US7116912B2 - Method and apparatus for pluggable fiber optic modules - Google Patents

Abstract

Pluggable fiber optic modules having a receive printed circuit board and a transmit printed circuit board perpendicular with an interface printed circuit board with an edge connection. The edge connection of the interface printed circuit board to plug into and out from an edge connector of a host printed circuit board. A transmitter optoelectronic device is coupled to the transmit printed circuit board. A receiver optoelectronic device is coupled to the receive printed circuit board. The pluggable fiber optic modules may further include a support base, a nose receptacle, and an alignment plate.

Description

CROSS REFERENCE TO RELATED APPLICATIONS

This U.S. Non-Provisional Patent Application claims the benefit of U.S. Provisional Patent Application No. 60/283,046 entitled “METHOD AND APPARATUS FOR PLUGGABLE FIBER OPTIC MODULES”, filed Apr. 10, 2001 by Ron Cheng Pang et al.

This U.S. Non-Provisional Patent Application also claims the benefit of and is a continuation-in-part application of U.S. application Ser. No. 09/321,308, entitled “METHOD AND APPARATUS FOR VERTICAL PCB FIBER OPTIC MODULES”, filed May 27, 1999 by inventors Wenbin Jiang et al, and claims the benefit of and is a continuation-in-part application of U.S. application Ser. No. 09/656,779, entitled “HOT PLUGGABLE OPTICAL TRANSCEIVER IN A SMALL FORM PLUGGABLE PACKAGE”, filed Sep. 7, 2000 now U.S. Pat. No. 6,873,800, by inventors Wei et al, which is incorporated herein by reference, all of which are to be assigned to E2O Communications, Inc.

FIELD OF THE INVENTION

This invention relates to fiber optic modules.

BACKGROUND OF THE INVENTION

Fiber optic modules interface optical fibers to electronic circuitry transducing communication by light or photons with communication by electrical signals. A fiber optic module may be a fiber optic receiver, transmitter or transceiver including both receive and transmit functions. The fiber optic receiver, transmitter and transceiver each have optical elements (OE) and electrical elements (EE). The fiber optic transmitter OE includes an emitter (such as a semiconductor LED or Laser) mounted in a package and an optical coupling element for coupling light or photons from the OE into the optical fiber. The type of semiconductor laser (light amplification by stimulated emission of radiation) may be a vertical cavity surface emitting laser (VCSEL). The fiber optic receiver OE includes a photodetector (such as a photodiode) mounted in a package and an optical coupling element for coupling light or photons from the optical fiber into the photodetector. The EE for each includes integrated circuits and passive elements mounted on a substrate such as a printed circuit board (PCB) or ceramic. The OE and EE are connected electrically at the emitter and photodetector.

Because of the high transmission frequencies utilized in fiber optic communication, crosstalk between receive and transmit signals is of concern. Additionally, electromagnetic interference (EMI) is of concern due to the high frequency of operation of the fiber optic modules. In order to reduce EMI, shielding of the electrical components is required which is usually accomplished by attaching a metal shield to the substrate of the fiber optic module and connecting it to ground. In order to avoid electronic crosstalk and EMI, the fiber optic transceiver usually employs separate components and separate shielding of fiber optic receiver and fiber optic transmitter components. In order to avoid optical crosstalk where light or photons can interfere between communication channels, the fiber optic transceiver usually employs separate optical elements for coupling light or photons into and out of the optical fiber for fiber optic receiver and fiber optic transmitter. Using separate optical elements requires additional components and increases the costs of fiber optic transceivers. It is desirable to reduce the component count of fiber optic transceivers such that they are less expensive to manufacture.

The form factor or size of the fiber optic module is of concern. Previously, the fiber optic transceiver, receiver, and transmitter utilized horizontal boards or substrates which mounted parallel with a system printed circuit board utilized significant footprint or board space. The horizontal boards provided nearly zero optical crosstalk and minimal electronic crosstalk when properly shielded. However, the horizontal boards, parallel to the system printed circuit board, required large spacing between optical fiber connectors to make the connection to the optical fibers. While this may have been satisfactory for early systems using minimal fiber optic communication, the trend is towards greater usage of fiber optic communication requiring improved connectivity and smaller optical fiber connectors to more densely pack them on a system printed circuit board. Thus, it is desirable to minimize the size of system printed circuit boards (PCBs) and accordingly it is desirable to reduce the footprint of the fiber optic module which will attach to such system PCBs. Additionally, the desire for tighter interconnect leads of fiber optic cables, restricts the size of the OE's. For example, in the common implementation using TO header and can, the header dimension of the interconnect lead is normally 5.6 mm. In small form factor optical modules, such as the MT family, the two optical fibers are separated by a distance of only 0.75 mm. This severely restricts the method of coupling light or photons from the OE into and out of fiber optic cables.

BRIEF DESCRIPTIONS OF THE DRAWINGS

FIG. 1 is a simplified top cutaway view of a first embodiment of the invention.

FIG. 2 is an exploded view of the first embodiment of the invention.

FIG. 3A is a cross-sectional view from the top of the optic block for the first embodiment of the invention.

FIG. 3B is a front side perspective view from the left of the optic block for the first embodiment of the invention.

FIG. 3C is a frontal view of the optic block for the first embodiment of the invention.

FIG. 3D is a back side perspective view from the right of the optic block for the first embodiment of the invention.

FIG. 3E is a back view of the optic block for the first embodiment of the invention.

FIG. 3F is a right side view of the optic block for the first embodiment of the invention.

FIG. 3G is a left side view of the optic block for the first embodiment of the invention.

FIG. 3H is a cross-sectional view of the optic block for the first embodiment of the invention.

FIG. 3I is a magnified cross-sectional view of the alignment post of the optic block.

FIG. 4 is a simplified top cutaway view of another embodiment of the invention.

FIG. 5A is an exploded view of the embodiment of the invention ofFIG. 4.

FIG. 5B is an exploded view of an alternate embodiment of the invention ofFIG. 4.

FIG. 5C is an exploded view of another alternate embodiment of the invention ofFIG. 4.

FIG. 5D is an exploded view of another alternate embodiment of the invention ofFIG. 4.

FIG. 6A is a cross-sectional view from the top of the optic block for embodiments of the invention.

FIG. 6B is a front side view of the optic block for the embodiments of the invention.

FIG. 6C is a back side view of the optic block for the embodiments of the invention.

FIG. 6D is a top side view of the optic block for the embodiments of the invention.

FIG. 7A is a top view of a manufacturing step of the invention.

FIG. 7B is a side view of a manufacturing step of the invention.

FIG. 8A is an exploded view of another embodiment of the invention.

FIG. 8B is perspective view of an alternate baseplate for embodiments of the invention.

FIG. 8C is a rear cross sectional view of the assembled invention illustrated inFIG. 8A.

FIG. 9A is an exploded view of another embodiment of the invention.

FIG. 9B is a rear cross sectional view of the assembled invention illustrated inFIG. 9A.

FIG. 9C illustrates an alternate embodiment of a single ground plane for a printed circuit board.

FIG. 9D illustrates an alternate embodiment of a single ground plane for a printed circuit board.

FIG. 9E illustrates an alternate embodiment of a ground plane sandwiched between layers in a multilayer printed circuit board.

FIG. 10A is an exploded view of another embodiment of the invention.

FIG. 10B is a rear cross sectional view of the assembled invention illustrated inFIG. 10A.

FIG. 11A is an exploded view of another embodiment of the invention.

FIG. 11B is a rear cross sectional view of the assembled invention illustrated inFIG. 11A.

FIG. 12A is an exploded view of another embodiment of the invention.

FIG. 12B is a rear cross sectional view of the assembled invention illustrated inFIG. 12A.

FIG. 13 illustrates a receive optical block and a transmit optical block as an alternative to a single optical block.

FIG. 14A illustrates how the pin configuration of the fiber optic modules can plug into a socket on a host printed circuit board.

FIG. 14B illustrates how a socket configuration of the fiber optic modules can plug into a socket on a host printed circuit board.

FIG. 14C illustrates how a socket configuration of the fiber optic modules can horizontally plug into a socket on a host printed circuit board.

FIG. 15A illustrates a bottom perspective view of an alternate embodiment of the shielded housing or cover and base of the invention.

FIG. 15B illustrates a rear cross sectional view of the assembled invention illustrated inFIG. 10A substituting the alternate embodiment of the shielded housing or cover ofFIG. 15A.

FIG. 15C illustrates a rear cross sectional view of the alternate embodiment of the shielded housing or cover ofFIG. 15A.

FIG. 15D illustrates a cross sectional view of another alternate embodiment of the shielded housing or cover.

FIG. 15E illustrates a cross sectional view of another alternate embodiment of the shielded housing or cover.

FIG. 15F illustrates a cross sectional view of another alternate embodiment of the shielded housing or cover.

FIG. 15G illustrates a cross sectional view of another alternate embodiment of the shielded housing or cover.

FIG. 16A illustrates a rear cross sectional view of an assembled alternate embodiment of the invention.

FIG. 16B illustrates a rear cross sectional view of an assembled alternate embodiment of the invention.

FIGS. 17A–17D illustrate exploded perspective views of an embodiment of the invention.

FIGS. 18A–18D illustrate a perspective views of the embodiment of the invention illustrated inFIGS. 17A–17D without the cover/housing assembled thereto.

FIGS. 19A–19E are views of an exemplary cage assembly or module receptacle for fiber optic modules.

FIG. 20 is a side view of an embodiment of a fiber optic module and an exemplary host connector without the exemplary cage assembly ofFIGS. 19A–19E.

FIGS. 21A–21D are perspective views of an embodiment of a fiber optic module and an exemplary host connector without the exemplary cage assembly ofFIGS. 19A–19E.

FIGS. 22A–22B are cross section views illustrating an embodiment of a fiber optic module coupling to the exemplary host connector ofFIGS. 20,21A–21D and the exemplary cage assembly ofFIGS. 19A–19E.

FIGS. 23A–23C illustrate an example of how an electrical connection between the interface printed circuit board of an embodiment of the fiber optic module and the host connector of a host printed circuit board is formed.

Like reference numbers and designations in the drawings indicate like elements providing similar functionality.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

In the following detailed description of the invention, numerous specific details are set forth in order to provide a thorough understanding of the invention. Note however that embodiments of the invention may be practiced without these specific details. In other instances well known methods, procedures, components, and circuits have not been described in detail so as not to unnecessarily obscure aspects of the embodiments of the invention.

The embodiments of the invention include a method, apparatus and system for vertical board construction of fiber optic transmitters, receivers and transceivers. Briefly, fiber optic transmitter and receiver electrical elements are implemented on at least two separate printed circuit boards (PCBs) in a fiber optic module. The separate boards are arranged within the fiber optic module to reduce the footprint of the fiber optic module. In one embodiment, bending light or photons through ninety degrees, the light transmitter (a packaged type of emitter) and a light receiver (a packaged type of photodetector) are each mounted substantially perpendicular to the transmit and receive boards respectively such that their active areas are nearly facing each other but offset. A single optical block can be used to implement lenses and reflecting surfaces to minimize manufacturing costs. In one embodiment, the light receiver and light transmitter are mounted offset from each other in the optical block in order to avoid optical cross talk. In a second embodiment, the light transmitter (emitter) and the light receiver (photodetector) are each mounted substantially parallel with the transmit and receive boards respectively, the optical axis of transmitter and receiver and the connection to the optical fibers. The separate receive and transmit boards can be provided with ground planes in order to minimize electrical cross talk. Preferably the ground planes on the back sides of the printed circuit boards face each other. A module outer shielded housing or cover, manufactured out of metal or metal plated plastic, provides further shielding for EMI. The separate boards may be extended to support multiple channels or multiple parallel fibers such as in a ribbon optical fiber cable. Manufacturing steps of the boards for the fiber optic module are disclosed to provide reduced manufacturing costs.

Referring now toFIG. 1, a simplified cutaway view of the first embodiment of the invention is illustrated.FIG. 1 illustrates afiber optic module100 coupling to a pair offiber optic cables101.Fiber optic module100 includes anoptical block102 and anelectrical element104. Theoptical block102 may also be referred to as a nose, an optical port, an alignment block, an optical connector, an optical receptacle or receptacle. Theoptical block102 can interface to an optical connector such as an LC, MT-RJ or VF-45 optical connector. Theelectrical element104 includes a transmit printed circuit board (PCB)106, a receivePCB108, an optionalinternal shield109, alight transmitter110, alight receiver111, and a shielded housing orcover119. Thelight transmitter110 andlight receiver111 are optoelectronic devices for communicating with optical fibers using light of various wavelengths or photons. An optoelectronic device is a device which can convert or transduce light or photons into an electrical signal or an electrical signal into light or photons. Thetransmitter110 is a packaged emitter, that converts an electrical signal into emitting light or photons, such as a semiconductor laser or LED, preferably packaged in a TO can. Thereceiver111 is a packaged photodetector, that detects or receives light or photons and converts it into an electrical signal, such as a photo diode, preferably package in a TO can. However other packages, housings or covers, or optoelectronic devices for receiving and transmitting light or photon may be used for thereceiver111 ortransmitter110.

Each of the optoelectronic devices,receiver111 andtransmitter110, have terminals. In one embodiment, terminals of one or more optoelectronic devices couple to thruholes of thePCB106 orPCB108 or both. In another embodiment, terminals of one or more optoelectronic devices couple to an edge connector of thePCB106 orPCB108 or both. In one embodiment, the transmitPCB106 includes electrical components112 (transmitter integrated circuit (laser driver), resistors, capacitors and other passive or active electrical components), pins113, and aground plane114. Theelectrical components112 control thetransmitter110 and buffer the data signal received from a system for transmission over an optical fiber. In one embodiment, the receivePCB108 includes electrical components116 (receiver integrated circuit (transimpedance amplifier and post amplifier), resistors, capacitors and other passive or active electrical components), pins117, and aground plane118. Theelectrical components116 control thereceiver111 and buffer the data signal received from an optical fiber. The ground planes114 and118 and the shielded housing or cover119 are coupled to ground. In another embodiment, a pin header consisting of a dielectric medium that is molded over a plurality of pins, is used to couple to through holes in thePCB108 orPCB106. Theelectrical components116 and pins117 are sandwiched between theground plane118 and the shielding119 to shunt electromagnetic fields to ground and avoid crosstalk in the receivePCB108.Electrical components112 and pins113 are sandwiched between theground plane114 and the shielded housing or cover119 to shunt electromagnetic fields generated by these components to ground and avoid crosstalk in the transmitPCB106. Optional internal shielding109 further provides additional crosstalk protection between printed circuit boards. If ground planes114 and118 are not used, theninternal shielding109 is required to reduce the electromagnetic fields that may be generated.

Theoptical block102 includeslenses120–123 andreflectors124–125.Lenses120–123 may be any collimating lenses including aspheric lenses, ball lenses, and GRIN lenses.Lenses121–123 may be symmetric (circular symmetry) or asymmetric to provide optical steering.Lens123 is for collimating the light or photons diverging from thetransmitter110 andlens122 is for focussing the collimated light or photons into an optical fiber.Lens120 is for collimating the light or photons diverging out from the end of an optical fiber andlens121 is for focusing the collimated light or photons into thereceiver111.Reflectors124–125 may be facets formed in the optical block having angles to provide total internal reflection between the optical block material and the atmosphere. Preferably they are forty five degree angle facets. Alternatively, they may be facets coated with a reflective surface or mirror surface to reflect light or photons off the reflective coated surface or facets having an optical grating surface to reflect photons. Theoptical block102 is preferably constructed of a thermoplastic or polycarbonate which is clear to the desired wavelengths of light or photons. Thereflectors124–125,lenses120–123 and other elements of theoptical block102 described below are preferably formed through injection molding of the desired material.

Referring toFIG. 2; an exploded diagram of thefiber optic module100 is illustrated and its assembly is described.Transmitter110 is inserted into anopening214 in theoptical block102.Receiver111 is inserted into anopening213 inoptical block102. An epoxy is injected into top andbottom tacking holes215 in order to hold thetransmitter110 andreceiver111 inopenings214 and213 respectively. AnMT alignment plate201 has optical block alignment holes216, anoptical opening217 and fiber optic connector alignment pins218 for alignment purposes. The optical block holes216 couple to optical block alignment pins in theoptical block102, not illustrated inFIG. 2. The fiber optic connector alignment pins218 are for aligning optical fibers that couple to thefiber optic module100.

For coupling to a fiber optic connector, thefiber optic module100 has anose202 and anose shield203. Thenose202 includes anoptical fiber opening222 and alatch opening223. Thelatch opening223 receives the optical fiber connector and holds the optical fiber substantially fixed in place and aligned with theoptical opening217 of thealignment plate201. Thenose shield203 includes anopening224 for insertion over thenose202 and shieldtabs225 for coupling to the ground plane of the package. The nose shielding203 further reduces EMI.

After assembling the nose pieces to theoptical block102, thetransmitter110 andreceiver111 may be aligned to provide optimal light or photon output and reception. Alignment of thetransmitter110 andreceiver111 inoptical block102 is performed by active alignment where thereceiver111 andtransmitter110 are powered up to detect and emit photons. Thereceiver111 andtransmitter110 are properly aligned in theoptical block102 to provide maximum photon detection from or coupling intofiber101. The tackingholes215 extend into theopenings213 and214 such that epoxy may poured in to hold the optoelectronic devices to the optical block. After alignment is complete, the epoxy is UV cured and allowed to set such that thereceiver111 andtransmitter110 are substantially coupled to theoptical block102.

After the epoxy has set, the receivePCB108 and the transmitPCB106 may be attached to thereceiver111 andtransmitter110 respectively.Receiver thruholes232 in the receivePCB108 are aligned and slid overterminals211 of thereceiver111. Theterminals211 are then soldered to make an electrical connection on the component side (opposite the side of the ground plane118) of the receivePCB108.Transmitter thruholes233 in the transmitPCB106 are aligned and then slid over theterminals210 of thetransmitter110. Theterminals210 are then soldered to make an electrical connection on the component side (opposite the side of the ground plane114) of transmitPCB106. Ground planes114 and118 have sufficient material removed around the transmitter thruholes233 and thereceiver thruholes232 respectively to avoid shorting the terminals of thetransmitter110 andreceiver111 to ground.

After coupling thePCBs108 and106 to thereceiver111 andtransmitter110 respectively, the assembly is inserted into the shielded housing orcover119. The optionalinternal shield109 is next assembled into the shielded housing or cover119 between thePCBs106 and108. The optionalinternal shield109 haspin slots230 to surround thepins113 and117 and avoid shorting thereto.

The shielded housing or cover119 includes clips ortabs236 at each corner for mating to abase205. Thebase205 includesPCB slots240, clip openings orslots238 into which the clips ortabs236 may be inserted, and base pin holes242 into which the PCB pins113 and117 may be inserted. Thebase205 includes aguide post244 for mounting the fiber optic module into a system printed circuit board. The bottom of the base mounts parallel to the printed circuit board of the system such that when horizontal, the receivePCB108 and the transmitPCB106 are vertical and substantially perpendicular in reference to the printed circuit board of the system and thebase205. Next in assembly, thebase205 has its base pin holes242 slid over the PCB pins113 and117, the printedcircuit boards106 and108 are guided to mate with thePCB slots240, and the clips ortabs236 of the shielded housing or cover119 are guided into the clip openings orslots238. The receivePCB pins113 and the transmitPCB pins117 are vertical and substantially perpendicular in reference to the printed circuit board of the system and thebase205. After coupling the base205 to the shielded housing or cover119, the clips ortabs236 are bent, twisted, or otherwise changed in order to hold the base205 in place. As an alternative to clips ortabs236 and clip openings orslots238, the shielded housing or cover119 may use plastic clips, or a ridge, integrated into each side that couples to base205 appropriately. The shielded housing or cover119, which is coupled to ground, encases thePCBs106 and108 to reduce the electromagnetic fields generated by the electrical components coupled thereto by shunting the electric fields to ground to reduce electromagnetic interference (EMI).

Referring now toFIG. 3A, a cross-sectional view of theoptical block102 for the first embodiment is illustrated. Thetransmitter110, thereceiver111, and theMT alignment plate201 are coupled to theoptical block102. Thelight transmitter110 includes anemitter302 for generation of light or photons in response to electrical signals from the transmitPCB106. Thelight receiver111 includes adetector304 to receive light or photons and generate electrical signals in response to light or photons coupled thereto. Light or photons emitted by theemitter302 are coupled intolens123 and collimated onto thereflector125 at an incident angle I1 (angle with the perpendicular toreflector125 surface) preferably of substantially forty five degrees.Reflector125 reflects the incident light or photons on a refraction angle R1 (angle with the perpendicular toreflector125 surface) equivalent to incident angle I1 preferably of substantially forty five degrees. The reflected light or photons preferably travel perpendicular to the incident light or photons towards thelens122.Lens122 focuses the light or photons from theemitter302 into an aligned optical fiber through theoptical port217 in theMT alignment plate201. Thus, light or photons coupled or launched into an optical fiber, defining a first optical axis, are preferably substantially perpendicular to the light or photons emitted and incident uponlens123 from theemitter302 of thetransmitter110.

Light or photons, incident from a fiber optic cable coupled to thefiber optic module100, is received through theoptical port217 of theMT alignment plate201. Light or photons from the fiber optic cable are aligned to be incident upon thelens120.Lens120 collimates the incident light or photons from a fiber optic cable onto thereflector124 at an incident angle I2 of preferably substantially forty five degrees.Reflector124 reflects incident light or photons at a refractive angle R2 equivalent to incident angle I2 of preferably substantially forty five degrees towardslens121.Lens121 focuses the light or photons received from a fiber optical cable onto thedetector304. Light or photons incident from a fiber optic cable, defining a second optical axis, are preferably substantially perpendicular to the light or photons incident upon thedetector304.

FIG. 3B illustrates a frontal perspective view from the left side of theoptical block102. The front side of theoptical block102 includes optical block alignment pins316 and anoptical output opening317. The optical block alignment pins316 couple to the alignment holes216 of thealignment plate201 such that theoptical output opening317 is aligned with theoptical port217 in thealignment plate201.FIG. 3C illustrates the front side of theoptical block102. Theoptical output opening317 is indicated.

FIG. 3D is a back side perspective view from the right of theoptical block102. The back side of theoptical block102 includes acavity322 that is used to form the shape of thereflective surfaces124–125 during manufacturing of theoptical block102.FIG. 3E is a back view of the optic block illustrating the opening into thecavity322.

FIG. 3F illustrates the right side of theoptical block102 which has theopening214 to mate with the type of housing of thetransmitter110. Thelens123 can be viewed near the center of theopening214.FIG. 3G illustrates the left side of theoptical block102. which has theopening213 to mate with the type of housing of thereceiver111. Thelens121 can be viewed near the center of theopening213. ComparingFIGS. 3F and 3G, the offset betweenopenings213 and214 to avoid optical crosstalk is visible. In the preferred embodiment,receiver111 is closer to theoptical opening317 in order to minimize the loss of incoming received optical power. However, the position ofreceiver111 andtransmitter110 can be interchanged.FIG. 3H is a cross-sectional view of theoptical block102 illustrating the relative position of the optical block alignment posts316. Thearea324 surrounding thealignment post316 is magnified inFIG. 3I.FIG. 3I provides a magnified cross-sectional view of thealignment post316.

FIG. 4 illustrates another embodiment of the invention. To couple to theoptical fibers101, afiber optic module400 includes anoptical block402 andelectrical elements404. Theoptical block402 may also be referred to as a nose, an optical port, an alignment block, an optical connector, an optical receptacle or receptacle. Theoptical block402 can interface to an optical connector such as an LC, MT-RJ or VF-45 optical connector.Electrical elements404 includetransmitter PCB106,receiver PCB108,light receiver111,light transmitter110, and a shielded housing orcover419. Shielded housing or cover419 may be narrower than shielded housing or cover119 due toreceiver111 andtransmitter110 being parallel with thePCBs108 and106. The optical oralignment block402 may includelens423 andlens421 for coupling light or photons into and out of thefiber optic cable101. Alternatively thelens423 and421 may be coupled to thereceiver111 andtransmitter110.Lens423 and421 may be spherical lenses or each may be a pair of aspheric lenses on the same optical axis. Light or photons emitted by thetransmitter110 are collected and focused bylens423 into a transmit fiber optic cable. Light or photons on a receive fiber optic cable are collected and focused bylens421 into thereceiver111. In this manner,fiber optic module400 preferably keeps light or photons substantially in parallel and does not have to reflect the light or photons to couple it withreceiver111 ortransmitter110.

FIG. 5A illustrates an exploded diagram of thefiber optic module400.Fiber optic module400 is assembled similar tofiber optic module100 as previously described with reference toFIG. 2. However, optical oralignment block402 differs fromoptical block102.Receiver111 andtransmitter110 are inserted intoopenings513 and514 respectively in the optical oralignment block402. The receiver and transmitter may be held in place by a press fit or glued in place. To glue in place, an epoxy or glue is injected in top andbottom tacking holes515 of the optical oralignment block402 while thereceiver111 andtransmitter110 are tested and aligned to substantially couple light or photons into and out of fiber optic cables. After the epoxy is set and the receiver and transmitter are substantially fixed in theoptical block102, the transmitPCB106 and the receivePCB108 are coupled respectively to thetransmitter110 and thereceiver111. Theterminals511 and510 of thereceiver111 and thetransmitter110 respectively are soldered directly onto the PCB. The high frequency pins associated with thereceiver111 andtransmitter110 are preferably soldered on the component side of the printed circuit boards in order to provide proper shielding. Thealignment plate201, thenose202 and the nose shielding203 are unnecessary in this embodiment of the invention. Fiber ferrules are utilized instead for alignment between the optical oralignment block402 and theoptical fibers101.

Referring now toFIG. 5B, an exploded view of afiber optic module400′ is illustrated.Fiber optic module400′ is assembled similar tofiber optic module400 as previously described with reference toFIG. 5A but adifferent base205′ is utilized. The base205′ differs frombase205 in that it has a pair ofguide rails540 to hold thePCBs106 and108 in place and a pair of cutouts oropen slots542 for thepins113 and117 to extend through. In this manner, thePCBs106 and108 may slide into place onto the base205′.

Referring now toFIG. 5C, an exploded view of afiber optic module400″ is illustrated.Fiber optic module400″ is assembled similar tofiber optic module400 as previously described with reference toFIG. 5A but adifferent base205″ is utilized. The base205″ differs frombase205 in that it has pairs of mountingbrackets540′ to hold thePCBs106 and108 in place and a pair ofopenings542′ for thepins113 and117 to extend through.

ThePCB slots240,guide rails540 orbrackets540′ can be replaced by slots, brackets or guide rails of theoptical block402 to align the PCBs thereto. Additionally, it is to be understood that alternate bases may be formed by combining the elements of thebases205,205′, and205″ in different ways. For example, refer toFIG. 5D.FIG. 5D illustrates an exploded view of afiber optic module400′″.Fiber optic module400′″ is assembled similar tofiber optic module400 as previously described with reference toFIG. 5A but adifferent base205′″ is utilized and a slightly different optical block502 is utilized. The base205′″ differs frombase205 in that there are noslots240 and that there are a pair of cutouts oropen slots542 for thepins113 and117 to extend through. The optical block502 differs from theoptical block402 in that a pair ofslots525 are provided to align thePCBs106 and108 with the optical block.

Referring now toFIG. 6A, a cross-sectional view of the optical oralignment block402 for the second embodiment is illustrated. Thetransmitter110 and thereceiver111 are coupled to the optical oralignment block402. Thetransmitter110 includes anemitter302 for generation of light or photons. Thereceiver111 includes adetector304 to receive light or photons. Light or photons emitted by theemitter302 are coupled intolens423, collected and focused into the optical fiber through theoptical port417A. Light or photons, incident from a fiber optic cable coupled to thefiber optic module400, is received through theoptical port417B. Photons from the fiber optic cable are incident upon thelens421.Lens421 collects and focuses the incident light or photons from the fiber optic cable onto thedetector304 of thereceiver111. In order to keep theoptical fibers101 in alignment with the optical oralignment block402, a pair offiber ferrules421 are provided. Thefiber ferrules421 are inserted into theoptical ports417A and417B.

FIG. 6B illustrates the front side of the optical oralignment block402. The front side of the optical oralignment block402 includesoptical output ports417A and417B. InFIG. 6B, thelens421 is visible through theoptical output port417B andlens423 is visible through theoptical output port417A.FIG. 6C is an illustration of the back side of the optical oralignment block402. InFIG. 6C, thelens421 is visible throughopening513 andlens423 is visible throughopening514.FIG. 6D illustrates the top side of the optical oralignment block402 which has the tackingholes515 coupling to theopenings513 and514. Epoxy may be inserted into the top andbottom tacking holes515 to hold thetransmitter110 andreceiver111 in position in the optical oralignment block402.

Referring now toFIGS. 7A–7B, final steps of the assembly of printedcircuit boards106 and108 are illustrated. TransmitPCB106 and receivePCB108 are assembled as one unit on one printedcircuit board700 with acenter score702 defining a boundary line between transmit and receive components. After all components have been attached and assembled onto theunitary PCB700, thePCB700 is flexed along thescore702 such that the transmitPCB106 and the receivePCB108 may be separated. TransmitPCB106 and the receivePCB108 may thereafter be assembled as part of thefiber optic module100 and thefiber optic module400. The transmitPCB106 and the receivePCB108 may each be approximately 6.5 mm inheight excluding pins113 and117.

Referring now toFIG. 8A, another embodiment of the invention is illustrated.FIG. 8A illustrates an exploded view of afiber optic module800. Thefiber optic module800 includes an upper transmitPCB106U, a lower transmitPCB106L, an upper receivePCB108U, a lower receivePCB108L, thetransmitter110, thereceiver111, theoptical block402, the shielded housing or cover419, a first and second PCBinterconnect pin headers827, a firstterminal pin header813 for the transmitter, a secondterminal pin header817 for the receiver, and abaseplate805.

Thetransmitter110 is a transmit optical subassembly (Tx OSA) that includes a VCSEL or other semiconductor device that transduces electrical signals into photons or a light output. Thereceiver111 is a receive optical subassembly (Rx OSA) including a PIN diode or other device that converts photons or light input into electrical signals. The Tx OSA and Rx OSA are attached to physically separated transmit and receive electrical subassemblies (ESA's). In one embodiment, the transmit ESA includes an upper and lower transmitPCBs106U and106L withcomponents116 mounted thereto. In one embodiment, the receive ESA includes an upper and lower receivePCBs108U and108L withcomponents112 mounted thereto.

The lower transmitPCB106L and the upper transmitPCB106U provide similar functionality to that of the transmitPCB106 and includecomponents112. The lower receivePCB108L and the upper receivePCB108U provide similar functionality to that of the receivePCB108 and includecomponents116. The upper and lower transmitPCBs106U and106L are parallel to each other in a horizontal plane and parallel with the optical axis of thetransmitter110. The upper and lower receivePCBs108U and108L are parallel to each other in a horizontal plane and parallel with the optical axis of thereceiver111. This configuration of parallel horizontal boards for each of the transmit and receive capability can be referred to as dual-stack horizontal modular PCBs.

The first and secondpin interconnect headers827 include the conductive signal pins837 molded into a non-conductive medium. The first and secondpin interconnect headers827 are used to interconnect lower and upper PCB's. Thefirst pin header827 provides signal interconnection between the upper and lower transmitPCBs106U and106L. Thefirst pin header827 provides signal interconnection between the upper and lower transmitPCBs106U and106L. Thesecond pin header827 provides signal interconnection between the upper and lower receivePCBs108U and108L. Thesecond pin header827 haspins837 that couple intoupper throughholes847U in the upper receivePCB108U and lower throughholes847L in the lower receivePCB108L. Thefirst pin header827 similarly haspins837 that couple into upper and lower throughholes in the upper and lower transmitPCBs106U and106L respectively.

The first and secondterminal pin headers817 and813 include conductive signal pins molded into a non-conductive medium. The first and secondterminal pin headers817 and813 are used to route electrical signals to and from thefiber optic module800 to a host system. The firstterminal pin header813 haspins113 that couple to throughholes842 in the lower transmitPCB106L. Similarly, the secondterminal pin header817 haspins117 that couple to throughholes842 in the lower receivePCB108L.

Thetransmitter110 couples to the upper transmitPCB106U in one embodiment. Theterminals810 of thetransmitter110 couple to the upper transmitPCB106U in one embodiment. Using a straddle mount, one or more terminals couple to upper edge traces820U on a top side of the upper transmitPCB106U and one or more terminals couple to lower edge traces820L on a back side of the upper transmitPCB106U. In a straddle mount, the optoelectronic device (i.e. thetransmitter110 or the receiver111) has its optical axis nearly in-line and parallel with a plane of the printed circuit board. In an alternate embodiment, theterminals810 may couple to the lower transmitPCB106U. In another alternate embodiment, theterminals810 may couple between the upper and lower receive PCBs so that one or more couple to the upper PCB and one or more couple to the lower PCB. In yet another alternate embodiment using a through hole mount, theterminals810 may couple into holes of the upper or lower transmit PCBs or both upper and lower transmit PCBs. In a through hole mount, the optoelectronic device (i.e. thetransmitter110 or the receiver111) has its optical axis nearly parallel with a plane of the printed circuit board.

Thereceiver111 couples to the upper receivePCB108U in one embodiment. Theterminals811 of thereceiver111 couple to the upper receivePCB108U in one embodiment. Using a straddle mount, one or more terminals couple to upper edge traces821U on a top side of the upper receivePCB108U and one or more terminals couple to lower edge traces821L on a back side of the upper receivePCB108U. In an alternate embodiment, theterminals811 may couple to the lower receivePCB108U. In another alternate embodiment, theterminals811 may couple between the upper and lower receive PCBs so that one or more couple to the upper PCB and one or more couple to the lower PCB. In yet another alternate embodiment, theterminals811 may couple into holes of the upper or lower receive PCBs or both upper and lower receive PCBs.

Included with thefiber optic module800 is abaseplate805. Thebaseplate805 may include aninner septum815 that divides the transceiver and receiver into two separate cavities, for EMI and electrical isolation of the transmitter from the receiver or between channels. Thebaseplate805 acts like a chassis or frame to provide support for the shielded housing or cover419 and the receiver and transmit subassemblies. Thebaseplate805 may include aninner septum815, one ormore openings242 to receive thepins113 and117, and one or more clip openings orslots238 to receive the clips ortabs236. Thebaseplate805 in one embodiment is plastic in other embodiments that baseplate may be metal or a metalized plastic to provide shielding. Theinner septum815 provides separation between the transmitter and the receiver or between channels.

Referring now toFIG. 8B, analternate baseplate805′ is illustrated.Baseplate805′ differs frombaseplate805 in that it includesslots842 forpins113 and117.Baseplate805′ may similarly include clip openings orslots238 and theinner septum815.

Referring now toFIG. 8C, a rear cross sectional view of the assembledfiber optic module800 is illustrated. Thebaseplate805 with theinner septum815 can divide thefiber optic module800 into two separate cavities. The separate cavities can improve EMI and electrical isolation of the transmitter from the receiver. Thereceiver111 couples to the upper receivePCB108U with itsterminals811 using a straddle mount in one embodiment. Thetransmitter111 couples to the upper transmitPCB106U with itsterminals810 using a straddle mount in one embodiment.

InFIG. 8C, the upper and lower transmitPCBs106U and106L are parallel to each other in a horizontal plane and parallel with the optical axis of thetransmitter110. The upper and lower receivePCBs108U and108L are parallel to each other in a horizontal plane and parallel with the optical axis of thereceiver111. This configuration of parallel horizontal boards for each channel can be referred to as dual-stack horizontal modular PCBs. The dual stacked horizontal PCB's allow an increase in component surface mounting area for a given volume. Both sides of the upper and lower transmit and receive PCB's can be utilized to mount electronic components. This increased surface area can provide increased functionality in a fiber optic module by allowing additional components such as integrated circuits and passive components such as filters, capacitors, and inductors to be utilized.

Referring now toFIG. 9A, another embodiment of the invention is illustrated.FIG. 9A illustrates an exploded view of afiber optic module900. Thefiber optic module900 utilizes a motherboard which is common to daughtercards PCBs which are substantially perpendicular to the motherboard. Assuming the motherboard is horizontal, the daughtercard PCBs are substantially vertical to the motherboard and can be also be referred to as vertical PCBs. The substantially vertical PCB's couple to the common motherboard.

Thefiber optic module900 includes a vertical transmitPCB106′ and a vertical receivePCB108′ in parallel coupled to ahorizontal motherboard PCB905. Themotherboard PCB905 can separate ground and power planes between receiver and transmitter channels in order to maximize isolation and minimize cross talk. The vertical transmit PCB and the vertical receive PCB may have traces soldered to traces of the motherboard for electrical connectivity or otherwise include pins that plugged into holes or sockets of the motherboard to ease replacement or to expand the number of transmit or receive channels with additional transmit PCBs or receive PCBs. Alternatively, the electrical connection between the vertical transmit PCB and the vertical receive PCB and motherboard PCB may be made with electrical connectors in lieu of solder joints. The mother board PCB includes Input/Output Pins (I/O Pins) or an I/O socket connector to couple to holes or a socket of a host system PCB to interface with a host system.

In order to further minimize the form factor of thefiber optic module900, the vertical transmit PCB and the vertical receive PCB provides mounting surfaces for components on both the left and right side surfaces (or front and back surfaces). Additionally, a top surface of themotherboard PCB905 may also be used to mount components or circuits for increased electrical functionality such as a clock/data recovery (CDR) function and minimize the form factor of the fiber optic module.

To minimize EMI and crosstalk between the vertical transmit PCB and the vertical receive PCB, an inner shield similar to theshield109 may be used. Alternatively, one or both of the vertical transmit PCB and the vertical receive PCB may have a ground plane on of its left or right side surfaces (sometimes referred to as a backside ground plane).

Thevertical PCBs106′ and108′ are similar toPCBs106 and108 but for the coupling to thehorizontal motherboard PCB905. Thevertical PCBs106′ and108′ have signal traces soldered to signal traces of thehorizontal motherboard PCB905 which can also mechanically support thevertical PCBs106′ and108′. Solder joints917R couple the receivePCB108′ to thehorizontal motherboard PCB905.Solder joints917T couple the transmitPCB106′ to the horizontal motherboard PCB905 (seeFIG. 9B). Thefiber optic module900 can be referred to as having vertical PCB's with a horizontal motherboard PCB.

Thehorizontal motherboard PCB905 includes input/output (I/O) pins113 and117 to couple to a host system and wire traces to route power, ground and signals between thepins113 and117 and thevertical PCBs106′ and108′.

Thefiber optic module900 further includes thetransmitter110, thereceiver111, theoptical block402, and the shielded housing orcover419. The shielded housing or cover419 has clips ortabs236 that couple into clip openings orslots238 in themotherboard PCB905. The clips ortabs236 can be held in place in the slots by a friction fit or glued in place or they may extend through themotherboard PCB905 and be turned and or bent to couple the shielded housing or cover419 and themotherboard PCB905 together. Alternatively, the clips ortabs236 of the shielded housing or cover419 can wrap around themotherboard PCB905 to couple them together.

Thetransmitter110 couples into theopening514 of theoptical block402. Thereceiver111 couples into theopening513 of the optical block. They are held in place by either a friction fit or a glue such as an epoxy.

Thetransmitter110 couples to the transmitPCB106′. Theterminals810 of thetransmitter110 couple to the transmitPCB106′. In one embodiment using a straddle mount, one ormore terminals810 couple to left edge traces920L on a left side and one ormore terminals810 couple to right edge traces920R on a right side of the transmitPCB106′. In alternate embodiment, theterminals810 may couple to one side of the transmitPCB106′. In yet another alternate embodiment, theterminals810 may couple into holes of the transmitPCB106′.

Thereceiver111 couples to the receivePCB108′. Theterminals811 of thereceiver111 couple to the receivePCB108′. Using a straddle mount, one ormore terminals811 couple to left edge traces921L on a left side and one ormore terminals811 couple to right edge traces921R on a right side of the receivePCB108′. In an alternate embodiment, theterminals811 may couple to one side of the receivePCB108′. In yet another alternate embodiment, theterminals811 may couple into holes of the receivePCB108′.

Referring now toFIG. 9B, a rear cross-sectional view of the assembledfiber optic module900 is illustrated.Traces920 on the motherboard PCB route signals to components on the motherboard PCB, the I/O pins113 and117, and the solder joints917R and917T. Aground plane118 can be coupled to a side the vertical receivePCB108′ or aground plane114 can be coupled to a side of the vertical transmitPCB106′ or both. Referring toFIG. 9C, the vertical transmitPCB106′ includes theground plane114 and the vertical receivePCB108′ is without a ground plane to allow room for addedcomponents116 on each side; Referring toFIG. 9D, the vertical receivePCB108′ includes theground plane118 and the vertical transmitPCB106′ is without a ground plane to allow room for addedcomponents112 on each side. An optionalinner shield109 can also be used for further isolation between channels to reduce cross-talk and EMI as illustrated inFIG. 9B. In any case, theground plane114 and118 will have cutouts for traces to coupled to theterminals810 and811 and may have additional cutouts forcomponents112 or116 as the case may be. Referring now toFIG. 9E, theground plane118 or theground plane114 may be alternatively sandwiched between layers of either the vertical receivePCB108′ or the vertical transmitPCB106′ or both as a part of a multilayer PCB as illustrated byFIG. 9C. This can allow forfurther components116 and112 to be added to both sides of the vertical receivePCB108′ and the vertical transmitPCB106′.

Referring now toFIG. 10A, another embodiment of the invention is illustrated.FIG. 10A illustrates an exploded view of afiber optic module1000. Thefiber optic module1000 has angled PCBs with respect to a horizontal or vertical axis of thefiber optic module1000. The length of the PCBs remain parallel to the optical axis of thereceiver111 andtransmitter110. By angling the PCBs with the horizontal or vertical axis, the PCBs may be made smaller to fit a smaller form factor or alternatively the surface area can be increased. That is the available PCB surface area for mounting components can be increased for a given volume by angling the PCBs. The increased surface area can give the final assembled fiber optic module increased functionality by allowing components such as integrated circuits and passive components such as filters, capacitors, and inductors to be added. More room can also be provided in thefiber optic module1000 for mounting larger components by angling the PCBs.

Thefiber optic module1000 includes an angled transmitPCB106″, an angled receivePCB108″, thetransmitter110, thereceiver111, anoptical block402′, the shielded housing or cover419, a firstterminal pin header1027T for the transmitter, a secondterminal pin header1027R for the receiver, and thebaseplate805 or805′.

The angled transmitPCB106″ and the angled receivePCB108″ are arranged within the fiber optic module at an angle with respect to the horizontal axis thereof as defined by a line normal to both receiver and transmitter optical axes. The angled transmitPCB106″ and the angled receivePCB108″ are held in place having a width that is on an angle with respect to a horizontal or vertical axis of thefiber optic module1000. The length of the angled transmitPCB106″ and the angled receivePCB108″ are parallel to the optical axis of thereceiver111 andtransmitter110. The angled transmitPCB106″ includescomponents116 and left and right edge traces921L and921R. The firstterminal pin header1027T haspins117 that couple to holes of the angled transmitPCB106″ on one end. The angled receivePCB108″ includescomponents112 and left and right edge traces920L and920R. The secondterminal pin header1027R haspins113 that couple to holes of the angled receivePCB108″ on one end.

Thetransmitter110 is a transmit optical subassembly (Tx OSA) that includes a VCSEL or other semiconductor device that transduces electrical signals into photons or a light output. Thereceiver111 is a receive optical subassembly (Rx OSA) including a PIN diode or other device that converts photons or light input into electrical signals. The Tx OSA and Rx OSA are attached to physically separated transmit and receive electrical subassemblies (ESA's). In one embodiment, the transmit ESA includes the angled transmitPCB106″ withcomponents116 and the firstterminal pin header1027T mounted thereto. In one embodiment, the receive ESA includes the angled receivePCB108″ withcomponents112 and the secondterminal pin header1027R mounted thereto.

Theoptical block402′ is similar to theoptical block402 but has some modifications to accommodate the angled transmitPCB106″ and the angled receivePCB108″. Theoptical block402′ includesopenings513′ and514′ to receive thereceiver111 andtransmitter110 respectively andangled slots1015 to receive the angled transmitPCB106″ and the angled receivePCB108″. Theangled slots1015 can provide a friction fit with the angled transmitPCB106″ and the angled receivePCB108″ or glue or epoxy can be used to couple them together. Theangled slots1015 can also serve to tack thereceiver111 andtransmitter110 in place within theoptical block402′.

Thetransmitter110 couples into theopening514′ of theoptical block402′. Thereceiver111 couples into theopening513′ of theoptical block402′. They can be held in place by either a friction fit or a glue such as an epoxy.

Thetransmitter110 also couples to the transmitPCB106″. Theterminals810 of thetransmitter110 couple to the transmitPCB106″ in one embodiment. Using a straddle mount, one ormore terminals810 couple to left edge traces920L on a left side and one ormore terminals810 couple to right edge traces920R on a right side of the transmitPCB106″. In an alternate embodiment, theterminals810 may couple to one side of the transmitPCB106″. In yet another alternate embodiment, theterminals810 may couple into holes of the transmitPCB106″.

Thereceiver111 also couples to the receivePCB108″. Theterminals811 of thereceiver111 couple to the receivePCB108″. Using a straddle mount, one ormore terminals811 couple to left edge traces921L on a left side and one ormore terminals811 couple to right edge traces921R on a right side of the receivePCB108″. In an alternate embodiment, theterminals811 may couple to one side of the receivePCB108″. In yet another alternate embodiment, theterminals811 may couple into holes of the receivePCB108″.

Referring now toFIG. 10B, a rear cross-sectional view of the assembledfiber optic module1000 is illustrated. The firstterminal pin header1027T is coupled to the angled transmitPCB1027T so thatpins117 are vertical with the reference axis. The secondterminal pin header1027R is coupled to the angled receivePCB108″ so thatpins113 are vertical with the reference axis. Aground plane118 can be coupled to a side the angled receivePCB108″ or aground plane114 can be coupled to a side of the angled transmitPCB106″ or both similar to previously described with reference to the vertical boards andFIGS. 9B–9E. The shield housing or cover419 couples to the base orbaseplate805 or805′ around the printed circuit boards. Depending upon the width of the printedcircuit boards106′ and108′ and the width of thefiber optic module1000, the angles θ₁and θ₂which the printed boards make with the base orbaseplate805 or805′ can vary between zero and ninety degrees.

Referring now toFIG. 11A, another embodiment of the invention is illustrated.FIG. 11A illustrates an exploded view of afiber optic module1100. Thefiber optic module1100 has parallel angled or slanted PCBs with respect to a horizontal or vertical axis of thefiber optic module1100. The length of the PCBs remain parallel to the optical axis of thereceiver111 andtransmitter110. By parallel angling the PCBs with the horizontal or vertical axis, the PCBs may be made smaller to fit a smaller form factor or alternatively the surface area can be increased. That is the available PCB surface area for mounting components can be increased for a given volume by angling the PCBs. The increased surface area can give the final assembled fiber optic module increased functionality by allowing components such as integrated circuits and passive components such as filters, capacitors, and inductors to be added. More room can also be provided in thefiber optic module1100 for mounting larger components by angling the PCBs in parallel together.

Thefiber optic module1100 includes an angled transmitPCB106′″, an angled receivePCB108′″, thetransmitter110, thereceiver111, anoptical block402″, the shielded housing or cover419, a firstterminal pin header1027T′ for the transmitter, a secondterminal pin header1027R′ for the receiver, and abaseplate805″.

The angled transmitPCB106′″ and the angled receivePCB108′″ are arranged in parallel and at an angle with respect to a horizontal datum plane that passes through and is normal to receiver and transmitter optical axes. The angled transmitPCB106′″ and the angled receivePCB108′″ are slanted in parallel to the right but can be easily arranged so as to slant in parallel to the left. The angled transmitPCB106′″ and the angled receivePCB108′″ are held in place having a width that is on an angle with respect to a horizontal or vertical axis of thefiber optic module1100. The length of the angled transmitPCB106′″ and the angled receivePCB108′″ are parallel to the optical axis of thereceiver111 andtransmitter110. The angled transmitPCB106′″ includescomponents116 and left and right edge traces921L and921R. The firstterminal pin header1027T′ haspins117 that couple to holes of the angled transmitPCB106′″ on one end. The angled receivePCB108′″ includescomponents112 and left and right edge traces920L and920R. The secondterminal pin header1027R′ haspins113 that couple to holes of the angled receivePCB108′″ on one end.

Thetransmitter110 is a transmit optical subassembly (Tx OSA) that includes a VCSEL or other semiconductor device that transduces electrical signals into photons or a light output. Thereceiver111 is a receive optical subassembly (Rx OSA) including a PIN diode or other device that converts photons or light input into electrical signals. The Tx OSA and Rx OSA are attached to physically separated transmit and receive electrical subassemblies (ESA's). In one embodiment, the transmit ESA includes the angled transmitPCB106′″ withcomponents116 and the firstterminal pin header1027T′ mounted thereto. In one embodiment, the receive ESA includes the angled receivePCB108′″ withcomponents112 and the secondterminal pin header1027R′ mounted thereto.

Thebaseplate805″ is similar to thebaseplate805 and805′ but has angledinner septum815′ to be angled in parallel with the angled transmitPCB106′″ and the angled receivePCB108′″. Thebaseplates805,805′,805″ in one embodiment may be a dielectric to isolate components and insulate them from one another. In another embodiment,baseplates805,805′,805″ may be an insulator. In another embodiment,baseplates805,805′,805″ may have theirseptum815 or815′ metalized so as to provide EMI and crosstalk shielding. Alternatively, a metal shield my be placed on top of theseptum815 or815′ such asshield109.

Theoptical block402″ is similar to theoptical block402 but has some modifications to accommodate the angled transmitPCB106′″ and the angled receivePCB108′″. Theoptical block402″ includesopenings513″ and514″ to receive thereceiver111 andtransmitter110 respectively andangled slots1115 to receive the angled transmitPCB106′″ and the angled receivePCB108′″. Theangled slots1115 can provide a friction fit with the angled transmitPCB106′″ and the angled receivePCB108′″ or glue or epoxy can be used to couple them together. Theangled slots1115 can also serve to tack thereceiver111 andtransmitter110 in place within theoptical block402″.

Thetransmitter110 couples into theopening514″ of theoptical block402″. Thereceiver111 couples into theopening513″ of theoptical block402″. They can be held in place by either a friction fit or a glue such as an epoxy.

Thetransmitter110 also couples to the transmitPCB106′″. Theterminals810 of thetransmitter110 couple to the transmitPCB106′″ in one embodiment. Using a straddle mount, one ormore terminals810 couple to left edge traces920L on a left side and one ormore terminals810 couple to right edge traces920R on a right side of the transmitPCB106′″. In an alternate embodiment, theterminals810 may couple to one side of the transmitPCB106′″. In yet another alternate embodiment, theterminals810 may couple into holes of the transmitPCB106′″.

Thereceiver111 also couples to the receivePCB108′″. Theterminals811 of thereceiver111 couple to the receivePCB108′″. Using a straddle mount, one ormore terminals811 couple to left edge traces921L on a left side and one ormore terminals811 couple to right edge traces921R on a right side of the receivePCB108′″. In an alternate embodiment, theterminals811 may couple to one side of the receivePCB108′″. In yet another alternate embodiment, theterminals811 may couple into holes of the receivePCB108′″.

Referring now toFIG. 11B, a rear cross-sectional view of the assembledfiber optic module1100 is illustrated. The angled receivePCB108′″ and the angled transmitPCB106′″ of thefiber optic module1100 are angled in parallel together with respect to a horizontal or vertical axis thereof. The firstterminal pin header1027T′ is coupled to the angled transmitPCB1027T′ so thatpins117 are vertical with the reference axis. The secondterminal pin header1027R′ is coupled to the angled receivePCB108′″ so thatpins113 are vertical with the reference axis. Aground plane118 can be coupled to a side the angled receivePCB108′″ or aground plane114 can be coupled to a side of the angled transmitPCB106′″ or both similar to previously described with reference to the vertical boards andFIGS. 9B–9E. The shield housing or cover419 couples to thebaseplate805″ around the printed circuit boards. Depending upon the width of the printedcircuit boards106′″ and108′″ and the width of thefiber optic module1100, the angles θ₃and θ₄which the printed boards make with the base orbaseplate805″ and the angle θ₅which theseptum815′ makes with the base orbaseplate805″ can vary between zero and ninety degrees.

Referring now toFIG. 12A, another embodiment of the invention is illustrated.FIG. 12A illustrates an exploded view of afiber optic module1200. Thefiber optic module1200 has angled or slanted PCBs with respect to a horizontal or vertical axis of thefiber optic module1200. The PCBs are angled or slanted away at top edges to form a V configuration of PCB orientation. The length of the PCBs remain parallel to the optical axis of thereceiver111 andtransmitter110. By angling the PCBs with the horizontal or vertical axis, the PCBs may be made smaller to fit a smaller form factor or alternatively the surface area can be increased. That is the available PCB surface area for mounting components can be increased for a given volume by angling the PCBs. The increased surface area can give the final assembled fiber optic module increased functionality by allowing components such as integrated circuits and passive components such as filters, capacitors, and inductors to be added. More room can also be provided in thefiber optic module1200 for mounting larger components by angling the PCBs.

Thefiber optic module1200 includes an angled transmitPCB106″″, an angled receivePCB108″″, thetransmitter110, thereceiver111, anoptical block402′″, the shielded housing or cover419, a firstterminal pin header1027T″ for the transmitter, a secondterminal pin header1027R″ for the receiver, and thebaseplate805 or805′.

The angled transmitPCB106″″ and the angled receivePCB108″″ are arranged at an angle with respect to the horizontal axis of the fiber optic module as defined by a line normal to both receiver and transmitter optical axes. The angled transmitPCB106″″ and the angled receivePCB108″″ slant away from each other to form the V configuration. The angled transmitPCB106″″ and the angled receivePCB108″″ are held in place having a width that is on an angle with respect to a horizontal or vertical axis of thefiber optic module1200. The length of the angled transmitPCB106″″ and the angled receivePCB108″″ are parallel to the optical axis of thereceiver111 andtransmitter110. The angled transmitPCB106″″ includescomponents116 and left and right edge traces921L and921R. The firstterminal pin header1027T″ haspins117 that couple to holes of the angled transmitPCB106″″ on one end. The angled receivePCB108″″ includescomponents112 and left and right edge traces920L and920R. The secondterminal pin header1027R″ haspins113 that couple to holes of the angled receivePCB108″″ on one end.

Thetransmitter110 is a transmit optical subassembly (Tx OSA) that includes a VCSEL or other semiconductor device that transduces electrical signals into photons or a light output. Thereceiver111 is a receive optical subassembly (Rx OSA) including a PIN diode or other device that converts photons or light input into electrical signals. The Tx OSA and Rx OSA are attached to physically separated transmit and receive electrical subassemblies (ESA's). In one embodiment, the transmit ESA includes the angled transmitPCB106″″ withcomponents116 and the firstterminal pin header1027T″ mounted thereto. In one embodiment, the receive ESA includes the angled receivePCB108″″ withcomponents112 and the secondterminal pin header1027R″ mounted thereto.

Theoptical block402′″ is similar to theoptical block402 but has some modifications to accommodate the angled transmitPCB106″″ and the angled receivePCB108″″. Theoptical block402′″ includesopenings513′″ and514′″ to receive thereceiver111 andtransmitter110 respectively andangled slots1215 to receive the angled transmitPCB106″″ and the angled receivePCB108″″. Theangled slots1215 can provide a friction fit with the angled transmitPCB106″″ and the angled receivePCB108″″ or glue or epoxy can be used to couple them together. Theangled slots1215 can also serve to tack thereceiver111 andtransmitter110 in place within theoptical block402′″.

Thetransmitter110 couples into theopening514′″ of theoptical block402′″. Thereceiver111 couples into theopening513′″ of theoptical block402′″. They can be held in place by either a friction fit or a glue such as an epoxy.

Thetransmitter110 also couples to the transmitPCB106″″. Theterminals810 of thetransmitter110 couple to the transmitPCB106″″ in one embodiment. Using a straddle mount, one ormore terminals810 couple to left edge traces920L on a left side and one ormore terminals810 couple to right edge traces920R on a right side of the transmitPCB106″″. In an alternate embodiment, theterminals810 may couple to one side of the transmitPCB106″″. In yet another alternate embodiment, theterminals810 may couple into holes of the transmitPCB106″″.

Thereceiver111 also couples to the receivePCB108″″. Theterminals811 of thereceiver111 couple to the receivePCB108″″. Using a straddle mount, one ormore terminals811 couple to left edge traces921L on a left side and one ormore terminals811 couple to right edge traces921R on a right side of the receivePCB108″″. In an alternate embodiment, theterminals811 may couple to one side of the receivePCB108″″. In yet another alternate embodiment, theterminals811 may couple into holes of the receivePCB108″″.

Referring now toFIG. 12B, a rear cross-sectional view of the assembledfiber optic module1200 is illustrated. The angled receivePCB108″″ and the angled transmitPCB106″″ of thefiber optic module1200 are angled away from each other with respect to a horizontal or vertical axis thereof. The firstterminal pin header1027T″ is coupled to the angled transmitPCB1027T″ so thatpins117 are vertical with the reference axis. The secondterminal pin header1027R″ is coupled to the angled receivePCB108″″ so thatpins113 are vertical with the reference axis. Aground plane118 can be coupled to a side the angled receivePCB108″″ or aground plane114 can be coupled to a side of the angled transmitPCB106″″ or both similar to previously described with reference to the vertical boards andFIGS. 9B–9E. The shield housing or cover419 couples to thebaseplate805 or805′ around the printed circuit boards. Depending upon the width of the printedcircuit boards106″″ and108″″ and the width of thefiber optic module1200, the angles θ₆and θ₇which the printed boards make with the base orbaseplate805 or805′ can vary between zero and ninety degrees.

While symmetrical angles for the printed circuit boards have been illustrated, combinations can be utilized to form alternate embodiments. For example, one of the printed circuit boards may be arranged on an angle with the base so as to slant while the other printed circuit board may be arranged perpendicular to the base.FIG. 16A illustrates afiber optic module1600 with such an arrangement for an alternate embodiment of the invention.

Referring now toFIG. 13, a receiveroptical block402R and a transmitteroptical block402T are illustrated as an alternative to theoptical block402 or402′. Previously the fiber optic modules were described and illustrate using a singleoptical block402 or402′. However, theoptical blocks402R and402T can provide similar functionality to the singleoptical block402 or402′. The receiveroptical block402R couples to thereceiver111 while the transmitoptical block402T couples to thetransmitter110. Thereceiver111 andtransmitter110 can be press fit into theopenings513 and514 or alternatively a glue or epoxy can inserted into the tacking holes to couple them together. Each optical receiveroptical block402R and transmitoptical block402T provides alignment to an optical fiber and may include a lens. If one more receiver channels are desired, one or more receiveroptical blocks402R can be utilized. If one or more transmit channels are desired, one or more transmitoptical blocks402T can be utilized.

Whilepins113 and117 of the fiber optic modules (100,400,800,900,1000,1100, or1200) facilitate soldering to a host printed circuit board, they can also be plugged into asocket1402 on a host printedcircuit board1404 as illustrated inFIG. 14A. Alternatively, thepins113 and117 can each be replaced with one or more sockets1406R and1406T coupled to the printed circuit boards on the bottom edge or back edge. In the case of sockets1406R and1406T on the bottom edges of the printed circuit boards, the fiber optic module (100,400,800,900,1000,1100, or1200) plugs vertically or downward onsockets1408R and1408T for example of the host printedcircuit board1404′ as illustrated byFIG. 14B. In the case of a socket orsockets1416R and1416T on the back edge of the printed circuit boards, the fiber optic module (100,400,800,900,1000,1100, or1200) plugs horizontally or inward into a socket orsockets1418R and1418T of the host printedcircuit board1404″.

Referring nowFIG. 15A, an alternate embodiment of a shielded housing orcover1519 and analternate base1505. The shielded housing orcover1519 includes a centerinner septum1515 incorporated as part of the housing or cover to isolate a transmit channel from a receive channel or one channel from another channel. The centerinner septum1515 splits the fiber optic module into a left side and a right side as does the other septums described herein. The housing orcover1519 further includes aback side1521, aleft side1522, aright side1523 and clips ortabs236. A front side1524 of the housing orcover1519 is open to couple to theoptical block402 and/or a nose.

Thealternate base1505 has no septum and may include clip openings orslots238. Alternately, a base is without the clip openings orslots238 such that the clips ortabs236 of the housing or cover are bent over and around the base.

Referring now toFIG. 15B, a cross sectional view of afiber optic module1000′ utilizing the alternate embodiment of the shielded housing orcover1519 andbase1505 is illustrated. Thefiber optic module1000′ is similar tofiber optic module1000 as described with reference toFIGS. 10A–10B but for the alternate shielded housing orcover1519 and thealternate base1505.

Referring now toFIG. 15C, a cross sectional view of the alternate embodiment of the shielded housing orcover1519 is illustrated. The shielded housing orcover1519 is a monolithic or integrated shielded housing or cover incorporating theseptum1515. The shielded housing orcover1519 can be formed of a metal, a plastic or other solid material. The shielded housing orcover1519 if made of metal, can be formed by forging, stamping or machining. Lower costs methods to fabricate the shielded housing orcover1519 include injection, transfer, or blow molding the shape out of plastic. The plastic can then be plated, painted or otherwise coated with a conductive material, if conductivity is desired. Likewise a metal part can be overcoated with a non-conductive material if conductivity is not desired.

Referring now toFIG. 15D andFIG. 15E, the septum can be angled as well to accommodate parallel angled PCB boards as illustrated by theseptum1515′ of the shielded housing or cover1519′ and theseptum1515″ of the shielded housing orcover1519″.

Referring now toFIG. 15F, the septum can be formed separately from the housing or cover and coupled thereto. The shielded housing or cover1519′″ includes aseptum1515′″ which is formed separately and coupled together. Theseptum1515′″ can be coupled to the outer housing by using fusion techniques such as soldering, welding, or melting.FIG. 15F illustrates the fuse links1530 (solder, weld, etc) coupling theseptum1515′″ to the outer housing of the shielded housing or cover1519′″.

Referring now toFIG. 15G, the septum can be formed separately from the housing or cover and coupled thereto by alternate means.FIG. 15G illustrates the shielded housing orcover1519″″ including aseptum1515″″ which is formed separately and coupled together. The outer cover of the shielded housing orcover1519″″ includes agroove1532 and theseptum1515″″ includes atongue1534 to form a tongue and groove system. A glue, adhesive or epoxy1535 is applied between the tongue and groove system which may be conductive or non-conductive to couple the outer housing and theseptum1515″″ together to form the shielded housing orcover1519″″.

The fiber optic modules previously described with reference toFIGS. 8A–15G were illustrated with the optoelectronic devices (transmitter110 and receiver111) having its terminals coupled to the printed circuit boards using a straddle mount. However, one or all of the optoelectronic devices may have their terminals coupled to the printed circuit boards using a through hole mount. In a straddle mount, the optoelectronic device (i.e. thetransmitter110 or the receiver111) has its optical axis nearly in-line and parallel with a plane of the printed circuit board. In a through hole mount, the optoelectronic device (i.e. thetransmitter110 or the receiver111) has its optical axis nearly parallel with a plane of the printed circuit board.

Referring now toFIG. 16A, a rear cross-section of afiber optic module1600 is illustrated having a first optoelectronic device with its terminals coupled to a first printed circuit board in a straddle mount configuration and a second optoelectronic device with its terminals coupled to a second printed circuit board in a through hole mount configuration. Alternatively, both the first optoelectronic device the second optoelectronic device may have their terminals coupled to their respective printed circuit boards in a through hole mount configuration as illustrated by the rear cross-section offiber optic module1602 ofFIG. 16B.

Referring now toFIGS. 17A–17D, exploded perspective views of a pluggablefiber optic module1700 are illustrated. In one embodiment, the pluggablefiber optic module1700 is an MTRJ-SFP pluggable fiber optic module. As illustrated inFIG. 17A, the pluggablefiber optic module1700 may include a cover/housing1702, an interface printed circuit board (PCB)1704, asupport base1706, a transmit printed circuit board (PCB)1708, a receive printed circuit board (PCB)1710, theoptical block102, thetransmitter110, thereceiver111, analignment plate201′, anose receptacle202′, and anactuator1714.

The details of theoptical block102, thetransmitter110, thereceiver111 were previously described and will not be repeated here for reasons of brevity.

The cover/housing1702 may have one or more top, left, and right side electromagnetic interference (EMI)fingers1720T,1720L,1720R extending outward from a top surface, left surface and right surface thereof, respectively. The cover/housing1702 may further have one or more right and leftside openings1721R,1721L,1722R,1722L,1723R,1723L in the top surface, the left surface, and the right surface thereof. The cover/housing1702 may further have acontact tab1726 extending inward from the top surface.

The right and leftside openings1721R,1721L,1722R,1722L may interface to right and lefttabs1741R,1741L,1742R,1742L in thesupport base1704 to couple the cover/housing102 to a subassembly of thefiber optic module1700. The right and leftside openings1723R,1723L may interface to right and left tabs (right tab1782R only shown in the Figures with left tab1782L being a mirror image thereof) in thenose receptacle202′ to further the cover/housing102 to the subassembly of thefiber optic module1700. If the cover/housing102 is conductive, thecontact tab1726 may electrically couple to an edge of thealignment plate201′, if its conductive. Alternatively, thecontact tab1726 may extend and electrically couple to both thealignment plate201′ and thenose receptacle202′ if both are conductive.

The cover/housing1702,alignment plate201′, andnose receptacle202′ may be formed of a metal or a plastic. In the case of plastic, the plastic may be metalized to form of a metalized plastic in order to be conductive and provide static (ESD), EMI, or RF shielding through a ground connection which may be made through the one ormore fingers1720T,1720L,1720R (one ormore fingers1720L are not shown in the figures but being a mirror image of the one ormore fingers1720R). In a preferred embodiment, the cover/housing1702 is formed of stainless steel.

Theinterface PCB1704 may also be referred to as a horizontal printed circuit board. Theinterface PCB1704 may include one ormore openings1734 to slide over one ormore alignment pillars1740 in thesupport base1706. Theinterface PCB1704 may further include anedge connection1730 formed by traces on the surface of theinterface PCB1704; left and rightside solder pads1732L,1732R; and one or more integrated circuits (ICs)1736 or other electrical components. Theedge connection1730 of theinterface PCB1704 may also be referred to as an edge connector, a plug, an interface slot, or a connector tongue. The left and rightside solder pads1732L,1732R are for forming an electrical connection with the transmitPCB1708 and the receivePCB1710 by means of one or more solder joints. In the preferred embodiment, each solder joint is a ninety degree castellation solder joint. Theinterface PCB1704 may further include left andright cutouts1738L,1738R which may allow respective edges of the transmitPCB1708 and the receivePCB1710 to slide into respective left andright slots1743L,1743R in thesupport base1706. Theedge connection1730 of theinterface PCB1704, allows thefiber optic module1700 to be plugged into and out of an edge connector of a host printed circuit board. Theedge connection1730, as discussed further below, may allow for the hot pluggability of thefiber optic module1700 into a powered up host printed circuit board.

Thesupport base1706 may include the one ormore alignment pillars1740; the left andright tabs1741R,1741L,1742R,1742L (lefttab1741L is not shown in the figures but being a mirror image of theright tab1741R); the left andright slots1743L,1743R; asupport edge1744; and asupport tab1746. Theleft slot1743L is for receiving an edge of the transmitPCB1708 in the preferred embodiment. Theright slot1743R is for receiving an edge of the receivePCB1710 in the preferred embodiment. In an alternate embodiment, the receive PCB and transmit PCB can swap sides along with swapping sides of thetransmitter110 andreceiver111 and the optical components (i.e. lenses, etc.) within theoptical block102.

As previously discussed, theinterface PCB1704 may include one ormore openings1734 to slide over the one ormore alignment pillars1740 in thesupport base1706. An epoxy or glue can be deposited around thepillars1740 and on the surface of theinterface PCB1704 near theopenings1734 in order to holdinterface PCB1704 and thesupport base1706 coupled together. When theedge connection1730 of theinterface PCB1704 is plugged into and out of an edge connector of a host PCB, thepillars1740 deter movement of theinterface PCB1704 with respect to thefiber optic module1700. Thesupport edge1744 of thesupport base1706 provides support to theinterface PCB1704 nearer theedge connection1730. Thesupport tab1746 provides support to theinterface PCB1704 near an end opposite to the end having theedge connection1730.

As previously discussed, the right and lefttabs1741R,1741L,1742R,1742L in thesupport base1704 couple into the right and leftside openings1721R,1721L,1722R,1722L in the cover/housing102 to couple the cover/housing102 and thesupport base1704 together. In the preferred embodiment, the tabs are shaped as a ramp or a wedge as illustrated so that the edges of the cover/housing102 can easily slide over the tabs. However, when the tabs are engaged into the openings, it is difficult to release the cover/housing102 and disassemble it from thefiber optic module1700.

The receivePCB1710 may also be referred to as a vertical printed circuit board and is a receiver electrical subassembly. The receivePCB1710 includes one ormore solder pads1752, one or more integrated circuits (ICs)1754 or other electrical components, and one or more thruholes1756. The receivePCB1710 may also include a ground plane or a portion thereof on one side or the other to provide EMI/RF shielding. The receivePCB1710 may also acutout area1758 in the circuit board to electrically couple the one ormore solder pads1752 to the interface PCB and allow the edge of the transmit PCB to slide into a slot in thesupport base1706. The one or more thruholes1756 in the receivePCB1710 are similar to thethruholes232 in the receivePCB108 illustrated inFIG. 2 and discussed previously. The one or more thruholes1756 in the receivePCB1710 are aligned and then slid over theterminals211 of thereceiver111. Theterminals211 are then soldered to the receivePCB1710 to make an electrical connection thereto. The one ormore solder pads1752 may be electrically coupled to thereceiver111 and/or the one or more integrated circuits (ICs)1754 or other electrical components thereon through traces of thereceiver PCB1710. As previously discussed, the rightside solder pads1732R of theinterface PCB1704 form an electrical connection with thesolder pads1752 of the receivePCB1710 by means of one or more solder joints. In the preferred embodiment, each solder joint is a ninety degree castellation solder joint.

The transmitPCB1708 may also be referred to as a vertical printed circuit board and is a transmitter electrical subassembly. The transmitPCB1708 includes one ormore solder pads1762, one or more integrated circuits (ICs)1764 or other electrical components, and one or more thruholes1766. The transmitPCB1708 may also include a ground plane or a portion thereof on one side or the other to provide EMI/RF shielding. The transmitPCB1708 may also acutout area1768 in the circuit board to electrically couple the one ormore solder pads1762 to the interface PCB and allow the edge of the transmit PCB to slide into a slot in thesupport base1706. The one or more thruholes1766 in the transmitPCB1708 are similar to thethruholes233 in the transmitPCB106 illustrated inFIG. 2 and discussed previously. The one or more thruholes1766 in the transmitPCB1708 are aligned and then slid over theterminals210 of thetransmitter110. Theterminals210 are then soldered to the transmitPCB1708 to make an electrical connection thereto. The one ormore solder pads1762 may be electrically coupled to thetransmitter110 and/or the one or more integrated circuits (ICs)1764 or other electrical components thereon through traces of the transmitPCB1708. As previously discussed, the leftside solder pads1732L of theinterface PCB1704 form an electrical connection with thesolder pads1762 of the transmitPCB1708 by means of one or more solder joints. In the preferred embodiment, each solder joint is a ninety degree castellation solder joint.

With thetransmitter110 coupled to the transmitPCB1708 and thereceiver111 coupled to the receivePCB1710, thetransmitter110 can be inserted into theopening213 of theoptical block102 and thereceiver111 can be inserted into theopening214 of theoptical block102. As discussed previously, thetransmitter110 and thereceiver111 can be aligned and coupled to theoptical block102 within theopenings213 and214, respectively.

Thealignment plate201′ may also be referred to as an EMI block and functions somewhat similar to thealignment plate201.Alignment plate201′ may have some similar features and may have some different features as thealignment plate201 in order to accommodate the same or different fiber optic plugs and fiber optic cables. Thealignment plate201′ has the optical block alignment holes216 and anoptical opening217′ to allow light to pass through similar to thealignment plate201. Thealignment plate201′ may or may not have the fiber optic connector alignment pins218 depending upon the type of fiber optic plug is being used. The optical block holes216 couple to optical block alignment pins in theoptical block102, not illustrated inFIG. 2. The fiber optic connector alignment pins218 are for aligning optical fibers that couple to thefiber optic module100. Thealignment plate201′ may further haveopenings1770 to align with pins in thenose receptacle202′ in order to couple to thenose receptacle202′. Thealignment plate201′ may be formed of plastic, metal or a metalized plastic. If formed of metal or metalized plastic, thealignment plate201′ may be electrically grounded through the cover/housing1702 or otherwise to reduce EMI or RF interference.

For coupling to a fiber optic connector, thefiber optic module1700 has thenose receptacle202′. Thenose receptacle202′ may include the plug opening222′ and the latch opening223 to couple to a fiber optic connector or plug of an optical fiber. The optical fiber may be one or more optical fibers to provide unidirectional, bidirectional, or multidirectional communication. Thelatch opening223 can receive a latch of the optical fiber connector and hold the fiber optic connector of the optical fiber coupled thereto. The optical fiber plug opening222′ receives an optical fiber plug and aligns the optical fibers with theoptical opening217 of thealignment plate201′. Thenose receptacle202′ may be formed of plastic, metal or metalized plastic. If formed of metal or metalized plastic, thenose receptacle202′ may be electrically grounded through the cover/housing1702 or otherwise to further reduce EMI or RF interference.

Thenose receptacle202′ may further include the right and left tabs (right tab1782R only shown in the Figures with left tab1782L being a mirror image thereof) to interface with the right and leftside openings1723R,1723L of the cover/housing102. Thenose receptacle202′ may further include right and left slots (right slot1783R only shown in the Figures with left slot1783L being a mirror image thereof) to allow a portion of thesupport base1706 including the right andleft side tabs1742R,1742L to slide therein. In this manner, the right andleft side tabs1742R,1742L may be supported in place by thenose receptacle202′ when the cover/housing1702 is engaged therewith.

As illustrated inFIG. 17A, thenose receptacle202′ may further include anopening1784 having a pair of tangs orridges1786 on opposite side thereof to slideably interface with theactuator1714. In a preferred embodiment, theactuator1714 is an SFP actuator. Thenose receptacle202′ may further include a center region in theopening1784 over which a portion of theactuator1714 may slide.

Theactuator1714 includes one or more ramps or wedges (a pair of which are illustrated)1792, slot orgrooves1794 on each side having an opening at one end and a closure at an opposite end. The slots orgrooves1794 in theactuator1714 slideably engage the ridges ortangs1786 in thenose receptacle202′.

As illustrated inFIG. 17B, thenose receptacle202′ may further include a pair ofpins1780 and asupport slot1781 for engaging with thealignment plate201′. The pair ofpins1780 can slide into theopenings1770 in thealignment plate201′. Thesupport slot1781 may be unshaped to accept and hold thealignment plate201′ in place with thenose receptacle202′.

As illustrated inFIGS. 17C and 17D, thenose receptacle202′ may further include a hook orboss1785 and thecenter region1787. The hook orboss1785 interfaces to a latch of a cage or host receptacle as described further below. A portion of theactuator1714 may slide over thecenter region1787 in theopening1784.

Theactuator1714 includes the one or more ramps or wedges (a pair of which are illustrated)1792 for releasing the hook orboss1785 from a latch and freeing the fiber optic module from1700 a cage or host receptacle. Thecenter region1787 can provide slideable support to theactuator1714 to allow it to push out on the latch while the ridges ortangs1786 can provide slideable guidance in movement thereof.

Thenose receptacle202′ may further include a nose grip at its sides. In one embodiment, the nose grip includes vertical ribs located at the sides near theopening222′. The nose grip can serve to provide additional gripable surface area during the withdrawal process of thefiber optic module1700. The one or more vertical ribs deters slippage during handling. The nose grip may be an integrated part of thenose receptacle202′ and can be formed of similar materials.

Additionally, thefiber optic module1700 may optionally include an internal shield, such as the optionalinternal shield109 illustrated inFIGS. 1–2 and previously described above, located between the receivePCB1710 and the transmitPCB1708 and theinterface PCB1704. The internal shield may be coupled to a ground trace or ground plane of one of the receivePCB1710, the transmitPCB1708 and theinterface PCB1704 or alternatively, it may be coupled to the cover/housing1702. In any case, the optional internal shield needs to formed so as to not short to any integrated circuit, other electrical component, wire or trace of the printed circuit boards.

Additionally, thefiber optic module1700 may optionally include pull-action delatching, push button release, pull-lever release, or other delatching or release mechanisms as described in application Ser. No. 09/896,695, titled “METHOD AND APPARATUS FOR PUSH BUTTON RELEASE FIBER OPTIC MODULES”, filed Jun. 28, 2001; application Ser. No. 09/939,403, titled “DE-LATCHING MECHANISMS FOR FIBER OPTIC MODULES”, filed Aug. 23, 2001; application Ser. No. 09/939,413, titled “PULL-ACTION DE-LATCHING MECHANISMS FOR FIBER OPTIC MODULES”, filed Aug. 23, 2001; and application Ser. No. 10/056,394, titled “METHOD AND APPARATUS FOR PULL-LEVER RELEASE FOR FIBER OPTIC MODULES”, filed Jan. 24, 2002, all of which are incorporated herein by reference and are to be assigned to E2O Communications, Inc.

Referring now toFIGS. 18A–18D, perspective views of a partially assembled pluggablefiber optic module1700 are illustrated with the cover/housing1702 being disassembled therefrom. Thetransmitter110 andreceiver111 are coupled into respective openings in theoptical block102. Thepins211 of thereceiver111 are coupled to the receivePCB1710. Thepins210 of the transmitter are coupled to the transmitPCB1708. Thecutout1758 of the receivePCB1710 and thecutout1738R of the interface PCB allow therespective solder pads1752 andsolder pads1732R align up together. Thesolder pads1752 of the receivePCB1710 are electrically coupled to the rightside solder pads1732R of theinterface PCB1704 by means of one ormore solder joints1802R. Thecutout1768 of the transmitPCB1708 and thecutout1738L of the interface PCB allow therespective solder pads1762 andsolder pads1732L align up together. Thesolder pads1762 of the transmitPCB1708 are electrically coupled to the leftside solder pads1732L of theinterface PCB1704 by means of one or more solder joints1802L (The one or more solder joints1802L are not shown in the figures but are a mirror image of the one ormore solder joints1802R). In the preferred embodiment, the one or more solder joints are ninety degree castellation solder joints. This subassembly is then assembled to thesupport base1706.

Theopenings1734 of theinterface PCB1704 are slid over thepillars1740 of thesupport base1706. The respective edges of the transmitPCB1708 and the receivePCB1710 slide into theslot1743L and theslot1743R. Theinterface PCB1704 rests for is support on thesupport edge1744 and thesupport tab1746. A wax, epoxy, or glue may be dripped onto thepillars1740 to couple thesupport base1706 and theinterface PCB1704 together with the rest of the subassembly.

Thealignment plate201′ is coupled to theoptical block102. The alignment holes216 of thealignment plate201′ are slid over the alignment pins316 in theoptical block102. In an alternate embodiment, thealignment plate201′ may first couple to thenose receptacle202′ before coupling to theoptical block102.

Theactuator1714 is coupled to thenose receptacle202′. The slots orgrooves1794 in theactuator1714 are mated with the ridges ortangs1786 of thenose receptacle202′. Theactuator1714 may slide back and forth in theopening1784 in thenose receptacle202′.

Thenose receptacle202′ is coupled to thealignment plate201′ and thesupport base1706. Theopenings1770 in thealignment plate201′ are slid over thepins1780 of thenose receptacle202′. The extended portion of thesupport base1706 including the right andleft side tabs1742R,1742L, slides into respective right and left slots (right slot1783R only shown in the Figures with left slot1783L being a mirror image thereof) of thenose receptacle202′.

The cover/housing1702 is coupled to thenose receptacle202′ and thesupport base1706. The sides of the cover/housing1702 are slid over the sides of the subassembly so that theopenings1721R,1722R,1723R,1712L,1722L, and1723L may align with therespective tabs1741R,1742R,1782R,1741L,1742L, and1782L of thesupport base1706 and thenose receptacle202′. The edge of the sides of the cover/housing1702 slide over thetabs1741R,1742R,1782R,1741L,1742L, and1782L. Thetabs1741R,1742R,1782R,1741L,1742L, and1782L engage therespective openings1721R,1722R,1723R,1712L,1722L, and1723L in the cover/housing1702. In one embodiment, the tabs snap in place into the openings of the cover/housing. In this manner, the sides of cover/housing1702 couple to the sides of thesupport base1706 and thenose receptacle202′. Thecontact tab1726 of the cover/housing1702 may contact a surface of thealignment plate201′ or a surface of both thealignment plate201′ andnose receptacle202′. The completed assembly of thefiber optic module1700 with the cover/housing1702 coupled in place is illustrated inFIG. 20 andFIGS. 21A–21D.

Referring now toFIGS. 19A–19E, views of an exemplary cage assembly ormodule receptacle1900 for fiber optic modules is illustrated. That is a fiber optic module, such asfiber optic module1700, is inserted into the cage assembly ormodule receptacle1900. InFIG. 19B, thelatch1902 is illustrated in a bottom view of themodule receptacle1900. Thelatch1902 includes acatch1905 that mates with the hook orboss1785 of thefiber optic module1700. As illustrated in the cross sectional view ofFIG. 19C and the exploded cross-sectional view ofFIG. 19D, thelatch1902 is flexed downward in order to release the fiber optic module. The one ormore ramps1792 of theactuator1714 of thefiber optic module1700 flexes thelatch1902 downward when the fiber optic module is pushed in or a force is exerted on a delatching or other release mechanism operating in conjunction with the actuator. The one ormore ramps1792 of theactuator1714 meets alip1908 of thelatch1902 which is bent on an angle and then flexes thelatch1902 outward so that thecatch1905 is released from the hook orboss1785. The cage assembly ormodule receptacle1900 may include one ormore pins1910 to mechanically and/or electrically couple to a host printedcircuit board1912. Thepins1910 may couple to a ground trace or a ground plane so that static charges, EMI, and RF interference may be dissipated through to ground or a negative power supply.

Referring now toFIG. 20, a side view of an embodiment of afiber optic module1700 to couple to ahost system2000 is illustrated. Thehost system2000 may include the host printedcircuit board1912, anexemplary host connector2002 coupled to the host printedcircuit board1912, and the exemplary cage assembly ormodule receptacle1900 coupled to the host printedcircuit board1912. Thehost system2000 may be networking equipment, computer equipment, or other equipment desiring data communication using an optical fiber.

The cage assembly ormodule receptacle1900 may extend through anopening2004 in a plate orbezel2006 of thehost system2000 as illustrated inFIG. 20, remain flush with the plate orbezel2006, or be recessed from the plate orbezel2006. The plate orbezel2006 may be formed of metal or plastic. If formed of plastic, the plastic may be metalized to make the plate orbezel2006 conductive. The cage assembly ormodule receptacle1900 may include external grounding fingers to couple to a surface of the plate orbezel2006 or within theopening2004 of the plate orbezel2006 so as to ground thereto. Alternatively, the cage assembly ormodule receptacle1900 may be insulated from the plate orbezel2006 so as to electrically isolate each from the other.

Theexemplary host connector2002 is for coupling to an edge connection of a printed circuit board, such as theedge connection1730 of theinterface PCB1704 in the pluggablefiber optic module1700. Thehost connector2002 may also be referred to as an edge connector. Theedge connector2002 is located inside the perimeter of the cage assembly ormodule receptacle1900 nearer its back end.

Theedge connector2002 may include one ormore alignment posts2014 to interface with one or more openings in the host printedcircuit board1912. Theedge connector2002 further includes one or moreexternal pins2016 on either or both sides to couple to electrical traces of the host printedcircuit board1912. As will be discussed further below, theedge connector2002 further includes one or more internal pins to couple to theedge connection1730 of theinterface PCB1704 of the pluggablefiber optic module1700. The one or moreexternal pins2016 are electrically coupled to one or more internal pins of theedge connector2002 in order to electrically couple thefiber optic module1700 to the host printedcircuit board1912.

To couple, insert, or plug thefiber optic module1700 into thehost system2000, theedge connection1730 of thefiber optic module1700 is first inserted into an open end of the cage assembly ormodule receptacle1900. Thefiber optic module1700 is further inserted into the cage assembly ormodule receptacle1900 so that the one or more top, left, and right side electromagnetic interference (EMI)fingers1720T,1720L,1720R extending outward from the top surface, left surface and right surface are inserted into the open end of the cage assembly ormodule receptacle1900. The one or more top, left, and right side electromagnetic interference (EMI)fingers1720T,1720L,1720R of thefiber optic module1700 slidingly couple to the top, left, or right side inner surfaces of the cage assembly ormodule receptacle1900. In this manner, static charges may be grounded out to the cage assembly ormodule receptacle1900 before thefiber optic module1700 couples to theedge connector2002. Thefiber optic module1700 is further inserted into the cage assembly ormodule receptacle1900 so that theedge connection1730 finally couples to theedge connector2002 of thehost system2000 and theopening1905 in thelatch1902 engages with theboss1785. To decouple, remove or unplug thefiber optic module1700 from thehost system2000, the fiber optic module may be pushed further inward to cause theramps1792 of theactuator1714 to push out on thelatch1902, disengaging theopening1905 from theboss1785 and pulling out on thefiber optic module1700. Alternatively, the methods and apparatus described in application Ser. Nos. 09/896,695; 09/939,403; 09/939,413; and 10/056,394 referred to above may be used to decouple, remove or unplug thefiber optic module1700 from thehost system2000.

Referring now toFIGS. 21A–21D, perspective views of thefiber optic module1700 and theexemplary edge connector2002 are illustrated.FIGS. 21A–21D better illustrate some aspects of theedge connector2002. Theedge connection1730 of theinterface PCB1704 is inserted into theopening2018 of theedge connector2002 to couple thereto. As discussed previously, thepins2016 of theedge connector2002 are for coupling to conductive traces on a host printed circuit board. The alignment pins2014 of theedge connector2002 assure that thepins2016 properly line up to couple to the traces of the host printed circuit board. Thepins2016 may be soldered to the host printed circuit board. Theedge connection1730 includes one ormore pads2100A on one side and one ormore pads2100B on an opposite side of theinterface PCB1704. The one ormore pads2100A and2100B on theinterface PCB1704 are to couple to internal pins of theedge connector2002 when inserted into theopening2018. The size of theedge connector2002 is such that the sides of cover/housing1702 of thefiber optic module1700 may fit over and partially cover theedge connector2002. That is, the cover/housing1702 of thefiber optic module1700 may receive theedge connector2002 so that theedge connection1730 may couple thereto.

With thetabs1741R,1742R,1782R,1741L,1742L, and1782L engaged with therespective openings1721R,1722R,1723R,1712L,1722L, and1723L in the cover/housing1702, the cover/housing1702 is deterred from being decoupled from thefiber optic module1200 during the sliding engagement between the one or more top, left, and right side electromagnetic interference (EMI)fingers1720T,1720L,1720R of thefiber optic module1700 and the top, left, or right side inner surfaces of the cage assembly ormodule receptacle1900.

Referring now toFIG. 22A, a cross sectional view of thefiber optic module1700 coupled to theedge connector2002 is illustrated. The cross section view of thefiber optic module1700 illustrates more clearly how thesupport tab1746 and thesupport edge1744 of thesupport base1744 supports theinterface PCB1704. It also further illustrates how the one ormore openings1734 slide over the one ormore pillars1740 and keep theinterface PCB1704 from moving when plugged into and pulled out from theedge connector2002. A portion of the sides of the cover/housing1702 of thefiber optic module1700 fit over and partially cover theedge connector2002. Theedge connection1730 of theinterface PCB1704 is coupled into theedge connector2002 through theopening2018.

Referring now toFIG. 22B, a cross sectional view of thefiber optic module1700 coupled to thehost system2000 is illustrated. Thehost system2000 includes theedge connector2002 and thecage assembly1900 coupled to the host printedcircuit board1912. Thefiber optic module1700 is illustrated as being fully inserted into thecage assembly1900 so that itsedge connection1730 is coupled into theedge connector2002 through theopening2018. Thepins2016 of theedge connector2002 are coupled totraces2202 on the host printedcircuit board1912. The alignment pins2104 are coupled into openings or holes in the host printedcircuit board1912. The one or more top side electromagnetic interference (EMI)fingers1720T of thefiber optic module1700 is coupled to the top inner surface of the cage assembly ormodule receptacle1900.

Referring now toFIGS. 23A–23C, an example of forming the electrical connection between interface PCB of thefiber optic module1700 and the edge connector of the host system is illustrated. As illustrated inFIGS. 23A–23C, theedge connection1730 includes the one ormore pads2100A on oneside1704A and the one ormore pads2100B on anopposite side1704B of theinterface PCB1704. Theedge connector2002 includes one or moreinternal pins2302A on one side and one or moreinternal pins2302B on an opposite side of theopening2018. The one ormore pads2100A of theedge connection1730 slidingly couple to respective ones of the one or moreinternal pins2302A of theedge connector2002. Contact is made between thepads2100A and thepins2302A such that an electrical connection is formed. The one ormore pads2100B of theedge connection1730 slidingly couple to respective ones of the one or moreinternal pins2302B of theedge connector2002. Contact is made between thepads2100B and thepins2302B such that an electrical connection is formed.

Referring now toFIG. 23C, a side view of theedge connection1730 is illustrated. InFIG. 23C, a side view of one of the one or more pads2300A and one of the one or more pads2300B on opposite sides of theinterface PCB1704 are more clearly illustrated. A side view of one of the one or moreinternal pins2302A and one of the one or moreinternal pins2302B of theedge connector2002 is also illustrated inFIG. 23C. The one or moreinternal pins2302A and2302B are coupled to theexternal pins2016 of theedge connector2002. With theexternal pins2016 coupled to the host printedcircuit board1912, theinternal pins2302A and2302B are coupled to the host printedcircuit board1912 as well. A number of the one ormore pads2100A and/or2100B can be staggered from the edge of theedge connection1730 as illustrated inFIGS. 23A–23C in order that ground may be provided first and power may be provided secondly, prior to making connections for signal or data lines. In this case, theinterface PCB1704 and thefiber optic module1700 may be hot-pluggable into theedge connector2002 and thehost system2000. That is, power can be maintained to the host printedcircuit board1912 while thefiber optic module1700 is plugged into or out of thecage assembly1900 and theedge connector2002.

The previous detailed description describes fiber optic modules as including a receiver and transmitter. However, one of ordinary skill can see that a fiber optic module may be a receiver only or a transmitter only such that only one board type is used. Additionally, the previous detailed description described one receive channel and one transmit channel. However, the invention may be extended to a plurality of channels in parallel which can be all transmit channels, all receive channels or both receive and transmit channels into multiple fiber optic cables.

The preferred embodiments of the invention are thus described. While the invention has been described in particular embodiments, the invention should not be construed as limited by such embodiments, but rather construed according to the claims that follow below.

Claims (41)

What is claimed is:

1. A fiber optic module for coupling photons between optoelectronic devices and optical fibers, the fiber optic module comprising:

a horizontal printed circuit board (PCB) arranged horizontally, the horizontal printed circuit board having an edge connection to plug into and out of an edge connector of a host system;

a first vertical printed circuit board (PCB) arranged at a perpendicular angle with the horizontal printed circuit board, the first optoelectronic device having terminals coupled to the first vertical printed circuit board, the first vertical printed circuit board electrically coupled to the horizontal printed circuit board along a right side thereof;

a second vertical printed circuit board (PCB) arranged at a perpendicular angle with the horizontal printed circuit board, the second optoelectronic device having terminals coupled to the second vertical printed circuit board, the second vertical printed circuit board electrically coupled to the horizontal printed circuit board along a left side thereof parallel to the first vertical printed circuit board; and

a support base to support the horizontal printed circuit board, the first vertical printed circuit board, and the second vertical printed circuit board;

wherein the support base includes right and left slots to support the sides of the first and second vertical printed circuit boards, respectively; and

wherein the horizontal printed circuit board includes first and second cutouts enabling edges of the first and second vertical printed circuit boards to be received in the right and left slots, respectively.

2. The fiber optic module ofclaim 1 further comprising: a housing coupled around the horizontal printed circuit board, the first vertical printed circuit board, and the second vertical printed circuit board.

3. The fiber optic module ofclaim 2 wherein, the housing is a shielded housing to shield the horizontal printed circuit board, the first vertical printed circuit board, and the second vertical printed circuit board to reduce electromagnetic interference (EMI).

4. The fiber optic module ofclaim 1 wherein the edge connection of the horizontal printed circuit board has a plurality of pads to couple to the edge connector of the host system; and

wherein the first vertical printed circuit board has one or more solder pads to couple to one or more first solder pads of the horizontal printed circuit board, and the second vertical printed circuit board has one or more solder pads to couple to one or more second solder pads of the horizontal printed circuit board.

5. The fiber optic module ofclaim 1, wherein the first vertical printed circuit board further includes one or more first electrical components coupled to the first optoelectronic device to control the first optoelectronic device, and

wherein the second vertical printed circuit board further includes one or more second electrical components coupled to the second optoelectronic device to control the second optoelectronic device, and a backside ground plane between the first and second electrical components to minimize crosstalk therebetween.

6. The fiber optic module ofclaim 1 wherein, the horizontal printed circuit board further includes a ground plane to reduce electromagnetic fields generated by electrical components.

7. The fiber optic module ofclaim 1, wherein the first and second vertical printed circuit boards each further include a ground plane facing each other to reduce electromagnetic fields generated by electrical components.

8. The fiber optic module ofclaim 1, further comprising:

a first optical block coupled to the first optoelectronic device, the first optical block having a first opening to receive the first optoelectronic device, and a first lens to couple photons between the first optoelectronic device and an optical fiber; and

a second optical block coupled to the second optoelectronic device, the second optical block having a second opening to receive the second optoelectronic device, and a second lens to couple photons between the second optoelectronic device and an optical fiber.

9. The fiber optic module ofclaim 8 further comprising: a nose receptacle to receive an optical fiber connector and to hold an optical fiber substantially fixed and aligned with an optical opening of the optical block.

10. The fiber optic module ofclaim 9 wherein, the nose receptacle is formed of metal or metalized plastic to reduce electromagnetic interference.

11. The fiber optic module ofclaim 1 further comprising: an optical block coupled to the first and second optoelectronic devices, the optical block having first and second openings to receive the first and second optoelectronic devices perpendicular to the first and second printed circuit boards, respectively, a first lens and a first reflector to couple photons between the first optoelectronic device and a first optical fiber, and a second lens and a second reflector to couple photons between the second optoelectronic device and a second optical fiber.

12. The fiber optic module ofclaim 11, wherein the first lens of the optical block to launch photons from the first optoelectronic device along a first optical axis;

wherein the second lens of the optical block is a focusing lens to couple photons to the second optoelectronic device along a second optical axis;

wherein the first and second optical axes are offset from each other to minimize optical crosstalk therebetween.

13. The fiber optic module ofclaim 11 further comprising: a nose receptacle to receive an optical fiber connector and to hold an optical fiber substantially fixed and aligned with an optical opening of the optical block.

14. The fiber optic module ofclaim 13 wherein, the nose receptacle is formed of metal or metalized plastic to reduce electromagnetic interference.

15. The fiber optic module ofclaim 13 further comprising: an alignment plate coupled between the optical block and the nose receptacle, the alignment plate to align one or more optical fibers with the optical opening of the optical block.

16. The fiber optic module ofclaim 1, wherein the support base includes one or more pillars to engage one or more respective openings in the horizontal printed circuit board to deter movement thereof when the fiber optic module is plugged into or unplugged from the edge connector of the host system.

17. The fiber optic module ofclaim 1, further comprising: a cover/housing coupled to the support base and the nose receptacle around the horizontal printed circuit board, the first vertical printed circuit board, and the second vertical printed circuit board.

18. The fiber optic module ofclaim 17 wherein, the cover/housing is a shielded cover/housing to shield the horizontal printed circuit board, the first vertical printed circuit board, and the second vertical printed circuit board to reduce electromagnetic interference (EMI).

19. The fiber optic module ofclaim 17 further comprising: an internal shield located under the cover/housing, over the horizontal printed circuit board, and between the first vertical printed circuit board and the second vertical printed circuit board, the internal shield to shield and reduce electromagnetic interference (EMI).

20. The fiber optic module ofclaim 1, wherein, the first optoelectronic device is a photodetector.

21. The fiber optic module ofclaim 1, wherein, the second optoelectronic device is an emitter.

22. The fiber optic module ofclaim 1, wherein the horizontal printed circuit board has a plurality of pins to couple to a host system; and wherein the first and second vertical printed circuit boards have solder pads to couple to the horizontal printed circuit board.

23. A fiber optic transceiver comprising:

an interface printed circuit board (PCB) having an edge connection to couple to and to decouple from an edge connector of a host system;

a receive printed circuit board (PCB) perpendicularly coupled to the interface printed circuit board along a right side thereof, the receive printed circuit board having a receiving optoelectronic device coupled perpendicularly thereto;

a transmit printed circuit board (PCB) perpendicularly coupled to the interface printed circuit board along a left side thereof parallel to the receive printed circuit board, the transmit printed circuit board having a transmitting optoelectronic device coupled perpendicularly thereto; and

a support base to support the interface printed circuit board, the receive printed circuit board, and the transmit printed circuit board;

wherein the support base includes right and left slots to support the sides of the transmit and receive printed circuit boards, respectively; and

wherein the interface printed circuit board includes first and second cutouts enabling edges of the transmit and receive printed circuit boards to be received in the right and left slots, respectively.

24. The fiber optic transceiver ofclaim 23 further comprising:

an optical block coupled to the transmitting optoelectronic device and the receiving optoelectronic device, the optical block having

a first opening to receive the transmitting optoelectronic device perpendicular to the transmit printed circuit board,

a first lens to couple photons from the transmitting optoelectronic device into a first optical fiber,

a first reflector for reflecting photons at substantially a 90° angle into the first optical fiber;

a second opening to receive the receiving optoelectronic device perpendicular to the receive printed circuit board,

a second lens to couple photons from a second optical fiber into the receiving optoelectronic device, and

a second reflector for reflecting photons at substantially a 90° angle into the second optical fiber.

25. The fiber optic transceiver ofclaim 24 further comprising: a nose receptacle to receive an optical fiber connector and to hold an optical fiber substantially fixed and aligned with an optical opening of the optical block.

26. The fiber optic transceiver ofclaim 25 further comprising: an alignment plate coupled between the optical block and the nose receptacle, the alignment plate to align first and second optical fibers with the optical opening of the optical block.

27. The fiber optic transceiver ofclaim 26 further comprising: a cover/housing coupled to the support base and the nose receptacle around the interface printed circuit board, the receive printed circuit board, and the transmit printed circuit board.

28. The fiber optic transceiver ofclaim 27 wherein, the cover/housing is a shielded cover/housing to shield the interface printed circuit board, the receive printed circuit board, and the transmit printed circuit board to reduce electromagnetic interference (EMI).

29. The fiber optic transceiver ofclaim 28 wherein, the alignment plate is formed of metal or metalized plastic to reduce electromagnetic interference and the cover/housing has a tab to electrically couple to the alignment plate.

30. The fiber optic transceiver ofclaim 29 wherein the support base includes one or more pillars to engage one or more respective openings in the interface printed circuit board to deter movement thereof when the fiber optic transceiver is plugged into or unplugged from the edge connector of the host system.

31. The fiber optic transceiver ofclaim 23, wherein the transmit printed circuit board further includes one or more first electrical components coupled to the transmitting optoelectronic device to control the transmitting optoelectronic device,

wherein the receive vertical printed circuit board further includes one or more second electrical components coupled to the receiving optoelectronic device to control the receiving optoelectronic device, and

wherein at least one of the receive and transmit printed circuit boards further includes a backside ground plane between the first and second electrical components to minimize crosstalk therebetween.

32. A fiber optic module comprising:

a base having one or more pillars;

a first printed circuit board (PCB) having an edge connection, at least one left solder pad, at least one right solder pad, and one or more openings, the one or more openings to slide over the one or more pillars and align the first printed circuit board to the base;

a second printed circuit board (PCB) having at least one solder pad to couple perpendicularly to the at least one left solder pad along a left side of the first printed circuit board, the second printed circuit board having a first optoelectronic device coupled thereto;

a third printed circuit board (PCB) having at least one solder pad to couple perpendicularly to the at least one right solder pad along a right side of the first printed circuit board parallel to the second printed circuit board, the third printed circuit board having a second optoelectronic device coupled thereto;

an optical block having openings to receive the first optoelectronic device and the second optoelectronic device;

a nose receptacle having a plug opening to receive an optical fiber plug; and

a cover coupled to the base and the nose receptacle to cover and protect the optical block and the first, second, and third printed circuit boards;

wherein the base includes right and left slots to support the sides of the second and third printed circuit boards, respectively; and

wherein the first printed circuit board includes first and second cutouts enabling edges of the second and third printed circuit boards to be received in the right and left slots, respectively.

33. The fiber optic module ofclaim 32 wherein the base couples to the nose receptacle and includes a support tab to support an end of the first printed circuit board and a support edge to support an opposite end of the first printed circuit board.

34. The fiber optic module ofclaim 32 further comprising: an alignment plate coupled between the optical block and the nose receptacle, the alignment plate to align first and second optical fibers with an optical opening of the optical block.

35. The fiber optic module ofclaim 34 wherein, the cover to shield the first, second, and third printed circuit boards to reduce electromagnetic interference (EMI).

36. The fiber optic module ofclaim 35 wherein, the cover is formed of metalized plastic.

37. The fiber optic module ofclaim 35 wherein, the cover further includes one or more fingers to couple to a cage of the host system.

38. The fiber optic module ofclaim 35 wherein, the alignment plate to shield and reduce electromagnetic interference (EMI), and the cover has a tab to couple to the alignment plate.

39. The fiber optic module ofclaim 38 wherein, the alignment plate is formed of metalized plastic.

40. The fiber optic module ofclaim 32, wherein the second printed circuit board further includes one or more first electrical components coupled to the first optoelectronic device to control the first optoelectronic device,

wherein the third vertical printed circuit board further includes one or more second electrical components coupled to the second optoelectronic device to control the second optoelectronic device, and

wherein at least one of the second and third printed circuit boards further includes a backside ground plane between the first and second electrical components to minimize crosstalk therebetween.

41. The fiber optic module ofclaim 32, wherein the block includes:

a first opening to receive the first optoelectronic device perpendicular to the second printed circuit board,

a first lens to couple photons from the first optoelectronic device into a first optical fiber,

a first reflector for reflecting photons at substantially a 90° angle into the first optical fiber;

a second opening to receive the second optoelectronic device perpendicular to the third printed circuit board,

a second lens to couple photons from a second optical fiber into the second optoelectronic device, and

a second reflector for reflecting photons at substantially a 90° angle into the second optical fiber.

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