thomson Microelectronics, Inc.Socketed integrated circuit package
US5451165A (en)1994-07-271995-09-19Minnesota Mining And Manufacturing CompanyTemporary package for bare die test and burn-in
US5519332A (en)1991-06-041996-05-21Micron Technology, Inc.Carrier for testing an unpackaged semiconductor die
US5541525A (en)1991-06-041996-07-30Micron Technology, Inc.Carrier for testing an unpackaged semiconductor die
USD401567S (en)1997-04-251998-11-24Micron Technology, Inc.Temporary package for semiconductor dice
US20010043074A1 (en)1998-08-282001-11-22David R. HembreeTest carrier with molded interconnect for testing semiconductor components
US20040016993A1 (en)2002-07-242004-01-29Mirae CorporationTest tray with carrier modules for a semiconductor device handler

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US5519332A (en)1991-06-041996-05-21Micron Technology, Inc.Carrier for testing an unpackaged semiconductor die
US5541525A (en)1991-06-041996-07-30Micron Technology, Inc.Carrier for testing an unpackaged semiconductor die
USD359028S (en)1993-09-021995-06-06Sgs-Thomson Microelectronics, Inc.Socketed integrated circuit package
US5451165A (en)1994-07-271995-09-19Minnesota Mining And Manufacturing CompanyTemporary package for bare die test and burn-in
USD401567S (en)1997-04-251998-11-24Micron Technology, Inc.Temporary package for semiconductor dice
US20010043074A1 (en)1998-08-282001-11-22David R. HembreeTest carrier with molded interconnect for testing semiconductor components
US20040016993A1 (en)2002-07-242004-01-29Mirae CorporationTest tray with carrier modules for a semiconductor device handler

Cited By (4)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
USD594827S1 (en)*2006-12-072009-06-23Cree, Inc.Lamp package
US10256385B2 (en)2007-10-312019-04-09Cree, Inc.Light emitting die (LED) packages and related methods
USD873223S1 (en)*2017-05-242020-01-21Osram Sylvania Inc.Surface-mountable heat sink
USD878312S1 (en)*2017-05-242020-03-17Osram Sylvania Inc.Lightweight heat sink

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