USD1042373S1 - Sliding ring for an interlocking process kit for a substrate processing chamber - Google Patents
Sliding ring for an interlocking process kit for a substrate processing chamberDownload PDFInfo
- Publication number
- USD1042373S1 USD1042373S1US29/831,295US202229831295FUSD1042373SUS D1042373 S1USD1042373 S1US D1042373S1US 202229831295 FUS202229831295 FUS 202229831295FUS D1042373 SUSD1042373 SUS D1042373S
- Authority
- US
- United States
- Prior art keywords
- processing chamber
- substrate processing
- sliding ring
- process kit
- interlocking process
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Description
Claims (1)
- The ornamental design for a sliding ring for an interlocking process kit for a substrate processing chamber, as shown and described.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US29/831,295USD1042373S1 (en) | 2022-03-18 | 2022-03-18 | Sliding ring for an interlocking process kit for a substrate processing chamber |
| TW111304573FTWD226237S (en) | 2022-03-18 | 2022-09-14 | Sliding ring for an interlocking process kit for a substrate processing chamber |
| JP2022020004FJP1734727S (en) | 2022-03-18 | 2022-09-16 | Sliding ring for substrate processing chamber interlock processing kit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US29/831,295USD1042373S1 (en) | 2022-03-18 | 2022-03-18 | Sliding ring for an interlocking process kit for a substrate processing chamber |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USD1042373S1true USD1042373S1 (en) | 2024-09-17 |
Family
ID=84900708
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/831,295ActiveUSD1042373S1 (en) | 2022-03-18 | 2022-03-18 | Sliding ring for an interlocking process kit for a substrate processing chamber |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | USD1042373S1 (en) |
| JP (1) | JP1734727S (en) |
| TW (1) | TWD226237S (en) |
Citations (74)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD404372S (en) | 1997-08-20 | 1999-01-19 | Tokyo Electron Limited | Ring for use in a semiconductor wafer heat processing apparatus |
| US6068548A (en)* | 1997-12-17 | 2000-05-30 | Intel Corporation | Mechanically stabilized retaining ring for chemical mechanical polishing |
| US20040077167A1 (en)* | 2002-10-11 | 2004-04-22 | Willis George D. | Retaining ring for use on a carrier of a polishing apparatus |
| USD491963S1 (en)* | 2002-11-20 | 2004-06-22 | Tokyo Electron Limited | Inner wall shield for a process chamber for manufacturing semiconductors |
| US20050277375A1 (en)* | 2004-06-10 | 2005-12-15 | Young Richard T | Retaining ring assembly for use in chemical mechanical polishing |
| US20060057826A1 (en) | 2002-12-09 | 2006-03-16 | Koninklijke Philips Electronics N.V. | System and method for suppression of wafer temperature drift in cold-wall cvd systems |
| US7186171B2 (en) | 2005-04-22 | 2007-03-06 | Applied Materials, Inc. | Composite retaining ring |
| US20070113783A1 (en)* | 2005-11-19 | 2007-05-24 | Applied Materials, Inc. | Band shield for substrate processing chamber |
| USD556704S1 (en)* | 2005-08-25 | 2007-12-04 | Hitachi High-Technologies Corporation | Grounded electrode for a plasma processing apparatus |
| USD559994S1 (en) | 2005-03-30 | 2008-01-15 | Tokyo Electron Limited | Cover ring |
| USD559993S1 (en) | 2005-03-30 | 2008-01-15 | Tokyo Electron Limited | Cover ring |
| US20080041820A1 (en) | 2002-09-20 | 2008-02-21 | Lam Research Corporation | Apparatus for reducing polymer deposition on a substrate and substrate support |
| US7459057B2 (en) | 1998-05-15 | 2008-12-02 | Applied Materials, Inc. | Substrate retainer |
| US20090050272A1 (en) | 2007-08-24 | 2009-02-26 | Applied Materials, Inc. | Deposition ring and cover ring to extend process components life and performance for process chambers |
| USD588078S1 (en)* | 2006-06-16 | 2009-03-10 | Tokyo Electron Limited | Heat dissipation deterrence link for semiconductor manufacture |
| USD599827S1 (en) | 2008-05-07 | 2009-09-08 | Komatsu Ltd. | Fan shroud for construction machinery |
| USD633991S1 (en) | 2008-11-26 | 2011-03-08 | Nippon Valqua Industries, Ltd. | Gate valve seal |
| US20110092142A1 (en)* | 2009-10-21 | 2011-04-21 | Frank Jr George J | Retaining Rings |
| USD638522S1 (en) | 2010-07-20 | 2011-05-24 | Wārtsilā Japan Ltd. | Seal ring for stern tube |
| USD655401S1 (en) | 2009-08-10 | 2012-03-06 | Nippon Valqua Industries, Ltd. | Hybrid seal member |
| USD655797S1 (en) | 2010-03-24 | 2012-03-13 | Nippon Valqua Industries, Ltd. | Hybrid seal member |
| US20120263569A1 (en) | 2011-04-14 | 2012-10-18 | Scott Wayne Priddy | Substrate holders and methods of substrate mounting |
| US8491267B2 (en)* | 2010-08-27 | 2013-07-23 | Pratt & Whitney Canada Corp. | Retaining ring arrangement for a rotary assembly |
| US8617672B2 (en) | 2005-07-13 | 2013-12-31 | Applied Materials, Inc. | Localized surface annealing of components for substrate processing chambers |
| USD703160S1 (en)* | 2011-01-27 | 2014-04-22 | Hitachi High-Technologies Corporation | Grounded electrode for a plasma processing apparatus |
| US20140262193A1 (en) | 2013-03-13 | 2014-09-18 | Techest Co., Ltd. | Edge ring cooling module for semi-conductor manufacture chuck |
| USD717746S1 (en)* | 2013-11-06 | 2014-11-18 | Applied Materials, Inc. | Lower chamber liner |
| USD722966S1 (en)* | 2013-08-23 | 2015-02-24 | Bridgeport Fittings, Inc. | Split, non-metallic electrical insulating bushing |
| US20150190835A1 (en) | 2010-08-20 | 2015-07-09 | Applied Materials, Inc. | Extended life deposition ring |
| USD767234S1 (en) | 2015-03-02 | 2016-09-20 | Entegris, Inc. | Wafer support ring |
| USD770992S1 (en) | 2015-06-12 | 2016-11-08 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus |
| USD783922S1 (en) | 2014-12-08 | 2017-04-11 | Entegris, Inc. | Wafer support ring |
| USD799690S1 (en) | 2014-12-22 | 2017-10-10 | Ebara Corporation | Inner cylinder for exhaust gas treatment apparatus |
| USD802545S1 (en)* | 2015-06-12 | 2017-11-14 | Hitachi High-Technologies Corporation | Lower chamber for a plasma processing apparatus |
| USD803917S1 (en) | 2015-06-16 | 2017-11-28 | Hitachi Kokusai Electric, Inc. | Heat reflector for substrate processing apparatus |
| USD804436S1 (en)* | 2015-06-12 | 2017-12-05 | Hitachi High-Technologies Corporation | Upper chamber for a plasma processing apparatus |
| USD804556S1 (en) | 2015-06-16 | 2017-12-05 | Hitachi Kokusai Electric Inc. | Heat reflector for substrate processing apparatus |
| USD812578S1 (en)* | 2016-02-26 | 2018-03-13 | Hitachi High-Technologies Corporation | Upper chamber for a plasma processing apparatus |
| USD821552S1 (en) | 2016-11-29 | 2018-06-26 | Nippon Valqua Industries, Ltd. | Composite seal |
| USD822181S1 (en) | 2016-11-29 | 2018-07-03 | Nippon Valqua Industries, Ltd. | Composite seal |
| USD862404S1 (en) | 2016-10-25 | 2019-10-08 | Kokusai Electric Corporation | Sealing material ring for a semiconductor manufacturing apparatus |
| JP1644757S (en) | 2018-12-14 | 2019-11-05 | ||
| US20190362949A1 (en) | 2018-05-28 | 2019-11-28 | Applied Materials, Inc. | Process kit with adjustable tuning ring for edge uniformity control |
| USD871561S1 (en) | 2017-11-17 | 2019-12-31 | Valqua, Ltd. | Seal member for use in semiconductor production apparatus |
| USD871608S1 (en) | 2017-07-31 | 2019-12-31 | Hitachi High-Technologies Corporation | Gas ring for a plasma processing apparatus |
| US20200090915A1 (en) | 2017-06-01 | 2020-03-19 | Oerlikon Surface Solutions Ag, Pfäffikon | Target assembly for safe and economic evaporation of brittle materials |
| USD885444S1 (en) | 2017-12-19 | 2020-05-26 | Valqua, Ltd. | Seal member for use in semiconductor production apparatus |
| USD885443S1 (en) | 2017-12-19 | 2020-05-26 | Valqua, Ltd. | Seal member for use in semiconductor production apparatus |
| USD888903S1 (en) | 2018-12-17 | 2020-06-30 | Applied Materials, Inc. | Deposition ring for physical vapor deposition chamber |
| USD888804S1 (en) | 2018-05-04 | 2020-06-30 | New Ideas Manufacturing LLC | Step-up ring |
| USD891382S1 (en)* | 2019-02-08 | 2020-07-28 | Applied Materials, Inc. | Process shield for a substrate processing chamber |
| USD895075S1 (en) | 2018-02-08 | 2020-09-01 | Valqua, Ltd. | Seal member for semiconductor production apparatus |
| USD895076S1 (en)* | 2018-02-08 | 2020-09-01 | Valqua, Ltd. | Composite seal member for semiconductor production apparatus |
| USD895777S1 (en)* | 2017-09-20 | 2020-09-08 | Gardner Denver Petroleum Pumps Llc | Header ring |
| US20200395195A1 (en) | 2018-08-13 | 2020-12-17 | Lam Research Corporation | Replaceable and/or collapsible edge ring assemblies for plasma sheath tuning incorporating edge ring positioning and centering features |
| US20210005502A1 (en) | 2019-07-05 | 2021-01-07 | Tokyo Electron Limited | Stage, substrate processing apparatus and stage assembling method |
| USD909323S1 (en) | 2018-10-12 | 2021-02-02 | Valqua, Ltd. | Seal member for use in semiconductor production apparatus |
| TWD210892S (en) | 2019-02-08 | 2021-04-11 | 美商應用材料股份有限公司 | Deposition ring for a substrate processing chamber |
| USD916038S1 (en)* | 2019-03-19 | 2021-04-13 | Hitachi High-Tech Corporation | Grounded electrode for a plasma processing apparatus |
| USD917825S1 (en) | 2019-07-16 | 2021-04-27 | Entegris, Inc. | Wafer support ring |
| WO2021108178A1 (en) | 2019-11-26 | 2021-06-03 | Lam Research Corporation | Carrier ring to pedestal kinematic mount for substrate processing tools |
| USD928591S1 (en) | 2020-05-05 | 2021-08-24 | Wade D. Morgan, Sr. | Support ring for a water heater stand |
| USD931241S1 (en) | 2019-08-28 | 2021-09-21 | Applied Materials, Inc. | Lower shield for a substrate processing chamber |
| WO2021194468A1 (en) | 2020-03-23 | 2021-09-30 | Lam Research Corporation | High precision edge ring centering for substrate processing systems |
| USD933726S1 (en) | 2020-07-31 | 2021-10-19 | Applied Materials, Inc. | Deposition ring for a semiconductor processing chamber |
| USD934315S1 (en) | 2020-03-20 | 2021-10-26 | Applied Materials, Inc. | Deposition ring for a substrate processing chamber |
| TWD215401S (en) | 2020-03-20 | 2021-11-21 | 美商應用材料股份有限公司 | Process shield for a substrate processing chamber |
| USD939459S1 (en) | 2019-08-07 | 2021-12-28 | Kokusai Electric Corporation | Boat for wafer processing apparatus |
| USD941372S1 (en)* | 2020-03-20 | 2022-01-18 | Applied Materials, Inc. | Process shield for a substrate processing chamber |
| USD942516S1 (en) | 2019-02-08 | 2022-02-01 | Applied Materials, Inc. | Process shield for a substrate processing chamber |
| USD949116S1 (en) | 2019-05-03 | 2022-04-19 | Lumileds Holding B.V. | Flexible circuit board with connectors |
| USD954986S1 (en) | 2019-10-18 | 2022-06-14 | Hitachi High-Tech Corporation | Electrode cover for a plasma processing device |
| USD992614S1 (en) | 2018-12-06 | 2023-07-18 | Tokyo Electron Limited | Focus ring |
| USD992615S1 (en) | 2018-12-07 | 2023-07-18 | Tokyo Electron Limited | Focus ring |
- 2022
- 2022-03-18USUS29/831,295patent/USD1042373S1/enactiveActive
- 2022-09-14TWTW111304573Fpatent/TWD226237S/enunknown
- 2022-09-16JPJP2022020004Fpatent/JP1734727S/enactiveActive
Patent Citations (81)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD404372S (en) | 1997-08-20 | 1999-01-19 | Tokyo Electron Limited | Ring for use in a semiconductor wafer heat processing apparatus |
| US6068548A (en)* | 1997-12-17 | 2000-05-30 | Intel Corporation | Mechanically stabilized retaining ring for chemical mechanical polishing |
| US7459057B2 (en) | 1998-05-15 | 2008-12-02 | Applied Materials, Inc. | Substrate retainer |
| US20080041820A1 (en) | 2002-09-20 | 2008-02-21 | Lam Research Corporation | Apparatus for reducing polymer deposition on a substrate and substrate support |
| US20040077167A1 (en)* | 2002-10-11 | 2004-04-22 | Willis George D. | Retaining ring for use on a carrier of a polishing apparatus |
| USD491963S1 (en)* | 2002-11-20 | 2004-06-22 | Tokyo Electron Limited | Inner wall shield for a process chamber for manufacturing semiconductors |
| US20060057826A1 (en) | 2002-12-09 | 2006-03-16 | Koninklijke Philips Electronics N.V. | System and method for suppression of wafer temperature drift in cold-wall cvd systems |
| US20050277375A1 (en)* | 2004-06-10 | 2005-12-15 | Young Richard T | Retaining ring assembly for use in chemical mechanical polishing |
| USD559993S1 (en) | 2005-03-30 | 2008-01-15 | Tokyo Electron Limited | Cover ring |
| USD559994S1 (en) | 2005-03-30 | 2008-01-15 | Tokyo Electron Limited | Cover ring |
| US7186171B2 (en) | 2005-04-22 | 2007-03-06 | Applied Materials, Inc. | Composite retaining ring |
| US8617672B2 (en) | 2005-07-13 | 2013-12-31 | Applied Materials, Inc. | Localized surface annealing of components for substrate processing chambers |
| USD556704S1 (en)* | 2005-08-25 | 2007-12-04 | Hitachi High-Technologies Corporation | Grounded electrode for a plasma processing apparatus |
| US20070113783A1 (en)* | 2005-11-19 | 2007-05-24 | Applied Materials, Inc. | Band shield for substrate processing chamber |
| USD588078S1 (en)* | 2006-06-16 | 2009-03-10 | Tokyo Electron Limited | Heat dissipation deterrence link for semiconductor manufacture |
| US20090050272A1 (en) | 2007-08-24 | 2009-02-26 | Applied Materials, Inc. | Deposition ring and cover ring to extend process components life and performance for process chambers |
| USD599827S1 (en) | 2008-05-07 | 2009-09-08 | Komatsu Ltd. | Fan shroud for construction machinery |
| USD633991S1 (en) | 2008-11-26 | 2011-03-08 | Nippon Valqua Industries, Ltd. | Gate valve seal |
| USD655401S1 (en) | 2009-08-10 | 2012-03-06 | Nippon Valqua Industries, Ltd. | Hybrid seal member |
| US20110092142A1 (en)* | 2009-10-21 | 2011-04-21 | Frank Jr George J | Retaining Rings |
| USD655797S1 (en) | 2010-03-24 | 2012-03-13 | Nippon Valqua Industries, Ltd. | Hybrid seal member |
| USD638522S1 (en) | 2010-07-20 | 2011-05-24 | Wārtsilā Japan Ltd. | Seal ring for stern tube |
| US20150190835A1 (en) | 2010-08-20 | 2015-07-09 | Applied Materials, Inc. | Extended life deposition ring |
| US8491267B2 (en)* | 2010-08-27 | 2013-07-23 | Pratt & Whitney Canada Corp. | Retaining ring arrangement for a rotary assembly |
| USD703160S1 (en)* | 2011-01-27 | 2014-04-22 | Hitachi High-Technologies Corporation | Grounded electrode for a plasma processing apparatus |
| US20120263569A1 (en) | 2011-04-14 | 2012-10-18 | Scott Wayne Priddy | Substrate holders and methods of substrate mounting |
| US20140262193A1 (en) | 2013-03-13 | 2014-09-18 | Techest Co., Ltd. | Edge ring cooling module for semi-conductor manufacture chuck |
| USD722966S1 (en)* | 2013-08-23 | 2015-02-24 | Bridgeport Fittings, Inc. | Split, non-metallic electrical insulating bushing |
| USD717746S1 (en)* | 2013-11-06 | 2014-11-18 | Applied Materials, Inc. | Lower chamber liner |
| USD783922S1 (en) | 2014-12-08 | 2017-04-11 | Entegris, Inc. | Wafer support ring |
| USD799690S1 (en) | 2014-12-22 | 2017-10-10 | Ebara Corporation | Inner cylinder for exhaust gas treatment apparatus |
| USD767234S1 (en) | 2015-03-02 | 2016-09-20 | Entegris, Inc. | Wafer support ring |
| USD770992S1 (en) | 2015-06-12 | 2016-11-08 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus |
| USD802545S1 (en)* | 2015-06-12 | 2017-11-14 | Hitachi High-Technologies Corporation | Lower chamber for a plasma processing apparatus |
| USD804436S1 (en)* | 2015-06-12 | 2017-12-05 | Hitachi High-Technologies Corporation | Upper chamber for a plasma processing apparatus |
| USD803917S1 (en) | 2015-06-16 | 2017-11-28 | Hitachi Kokusai Electric, Inc. | Heat reflector for substrate processing apparatus |
| USD804556S1 (en) | 2015-06-16 | 2017-12-05 | Hitachi Kokusai Electric Inc. | Heat reflector for substrate processing apparatus |
| USD812578S1 (en)* | 2016-02-26 | 2018-03-13 | Hitachi High-Technologies Corporation | Upper chamber for a plasma processing apparatus |
| USD862404S1 (en) | 2016-10-25 | 2019-10-08 | Kokusai Electric Corporation | Sealing material ring for a semiconductor manufacturing apparatus |
| USD822181S1 (en) | 2016-11-29 | 2018-07-03 | Nippon Valqua Industries, Ltd. | Composite seal |
| USD821552S1 (en) | 2016-11-29 | 2018-06-26 | Nippon Valqua Industries, Ltd. | Composite seal |
| US20200090915A1 (en) | 2017-06-01 | 2020-03-19 | Oerlikon Surface Solutions Ag, Pfäffikon | Target assembly for safe and economic evaporation of brittle materials |
| USD871608S1 (en) | 2017-07-31 | 2019-12-31 | Hitachi High-Technologies Corporation | Gas ring for a plasma processing apparatus |
| USD895777S1 (en)* | 2017-09-20 | 2020-09-08 | Gardner Denver Petroleum Pumps Llc | Header ring |
| USD871561S1 (en) | 2017-11-17 | 2019-12-31 | Valqua, Ltd. | Seal member for use in semiconductor production apparatus |
| USD885444S1 (en) | 2017-12-19 | 2020-05-26 | Valqua, Ltd. | Seal member for use in semiconductor production apparatus |
| USD885443S1 (en) | 2017-12-19 | 2020-05-26 | Valqua, Ltd. | Seal member for use in semiconductor production apparatus |
| USD895075S1 (en) | 2018-02-08 | 2020-09-01 | Valqua, Ltd. | Seal member for semiconductor production apparatus |
| USD895076S1 (en)* | 2018-02-08 | 2020-09-01 | Valqua, Ltd. | Composite seal member for semiconductor production apparatus |
| USD888804S1 (en) | 2018-05-04 | 2020-06-30 | New Ideas Manufacturing LLC | Step-up ring |
| US20190363003A1 (en) | 2018-05-28 | 2019-11-28 | Applied Materials, Inc. | Process kit with adjustable tuning ring for edge uniformity control |
| US20190362948A1 (en) | 2018-05-28 | 2019-11-28 | Applied Materials, Inc. | Process kit with adjustable tuning ring for edge uniformity control |
| US20190362949A1 (en) | 2018-05-28 | 2019-11-28 | Applied Materials, Inc. | Process kit with adjustable tuning ring for edge uniformity control |
| US20210013014A1 (en) | 2018-05-28 | 2021-01-14 | Applied Materials, Inc. | Process kit with adjustable tuning ring for edge uniformity control |
| US20200395195A1 (en) | 2018-08-13 | 2020-12-17 | Lam Research Corporation | Replaceable and/or collapsible edge ring assemblies for plasma sheath tuning incorporating edge ring positioning and centering features |
| USD933033S1 (en) | 2018-10-12 | 2021-10-12 | Valqua, Ltd. | Seal member for semiconductor production apparatus |
| USD909323S1 (en) | 2018-10-12 | 2021-02-02 | Valqua, Ltd. | Seal member for use in semiconductor production apparatus |
| USD933619S1 (en) | 2018-10-12 | 2021-10-19 | Valqua, Ltd. | Seal member for semiconductor production apparatus |
| USD992614S1 (en) | 2018-12-06 | 2023-07-18 | Tokyo Electron Limited | Focus ring |
| USD992615S1 (en) | 2018-12-07 | 2023-07-18 | Tokyo Electron Limited | Focus ring |
| JP1644757S (en) | 2018-12-14 | 2019-11-05 | ||
| USD888903S1 (en) | 2018-12-17 | 2020-06-30 | Applied Materials, Inc. | Deposition ring for physical vapor deposition chamber |
| TWD210892S (en) | 2019-02-08 | 2021-04-11 | 美商應用材料股份有限公司 | Deposition ring for a substrate processing chamber |
| USD942516S1 (en) | 2019-02-08 | 2022-02-01 | Applied Materials, Inc. | Process shield for a substrate processing chamber |
| USD891382S1 (en)* | 2019-02-08 | 2020-07-28 | Applied Materials, Inc. | Process shield for a substrate processing chamber |
| USD933725S1 (en) | 2019-02-08 | 2021-10-19 | Applied Materials, Inc. | Deposition ring for a substrate processing chamber |
| USD916038S1 (en)* | 2019-03-19 | 2021-04-13 | Hitachi High-Tech Corporation | Grounded electrode for a plasma processing apparatus |
| USD949116S1 (en) | 2019-05-03 | 2022-04-19 | Lumileds Holding B.V. | Flexible circuit board with connectors |
| US20210005502A1 (en) | 2019-07-05 | 2021-01-07 | Tokyo Electron Limited | Stage, substrate processing apparatus and stage assembling method |
| USD917825S1 (en) | 2019-07-16 | 2021-04-27 | Entegris, Inc. | Wafer support ring |
| USD939459S1 (en) | 2019-08-07 | 2021-12-28 | Kokusai Electric Corporation | Boat for wafer processing apparatus |
| USD931241S1 (en) | 2019-08-28 | 2021-09-21 | Applied Materials, Inc. | Lower shield for a substrate processing chamber |
| USD954986S1 (en) | 2019-10-18 | 2022-06-14 | Hitachi High-Tech Corporation | Electrode cover for a plasma processing device |
| WO2021108178A1 (en) | 2019-11-26 | 2021-06-03 | Lam Research Corporation | Carrier ring to pedestal kinematic mount for substrate processing tools |
| USD934315S1 (en) | 2020-03-20 | 2021-10-26 | Applied Materials, Inc. | Deposition ring for a substrate processing chamber |
| USD941371S1 (en) | 2020-03-20 | 2022-01-18 | Applied Materials, Inc. | Process shield for a substrate processing chamber |
| USD941372S1 (en)* | 2020-03-20 | 2022-01-18 | Applied Materials, Inc. | Process shield for a substrate processing chamber |
| TWD215401S (en) | 2020-03-20 | 2021-11-21 | 美商應用材料股份有限公司 | Process shield for a substrate processing chamber |
| WO2021194468A1 (en) | 2020-03-23 | 2021-09-30 | Lam Research Corporation | High precision edge ring centering for substrate processing systems |
| USD928591S1 (en) | 2020-05-05 | 2021-08-24 | Wade D. Morgan, Sr. | Support ring for a water heater stand |
| USD933726S1 (en) | 2020-07-31 | 2021-10-19 | Applied Materials, Inc. | Deposition ring for a semiconductor processing chamber |
Non-Patent Citations (4)
| Title |
|---|
| M I-T-M Support Ring Kit: Support Ring Kit, Fits MI-T-M Brand, https://www.grainger.com/product/M I-T-M-Support-Ring-Kit-Support-Ring-33PL56,2024. (Year: 2024). |
| Meiko 0403014 Sliding Ring Ceramics,https://www.restaurantsupply.com/meiko-0403014-sliding-ring-ceramics?srsltid=AfmBOooBtUq7QrCooQa28u5SfAkZX49d1xQ-Oba7--NsSAm5xjEXxnYFTvg, 2024. (Year: 2024).* |
| Support Ring Kit,https://www.amazon.com/Support-Ring-Kit/dp/B00CSBVCJ2, Feb. 6, 2017. (Year: 2017). |
| Zhuhai Cersol Technology Co., Ltd's Post,https://www.linkedin.com/posts/ceramic-solutions.com_in-semiconductor-etching-the-electrostatic-activity-7185829631504125952-ii10, 2024. (Year: 2024). |
Also Published As
| Publication number | Publication date |
|---|---|
| JP1734727S (en) | 2023-01-17 |
| TWD226237S (en) | 2023-07-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| USD933725S1 (en) | Deposition ring for a substrate processing chamber | |
| USD891382S1 (en) | Process shield for a substrate processing chamber | |
| USD933726S1 (en) | Deposition ring for a semiconductor processing chamber | |
| USD1051867S1 (en) | Confinement liner for a substrate processing chamber | |
| USD1038049S1 (en) | Cover ring for use in semiconductor processing chamber | |
| USD941372S1 (en) | Process shield for a substrate processing chamber | |
| USD862068S1 (en) | Magnetic key organizer | |
| USD973820S1 (en) | Swimming ring | |
| USD943539S1 (en) | Confinement plate for a substrate processing chamber | |
| USD1094322S1 (en) | Susceptor | |
| USD984218S1 (en) | Tumbler | |
| USD1055006S1 (en) | Support ring for an interlocking process kit for a substrate processing chamber | |
| USD1094321S1 (en) | Susceptor cover | |
| USD1050312S1 (en) | Pickleball paddle | |
| USD1094320S1 (en) | Susceptor | |
| USD1063684S1 (en) | Ring | |
| USD911402S1 (en) | Chamber | |
| USD941027S1 (en) | Organizer | |
| USD862211S1 (en) | Magnetic key organizer | |
| USD973609S1 (en) | Upper shield with showerhead for a process chamber | |
| USD1044204S1 (en) | Girdle | |
| USD1042374S1 (en) | Support pipe for an interlocking process kit for a substrate processing chamber | |
| USD1042373S1 (en) | Sliding ring for an interlocking process kit for a substrate processing chamber | |
| USD1089130S1 (en) | Process chamber manifold | |
| USD1071886S1 (en) | Substrate support for a substrate processing chamber |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FEPP | Fee payment procedure | Free format text:ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |