| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021-021414D | 2021-10-01 | ||
| JP2021021414FJP1713190S (en) | 2021-10-01 | 2021-10-01 |
| Publication Number | Publication Date |
|---|---|
| USD1086086S1true USD1086086S1 (en) | 2025-07-29 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/832,777ActiveUSD1086086S1 (en) | 2021-10-01 | 2022-03-30 | Separator of substrate processing apparatus |
| Country | Link |
|---|---|
| US (1) | USD1086086S1 (en) |
| JP (1) | JP1713190S (en) |
| TW (1) | TWD230582S (en) |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6231038B1 (en)* | 1998-12-01 | 2001-05-15 | Greene Tweed Of Delaware, Inc. | Two-piece clamp ring for holding semiconductor wafer or other workpiece |
| US7484958B2 (en)* | 2003-07-16 | 2009-02-03 | Shin-Etsu Handotai Co., Ltd. | Vertical boat for heat treatment and method for producing the same |
| US20090197424A1 (en)* | 2008-01-31 | 2009-08-06 | Hitachi Kokusai Electric Inc. | Substrate processing apparatus and method for manufacturing semiconductor device |
| USD616392S1 (en)* | 2009-03-06 | 2010-05-25 | Tokyo Electron Limited | Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers |
| US8028978B2 (en)* | 1996-07-15 | 2011-10-04 | Semitool, Inc. | Wafer handling system |
| USD734730S1 (en)* | 2012-12-27 | 2015-07-21 | Hitachi Kokusai Electric Inc. | Boat of substrate processing apparatus |
| USD739831S1 (en)* | 2013-03-22 | 2015-09-29 | Hitachi Kokusai Electric Inc. | Boat for substrate processing apparatus |
| USD740769S1 (en)* | 2013-03-22 | 2015-10-13 | Hitachi Kokusai Electric Inc. | Boat for substrate processing apparatus |
| US20170073813A1 (en)* | 2015-09-11 | 2017-03-16 | Eugene Technology Co., Ltd. | Substrate processing apparatus |
| USD824440S1 (en)* | 2016-02-12 | 2018-07-31 | Hitachi Kokusai Electric Inc. | Heater of substrate processing apparatus |
| USD839219S1 (en)* | 2016-02-12 | 2019-01-29 | Kokusai Electric Corporation | Boat for substrate processing apparatus |
| USD846514S1 (en)* | 2018-05-03 | 2019-04-23 | Kokusai Electric Corporation | Boat of substrate processing apparatus |
| US20200152490A1 (en)* | 2016-07-26 | 2020-05-14 | Kokusai Electric Corporation | Heating element, substrate processing apparatus, and method of manufacturing semiconductor device |
| US10840118B2 (en)* | 2015-10-27 | 2020-11-17 | Eugene Technology Co., Ltd. | Substrate processing apparatus and method for assembling tube assembly |
| US20210207268A1 (en)* | 2018-09-20 | 2021-07-08 | Kokusai Electric Corporation | Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording medium |
| USD981970S1 (en)* | 2021-03-04 | 2023-03-28 | Kokusai Electric Corporation | Substrate mounting plate for substrate processing apparatus |
| USD982537S1 (en)* | 2021-03-15 | 2023-04-04 | Kokusai Electric Corporation | Separator of substrate processing apparatus |
| USD1023959S1 (en)* | 2021-05-11 | 2024-04-23 | Asm Ip Holding B.V. | Electrode for substrate processing apparatus |
| USD1070797S1 (en)* | 2022-03-15 | 2025-04-15 | Kokusai Electric Corporation | Furnace for substrate processing apparatus |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD908103S1 (en) | 2019-02-20 | 2021-01-19 | Veeco Instruments Inc. | Transportable semiconductor wafer rack |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8028978B2 (en)* | 1996-07-15 | 2011-10-04 | Semitool, Inc. | Wafer handling system |
| US6231038B1 (en)* | 1998-12-01 | 2001-05-15 | Greene Tweed Of Delaware, Inc. | Two-piece clamp ring for holding semiconductor wafer or other workpiece |
| US7484958B2 (en)* | 2003-07-16 | 2009-02-03 | Shin-Etsu Handotai Co., Ltd. | Vertical boat for heat treatment and method for producing the same |
| US20090197424A1 (en)* | 2008-01-31 | 2009-08-06 | Hitachi Kokusai Electric Inc. | Substrate processing apparatus and method for manufacturing semiconductor device |
| USD616392S1 (en)* | 2009-03-06 | 2010-05-25 | Tokyo Electron Limited | Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers |
| USD734730S1 (en)* | 2012-12-27 | 2015-07-21 | Hitachi Kokusai Electric Inc. | Boat of substrate processing apparatus |
| USD739831S1 (en)* | 2013-03-22 | 2015-09-29 | Hitachi Kokusai Electric Inc. | Boat for substrate processing apparatus |
| USD740769S1 (en)* | 2013-03-22 | 2015-10-13 | Hitachi Kokusai Electric Inc. | Boat for substrate processing apparatus |
| US20170073813A1 (en)* | 2015-09-11 | 2017-03-16 | Eugene Technology Co., Ltd. | Substrate processing apparatus |
| US10840118B2 (en)* | 2015-10-27 | 2020-11-17 | Eugene Technology Co., Ltd. | Substrate processing apparatus and method for assembling tube assembly |
| USD824440S1 (en)* | 2016-02-12 | 2018-07-31 | Hitachi Kokusai Electric Inc. | Heater of substrate processing apparatus |
| USD839219S1 (en)* | 2016-02-12 | 2019-01-29 | Kokusai Electric Corporation | Boat for substrate processing apparatus |
| US20200152490A1 (en)* | 2016-07-26 | 2020-05-14 | Kokusai Electric Corporation | Heating element, substrate processing apparatus, and method of manufacturing semiconductor device |
| USD846514S1 (en)* | 2018-05-03 | 2019-04-23 | Kokusai Electric Corporation | Boat of substrate processing apparatus |
| US20210207268A1 (en)* | 2018-09-20 | 2021-07-08 | Kokusai Electric Corporation | Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording medium |
| USD981970S1 (en)* | 2021-03-04 | 2023-03-28 | Kokusai Electric Corporation | Substrate mounting plate for substrate processing apparatus |
| USD982537S1 (en)* | 2021-03-15 | 2023-04-04 | Kokusai Electric Corporation | Separator of substrate processing apparatus |
| USD1023959S1 (en)* | 2021-05-11 | 2024-04-23 | Asm Ip Holding B.V. | Electrode for substrate processing apparatus |
| USD1070797S1 (en)* | 2022-03-15 | 2025-04-15 | Kokusai Electric Corporation | Furnace for substrate processing apparatus |
| Publication number | Publication date |
|---|---|
| JP1713190S (en) | 2022-04-21 |
| TWD230582S (en) | 2024-04-01 |
| Publication | Publication Date | Title |
|---|---|---|
| USD927110S1 (en) | Handheld vacuum cleaner | |
| USD926399S1 (en) | Vacuum machine | |
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| Date | Code | Title | Description |
|---|---|---|---|
| FEPP | Fee payment procedure | Free format text:ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |