US9445526B2 - Modular jet impingement assemblies with passive and active flow control for electronics cooling - Google Patents

Abstract

Power electronics modules having modular jet impingement assembly utilized to cool heat generating devices are disclosed. The modular jet impingement assemblies include a modular manifold having a distribution recess, one or more angled inlet connection tubes positioned at an inlet end of the modular manifold that fluidly couple the inlet tube to the distribution recess and one or more outlet connection tubes positioned at an outlet end of the modular manifold that fluidly coupling the outlet tube to the distribution recess. The modular jet impingement assemblies include a manifold insert removably positioned within the distribution recess and include one or more inlet branch channels each including an impinging slot and one or more outlet branch channels each including a collecting slot. Further a heat transfer plate coupled to the modular manifold, the heat transfer plate comprising an impingement surface including an array of fins that extend toward the manifold insert.

Description

STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT

This invention was made with government support under Cooperative Agreement DE-EE0006429 awarded by the United States Department of Energy. The government has certain rights in the invention.

TECHNICAL FIELD

The present specification generally relates to jet impingement assemblies and, more particularly, to modular jet impingement assemblies having active and passive fluid flow control features.

BACKGROUND

Heat management devices may be coupled to a heat generation device, such as a power electronics device, to remove heat and lower the operating temperature of the heat generating device. A cooling fluid may be introduced to the heat management device, where it receives heat from the heat management device, primarily through convective and/or conductive heat transfer. The cooling fluid is then removed from the heat management device, thereby removing heat from the heat generating device. In one example, fluid may be directed in a jet in a localized region at a high velocity such that the fluid impinges a surface of the heat management device coupled to the heat generating device. Further, as power electronic devices are designed to operate at increased power levels, the power electronics devices generate an increased corresponding heat flux. The increase in heat flux generated by the power electronics devices may render conventional heat sinks inadequate to reject sufficient heat to maintain a desired operating temperature in the power electronics device.

Accordingly, heat management devices that incorporate passive and active fluid flow control within jet impingement assemblies may be desired to mitigate high temperature operation of the power electronics devices.

SUMMARY

In one embodiment, a modular jet impingement assembly includes an inlet tube fluidly coupled to a fluid inlet, an outlet tube fluidly coupled to a fluid outlet, a modular manifold comprising a distribution recess, and one or more angled inlet connection tubes positioned at an inlet end of the modular manifold. The one or more angled inlet connection tubes are angled with respect to a surface of the modular manifold and fluidly couple the inlet tube to the distribution recess. The modular jet impingement assembly further includes one or more outlet connection tubes positioned at an outlet end of the modular manifold, fluidly coupling the outlet tube to the distribution recess and a manifold insert removably positioned within the distribution recess of the modular manifold. The manifold insert includes one or more inlet branch channels fluidly coupled to the one or more angled inlet connection tubes. Each inlet branch channel includes an impinging slot. The manifold insert also includes one or more outlet branch channels fluidly coupled to the one or more inlet branch channels and the one or more outlet connection tubes. Each outlet branch channel includes a collecting slot. A heat transfer plate is coupled to the modular manifold, the heat transfer plate includes an impingement surface including an array of fins that extend toward the manifold insert.

In another embodiment, a power electronics module includes a modular jet impingement assembly that includes an inlet tube fluidly coupled to a fluid inlet, an outlet tube fluidly coupled to a fluid outlet, and a modular manifold including a distribution recess and one or more angled inlet connection tubes positioned at an inlet end of the modular manifold. The one or more angled inlet connection tubes are angled with respect to a surface of the modular manifold and fluidly couple the inlet tube to the distribution recess. The modular manifold further includes one or more outlet connection tubes positioned at an outlet end of the modular manifold. The one or more outlet connection tubes fluidly couple the outlet tube to the distribution recess. A manifold insert is removably positioned within the distribution recess of the modular manifold. The manifold insert includes one or more inlet branch channels fluidly coupled to the one or more angled inlet connection tubes. Each inlet branch channel includes an impinging slot. The manifold insert also includes one or more outlet branch channels fluidly coupled to the one or more inlet branch channels and the one or more outlet connection tubes. Each outlet branch channel includes a collecting slot. A heat transfer plate is coupled to the modular manifold, the heat transfer plate includes an impingement surface including an array of fins that extend toward the manifold insert. Further, an electronics device is positioned in thermal contact with the heat transfer plate opposite the array of fins.

In yet another embodiment, a modular jet impingement assembly includes an inlet tube fluidly coupled to a fluid inlet, an outlet tube fluidly coupled to a fluid outlet, and two or more modular manifolds. Each modular manifold includes a distribution recess and one or more angled inlet connection tubes positioned at an inlet end of the modular manifold. The one or more angled inlet connection tubes are angled with respect to a surface of the modular manifold and fluidly couple the inlet tube to the distribution recess. The modular manifold further includes one or more outlet connection tubes positioned at an outlet end of the modular manifold, fluidly coupling the outlet tube to the distribution recess. The modular jet impingement assembly further includes one or more manifold inserts removably positioned within the distribution recess of each modular manifold. The one or more manifold inserts include one or more inlet branch channels fluidly coupled to the one or more angled inlet connection tubes. Each inlet branch channel includes an impinging slot. The one or more outlet branch channels are fluidly coupled to the one or more inlet branch channels and the one or more outlet connection tubes. Each outlet branch channel includes a collecting slot. One or more heat transfer plates are coupled to each modular manifold. The one or more heat transfer plates include an impingement surface including an array of fins that extend toward the manifold insert. Further, a diameter of a first angled inlet connection tube of a first modular manifold is greater than a diameter of a first angled inlet connection tube of a second modular manifold.

These and additional features provided by the embodiments described herein will be more fully understood in view of the following detailed description, in conjunction with the drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

The embodiments set forth in the drawings are illustrative and exemplary in nature and not intended to limit the subject matter defined by the claims. The following detailed description of the illustrative embodiments can be understood when read in conjunction with the following drawings, where like structure is indicated with like reference numerals and in which:

FIG. 1 schematically depicts an isometric view of an example power electronics module according to one or more embodiments shown or described herein;

FIG. 2 schematically depicts an exploded isometric view of the power electronics module as shown inFIG. 1 according to one or more embodiments shown or described herein;

FIG. 3 schematically depicts a top view of an example modular jet impingement assembly according to one or more embodiments shown or described herein;

FIG. 4A schematically depicts an isometric view of a manifold insert positioned adjacent a heat transfer plate according to one or more embodiments shown or described herein;

FIG. 4B schematically depicts an isometric view of another embodiment of a manifold insert positioned adjacent a heat transfer plate according to one or more embodiments shown or described herein;

FIG. 5A schematically depicts an isometric view of an embodiment of the manifold insert depicting a slot surface of the manifold insert according to one or more embodiments shown or described herein;

FIG. 5B an isometric view of a heat transfer plate positioned such that an impingement surface of the heat transfer plate having an array of fins is visible according to one or more embodiments shown or described herein;

FIG. 6 schematically depicts a mass flow rate of an example coolant fluid traversing an example modular jet impingement assembly according to one or more embodiments shown or described herein;

FIG. 7A schematically depicts an isometric view of a valve configured to be positioned within a modular jet impingement assembly according to one or more embodiments shown or described herein;

FIG. 7B schematically depicts the valve ofFIG. 7A in a closed position according to one or more embodiments shown or described herein

FIG. 7C schematically depicts the valve ofFIG. 7A in an open position according to one or more embodiments shown or described herein

FIG. 8 schematically depicts an exploded isometric view of an example power electronics module comprising a plurality of removably attachable modular manifolds according to one or more embodiments shown or described herein;

FIG. 9 schematically depicts an isometric view of an example embodiment of an individual removably attachable modular manifold ofFIG. 8 according to one or more embodiments shown or described herein;

FIG. 10 schematically depicts a top view of the modular jet impingement assembly ofFIG. 8 having a fluid inlet and a fluid outlet disposed through the same fitting cap and comprising a plurality of removably attachable modular manifolds arranged in parallel according to one or more embodiments shown or described herein;

FIG. 11 schematically depicts a top view of the modular jet impingement assembly ofFIG. 8 having a fluid inlet and a fluid outlet disposed through different fitting caps and comprising a plurality of removably attachable modular manifolds arranged in parallel according to one or more embodiments shown or described herein;

FIG. 12 schematically depicts a top view of the modular jet impingement assembly ofFIG. 8 comprising a plurality of removably attachable modular manifolds arranged in series according to one or more embodiments shown or described herein;

FIG. 13 schematically depicts a top view of the modular jet impingement assembly ofFIG. 8 comprising a plurality of removably attachable modular manifolds arranged partially in series and partially in parallel according to one or more embodiments shown or described herein;

FIG. 14 schematically depicts a top view of the modular jet impingement assembly ofFIG. 8 comprising a plurality of removably attachable modular manifolds arranged partially in series and partially in parallel according to one or more embodiments shown or described herein; and

FIG. 15 schematically depicts an isometric view of an example modular jet impingement assembly comprising a plurality of removably attachable modular manifolds coupled in a snap fit arrangement according to one or more embodiments shown or described herein.

DETAILED DESCRIPTION

Embodiments of the present disclosure are directed to power electronics modules having modular jet impingement assemblies and apparatuses that may be utilized to cool heat generating devices, such as semiconductor devices. In the embodiments described herein, jet impingement is provided by directing jets of coolant fluid at an impingement surface of a thermally conductive heat transfer plate thermally coupled to a heat generating device. Heat is transferred to the coolant fluid as it impinges the impingement surface. This may increase the operating life of the heat generating devices. The modular jet impingement assemblies include modular manifolds configured to receive manifold inserts. Further, the modular jet impingement assemblies having modular manifolds may be configured to actively and/or passively alter the mass flow rate of coolant fluid flowing along a fluid flow path formed within the modular jet impingement assemblies, which may facilitate uniform heat transfer and/or targeted heat transfer from the heat generating devices to the coolant fluid thereby removing heat flux from the heat generating devices and increasing the operating life of the heat generating devices.

Referring toFIGS. 1-3, an exemplarypower electronics module100 is depicted. Thepower electronics module100 depicted inFIGS. 1-3 includes a modularjet impingement assembly101 that may be thermally coupled to one or more heat generating devices190. The modularjet impingement assembly101 comprises afluid inlet102, afluid outlet104, aninlet tube106, anoutlet tube108, one or more modular manifolds110, one or moremanifold inserts140, and one or moreheat transfer plates170. In the embodiment depicted inFIG. 1-3, the modularjet impingement assembly101 comprises a firstmodular manifold110A, a secondmodular manifold110B, and a thirdmodular manifold110C integrally connected such that theinlet tube106 and theoutlet tube108 extend through each of themodular manifolds110A-110C. In other embodiments, (for example, the embodiment depicted inFIGS. 8-15), themodular manifolds110A-110C are removably coupled. It should be understood that any number of modular manifolds110 are contemplated and the three modular manifold (110A-110C) embodiment is described herein merely as an illustrative embodiment. In some embodiments, eachmodular manifold110A-110C may be made from a generally thermally conductive material, for example and without limitation, copper, aluminum, steel, thermally enhanced composite materials, polymeric composite materials, graphite, molded plastic, or the like. Additionally, the modularjet impingement assembly101, including eachmodular manifold110A-110C, may be manufactured using 3D printing, additive manufacturing, and the like, for example, fusion deposition modeling. Further, it should be understood that throughout this disclosure, the firstmodular manifold110A, and components associated therewith are described for illustrative purposes and the description may apply to any of the one or more modular manifolds110.

Referring still toFIGS. 1-3, theinlet tube106 may be positioned on aninlet side114 of the modularjet impingement assembly101 and may fluidly couple thefluid inlet102 and themodular manifolds110A-110C. Theoutlet tube108 may be positioned on anoutlet side116 of the modularjet impingement assembly101 and may fluidly couple thefluid outlet104 and themodular manifolds110A-110C. In the embodiments depicted inFIGS. 1-3, theinlet tube106 and theoutlet tube108 may comprise a single tube extending along themodular manifolds110A-110C. Further, in embodiments in which themodular manifolds110A-110C are removably coupled together (FIGS. 8-15), each individual modular manifold110 may comprise a portion of theinlet tube106 and a portion of theoutlet tube108 fluidly coupled to thefluid outlet104.

As described in more detail below, a coolant fluid may enter the modularjet impingement assembly101 through thefluid inlet102 and exit the modularjet impingement assembly101 throughfluid outlet104. The modularjet impingement assembly101 may be fluidly coupled to a coolant reservoir (not shown), for example, in operation, the coolant fluid may follow afluid flow path103 and traverse theinlet tube106, themodular manifolds110A-110C, one or more manifold inserts140A-140C, contact one or moreheat transfer plates170A-170C, and exit through theoutlet tube108. The coolant fluid may be any appropriate liquid, such as deionized water or radiator fluid. Other exemplary fluids include, for example and without limitation, water, organic solvents, and inorganic solvents. Examples of such solvents may include commercial refrigerants such as R-134a, R717, and R744. Selection of the composition of the coolant fluid used in association with thepower electronics module100 may be selected based on, among other properties, the boiling point, the density, and the viscosity of the fluid.

Referring now toFIG. 2, each individualmodular manifold110A-110C comprises one or more distribution recesses130A-130C positioned between theinlet side114 and theoutlet side116 of the modularjet impingement assembly101. The one or more distribution recesses130A-130C are fluidly coupled to theinlet tube106 on theinlet side114 and theoutlet tube108 on theoutlet side116. For example, as depicted inFIG. 2, the firstmodular manifold110A comprises afirst distribution recess130A, the secondmodular manifold110B comprises asecond distribution recess130B, and the thirdmodular manifold110C comprises athird distribution recess130C. Referring specifically to thefirst distribution recess130A for ease of understanding, thefirst distribution recess130A comprises aninsert receiving portion134A and a heat transferplate receiving portion132A. The heat transferplate receiving portion132A circumscribes theinsert receiving portion134A. As described below, theinsert receiving portion134A is configured to receive and house afirst manifold insert140A and the heat transferplate receiving portion132A is configured to receive and house a firstheat transfer plate170A, positioned proximate and covering thefirst manifold insert140.

Referring once again toFIGS. 1-3, the firstmodular manifold110A further comprises one or more angledinlet connection tubes122A′-122A′″ and one or moreoutlet connection tubes124A′-124A″. In the embodiments depicted inFIGS. 1-3, the firstmodular manifold110A comprises a first angledinlet connection tube122A′, a second angledinlet connection tube122A″, and a third angledinlet connection tube122A′″, each fluidly connecting theinlet tube106 and thedistribution recess130A. Further, the firstmodular manifold110A comprises a firstoutlet connection tube124A′ and a secondoutlet connection tube124A″, each fluidly connecting thedistribution recess130A with theoutlet tube108. It should be understood that the one or more modular manifolds110 may comprise any number of angled inlet connection tubes122 and any number of outlet connection tubes124. Further, it should be understood that description of the angledinlet connection tubes122A′-122A′″ andoutlet connection tube124A′-124A″ of the firstmodular manifold110A also describe the embodiments of the corresponding components of the secondmodular manifold110B, the thirdmodular manifold110C, and any additional modular manifolds110.

The angledinlet connection tubes122A′-122A′″ are positioned at theinlet side114 of the firstmodular manifold110A and extend between and fluidly couple theinlet tube106 and thedistribution recess130A and may be an inlet path for coolant fluid entering thedistribution recess130A. Further, theoutlet connection tubes124A′-124A″ are positioned at theoutlet side116 of the firstmodular manifold110A and extend between and fluidly couple thedistribution recess130A with theoutlet tube108 and may be an outlet path for coolant fluid exiting thedistribution recess130A. Additionally, the one or more angledinlet connection tubes122A′-122A′″ are angled with respect to asurface111 of the modular manifold110 between about 5° and about 25°, such as, for example, about 10°, about 15°, and about 20°. In some embodiments, the angle of the angled inlet connection tubes122 may be uniform or non-uniform. For example, the first angledinlet connection tube122A′ may have a different angle than the second angledinlet connection tube122A″, the third angledinlet connection tube122A′″, or both. Further, the angledinlet connection tubes122A′-122A′″ of the firstmodular manifold110A may have a different angle than the angledinlet connection tubes122B′-122B′″ and122C′-122C′″ of the secondmodular manifold110B and the thirdmodular manifold110C, respectively. By angling the inlet connection tubes122′-122′″, the flow resistance of thefluid flow path103 may be altered. For example, angled inlet connection tubes122′-122′″ having larger angles may provide more flow resistance than angled inlet connection tubes122′-122′″ having smaller angles. In some embodiments, it may be desirable to provide angled inlet connection tubes122′-122′″ having angles that facilitate uniform flow resistances and uniform mass flow rates and, in other embodiments, it may be desirable to provide angled inlet connection tubes122′-122′″ having angles that facilitate non-uniform flow resistances and non-uniform mass flow rates, for example, to provide targeted cooling to one or more heat generating devices190.

Referring now toFIG. 3, the geometry, for example, the cross sectional area, the diameter, or the like, of each angled inlet connection tube122′-122′″ may provide passive mass flow rate control of thefluid flow path103 through the modularjet impingement assembly101. In some embodiments, the diameters of each angled inlet connection tube122′-122′″ are uniform or non-uniform. For example, the diameters of each angled inlet connection tube122′-122′″ may be non-uniform with respect to the angled inlet connection tubes122′-122′″ of one individual modular manifold110 (e.g., the firstmodular manifold110A). Further, the diameters of each angled inlet connection tube122′-122′″ may be non-uniform with respect to all angled inlet connection tubes122′-122′″ within the modular jet impingement assembly101 (e.g., the angled inlet connection tubes122′-122′″ associated with the firstmodular manifold110A, the secondmodular manifold110B, and the like).

In some embodiments, the diameter of each angled inlet connection tube122′-122′″ may be computationally determined by an optimization process, for example, the diameter of each angled inlet connection tube122 may be optimized to control the mass flow rate of the coolant fluid along thefluid flow path103. For example, the diameter of each angled inlet connection tube122 may facilitate uniform coolant fluid flow into eachmodular manifold110A-110C or facilitate targeted coolant fluid flow into each distribution manifold of the modular manifolds110 to provide more or less cooling to different heat generating devices190 thermally coupled to the modular manifolds110. Similarly, the diameter of each angled inlet connection tube122 may vary based on the cooling requirements of a particular application. For example, smaller diameters may be used to provide less coolant fluid into modular manifolds110 coupled to heat generating devices190 requiring less heat transfer and larger diameters may be used to provide more coolant fluid into modular manifolds110 coupled to heat generating devices190 requiring more heat transfer.

Referring now toFIGS. 2-5B, the modularjet impingement assembly101 further comprises one or moremanifold inserts140 removably positioned within the distribution recess130 of each individual modular manifold110. In the embodiments depicted inFIGS. 2-5B, threemanifold inserts140A-140C are depicted, however, it should be understood that any number ofmanifold inserts140 are contemplated. In some embodiments, eachindividual manifold insert140 may be removably positioned within each individual distribution recess130 of each individual modular manifold110. In other embodiments, multiplemanifold inserts140 may be removably positioned within individual distribution recesses130. For example, as depicted inFIG. 2, afirst manifold insert140A is removably positioned within thefirst distribution recess130A of the firstmodular manifold110A, asecond manifold insert140B is removably positioned within thesecond distribution recess130B of the secondmodular manifold110B, and a thirdmanifold insert140C is removably positioned within thethird distribution recess130C of the thirdmodular manifold110C.

Referring now toFIGS. 4A-4B, isometric views of two exemplary manifold inserts140 are depicted. The manifold inserts140 each comprise one or moreinlet branch channels142 and one or moreoutlet branch channels144. The one or moreinlet branch channels142 are fluidly coupled to the one or more angled inlet connection tubes122 when theindividual manifold insert140 is positioned within the distribution recess130 of the individual modular manifold110, thereby defining a portion of thefluid flow path103. Further, the one or more outlet branch channels are fluidly coupled to the one or more outlet connection tubes124 when theindividual manifold insert140 is positioned within the distribution recess130 of the individual modular manifold110, thereby defining another portion of thefluid flow path103. The one or moreinlet branch channels142 and the one or moreoutlet branch channels144 may be alternately positioned within themanifold insert140 such that eachinlet branch channel142 is positioned adjacent at least oneoutlet branch channel144 and eachoutlet branch channel144 is positioned adjacent at least oneinlet branch channel142. Further, the manifold inserts140 comprise achannel surface158 positioned proximate the distribution recess130 when themanifold insert140 is disposed within the distribution recess130 and a slot surface156 (FIG. 5A) positioned proximate theheat transfer plate170 when theheat transfer plate170 is coupled to the modular manifold110.

In some embodiments, for example the embodiment depicted inFIG. 4B, the one or more of theinlet branch channels142 comprise one or moretapered portions146. For example, a taperedportion146 may be aligned with the one or more angled inlet connection tubes122 and may be configured to alter the mass flow rate of coolant fluid traversing thefluid flow path103. Further, in other embodiments, one or more of theoutlet branch channels144 may also comprise one or more tapered portions. It should be understood that the one or moreinlet branch channels142 and the one or moreoutlet branch channels144 may take a variety of configurations including having a variety of slopes, lengths, discontinuous portions, non-linear portions, and the like without departing from the scope of the present disclosure.

Referring also toFIG. 5A, an isometric view of an embodiment of themanifold insert140 depicting aslot surface156 of themanifold insert140 is depicted. As shown inFIG. 5A, the one or moremanifold inserts140 further comprise one ormore impinging slots152 fluidly coupled to the one or moreinlet branch channels142 and may form a throughput portion of themanifold insert140 such that coolant fluid may pass through the impingingslot152, for example, as jets of coolant fluid. Further, the impingingslots152 may comprise uniform or non-uniform shapes and cross-sectional areas and may take a variety of sizes and shapes to provide jets of coolant fluid to impinge theheat transfer plate170 and transfer heat from theheat transfer plate170 to the coolant fluid, as described below. In operation, the impingingslots152 facilitate jet impingement from the manifold inserts140 to theheat transfer plates170.

Referring again toFIG. 5A, one or moremanifold inserts140 further comprise one ormore collecting slots154 fluidly coupled to the one or moreoutlet branch channels144 and may form additional throughput portions of themanifold insert140 such that coolant fluid may pass through the collectingslots154. The collectingslots154 are in fluid communication with the impingingslots152 such that coolant fluid that exits themanifold insert140 through anindividual impinging slot152 reenters themanifold insert140 through anindividual collecting slot154, for example, anadjacent collecting slot154. Further, the collectingslots154 may comprise uniform or non-uniform shapes and cross-sectional areas and may take a variety of sizes and shapes to collect coolant fluid after it impinges theheat transfer plate170 and transfer heat from theheat transfer plate170.

Referring again toFIGS. 1-5B, the modularjet impingement assembly101 may further comprise one or moreheat transfer plates170 coupled to the one or more modular manifolds110. For example, in the embodiments depicted inFIGS. 1 and 2, a firstheat transfer plate170A is removably coupled to the firstmodular manifold110A, a secondheat transfer plate170B is removably coupled to the secondmodular manifold110B, and a thirdheat transfer plate170C is removably coupled to the thirdmodular manifold110C. Further, it should be understood that any number of modular manifold110 and any number ofheat transfer plates170 are contemplated. For example, in some embodiments, two or moreheat transfer plates170 may be coupled to an individual modular manifolds110 and in other embodiments, an individualheat transfer plate170 may be coupled to two or more modular manifolds110. Further, theheat transfer plates170 may also be made from a thermally conductive material, for example and without limitation, copper, aluminum, steel, thermally enhanced composite materials, polymeric composite materials, graphite, or the like.

Referring toFIG. 5B, an isometric view of aheat transfer plate170 is depicted such that animpingement surface172 of theheat transfer plate170 having an array offins172 is visible. Each individualheat transfer plate170 comprises theimpingement surface172 having the array offins174 that extend towards the modular manifold110, for example, toward theslot surface156 of themanifold insert140 removably positioned within the distribution recess130 of the modular manifold110. The array offins174 may be proximate to themanifold insert140, and in some embodiments, the array offins174 may contact theslot surface156 of themanifold insert140. Theheat transfer plate170 may be positioned within the heat transfer plate receiving portion132 of the distribution recess130 and theimpingement surface172, including the array offins174, extends towards themanifold insert140 such that the array offins174 are positioned proximate the impingingslots152 and the collectingslots154 of themanifold insert140, forming an impingement chamber therebetween.

In operation, the array offins174 receive coolant fluid from the impingingslots152 and the array offins174 direct coolant fluid toward the collectingslots154. For example, in some embodiments, theimpingement surface172 may further include one or more grooves that may direct coolant fluid flow through the impingement chamber. The one or more grooves may be positioned within the array offins174. For example, the one or more grooves may run substantially parallel and proximate the impingingslots152 and the collectingslots154 of themanifold insert140 and may direct coolant fluid between impingingslots152 and collectingslots154. Further, theheat transfer plate170 may be coupled to the heat transfer plate receiving portion132 through any appropriate connection, creating a fluid-tight seal between the modular manifold110 and theheat transfer plate170, forming the impingement chamber therebetween. Example connections include, but are not limited to, gaskets and mechanical fasteners, o-rings, soldering, brazing, ultrasonic welding, and the like. As described in more detail below, the one or more arrays offins174 can correspond to the locations of the one or more heat generating devices190 positioned proximate theheat transfer plate170.

Referring again toFIG. 5B, the one or more arrays offins174 increase the local surface area of theheat transfer plate170, such that coolant fluid delivered to theheat transfer plate170 may efficiently convect heat away from theheat transfer plate170. By increasing the surface area of theheat transfer plate170, the heat transfer rate from theheat transfer plate170 to the coolant fluid may be enhanced. In some embodiments, theheat transfer plate170, including the one or more arrays offins174, may have a variety of configurations including being made from uniform, isotropic materials, non-isotropic materials, composite materials, or the like. In some embodiments, the one or more arrays offins174 of theheat transfer plate170 may include a coating, for example, a porous coating, that increases the surface area of the one or more arrays offins174, thereby increasing heat transfer away from theheat transfer plate170. In some embodiments, the one or more arrays offins174 may be constructed from a porous material. Additionally, it should be understood that in some embodiments, theheat transfer plates170 may not be provided with the one or more arrays offins174.

As stated above, the modularjet impingement assembly101 may include one or more gaskets (not shown) positioned between the modular manifold110 and theheat transfer plate170, for example, between the heat transfer plate receiving portion132 of the distribution recess130 and theimpingement surface172 of theheat transfer plate170. The one or more gaskets may provide a fluid-tight seal between adjacent components of modularjet impingement assembly101 such that coolant fluid introduced to the modularjet impingement assembly101 may be maintained in a closed-loop cooling system as the coolant fluid circulates through the modularjet impingement assembly101. The gaskets may be made from a variety of materials that provide a fluid-tight seal between the generally non-compliant bodies of the modularjet impingement assembly101. Examples of such materials include, without limitation, natural or synthetic elastomers, compliant polymers such as silicone, and the like. The one or more gaskets may also be made from an assembly that includes compliant materials and non-compliant materials, such that the one or more gaskets provide desired sealing characteristics while maintaining their geometric configuration. In other embodiments, gaskets are not utilized, such as embodiments where soldering or brazing is used to couple the modular manifolds110 and theheat transfer plates170.

Referring again toFIGS. 1-3, a heat transfer surface176 of theheat transfer plate170 is depicted. The heat transfer surface176 is opposite theimpingement surface172. As stated above, the heat transfer surface176 may be thermally coupled to one or more heat generating devices190 at locations on theheat transfer plate170 corresponding with the array offins174 of theimpingement surface172. The heat transfer surface176 operates to transfer heat from the heat generating device190 to theheat transfer plate170, including the one or more arrays offins174. Heat transferred to theheat transfer plate170 by the one or more heat generating devices190 can be transferred to coolant fluid flowing through the modularjet impingement assembly101. In one embodiment, the heat generating devices190 are thermally coupled to the heat transfer surface176 of theheat transfer plate170 via an intermediate, thermally conductive substrate layer (not shown) (for example and without limitation, thermal paste, epoxy, direct bonded copper (DBC), direct bonded aluminum (DBA), or similar materials). The heat generating devices190 may be bonded to the substrate layer by bonding techniques such as soldering, transient liquid phase bonding (TLP), or nano-silver sintering, for example. In some embodiments, the heat generating devices190 are not bonded to the heat transfer surface176 of aheat transfer plate170 but rather just positioned adjacent thereto. As described in more detail below, eachheat transfer plate170 is cooled using jet impingement, providing cooling to the heat generating devices190.

Heat generating devices190 may include, but are not limited to, electronics devices such as semiconductor devices, insulated gate bipolar transistors (IGBT), metal-oxide-semiconductor field effect transistors (MOSFET), power diodes, power bipolar transistors, and power thyristor devices. As an example and not a limitation, the heat generating device190 may be a component in an inverter and/or converter circuit used to electrically power high load devices, such as electric motors in electrified vehicles (e.g., hybrid vehicles, plug in hybrid electric vehicles, plug in electric vehicles, and the like).

Referring now toFIG. 6, the mass flow rate andfluid flow path103 of an exemplary embodiment of the modularjet impingement assembly101 is schematically depicted. In the embodiment depicted inFIG. 6, the diameters of the three angled inlet connection tubes122′-122′″ of eachmodular manifold110A-110C are 5 mm, 6 mm, and 5 mm, respectively. In this embodiment, a flow volume percentage (i.e., the percentage of the total coolant fluid that flows through an individual modular manifold110 in operation) through each of the threemodular manifolds110A-110C is varied such that more coolant fluid flows through the firstmodular manifold110A, less coolant fluid flows through the secondmodular manifold110B, and still less coolant fluid flows through the thirdmodular manifold110C. For example, in this embodiment, the flow volume percentage through the firstmodular manifold110A was calculated to be about 38.3%, the flow volume percentage through the secondmodular manifold110B was calculated to be about 32.1%, and the flow volume percentage through the thirdmodular manifold110C was calculated to be about 29.5%. It should be understood that these values relate to a specific exemplary embodiment and provide non-limiting examples of angled inlet connection tube122 diameter sizes. In other embodiments, the angled inlet connection tubes may comprise any contemplated diameter, for example, between about 2-10 mm, such as about 3 mm, 5 mm, and 7 mm.

In another embodiment, the diameters of the three angled inlet connection tubes122′-122′″ of themodular manifolds110A-110C are varied between each of themodular manifolds110A-110C. For example, in one embodiment, the diameters of the three angledinlet connection tubes122A′-122A′″ of the firstmodular manifold110A comprise about 5 mm, 6 mm, and 5 mm, respectively, the diameters of the three angledinlet connection tubes122B′-122B′″ of the secondmodular manifold110B comprise about 4.7 mm, 5.5 mm, and 4.7 mm, respectively, and the diameters of the three angledinlet connection tubes122C′-122C′″ of the thirdmodular manifold110C comprise about 4.5 mm, 5 mm, and 4.5 mm, respectively. In this embodiment, the mass flow percentage through the firstmodular manifold110A was calculated to be about 34.1%, the mass flow percentage through the second modular manifold was calculated to be about 32.8%, and the mass flow percentage through the third modular manifold was calculated to be about 33.1%.

In this embodiment, the diameters of respective angled inlet connection tubes122′-122′″ of eachmodular manifold110A-110C are smaller, the farther themodular manifold110A-110C is from thefluid inlet102. This creates a more uniform mass flow rate through eachmodular manifold110A-110C. The uniform mass flow rate allows coolant fluid to be applied evenly to eachmodular manifold110A-110C, for example, to provide uniform cooling to one or more heat generating devices190. In contrast, in the embodiment described previously, the diameters of respective angled inlet connection tubes122′-122′ of eachmodular manifold110A-110C are uniform across themodular manifolds110A-110C. This creates a non-uniform mass flow rate through eachmodular manifold110A-110C. The non-uniform mass flow rate through eachmodular manifold110A-110C allows more coolant fluid to be applied to particularmodular manifolds110A-110C, for example to provide targeted cooling to one or more heat generating devices190. It should be understood that these values relate to a specific exemplary embodiment and provide non-limiting examples of angled inlet connection tube122 diameter sizes. In other embodiments, the angled inlet connection tubes may comprise any contemplated diameter, for example, between about 2-10 mm, such as about 3 mm, 5 mm, and 7 mm. It should be understood that by altering the diameters of the angled inlet connection tubes122, the mass flow rate of the coolant fluid traversing the modular manifolds110 may be altered.

Additionally, in some embodiments, the mass flow rate of the coolant fluid along thefluid flow path103 may be altered by one or more porous media portions positioned within theinlet tube106, theoutlet tube108, and/or one or more angled inlet connection tubes. The one or more porous media portions alter the porosity of thefluid flow path103 and alter the mass flow rate of coolant fluid through the modularjet impingement assembly101. The porous media portions may comprise a cylindrical porous media having a diameter substantially similar to theinlet tube106. In some embodiments, one or more porous media portions may be positioned within the one or more angled inlet connection tubes122. Porous media portions may comprise, for example, a metal foam, a porous ceramic, a porous glass, and/or a porous plastic, for example, polyethylene, polypropylene, polytetrafluoroethylene, polyvinylidene, ethyl vinyl acetate, and the like.

Referring now toFIG. 7A, avalve180 comprising avalve inlet182 is depicted. One ormore valves180 may be positioned within or adjacent the one or more angled inlet connection tubes122 to alter the cross sectional area of the one or more angled inlet connection tubes122. By altering the cross sectional area of the angled inlet connection tubes122, the mass flow rate of coolant fluid entering the distribution manifold130 may be altered.Valves180 comprisingvalve inlets182 having a smaller cross sectional area allow less coolant fluid to enter the distribution manifold130 andvalves180 comprisingvalve inlets182 having a larger cross sectional area allow more coolant fluid to enter the distribution manifold130. Referring now toFIG. 7B, a schematic view of thevalve180 is depicted in a closed position, for example, when no coolant fluid is flowing through thevalve180. Referring now toFIG. 7C, a schematic view of thevalve180 is depicted in an open position. Thevalve180 may be in the open position when coolant fluid is flowing through thevalve180.

In some embodiments, thevalves180 may comprise an electro active polymer having an adjustable rigidity and may be strengthened or weakened in response to a received electronic signal. For example, a positive potential and/or a negative potential may be applied to the electro-active polymer. The adjustable rigidity of the one ormore valves180 may alter the flow resistance of the one ormore valves180. When anindividual valve180 comprising electro active polymer is strengthened, less coolant fluid is able to flow through thevalve inlet182 and when the valve comprising electro active polymer is weakened, more coolant fluid is able to flow through thevalve inlet182.

Some embodiments of the modularjet impingement assembly101 may further comprise a feedback loop controller communicatively coupled to the modularjet impingement assembly101, for example, communicatively coupled to one ormore valves180 positioned within the modularjet impingement assembly101. In some embodiments, the feedback loop controller comprises a proportional-integral-derivative (PID) feedback loop controller. Additionally, the feedback loop controller may be communicatively coupled with one or more temperature sensors and one or more pressure sensors configured to monitor the temperature and pressure of one or more components of the modularjet impingement assembly101 and one or more heat generating devices190 thermally coupled to the modularjet impingement assembly101. The feedback loop controller may provide a signal to the one ormore valves180 to adjust the rigidity of the one ormore valves180 to actively control the mass flow rate of the coolant fluid in response to received temperature and or pressure signals. For example, the feedback loop controller may weaken the rigidity of one ormore valves180 to provide more coolant fluid to an individual modular manifold110 in response to a high measured temperature of the individual modular manifold110.

Referring once again toFIGS. 1-3, operation of the modularjet impingement assembly101 will now be described. Coolant fluid flows through theinlet tube106 such that a portion of coolant fluid enters eachmodular manifold110A-110C, in a parallel flow pattern. In other embodiments, as described below (e.g.,FIG. 11), the coolant fluid may enter eachmodular manifold110A-110C iteratively in a series flow pattern. The volume of coolant fluid that enters eachmodular manifold110A-110C may be passively controlled as described above, for example, by altering the inlet geometry (e.g., diameter) of the angled fluid connection tubes122, positioning one ormore valves180 within thefluid flow path103, and/or positioning one or more porous media portions within thefluid flow path103. The volume of coolant fluid that enters eachmodular manifold110A-110C may also be actively controlled using the feedback loop controller communicatively coupled to the one ormore valves180, as described above. Further, thefluid inlet102 and thefluid outlet104 may be coupled to a fluid reservoir (not shown) that houses coolant fluid. The fluid reservoir can provide coolant fluid to the modularjet impingement assembly101 through thefluid inlet102 and cool heated coolant fluid when it returns to the fluid reservoir through thefluid outlet104, preparing the coolant fluid for reuse.

More specifically, referring to the firstmodular manifold110A depicted inFIGS. 1-3 for ease of understanding, coolant fluid enters the modularjet impingement assembly101 through thefluid inlet102, traverses theinlet tube106, and enters thefirst distribution recess130A of the firstmodular manifold110A through each of the angledinlet connection tubes122A′-122A′″ fluidly coupled to thefirst distribution recess130A. When themanifold insert140A is positioned with thedistribution recess130A, coolant fluid introduced into thefirst distribution recess130A enters theinlet branch channels142 of thefirst manifold insert140A and passes through the impingingslots152, forming a jet of coolant fluid that is ejected through themanifold insert140A toward theheat transfer plate170A.

When coolant fluid passes through the impingingslot152, it forms a jet of coolant fluid directed at the array offins174 positioned on theimpingement surface172 of theheat transfer plate170. The jet of coolant fluid impinges the array offins174 and transfers heat from the array offins174 to the coolant fluid. After impinging the one or more arrays offins174 of theheat transfer plate170, the heated coolant fluid flows away from the one or more arrays offins174 within the impingement chamber and reenters themanifold insert140 through the collectingslot154, for example, through anadjacent collecting slot154 and into anoutlet branch channel144. Additionally, theoutlet connection tubes124A′ and124A″ are positioned downstream from thedistribution recess130A and fluidly couple theoutlet branch channels144 and thedistribution recess130A with theoutlet tube108 of the modularjet impingement assembly101. The coolant fluid then flows through thefluid outlet104 and travels to the fluid reservoir where the coolant fluid is prepared for reuse.

Referring now toFIG. 8, apower electronics module200 including a modularjet impingement assembly201 is depicted comprising a plurality of removably coupledmodular manifolds210. In this embodiment, three removably coupledmodular manifolds210A-210C are depicted, however, it should be understood that any number ofmodular manifolds210 are contemplated. Themodular manifolds210A-210C comprise the same components as themodular manifolds110A-110C described above. Further, one or more manifold inserts240A-240C may be positioned within thedistribution manifolds230A-230C of each of themodular manifolds210A-210C and one or moreheat transfer plates270A-270C may be coupled to themodular manifolds210A-210C, as described above. Further, the one or moreheat transfer plates270A-270C may be thermally coupled to one or moreheat generating devices290A-290C.

The modularjet impingement assembly201 further comprises aninlet tube206 having a plurality of discrete portions traversing eachmodular manifold210 and anoutlet tube208 having a plurality of discrete portions traversing eachmodular manifold210. When the one or moremodular manifolds210 are coupled together, theinlet tubes206 and theoutlet tubes208 may be fluidly coupled to form a continuousfluid flow path203. The individualmodular manifolds210 may be coupled using a fastener engagement, for example, a flange and bolt arrangement as depicted inFIGS. 8-9, or a snap fit engagement, as depicted inFIG. 15. In embodiments comprising the flange and bolt arrangement depicted inFIGS. 8 and 9, each individualmodular manifold210 may comprise one ormore flanges250 that each include aflange hole252 disposed through theflange250. In embodiments in which multiplemodular manifolds210 are coupled together,flanges250 of adjacentmodular manifolds210 may be aligned. To couple the adjacentmodular manifolds210, a bolt can be disposed through the flange holes252 of theflanges250 of adjacentmodular manifolds210.

Referring now toFIG. 9, in these embodiments, an O-ring238 may be positioned betweenadjacent inlet tubes206 andadjacent outlet tubes208. The O-ring238 may be positioned within an O-ring groove239 of eachmodular manifold210 circumscribing theinlet tube206 and/or theoutlet tube208, providing a fluid-tight seal between adjacentmodular manifolds210. Additionally, as depicted inFIG. 8, the modularjet impingement assembly201 may comprise one or morefitting caps290 and may comprise anend cap292. The one or morefitting caps290 may be coupled to one or moremodular manifolds210, for example, as depicted inFIG. 8, the firstmodular manifold210A. Further, the one or morefitting caps290 and the one ormore end caps292 may includeflanges250 andflange holes252 which may be aligned with theflanges250 andflange holes252 of adjacentmodular manifolds210 allowing one or morefitting caps290, one ormore end caps292, or a combination of both, to be coupled to one or moremodular manifolds210. The one or morefitting caps290 also comprise one ormore throughputs291 which may be used as thefluid inlet202 and/or thefluid outlet204. Theend cap292 may be coupled to one of themodular manifolds210, for example, as depicted inFIG. 8, coupled to the thirdmodular manifold210C and may fluidly seal one side of themodular manifold210.

Referring toFIGS. 8 and 9, one ormore plugs284 may be removably positioned within theinlet tubes206, theoutlet tubes208, and/or thethroughputs291 of thefitting caps290 to fluidly block a portion of theinlet tube206, theoutlet tube208 and/or thethroughputs291 of thefitting caps290 to alter thefluid flow path203. As described below, theplugs284 may be positioned within the modularjet impingement assembly201 to provide a customizedfluid flow path203. For example, as depicted inFIG. 9, one ormore plugs284 may be positioned between discrete portions of theinlet tubes206 and/or theoutlet tubes208 to control thefluid flow path203 of the coolant fluid through the modularjet impingement assembly101. Theplugs284 may comprise a plastic, polymer, metal, or the like.

Referring now toFIGS. 10-14, in embodiments in which themodular manifolds210 are removably coupled, thefluid flow path203 may be altered by positioning one ormore plugs284 between adjacent discrete portions of theinlet tube206 and/or theoutlet tube208. For example, thefluid flow path203 may be positioned in a series flow pattern, a parallel flow pattern, or a combination thereof. Additionally, the positioning of thefitting cap290 and theend cap292 may alter thefluid flow path203.

Referring now toFIG. 10, an embodiment of the modularjet impingement assembly201 is depicted comprising three removably coupledmodular manifolds210A-210C. In this embodiment, thefluid inlet202 and thefluid outlet204 are each positioned within thefitting cap290A removably coupled to the firstmodular manifold210A and anend cap292 is positioned opposite thefitting cap290A and is removably coupled to the thirdmodular manifold210C. Further, aplug284 is positioned between theend cap292 and theinlet tube206 and in alignment with thefluid inlet202 such that thefluid flow path203 is configured in a parallel flow pattern. In the parallel flow pattern, a portion of the coolant fluid flows through each of themodular manifolds210A-210C.

Referring now toFIG. 11, another embodiment of the modularjet impingement assembly201 is depicted comprising threemodular manifolds210A-210C assembled such that thefluid inlet202 is positioned within thefitting cap290 coupled to the firstmodular manifold210A and thefluid outlet204 is positioned within thefitting cap290 coupled to the thirdmodular manifold210C. Further, plugs284 are positioned withinunused throughputs291 of each fitting caps290 (i.e. thethroughputs291 that are not being used as thefluid inlet202 or the fluid outlet204) such that thefluid flow path203 is configured in a parallel flow pattern and a portion of the coolant fluid flows through each of themodular manifolds210A-210C.

Referring now toFIG. 12, another embodiment of the modularjet impingement assembly201 is depicted comprising threemodular manifolds210A-210C assembled such that thefluid inlet202 is positioned within thefitting cap290 coupled to the firstmodular manifold210A and thefluid outlet204 is positioned within thefitting cap290 coupled to the thirdmodular manifold210C.Plugs284 are positioned withinunused throughputs291 of each fitting cap290 (i.e. thethroughputs291 that are not being used as thefluid inlet202 or the fluid outlet204). Additionally, aplug284 is positioned between the discrete portions of theinlet tube206 that extend through the firstmodular manifold210A and the secondmodular manifold210B and anotherplug284 is positioned between the discrete portions of theoutlet tube208 that extend through the secondmodular manifold210B and the thirdmodular manifold210C. In this arrangement, thefluid flow path203 is configured in a series flow pattern. In the series flow pattern, all coolant fluid that enters thefluid inlet202 flows through each of themodular manifolds210A-210C iteratively. For example, in operation, the coolant fluid first traverses the firstmodular manifold210A, impinging the impingement surface272 of the firstheat transfer plate270A, next traverses the secondmodular manifold210B, impinging the impingement surface272 of the secondheat transfer plate270B, next traverses the thirdmodular manifold210C, impinging the impingement surface272 of the third heat transfer plate270, and finally exits through thefluid outlet204.

Referring now toFIG. 13, an embodiment of the modularjet impingement assembly201 is depicted comprising threemodular manifolds210A-210C assembled such that thefluid flow path203 comprises a partial series and a partial parallel flow pattern. In this embodiment, thefluid inlet202 is positioned within thefitting cap290 coupled to the firstmodular manifold210A and thefluid outlet204 is positioned within thefitting cap290 coupled to the thirdmodular manifold210C. Thefluid inlet202 and thefluid outlet204 are each aligned with theinlet tube206.Plugs284 are positioned withinunused throughputs291 of each fitting caps290 (i.e. thethroughputs291 that are not being used as thefluid inlet202 or the fluid outlet204). Additionally, aplug284 is positioned between discrete portions of theinlet tube206 that extend through the secondmodular manifold210B and the thirdmodular manifold210C. In this embodiment, thefluid flow path203 traverses the firstmodular manifold210A and the secondmodular manifold210B in a parallel flow pattern and traverses the thirdmodular manifold210C is in a series flow pattern. In this embodiment, in operation, a first portion of the coolant fluid traverses the firstmodular manifold210A and a second portion of the coolant fluid traverses the secondmodular manifold210B substantially simultaneously. Next, all the first and second portion of the coolant fluid rejoin before traversing the thirdmodular manifold210C and exiting thefluid outlet204.

Referring now toFIG. 14, an embodiment of the modularjet impingement assembly201 is depicted comprising threemodular manifolds210A-210C assembled such that thefluid flow path203 comprises a partial series and a partial parallel flow pattern. In this embodiment, thefluid inlet202 is positioned within thefitting cap290 coupled to the firstmodular manifold210A and thefluid outlet204 is positioned within thefitting cap290 coupled to the thirdmodular manifold210C. Thefluid inlet202 and thefluid outlet204 are each aligned with theoutlet tube208.Plugs284 are positioned withinunused throughputs291 of each fitting caps290 (i.e. thethroughputs291 that are not being used as thefluid inlet202 or the fluid outlet204). Additionally, aplug284 is positioned between discrete portions of theinlet tube206 that extend through the firstmodular manifold210A and the secondmodular manifold210B. In this embodiment, thefluid flow path203 traverses the firstmodular manifold210A is a series flow pattern and traverses the secondmodular manifold210B and the thirdmodular manifold210C is in a parallel flow pattern. In this embodiment, in operation, the coolant fluid first traverses the firstmodular manifold210A then a first portion of the coolant fluid traverses the secondmodular manifold210B and a second portion of the coolant fluid traverses the thirdmodular manifold210C substantially simultaneously. Next, all the first and second portion of the coolant fluid rejoin and exit thefluid outlet204.

Referring now toFIG. 15, another embodiment of a modularjet impingement assembly300 is depicted comprising a plurality of removably coupled modular manifolds310 comprising a snap fit coupling configuration. In this embodiment, each modular manifold310, (e.g., a firstmodular manifold310A and a secondmodular manifold310B) comprise one ormore tab portions394 and one ormore hook portions396 configured to connect in a snap-fit arrangement to create a fluid seal between the firstmodular manifold310A and the secondmodular manifold310B.

It should now be understood that modular jet impingement assemblies and power electronics modules incorporating modular jet impingement assemblies allow for passive and active fluid flow control to facilitate efficient transfer of heat away from heat generating devices, which may increase the life of the heat generating device. The modular jet impingement assemblies comprise an inlet tube fluidly coupled to an fluid inlet, an outlet tube fluidly coupled to a fluid outlet, one or more modular manifolds, one or more manifold inserts removably positioned within the one or more modular manifolds, and one or more heat transfer plates coupled to modular manifolds and positioned proximate the one or more manifold inserts. The modular manifolds are configured to provide jet impingement cooling to the one or more heat transfer plates. Coolant fluid flow through the modular jet impingement assemblies may be passively controlled by altering the geometry of a fluid flow path and actively controlled by positioning one or more electronically adjustable valves within the fluid flow path. Additionally, the modular manifolds of the modular jet impingement assemblies may be removably coupled such that one or more plugs can be positioned between adjacent modular manifolds to generate parallel fluid flow patterns, series fluid flow patterns, or a combination thereof.

It is noted that the term “substantially” may be utilized herein to represent the inherent degree of uncertainty that may be attributed to any quantitative comparison, value, measurement, or other representation. This term is also utilized herein to represent the degree by which a quantitative representation may vary from a stated reference without resulting in a change in the basic function of the subject matter at issue.

While particular embodiments have been illustrated and described herein, it should be understood that various other changes and modifications may be made without departing from the spirit and scope of the claimed subject matter. Moreover, although various aspects of the claimed subject matter have been described herein, such aspects need not be utilized in combination. It is therefore intended that the appended claims cover all such changes and modifications that are within the scope of the claimed subject matter.

Claims (20)

What is claimed is:

1. A modular jet impingement assembly comprising:

an inlet tube fluidly coupled to a fluid inlet;

an outlet tube fluidly coupled to a fluid outlet;

a modular manifold comprising:

a distribution recess;

one or more angled inlet connection tubes positioned at an inlet end of the modular manifold, wherein the one or more angled inlet connection tubes are angled with respect to a surface of the modular manifold and fluidly couple the inlet tube to the distribution recess; and

one or more outlet connection tubes positioned at an outlet end of the modular manifold, fluidly coupling the outlet tube to the distribution recess;

a manifold insert removably positioned within the distribution recess of the modular manifold, the manifold insert comprising:

one or more inlet branch channels fluidly coupled to the one or more angled inlet connection tubes, each inlet branch channel including an impinging slot; and

one or more outlet branch channels fluidly coupled to the one or more inlet branch channels and the one or more outlet connection tubes, each outlet branch channel including a collecting slot; and

a heat transfer plate coupled to the modular manifold, the heat transfer plate comprising an impingement surface including an array of fins that extend toward the manifold insert.

2. The modular jet impingement assembly ofclaim 1 wherein the impingement surface of the heat transfer plate fluidly couples the impinging slot of the one or more inlet branch channels to the collecting slot of the one or more outlet branch channels.

3. The modular jet impingement assembly ofclaim 1 wherein the one or more angled inlet connection tubes comprise a first angled inlet connection tube having a first angled inlet diameter and a second angled inlet connection tube having a second angled inlet diameter that is larger than the first angled inlet diameter.

4. The modular jet impingement assembly ofclaim 1 wherein the one or more angled inlet connection tubes are angled with respect to the surface of the modular manifold between about 5° and about 25°.

5. The modular jet impingement assembly ofclaim 1 wherein at least one inlet branch channel comprises a tapered portion.

6. The modular jet impingement assembly ofclaim 1, further comprising one or more valves fluidly coupled to the one or more angled inlet connection tubes, wherein each of the one or more valves includes a valve inlet.

7. The modular jet impingement assembly ofclaim 6 wherein the one or more valves comprise an electro active polymer.

8. The modular jet impingement assembly ofclaim 7, wherein the one or more valves are communicatively coupled to a feedback loop controller, wherein the feedback loop controller provides a signal to the electro active polymer of the one or more valves to adjust a rigidity of the electro active polymer.

9. The modular jet impingement assembly ofclaim 1, further comprising one or more porous media portions positioned within the inlet tube, the one or more angled inlet connection tubes, the outlet tube, or a combination thereof.

10. The modular jet impingement assembly ofclaim 1, further comprising a plurality of modular manifolds and a plurality of manifold inserts wherein an individual manifold insert is positioned within an individual distribution recess of the plurality of modular manifolds.

11. The modular jet impingement assembly ofclaim 10 wherein a first modular manifold is removably coupled to a second modular manifold positioned adjacent the first modular manifold such that a fluid flow path through the first modular manifold and the second modular manifold comprises a parallel flow pattern.

12. The modular jet impingement assembly ofclaim 10 wherein a first modular manifold is removably coupled to a second modular manifold positioned adjacent the first modular manifold and one or more plugs are positioned between the first modular manifold and the second modular manifold such that a fluid flow path through the first modular manifold and the second modular manifold comprises a series flow pattern.

13. A power electronics module comprising:

a modular jet impingement assembly comprising:

an inlet tube fluidly coupled to a fluid inlet;

an outlet tube fluidly coupled to a fluid outlet;

a modular manifold comprising:

a distribution recess;

one or more angled inlet connection tubes positioned at an inlet end of the modular manifold, wherein the one or more angled inlet connection tubes are angled with respect to a surface of the modular manifold and fluidly couple the inlet tube to the distribution recess; and

one or more outlet connection tubes positioned at an outlet end of the modular manifold, fluidly coupling the outlet tube to the distribution recess;

a manifold insert removably positioned within the distribution recess of the modular manifold, the manifold insert comprising:

one or more inlet branch channels fluidly coupled to the one or more angled inlet connection tubes, each inlet branch channel including an impinging slot; and

one or more outlet branch channels fluidly coupled to the one or more inlet branch channels and the one or more outlet connection tubes, each outlet branch channel including a collecting slot; and

a heat transfer plate coupled to the modular manifold, the heat transfer plate comprising an impingement surface including an array of fins that extend toward the manifold insert; and

an electronics device positioned in thermal contact with the heat transfer plate opposite the array of fins.

14. The power electronics module ofclaim 13 wherein the impingement surface of the heat transfer plate fluidly couples the impinging slot of the one or more inlet branch channels to the collecting slot of the one or more outlet branch channels.

15. The power electronics module ofclaim 13 wherein the one or more angled inlet connection tubes comprise a first angled inlet connection tube having a first angled inlet diameter and a second angled inlet connection tube having a second angled inlet diameter that is larger than the first angled inlet diameter.

16. The power electronics module ofclaim 13, further comprising a plurality of modular manifolds and a plurality of manifold inserts wherein an individual manifold insert is positioned within an individual distribution recess of the plurality of modular manifolds.

17. The power electronics module ofclaim 16 wherein a first modular manifold is removably coupled to a second modular manifold positioned adjacent the first modular manifold such that a fluid flow path through the first modular manifold and the second modular manifold comprises a parallel flow pattern or a series flow pattern.

18. A modular jet impingement assembly comprising:

an inlet tube fluidly coupled to a fluid inlet;

an outlet tube fluidly coupled to a fluid outlet;

two or more modular manifolds, wherein each modular manifold comprises:

a distribution recess;

one or more angled inlet connection tubes positioned at an inlet end of the modular manifold, wherein the one or more angled inlet connection tubes are angled with respect to a surface of the modular manifold and fluidly couple the inlet tube to the distribution recess; and

one or more outlet connection tubes positioned at an outlet end of the modular manifold, fluidly coupling the outlet tube to the distribution recess;

one or more manifold inserts removably positioned within the distribution recess of each modular manifold, wherein each manifold insert comprises:

one or more inlet branch channels fluidly coupled to the one or more angled inlet connection tubes, each inlet branch channel including an impinging slot; and

one or more outlet branch channels fluidly coupled to the one or more inlet branch channels and the one or more outlet connection tubes, each outlet branch channel including a collecting slot; and

one or more heat transfer plates coupled to each modular manifold, each heat transfer plate comprising an impingement surface including an array of fins that extend toward the one or more manifold inserts;

wherein a diameter of a first angled inlet connection tube of a first modular manifold is greater than a diameter of a first angled inlet connection tube of a second modular manifold.

19. The modular jet impingement assembly ofclaim 18 wherein a diameter of a second angled inlet connection tube of the first modular manifold is greater than a diameter of a second angled inlet connection tube of the second modular manifold.

20. The modular jet impingement assembly ofclaim 19 wherein a diameter of a third angled inlet connection tube of the first modular manifold is greater than a diameter of a third angled inlet connection tube of the second modular manifold.

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