







| Application Number | Priority Date | Filing Date | Title | 
|---|---|---|---|
| JP2022-022682D | 2022-10-20 | ||
| JP2022022682FJP1741172S (en) | 2022-10-20 | 2022-10-20 | Susceptor cover | 
| Publication Number | Publication Date | 
|---|---|
| USD1094321S1true USD1094321S1 (en) | 2025-09-23 | 
| Application Number | Title | Priority Date | Filing Date | 
|---|---|---|---|
| US29/888,141ActiveUSD1094321S1 (en) | 2022-10-20 | 2023-03-28 | Susceptor cover | 
| Country | Link | 
|---|---|
| US (1) | USD1094321S1 (en) | 
| JP (1) | JP1741172S (en) | 
| Publication number | Priority date | Publication date | Assignee | Title | 
|---|---|---|---|---|
| JP1741172S (en)* | 2022-10-20 | 2023-04-06 | Susceptor cover | |
| JP1745873S (en)* | 2022-10-20 | 2023-06-08 | Susceptor | |
| JP1741174S (en)* | 2022-10-20 | 2023-04-06 | Susceptor | |
| JP1746407S (en)* | 2023-01-11 | 2023-06-15 | Susceptor | |
| JP1746405S (en) | 2023-01-11 | 2023-06-15 | Susceptor cover | |
| JP1746406S (en)* | 2023-01-11 | 2023-06-15 | Susceptor unit | 
| Publication number | Priority date | Publication date | Assignee | Title | 
|---|---|---|---|---|
| US4978567A (en)* | 1988-03-31 | 1990-12-18 | Materials Technology Corporation, Subsidiary Of The Carbon/Graphite Group, Inc. | Wafer holding fixture for chemical reaction processes in rapid thermal processing equipment and method for making same | 
| US5304248A (en)* | 1990-12-05 | 1994-04-19 | Applied Materials, Inc. | Passive shield for CVD wafer processing which provides frontside edge exclusion and prevents backside depositions | 
| US5584936A (en)* | 1995-12-14 | 1996-12-17 | Cvd, Incorporated | Susceptor for semiconductor wafer processing | 
| US5840124A (en)* | 1997-06-30 | 1998-11-24 | Emcore Corporation | Wafer carrier with flexible wafer flat holder | 
| USD404370S (en)* | 1997-08-20 | 1999-01-19 | Tokyo Electron Limited | Cap for use in a semiconductor wafer heat processing apparatus | 
| US6214122B1 (en)* | 1997-03-17 | 2001-04-10 | Motorola, Inc. | Rapid thermal processing susceptor | 
| US20030085223A1 (en)* | 2001-09-28 | 2003-05-08 | Neilson Zeng | Patterned microwave susceptor element and microwave container incorporating same | 
| US20040011293A1 (en)* | 2002-07-16 | 2004-01-22 | International Business Machines Corporation | Susceptor pocket with beveled projection sidewall | 
| US6815352B1 (en)* | 1999-11-09 | 2004-11-09 | Shin-Etsu Chemical Co., Ltd. | Silicon focus ring and method for producing the same | 
| US20050152089A1 (en)* | 2003-12-26 | 2005-07-14 | Ngk Insulators, Ltd. | Electrostatic chuck and manufacturing method for the same, and alumina sintered member and manufacturing method for the same | 
| US20050217585A1 (en)* | 2004-04-01 | 2005-10-06 | Blomiley Eric R | Substrate susceptor for receiving a substrate to be deposited upon | 
| US20050223994A1 (en)* | 2004-04-08 | 2005-10-13 | Blomiley Eric R | Substrate susceptors for receiving semiconductor substrates to be deposited upon and methods of depositing materials over semiconductor substrates | 
| US20050284372A1 (en)* | 2004-06-28 | 2005-12-29 | Applied Materials, Inc. | Chamber component having grooved surface with depressions | 
| US20060057826A1 (en)* | 2002-12-09 | 2006-03-16 | Koninklijke Philips Electronics N.V. | System and method for suppression of wafer temperature drift in cold-wall cvd systems | 
| US20070144442A1 (en)* | 2005-12-22 | 2007-06-28 | Kyocera Corporation | Susceptor | 
| USD548705S1 (en)* | 2005-09-29 | 2007-08-14 | Tokyo Electron Limited | Attracting disc for an electrostatic chuck for semiconductor production | 
| USD557226S1 (en)* | 2005-08-25 | 2007-12-11 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus | 
| USD559993S1 (en)* | 2005-03-30 | 2008-01-15 | Tokyo Electron Limited | Cover ring | 
| USD559994S1 (en)* | 2005-03-30 | 2008-01-15 | Tokyo Electron Limited | Cover ring | 
| US7459057B2 (en)* | 1998-05-15 | 2008-12-02 | Applied Materials, Inc. | Substrate retainer | 
| US20090050272A1 (en)* | 2007-08-24 | 2009-02-26 | Applied Materials, Inc. | Deposition ring and cover ring to extend process components life and performance for process chambers | 
| US20090269490A1 (en)* | 2008-04-25 | 2009-10-29 | Yoshikazu Moriyama | Coating apparatus and coating method | 
| US20100044974A1 (en)* | 2008-08-19 | 2010-02-25 | Lam Research Corporation | Edge rings for electrostatic chucks | 
| US20100098519A1 (en)* | 2008-10-17 | 2010-04-22 | Memc Electronic Materials, Inc. | Support for a semiconductor wafer in a high temperature environment | 
| USD646764S1 (en)* | 2010-11-04 | 2011-10-11 | Faster S.P.A. | Sealing gasket | 
| US20120263569A1 (en)* | 2011-04-14 | 2012-10-18 | Scott Wayne Priddy | Substrate holders and methods of substrate mounting | 
| US20140113458A1 (en)* | 2012-10-24 | 2014-04-24 | Applied Materials, Inc. | Minimal contact edge ring for rapid thermal processing | 
| USD709537S1 (en)* | 2011-09-30 | 2014-07-22 | Tokyo Electron Limited | Focusing ring | 
| USD709538S1 (en)* | 2011-09-30 | 2014-07-22 | Tokyo Electron Limited | Focusing ring | 
| USD709536S1 (en)* | 2011-09-30 | 2014-07-22 | Tokyo Electron Limited | Focusing ring | 
| USD709539S1 (en)* | 2011-09-30 | 2014-07-22 | Tokyo Electron Limited | Focusing ring | 
| US20140262193A1 (en)* | 2013-03-13 | 2014-09-18 | Techest Co., Ltd. | Edge ring cooling module for semi-conductor manufacture chuck | 
| US20150041314A1 (en)* | 2012-03-29 | 2015-02-12 | Kyocera Corporation | Annular member and film-forming device in which same is used | 
| USD724553S1 (en)* | 2013-09-13 | 2015-03-17 | Asm Ip Holding B.V. | Substrate supporter for semiconductor deposition apparatus | 
| US20150368829A1 (en)* | 2014-06-23 | 2015-12-24 | Applied Materials, Inc. | Substrate thermal control in an epi chamber | 
| US20160083840A1 (en)* | 2014-09-24 | 2016-03-24 | Applied Materials, Inc. | Graphite susceptor | 
| US20160133504A1 (en)* | 2014-11-12 | 2016-05-12 | Applied Materials, Inc. | Susceptor design to reduce edge thermal peak | 
| US9376752B2 (en)* | 2012-04-06 | 2016-06-28 | Applied Materials, Inc. | Edge ring for a deposition chamber | 
| US20160240398A1 (en)* | 2015-02-12 | 2016-08-18 | Hermes-Epitek Corporation | Wafer Holder | 
| USD767234S1 (en)* | 2015-03-02 | 2016-09-20 | Entegris, Inc. | Wafer support ring | 
| USD770992S1 (en)* | 2015-06-12 | 2016-11-08 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus | 
| USD783922S1 (en)* | 2014-12-08 | 2017-04-11 | Entegris, Inc. | Wafer support ring | 
| US20170117228A1 (en)* | 2015-10-27 | 2017-04-27 | Siltronic Ag | Susceptor for holding a semiconductor wafer having an orientation notch, a method for depositing a layer on a semiconductor wafer, and semiconductor wafer | 
| USD796012S1 (en)* | 2015-02-26 | 2017-08-29 | Toyoda Gosei Co., Ltd. | Gasket | 
| USD810705S1 (en)* | 2016-04-01 | 2018-02-20 | Veeco Instruments Inc. | Self-centering wafer carrier for chemical vapor deposition | 
| US20180144969A1 (en)* | 2016-11-18 | 2018-05-24 | Applied Materials, Inc. | Hybrid substrate carrier | 
| US20180155838A1 (en)* | 2016-12-03 | 2018-06-07 | Applied Materials, Inc. | Process kit design for in-chamber heater and wafer rotating mechanism | 
| USD830981S1 (en)* | 2017-04-07 | 2018-10-16 | Asm Ip Holding B.V. | Susceptor for semiconductor substrate processing apparatus | 
| USD840364S1 (en)* | 2017-01-31 | 2019-02-12 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus | 
| USD861757S1 (en)* | 2015-12-28 | 2019-10-01 | Ntn Corporation | Inner ring for tapered roller bearing | 
| USD870314S1 (en)* | 2017-08-31 | 2019-12-17 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus | 
| USD871609S1 (en)* | 2017-08-31 | 2019-12-31 | Hitachi High-Technologies Corporation | Electrode plate peripheral ring for a plasma processing apparatus | 
| USD876504S1 (en)* | 2017-04-03 | 2020-02-25 | Asm Ip Holding B.V. | Exhaust flow control ring for semiconductor deposition apparatus | 
| USD888903S1 (en)* | 2018-12-17 | 2020-06-30 | Applied Materials, Inc. | Deposition ring for physical vapor deposition chamber | 
| US20210066113A1 (en)* | 2017-09-07 | 2021-03-04 | Showa Denko K.K. | Susceptor, cvd apparatus, and method for manufacturing epitaxial wafer | 
| US20210202294A1 (en)* | 2019-12-26 | 2021-07-01 | Showa Denko K.K. | Susceptor | 
| US20210225688A1 (en)* | 2020-01-21 | 2021-07-22 | Asm Ip Holding B.V. | Susceptor with sidewall humps for uniform deposition | 
| JP1692954S (en)* | 2020-12-10 | 2021-08-16 | ||
| USD933725S1 (en)* | 2019-02-08 | 2021-10-19 | Applied Materials, Inc. | Deposition ring for a substrate processing chamber | 
| USD933619S1 (en)* | 2018-10-12 | 2021-10-19 | Valqua, Ltd. | Seal member for semiconductor production apparatus | 
| US20210375663A1 (en)* | 2018-10-04 | 2021-12-02 | Toyo Tanso Co., Ltd. | Susceptor | 
| US20210375591A1 (en)* | 2018-04-20 | 2021-12-02 | Lam Research Corporation | Edge exclusion control | 
| US20220013337A1 (en)* | 2020-07-08 | 2022-01-13 | Taiwan Semiconductor Manufacturing Company Limited | Plasma etcher edge ring with a chamfer geometry and impedance design | 
| JP1711119S (en) | 2021-10-22 | 2022-03-29 | Susceptoring | |
| JP1711120S (en) | 2021-10-22 | 2022-03-29 | Suceptor cover | |
| USD948463S1 (en)* | 2018-10-24 | 2022-04-12 | Asm Ip Holding B.V. | Susceptor for semiconductor substrate supporting apparatus | 
| US20220246462A1 (en)* | 2019-04-16 | 2022-08-04 | Tokai Carbon Korea Co., Ltd | Sic edge ring | 
| US11469118B2 (en)* | 2017-06-13 | 2022-10-11 | Ngk Insulators, Ltd. | Member for semiconductor manufacturing apparatus | 
| US20220361300A1 (en)* | 2021-05-10 | 2022-11-10 | The Boeing Company | Induction-heating system including a susceptor for generating induction heating below a selected curie temperature | 
| US20220380263A1 (en)* | 2020-02-12 | 2022-12-01 | Skc Solmics Co., Ltd. | Ceramic component and plasma etching apparatus comprising same | 
| US20220399190A1 (en)* | 2021-06-10 | 2022-12-15 | Ngk Insulators, Ltd. | Focus ring placement table | 
| JP1741172S (en)* | 2022-10-20 | 2023-04-06 | Susceptor cover | |
| JP1741174S (en)* | 2022-10-20 | 2023-04-06 | Susceptor | |
| JP1741176S (en)* | 2022-10-20 | 2023-04-06 | Cover base for susceptor | |
| USD992614S1 (en)* | 2018-12-06 | 2023-07-18 | Tokyo Electron Limited | Focus ring | 
| USD992615S1 (en)* | 2018-12-07 | 2023-07-18 | Tokyo Electron Limited | Focus ring | 
| USD1016761S1 (en)* | 2020-12-10 | 2024-03-05 | Nuflare Technology, Inc. | Top plate for semiconductor manufacturaing equipment | 
| US20240145281A1 (en)* | 2022-10-27 | 2024-05-02 | Applied Materials, Inc. | Detection and analysis of substrate support and pre-heat ring in a process chamber via imaging | 
| USD1034493S1 (en)* | 2022-11-25 | 2024-07-09 | Ap Systems Inc. | Chamber wall liner for a semiconductor manufacturing apparatus | 
| USD1034491S1 (en)* | 2020-07-27 | 2024-07-09 | Applied Materials, Inc. | Edge ring | 
| US20240258154A1 (en)* | 2023-02-01 | 2024-08-01 | Asm Ip Holding B.V. | Method, assembly and system for film deposition and control | 
| USD1038049S1 (en)* | 2020-11-18 | 2024-08-06 | Applied Materials, Inc. | Cover ring for use in semiconductor processing chamber | 
| US20240282618A1 (en)* | 2023-02-20 | 2024-08-22 | Kioxia Corporation | Jig, semiconductor manufacturing apparatus, and method of operating semiconductor manufacturing apparatus | 
| USD1040304S1 (en)* | 2018-12-17 | 2024-08-27 | Applied Materials, Inc. | Deposition ring for physical vapor deposition chamber | 
| USD1049067S1 (en)* | 2022-04-04 | 2024-10-29 | Applied Materials, Inc. | Ring for an anti-rotation process kit for a substrate processing chamber | 
| USD1053230S1 (en)* | 2022-05-19 | 2024-12-03 | Applied Materials, Inc. | Sputter target for a physical vapor deposition chamber | 
| USD1069054S1 (en)* | 2022-08-08 | 2025-04-01 | As America, Inc. | Gasket | 
| Publication number | Priority date | Publication date | Assignee | Title | 
|---|---|---|---|---|
| US4978567A (en)* | 1988-03-31 | 1990-12-18 | Materials Technology Corporation, Subsidiary Of The Carbon/Graphite Group, Inc. | Wafer holding fixture for chemical reaction processes in rapid thermal processing equipment and method for making same | 
| US5304248A (en)* | 1990-12-05 | 1994-04-19 | Applied Materials, Inc. | Passive shield for CVD wafer processing which provides frontside edge exclusion and prevents backside depositions | 
| US5584936A (en)* | 1995-12-14 | 1996-12-17 | Cvd, Incorporated | Susceptor for semiconductor wafer processing | 
| US6214122B1 (en)* | 1997-03-17 | 2001-04-10 | Motorola, Inc. | Rapid thermal processing susceptor | 
| US5840124A (en)* | 1997-06-30 | 1998-11-24 | Emcore Corporation | Wafer carrier with flexible wafer flat holder | 
| USD404370S (en)* | 1997-08-20 | 1999-01-19 | Tokyo Electron Limited | Cap for use in a semiconductor wafer heat processing apparatus | 
| US7459057B2 (en)* | 1998-05-15 | 2008-12-02 | Applied Materials, Inc. | Substrate retainer | 
| US6815352B1 (en)* | 1999-11-09 | 2004-11-09 | Shin-Etsu Chemical Co., Ltd. | Silicon focus ring and method for producing the same | 
| US20030085223A1 (en)* | 2001-09-28 | 2003-05-08 | Neilson Zeng | Patterned microwave susceptor element and microwave container incorporating same | 
| US20040011293A1 (en)* | 2002-07-16 | 2004-01-22 | International Business Machines Corporation | Susceptor pocket with beveled projection sidewall | 
| US20060057826A1 (en)* | 2002-12-09 | 2006-03-16 | Koninklijke Philips Electronics N.V. | System and method for suppression of wafer temperature drift in cold-wall cvd systems | 
| US20050152089A1 (en)* | 2003-12-26 | 2005-07-14 | Ngk Insulators, Ltd. | Electrostatic chuck and manufacturing method for the same, and alumina sintered member and manufacturing method for the same | 
| US20050217585A1 (en)* | 2004-04-01 | 2005-10-06 | Blomiley Eric R | Substrate susceptor for receiving a substrate to be deposited upon | 
| US20050223994A1 (en)* | 2004-04-08 | 2005-10-13 | Blomiley Eric R | Substrate susceptors for receiving semiconductor substrates to be deposited upon and methods of depositing materials over semiconductor substrates | 
| US20050284372A1 (en)* | 2004-06-28 | 2005-12-29 | Applied Materials, Inc. | Chamber component having grooved surface with depressions | 
| USD559993S1 (en)* | 2005-03-30 | 2008-01-15 | Tokyo Electron Limited | Cover ring | 
| USD559994S1 (en)* | 2005-03-30 | 2008-01-15 | Tokyo Electron Limited | Cover ring | 
| USD557226S1 (en)* | 2005-08-25 | 2007-12-11 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus | 
| USD548705S1 (en)* | 2005-09-29 | 2007-08-14 | Tokyo Electron Limited | Attracting disc for an electrostatic chuck for semiconductor production | 
| US20070144442A1 (en)* | 2005-12-22 | 2007-06-28 | Kyocera Corporation | Susceptor | 
| US20090050272A1 (en)* | 2007-08-24 | 2009-02-26 | Applied Materials, Inc. | Deposition ring and cover ring to extend process components life and performance for process chambers | 
| US20090269490A1 (en)* | 2008-04-25 | 2009-10-29 | Yoshikazu Moriyama | Coating apparatus and coating method | 
| US20100044974A1 (en)* | 2008-08-19 | 2010-02-25 | Lam Research Corporation | Edge rings for electrostatic chucks | 
| US20100098519A1 (en)* | 2008-10-17 | 2010-04-22 | Memc Electronic Materials, Inc. | Support for a semiconductor wafer in a high temperature environment | 
| USD646764S1 (en)* | 2010-11-04 | 2011-10-11 | Faster S.P.A. | Sealing gasket | 
| US20120263569A1 (en)* | 2011-04-14 | 2012-10-18 | Scott Wayne Priddy | Substrate holders and methods of substrate mounting | 
| USD709537S1 (en)* | 2011-09-30 | 2014-07-22 | Tokyo Electron Limited | Focusing ring | 
| USD709538S1 (en)* | 2011-09-30 | 2014-07-22 | Tokyo Electron Limited | Focusing ring | 
| USD709536S1 (en)* | 2011-09-30 | 2014-07-22 | Tokyo Electron Limited | Focusing ring | 
| USD709539S1 (en)* | 2011-09-30 | 2014-07-22 | Tokyo Electron Limited | Focusing ring | 
| US20150041314A1 (en)* | 2012-03-29 | 2015-02-12 | Kyocera Corporation | Annular member and film-forming device in which same is used | 
| US9376752B2 (en)* | 2012-04-06 | 2016-06-28 | Applied Materials, Inc. | Edge ring for a deposition chamber | 
| US20140113458A1 (en)* | 2012-10-24 | 2014-04-24 | Applied Materials, Inc. | Minimal contact edge ring for rapid thermal processing | 
| US9558982B2 (en)* | 2012-10-24 | 2017-01-31 | Applied Materials, Inc. | Minimal contact edge ring for rapid thermal processing | 
| US20140262193A1 (en)* | 2013-03-13 | 2014-09-18 | Techest Co., Ltd. | Edge ring cooling module for semi-conductor manufacture chuck | 
| USD724553S1 (en)* | 2013-09-13 | 2015-03-17 | Asm Ip Holding B.V. | Substrate supporter for semiconductor deposition apparatus | 
| US20150368829A1 (en)* | 2014-06-23 | 2015-12-24 | Applied Materials, Inc. | Substrate thermal control in an epi chamber | 
| US20160083840A1 (en)* | 2014-09-24 | 2016-03-24 | Applied Materials, Inc. | Graphite susceptor | 
| US20160133504A1 (en)* | 2014-11-12 | 2016-05-12 | Applied Materials, Inc. | Susceptor design to reduce edge thermal peak | 
| USD783922S1 (en)* | 2014-12-08 | 2017-04-11 | Entegris, Inc. | Wafer support ring | 
| US20160240398A1 (en)* | 2015-02-12 | 2016-08-18 | Hermes-Epitek Corporation | Wafer Holder | 
| USD796012S1 (en)* | 2015-02-26 | 2017-08-29 | Toyoda Gosei Co., Ltd. | Gasket | 
| USD767234S1 (en)* | 2015-03-02 | 2016-09-20 | Entegris, Inc. | Wafer support ring | 
| USD770992S1 (en)* | 2015-06-12 | 2016-11-08 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus | 
| US20170117228A1 (en)* | 2015-10-27 | 2017-04-27 | Siltronic Ag | Susceptor for holding a semiconductor wafer having an orientation notch, a method for depositing a layer on a semiconductor wafer, and semiconductor wafer | 
| US11380621B2 (en)* | 2015-10-27 | 2022-07-05 | Siltronic Ag | Susceptor for holding a semiconductor wafer having an orientation notch, a method for depositing a layer on a semiconductor wafer, and semiconductor wafer | 
| USD861757S1 (en)* | 2015-12-28 | 2019-10-01 | Ntn Corporation | Inner ring for tapered roller bearing | 
| USD810705S1 (en)* | 2016-04-01 | 2018-02-20 | Veeco Instruments Inc. | Self-centering wafer carrier for chemical vapor deposition | 
| US20180144969A1 (en)* | 2016-11-18 | 2018-05-24 | Applied Materials, Inc. | Hybrid substrate carrier | 
| US20180155838A1 (en)* | 2016-12-03 | 2018-06-07 | Applied Materials, Inc. | Process kit design for in-chamber heater and wafer rotating mechanism | 
| USD840364S1 (en)* | 2017-01-31 | 2019-02-12 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus | 
| USD876504S1 (en)* | 2017-04-03 | 2020-02-25 | Asm Ip Holding B.V. | Exhaust flow control ring for semiconductor deposition apparatus | 
| USD830981S1 (en)* | 2017-04-07 | 2018-10-16 | Asm Ip Holding B.V. | Susceptor for semiconductor substrate processing apparatus | 
| US11469118B2 (en)* | 2017-06-13 | 2022-10-11 | Ngk Insulators, Ltd. | Member for semiconductor manufacturing apparatus | 
| USD870314S1 (en)* | 2017-08-31 | 2019-12-17 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus | 
| USD871609S1 (en)* | 2017-08-31 | 2019-12-31 | Hitachi High-Technologies Corporation | Electrode plate peripheral ring for a plasma processing apparatus | 
| US20210066113A1 (en)* | 2017-09-07 | 2021-03-04 | Showa Denko K.K. | Susceptor, cvd apparatus, and method for manufacturing epitaxial wafer | 
| US20210375591A1 (en)* | 2018-04-20 | 2021-12-02 | Lam Research Corporation | Edge exclusion control | 
| US20210375663A1 (en)* | 2018-10-04 | 2021-12-02 | Toyo Tanso Co., Ltd. | Susceptor | 
| USD933619S1 (en)* | 2018-10-12 | 2021-10-19 | Valqua, Ltd. | Seal member for semiconductor production apparatus | 
| USD948463S1 (en)* | 2018-10-24 | 2022-04-12 | Asm Ip Holding B.V. | Susceptor for semiconductor substrate supporting apparatus | 
| USD992614S1 (en)* | 2018-12-06 | 2023-07-18 | Tokyo Electron Limited | Focus ring | 
| USD992615S1 (en)* | 2018-12-07 | 2023-07-18 | Tokyo Electron Limited | Focus ring | 
| USD1040304S1 (en)* | 2018-12-17 | 2024-08-27 | Applied Materials, Inc. | Deposition ring for physical vapor deposition chamber | 
| USD888903S1 (en)* | 2018-12-17 | 2020-06-30 | Applied Materials, Inc. | Deposition ring for physical vapor deposition chamber | 
| USD933725S1 (en)* | 2019-02-08 | 2021-10-19 | Applied Materials, Inc. | Deposition ring for a substrate processing chamber | 
| US20220246462A1 (en)* | 2019-04-16 | 2022-08-04 | Tokai Carbon Korea Co., Ltd | Sic edge ring | 
| US20210202294A1 (en)* | 2019-12-26 | 2021-07-01 | Showa Denko K.K. | Susceptor | 
| US20210225688A1 (en)* | 2020-01-21 | 2021-07-22 | Asm Ip Holding B.V. | Susceptor with sidewall humps for uniform deposition | 
| US20220380263A1 (en)* | 2020-02-12 | 2022-12-01 | Skc Solmics Co., Ltd. | Ceramic component and plasma etching apparatus comprising same | 
| US20220013337A1 (en)* | 2020-07-08 | 2022-01-13 | Taiwan Semiconductor Manufacturing Company Limited | Plasma etcher edge ring with a chamfer geometry and impedance design | 
| USD1034491S1 (en)* | 2020-07-27 | 2024-07-09 | Applied Materials, Inc. | Edge ring | 
| USD1038049S1 (en)* | 2020-11-18 | 2024-08-06 | Applied Materials, Inc. | Cover ring for use in semiconductor processing chamber | 
| USD1016761S1 (en)* | 2020-12-10 | 2024-03-05 | Nuflare Technology, Inc. | Top plate for semiconductor manufacturaing equipment | 
| JP1692954S (en)* | 2020-12-10 | 2021-08-16 | ||
| US20220361300A1 (en)* | 2021-05-10 | 2022-11-10 | The Boeing Company | Induction-heating system including a susceptor for generating induction heating below a selected curie temperature | 
| US20220399190A1 (en)* | 2021-06-10 | 2022-12-15 | Ngk Insulators, Ltd. | Focus ring placement table | 
| USD1047884S1 (en)* | 2021-10-22 | 2024-10-22 | Nuflare Technology, Inc. | Susceptor cover | 
| JP1711120S (en) | 2021-10-22 | 2022-03-29 | Suceptor cover | |
| USD1037186S1 (en)* | 2021-10-22 | 2024-07-30 | Nuflare Technology, Inc. | Susceptor ring | 
| JP1711119S (en) | 2021-10-22 | 2022-03-29 | Susceptoring | |
| USD1049067S1 (en)* | 2022-04-04 | 2024-10-29 | Applied Materials, Inc. | Ring for an anti-rotation process kit for a substrate processing chamber | 
| USD1053230S1 (en)* | 2022-05-19 | 2024-12-03 | Applied Materials, Inc. | Sputter target for a physical vapor deposition chamber | 
| USD1069054S1 (en)* | 2022-08-08 | 2025-04-01 | As America, Inc. | Gasket | 
| JP1741172S (en)* | 2022-10-20 | 2023-04-06 | Susceptor cover | |
| JP1741176S (en)* | 2022-10-20 | 2023-04-06 | Cover base for susceptor | |
| JP1741174S (en)* | 2022-10-20 | 2023-04-06 | Susceptor | |
| US20240145281A1 (en)* | 2022-10-27 | 2024-05-02 | Applied Materials, Inc. | Detection and analysis of substrate support and pre-heat ring in a process chamber via imaging | 
| USD1034493S1 (en)* | 2022-11-25 | 2024-07-09 | Ap Systems Inc. | Chamber wall liner for a semiconductor manufacturing apparatus | 
| US20240258154A1 (en)* | 2023-02-01 | 2024-08-01 | Asm Ip Holding B.V. | Method, assembly and system for film deposition and control | 
| US20240282618A1 (en)* | 2023-02-20 | 2024-08-22 | Kioxia Corporation | Jig, semiconductor manufacturing apparatus, and method of operating semiconductor manufacturing apparatus | 
| Title | 
|---|
| Semicorex susceptor,Date Jun. 10, 2023 [online], [retrieved May 16, 2025],https://www.semicorex.com/products/Wafer-Susceptor.html (Year: 2023).* | 
| Vet china mocvd susceptor,Date Mar. 18, 2022 [online], [retrieved May 16, 2025], https://www.youtube.com/watch?v=T8YC8b84DOQ (Year: 2022).* | 
| Vet china susceptor,Date Apr. 12, 2020 [online], [retrieved May 16, 2025], https://www.youtube.com/watch?v=iAVM00Q3zKc (Year: 2020).* | 
| Publication number | Publication date | 
|---|---|
| JP1741172S (en) | 2023-04-06 | 
| Publication | Publication Date | Title | 
|---|---|---|
| USD1096676S1 (en) | Cover base for susceptors | |
| USD1094322S1 (en) | Susceptor | |
| USD1094321S1 (en) | Susceptor cover | |
| USD1047884S1 (en) | Susceptor cover | |
| USD980205S1 (en) | Phone case | |
| USD1094320S1 (en) | Susceptor | |
| USD1030687S1 (en) | Susceptor | |
| USD1095473S1 (en) | Susceptor | |
| USD1082731S1 (en) | Susceptor | |
| USD1094323S1 (en) | Susceptor unit | |
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| Date | Code | Title | Description | 
|---|---|---|---|
| FEPP | Fee payment procedure | Free format text:ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |