Movatterモバイル変換


[0]ホーム

URL:


USD1094325S1 - Electro-magnetic device - Google Patents

Electro-magnetic device

Info

Publication number
USD1094325S1
USD1094325S1US29/804,957US202129804957FUSD1094325SUS D1094325 S1USD1094325 S1US D1094325S1US 202129804957 FUS202129804957 FUS 202129804957FUS D1094325 SUSD1094325 SUS D1094325S
Authority
US
United States
Prior art keywords
electro
magnetic device
view
magnetic
ornamental design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/804,957
Inventor
Benjamin HANSON
Steven Hofer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Vishay Dale Electronics LLC
Original Assignee
Vishay Dale Electronics LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vishay Dale Electronics LLCfiledCriticalVishay Dale Electronics LLC
Priority to US29/804,957priorityCriticalpatent/USD1094325S1/en
Assigned to VISHAY DALE ELECTRONICS, LLCreassignmentVISHAY DALE ELECTRONICS, LLCASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).Assignors: HANSON, Benjamin, Hofer, Steven
Assigned to JPMORGAN CHASE BANK, N.A.reassignmentJPMORGAN CHASE BANK, N.A.SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).Assignors: VISHAY DALE ELECTRONICS, INC. (N/K/A VISHAY DALE ELECTRONICS, LLC), VISHAY GENERAL SEMICONDUCTOR INC. (N/K/A VISHAY GSI, INC.), VISHAY GENERAL SEMICONDUCTOR, LLC (N/K/A VISHAY GSI, INC.), VISHAY INTERTECHNOLOGY, INC., VISHAY-SILICONIX (N/K/A SILICONIX INCORPORATED)
Application grantedgrantedCritical
Publication of USD1094325S1publicationCriticalpatent/USD1094325S1/en
Activelegal-statusCriticalCurrent
Anticipated expirationlegal-statusCritical

Links

Images

Description

FIG.1 is a top, front, right perspective view of an electro-magnetic device in accordance with our design;
FIG.2 is a bottom, rear, left perspective view thereof;
FIG.3 is a front elevational view thereof;
FIG.4 is a rear elevational view thereof;
FIG.5 is a right side elevational view thereof;
FIG.6 is a left side elevational view thereof;
FIG.7 is a top plan view thereof; and,
FIG.8 is a bottom plan view thereof.

Claims (1)

    CLAIM
  1. The ornamental design for an electro-magnetic device as shown and described.
US29/804,9572021-08-242021-08-24Electro-magnetic deviceActiveUSD1094325S1 (en)

Priority Applications (1)

Application NumberPriority DateFiling DateTitle
US29/804,957USD1094325S1 (en)2021-08-242021-08-24Electro-magnetic device

Applications Claiming Priority (1)

Application NumberPriority DateFiling DateTitle
US29/804,957USD1094325S1 (en)2021-08-242021-08-24Electro-magnetic device

Publications (1)

Publication NumberPublication Date
USD1094325S1true USD1094325S1 (en)2025-09-23

Family

ID=97102711

Family Applications (1)

Application NumberTitlePriority DateFiling Date
US29/804,957ActiveUSD1094325S1 (en)2021-08-242021-08-24Electro-magnetic device

Country Status (1)

CountryLink
US (1)USD1094325S1 (en)

Citations (58)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
DE2223345A1 (en)1972-05-121973-11-22Siemens Ag DEVICE FOR EQUIPMENT OF COMPONENT CARRIER
US4567543A (en)1983-02-151986-01-28Motorola, Inc.Double-sided flexible electronic circuit module
US4966282A (en)1989-01-131990-10-30Nitto Denko CorporationElectronic component carrier
JPH02143828U (en)1989-05-081990-12-06
US5089314A (en)1987-02-251992-02-18Tdk CorporationCarrier tape for electronic circuit elements and method of manufacturing an electronic circuit element series
JPH0511424U (en)1991-07-241993-02-12株式会社トーキン Common mode chiyoke coil
US5203143A (en)1992-03-281993-04-20Tempo GMultiple and split pressure sensitive adhesive stratums for carrier tape packaging system
US5493259A (en)1992-10-131996-02-20The Whitaker CorporationHigh voltage, low pass filtering connector with multiple ground planes
US5655290A (en)1992-08-051997-08-12Fujitsu LimitedMethod for making a three-dimensional multichip module
US5731633A (en)1992-09-161998-03-24Gary W. HamiltonThin multichip module
US5765692A (en)1995-11-131998-06-16Minnesota Mining And Manufacturing CompanyCarrier tape with adhesive and protective walls
US5846621A (en)1995-09-151998-12-08Minnesota Mining And Manufacturing CompanyComponent carrier tape having static dissipative properties
US5990509A (en)1997-01-221999-11-23International Business Machines Corporation2F-square memory cell for gigabit memory applications
US6058004A (en)1997-09-082000-05-02Delaware Capital Formation, Inc.Unitized discrete electronic component arrays
JP2000182838A (en)1998-12-152000-06-30Tokyo Coil Engineering KkChoke coil
US6412641B1 (en)2000-06-192002-07-02Advanced Micro Devices, Inc.Packaging for encapsulated dice employing EMR-sensitive adhesives
US20020118517A1 (en)2001-02-272002-08-293Com CorporationChip component assembly
CA2388319A1 (en)2001-05-252002-11-25Mould, BernardHigh voltage power transmission line filter system and module
US6541874B2 (en)1998-04-282003-04-01Tessera, Inc.Encapsulation of microelectronic assemblies
US20030231477A1 (en)2002-04-122003-12-18Avx CorporationDiscrete component array
US6822850B2 (en)2002-09-272004-11-23Rockwell Automation Technologies, Inc.Laminated bus bar for use with a power conversion configuration
JP2006253349A (en)2005-03-102006-09-21Shizuki Electric Co Inc Capacitor and manufacturing method thereof
JP4019541B2 (en)1999-03-152007-12-12ミツミ電機株式会社 Chip capacitor device
WO2008008538A2 (en)2006-07-142008-01-17Pulse Engineering, Inc.Self-leaded surface mount inductors and methods
US8028397B2 (en)2005-11-032011-10-04Vishay Sprague, Inc.Method of making a frame package array device
USD665740S1 (en)*2011-11-182012-08-21Sumida CorporationCoil component
USD674756S1 (en)*2010-04-262013-01-22Hakaryd AbMagnetic cladding with electronics box
JP2014027090A (en)2012-07-262014-02-06Keihin CorpReactor device
US20140160819A1 (en)2011-07-202014-06-12Sumitomo Electric Industries, Ltd.Reactor, converter, and power converter apparatus
JP2014130949A (en)2012-12-282014-07-10Auto Network Gijutsu Kenkyusho:KkReactor, converter and power conversion device
JP2014143332A (en)2013-01-252014-08-07Sumitomo Electric Ind LtdReactor, converter, and electric power conversion device
JP2015216145A (en)2014-05-072015-12-03株式会社オートネットワーク技術研究所Reactor
JP2016111276A (en)2014-12-092016-06-20株式会社オートネットワーク技術研究所Reactor
USD778837S1 (en)*2015-06-242017-02-14Sumida CorporationMagnetic component
USD779429S1 (en)*2015-06-242017-02-21Sumida CorporationMagnetic component
USD780120S1 (en)*2015-06-242017-02-28Sumida CorporationMagnetic component
USD796438S1 (en)*2015-07-312017-09-05Alps Electric Co., Ltd.Inductor
USD806651S1 (en)*2014-12-252018-01-02Sumida CorporationMagnetic component
US20190172630A1 (en)2017-11-162019-06-06Tdk CorporationCoil device
US20190189340A1 (en)2016-09-302019-06-20Moda-Innochips Co., Ltd.Power inductor
USD881127S1 (en)*2017-09-142020-04-14Alps Alpine Co., Ltd.Inductor
USD884630S1 (en)*2017-09-142020-05-19Alps Alpine Co., Ltd.Inductor
USD906965S1 (en)*2018-03-162021-01-05Tokin CorporationInductor
USD921587S1 (en)*2019-01-232021-06-08Sumida CorporationCore
USD923574S1 (en)*2019-01-302021-06-29Sumida CorporationCoil component
USD935407S1 (en)*2019-12-272021-11-09Sumida CorporationCore
USD942946S1 (en)*2014-12-022022-02-08Tdk CorporationCoil component
US11424539B2 (en)2016-12-212022-08-23Intel CorporationWireless communication technology, apparatuses, and methods
WO2023027690A1 (en)2021-08-242023-03-02Vishay Dale Electronics, LlcDual inductor assembly
USD993181S1 (en)*2021-08-232023-07-25Tdk CorporationCoil component
USD995431S1 (en)*2019-01-232023-08-15Sumida CorporationCoil component
US20240105379A1 (en)*2022-09-252024-03-28Cyntec Co., Ltd.Magnetic component and method of manufacturing magnetic component
USD1029763S1 (en)*2018-08-222024-06-04Tdk CorporationCore of coil component
USD1034462S1 (en)*2021-03-012024-07-09Vishay Dale Electronics, LlcInductor package
USD1040762S1 (en)*2020-09-072024-09-03Tdk CorporationCoil component
US12087492B2 (en)*2018-02-052024-09-10Murata Manufacturing Co., Ltd.Common-mode choke coil
USD1052527S1 (en)*2013-12-132024-11-26Pulse Electronics, Inc.Inductive apparatus
US12224105B2 (en)*2020-03-032025-02-11Tdk CorporationCoil component

Patent Citations (66)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
DE2223345A1 (en)1972-05-121973-11-22Siemens Ag DEVICE FOR EQUIPMENT OF COMPONENT CARRIER
US4567543A (en)1983-02-151986-01-28Motorola, Inc.Double-sided flexible electronic circuit module
US5089314A (en)1987-02-251992-02-18Tdk CorporationCarrier tape for electronic circuit elements and method of manufacturing an electronic circuit element series
US4966282A (en)1989-01-131990-10-30Nitto Denko CorporationElectronic component carrier
JPH02143828U (en)1989-05-081990-12-06
JPH0511424U (en)1991-07-241993-02-12株式会社トーキン Common mode chiyoke coil
US5203143A (en)1992-03-281993-04-20Tempo GMultiple and split pressure sensitive adhesive stratums for carrier tape packaging system
US5655290A (en)1992-08-051997-08-12Fujitsu LimitedMethod for making a three-dimensional multichip module
US5731633A (en)1992-09-161998-03-24Gary W. HamiltonThin multichip module
US5493259A (en)1992-10-131996-02-20The Whitaker CorporationHigh voltage, low pass filtering connector with multiple ground planes
US5846621A (en)1995-09-151998-12-08Minnesota Mining And Manufacturing CompanyComponent carrier tape having static dissipative properties
US5765692A (en)1995-11-131998-06-16Minnesota Mining And Manufacturing CompanyCarrier tape with adhesive and protective walls
US5990509A (en)1997-01-221999-11-23International Business Machines Corporation2F-square memory cell for gigabit memory applications
US6058004A (en)1997-09-082000-05-02Delaware Capital Formation, Inc.Unitized discrete electronic component arrays
US6541874B2 (en)1998-04-282003-04-01Tessera, Inc.Encapsulation of microelectronic assemblies
JP2000182838A (en)1998-12-152000-06-30Tokyo Coil Engineering KkChoke coil
JP4019541B2 (en)1999-03-152007-12-12ミツミ電機株式会社 Chip capacitor device
US6412641B1 (en)2000-06-192002-07-02Advanced Micro Devices, Inc.Packaging for encapsulated dice employing EMR-sensitive adhesives
US20020118517A1 (en)2001-02-272002-08-293Com CorporationChip component assembly
US6549098B1 (en)2001-05-252003-04-15Bernard Mould LimitedHigh voltage power transmission line filter system and module
CA2388319A1 (en)2001-05-252002-11-25Mould, BernardHigh voltage power transmission line filter system and module
US20030231477A1 (en)2002-04-122003-12-18Avx CorporationDiscrete component array
US6822850B2 (en)2002-09-272004-11-23Rockwell Automation Technologies, Inc.Laminated bus bar for use with a power conversion configuration
JP2006253349A (en)2005-03-102006-09-21Shizuki Electric Co Inc Capacitor and manufacturing method thereof
US8028397B2 (en)2005-11-032011-10-04Vishay Sprague, Inc.Method of making a frame package array device
US20100214050A1 (en)2006-07-142010-08-26Opina Jr GilSelf-leaded surface mount inductors and methods
WO2008008538A2 (en)2006-07-142008-01-17Pulse Engineering, Inc.Self-leaded surface mount inductors and methods
USD674756S1 (en)*2010-04-262013-01-22Hakaryd AbMagnetic cladding with electronics box
US20140160819A1 (en)2011-07-202014-06-12Sumitomo Electric Industries, Ltd.Reactor, converter, and power converter apparatus
USD665740S1 (en)*2011-11-182012-08-21Sumida CorporationCoil component
JP2014027090A (en)2012-07-262014-02-06Keihin CorpReactor device
JP2014130949A (en)2012-12-282014-07-10Auto Network Gijutsu Kenkyusho:KkReactor, converter and power conversion device
JP2014143332A (en)2013-01-252014-08-07Sumitomo Electric Ind LtdReactor, converter, and electric power conversion device
USD1052527S1 (en)*2013-12-132024-11-26Pulse Electronics, Inc.Inductive apparatus
JP2015216145A (en)2014-05-072015-12-03株式会社オートネットワーク技術研究所Reactor
USD1040763S1 (en)*2014-12-022024-09-03Tdk CorporationCoil component
USD942946S1 (en)*2014-12-022022-02-08Tdk CorporationCoil component
JP2016111276A (en)2014-12-092016-06-20株式会社オートネットワーク技術研究所Reactor
USD830972S1 (en)*2014-12-252018-10-16Sumida CorporationMagnetic component
USD806651S1 (en)*2014-12-252018-01-02Sumida CorporationMagnetic component
USD779429S1 (en)*2015-06-242017-02-21Sumida CorporationMagnetic component
USD780120S1 (en)*2015-06-242017-02-28Sumida CorporationMagnetic component
USD778837S1 (en)*2015-06-242017-02-14Sumida CorporationMagnetic component
USD796438S1 (en)*2015-07-312017-09-05Alps Electric Co., Ltd.Inductor
US20190189340A1 (en)2016-09-302019-06-20Moda-Innochips Co., Ltd.Power inductor
US11424539B2 (en)2016-12-212022-08-23Intel CorporationWireless communication technology, apparatuses, and methods
USD881127S1 (en)*2017-09-142020-04-14Alps Alpine Co., Ltd.Inductor
USD884630S1 (en)*2017-09-142020-05-19Alps Alpine Co., Ltd.Inductor
US20190172630A1 (en)2017-11-162019-06-06Tdk CorporationCoil device
US12087492B2 (en)*2018-02-052024-09-10Murata Manufacturing Co., Ltd.Common-mode choke coil
USD906965S1 (en)*2018-03-162021-01-05Tokin CorporationInductor
USD1029763S1 (en)*2018-08-222024-06-04Tdk CorporationCore of coil component
USD921587S1 (en)*2019-01-232021-06-08Sumida CorporationCore
USD995433S1 (en)*2019-01-232023-08-15Sumida CorporationCore
USD995431S1 (en)*2019-01-232023-08-15Sumida CorporationCoil component
USD995430S1 (en)*2019-01-232023-08-15Sumida CorporationCoil component
USD923574S1 (en)*2019-01-302021-06-29Sumida CorporationCoil component
USD935407S1 (en)*2019-12-272021-11-09Sumida CorporationCore
US12224105B2 (en)*2020-03-032025-02-11Tdk CorporationCoil component
USD1040762S1 (en)*2020-09-072024-09-03Tdk CorporationCoil component
USD1034462S1 (en)*2021-03-012024-07-09Vishay Dale Electronics, LlcInductor package
USD993181S1 (en)*2021-08-232023-07-25Tdk CorporationCoil component
US20240355525A1 (en)*2021-08-242024-10-24Vishay Dale Electronics, LlcDual inductor assembly
CA3229949A1 (en)2021-08-242023-03-02Benjamin HANSONDual inductor assembly
WO2023027690A1 (en)2021-08-242023-03-02Vishay Dale Electronics, LlcDual inductor assembly
US20240105379A1 (en)*2022-09-252024-03-28Cyntec Co., Ltd.Magnetic component and method of manufacturing magnetic component

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
"High Current Inductors", IHLD-2525GG-5A, Document No. 34556, Dec. 2020, 5 pages.
"Low Profile, High CurrentDual Inductors", IHLD-3232HB-5A, Document No. 34383, Oct. 2020, 4 pages.
"Low Profile, High CurrentDual Inductors", IHLD-4032KB-5A, Document No. 34381, Jan. 2020, 5 pages.
"SRF 1010DA Series—Dual Shielded Inductors for Class-D Amplifiers", Product Specification Sheet, Bourns, www.boruns.com, 3 pages.

Similar Documents

PublicationPublication DateTitle
USD959411S1 (en)Earphone
USD991913S1 (en)Earphone
USD976236S1 (en)Earphone
USD969942S1 (en)Exercise device
USD996961S1 (en)Attachment device
USD1040157S1 (en)Smart device case
USD951251S1 (en)Augmented reality device
USD940133S1 (en)Access device
USD972476S1 (en)Baffle
USD1003332S1 (en)Optical device
USD921077S1 (en)Funnel
USD1030746S1 (en)Electronic device
USD1033623S1 (en)Earplug
USD992627S1 (en)Monitoring camera
USD975707S1 (en)Electronic device
USD976095S1 (en)Clamp
USD989317S1 (en)Trainer device
USD1000318S1 (en)Automobile
USD1079698S1 (en)Authentication device
USD977138S1 (en)Molecular diagnostic device
USD969765S1 (en)Interface device
USD1047139S1 (en)Injection device
USD928667S1 (en)Scooter
USD1029780S1 (en)Electronic device
USD1030747S1 (en)Electronic device

Legal Events

DateCodeTitleDescription
FEPPFee payment procedure

Free format text:ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY


[8]ページ先頭

©2009-2025 Movatter.jp