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USD1086086S1 - Separator of substrate processing apparatus - Google Patents

Separator of substrate processing apparatus

Info

Publication number
USD1086086S1
USD1086086S1US29/832,777US202229832777FUSD1086086SUS D1086086 S1USD1086086 S1US D1086086S1US 202229832777 FUS202229832777 FUS 202229832777FUS D1086086 SUSD1086086 SUS D1086086S
Authority
US
United States
Prior art keywords
separator
processing apparatus
substrate processing
view
elevational view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/832,777
Inventor
Yusaku OKAJIMA
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kokusai Electric Corp
Original Assignee
Kokusai Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kokusai Electric CorpfiledCriticalKokusai Electric Corp
Assigned to Kokusai Electric CorporationreassignmentKokusai Electric CorporationASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).Assignors: OKAJIMA, YUSAKU
Application grantedgrantedCritical
Publication of USD1086086S1publicationCriticalpatent/USD1086086S1/en
Activelegal-statusCriticalCurrent
Anticipated expirationlegal-statusCritical

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Description

FIG.1 is a front, top and right side perspective view of a separator of substrate processing apparatus showing our new design;
FIG.2 is a front elevational view thereof;
FIG.3 is a right side elevational view thereof;
FIG.4 is a left side elevational view thereof;
FIG.5 is a rear elevational view thereof;
FIG.6 is a top plan view thereof;
FIG.7 is a bottom plan view thereof;
FIG.8 is a cross-sectional view taken along line8-8 inFIG.2 thereof; and,
FIG.9 is a cross-sectional view taken along line9-9 inFIG.2.

Claims (1)

    CLAIM
  1. The ornamental design for a separator of substrate processing apparatus, as shown and described.
US29/832,7772021-10-012022-03-30Separator of substrate processing apparatusActiveUSD1086086S1 (en)

Applications Claiming Priority (2)

Application NumberPriority DateFiling DateTitle
JP2021-021414D2021-10-01
JP2021021414FJP1713190S (en)2021-10-012021-10-01

Publications (1)

Publication NumberPublication Date
USD1086086S1true USD1086086S1 (en)2025-07-29

Family

ID=81209963

Family Applications (1)

Application NumberTitlePriority DateFiling Date
US29/832,777ActiveUSD1086086S1 (en)2021-10-012022-03-30Separator of substrate processing apparatus

Country Status (3)

CountryLink
US (1)USD1086086S1 (en)
JP (1)JP1713190S (en)
TW (1)TWD230582S (en)

Citations (19)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US6231038B1 (en)*1998-12-012001-05-15Greene Tweed Of Delaware, Inc.Two-piece clamp ring for holding semiconductor wafer or other workpiece
US7484958B2 (en)*2003-07-162009-02-03Shin-Etsu Handotai Co., Ltd.Vertical boat for heat treatment and method for producing the same
US20090197424A1 (en)*2008-01-312009-08-06Hitachi Kokusai Electric Inc.Substrate processing apparatus and method for manufacturing semiconductor device
USD616392S1 (en)*2009-03-062010-05-25Tokyo Electron LimitedHeat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers
US8028978B2 (en)*1996-07-152011-10-04Semitool, Inc.Wafer handling system
USD734730S1 (en)*2012-12-272015-07-21Hitachi Kokusai Electric Inc.Boat of substrate processing apparatus
USD739831S1 (en)*2013-03-222015-09-29Hitachi Kokusai Electric Inc.Boat for substrate processing apparatus
USD740769S1 (en)*2013-03-222015-10-13Hitachi Kokusai Electric Inc.Boat for substrate processing apparatus
US20170073813A1 (en)*2015-09-112017-03-16Eugene Technology Co., Ltd.Substrate processing apparatus
USD824440S1 (en)*2016-02-122018-07-31Hitachi Kokusai Electric Inc.Heater of substrate processing apparatus
USD839219S1 (en)*2016-02-122019-01-29Kokusai Electric CorporationBoat for substrate processing apparatus
USD846514S1 (en)*2018-05-032019-04-23Kokusai Electric CorporationBoat of substrate processing apparatus
US20200152490A1 (en)*2016-07-262020-05-14Kokusai Electric CorporationHeating element, substrate processing apparatus, and method of manufacturing semiconductor device
US10840118B2 (en)*2015-10-272020-11-17Eugene Technology Co., Ltd.Substrate processing apparatus and method for assembling tube assembly
US20210207268A1 (en)*2018-09-202021-07-08Kokusai Electric CorporationSubstrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording medium
USD981970S1 (en)*2021-03-042023-03-28Kokusai Electric CorporationSubstrate mounting plate for substrate processing apparatus
USD982537S1 (en)*2021-03-152023-04-04Kokusai Electric CorporationSeparator of substrate processing apparatus
USD1023959S1 (en)*2021-05-112024-04-23Asm Ip Holding B.V.Electrode for substrate processing apparatus
USD1070797S1 (en)*2022-03-152025-04-15Kokusai Electric CorporationFurnace for substrate processing apparatus

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
USD908103S1 (en)2019-02-202021-01-19Veeco Instruments Inc.Transportable semiconductor wafer rack

Patent Citations (19)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US8028978B2 (en)*1996-07-152011-10-04Semitool, Inc.Wafer handling system
US6231038B1 (en)*1998-12-012001-05-15Greene Tweed Of Delaware, Inc.Two-piece clamp ring for holding semiconductor wafer or other workpiece
US7484958B2 (en)*2003-07-162009-02-03Shin-Etsu Handotai Co., Ltd.Vertical boat for heat treatment and method for producing the same
US20090197424A1 (en)*2008-01-312009-08-06Hitachi Kokusai Electric Inc.Substrate processing apparatus and method for manufacturing semiconductor device
USD616392S1 (en)*2009-03-062010-05-25Tokyo Electron LimitedHeat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers
USD734730S1 (en)*2012-12-272015-07-21Hitachi Kokusai Electric Inc.Boat of substrate processing apparatus
USD739831S1 (en)*2013-03-222015-09-29Hitachi Kokusai Electric Inc.Boat for substrate processing apparatus
USD740769S1 (en)*2013-03-222015-10-13Hitachi Kokusai Electric Inc.Boat for substrate processing apparatus
US20170073813A1 (en)*2015-09-112017-03-16Eugene Technology Co., Ltd.Substrate processing apparatus
US10840118B2 (en)*2015-10-272020-11-17Eugene Technology Co., Ltd.Substrate processing apparatus and method for assembling tube assembly
USD824440S1 (en)*2016-02-122018-07-31Hitachi Kokusai Electric Inc.Heater of substrate processing apparatus
USD839219S1 (en)*2016-02-122019-01-29Kokusai Electric CorporationBoat for substrate processing apparatus
US20200152490A1 (en)*2016-07-262020-05-14Kokusai Electric CorporationHeating element, substrate processing apparatus, and method of manufacturing semiconductor device
USD846514S1 (en)*2018-05-032019-04-23Kokusai Electric CorporationBoat of substrate processing apparatus
US20210207268A1 (en)*2018-09-202021-07-08Kokusai Electric CorporationSubstrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording medium
USD981970S1 (en)*2021-03-042023-03-28Kokusai Electric CorporationSubstrate mounting plate for substrate processing apparatus
USD982537S1 (en)*2021-03-152023-04-04Kokusai Electric CorporationSeparator of substrate processing apparatus
USD1023959S1 (en)*2021-05-112024-04-23Asm Ip Holding B.V.Electrode for substrate processing apparatus
USD1070797S1 (en)*2022-03-152025-04-15Kokusai Electric CorporationFurnace for substrate processing apparatus

Also Published As

Publication numberPublication date
JP1713190S (en)2022-04-21
TWD230582S (en)2024-04-01

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