US9351424B2 - Passive cooling enclosure system and method for electronics devices - Google Patents

Abstract

An apparatus for passively cooling electronics. The apparatus for passively cooling electronics includes at least one heat sink configured to be thermally coupled to at least one cabinet. When the at least one cabinet is thermally coupled to the at least one heat sink, the at least one heat sink draws heat from the at least one cabinet.

Description

CROSS-REFERENCE TO RELATED PATENT APPLICATIONS

The present application is a continuation of U.S. patent application Ser. No 12/716,888, filed Mar. 3, 2010, which is a Continuation-In-Part of U.S. patent application Ser. No. 12/488,818, filed Jun. 22, 2009, the entire contents of each of which are incorporated herein by reference in their entirety.

BACKGROUND

The present disclosure relates generally to the field of passive cooling and more particularly to passive cooling of electronics devices.

Legacy electronics device cooling technologies typically use a forced air cooling method to remove heat from the electronics device. More recently, advanced cooling methods, such as water cooling and phase cooling systems, have been explored. However, there are many issues, for example with installation and maintenance that arise from the use of these systems in electronics devices.

The majority of existing systems depend on a forced air cooling method, i.e. fans. In existing systems, fans are used to cool processors and other internal components. Fans suffer from multiple deficiencies. For example, fans require significant physical space, are noisy because of high RPMs, require a significant ventilation space, produce heat as they are working to reduce heat, and consume vast amounts of power to operate. Additionally, the manufacturing process by which the majority of fans are made in some instances may use harmful industrial chemicals that could be reactivated as the temperature of a fan's blades increases thereby releasing these chemicals into exposed environments. Thus, there are high costs as well as potential health and environmental issues associated with operating fan-based systems. Often, data centers are designed for more wattage then necessary in order to account for necessary, but inefficient cooling systems. In addition, fan-based systems are prone to failure due to accumulation of dust, motor malfunction or burn-out thereby increasing operational and maintenance costs. When over-heating occurs components suffer irreversible damage, increasing cost, power consumption, and environmental impact.

Liquid cooling systems are two systems in one. Liquid cooling systems are greatly limited in their cooling capacity, depending on the configuration of the electronics device. Liquid cooling systems require heat exchangers such as a radiator. As a result, liquid cooling systems still require fans to cool the radiator and other components not attached to a heat exchanger thereby supplanting the inefficiency of a forced air cooling system with a potentially dangerous and costly liquid cooling system still reliant on fans. Liquid cooling systems require significant physical space, are complicated, are noisy because of radiator fans, require a significant ventilation space, produce heat as they are working to reduce heat, and consume vast amounts of power to operate and maintain. The end user must devote significant time and effort to set-up and maintain a liquid cooling system.

Moreover, the proximity of cooling liquid with electronics is a potential safety risk. Because components produce a lot of heat, the tubing typically used is constantly expanding and contracting causing the tubes to fail and leak cooling solution, which can result in electrical shorts and irreparable internal damage.

Phase cooling involves using a compressor system to cool electronics. Phase cooling typically only cools the CPU so fans are still needed to cool other components. The fans and compressor make a significant amount of noise, require extensive maintenance, and consume a significant amount of power. Operating a phase cooling system requires a high degree of technical proficiency.

Thus, improved cooling systems and techniques are needed.

SUMMARY

A representative embodiment relates to an apparatus for passively cooling electronics. The apparatus for passively cooling electronics includes at least one heat sink configured to be thermally coupled to at least one cabinet. When the at least one cabinet is thermally coupled to the at least one heat sink, the at least one heat sink draws heat from the at least one cabinet.

Another representative embodiment relates to an apparatus for passively cooling electronics. The apparatus for passively cooling electronics includes a cabinet configured to be thermally coupled to at least one heat sink. When the cabinet is thermally coupled to the at least one heat sink, the at least one heat sink draws heat from the cabinet.

Another representative embodiment relates to a method for passively cooling electronics. The method includes drawing heat from a cabinet through a thermal joint to at least one heat sink. The heat is dissipated in a channel. The at least one heat sink forms at least part of the channel.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of a passive cooling system in accordance with a representative embodiment.

FIG. 2 is an exploded view of the passive cooling system ofFIG. 1 in accordance with a representative embodiment.

FIG. 3 is a top view of the passive cooling system ofFIG. 2 in accordance with a representative embodiment.

FIG. 4 is a perspective view of the device module ofFIG. 2 in accordance with a representative embodiment.

FIG. 5A-5F are diagrams of representative heat pipe topologies in accordance with a representative embodiment.

FIG. 6 is an exploded view of the heat pipe assembly ofFIG. 2 in accordance with a representative embodiment.

FIG. 7 is a diagram of the bridge plate ofFIG. 6 in accordance with a representative embodiment.

FIG. 8 is a perspective view of the processor heat pipe assembly ofFIG. 2 in accordance with a representative embodiment.

FIG. 9 is a perspective view of a passive cooling enclosure system in accordance with a representative embodiment.

FIG. 10 is a front view of the passive cooling enclosure system ofFIG. 9 in accordance with a representative embodiment.

FIG. 11 is a top view of the passive cooling enclosure system ofFIG. 9 in accordance with a representative embodiment.

FIG. 12 is a side view of the passive cooling enclosure system ofFIG. 9 in accordance with a representative embodiment.

FIG. 13 is a top view of the inside of a cabinet ofFIG. 9 in accordance with a representative embodiment.

FIG. 14 is a top view of a passive cooling enclosure system with a rear heat sink in accordance with a representative embodiment.

FIG. 15 is a top view of a passive cooling enclosure system configuration in accordance with a representative embodiment.

FIG. 16 is a front view of a passive cooling enclosure system configuration ofFIG. 15 in accordance with a representative embodiment.

FIG. 17 is a top view of a server room in accordance with a representative embodiment.

FIG. 18 is a side view of the server room ofFIG. 17 in accordance with a representative embodiment.

FIG. 19 is a top view of a server room with various alternate configurations in accordance with a representative embodiment.

FIG. 20 is a perspective view of a passive cooling enclosure system in accordance with a representative embodiment.

FIG. 21 is a front perspective view of a passive cooling enclosure system ofFIG. 20 in accordance with a representative embodiment.

FIG. 22 is a top view of a thermal joint in accordance with a representative embodiment.

FIG. 23 is a side view of a thermal joint ofFIG. 22 in accordance with a representative embodiment.

FIG. 24 is a top view of a protected heat pipe in accordance with a representative embodiment.

FIG. 25 is a top view of a portion of a passive cooling system in accordance with a representative embodiment.

FIG. 26 is a top view of power supply unit in accordance with a representative embodiment.

DETAILED DESCRIPTION

A passive cooling enclosure system and method for electronics devices are described. In the following description, for purposes of explanation, numerous specific details are set forth to provide a thorough understanding of representative embodiments of the invention. It will be evident, however, to one skilled in the art that the representative embodiments may be practiced without these specific details. The drawings are not to scale. In other instances, well-known structures and devices are shown in simplified form to facilitate description of the representative embodiments.

Referring toFIG. 1, a perspective view of apassive cooling system100 in accordance with a representative embodiment is shown. In an embodiment, thepassive cooling system100 is configured as a rack-mount chassis. Thepassive cooling system100 includes afront panel110, adrive bay120, acover130,heat sinks140,filler strip150, and amedia drive160. Thefront panel110 includesholes113 for mounting thepassive cooling system100 to a rack (not shown). The rack can be a 19 inch rack, a 23 inch rack, a half rack, or any other size or depth rack. Likewise, non-rack configurations are possible. Additionally, theholes113 can include quick connects, rails, or other fasteners. Thefront panel110 also includeshandles115 for moving thepassive cooling system100 and alatch111 for securingbay doors125 that cover thedrive bay120. The media drive160 can be, for example, a compact disc (CD) burner or a tape drive.

Thepassive cooling system100 can be any height or depth. In particular, thedrive bay120 can be a 1 unit, 2 unit, 4 unit, 8 unit, or 16 unit bay. The bays can be configured in various configurations such as horizontal or vertical. Additionally, thepassive cooling system100 can include other input devices such as removable media drives, keyboards, displays, mice, or joysticks. Alternatively, thepassive cooling system100 can be a programmable logic controller chassis, a blade chassis, a VMEbus-type enclosure, a PCI-type enclosure, a CompactPCI-type enclosure, a server, or any other electronic device with modular bays and/or sub-bays. Thepassive cooling system100 can also be a desktop computer, a tower computer, an all-in-one system where the display is integrated, an appliance, or a mobile platform such as a laptop.

Referring toFIG. 2, an exploded view of thepassive cooling system100 ofFIG. 1 in accordance with a representative embodiment is shown. Thepassive cooling system100 includes afront panel110, acover130,heat sinks140,filler strip150, and amedia drive160. Thefront panel110 includeshandles115 and alatch111 for securingbay doors125 that cover the drive bay. Thepassive cooling system100 also includes aheat pipe assembly210, adevice module220, a processorheat pipe assembly230, amotherboard260, a daughterboard250, a bottom270, and a back panel280. Thefront panel110, thecover130,heat sinks140,filler strip150, the bottom270, and the back panel280 constitute the enclosure of thepassive cooling system100.

Thedevice module220 includes a cradle assembly and an electronic component. Preferably, the electronic component is a hot-swappable non-volatile storage device such as a hard drive. Alternatively, the electronic component can be any electronic device; for example, a 3.5″ hard drive, a 2.5″ hard drive, a 5.25″ drive, an optical drive, a tape drive, solid state drive, a card reader, a memory bank, a magnetic memory bank, a communications module, a daughterboard, a sensor module, or an input/output module. The electronic component is thermally coupled to the cradle assembly. The cradle assembly draws heat away from the electronic component. Thepassive cooling system100 can include a plurality of device modules. The cradle assembly can also include a clamping or securing mechanism as described in more detail below.

Thedevice module220 is removably mounted on theheat pipe assembly210 via the cradle assembly. Thedevice module220 is thermally coupled to theheat pipe assembly210. Theheat pipe assembly210 is thermally coupled to theheat sinks140 andfiller strip150. Theheat pipe assembly210 draws heat from thedevice module220. The heat sinks140 draw heat from theheat pipe assembly210. Each of the thermal couplings where two separate pieces meet can include a thermal compound to enhance the thermal characteristics of the junction. Alternatively, theheat pipe assembly210,heat sinks140 andfiller strip150 can be one piece that is thermally continuous. Theheat pipe assembly210 can also include electrical connections for the electronic component. Theheat pipe assembly210 is described in more detail below.

The electronic component ofdevice module220 is electrically connected to themotherboard260. Themotherboard260 can also include daughterboard250 which can be, for example, a video card, an Ethernet card, a processor card, or any other computer card. Themotherboard260 controls thedevice module220 and daughterboard250. Themotherboard260 can be powered through the rack to which thepassive cooling system100 is mounted. Themotherboard260 includes one or more processors which are thermally coupled to theheat sinks140 by processorheat pipe assembly230. Alternatively, other devices of themotherboard260 and daughterboard250, for example, a power supply, can also be thermally coupled to the heat sinks140. Advantageously, thepassive cooling system100 provides effective cooling to thedevice module220 and processors of themotherboard260 without the use of a fan or liquid cooling system, and without the need for additional power or costly maintenance.

Referring toFIG. 3, a top view of thepassive cooling system100 ofFIG. 2 in accordance with a representative embodiment is shown. The block arrows depict the main thermal paths through which heat can travel. Thepassive cooling system100 includes afront panel110,heat sinks140, filler strips150, aheat pipe assembly210,device modules220, a processorheat pipe assembly230, amotherboard260, amemory module310, and a power supplyheat pipe assembly320.

Asdevice modules220 generate heat,heat pipe assembly210 draws heat away from thedrive modules220. The filler strips150 draw heat away from theheat pipe assembly210. Finally, theheat sinks140 draw heat away from the filler strips150 and dissipate the heat into the ambient atmosphere. Thus, theheat sinks140, filler strips150,heat pipe assembly210, anddevice modules220 form an open-loop cooling system.

As a processor (not shown) of themotherboard260 generates heat, processorheat pipe assembly230 draws heat away from the processor. The heat sinks140 draw heat away from the processorheat pipe assembly230. Likewise, as a power supply (not shown) of themotherboard260 generates heat, power supplyheat pipe assembly320 draws heat away from the processor. The heat sinks140 draw heat away from the power supplyheat pipe assembly320. In some cases, components do not need additional cooling. For example,memory module310 can be cooled by the ambient atmosphere. Advantageously, thepassive cooling system100 provides effective cooling to thedevice module220, processor and power supply without the use of a fan or liquid cooling system.

Referring toFIG. 4, a perspective view of thedevice module220 ofFIG. 2 in accordance with a representative embodiment is shown. Thedevice module220 includes acradle assembly410 and anelectronic component420. Theelectronic component420 is fastened to thecradle assembly410. Theelectronic component420 can be a non-volatile storage device, such as a hard disc drive, as described above. Thecradle assembly410 can be both a thermal sink and a docking mechanism for theelectronic component420. Thecradle assembly410 can be made of metal, or any thermally conductive material. Preferably, thecradle assembly410 is made of aluminum or copper alloy. Thecradle assembly410 can be machined, cast, or extruded. Heat spreaders can be embedded in thecradle assembly410. A thermal compound can be applied to the space between theelectronic component420 and thecradle assembly410.

Thecradle assembly410 includesheat pipe conduits430. Thecradle assembly410 is docked on heat pipes that matchheat pipe conduits430. Thecradle assembly410 can have one or a plurality ofheat pipe conduits430. Theheat pipe conduits430 are disposed on either side of theelectronic component420. Alternatively, theheat pipe conduits430 can be located near a primary heat source of theelectronic component420. Theheat pipe conduits430 can be 1.5 inches or smaller in diameter depending on the application; however, larger conduits are also possible. For example, theheat pipe conduits430 can range from 1.5 inches to 0.25 inches in diameter. Additionally, theheat pipe conduits430 can each be a different size. For example, a heat conduit/heat pipe located towards the center of an enclosure can be larger than a heat conduit/heat pipe located towards the outside of the enclosure. Theheat pipe conduits430 include clampingslots440 which can be used to change the size of theheat pipe conduits430.

The clampingslots440 are associated with aclamping mechanism450. When a clampinglever460 is pressed in, theclamping mechanism450 closes the clampingslots440 thereby tightening theheat pipe conduits430. The clamping action creates a better thermal coupling between thecradle assembly410 and its associated heat pipes. Additionally, the clamping action fastens thecradle assembly410 to the heat pipes so that thecradle assembly410 cannot move and maintain thermal continuity. Thus, thecradle assembly410 can be quickly removed and replaced. Alternatively, many other clamping and/or attachment mechanisms are possible.

Referring toFIG. 5A-5F, diagrams of representative heat pipe topologies in accordance with a representative embodiment are shown. As shown inFIG. 5A, aheat pipe510 can be circular. As shown inFIG. 5B, aheat pipe520 can have fingers that press into the side ofcradle assembly525. As shown inFIG. 5C, aheat pipe530 can have fins to increase surface area. As shown inFIG. 5D, aheat pipe540 can be square and be pressed betweencradle assembly547 and aseparate batten545. As shown inFIG. 5E, aheat pipe550 can be triangular. As shown inFIG. 5F, aheat pipe560 can be circular and be pressed betweencradle assembly567 and aseparate batten565.

Referring toFIG. 6, an exploded view of theheat pipe assembly210 ofFIG. 2 in accordance with a representative embodiment is shown. Theheat pipe assembly210 includes abridge plate610, a back plane printed circuit board (PCB)620, andheat pipes630. Theheat pipes630 are coupled to thebridge plate610 through theback plane PCB620. Thebridge plate610 is coupled tofiller strips150 byscrews655. A thermal compound can be applied to the space between thebridge plate610 and the filler strips150.

Thebridge plate610 can be both a thermal sink and a dock fordevice module220. Thebridge plate610 can be made of metal or any thermally conductive material. In some implementations, thebridge plate610 is made of an aluminum or copper alloy. Thebridge plate610 can be machined, cast, stamped or extruded. Heat spreaders can be embedded in thebridge plate610. Thebridge plate610 includes a series of tap holes forheat pipes630. Alternatively, theheat pipes630 can be fastened to thebridge plate610 by pressing or other fastening means that provide a good thermal connection. A thermal compound can be applied to the space between thebridge plate610 and theheat pipes630.

Thedevice module220 slides over a pair ofheat pipes630. Theheat pipes630 are tapered at one end to make sliding thedevice module220 onto theheat pipes630 easy. Theheat pipes630 can range from 1.5 inches or less in diameter depending on the application. Theheat pipes630 are arranged so that when a device module is mounted, theheat pipes630 are disposed on either side of the device module. Alternatively, theheat pipes630 can be arranged in various configurations around a device module such as on the top and bottom. Theheat pipes630 can be made of metal or any thermally conductive material. Preferably, theheat pipes630 are made of thermally conductive material, such as copper alloy or aluminum. Theheat pipes630 can also be plated to prevent oxidation. Theheat pipes630 can be machined, cast, stamped or extruded. In use, a thermal compound can be applied to the surface of theheat pipes630 to promote thermal conductivity to an associateddevice module220 and to reduce oxidation. When the clamping mechanism of thedevice module220 is set, the cradle assembly of thedevice module220 presses against the associatedheat pipes630 creating a thermal and physical connection.

Theback plane PCB620 includes the power and data connections for thedevice module220. Theback plane PCB620 is connected to the motherboard of the electronics device. Thus, thedevice module220 can be easily electrically connected to the motherboard. Theback plane PCB620 is a custom PCB designed to fit around theheat pipes630. Theback plane PCB620 includes connections appropriate for the particular kind of electronic component associated with thedevice module220. For example, where thedevice module220 is mounted with a hard disk, theback plane PCB620 includes power and serial ATA, EIDE, IDE, or SCSI connectors. Thus, when a user inserts device module into a bay, the device module engages a power connector and a data connector. When the user engages the clamping mechanism, the device module becomes locked in place. The clamping mechanism can be designed to actively engage the connectors on theback plane PCB620.

Referring toFIG. 7, a diagram of thebridge plate610 ofFIG. 6 in accordance with a representative embodiment is shown. Thebridge plate610 includesheat spreaders710 for each set of heat pipes. In one implementation, thebridge plate610 is aluminum and theheat spreader710 is made of copper alloy. Theheat spreader710 is located inside of thebridge plate610. Thebridge plate610 also includesholes720 which are used to attach the heat pipes. Theholes720 go through theheat spreader710 so that when the heat pipes are attached, there is a direct thermal connection between the heat pipes and theheat spreader710. Theheat spreader710 increases the thermal transfer efficiency of thebridge plate610 by directing the thermal flow. In this example, theheat spreaders710 are doughnut shaped. Alternatively, the heat spreader could run horizontally as well as other configurations.

Referring toFIG. 8, a perspective view of the processorheat pipe assembly230 ofFIG. 2 in accordance with a representative embodiment is shown.Motherboard260 includesprocessors810. A firstthermal mass820 is attached to each of theprocessors810. The firstthermal masses820 are thermally coupled to secondthermal masses840 byheat pipes830. The secondthermal masses840 are each thermally coupled to aheat sink140. A thermal compound can be applied between the firstthermal masses820 and the processors; and the secondthermal masses840 and the heat sinks140.

As the processors produce heat, the firstthermal masses820 draw heat from the processors. The secondthermal masses840 draw heat from the firstthermal masses820 throughheat pipes830. The heat sinks140 draw heat from the secondthermal masses840. Finally, theheat sinks140 dissipate the heat into the ambient air. Advantageously, the passive cooling system provides effective cooling to processors without the use of fans or a liquid cooling system.

As noted above, a power supply can also be thermally coupled to a heat sink. Referring toFIG. 25, a top view of a portion of apassive cooling system2500 in accordance with a representative embodiment is shown. The portion of apassive cooling system2500 is an illustrative power supply area of a passive cooling system including aheat sink140, afiller strip150, and amotherboard260, as described above.

Apower supply2510 can be thermally coupled to theheat sink140. Thepower supply2510 provides power for the passive cooling system. Thepower supply2510 can include a printedcircuit board2520, a first power supply integratedcircuit2530, a second power supply integratedcircuit2540,components2550, andcapacitor2560. Thepower supply2510 can be attached to theheat sink140 bystandoffs2570. The first power supply integratedcircuit2530 and the second power supply integratedcircuit2540 can be, for example, a power transistor or a power supply module. The first power supply integratedcircuit2530 and the second power supply integratedcircuit2540 can, for example, switch at a high rate in order to convert 120 VAC to one of at least 12 VDC, 5 VDC, 3.3 VDC or any other voltage, thereby generating heat.

In one illustrative embodiment, the first power supply integratedcircuit2530 and the second power supply integratedcircuit2540 are soldered to a first side of the printedcircuit board2520 such that the first power supply integratedcircuit2530 and the second power supply integratedcircuit2540 can be positioned directly against theheat sink140 thereby thermally coupling the first power supply integratedcircuit2530 and the second power supply integratedcircuit2540 to theheat sink140. The junction between the power supply integrated circuits (2530,2540) and theheat sink140 can include a thermal compound to enhance the thermal characteristics of the thermal coupling. Heat generated by thepower supply2510, in particular, the first power supply integratedcircuit2530 and the second power supply integratedcircuit2540, is drawn to theheat sink140 and dissipated into the ambient air.

Other parts of thepower supply2510, such ascomponents2550, andcapacitor2560, can be located on a second side of the printedcircuit board2520. Thecomponents2550 andcapacitor2560 are arranged so that the area of the printedcircuit board2520 can be minimized while providing clearance for the power supply integrated circuits (2530,2540) on the first side of the printedcircuit board2520. Alternatively, the first power supply integratedcircuit2530, the second power supply integratedcircuit2540, thecomponents2550, and thecapacitor2560 can be located on one side of the printedcircuit board2520 and arranged so that the power supply integrated circuits (2530,2540) can contact theheat sink140. Theheat sink140 can include a raised area to enable contact with the power supply integrated circuits (2530,2540). Alternatively, any number of power supply integrated circuits or components can be thermally coupled to the heat sink. Advantageously, the power supply can be cooled directly by a heat sink of the passive cooling system.

Referring toFIG. 26, a top view ofpower supply unit2600 in accordance with a representative embodiment is shown. Thepower supply unit2600 can be integrated into a passive cooling system. Thepower supply unit2600 provides power to the passive cooling system.

Thepower supply unit2600 includes apower supply2610 and aheat sink140. Thepower supply2610 can be thermally coupled to theheat sink140. Thepower supply2610 can include a printedcircuit board2520, a first power supply integratedcircuit2530, a second power supply integratedcircuit2540,components2550, andcapacitor2560. Thepower supply2610 can be attached to theheat sink140 bystandoffs2570. The first power supply integratedcircuit2530 and the second power supply integratedcircuit2540 can be, for example, a power transistor or a power supply module.

In one illustrative embodiment, the first power supply integratedcircuit2530 and the second power supply integratedcircuit2540 are soldered to a first side of the printedcircuit board2520. The first power supply integratedcircuit2530 is coupled to afirst heat pipe2630. Thefirst heat pipe2630 is coupled to theheat sink140. Thus, the first power supply integratedcircuit2530 is thermally coupled to theheat sink140 via thefirst heat pipe2630. Heat generated by the first power supply integratedcircuit2530 is drawn to theheat sink140 through thefirst heat pipe2630 and dissipated into the ambient air. Thefirst heat pipe2630 can be an “I-beam” shape; however, any other shape can be used. The joints between the first power supply integratedcircuit2530, thefirst heat pipe2630, and theheat sink140 can include thermal compound to enhance thermal coupling.

The second power supply integratedcircuit2540 is coupled to asecond heat pipe2640. Thesecond heat pipe2640 is coupled to theheat sink140. Thus, the second power supply integratedcircuit2540 is thermally coupled to theheat sink140 via thesecond heat pipe2640. Heat generated by the second power supply integratedcircuit2540 is drawn to theheat sink140 through thesecond heat pipe2640 and dissipated into the ambient air. Thesecond heat pipe2640 can be an “I-beam” shape; however, any other shape can be used. The joints between the second power supply integratedcircuit2540, thesecond heat pipe2640, and theheat sink140 can include thermal compound to enhance thermal coupling.

Thefirst heat pipe2630 and thesecond heat pipe2640 can be made of copper alloy, aluminum, metal, or any other thermally conductive material. As shown, thefirst heat pipe2630 and thesecond heat pipe2640 can be different heights in order to accommodate the different heights of the first power supply integratedcircuit2530 and the second power supply integratedcircuit2540. Alternatively, one or more heat pipes can be used to connect the power supply to the heat sink. The power supply can include any number of power supply integrated circuits and other components. Additionally, the heat pipes can have various configurations depending on the particular implementation of the power supply. For example, a heat pipe could span across many components or pierce the printed circuit board to contact the bottom of a component. Advantageously, the heat pipes cool the power supply by drawing heat from the power supply to the heat sink.

Passive Cooling Enclosure System

Referring toFIG. 9, a perspective view of a passivecooling enclosure system900 in accordance with a representative embodiment is shown. In one embodiment, the passivecooling enclosure system900 is configured as a rack. The passivecooling enclosure system900 can include asupport structure905,heat sinks910,cabinets920,heat pipes930, andpipe connectors940. Unlike thepassive cooling system100, the heat sinks of passivecooling enclosure system900 can be located on the rack enclosure instead of (or in addition to) the individual rack-mount chassis. The passivecooling enclosure system900 can be a rack for mounting rack-mount chassis. The passivecooling enclosure system900 can be integrated into, or be part of, a structure such as a standard shipping container, a containerized data center, or a building. For example, theheat sinks910 can be integrated into the sides of a shipping container.

Thesupport structure905 can supportheat sinks910 andcabinets920. Thesupport structure905 can be the size of a standard rack, for example, for mounting servers. Thesupport structure905 can be any height, depth, and width. Thesupport structure905 can include a power supply and a back plane for powering and communicatively coupling thecabinets920.

The heat sinks910 can include fins, coolant channels, or any other heat dissipation means. Fins are preferably integrated vertically into the outside of the heat sinks910. The heat sinks910 can be made of aluminum, aluminum alloy, or any other thermal conductor. The heat sinks910 can include heat spreaders as described above (not shown). The heat spreaders can be made of copper alloy, or any other thermal conductor.

The heat sinks910 can includepipe connectors940. Thepipe connectors940 thermally couple theheat sinks910 to heatpipes930. Thepipe connectors940 can include a clamping mechanism or clamping means to mechanically secure thepipe connectors940 to theheat pipes930 thereby promoting a thermal bond between thepipe connectors940 and theheat pipes930. In addition, thepipe connectors940 can mechanically secure thecabinets920 to thesupport structure905. Thepipe connectors940 can be separate from theheat sinks910 or integrated into the heat sinks910. Various clamping mechanisms can be employed as described further below. Thepipe connectors940 can be made of aluminum, aluminum alloy, or any other thermal conductor.

Thecabinets920 can be inserted into thesupport structure905. Thecabinets920 can be a server, a switch, a router, a storage device, a battery backup, electrical equipment, or any other electronics device. Thecabinets920 can be any height or depth. In particular, thecabinets920 can include bays, as described above. The bays can be configured in various configurations such as horizontal or vertical. Additionally, thecabinets920 can include other input devices such as removable media drives, keyboards, displays, mice, or joysticks. Alternatively, thecabinets920 can be a programmable logic controller chassis, a blade chassis, a VMEbus-type enclosure, a PCI-type enclosure, a CompactPCI-type enclosure, a server, or any other electronic device with modular bays and/or sub-bays. Alternatively, theheat sinks910 can supportcabinets920.

Thecabinets920 can includeheat pipes930. Theheat pipes930 can be thermally coupled to the internal components of thecabinets920. For example, theheat pipes930 can be thermally coupled to processors, disk drives, or other heat generating components of thecabinets920. On each side associated with aheat sink910, theheat pipe930 can be a single heat pipe or multiple, individual heat pipes. Alternatively, theheat pipes930 can be part of theheat sinks910 and thepipe connectors940 can be part of thecabinets920. Advantageously, heat from each of thecabinets920 can be drawn out to theheat sinks910 throughheat pipes930 andpipe connectors940. Advantageously, each of thecabinets920 is cooled by thermal conduction thereby eliminating dust build-up on internal components of thecabinets920.

In one illustrative embodiment, each of thecabinets920 can be a server with modular bays as described above. In another illustrative embodiment, each of thecabinets920 can be a scaled rack chassis unit such as a hermetically scaled unit. Advantageously, a scaled rack chassis unit can be easily removed and cleaned. For example, suppose a server farm consisting of passive cooling enclosure systems was located in an area that was exposed to a biohazard such as anthrax or to particulate contamination, floods, or a hurricane. Personnel could easily remove and decontaminate or salvage the sealed rack chassis units. The decontaminated or salvaged sealed rack chassis units could then be safely moved to a different facility thereby preserving the equipment and the data stored on the sealed rack chassis units. In addition, thesupport structure905 andheat sinks910 can be easily decontaminated. In addition, any power modules or other electronics associated with the passivecooling enclosure system900 can be sealed in a removable cabinet.

In another illustrative embodiment, the passivecooling enclosure system900 can be integrated into, or be part of, a structure such as a standard shipping container, a containerized data center, or a building. For example, theheat sinks910 can be integrated into the outside of a shipping container. The fins ofheat sinks910 can be located along the sides (and top and bottom) of the shipping container. Advantageously, heat generated bycabinets920 can be drawn to heat sinks910. Advantageously, theheat sinks910, which are part of the shipping container, can be cooled with ambient air. Advantageously, a portable data center including the passivecooling enclosure system900 requires minimal maintenance and requires less power to operate than a conventional server farm.

In particular, sealed rack chassis units can be advantageous in many military applications. For example, the sealed design of thecabinets920 allows thecabinets920 to be operated in extreme environments such as the desert, sea-side, or the arctic. For example, moisture entering a cabinet in an arctic environment could easily cause condensation to build on electronic components causing a failure. Because thecabinets920 are sealed, dust, dirt, sand, moisture, and other contaminates cannot get into thecabinets920. Additionally, the passivecooling enclosure system900 consumes significantly less power than a typical server rack. Therefore, the passivecooling enclosure system900 is easily adaptable to many environments where acquiring power is a challenge. Consequently, thecabinets920 require minimal maintenance, use less power than a typical rack, and are less prone to failure.

Referring toFIG. 10, a front view of the passivecooling enclosure system900 ofFIG. 9 in accordance with a representative embodiment is shown. The passivecooling enclosure system900 includesheat sinks910,cabinets920,heat pipes930, andpipe connectors940 as discussed above.

Referring toFIG. 11, a top view of the passivecooling enclosure system900 ofFIG. 9 in accordance with a representative embodiment is shown. The passivecooling enclosure system900 includesheat sinks910,cabinets920,heat pipes930, andpipe connectors940 as discussed above.

Referring toFIG. 12, a side view of the passivecooling enclosure system900 ofFIG. 9 in accordance with a representative embodiment is shown. The passivecooling enclosure system900 includescabinets920,heat pipes930, andpipe connectors940 as discussed above.

Referring toFIG. 13, a top view of the inside of acabinet920 ofFIG. 9 in accordance with a representative embodiment is shown. Thecabinet920 includesheat pipes930 as described above. The right side ofcabinet920 shows many individual heat pipes and the left side ofcabinet920 shows a single heat pipe.

Theheat pipes930 can be thermally connected tointernal heat pipes1360. Theinternal heat pipes1360 are thermally coupled tobridge plate1350. Thebridge plate1350 can be thermally coupled todevice heat pipes1370. Thedevice heat pipes1370 can be thermally coupled todevices1310.Devices1310 can be, for example, hard drives as discussed above.Processors1320 can also be thermally coupled to theinternal heat pipes1360 and/or to bridgeplate1350. Thus, heat generated bydevices1310 andprocessors1320 can be drawn from thedevices1310 andprocessors1320 to theheat pipes930. Alternatively, where a cabinet includes pipe connectors, heat generated bydevices1310 andprocessors1320 can be drawn from thedevices1310 andprocessors1320 to the pipe connectors.

Thedevices1310 andprocessors1320 can be electrically connected bymotherboard1340.Motherboard1340 can be electrically connected to external devices throughport1380.Port1380 can be hermetically scaled allowing electrical connections withcabinet920 without exposing the internal components of thecabinet920 to contaminants.

Referring toFIG. 14, a top view of a passive cooling enclosure system with arear heat sink1400 in accordance with a representative embodiment is shown. In one embodiment, the passive cooling enclosure system with arear heat sink1400 is configured as a rack. The passive cooling enclosure system with arear heat sink1400 includes aheat sink1410, acabinet1420,heat pipes1430, andpipe connectors1440.

Theheat sink1410 can include tins, coolant channels, or any other heat dissipation means as discussed above. Theheat sink1410 is located toward the rear. In some embodiments, theheat sink1410 also provides the structure of the rack.

Theheat sink1410 can includeheat pipes1430. Theheat pipes1430 can be thermally coupled to theheat sink1410. Theheat pipes1430 protrude from theheat sink1410. In some embodiments, theheat pipes1430 can be tapered.

Thecabinet1420 can includepipe connectors1440. Thepipe connectors1440 include recesses that match theheat pipes1430. When thecabinet1420 is mounted to the passive cooling enclosure system with arear heat sink1400,pipe connectors1440 slide overheat pipes1430. Thepipe connectors1440 can include a clamping mechanism or clamping means to mechanically secure thepipe connectors1440 to theheat pipes1430 thereby promoting a thermal bond between thepipe connectors1440 and theheat pipes1430. In addition, thepipe connectors1440 can mechanically secure thecabinets1420 to theheat pipes1430.

Passive cooling enclosure systems can be arranged in various configurations. Referring toFIG. 15, a top view of a passive cooling enclosure system configuration in accordance with a representative embodiment is shown. InFIG. 15, two passivecooling enclosure systems900 are arranged side-by-side. Each passivecooling enclosure system900 includes asupport structure905 andheat sinks910 as discussed above.

The two passivecooling enclosure systems900 are separated by achannel1510. Thechannel1510 is formed in part by twoheat sinks910 from each of the two passivecooling enclosure systems900. Thechannel1510 can act like a duct to contain air. Additionally, thechannel1510 can be integrated into other data center monitoring and/or cooling technologies. In one illustrative embodiment, thechannel1510 can be used to contain cool air. In another illustrative embodiment, thechannel1510 can be used to contain a gas such as, but not limited to, air, humidified air, air conditioned air, nitrogen gas, or any other gas. In another illustrative embodiment, thechannel1510 can be used to contain a liquid such as, but not limited to, glycol, ammonia, water, or any other liquid. Thechannel1510 can be adapted to the particular coolant mechanism employed.

Referring toFIG. 16, a front view of a passive cooling enclosure system configuration ofFIG. 15 in accordance with a representative embodiment is shown. The two passivecooling enclosure systems900 are arranged side-by-side. Each passivecooling enclosure system900 includes asupport structure905,heat sinks910, andcabinets920 as discussed above.

The two passivecooling enclosure systems900 are separated by achannel1510. Thechannel1510 is formed in part by twoheat sinks910 from each of the two passivecooling enclosure systems900. Thechannel1510 can act like a duct to contain air. In one illustrative embodiment, thechannel1510 can be used to contain a gas. In another illustrative embodiment, thechannel1510 can be used to contain a liquid.

Air can move through thechannel1510 as represented byarrow1610. The air flows over the twoheat sinks910 from each of the two passivecooling enclosure systems900 that form thechannel1510 thereby drawing heat from the heat sinks910.

Thechannel1510 can be used to conduct air passively over theheat sinks910, i.e. by convection. In addition, air can be forced throughchannel1510, for instance, by using a fan. In one illustrative embodiment, cool air from outside a facility is drawn into thechannel1510. Advantageously, the cooling air in thechannel1510 cannot reach thecabinets920 thereby preventing contaminants from entering electronics.

Advantageously, raised floors, hot aisle/cold aisle configurations, and heating ventilation and air conditioning (HVAC) systems are not need to cool thecabinets920. Advantageously, computing and electronics facilities can be arranged in a space-saving manner by reducing the amount of ductwork needed for cooling server racks.

Referring toFIG. 17, a top view of aserver room1710 in accordance with a representative embodiment is shown. Theserver room1710 can be arranged in various configurations. In one illustrative embodiment, passivecooling enclosure systems900 are arranged in rows. Every two passivecooling enclosure systems900 are separated by achannel1510. Theserver room1710 can be a building, a modular freight container, part of a vehicle, or any other enclosure.

Air moving through thechannels1510 can draw heat from heat sinks of the passivecooling enclosure systems900. Thechannels1510 can be connected to a duct system. Thus, the inside ofserver room1710 is completed separated from the cooling means. Advantageously, contaminates cannot reach the inside ofserver room1710. In other illustrative embodiments, thechannels1510 can be configured to contain a gas or liquid, as described above.

Referring toFIG. 18, a side view of theserver room1710 ofFIG. 17 in accordance with a representative embodiment is shown. Theserver room1710 can be arranged in various configurations. In one embodiment, passivecooling enclosure systems900 are arranged in rows. Every two passivecooling enclosure systems900 are separated by achannel1510.

Theserver room1710 includeswalls1870,ceiling1860, andfloor1850. Thechannels1510 can extend from thefloor1850 to theceiling1860. Cable chases1840 can run underneathfloor1850. Alternatively, cabling can be run within theserver room1710.

Thechannels1510 are connected to anintake duct1890 belowfloor1850 and anexhaust duct1880 aboveceiling1860. In one illustrative embodiment, cool air from outside a facility is drawn into theintake duct1890 by convection. The cool air is drawn throughchannels1510 and over heat sinks of the passivecooling enclosure systems900. Thus, the air from theintake duct1890 is heated. The heated air rises up in thechannels1510 thereby drawing more cool outside air into theintake duct1890.

The heated air continues into theexhaust duct1880 by convection. The heated air is expelled to the outside. The convection properties of thechannels1510 and related ductwork can be designed to exhibit specific convective properties. For example, chimneys can be added to theexhaust duct1880 in order to enhance the convection. In addition, multiple floors can include continuous channels to enhance convection. Various passive and active cooling designs can be implemented as known by those of skill in the art. Advantageously, heat from the cabinets of the passivecooling enclosure systems900 can be passively removed thereby reducing cooling costs, facilities costs, maintenance costs, and development costs.

Referring toFIG. 19, a top view of aserver room1910 with various alternate configurations in accordance with a representative embodiment is shown. Theserver room1910 can be arranged in various configurations. In one illustrative embodiment, passivecooling enclosure systems900 are arranged in pods. Alternatively, more or fewer passive cooling enclosure systems can be arranged in a pod. In addition, the pods can be rotated relative to one another in order to enhance the packing of the pods in a particular space.

Every four passivecooling enclosure systems900 are separated by achannel1930 andcabling channels1920. The four passivecooling enclosure systems900 andcabling channels1920 are arranged back-to-back to formchannel1930. In this configuration, the heat sinks of the four passivecooling enclosure systems900 can be designed so that the heat sinks are only in thechannel1930. Theserver room1910 can be a building, a modular freight container, part of a vehicle, or any other enclosure.

Air moving through thechannel1930 can draw heat from heat sinks of the passivecooling enclosure systems900. Thechannel1930 can be connected to a duct system. Thus, the inside ofserver room1910 is completed separated from the cooling means. Advantageously, contaminates cannot reach the inside ofserver room1910.

In another illustrative embodiment, passive cooling enclosure systems with a rear heat sink1400 (ofFIG. 14) are arranged in an alternative pod arrangement. As discussed above, passive cooling enclosure systems with arear heat sink1400 have the heat sink located towards the rear of the rack. Every four cooling enclosure systems with arear heat sink1400 are separated by achannel1940. Alternatively, more or fewer passive cooling enclosure systems can be arranged in a pod. In addition, the pods can be rotated relative to one another in order to enhance the packing of the pods in a particular space.

The four passive cooling enclosure systems with arear heat sink1400 are arranged back-to-back to formchannel1940. In this configuration, the heat sinks of the four passive cooling enclosure systems with arear heat sink1400 are arranged so that the heat sinks are only in thechannel1940.

Air moving through thechannel1940 can draw heat from heat sinks of the passive cooling enclosure systems with arear heat sink1400. Thechannel1940 can be connected to a duct system. Thus, the inside ofserver room1910 is completed separated from the cooling means. Advantageously, contaminates cannot reach the inside ofserver room1910.

The heat pipes and pipe connectors can be implemented using various thermal connection designs. Referring toFIG. 20, a perspective view of a passivecooling enclosure system2000 in accordance with a representative embodiment is shown. InFIG. 20, the passivecooling enclosure system2000 is configured as a standard rack. The passivecooling enclosure system2000 includes anenclosure structure2005,heat sinks2010, acabinet2020,heat pipes2030, andpipe connectors2040.

Theenclosure structure2005 can supportheat sinks2010. Theenclosure structure2005 can be the size of a standard rack, for example, for mounting servers. Theenclosure structure2005 can include any electronics device. Theenclosure structure2005 can be any height, depth, and width. Theenclosure structure2005 can include a power supply and a back plane for powering and communicatively coupling thecabinet2020.

Theheat sinks2010 can include fins, coolant channels, or any other heat dissipation means (not shown). Theheat sinks2010 can be made of aluminum, aluminum alloy, or any other thermal conductor. Theheat sinks2010 can include heat spreaders as described above (not shown). The heat spreaders can be made of copper alloy.

Theheat sinks2010 can includepipe connectors2040. Thepipe connectors2040 thermally couple theheat sinks2010 to heatpipes2030. Thepipe connectors2040 can mechanically secure thecabinet2020 to the passivecooling enclosure system2000. Thepipe connectors2040 can be integrated into the heat sinks2010. Thepipe connectors2040 can includeslots2072. Theslots2072 can have a wide taper at the front to allow easy cabinet mounting. Theslots2072 can run along the depth of the heat sinks2010. Theslots2072 can slightly taper from front to back.

Thecabinet2020 can be inserted into theenclosure structure2005. Thecabinet2020 can be a server, a switch, a router, a storage device, a battery backup, electrical equipment, or any other electronics device. Thecabinet2020 can be any height or depth. In particular, thecabinet2020 can include bays, as described above. The bays can be configured in various configurations such as horizontal or vertical.

Thecabinet2020 can includeheat pipes2030. Theheat pipes2030 can be thermally coupled to the internal components of thecabinet2020. For example, theheat pipes2030 can be thermally coupled to processors, disk drives, or other heat generating components of thecabinet2020. InFIG. 20, theheat pipes2030 run along both sides of thecabinet2020.

Theheat pipes2030 thermally engage theslots2072 as thecabinet2020 is inserted into the passivecooling enclosure system2000. Thermal compound can be used to enhance the thermal coupling between theheat pipes2030 and thepipe connectors2040. Theheat pipes2030 can include astarting block2062, afirst compression rail2066, and asecond compression rail2066. Thestarting block2062 guides theheat pipes2030 as they are inserted intoslots2072. Thestarting block2062 protects the edges of thefirst compression rail2066 and thesecond compression rail2066. Thestarting block2062 is made of a durable material such as aluminum, aluminum alloy, or any other metal. Together, thefirst compression rail2066 and thesecond compression rail2066 taper to a slightly larger width than theslots2072, i.e. at thestarting block2062 the width of thefirst compression rail2066 and thesecond compression rail2066 is about that of thestarting block2062, but, at the opposite end, thefirst compression rail2066 and thesecond compression rail2066 are slightly wider than the front opening ofslots2072.

Thefirst compression rail2066 and thesecond compression rail2066 can flex to match theslots2072 thereby engaging theslots2072 both mechanically and thermally. Thefirst compression rail2066 and thesecond compression rail2066 can have filleting or other relieving that enhances flexing. Thefirst compression rail2066 and thesecond compression rail2066 can be made of any flexible, thermally conductive material such as aluminum, aluminum alloy, or any other metal.

Thus, when thecabinet2020 is inserted into a set ofslots2072, thestarting block2062 guides thefirst compression rail2066 and thesecond compression rail2066 into theslots2072. As thecabinet2020 is pushed further into the passivecooling enclosure system2000, thefirst compression rail2066 and thesecond compression rail2066 press against the sides of theslots2072 thereby creating a thermal coupling between theheat pipes2030 and thepipe connectors2040.

Referring toFIG. 21, a front perspective view of a passivecooling enclosure system2000 ofFIG. 20 in accordance with a representative embodiment is shown. The passivecooling enclosure system2000 includes anenclosure structure2005,heat sinks2010, acabinet2020,heat pipes2030, andpipe connectors2040. Thepipe connectors2040 can includeslots2072. Theheat pipes2030 can include afirst compression rail2066, and asecond compression rail2066.FIG. 21 shows bothheat pipes2030 ofcabinet2020 engagingslots2072 ofpipe connectors2040.

Referring toFIG. 22, a top view of a thermal joint2200 in accordance with a representative embodiment is shown. In one illustrative embodiment, the thermal joint2200 can be a thermal and mechanical coupling between aheat pipe2230 and apipe connector2240. Theheat pipe2230 is associated with acabinet2220. Thepipe connector2240 is associated with aheat sink2210.

Thepipe connector2240 includes aheat pipe conduit2245. Thepipe connector2240 is docked on aheat pipe protrusion2235 that matchesheat pipe conduit2245. Thepipe connector2240 can have one or a plurality ofheat pipe conduits2245. A heat pipe protrusion can be disposed on either side of thecabinet2220. Theheat pipe conduit2245 can be 1.5 inches or smaller in diameter depending on the application; however, larger conduits are also possible. For example, theheat pipe conduit2245 can range from 1.5 inches to 0.25 inches in diameter. Additionally, the heat pipe conduits at various locations in a passive cooling enclosure system can each be a different size. For example, a heat conduit/heat pipe for a power supply cabinet can be larger than a heat conduit/heat pipe for a server cabinet. Theheat pipe conduit2245 includes a clamping slot which can be used to change the size of theheat pipe conduit2245. Theheat pipe conduit2245 can have various profiles such as those depicted inFIGS. 5A-5F. When thecabinet2220 is inserted in the passive cooling enclosure system, theheat pipe protrusion2235 engagesheat pipe conduit2245. Alternatively, theheat pipe protrusion2235 and theheat pipe conduit2245 can be tapered from back to front.

Referring toFIG. 23, a side view of a thermal joint2200 ofFIG. 22 in accordance with a representative embodiment is shown. The thermal joint2200 can be a thermal and mechanical coupling between theheat pipe2230 and thepipe connector2240. Theheat pipe2230 is associated withcabinet2220. Thepipe connector2240 is associated withheat sink2210.

Thepipe connector2240 includesheat pipe conduit2245. Thepipe connector2240 is docked onheat pipe protrusion2235 that matchesheat pipe conduit2245. InFIG. 23, theheat pipe protrusion2235 and theheat pipe conduit2245 have a circular profile. Alternatively, other various profiles can be used such as inFIGS. 5A-5F.

Thepipe connector2240 can also include aclamping slot2347. Theclamping slot2347 can be used in conjunction with a clamping mechanism. For example, when a clamping lever of a clamping mechanism is pressed in, the clamping mechanism could close theclamping slot2347 thereby tightening theheat pipe conduit2245. The clamping action creates a better thermal coupling between thepipe connector2240 and theheat pipe2230. Additionally, the clamping action fastens thecabinet2220 to theheat pipe2230 so that thecabinet2220 cannot move and so that thecabinet2220 maintains thermal continuity withheat sink2210. Thus, thecabinet2220 can be quickly removed and replaced. Alternatively, many other clamping and/or attachment mechanisms are possible.

Referring toFIG. 24, a top view of a protectedheat pipe2400 in accordance with a representative embodiment is shown. In one illustrative embodiment, theheat pipe2430 is associated with aheat sink2410. A matching pipe connector (not shown) is associated with a cabinet (not shown). Alternatively, the heat pipe is associated with a cabinet and the pipe connector is associated with the heat sink.

Theheat pipe2430 is thermally coupled to theheat sink2410. Theheat pipe2430 includes aheat pipe protrusion2435. Theheat pipe protrusion2435 can have various profiles such as inFIGS. 5A-5F. Aprotective block2485 slides over theheat pipe protrusion2435. Theprotective block2485 is spring-loaded byspring2480. Theprotective block2485 prevents theheat pipe protrusion2435 from getting bent or otherwise damaged.

When a matching pipe connector is slid over theheat pipe protrusion2435 theprotective block2485 retracts. Eventually,notches2490 are exposed. The pipe connector can engage thenotches2490 to secure the pipe connector to theheat pipe protrusion2435. Alternatively, a heat pipe with protective block can be associated with a cabinet.

The foregoing description of the representative embodiments have been presented for purposes of illustration and of description. It is not intended to be exhaustive or to limit the invention to the precise form disclosed, and modifications and variations are possible in light of the above teachings or may be acquired from practice of the invention. For example, the described representative embodiments focused on a representative implementation of a horizontal drive configuration on a rack-mount server. The present invention, however, is not limited to a representative implementation as described and depicted. Those skilled in the art will recognize that the device and methods of the present invention may be practiced using various combinations of components. Additionally, the device and method may be adapted for different electronics systems that need to be cooled. The embodiments were chosen and described in order to explain the principles of the invention and as practical applications of the invention to enable one skilled in the art to utilize the invention in various embodiments and with various modifications as suited to the particular use contemplated. It is intended that the scope of the invention be defined by the claims appended hereto and their equivalents.

Claims (20)

What is claimed is:

1. An apparatus for cooling electronics, the apparatus comprising:

a modular support structure including:

a first heat sink configured to thermally couple to a cabinet, wherein the first heat sink comprises a first slot that tapers from front to back in terms of a mounting direction of the cabinet such that the first slot is wider at the front than at the back, and wherein the cabinet comprises a first heat pipe configured to thermally engage the first heat sink via the first slot; and

a second heat sink configured to thermally couple to the cabinet, wherein the second heat sink comprises a second slot that tapers from front to back in terms of the mounting direction of the cabinet such that the second slot is wider at the front than at the back, and wherein the cabinet comprises a second heat pipe configured to thermally engage the second heat sink via the second slot;

wherein the first heat sink and the second heat sink are external to the cabinet;

and

wherein, when the cabinet is thermally coupled to the first heat sink and the second heat sink, the first heat sink and the second heat sink are configured to passively draw heat from the cabinet.

2. The apparatus ofclaim 1, wherein the first heat sink and the second heat sink do not include an active fluid cooling element.

3. The apparatus ofclaim 1, wherein the cabinet comprises at least one electronic device that generates heat.

4. The apparatus ofclaim 1, wherein the modular support structure is positioned beside a second modular support structure such that a channel is formed between the modular support structure and the second modular support structure, and wherein the channel is configured to receive and direct cooling air over the first heat sink of the modular support structure and a third heat sink of the second modular support structure, wherein the first heat sink comprises at least a portion of a wall of the modular support structure, and wherein the third heat sink comprises at least a portion of a wall of the second modular support.

5. The apparatus ofclaim 1, further comprising the cabinet.

6. The apparatus ofclaim 5, wherein the cabinet comprises a sealed cabinet.

7. The apparatus ofclaim 5, wherein the cabinet is configured to removably couple to the first heat sink and the second heat sink.

8. The apparatus ofclaim 1, wherein the first heat sink is not thermally coupled to the at least one cabinet using a liquid or a gas.

9. The apparatus ofclaim 1, wherein the first heat sink and the second heat sink are each located in at least one wall of the modular support structure.

10. The apparatus ofclaim 1, wherein the modular support structure comprises a plurality of slots, and wherein the plurality of slots are configured to allow a plurality of cabinets to each linearly slide along respective slots of the plurality of slots, and wherein the plurality of slots are configured to receive respective heat pipes extending from an external surface of the respective cabinet.

11. The apparatus ofclaim 1, wherein the modular support structure encloses the cabinet.

12. The apparatus ofclaim 11, wherein the modular support structure comprises at least four sides, wherein a first side of the at least four sides comprises the first heat sink, and wherein a second side of the at least four sides opposite the first side comprises the second heat sink.

13. The apparatus ofclaim 1, wherein the first heat sink and the second heat sink are further configured to passively dissipate heat from the cabinet to a space outside of the modular support structure.

14. A method for passively cooling electronics comprising:

passively drawing heat from a cabinet through:

a first solid thermal joint to a first heat sink located in a modular support structure external to the cabinet, wherein the first heat sink comprises a first slot that tapers from a first end of the modular support structure toward a second end of the modular support structure such that the first slot is wider at the first end of the modular support structure than at the second end of the modular support structure, and wherein the cabinet comprises a first heat pipe configured to thermally engage the first heat sink via the first slot; and

a second solid thermal joint to a second heat sink located in the modular support structure external to the cabinet, wherein the second heat sink comprises a second slot that tapers from the first end of the modular support structure toward the second end of the modular support structure such that the second slot is wider at the first end of the modular support structure than at the second end of the modular support structure, and wherein the cabinet comprises a second heat pipe configured to thermally engage the second heat sink via the second slot;

wherein the cabinet is located between the first heat sink and the second heat sink.

15. The apparatus ofclaim 5, wherein the first heat pipe and the second heat pipe are each configured to thermally couple to an internal component of the cabinet.

16. The apparatus ofclaim 5, wherein the first heat pipe includes a first compression rail and a second compression rail, wherein a space is formed between the first compression rail and the second compression rail, and wherein the space tapers from front to back in terms of the mounting direction of the cabinet to engage the first slot between the first compression rail and the second compression rail.

17. The apparatus ofclaim 16, wherein the first compression rail and the second compression rail are made of a flexible and thermal conductive material.

18. The apparatus ofclaim 16, wherein the first heat pipe further includes a starting block disposed at an edge of the first heat pipe.

19. The method ofclaim 14, wherein the first heat pipe includes a first compression rail and a second compression rail, wherein a space is formed between the first compression rail and the second compression rail, and wherein the space tapers from front to back in terms of the mounting direction of the cabinet to engage the first slot between the first compression rail and the second compression rail.

20. The method ofclaim 14, further comprising:

forming a channel between the modular support structure and a second modular structure, wherein the modular support structure is positioned beside the second modular support structure;

receiving and directing cooling air through the channel over the first heat sink of the modular support structure and a third heat sink of the second modular support structure, wherein the first heat sink comprises at least a portion of a wall of the modular support structure, and wherein the third heat sink comprises at least a portion of a wall of the second modular support.

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