CROSS REFERENCE TO RELATED APPLICATIONSThis application claims the benefit of U.S. Provisional Patent Application No. 60/247,281, filed Nov. 9, 2000.
FIELD OF THE INVENTIONThe present invention relates to an air handling system. More particularly, it relates to an air conditioning/heating system for use in computer rooms and data centers to provide climate control for electronic equipment such as computers, servers, routers, switches and other networking equipment.
BACKGROUND OF THE INVENTIONOperators, managers, designers, and developers of large data centers and computer rooms are constantly striving to put as much computer hardware into their available space as they can. This has led to tall, compact, double-sided rack systems set atop raised computer room floors. At the same time, computing speed is increasing per Moore's law due to the demand for and development of more complex software and interfaces. This also leads to more heat generation. These two factors combined have greatly reduced the effectiveness of traditional cooling systems, such as Computer Room Air Conditioners (CRACs), Computer Room Air Handlers (CRAHs), In Space Units (ISUs), etc.
In the past, most large data centers and computer rooms have utilized many small packaged CRACs or CRAHs located atop the raised floor amongst the computer and server equipment. Both of these systems pull warm air in at the top (˜5-6′ above the raised floor), condition the air (per temperature and humidity setpoints), and provide cool air to an underfloor plenum (under the raised floor). Air is then passively allowed out of the underfloor plenum through the use of perforated floor tiles.
The heat that is pulled out of the air is then transferred out of each of the CRACs or CRAHs via underfloor condenser or chilled water piping systems to cooling towers and/or chillers located outside of the data center. Each CRAC or CRAH is also served by condensate and makeup water piping for humidity control. All of this piping interferes with the cool air that is being distributed under the floor and decreases the air supply or static pressure. Also, if the condenser water piping is not insulated, the heat in the condenser water can be transferred to the air under the floor before it has a chance to cool the servers and computers, thus providing warm air supply to the servers and computers.
Since the cool air is passively allowed out of the underfloor plenum, the distance that the air moves out of the perforated tiles relies on the pressure from the CRACs or CRAHs, the number of perforated tiles, the size/quantity of perforations, and the amount of space served by the CRACs and CRAHs. However, even if high pressure blowers were utilized in the CRACs, there can still be areas where there is not enough cool air coming out of the floorspace.
Also, since warm air rises and cool air drops, natural convection typically overpowers the trickle of cool air from the floor tiles. Without active circulation in place (natural or otherwise), the air stratifies into different temperature layers. This results in higher supply and operating temperatures on servers at the tops of the racks. With a traditional data center cooling system, temperatures of 80 to 90° F. (or more) have been seen at the intake of servers from the middle to the tops of the racks versus the 60 to 70° F. available under the raised floor.
At elevated temperatures, electronic components can fail catastrophically or the electrical characteristics of the chips can undergo intermittent or permanent changes. Manufacturers of processors and other computer components specify a maximum operating temperature for their products. Most devices are not certified to function properly beyond 50° C.-80° C. (122° F.-176° F. However, a loaded server/computer with standard cooling can easily experience operating temperatures that exceed the limits. The result can be memory errors, hard disk read-write errors, faulty video, and other problems not commonly recognized as heat related.
There have been many studies by public and private agencies over the years that have found that the life of an electronic device is directly related to its operating temperature. These studies, based on empirical data, were used to create models/standards for determining electronic equipment reliability. (MIL-HDBK-217, Bellcore TR-332, and the Arrhenius equation are examples.) Based on the Arrhenius equation, it can be seen that each 10° C. (18° F.) temperature rise reduces component life by 50%. Conversely, each 10° C. (18° F.) temperature reduction increases component life by 100%. Therefore, it is recommended that computer components be kept as cool as possible for maximum reliability, longevity, and return on investment.
It is the objective of this invention to provide cool air evenly to the electronic equipment, eliminate the air stratification, extend the life and increase the reliability of electronic equipment while minimizing the impact on the floorspace, since space on a computer room or server room floor is typically a commodity.
SUMMARY OF THE INVENTIONThe present invention takes the form of raised floor air handling units. The units actively pull cool air from the underfloor plenum through a custom raised floor tile with bulkhead fittings to flexible anti-static fabric ductwork supported vertically (or other air distribution systems). This ductwork then directs the cool air equally across the face of all electronic equipment on each rack or cabinet via nozzles, reinforced linear slots, or other air distribution methods. This, coupled with a properly designed computer room cooling system, eliminates heat added to the room and the associated stratification. Therefore, with a cooler air supply to all of the servers from the raised floor air handling units, the annual cost for server replacement (not including interruption of service) could be reduced by as much as 50%. Note that additional savings can also be achieved by the elimination of problems from customer dissatisfaction associated with the equipment overheating issues, which is typically more valuable than the replacement costs. Financial losses from possible disruption in service due to overheating would also be reduced.
By implementing the raised floor air handling units, the typical computer room air conditioning units can be eliminated and centralized air handling or air conditioning systems can be installed remotely on roof or in a mechanical room to handle the climate control, move the cool air under the floor, and pull the warm air back from above the racks. In new construction, it not only eliminates the installation cost of the CRACs, CRAHs, and ISUs, but also the associated piping and wiring under the floor. This would, in turn, save on energy costs associated with the losses in the piping and electrical.
Also, since the raised floor air handling units can be installed in walkways in front of the server racks and allow a person to still use the walkway, the additional floorspace freed up by the elimination/relocation of the computer room air conditioning units can be used to generate additional revenue and/or allow the installation of more computer racks.
BRIEF DESCRIPTION OF THE DRAWINGSFIG. 1 provides an elevation to show the application of the raised floor air handling unit in a raised floor system providing air to server/computer racks or cabinets with air intakes on the exterior of the rack or cabinet.
FIG. 2 provides an elevation to show the application of the raised floor air handling unit in a raised floor system providing air to server/computer racks or cabinets with air intakes on the interior of the rack or cabinet.
FIG. 3 provides an elevation to show the application of the raised floor air handling unit in a raised floor system pulling air from server/computer racks or cabinets with exhaust air plenums on the interior of the rack or cabinet.
FIG. 4 provides an elevation to show the application of the raised floor air handling unit in a raised floor system recirculate air to and from server/computer racks or cabinets with exhaust air plenums on the interior of the rack or cabinet.
FIG. 5 is an isometric representation of the raised floor air handling unit assembly.
FIG. 6 is a partially-exploded isometric representation of the raised floor air handling unit assembly.
FIG. 7 is an elevation view of the supply end of the raised floor air handling unit without its air distribution ducting.
FIG. 8 is an elevation view of the side of the raised floor air handling unit without its air distribution ducting.
FIG. 9 is an elevation view of the “intake” end of the raised floor air handling unit without its air distribution ducting.
FIG. 10 is a cross sectional view of FIG. 9 showing the inner workings of the raised floor air handling unit.
FIG. 11 is a partial cross sectional view of the raised floor air handling unit to show an optional chilled water coil.
FIG. 12 is a plan view of the of the raised floor air handling unit from the top without the floor tile (air handling section only).
FIG. 13 is a plan view of the of the raised floor air handling unit from the bottom without the maintenance access cover (air handling section only).
FIG. 14 is a plan view of the of the raised floor air handling unit.
FIG. 15 is a partial cross sectional view of FIG. 14 showing the construction of the floor tile.
FIG. 16 is an isometric representation of the raised floor air handling unit assembly with a rectangular supply air register or exhaust air grille.
FIG. 17 is an isometric representation of the raised floor air handling unit assembly with two square supply air registers or exhaust air grilles.
FIG. 18 is an isometric representation of the raised floor air handling unit assembly with two round supply air registers or exhaust air grilles.
FIG. 19 is an isometric representation of the raised floor air handling unit assembly with a supply air manifold.
FIG. 20 is a representation of a supply air duct or manifold with nozzles for air distribution.
FIG. 21 is a representation of a supply air duct or manifold with a linear vent for air distribution.
FIG. 22 is a representation of a supply air duct or manifold with linear slots for air distribution.
DETAILED DESCRIPTION OF THE INVENTIONThe implementation of the first embodiment of the raised floorair handling unit60 is shown in the elevation provided in FIG.1. In this figure, one can see that the raised floorair handling unit60 is designed to sit in and become an integral part of an elevated floor assembly or raisedfloor tile system64 that sits above thefloor68 of a building. The space between the raisedfloor tile system64 and thebuilding floor68 is typically utilized as an underfloorcool air plenum67. Cool air can be distributed into the underfloorcool air plenum67 by a separate air conditioning system or by multiple systems. However, the raised floor air handling unit can be provided with an internalchilled water coil41 as seen in the section view provided in FIG.11. Although thechilled water coil41 is not part of the all of the embodiments, the addition of this option eliminates the need for a separate air conditioning system and theair plenum67 can be used as a return air plenum where the air is cooled inside the raised floorair handling unit60. In either case, FIG. 1 shows that air is pulled from theunderfloor air plenum67 into the raised floorair handling unit60 via a fan inside of theair handler30 and pushes up through the integral raisedfloor tile20 intoducting61 or another type of air distribution equipment, such as registers, manifold, nozzles, etc. (as seen in FIGS. 16-22) and suppliesair66 onto the face of the electronic equipment in a rack orcabinet62. This supply air could also be used for comfort cooling/heating of personnel, ventilation, makeup air, or other processes. One embodiment utilizes flexibleanti-static fabric ducting61 that is hung vertically by a vertical duct support arm/bracket14 approximately the same height H3 as the rack or cabinet62 (typically 8′); however, the ducting can be custom built to a customer specified length. The ducting is held in place horizontally by vertical duct support arm/brackets15 attached to the server/computer rack orcabinet62 or some other structural component such as a cable tray; however, alternative air distribution methods and support systems can be utilized such as spring-loaded, retractable cable reels to allow access to the electronic equipment without disconnecting the ductwork. Thesupply air66 would then be pulled in by the circulation fans internal to the electronic equipment located in the rack orcabinet62 and exhausted from the rack orcabinet62 via anexhaust air plenum63.
One option to the implementation of the raised floorair handling unit60 is shown in the elevation in FIG.2. It is a similar configuration to the implementation shown in FIG. 1; however, theair handler section30 pushes air horizontally into ducting61 below the raisedfloor64 into an underfloor airsupply plenum box69 that then directs thecool air66 up through the raisedfloor tile64 into thesupply air plenum65 of a server/computer rack orcabinet62. However, note that the ducting could route the air directly to thesupply air plenum65 of a server/computer rack orcabinet62 without an underfloor airsupply plenum box69.
Another option to the implementation of the raised floorair handling unit60 is shown in the elevation in FIG.3. It is a similar configuration to the implementation shown in FIG. 1; however, warm air is pulled from theexhaust air plenum63 at the bottom of the server/computer rack orcabinet62, into thereturn air plenum67, circulated into theair handler section30, cooled through a chilled water coil41 (as seen in FIG.11), pushed intoducting61 or another type of air distribution equipment, supplied66 onto the face of the servers/computers in a server/computer rack orcabinet62, into theexhaust air plenum63, back into underfloorreturn air plenum67, and recirculated back into theair handler section30. This eliminates dependence on other air distribution systems for cooling the servers/computers in a server/computer rack orcabinet62. Also, note that ducting could be added between theexhaust air plenum63 and theair handler section30 to enhance the air circulation through the server/computer rack orcabinet62.
Another option to the implementation of the raised floorair handling unit60 is shown in the elevation in FIG.4. It is a similar configuration to the implementation shown in FIG. 3; however, warm air is pulled from theexhaust air plenum63 at the bottom of the server/computer rack orcabinet62 through ducting into theair handler section30, and exhausted into thereturn air plenum67.
The first embodiment of the raised floor air handling unit is illustrated generally in FIG.5. Thissystem60 consists of3 main subassemblies: anair handling unit30, raisedfloor tile20, andductwork61. As previously shown, FIG. 5 shows air being pulled into the sides of theair handling unit30, up through the raisedfloor tile20, and pushed out throughductwork61 or another form of air distribution equipment.
This embodiment is further represented in the partially exploded view provided in FIG.6. The external shell of theair handling unit30 includes ahousing44, a removablefan access cover50, two duct blank-offs31 that seal off alternatesupply air openings46 and can be interchanged with the two duct collars23 (discussed later), and two inlet screens33. Theradial impeller fan32 andfan motor40 pull air into theair handling unit30 through the inlet screens33,optional filters35, and optionalfilter retaining screens34 into theintake plenum36 down through theinlet ring37 andradial impeller fan32. This air is then directed up through the raisedfloor tile assembly20 through the primarysupply air openings47. Optional filter access covers24 are provided for easy access to thefilters35 without removing the raised floorair handling unit60. Optional filter access covers24 are provided for easy access to thefilters35 without removing the raised floorair handling unit60. An optional controls access cover22 is provided for controlling the raised floorair handling unit60. Theduct assembly61 attaches to the raised floor assembly viaduct collars23 that channel the air from the primarysupply air openings47 into theair distribution ducts10 and out of thesupply air nozzles16 or another type of air distribution orifice. The nozzles may be oriented horizontally or they may be angled up or down from horizontal anywhere from up 75 degrees to down 75 degrees, more preferably between up 45 degrees to down 45 degrees, and most preferably between up 25 degrees to down 25 degrees. In the embodiment shown, the nozzles are approximately horizontal. Thenozzles16 may also be oriented around the circumference of theduct10 to provide air to a single vertical line, part or the entire surrounding area. Therefore thenozzles16 may be in a single vertical line or thenozzles16 may extend around 360 degrees, 270 degrees, 180 degrees, 90 degrees, etc. or any amount in between. The embodiment shown has thenozzles16 at 19 degrees each direction from the center line. Theair distribution ducts10 are fastened to theduct collars23 via aband clamp12, strap, or other similar attachment means, supported vertically by a verticalduct support clip13, and supported horizontally by a horizontalduct support clip11. These duct support clips are then attached to the vertical and horizontal duct support arm/bracket assemblies (14 &15, respectively) as shown in FIGS. 1-3.
FIGS. 7-9 provide elevation views of the raised floor air handling unit without the ducting. In these views, one can see the relationships between the previously mentioned assemblies and parts. In the embodiment shown, dimensions L1, L2, W1, W2, H1, and H2, would accommodate a standard 24″ length×24″ width×18″ depth floor tile assembly; however, custom dimensions can be accommodated. Additionally, FIG. 9 refers to a cross section provided in FIG.10.
The internal workings of the first embodiment are shown in the cross section provided in FIG.10. This cross section shows the air after it has already been pulled through the optional inlet screens33, filters35, filter retainer screens34, and into theintake plenum36. The air is then pulled through theinlet ring37 to theradial impeller fan32, diverted up by anairflow diverter39 through the raisedfloor tile assembly20 andduct collars23 into theducting61. Although thecontrols28,control panel27, and controls access cover22 impede the air flow in this cross section, the air still flows into theduct collars23 on either side of these controls. Additional diverters could be implemented around thecontrol panel27 to enhance the air flow into the duct collars. FIG. 10 also shows thefan motor40 mounted via afan mounting bracket43; however, this can be accomplished in any other manner as necessary.
FIG11 shows the implementation of an optionalchilled water coil41 where theairflow diverter39 was shown previously in FIG.10. FIG. 11 also shows the implementation ofinsulation45 and a condensate pan to support the implementation of thechilled water coil41. However, note that other components could be provided in support of thechilled water coil41 such as a condensate pump, chilled water control valve, and additional/different controls.
FIGS. 12 & 13 provide plan views of the first embodiment of theair handling unit30 assembly where FIG. 12 is looking at it from the top without the raised floor tile attached and FIG.13 is looking at it from the bottom without the fan access cover attached. In these views, one can see the relationships between the previously mentioned parts. In the embodiment shown, dimensions L2 and W2 would accommodate a standard 24″×24″×18″D floor tile assembly; however, larger, smaller, and different strength sizes could be created to accommodate custom dimensions and floor loads. Different size units may also be used in situations where more or less depth is available below the raised floor. One unique aspect shown in these views is the angular construction of theintake plenum36 which allows for reduced air velocity through the optional filters35 (as seen in FIG. 12) and diverts the airflow from theradial impeller fan32 for better performance and reduced air noise.
FIG. 14 provides a plan view of the first embodiment of the raisedfloor tile assembly20 with theduct collars23 attached. Theassembly20 includes atile plate25 that is supported below by tubular steel framing/reinforcement26, which also frames5 openings in the tile plate25: two primarysupply air openings47, twofilter openings48, and onecontrol panel opening29. Covering these openings is theducting61 mounted to theduct collars23, filter access covers24, and thecontrols access cover22, respectively.Optional handles21 are also shown.
FIG. 15 provides a cross section of the first embodiment of the raisedfloor tile assembly20. In this view, one can see the relationships between the previously mentioned parts.
FIG. 16 provides an isometric of a rectangular supply register orexhaust grille80 mounted to the raisedfloor tile assembly20 in lieu of theductwork61 previously shown. The rectangular supply register orexhaust grille80 can be installed with or without adjustable vanes to allow for the transfer of air without installing ductwork or its associated hardware. The incorporation of the rectangular supply register orexhaust grille80 requires the control panel opening29 to be relocated as shown.
FIG. 17 provides an isometric of two square supply registers orexhaust grilles81 mounted to the raisedfloor tile assembly20 in lieu of theductwork61 previously shown. The square supply registers orexhaust grilles81 can be installed with or without adjustable vanes to allow for the transfer of air without installingductwork61 or its associated hardware.
FIG. 18 provides an isometric of two round supply registers orexhaust grilles81 mounted to the raisedfloor tile assembly20 in lieu of theductwork61 previously shown. The square supply registers orexhaust grilles81 can be installed with or without adjustable vanes to allow for the transfer of air without installingductwork61 or its associated hardware.
FIG. 19 provides an isometric of asupply air manifold71 mounted to the raisedfloor tile assembly20 in lieu of theductwork61 previously shown. Thesupply air manifold71 can be connected to other supply air manifolds (as shown in the dashed lines) via removable manifold end caps72. In this embodiment, the manifold71 is placed horizontally. In other embodiments, the manifold71 orduct61 may be placed at any angle to the floor or wall.
FIGS. 20 through 22 provide alternative air outlets forair distribution ducts10 or supply air manifolds71. In FIG. 20, the outlets aresupply air nozzles16. FIG. 21 shows the outlets as supply air linear vents17. FIG. 22 has supply airlinear slits18 as the outlets.
It will be readily apparent to those skilled in the air handling art that various modifications and changes can be made to the described air handling system without departing from the spirit and scope of this invention. For example, although the unit has been shown and described with a radial impeller fan, other types of fans, such as centrifugal or axial may be used. Accordingly, all such modifications and changes that fall within the scope of the appended claims are intended to be part of the present invention.
Reference CharactersH1—height of raised floor tile assembly (1.125″ on standard design, can be adjusted for special applications)
H2—height of air handling unit (6″ to 16″, depending on options)
H3—height of ServAire ductwork
W1—width of raised floor tile assembly (24″ on standard design, can be adjusted for special applications)
W2—width of air handling unit (20″ on standard design, can be adjusted for special applications)
L1—length of raised floor tile assembly (24″ on standard design, can be adjusted for special applications)
L2—length of air handling unit (20″ on standard design, can be adjusted for special applications)
10. air distribution duct
11. interstitial duct support clip
12. band clamp
13. vertical duct support clip
14. vertical duct support arm/bracket
15. horizontal duct support arm/bracket
16. supply air nozzle(s)
17. supply air linear vent(s)
18. supply air linear slit(s)
20. raised floor tile
21. handle (optional, can be provided with other handle styles)
22. controls access cover
23. duct collar
24. filter access cover
25. tile plate
26. tubular steel framing/reinforcement (can be modified/enhanced for special applications)
27. control panel
28. controls
29. control panel opening
30. air handling unit
31. duct blank-off
32. radial impeller fan
33. inlet screen
34. filter retainer screen
35. air filter (can be disposable or re-usable)
36. intake plenum
37. inlet ring
38. fan shroud
39. air flow diverter
40. fan motor
41. chilled water coil
42. condensate pan
43. fan mounting bracket
44. housing
45. insulation
46. alternate supply air opening
47. primary supply air opening
48. filter opening
50. fan access cover
60. raised floor air handling unit
61. ductwork
62. server rack
63. exhaust air plenum of server rack
64. raised floor tile system
65. supply air plenum of server rack
66. cool air distribution
67. underfloor cool air plenum
68. building floor
69. underfloor air supply plenum box
70. exhaust
71. supply air manifold
72. removable manifold end cap
80. rectangular supply register or exhaust grille
81. square supply register or exhaust grille
82. round supply register or exhaust grille