Movatterモバイル変換


[0]ホーム

URL:


USD1098055S1 - Power module package - Google Patents

Power module package

Info

Publication number
USD1098055S1
USD1098055S1US29/861,844US202229861844FUSD1098055SUS D1098055 S1USD1098055 S1US D1098055S1US 202229861844 FUS202229861844 FUS 202229861844FUS D1098055 SUSD1098055 SUS D1098055S
Authority
US
United States
Prior art keywords
power module
module package
view
design
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/861,844
Inventor
Seungwon Im
Jeonghyuk Park
KeunHyuk Lee
Jerome Teysseyre
Paolo Bilardo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semiconductor Components Industries LLC
Original Assignee
Semiconductor Components Industries LLC
Filing date
Publication date
Application filed by Semiconductor Components Industries LLCfiledCriticalSemiconductor Components Industries LLC
Assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCreassignmentSEMICONDUCTOR COMPONENTS INDUSTRIES, LLCASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).Assignors: TEYSSEYRE, JEROME, LEE, KEUNHYUK, IM, SEUNGWON, PARK, JEONGHYUK, Bilardo, Paolo
Assigned to DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENTreassignmentDEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENTSECURITY INTEREST (SEE DOCUMENT FOR DETAILS).Assignors: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCreassignmentSEMICONDUCTOR COMPONENTS INDUSTRIES, LLCRELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL 062882, FRAME 0265Assignors: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Priority to US29/997,705priorityCriticalpatent/USD1095474S1/en
Application grantedgrantedCritical
Publication of USD1098055S1publicationCriticalpatent/USD1098055S1/en
Activelegal-statusCriticalCurrent
Anticipated expirationlegal-statusCritical

Links

Images

Description

FIG.1 is a perspective view of a first embodiment of a power module package showing our new design;
FIG.2 is a top plan view thereof;
FIG.3 is a bottom plan view thereof;
FIG.4 is a front view thereof;
FIG.5 is a rear view thereof;
FIG.6 is a side view thereof;
FIG.7 is an opposite side view thereof;
FIG.8 is a perspective view of a second embodiment of a power module package showing our new design;
FIG.9 is a top plan view thereof;
FIG.10 is a bottom plan view thereof;
FIG.11 is a front view thereof;
FIG.12 is a rear view thereof;
FIG.13 is a side view thereof; and,
FIG.14 is an opposite side view thereof.
Evenly spaced broken lines depict unclaimed portions of the environmental structure, and form no part of the claimed design. Dot-dash lines depict boundaries of the claimed design, and form no part of the claimed design.
The shading inFIGS.1-14 indicates claimed surface areas on the power module package.

Claims (1)

    CLAIM
  1. The ornamental design for a power module package, as shown and described.
US29/861,8442022-12-022022-12-02Power module packageActiveUSD1098055S1 (en)

Priority Applications (1)

Application NumberPriority DateFiling DateTitle
US29/997,705USD1095474S1 (en)2022-12-022025-04-09Power module package

Related Child Applications (1)

Application NumberTitlePriority DateFiling Date
US29/997,705DivisionUSD1095474S1 (en)2022-12-022025-04-09Power module package

Publications (1)

Publication NumberPublication Date
USD1098055S1true USD1098055S1 (en)2025-10-14

Family

ID=

Citations (42)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US3602846A (en)*1969-07-141971-08-31Pulse Eng IncDelay line
US3762039A (en)*1971-09-101973-10-02Mos Technology IncPlastic encapsulation of microcircuits
US3825876A (en)*1971-08-121974-07-23Augat IncElectrical component mounting
US4916519A (en)*1989-05-301990-04-10International Business Machines CorporationSemiconductor package
USD317592S (en)*1987-01-191991-06-18Canon Kabushiki KaishaSemiconductor element
US5105257A (en)*1990-08-081992-04-14Mitsubishi Denki Kabushiki KaishaPackaged semiconductor device and semiconductor device packaging element
USD345731S (en)*1992-12-031994-04-05Motorola, Inc.Semiconductor package
US5337216A (en)*1992-05-181994-08-09Square D CompanyMultichip semiconductor small outline integrated circuit package structure
US5434357A (en)*1991-12-231995-07-18Belcher; Donald K.Reduced semiconductor size package
US5646443A (en)*1993-10-151997-07-08Nec CorporationSemiconductor package
USD396847S (en)*1996-10-171998-08-11Matsushita Electronics CorporationSemiconductor device
USD397092S (en)*1997-01-031998-08-18Fujitsu LimitedIntegrated circuit package
US5798570A (en)*1996-06-281998-08-25Kabushiki Kaisha Gotoh SeisakushoPlastic molded semiconductor package with thermal dissipation means
US5844307A (en)*1995-07-311998-12-01Nec CorporationPlastic molded IC package with leads having small flatness fluctuation
US5959842A (en)*1998-05-141999-09-28Lucent Technologies Inc.Surface mount power supply package and method of manufacture thereof
US6093957A (en)*1997-04-182000-07-25Lg Semicon Co., Ltd.Multilayer lead frame structure that reduces cross-talk and semiconductor package using same and fabrication method thereof
USD432097S (en)*1999-11-202000-10-17Samsung Electronics Co., Ltd.Semiconductor package
US6238953B1 (en)*1999-01-122001-05-29Sony CorporationLead frame, resin-encapsulated semiconductor device and fabrication process for the device
USD448739S1 (en)*2000-09-122001-10-02Mitsubishi Denki Kabushiki KaishaSemiconductor device
USD466485S1 (en)*2001-05-232002-12-03Shindengen Electric Manufactuturing Co., Ltd.Semiconductor package
USD466873S1 (en)*2001-10-312002-12-10Siliconix IncorporatedSemiconductor chip package
US20030042584A1 (en)*2001-09-052003-03-06Mitsubishi Denki Kabushiki KaishaSemiconductor device and method of manufacturing the same
USD472528S1 (en)*2001-10-312003-04-01Siliconix IncorporatedSemiconductor chip package
US6555899B1 (en)*1999-10-152003-04-29Amkor Technology, Inc.Semiconductor package leadframe assembly and method of manufacture
USD476962S1 (en)*2002-03-292003-07-08Kabushiki Kaisha ToshibaSemiconductor device
USD505400S1 (en)*2004-03-262005-05-24Mitsubishi Denki Kabushiki KaishaSemiconductor device
US6992386B2 (en)*2003-07-312006-01-31Renesas Technology Corp.Semiconductor device and a method of manufacturing the same
USD548202S1 (en)*2006-04-172007-08-07Kabushiki Kaisha ToshibaSemiconductor
US7638363B2 (en)2002-09-172009-12-29Chippac, Inc.Semiconductor multi-package module having package stacked over ball grid array package and having wire bond interconnect between stacked packages
US8143100B2 (en)2002-09-172012-03-27Chippac, Inc.Method of fabricating a semiconductor multi-package module having wire bond interconnect between stacked packages
USD717253S1 (en)*2012-10-112014-11-11Samsung Electro-Mechanics Co., Ltd.Semiconductor device
USD717256S1 (en)*2012-09-202014-11-11Samsung Electro-Mechanics Co., Ltd.Semiconductor device
USD719113S1 (en)*2012-09-202014-12-09Samsung Electro-Mechanics Co., Ltd.Semiconductor device
US9711343B1 (en)2006-12-142017-07-18Utac Thai LimitedMolded leadframe substrate semiconductor package
USD852765S1 (en)*2017-10-192019-07-02Rohm Co., Ltd.Semiconductor device
USD853343S1 (en)*2017-10-192019-07-09Rohm Co., Ltd.Semiconductor device
USD856947S1 (en)*2017-10-192019-08-20Rohm Co., Ltd.Semiconductor device
USD859334S1 (en)*2017-10-262019-09-10Mitsubishi Electric CorporationSemiconductor device
USD902877S1 (en)*2018-06-122020-11-24Rohm Co., Ltd.Packaged semiconductor module
USD920264S1 (en)*2019-11-272021-05-25The Noco CompanySemiconductor device
USD932452S1 (en)*2019-11-272021-10-05The Noco CompanySemiconductor device
USD969762S1 (en)*2020-04-062022-11-15Wolfspeed, Inc.Power semiconductor package

Patent Citations (42)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US3602846A (en)*1969-07-141971-08-31Pulse Eng IncDelay line
US3825876A (en)*1971-08-121974-07-23Augat IncElectrical component mounting
US3762039A (en)*1971-09-101973-10-02Mos Technology IncPlastic encapsulation of microcircuits
USD317592S (en)*1987-01-191991-06-18Canon Kabushiki KaishaSemiconductor element
US4916519A (en)*1989-05-301990-04-10International Business Machines CorporationSemiconductor package
US5105257A (en)*1990-08-081992-04-14Mitsubishi Denki Kabushiki KaishaPackaged semiconductor device and semiconductor device packaging element
US5434357A (en)*1991-12-231995-07-18Belcher; Donald K.Reduced semiconductor size package
US5337216A (en)*1992-05-181994-08-09Square D CompanyMultichip semiconductor small outline integrated circuit package structure
USD345731S (en)*1992-12-031994-04-05Motorola, Inc.Semiconductor package
US5646443A (en)*1993-10-151997-07-08Nec CorporationSemiconductor package
US5844307A (en)*1995-07-311998-12-01Nec CorporationPlastic molded IC package with leads having small flatness fluctuation
US5798570A (en)*1996-06-281998-08-25Kabushiki Kaisha Gotoh SeisakushoPlastic molded semiconductor package with thermal dissipation means
USD396847S (en)*1996-10-171998-08-11Matsushita Electronics CorporationSemiconductor device
USD397092S (en)*1997-01-031998-08-18Fujitsu LimitedIntegrated circuit package
US6093957A (en)*1997-04-182000-07-25Lg Semicon Co., Ltd.Multilayer lead frame structure that reduces cross-talk and semiconductor package using same and fabrication method thereof
US5959842A (en)*1998-05-141999-09-28Lucent Technologies Inc.Surface mount power supply package and method of manufacture thereof
US6238953B1 (en)*1999-01-122001-05-29Sony CorporationLead frame, resin-encapsulated semiconductor device and fabrication process for the device
US6555899B1 (en)*1999-10-152003-04-29Amkor Technology, Inc.Semiconductor package leadframe assembly and method of manufacture
USD432097S (en)*1999-11-202000-10-17Samsung Electronics Co., Ltd.Semiconductor package
USD448739S1 (en)*2000-09-122001-10-02Mitsubishi Denki Kabushiki KaishaSemiconductor device
USD466485S1 (en)*2001-05-232002-12-03Shindengen Electric Manufactuturing Co., Ltd.Semiconductor package
US20030042584A1 (en)*2001-09-052003-03-06Mitsubishi Denki Kabushiki KaishaSemiconductor device and method of manufacturing the same
USD466873S1 (en)*2001-10-312002-12-10Siliconix IncorporatedSemiconductor chip package
USD472528S1 (en)*2001-10-312003-04-01Siliconix IncorporatedSemiconductor chip package
USD476962S1 (en)*2002-03-292003-07-08Kabushiki Kaisha ToshibaSemiconductor device
US7638363B2 (en)2002-09-172009-12-29Chippac, Inc.Semiconductor multi-package module having package stacked over ball grid array package and having wire bond interconnect between stacked packages
US8143100B2 (en)2002-09-172012-03-27Chippac, Inc.Method of fabricating a semiconductor multi-package module having wire bond interconnect between stacked packages
US6992386B2 (en)*2003-07-312006-01-31Renesas Technology Corp.Semiconductor device and a method of manufacturing the same
USD505400S1 (en)*2004-03-262005-05-24Mitsubishi Denki Kabushiki KaishaSemiconductor device
USD548202S1 (en)*2006-04-172007-08-07Kabushiki Kaisha ToshibaSemiconductor
US9711343B1 (en)2006-12-142017-07-18Utac Thai LimitedMolded leadframe substrate semiconductor package
USD717256S1 (en)*2012-09-202014-11-11Samsung Electro-Mechanics Co., Ltd.Semiconductor device
USD719113S1 (en)*2012-09-202014-12-09Samsung Electro-Mechanics Co., Ltd.Semiconductor device
USD717253S1 (en)*2012-10-112014-11-11Samsung Electro-Mechanics Co., Ltd.Semiconductor device
USD852765S1 (en)*2017-10-192019-07-02Rohm Co., Ltd.Semiconductor device
USD853343S1 (en)*2017-10-192019-07-09Rohm Co., Ltd.Semiconductor device
USD856947S1 (en)*2017-10-192019-08-20Rohm Co., Ltd.Semiconductor device
USD859334S1 (en)*2017-10-262019-09-10Mitsubishi Electric CorporationSemiconductor device
USD902877S1 (en)*2018-06-122020-11-24Rohm Co., Ltd.Packaged semiconductor module
USD920264S1 (en)*2019-11-272021-05-25The Noco CompanySemiconductor device
USD932452S1 (en)*2019-11-272021-10-05The Noco CompanySemiconductor device
USD969762S1 (en)*2020-04-062022-11-15Wolfspeed, Inc.Power semiconductor package

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
IGBTS and IPM Module, 10v To 100v,https://www.indiamart.com/proddetail/igbts-and-ipm-module-7488547988.html?mTd=1, 2024. (Year: 2024).*
Intelligent Power Modules provide excellent protection for industrial equipment,https://www.arrow.com/en/research-and-events/articles/on_semi_ipm, 2024. (Year: 2024).*

Similar Documents

PublicationPublication DateTitle
USD984705S1 (en)Solar light
USD1021884S1 (en)Case for mobile electronic device
USD1042388S1 (en)Mobile electronic device
USD1018513S1 (en)Case for mobile electronic device
USD1042387S1 (en)Mobile electronic device
USD1024043S1 (en)Case for mobile electronic device
USD1042385S1 (en)Mobile electronic device
USD1057722S1 (en)Case for mobile electronic device
USD1024044S1 (en)Case for mobile electronic device
USD1025772S1 (en)Packaging
USD1042386S1 (en)Mobile electronic device
USD1039195S1 (en)Solar light
USD958743S1 (en)Electric generator
USD1024042S1 (en)Case for mobile electronic device
USD1042426S1 (en)Case for mobile electronic device
USD1024045S1 (en)Case for mobile electronic device
USD478082S1 (en)Optical scanner assembly
USD955335S1 (en)Power module
USD1031718S1 (en)Case for electronic device
USD1031720S1 (en)Case for electronic device
USD1018515S1 (en)Case for mobile electronic device
USD1043601S1 (en)Mobile electronic device
USD997236S1 (en)Photo sensor
USD1098055S1 (en)Power module package
USD1048414S1 (en)Control module

[8]ページ先頭

©2009-2025 Movatter.jp