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USD1038049S1 - Cover ring for use in semiconductor processing chamber - Google Patents

Cover ring for use in semiconductor processing chamberDownload PDF

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Publication number
USD1038049S1
USD1038049S1US29/758,812US202029758812FUSD1038049SUS D1038049 S1USD1038049 S1US D1038049S1US 202029758812 FUS202029758812 FUS 202029758812FUS D1038049 SUSD1038049 SUS D1038049S
Authority
US
United States
Prior art keywords
processing chamber
semiconductor processing
cover ring
ring
cover
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/758,812
Inventor
Abhishek Chowdhury
Harisha SATHYANARAYANA
Edwin C. Suarez
Siqing Lu
Nataraj BHASKAR RAO
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials IncfiledCriticalApplied Materials Inc
Priority to US29/758,812priorityCriticalpatent/USD1038049S1/en
Assigned to APPLIED MATERIALS, INC.reassignmentAPPLIED MATERIALS, INC.ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).Assignors: SUAREZ, EDWIN C., LU, SIQING, BHASKAR RAO, NATARAJ, SATHYANARAYANA, HARISHA, Chowdhury, Abhishek
Priority to TW110306065Fprioritypatent/TWD222669S/en
Priority to TW110302307Fprioritypatent/TWD218919S/en
Priority to JP2021009879Fprioritypatent/JP1707743S/en
Priority to JP2021028079Fprioritypatent/JP1707822S/en
Application grantedgrantedCritical
Publication of USD1038049S1publicationCriticalpatent/USD1038049S1/en
Activelegal-statusCriticalCurrent
Anticipated expirationlegal-statusCritical

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Description

FIG.1 is a bottom isometric view of a cover ring for use in a semiconductor processing chamber in accordance with some embodiments.
FIG.2 is a top plan view thereof.
FIG.3 is a bottom plan view thereof.
FIG.4 is a front elevation view thereof.
FIG.5 is a back elevation view thereof.
FIG.6 is a right side elevation view thereof; and,
FIG.7 is a left side elevation view thereof.
The broken lines in the drawings illustrate portions of the cover ring for use in a semiconductor processing chamber that form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a cover ring for use in a semiconductor processing chamber, as shown and described.
US29/758,8122020-11-182020-11-18Cover ring for use in semiconductor processing chamberActiveUSD1038049S1 (en)

Priority Applications (5)

Application NumberPriority DateFiling DateTitle
US29/758,812USD1038049S1 (en)2020-11-182020-11-18Cover ring for use in semiconductor processing chamber
TW110306065FTWD222669S (en)2020-11-182021-05-05Cover ring for use in semiconductor processing chamber
TW110302307FTWD218919S (en)2020-11-182021-05-05Cover ring for use in semiconductor processing chamber
JP2021009879FJP1707743S (en)2020-11-182021-05-12 Covering for semiconductor processing chambers
JP2021028079FJP1707822S (en)2020-11-182021-05-12 Covering for semiconductor processing chambers

Applications Claiming Priority (1)

Application NumberPriority DateFiling DateTitle
US29/758,812USD1038049S1 (en)2020-11-182020-11-18Cover ring for use in semiconductor processing chamber

Publications (1)

Publication NumberPublication Date
USD1038049S1true USD1038049S1 (en)2024-08-06

Family

ID=80326147

Family Applications (1)

Application NumberTitlePriority DateFiling Date
US29/758,812ActiveUSD1038049S1 (en)2020-11-182020-11-18Cover ring for use in semiconductor processing chamber

Country Status (3)

CountryLink
US (1)USD1038049S1 (en)
JP (2)JP1707743S (en)
TW (2)TWD222669S (en)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
USD1071886S1 (en)*2022-01-202025-04-22Applied Materials, Inc.Substrate support for a substrate processing chamber
USD1073758S1 (en)*2022-10-132025-05-06Lam Research CorporationBaffle for substrate processing system
USD1082729S1 (en)*2023-01-112025-07-08Nuflare Technology, Inc.Susceptor cover
USD1082730S1 (en)*2023-01-112025-07-08Nuflare Technology, Inc.Cover base for susceptors
USD1082728S1 (en)*2023-01-112025-07-08Nuflare Technology, Inc.Susceptor
USD1082731S1 (en)*2023-01-112025-07-08Nuflare Technology, Inc.Susceptor
USD1090468S1 (en)*2021-09-082025-08-26Lam Research CorporationDebubbler component
USD1093328S1 (en)*2023-01-112025-09-16Nuflare Technology, Inc.Susceptor
USD1094322S1 (en)*2022-10-202025-09-23Nuflare Technology, Inc.Susceptor
USD1094323S1 (en)*2023-01-112025-09-23Nuflare Technology, Inc.Susceptor unit
USD1094320S1 (en)*2022-10-202025-09-23Nuflare Technology, Inc.Susceptor
USD1094321S1 (en)*2022-10-202025-09-23Nuflare Technology, Inc.Susceptor cover
USD1096676S1 (en)*2022-10-202025-10-07Nuflare Technology, Inc.Cover base for susceptors
USD1098057S1 (en)*2022-10-202025-10-14Nuflare Technology, Inc.Susceptor cover

Citations (35)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US5524905A (en)*1994-09-281996-06-11Greene, Tweed Of Delaware, Inc.Sealing assembly with T-shaped seal ring and anti-extrusion rings
US5632673A (en)1995-10-301997-05-27Chrysler CorporationVentilation system for lightweight automobile
US5810931A (en)1996-07-301998-09-22Applied Materials, Inc.High aspect ratio clamp ring
US6051122A (en)1997-08-212000-04-18Applied Materials, Inc.Deposition shield assembly for a semiconductor wafer processing system
US6162336A (en)1999-07-122000-12-19Chartered Semiconductor Manufacturing Ltd.Clamping ring design to reduce wafer sticking problem in metal deposition
US20040149226A1 (en)2003-01-302004-08-05Taiwan Semiconductor Manufacturing Co., Ltd.Substrate clamp ring with removable contract pads
US20050257746A1 (en)2004-05-212005-11-24Kenji ShirakawaClamp member, film deposition apparatus, film deposition method, and semiconductor device manufacturing method
US20070209931A1 (en)2006-03-072007-09-13Miller Keith ANotched deposition ring
USD557226S1 (en)*2005-08-252007-12-11Hitachi High-Technologies CorporationElectrode cover for a plasma processing apparatus
USD559993S1 (en)*2005-03-302008-01-15Tokyo Electron LimitedCover ring
USD559994S1 (en)*2005-03-302008-01-15Tokyo Electron LimitedCover ring
US20080178801A1 (en)2007-01-292008-07-31Applied Materials, Inc.Process kit for substrate processing chamber
US20100065216A1 (en)2006-05-302010-03-18Applied Materials, Inc.Ring assembly for substrate processing chamber
JP4615659B2 (en)1999-02-222011-01-19アプライド マテリアルズ インコーポレイテッド Combination clamp ring
US8104385B2 (en)2004-10-082012-01-31Shibaura Mechatronics CorporationBrittle workpiece splitting system and brittle workpiece splitting method
US20130288477A1 (en)2010-12-082013-10-31Oc Oerlikon Balzers AgApparatus and method for depositing a layer onto a substrate
US20140130743A1 (en)2012-11-152014-05-15Tokyo Electron LimitedFilm forming apparatus
TWD161030S (en)2013-08-122014-06-11陳世發 Substrate retaining ring
US20140190822A1 (en)2008-04-162014-07-10Applied Materials, Inc.Wafer processing deposition shielding components
US8795479B2 (en)2005-07-122014-08-05Texas Instruments Deutschland GmbhWafer clamp assembly for holding a wafer during a deposition process
US20140262763A1 (en)2013-03-142014-09-18Applied Materials, Inc.Selectively groundable cover ring for substrate process chambers
TWD167109S (en)2013-05-152015-04-11荏原製作所股份有限公司Substrate retaining ring
US20170011892A1 (en)2014-02-242017-01-12Beijing Nmc Co., Ltd.Bearing device and plasma processing apparatus
USD797691S1 (en)*2016-04-142017-09-19Applied Materials, Inc.Composite edge ring
USD827592S1 (en)*2017-01-312018-09-04Hitachi High-Technologies CorporationElectrode cover for a plasma processing apparatus
USD840364S1 (en)*2017-01-312019-02-12Hitachi High-Technologies CorporationElectrode cover for a plasma processing apparatus
CN110306065A (en)*2019-08-212019-10-08河钢股份有限公司承德分公司A kind of method that vanadium slag prepares ammonium metavanadate
USD870314S1 (en)*2017-08-312019-12-17Hitachi High-Technologies CorporationElectrode cover for a plasma processing apparatus
USD888903S1 (en)*2018-12-172020-06-30Applied Materials, Inc.Deposition ring for physical vapor deposition chamber
KR20210022973A (en)*2019-08-212021-03-04한화테크윈 주식회사Multi camera apparatus and photography system having the same
USD934315S1 (en)*2020-03-202021-10-26Applied Materials, Inc.Deposition ring for a substrate processing chamber
US20220157572A1 (en)2020-11-182022-05-19Applied Materials, Inc.Deposition ring for thin substrate handling via edge clamping
US20220157635A1 (en)2020-11-182022-05-19Applied Materials, Inc.Thin substrate handling via edge clamping
USD954986S1 (en)*2019-10-182022-06-14Hitachi High-Tech CorporationElectrode cover for a plasma processing device
US20220246462A1 (en)*2019-04-162022-08-04Tokai Carbon Korea Co., LtdSic edge ring

Patent Citations (35)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US5524905A (en)*1994-09-281996-06-11Greene, Tweed Of Delaware, Inc.Sealing assembly with T-shaped seal ring and anti-extrusion rings
US5632673A (en)1995-10-301997-05-27Chrysler CorporationVentilation system for lightweight automobile
US5810931A (en)1996-07-301998-09-22Applied Materials, Inc.High aspect ratio clamp ring
US6051122A (en)1997-08-212000-04-18Applied Materials, Inc.Deposition shield assembly for a semiconductor wafer processing system
JP4615659B2 (en)1999-02-222011-01-19アプライド マテリアルズ インコーポレイテッド Combination clamp ring
US6162336A (en)1999-07-122000-12-19Chartered Semiconductor Manufacturing Ltd.Clamping ring design to reduce wafer sticking problem in metal deposition
US20040149226A1 (en)2003-01-302004-08-05Taiwan Semiconductor Manufacturing Co., Ltd.Substrate clamp ring with removable contract pads
US20050257746A1 (en)2004-05-212005-11-24Kenji ShirakawaClamp member, film deposition apparatus, film deposition method, and semiconductor device manufacturing method
US8104385B2 (en)2004-10-082012-01-31Shibaura Mechatronics CorporationBrittle workpiece splitting system and brittle workpiece splitting method
USD559993S1 (en)*2005-03-302008-01-15Tokyo Electron LimitedCover ring
USD559994S1 (en)*2005-03-302008-01-15Tokyo Electron LimitedCover ring
US8795479B2 (en)2005-07-122014-08-05Texas Instruments Deutschland GmbhWafer clamp assembly for holding a wafer during a deposition process
USD557226S1 (en)*2005-08-252007-12-11Hitachi High-Technologies CorporationElectrode cover for a plasma processing apparatus
US20070209931A1 (en)2006-03-072007-09-13Miller Keith ANotched deposition ring
US20100065216A1 (en)2006-05-302010-03-18Applied Materials, Inc.Ring assembly for substrate processing chamber
US20080178801A1 (en)2007-01-292008-07-31Applied Materials, Inc.Process kit for substrate processing chamber
US20140190822A1 (en)2008-04-162014-07-10Applied Materials, Inc.Wafer processing deposition shielding components
US20130288477A1 (en)2010-12-082013-10-31Oc Oerlikon Balzers AgApparatus and method for depositing a layer onto a substrate
US20140130743A1 (en)2012-11-152014-05-15Tokyo Electron LimitedFilm forming apparatus
US20140262763A1 (en)2013-03-142014-09-18Applied Materials, Inc.Selectively groundable cover ring for substrate process chambers
TWD167109S (en)2013-05-152015-04-11荏原製作所股份有限公司Substrate retaining ring
TWD161030S (en)2013-08-122014-06-11陳世發 Substrate retaining ring
US20170011892A1 (en)2014-02-242017-01-12Beijing Nmc Co., Ltd.Bearing device and plasma processing apparatus
USD797691S1 (en)*2016-04-142017-09-19Applied Materials, Inc.Composite edge ring
USD827592S1 (en)*2017-01-312018-09-04Hitachi High-Technologies CorporationElectrode cover for a plasma processing apparatus
USD840364S1 (en)*2017-01-312019-02-12Hitachi High-Technologies CorporationElectrode cover for a plasma processing apparatus
USD870314S1 (en)*2017-08-312019-12-17Hitachi High-Technologies CorporationElectrode cover for a plasma processing apparatus
USD888903S1 (en)*2018-12-172020-06-30Applied Materials, Inc.Deposition ring for physical vapor deposition chamber
US20220246462A1 (en)*2019-04-162022-08-04Tokai Carbon Korea Co., LtdSic edge ring
CN110306065A (en)*2019-08-212019-10-08河钢股份有限公司承德分公司A kind of method that vanadium slag prepares ammonium metavanadate
KR20210022973A (en)*2019-08-212021-03-04한화테크윈 주식회사Multi camera apparatus and photography system having the same
USD954986S1 (en)*2019-10-182022-06-14Hitachi High-Tech CorporationElectrode cover for a plasma processing device
USD934315S1 (en)*2020-03-202021-10-26Applied Materials, Inc.Deposition ring for a substrate processing chamber
US20220157572A1 (en)2020-11-182022-05-19Applied Materials, Inc.Deposition ring for thin substrate handling via edge clamping
US20220157635A1 (en)2020-11-182022-05-19Applied Materials, Inc.Thin substrate handling via edge clamping

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
International Search Report for PCT/US2021/059404, dated Mar. 14. 2022.

Cited By (16)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
USD1096679S1 (en)2021-09-082025-10-07Lam Research CorporationDebubbler component
USD1090468S1 (en)*2021-09-082025-08-26Lam Research CorporationDebubbler component
USD1091491S1 (en)*2021-09-082025-09-02Lam Research CorporationDebubbler component
USD1071886S1 (en)*2022-01-202025-04-22Applied Materials, Inc.Substrate support for a substrate processing chamber
USD1073758S1 (en)*2022-10-132025-05-06Lam Research CorporationBaffle for substrate processing system
USD1094320S1 (en)*2022-10-202025-09-23Nuflare Technology, Inc.Susceptor
USD1098057S1 (en)*2022-10-202025-10-14Nuflare Technology, Inc.Susceptor cover
USD1096676S1 (en)*2022-10-202025-10-07Nuflare Technology, Inc.Cover base for susceptors
USD1094321S1 (en)*2022-10-202025-09-23Nuflare Technology, Inc.Susceptor cover
USD1094322S1 (en)*2022-10-202025-09-23Nuflare Technology, Inc.Susceptor
USD1082728S1 (en)*2023-01-112025-07-08Nuflare Technology, Inc.Susceptor
USD1094323S1 (en)*2023-01-112025-09-23Nuflare Technology, Inc.Susceptor unit
USD1093328S1 (en)*2023-01-112025-09-16Nuflare Technology, Inc.Susceptor
USD1082731S1 (en)*2023-01-112025-07-08Nuflare Technology, Inc.Susceptor
USD1082730S1 (en)*2023-01-112025-07-08Nuflare Technology, Inc.Cover base for susceptors
USD1082729S1 (en)*2023-01-112025-07-08Nuflare Technology, Inc.Susceptor cover

Also Published As

Publication numberPublication date
TWD218919S (en)2022-05-21
JP1707743S (en)2022-02-17
JP1707822S (en)2022-02-17
TWD222669S (en)2022-12-21

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