US5314596A - Process for fabricating magnetic film recording head for use with a magnetic recording media - Google Patents

Abstract

A thin film magnetic recording head for high-density recording applications. The head includes a pole formed from at least two ferromagnetic material layers with one layer having high anisotropy (H_k) and low permeability (μ), and the other layer having low H_k and high μ. The high H_k layer provides the lower magnetic impedance flux path in the tip region and the low H_k layer provides the lower magnetic impedance path in the yoke region of the head. A non-magnetic film may be disposed between the layers, with a thickness chosen to minimize domain flux coupling of the two magnetic layers, while allowing magnetic signal flux transfer between layers at an appropriate point between the tip and the yoke. The pole may be sculpted so that the low H_k layer extends only partially into the tip region, or so that the high H_k layer extends only partially into the yoke. Alternatively, the invention may use a laminated, high permeability layer and a homogeneous layer in place of the high H_k and low H_k layers.

Description

This application is a division of U.S. patent application Ser. No. 546,280 filed Jun. 29, 1990, which issued as U.S. Pat. No. 5,157,570 on Oct. 20, 1992.

CROSS-REFERENCE TO RELATED APPLICATIONS

This invention relates to the following co-pending patent applications, all of which are assigned to the assignee of this application as of the date of filing:

"Laminated Poles for Recording Heads", Ser. No. 07/128,886, filed Dec. 4, 1987, which was continued as Ser. No. 07/410,028, filed on Sep. 20, 1989, now U.S. Pat. No. 5,108,837.

"Flux Spreading Thin Film Magnetic Device", Ser. No. 07/227,808, filed Jun. 28, 1988, now U.S. Pat. No. 5,089,334.

"Magnetic Devices with Enhanced Poles", Ser. No. 07/345,719, filed May 1, 1989, pending.

FIELD OF THE INVENTION

This invention relates generally to magnetic disk drives and particularly to the configuration of a thin film head which increases recording density and data transfer efficiency.

BACKGROUND OF THE INVENTION

A typical magnetic data recording device, such as a disk drive, includes a magnetic storage media, and a read/write head. The head is usually formed from two or more elongated pieces of a suitable ferromagnetic material such as a nickel iron (NiFe) alloy. The poles are joined at one end, called the yoke, and are separated by a precisely defined gap at the opposite end, called the tip. A wire coil is wrapped around the poles adjacent the yoke. During read and write operations, the head is positioned with the tip portion adjacent the disk; the coil provides a mechanism for driving magnetic flux into as well as sensing magnetic flux from the head.

In designing a disk drive it is generally desirable to increase the density of information recorded per unit area of disk media surface, as well as the data transfer rate and signal-to-noise ratio (SNR). These parameters are primarily determined by the specific electro-mechanical configuration of the head. For example, since the number of tracks per inch (TPI) available on a disk of a given size is determined by the width of the tip, it is desirable to keep the tip as narrow as possible. However, the yoke should be made as wide as possible, to encourage magnetic flux conduction between the poles and the coil. A wider yoke increases the available amplitude of the signal emanating from the head, and thus the number of bits per inch (BPI) recordable in a given track. Given these conditions, it is well known that the preferred head pole configuration has a narrow tip and a wide yoke.

However, other parameters must normally be considered to achieve maximum recording density. For example, a ferromagnetic pole can be fabricated to have an induced anisotropy axis of preferred magnetic orientation, or "easy axis". When this axis is oriented perpendicular to the direction of flux conduction, the flow of flux through the head can occur by the preferred process of rotation of the rest state of magnetization away from the easy axis. The preference for the material to remain magnetized in the easy axis direction is also referred to as the anisotropy field, H_k.

Unfortunately, reducing the width of the pole beyond a critical value results in the dominance of "edge closure domains" which are not oriented in the preferred direction. Therefore, these edge closure domains encourage flux conduction by domain wall motion along the outer walls of the pole. While this may actually facilitate flux conduction at low frequencies, at higher frequencies the magnetic permeability, or μ of the pole becomes unacceptably low. Furthermore, defects in the head material can perturb the conduction of magnetic flux along the domain walls, resulting in Barkhausen noise. Thus, the pole tip cannot be made too narrow without adversely affecting head performance.

One technique for minimizing the size of the edge closure domains and thus for reducing the size of the tip is to increase the H_k of the pole material. Several other techniques are known for adjusting the H_k, such as adding cobalt to create an NiFeCo alloy; changing the proportion of Ni to Fe together with a change in the magneostrictive forces on the pole; or using other materials, such as cobalt zirconium (CoZr), cobalt zirconium neodymium (CoZrNd), iron nitride FeN, iron silica (FeSi), and the like.

A quite different concern arises with the yoke, however, which complicates the choice of a suitable H_k. In particular, the yoke is less susceptible to Barkhausen noise, since its wider path prevents the dominance of edge closure domains, and thus the yoke usually provides sufficient flux conductivity. Rather, the problem with the yoke usually is that the permeability, μ, of the material is inversely proportional to its H_k. Having too low a μ limits the amount of flux conduction through the coil. Thus, it is generally believed that the H_k of the pole material should be kept low in order to avoid adverse affects upon the overall head efficiency.

A further consideration is the thicknesses of the poles in the dimension parallel to the write track. Optimum pole thickness is dictated primarily by surface eddy currents which originate from variations in the applied or detected magnetic field as different sections of the disk rotate past the head. At high frequencies, the presence of eddy currents generally limits flux conduction to the extent of the surface effect or "skin depth". Since thicker poles generally provide greater material for conduction, the thicker the pole, the better the conductivity. However, increasing the pole thickness beyond about twice the skin depth can adversely affect the pole's frequency response.

To optimize the SNR, other parameters should also be considered in determining the pole thickness. For example, consider that any given head configuration can be modelled by an equivalent electrical circuit consisting of an ideal inductor having a series resistance, R_s, and a parallel resistance, R_p. In order to maximize the available SNR, the output signal level, and hence, R_p, must be as large as possible. Since R_p is typically inversely proportional to the pole thickness, in order to achieve high R_p, the thickness must be minimized. Hence, a compromise must typically be made between maximum frequency operation and maximum SNR when choosing the pole thickness.

A higher R_p can also be obtained by decreasing the H_k of the pole material, but this conflicts with the need to increase H_k to encourage maximum flux conduction through the tip, as previously mentioned.

One approach to resolving some of these design tradeoffs has been to use a pole formed from multiple laminations. Such multiple laminations inherently provide the desired domain structure, since flux paths are provided in parallel by the laminated layers. They also increase the R_p of the pole for a given pole thickness.

However, fabrication of laminated poles involves a more complicated and expensive fabrication process, since the layers must be formed by slower, more precise processes. For example, this process typically requires sputtering a sheet deposit and then ion milling the pole form with a mask, rather than the less expensive electroplating through a mask. Additionally, any ion milling required to form the pole geometry has the adverse effect of side-wall redeposition. This means that the longer the ion milling time, the greater the chance that redeposited material will build up sufficiently to provide a short circuit path between layers, thereby unfavorably changing the electrical and magnetic properties of the head.

Further discussion of the tradeoffs in thin film head design and some suggested alternatives are discussed in the following papers.

Mallary, M., et al., "Frequency Response of Thin Film Heads with Longitudinal and Transverse Anisotropy", presented at the IEEE Conference on Magnetics in April, 1990.

Mallary, M., et al., "Three Dimensional Transmission Line Model for Flux Conduction in Thin Film Heads", presented at the 34th Annual Conference on Magnetism and Magnetic Materials (1989).

Mallary, M., and Smith, A. B., "Conduction of Flux at High Frequencies by a Charge Free Magnetization Distribution", IEEE Transactions on Magnetics, Vol. MAG-24, pp. 2374- (1988).

Mallary, M., "Conduction of Flux at High Frequencies in Permalloy Strips by Small-Angle Rotations", Journal of Applied Physics, Vol 57, pp 3953- (1985).

What is needed is a thin film magnetic recording head which provides the desired domain structure in the tip and good flux conduction in the yoke region to provide for maximum density recording at acceptable SNRs. The head should be easily fabricated with minimal use of ion milling.

SUMMARY OF THE INVENTION

The invention is a thin film magnetic recording head which includes a pole comprising two magnetic layers formed of ferromagnetic material, with one layer formed of a material having high H_k and low μ, and the other layer formed of a material having low H_k and high μ. The layers as decoupled in terms of near-field, or internal domain flux, so that the pole behaves are though they were positioned far apart. However, the two magnetic layers are coupled in terms of far field, or signal flux applied from external sources. As a result, the high H_k layer provides the lower magnetic impedance path in the pole tip region, and the low H_k layer provides the lower magnetic impedance path in the yoke region.

The H_k of the layers can be selected by any suitable means. For example, both pole layers may be each be formed from nickel-iron-cobalt (NiFeCo) with the low H_k layer being an Ni_u Fe_v Co_w alloy, and the high H_k layer being an Ni_x Fe_y Co_z alloy. The proportions u, v, and w are then chosen to provide the desired low H_k, and x, y, z are chosen to provide the desired high H_k. However, the cobalt may be omitted entirely from the low H_k layer, or other suitable ferromagnetic materials may be used, such as cobalt zirconium (CoZr), cobalt zirconium neodymium (CoZrNd), iron nitride FeN, iron silica (FeSi), and the like. The H_k of the layers can also be adjusted by consideration of the magnetostrictive forces on the poles and selecting the proportion of Ni to Fe accordingly.

Alternatively, the two magnetic layers may include a high permeability layer extending through the pole region, and a homogeneous layer extending through the yoke. The laminated layer is composed of plurality of laminae formed from alternating films of magnetic conductive and magnetic insulating material.

In one embodiment, a non-magnetic, separation film or layer may be disposed between the two magnetic layers. The non-magnetic layer may be formed of a material which is both non-magnetic and electrically insulating, if desired. Its thickness is chosen to minimize domain flux coupling of the two magnetic layers, while allowing magnetic signal flux transfer via exchange coupling between layers at an appropriate point between the tip and the yoke.

In yet another embodiment, the yoke region is a sculpted (thickened) low H_k layer, which extends only partially over the high H_k layer, to further assist in providing the desired type of coupling between layers.

There are several advantages to the invention. It exhibits the preferred domain behavior in the tip region, namely, conduction by magnetization rotation via the high H_k material. In addition, the low H_k material in the yoke region provides both maximum flux spreading and high permeability.

The sculpted embodiment eliminates the need for using an non-magnetic layer in some applications.

If a laminated layer is used, it achieves suppression of eddy currents by means of small skin depth, while also providing high permeability, without the need to use high H_k materials in the preferred domain structure in the pole-tip region.

Fabrication of the poles is relatively straightforward, with several process step variations depending upon the desired pole configuration. For example, to fabricate the lower half of the pole, a suitably thick (such as 2 μm) high H_k layer is first deposited onto an appropriate substrate by plating through a mask onto a sputter-deposited seed layer. Next, a non-magnetic layer of about 500 angstroms (Å) thickness is sputtered onto the high H_k layer, followed by sputtering a low H_k seed layer. Additional low H_k material is then plated through a mask onto the seed layer to complete a suitably thick low H_k layer (such as 2 μm). The seed layer is then removed by etching.

In the sculpted embodiment, high H_k material is plated through a mask onto a seed layer to form a layer that extends throughout the yoke but not into the pole tip region. The mask then stripped and the non-magnetic layer material and a seed layer of low H_k material are vacuum-deposited. A second mask is formed that exposes the yoke and pole tip regions, and a low H_k material layer is plated on top of the high H_k material layer. The mask is then stripped and the seed and non-magnetic layers are etched away.

The laminated layer can be fabricated by alternately sputtering 500-1000 Å NiFeCo layers and ultra-thin 35-50 Å Al₂ O₃ layers onto a substrate until a total thickness of about 1-2 μm is achieved. At this point, a thicker 150 Å Al₂ O₃ layer is sputtered as the non-magnetic layer. Following this, a NiFeCo seed layer is sputtered, and subsequent plating of NiFeCo to a 2-4 μm total thickness completes the pole.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and further advantages of the invention may be better understood by referring to the following description in conjunction with the accompanying drawings, in which:

FIG. 1 is an isometric view of a two-pole thin film head according to the invention;

FIG. 2A is a plan view of the lower pole having a homogeneous high H_k layer;

FIGS. 2B-2E are cross sectional views of various embodiments of the lower pole taken alongline 2--2 of FIG. 2A, with:

FIG. 2B showing the lower and upper magnetic material layers, and a middle non-magnetic layer of a three-layer embodiment,

FIG. 2C showing a sculpted pole embodiment without a non-magnetic layer,

FIG. 2D showing a sculpted pole embodiment, with a non-magnetic layer, and

FIG. 2E showing a sculpted pole embodiment using overlapping layers;

FIG. 3A is a plan view of the lower pole having a laminated high H_k layer;

FIG. 3B-3E are cross sectional views of various embodiments of the lower pole taken alonglines 3--3 of FIG. 3A, with;

FIG. 3B showing three layer embodiment having a laminated lower magnetic layer, middle non-magnetic layer, and upper homogeneous magnetic layer,

FIG. 3C showing a sculpted pole embodiment without an non-magnetic layer,

FIG. 3D showing a sculpted pole embodiment with an non-magnetic layer, and

FIG. 3E showing a sculpted pole embodiment using overlapping layers;

FIG. 4 is an isometric view of a laminated layer showing the orientation of various magnetic domains;

FIGS. 5A and 5B depict the preferred manner of fabricating certain portions of the homogeneous embodiment of the head; and

FIGS. 6A and 6B depict the preferred manner of fabricating certain portions of the laminated embodiment of the head.

DETAILED DESCRIPTION OF ILLUSTRATIVE EMBODIMENTS

As shown in FIG. 1, a thin filmmagnetic head 10 in accordance with the invention includes an upper pole 12a and alower pole 12b (collectively, "the poles 12"). The poles 12 are generally Y-shaped, and are formed from a ferromagnetic fluxconductive material, such as a nickel-iron-cobalt (NiFeCo) alloy. They are magnetically isolated at the narrow end, ortip 14, such as by mechanically spacing them apart. In addition, the poles 12 are magnetically coupled at the wide end, oryoke 16, such as by mechanically joining them.

The space between the poles 12 at thetip 14 is referred to as agap 18, which is further defined by a rigid gap layer 19 disposed between the poles 12 and extending from thetip 14 to theyoke 16. The gap layer 19 is formed of a material which is both non-magnetic and electrically insulating, such as Al₂ O₃.

A ridge 22 formed in the upper pole 12a allows the gap layer 19 to accommodate a plurality ofcoiled conductors 24 positioned between the poles 12. Theconductors 24 serve to conduct electric current to and from thehead 10. In addition, other configurations of thehead 10 may include a third pole (not shown in the drawings) disposed between the upper pole 12a andlower pole 12b to form a second gap.

A magnetic media, such as adisk 20, is spaced opposite the poles 12 at thetip 14, and stores the recorded information. Other types of magnetic media may be used with thehead 10, such as magnetic tape. During read operations, thehead 10 is positioned with thetip 14 nearest thedisk 20. As various sections of thedisk 20 having different recorded polarizations pass by thetip 14, a magnetic flux travels around thehead 10 in the direction of path I. This changing magnetic flux in turn induces an electric current in theconductors 24, which provides an electronic indication of the sensed magnetic field.

During write operations the process is reversed, with a current of either polarity being applied through theconductors 24. This creates a magnetic field in one direction or the other, along the path I, with sufficient strength to set the magnetization of a small portion of thedisk 20 adjacent thetip 14.

A distinguishing feature of the invention is the way in which the poles 12 are constructed. In particular, the poles 12 are laminated from two or more layers, with each layer having specific characteristics. One embodiments of anexemplary pole 12b has a firstferromagnetic layer 30 formed of a high anisotropy (H_k) and low permeability (μ) material such as Ni_x Fe_y Co_z, and a secondferromagnetic layer 32 formed of a low H_k and high μ material such as Ni_u Fe_v Co_w. The proportions x, y, and z are chosen to provide the desired high H_k inlayer 30; similarly, u, v, and w are chosen to provide the desired low H_k inlayer 32.

The twolayers 30 and 32 are decoupled in terms of internal domain flux, that is, the flux inherent in the domain structure of the pole. In other words, the two magnetic layers assume a domain pattern that is essentially the same as if they were very far apart from each other. However, layers 30 and 32 are coupled in terms of external signal flux, that is, the far-field flux applied to the pole by outside forces such as thecoils 24 or thedisk 20. It may also be said that the two layers are decoupled in terms of, or exchange coupling.

The high H_k layer 30 is the path of least magnetic resistance in thetip 14, and the low H_k layer 32 is the path of least magnetic resistance in theyoke 16.

As will be understood shortly, this provides the novel advantage of having the preferred domain structure in thetip 14, via the high H_k material, as well as the preferred structure in theyoke 16 via the low H_k material.

As shown in FIG. 1, the upper pole 12a also comprises a high H_k layer 30 and a low H_k layer 32. In the illustrated embodiment, the low H_k layers 32 form the outer faces of the poles 12, and the high H_k layers 30 form the inner faces adjacent the gap layer 19, but the layers may also be arranged in other orientations.

FIG. 2A is a plan view of thelower pole 12b showing in greater detail the general Y-shape and the approximate extent of thetip 14 andyoke 16.

FIG. 2B is a cross sectional view of one embodiment of thelower pole 12b taken alonglines 2--2 of FIG. 2A. The high H_k layer 30 is preferably a homogeneously formed layer of ferromagnetic material having an intrinsically high H_k. For example, it may be a 2-4 μm thick layer of Ni_x Fe_y Co_z, with the proportions x, y, and z chosen to provide the desired H_k of approximately 10 Oersteds (oer). However, the exact thickness of the high H_k layer 30 depends upon several other considerations. For example, if it is too thick, a pole tuning effect may occur, which adversely affects the shape of the electric signal pulse emanating from thecoils 24, and the parallel resistance (R_p) of the pole may become too small. If the high H_k layer is too thin, a lower electrical signal level results at theconductors 24.

The low H_k layer 32 extends the entire length of thepole 12b, from thetip 14 to theyoke 16. The low H_k layer 32 is typically a homogeneously formed Ni_u Fe_v Co_w layer of about 2 μm thickness, with the proportions u, v, and w are chosen to provide the desired low H_k. However, the exact thickness oflayer 32 is dictated by the desired parallel resistance, R_p, of thepole 12b, since this layer carries the flux through theyoke 16.

Those of skill in the art will recognize that there are various ways to provide layers having different H_k 's. For example, both pole layers may be each formed from nickel-iron-cobalt (NiFeCo) alloy, with the low H_k layer being an Ni_u Fe_v Co_w alloy, and the high H_k layer being an Ni_x Fe_y Co_z alloy. The cobalt may be omitted entirely from the low H_k layer, i.e., w may be zero. Other suitable ferromagnetic materials may be used, such as cobalt zirconium (CoZr), cobalt zirconium neodymium (CoZrNd), iron nitride FeN, iron silica (FeSi), and the like. The H_k of the layers can also be adjusted by consideration of the magnetostrictive forces on the poles and selecting proportion of Ni to Fe in the pole material accordingly.

In the embodiment of FIG. 2B, anon-magnetic layer 34 is sandwiched between the high H_k layer 30 and the low H_k layer 32. Thenon-magnetic layer 34 may also be electrically insulating, if desired; a 200 Å layer of Al₂ O₃ is one such type of layer.

To avoid erroneous operation, thenon-magnetic layer 34 must not be thick enough to appear to be agap 18. However, the primary consideration dictating the thickness of thenon-magnetic layer 34 is the need to achieve the desired type of coupling between the twomagnetic layers 30 and 32. As previously mentioned, the twolayers 30 and 32 must be decoupled in terms of internal domain flux, that is, the flux inherent in their domain structures. In other words, the thickness of thenon-magnetic layer 34 is chosen such that the twomagnetic layers 30 and 32 assume a domain pattern which is essentially the same as if they were not proximate to each other. However, layers 30 and 32 must be coupled in terms of external signal flux, that is, the far-field flux applied to the pole by outside forces such as thecoils 24 or thedisk 20. This can be accomplished by suitable thickness of thelayer 34, since the magnitude of the domain flux is typically on the order of 10 kilo-gauss, and the signal flux is on the order of 1 Oersted.

FIG. 2C is a cross sectional view of another embodiment of thelower pole 12b. We refer to this as a sculpted pole, since the high H_k layer 30 is only partially covered by the low H_k layer 32, to the extent of theyoke 16. A non-magnetic layer is not necessary in this arrangement, since the absence of the low H_k layer 32 in the area of the tip 12 provides inherent isolation.

FIG. 2D is a cross sectional view of a sculpted pole embodiment similar to that of FIG. 2C, but having anon-magnetic layer 34 which is co-extensive with the low H_k layer 32 in theyoke 16. This embodiment may be used wherever additional isolation is required.

FIG. 2E shows yet another variation. Here, the high H_k layer 30 is placed in the vicinity of thetip 14 only. The low H_k layer 32 forms theyoke 16, and extends slightly into thetip 14, over the high H_k layer 30. This embodiment also eliminates the need for a non-magnetic layer.

The embodiments depicted in FIGS. 2C, 2D and 2E all provide the same advantages as the FIG. 2B embodiment, while also providing a mechanism for eliminating the false gap problem sometimes experienced with anon-magnetic layer 34 which extends into thetip 14. However, this is achieved at the expense of a more complicated fabrication process, which must mask various areas of the layers to achieve the specific desired shapes.

FIG. 3A is plan view of thelower pole 12b showingsection lines 3--3 along which the views of FIGS. 3B-3E are taken.

FIGS. 3B-3E depict various embodiments of the invention wherein the two layers are alaminated layer 33 and ahomogeneous layer 35. Laminated pole structures are the subject of a co-pending United States patent application entitled "Laminated Poles for Recording Heads", Ser. No. 07/128,866 filed Dec. 4, 1987 which was continued as Ser. No. 07/410,028, filed Sept. 20, 1989 now U.S. Pat. No. 5,108,837 and assigned to Digital Equipment Corporation, which should be referred to for more details.

As shown in FIG. 3B, thelaminated layer 33 consists of plurality of magneticconductive films 36 and insulatingfilms 38 alternately disposed upon one another. The magnetic conductive films are fabricated from any convenient NiFeCo alloy, and the insulatingfilms 38 from an insulating material such as Al₂ O₃

The homogeneous, orunlaminated layer 35 disposed adjacent thelaminated layer 33 provides flux spreading along domain walls in theyoke 14 and additional conductance down the longer axis of thepole 12b.

FIGS. 3C, 3D, and 3E, respectively, depict the laminated layer embodiment using a sculpted pole without anon-magnetic layer 34, a sculpted pole with anon-magnetic layer 34, and an embodiment using overlappinglayers 33 and 35.

Thelaminated layer 33 has intrinsically high magnetic permeability, μ, since its magnetization domains close in upon themselves. This also achieves suppression of eddy currents by means of the multiple laminations, and hence enhanced high frequency performance.

This is evident from consideration of FIG. 4, which shows the orientation of magnetic domains in thelaminated layer 33. An upperconductive film 36a is positioned above an insulating film 38a which, in turn, is above a lower conductive film 36b.Edge curling walls 42 are formed via magnetostatic and exchange coupling about the periphery of the pole 12, thereby providing conductive paths at the outside edges. A given cross section of thelaminated layer 33, such as alongplane 4--4, thus has a region of closure. For example, a domain is provided in the "right" direction by the upperconductive film 36a, in the "down" direction by the right-edge domain, in the "left" direction by the lower conductive film 36b, and in the "up" direction by the left-edge domain. A high-permeability axis for conduction is thus provided in the direction I of desired flux conduction.

In other words, since the laminated embodiment provides domains of closure with the correct orientation, magnetic flux conduction will inherently occur by magnetization rotation, rather than by wall motion. Thus, this structure has intrinsically high permeability, and there is less of a need to use high H_k material for narrow track heads.

FIGS. 5A and 5B depict the homogenous sculpted embodiment of thelower pole 12b in certain stages of fabrication, as viewed in the direction 5 of FIG. 2D. Thelower pole 12b is constructed by first plating or sputtering approximately 2 μm of high H_k material, such as Ni_x Fe_y Co_z, onto a substrate orwafer 46 to form the high H_k layer 30. Thewafer 46 is typically formed from an alsimag composite material. Alsimag is a trademark of 3M Corporation of Minneapolis, Minn. for its composite ceramic materials formed of Al₂ O₃ and titanium carbide. A 500 Å Al₂ O₃non-magnetic layer 34 is sputtered on, followed by sputtering aseed layer 48 of low H_k material, such as Ni_u Fe_v Co_w.Photoresist 50 is then applied to define and expose only theyoke 16, and then approximately 4 μm of Ni_u Fe_v Co_w is plated to complete the low H_k layer 32. Thephotoresist 50 is then removed.

The next step, as shown in FIG. 5B, is to ion mill theentire pole 12b to remove about 2 μm of material. This separates thepole 12b from other poles formed on thewafer 46, and reduces the thickness of the low H_k layer 32 to the desired 2 μm, all in one step.

A variation on this technique which requires less processing to achieve the same result (i.e., two layers having different H_k 's separated by a non-magnetic, electrically insulating layer) is as follows. The high H_k layer 30, thenon-magnetic layer 34, and theplating seed layer 48 are sheet-deposited in a vacuum (e.g. by sputtering, evaporation, etc.). The low H_k layer 32 is then plated through a mask at an excess thickness. After stripping the mask, the extra-thickupper layer 32 is itself is used as a mask to ion mill its geometry into thebottom layer 30. The excess thickness is chosen such that the desired final thickness of thetop layer 32 is achieved when the ion beam etch processing of thelower layer 30 is complete.

A third variation requiring even less processing can be used, especially when a insulating spacer layer is not required. In this approach, the high H_k layer 30 of Ni_x Fe_y Co_z is plated through a mask onto aseed layer 48. Next, if desired, a thin (e.g. 500 Å)non-magnetic layer 34 is plated through the same mask onto the bottom Ni_x Fe_y Co_z layer. Finally, the upper Ni_u Fe_v Co_w layer 32 is plated through the same mask. The mask is stripped and theseed layer 48 is removed by etching.

To fabricate the sculpted embodiment of FIG. 2D, Ni_u Fe_v Co_w can be first plated through a mask onto aseed layer 48 to form a layer that extends throughout theyoke 16 but not into thetip 14. The mask then stripped, and thenon-magnetic layer 34 and a seed layer are vacuum-deposited. A second mask is formed that exposes theyoke 16 andtip 14 regions, and a Ni_x Fe_y Co_z layer is plated on top of the Ni_u Fe_v Co_w layer. The mask is stripped and the seed and non-magnetic layers are then etched away.

A variation on the sculpting process that requires less processing may or may not use a thin non magnetic conductive spacer layer between the two NiFeCo alloy layers. In the yoke region only, a low H_k, Ni_u Fe_v Co_w alloy is plated through a mask onto a seed layer. A non-magnetic layer may or may not be plated through the same mask onto the Ni_u Fe_v Co_w layer. The mask is then re-exposed and re-developed in order to open a window in thetip region 14. The high H_k, Ni_x Fe_y Co_z layer is then plated, the mask is stripped, and the seed layer is etched to complete the pole 12.

Processing for the laminated embodiment, as shown in FIGS. 6A and 6B, is quite similar. However, thelaminated layer 33 is produced by alternately sputter-depositing about 100-1000 angstroms (Å), of NiFeCo alloy as aconductive film 36 and 10-100 (Å) of Al₂ O₃ as an insulatingfilm 38 until a total thickness of about 1-2 μm is reached. At this point, if thenon-magnetic layer 34 is desired, a thicker 150-500 Å Al₂ O₃ layer is sputter deposited. This is followed by sputtering a thin NiFeCo alloy film which serves as a seed for subsequent plating of a 2-4 μm thick,homogeneous layer 35. There are no other major process step variations, other than this sequence of alternate sputtering of materials to form thelaminated layer 33.

The foregoing description has been limited to a specific embodiment of this invention. It will be apparent, however, that variations and modifications may be made to the invention, with the attainment of some or all of its advantages. Therefore, it is the object of the appended claims to cover all such variations and modifications as come within the true spirit and scope of the invention.

Claims (19)

We claim:

1. A process for fabricating a magnetic recording head, the head including at least one pole member having a tip portion and a yoke portion, the process of fabricating the pole comprising the steps of laying down, onto a substrate, in succession:

a first flux-conductive layer of a high anisotropy (H_k) and low permeability (μ) material;

a non-magnetic, electrically insulating material layer for preventing domain flux coupling in the tip portion; and

a second flux-conductive layer having low H_k and high μ.

2. A process as in claim 1 wherein the first flux-conductive layer is formed to extend from the tip to the yoke.

3. A process as in claim 1 wherein the electrically insulating layer is formed to extend from the tip to the yoke.

4. A process as in claim 1 wherein the second flux-conductive layer is formed to extend from the tip to the yoke.

5. A process as in claim 1 wherein the second flux-conductive layer is formed to extend only into the yoke.

6. A process as in claim 5 wherein the electrically insulating layer is formed to extend only into the yoke.

7. A process as in claim 1 wherein the first flux-conductive layer is formed as a homogeneous layer of a high H_k material.

8. A process as in claim 1 wherein the first flux-conductive layer is formed by plating.

9. A process as in claim 1 wherein the first flux-conductive layer is formed by sputtering.

10. A process as in claim 1 wherein the non-magnetic, electrically insulating layer is formed by plating.

11. A process as in claim 1 wherein the non-magnetic, electrically insulating layer is formed by sputtering.

12. A process as in claim 1 wherein the second flux-conductive layer is formed by plating.

13. A process as in claim 1 wherein the second flux-conductive layer is formed by sputtering.

14. A process for fabricating a magnetic recording head for use with a magnetic recording media, the head including at least one pole member having a tip portion and a yoke portion, and the of fabricating a pole comprising, in order, the steps of:

alternately sputtering films of a magnetic conductive material and a magnetic insulating material to provide a first flux-conductive layer having intrinsically high permeability (μ);

sputtering a non-magnetic, electrically non-conductive material layer that prevents domain flux coupling in the tip portion;

sputtering a seed layer of conductive material; and

plating a second flux-conductive layer having high H_k and low μ.

15. A process as in claim 14 wherein the first flux-conductive layer is formed to extend from the tip to the yoke.

16. A process as in claim 15 wherein the second flux-conductive layer is plated to extend only into the yoke.

17. A process as in claim 14 wherein the non-magnetic, electrically non-conductive material layer is plated to extend from the tip to the yoke.

18. A process as in claim 14 wherein the second flux-conductive layer is plated to extend from the tip to the yoke.

19. A process as in claim 14 wherein the non-magnetic, electrically non-conductive material layer is plated to extend only into the yoke.

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