














| Application Number | Priority Date | Filing Date | Title | 
|---|---|---|---|
| US29/997,705USD1095474S1 (en) | 2022-12-02 | 2025-04-09 | Power module package | 
| Application Number | Title | Priority Date | Filing Date | 
|---|---|---|---|
| US29/997,705DivisionUSD1095474S1 (en) | 2022-12-02 | 2025-04-09 | Power module package | 
| Publication Number | Publication Date | 
|---|---|
| USD1098055S1true USD1098055S1 (en) | 2025-10-14 | 
| Publication number | Priority date | Publication date | Assignee | Title | 
|---|---|---|---|---|
| US3602846A (en)* | 1969-07-14 | 1971-08-31 | Pulse Eng Inc | Delay line | 
| US3762039A (en)* | 1971-09-10 | 1973-10-02 | Mos Technology Inc | Plastic encapsulation of microcircuits | 
| US3825876A (en)* | 1971-08-12 | 1974-07-23 | Augat Inc | Electrical component mounting | 
| US4916519A (en)* | 1989-05-30 | 1990-04-10 | International Business Machines Corporation | Semiconductor package | 
| USD317592S (en)* | 1987-01-19 | 1991-06-18 | Canon Kabushiki Kaisha | Semiconductor element | 
| US5105257A (en)* | 1990-08-08 | 1992-04-14 | Mitsubishi Denki Kabushiki Kaisha | Packaged semiconductor device and semiconductor device packaging element | 
| USD345731S (en)* | 1992-12-03 | 1994-04-05 | Motorola, Inc. | Semiconductor package | 
| US5337216A (en)* | 1992-05-18 | 1994-08-09 | Square D Company | Multichip semiconductor small outline integrated circuit package structure | 
| US5434357A (en)* | 1991-12-23 | 1995-07-18 | Belcher; Donald K. | Reduced semiconductor size package | 
| US5646443A (en)* | 1993-10-15 | 1997-07-08 | Nec Corporation | Semiconductor package | 
| USD396847S (en)* | 1996-10-17 | 1998-08-11 | Matsushita Electronics Corporation | Semiconductor device | 
| USD397092S (en)* | 1997-01-03 | 1998-08-18 | Fujitsu Limited | Integrated circuit package | 
| US5798570A (en)* | 1996-06-28 | 1998-08-25 | Kabushiki Kaisha Gotoh Seisakusho | Plastic molded semiconductor package with thermal dissipation means | 
| US5844307A (en)* | 1995-07-31 | 1998-12-01 | Nec Corporation | Plastic molded IC package with leads having small flatness fluctuation | 
| US5959842A (en)* | 1998-05-14 | 1999-09-28 | Lucent Technologies Inc. | Surface mount power supply package and method of manufacture thereof | 
| US6093957A (en)* | 1997-04-18 | 2000-07-25 | Lg Semicon Co., Ltd. | Multilayer lead frame structure that reduces cross-talk and semiconductor package using same and fabrication method thereof | 
| USD432097S (en)* | 1999-11-20 | 2000-10-17 | Samsung Electronics Co., Ltd. | Semiconductor package | 
| US6238953B1 (en)* | 1999-01-12 | 2001-05-29 | Sony Corporation | Lead frame, resin-encapsulated semiconductor device and fabrication process for the device | 
| USD448739S1 (en)* | 2000-09-12 | 2001-10-02 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device | 
| USD466485S1 (en)* | 2001-05-23 | 2002-12-03 | Shindengen Electric Manufactuturing Co., Ltd. | Semiconductor package | 
| USD466873S1 (en)* | 2001-10-31 | 2002-12-10 | Siliconix Incorporated | Semiconductor chip package | 
| US20030042584A1 (en)* | 2001-09-05 | 2003-03-06 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device and method of manufacturing the same | 
| USD472528S1 (en)* | 2001-10-31 | 2003-04-01 | Siliconix Incorporated | Semiconductor chip package | 
| US6555899B1 (en)* | 1999-10-15 | 2003-04-29 | Amkor Technology, Inc. | Semiconductor package leadframe assembly and method of manufacture | 
| USD476962S1 (en)* | 2002-03-29 | 2003-07-08 | Kabushiki Kaisha Toshiba | Semiconductor device | 
| USD505400S1 (en)* | 2004-03-26 | 2005-05-24 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device | 
| US6992386B2 (en)* | 2003-07-31 | 2006-01-31 | Renesas Technology Corp. | Semiconductor device and a method of manufacturing the same | 
| USD548202S1 (en)* | 2006-04-17 | 2007-08-07 | Kabushiki Kaisha Toshiba | Semiconductor | 
| US7638363B2 (en) | 2002-09-17 | 2009-12-29 | Chippac, Inc. | Semiconductor multi-package module having package stacked over ball grid array package and having wire bond interconnect between stacked packages | 
| US8143100B2 (en) | 2002-09-17 | 2012-03-27 | Chippac, Inc. | Method of fabricating a semiconductor multi-package module having wire bond interconnect between stacked packages | 
| USD717253S1 (en)* | 2012-10-11 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device | 
| USD717256S1 (en)* | 2012-09-20 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device | 
| USD719113S1 (en)* | 2012-09-20 | 2014-12-09 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device | 
| US9711343B1 (en) | 2006-12-14 | 2017-07-18 | Utac Thai Limited | Molded leadframe substrate semiconductor package | 
| USD852765S1 (en)* | 2017-10-19 | 2019-07-02 | Rohm Co., Ltd. | Semiconductor device | 
| USD853343S1 (en)* | 2017-10-19 | 2019-07-09 | Rohm Co., Ltd. | Semiconductor device | 
| USD856947S1 (en)* | 2017-10-19 | 2019-08-20 | Rohm Co., Ltd. | Semiconductor device | 
| USD859334S1 (en)* | 2017-10-26 | 2019-09-10 | Mitsubishi Electric Corporation | Semiconductor device | 
| USD902877S1 (en)* | 2018-06-12 | 2020-11-24 | Rohm Co., Ltd. | Packaged semiconductor module | 
| USD920264S1 (en)* | 2019-11-27 | 2021-05-25 | The Noco Company | Semiconductor device | 
| USD932452S1 (en)* | 2019-11-27 | 2021-10-05 | The Noco Company | Semiconductor device | 
| USD969762S1 (en)* | 2020-04-06 | 2022-11-15 | Wolfspeed, Inc. | Power semiconductor package | 
| Publication number | Priority date | Publication date | Assignee | Title | 
|---|---|---|---|---|
| US3602846A (en)* | 1969-07-14 | 1971-08-31 | Pulse Eng Inc | Delay line | 
| US3825876A (en)* | 1971-08-12 | 1974-07-23 | Augat Inc | Electrical component mounting | 
| US3762039A (en)* | 1971-09-10 | 1973-10-02 | Mos Technology Inc | Plastic encapsulation of microcircuits | 
| USD317592S (en)* | 1987-01-19 | 1991-06-18 | Canon Kabushiki Kaisha | Semiconductor element | 
| US4916519A (en)* | 1989-05-30 | 1990-04-10 | International Business Machines Corporation | Semiconductor package | 
| US5105257A (en)* | 1990-08-08 | 1992-04-14 | Mitsubishi Denki Kabushiki Kaisha | Packaged semiconductor device and semiconductor device packaging element | 
| US5434357A (en)* | 1991-12-23 | 1995-07-18 | Belcher; Donald K. | Reduced semiconductor size package | 
| US5337216A (en)* | 1992-05-18 | 1994-08-09 | Square D Company | Multichip semiconductor small outline integrated circuit package structure | 
| USD345731S (en)* | 1992-12-03 | 1994-04-05 | Motorola, Inc. | Semiconductor package | 
| US5646443A (en)* | 1993-10-15 | 1997-07-08 | Nec Corporation | Semiconductor package | 
| US5844307A (en)* | 1995-07-31 | 1998-12-01 | Nec Corporation | Plastic molded IC package with leads having small flatness fluctuation | 
| US5798570A (en)* | 1996-06-28 | 1998-08-25 | Kabushiki Kaisha Gotoh Seisakusho | Plastic molded semiconductor package with thermal dissipation means | 
| USD396847S (en)* | 1996-10-17 | 1998-08-11 | Matsushita Electronics Corporation | Semiconductor device | 
| USD397092S (en)* | 1997-01-03 | 1998-08-18 | Fujitsu Limited | Integrated circuit package | 
| US6093957A (en)* | 1997-04-18 | 2000-07-25 | Lg Semicon Co., Ltd. | Multilayer lead frame structure that reduces cross-talk and semiconductor package using same and fabrication method thereof | 
| US5959842A (en)* | 1998-05-14 | 1999-09-28 | Lucent Technologies Inc. | Surface mount power supply package and method of manufacture thereof | 
| US6238953B1 (en)* | 1999-01-12 | 2001-05-29 | Sony Corporation | Lead frame, resin-encapsulated semiconductor device and fabrication process for the device | 
| US6555899B1 (en)* | 1999-10-15 | 2003-04-29 | Amkor Technology, Inc. | Semiconductor package leadframe assembly and method of manufacture | 
| USD432097S (en)* | 1999-11-20 | 2000-10-17 | Samsung Electronics Co., Ltd. | Semiconductor package | 
| USD448739S1 (en)* | 2000-09-12 | 2001-10-02 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device | 
| USD466485S1 (en)* | 2001-05-23 | 2002-12-03 | Shindengen Electric Manufactuturing Co., Ltd. | Semiconductor package | 
| US20030042584A1 (en)* | 2001-09-05 | 2003-03-06 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device and method of manufacturing the same | 
| USD466873S1 (en)* | 2001-10-31 | 2002-12-10 | Siliconix Incorporated | Semiconductor chip package | 
| USD472528S1 (en)* | 2001-10-31 | 2003-04-01 | Siliconix Incorporated | Semiconductor chip package | 
| USD476962S1 (en)* | 2002-03-29 | 2003-07-08 | Kabushiki Kaisha Toshiba | Semiconductor device | 
| US7638363B2 (en) | 2002-09-17 | 2009-12-29 | Chippac, Inc. | Semiconductor multi-package module having package stacked over ball grid array package and having wire bond interconnect between stacked packages | 
| US8143100B2 (en) | 2002-09-17 | 2012-03-27 | Chippac, Inc. | Method of fabricating a semiconductor multi-package module having wire bond interconnect between stacked packages | 
| US6992386B2 (en)* | 2003-07-31 | 2006-01-31 | Renesas Technology Corp. | Semiconductor device and a method of manufacturing the same | 
| USD505400S1 (en)* | 2004-03-26 | 2005-05-24 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device | 
| USD548202S1 (en)* | 2006-04-17 | 2007-08-07 | Kabushiki Kaisha Toshiba | Semiconductor | 
| US9711343B1 (en) | 2006-12-14 | 2017-07-18 | Utac Thai Limited | Molded leadframe substrate semiconductor package | 
| USD717256S1 (en)* | 2012-09-20 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device | 
| USD719113S1 (en)* | 2012-09-20 | 2014-12-09 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device | 
| USD717253S1 (en)* | 2012-10-11 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device | 
| USD852765S1 (en)* | 2017-10-19 | 2019-07-02 | Rohm Co., Ltd. | Semiconductor device | 
| USD853343S1 (en)* | 2017-10-19 | 2019-07-09 | Rohm Co., Ltd. | Semiconductor device | 
| USD856947S1 (en)* | 2017-10-19 | 2019-08-20 | Rohm Co., Ltd. | Semiconductor device | 
| USD859334S1 (en)* | 2017-10-26 | 2019-09-10 | Mitsubishi Electric Corporation | Semiconductor device | 
| USD902877S1 (en)* | 2018-06-12 | 2020-11-24 | Rohm Co., Ltd. | Packaged semiconductor module | 
| USD920264S1 (en)* | 2019-11-27 | 2021-05-25 | The Noco Company | Semiconductor device | 
| USD932452S1 (en)* | 2019-11-27 | 2021-10-05 | The Noco Company | Semiconductor device | 
| USD969762S1 (en)* | 2020-04-06 | 2022-11-15 | Wolfspeed, Inc. | Power semiconductor package | 
| Title | 
|---|
| IGBTS and IPM Module, 10v To 100v,https://www.indiamart.com/proddetail/igbts-and-ipm-module-7488547988.html?mTd=1, 2024. (Year: 2024).* | 
| Intelligent Power Modules provide excellent protection for industrial equipment,https://www.arrow.com/en/research-and-events/articles/on_semi_ipm, 2024. (Year: 2024).* | 
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