The invention relates to a wear-resistant conductive contact patch for a color CRT faceplate panel and, more particularly, to a contact patch which facilitates the electrophotographic manufacturing of a luminescent screen on an interior surface of the faceplate panel.
BACKGROUND OF THE INVENTIONU.S. Pat. No. 4,921,767, issued to P. Datta et al. on May 1, 1990, discloses a method for electrophotographically manufacturing a luminescent screen assembly on an interior surface of a CRT faceplate using dry-powdered, triboelectrically-changed, screen structure materials deposited on a suitably prepared, electrostatically-chargeable photoreceptor. The photoreceptor comprises a photoconductive layer overlying a conductive layer, both of which are deposited, serially, as solutions, on the interior surface of the CRT panel.
The photoreceptor is electrostatically charged by electrically contacting the conductive layer while simultaneously generating a corona discharge to suitably charge the photoconductive layer. Preferably, the conductive layer is grounded while a positive corona discharge is generated from a corona charger which is moved across the photoconductive layer. The conductive layer is relatively thin, on the order of about 1 to 2 microns, and must be contacted a number of different times during screen processing. Experience has shown that repeated contacts with the thin conductive layer by the ground contact of the charging apparatus erodes the contacted portion of the conductive layer and, thus, a need exists for a more wear-resistant contact.
SUMMARY OF THE INVENTIONThe method of electrophotographically manufacturing a luminescent screen on a substrate of a color CRT, according to the present invention, includes the steps of forming a photoreceptor by sequentially coating a surface of the substrate with a first solution to form a volatilizable conductive layer and overcoating the conductive layer with a second solution to form a volatilizable photoconductive layer; establishing a substantially uniform electrostatic charge on the photoconductive layer; and exposing selected areas of the photoconductive layer to visible light to affect the charge thereon. Then, the photoconductive layer is developed with a triboelectrically-changed, dry-powdered first screen structure material. The charging, exposing and developing steps are sequentially repeated with different color-emitting phosphor screen structure materials to form the luminescent screen comprising picture elements of color-emitting phosphor materials. The improved process provides at least one wear-resistant conductive contact patch on a peripheral portion of the surface of the substrate. The contact patch has a first portion which underlies at least one of the layers of the photoreceptor and is in electrical contact with the conductive layer, and a second portion which extends from the photoreceptor. The contact patch is grounded during the charging step to facilitate establishing the charge on the photoconductive layer. The contact patch also is contacted during the developing step with suitable measuring means to monitor the deposition of the triboelectrically charged materials on the photoconductive layer.
BRIEF DESCRIPTION OF THE DRAWINGSFIG. 1 is a plan view, partially in axial section, of a color CRT made according to the present invention.
FIG. 2 is a section of the tube of FIG. 1 showing details of the luminescent screen assembly.
FIG. 3 shows the screen assembly of FIG. 2 during a step in the manufacturing process.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTFIG. 1 shows acolor CRT 10 having a glass envelope 11 comprising arectangular faceplate panel 12 and atubular neck 14 connected by arectangular funnel 15. Thefunnel 15 has an internal conductive coating (not shown) that contacts ananode button 16 and extends into theneck 14. Thepanel 12 comprises a viewing faceplate orsubstrate 18 and a peripheral flange orsidewall 20, which is sealed to thefunnel 15 by a glass frit 21. A threecolor phosphor screen 22 is carried on the inner surface of thefaceplate 18. Thescreen 22, shown in FIG. 2, preferably is a line screen which includes a multiplicity of screen elements comprised of red-emitting, green-emitting and blue-emitting phosphor stripes R, G and B, respectively, arranged in color groups or picture elements of three stripes or triads in a cyclic order and extending in a direction which is generally normal to the plane in which the electron beams are generated. In the normal viewing position of the embodiment, the phosphor stripes extend in the vertical direction. Preferably, the phosphor stripes are separated from each other by a light-absorptive matrix material 23, as is known in the art. Alternatively, the screen can be a dot screen. A thinconductive layer 24, preferably of aluminum, overlies thescreen 22 and provides a means for applying a uniform potential to the screen as well as for reflecting light, emitted from the phosphor elements, through thefaceplate 18. Thescreen 22 and theoverlying aluminum layer 24 comprise a screen assembly.
With respect again to FIG. 1, a multi-apertured color selection electrode orshadow mask 25 is removably mounted in predetermined spaced relation to the screen assembly, by conventional means comprising a plurality ofspring members 26 each attached to astud 27 embedded in thesidewall 20. Anelectron gun 28, shown schematically by the dashed lines in FIG. 1, is centrally mounted within theneck 14, to generate and direct threeelectron beams 29 along convergent paths, through the apertures in themask 25, to thescreen 22. Thegun 28 may be, for example, a bi-potential electron gun of the type described in U.S. Pat. No. 4,620,133, issued to Morrell et al., on Oct. 28, 1986, or any other suitable gun.
Thetube 10 is designed to be used with an external magnetic deflection yoke, such as yoke 30 located in the region of the funnel-to-neck junction. When activated, the yoke 30 subjects the threebeams 29 to magnetic fields which cause the beams to scan horizontally and vertically in a rectangular raster over thescreen 22. The initial plane of deflection (at zero deflection) is shown by the line P--P in FIG. 1, at about the middle of the yoke 30. For simplicity, the actual curvatures of the deflection beam paths in the deflection zone are not shown.
Thescreen 22 is manufactured by an electrophotographic process that is described in the above-mentioned U.S. Pat. No. 4,921,767 which is incorporated by reference herein for the purpose of disclosure. Initially, thepanel 12 is washed with a caustic solution, rinsed with water, etched with buffered hydrofluoric acid and rinsed once again with water, as is known in the art. The interior surface of theviewing faceplate 18 is then coated with a first solution and dried to form alayer 32 of a volatilizable, electrically conductive material which provides an electrode for an overlying volatilizable, photoconductive layer 34 that is formed by applying a second solution. Portions of thelayers 32 and 34, which together comprise a photoreceptor, are shown in FIG. 3. The composition and method of forming theconductive layer 32 and the photoconductive layer 34 are described in U.S. Pat. No. 4,921,767. Typically, theconductive layer 32 has a thickness within the range of about 1 to 2 microns and the photoconductive layer 34 has a thickness within the range of about 3 to 4 microns.
Theconductive layer 32 is grounded and the overlying photoconductive layer 34, is uniformly charged in a dark environment by a corona discharge apparatus which charges the photoconductive layer 34 within the range of +200 to +700 volts. Theshadow mask 25 is inserted into thepanel 12, and the positively-charged photoconductor is exposed, through the shadow mask, to the light from a xenon flash lamp disposed within a conventional lighthouse (not shown). After each exposure, the lamp is moved to a different position, to duplicate the incident angle of the electron beams from the electron gun. Three exposures are required, from three different lamp positions, to discharge the areas of the photoconductor where the light-emitting phosphors subsequently will be deposited to form the screen. After the exposure step, theshadow mask 25 is removed from thepanel 12, and the panel is moved to a first developer (also not shown). The first developer contains suitably prepared dry-powdered particles of a light-absorptive black matrix screen structure material which is negatively charged by the developer. Theconductive layer 32 is again grounded and negatively-charged matrix particles are expelled from the developer and attracted to the positively-charged, unexposed area of the photoconductive layer 34 to directly develop that area.
The photoconductive layer 34, containing thematrix 23, is uniformly recharged by the discharge apparatus to a positive potential, as described above, for the application of the first of three triboelectrically-charged, dry-powdered, color-emitting phosphor screen structure materials. Theshadow mask 25 is reinserted into thepanel 12 and selected areas of the photoconductive layer 34, corresponding to the locations where green-emitting phosphor material will be deposited, are exposed to light from a first location within the lighthouse to selectively discharge the exposed areas. The first light location approximates the incidence angle of the green phosphor-impinging electron beam. Theshadow mask 25 is removed from thepanel 12, and the panel is moved to a second developer. The second developer contains e.g., dry-powdered particles of green-emitting phosphor screen structure material. The green-emitting phosphor particles are positively-charged by, and expelled from, the developer, repelled by the positively-charged areas of the photoconductive layer 34 andmatrix 23, and deposited onto the discharged, light-exposed areas of the photoconductive layer, in a process known as reversal developing.
The processes of charging, exposing and developing are repeated for the dry-powdered, blue- and red-emitting, phosphor particles of screen structure material. The exposure to light, to selectively discharge the positively-charged areas of the photoconductive layer 34, is made from a second and then from a third position within the lighthouse, to approximate the incidence angles of the blue phosphor- and red phosphor-impinging electron beams, respectively. The triboelectrically-positively-charged, dry-powdered phosphor particles are expelled from a third and then a fourth developer, repelled by the positively-charged areas of the previously deposited screen structure materials, and deposited onto the discharged areas of the photoconductive layer 34, to provide the blue- and red-emitting phosphor elements, respectively.
The screen structure materials, comprising the black matrix material and the green-, blue-, and red-emitting phosphor particles are electrostatically attached, or bonded, to the photoconductive layer 34. The adherence of the screen structure materials can be increased by directly depositing thereon an electrostatically charged dry-powdered filming resin from a fifth developer as described in U.S. Pat. No. 5,028,501issued to P. M. Ritt et al. on Jul. 2, 1991, and incorporated by reference herein for the purpose of disclosure. Theconductive layer 32 is grounded during the deposition of the resin. A substantially uniform positive potential of about 200 to 400 volts is applied to the photoconductive layer and to the overlying screen structure materials using the discharge apparatus, prior to the filming step, to provide an attractive potential and to assure a uniform deposition of the resin which, in this instance, would be charged negatively. The resin is an organic material with a low glass transition temperature/melt flow index of less than about 120° C., and with a pyrolyzation temperature of less than about 400° C. The resin is water insoluble, preferably has an irregular particle shape for better charge distribution, and has a particle size of less than about 50 microns. The preferred material is n-butyl methacrylate; however, other acrylic resins, such as methyl methacrylates and polyethylene waxes, may be used. Between about 1 and 10 grams, and typically about 2 grams, of powdered filming resin is deposited onto thescreen surface 22 of thefaceplate 18. The faceplate is then heated to a temperature of between 100° to 120° C. for about 1 to 5 minutes using a suitable heat source to melt or fuse the resin and to form a substantiallycontinuous film 36 which bonds the screen structure materials to thefaceplate 18. Alternatively, the filming resin may be fused by a suitable chemical vapor. Thefilm 36 is water insoluble and acts as a protective barrier if a subsequent wet-filming step is required to provide additional film thickness or uniformity. If sufficient dry-filming resin is utilized, the subsequent wet-filming step is unnecessary. An aqueous 2 to 4 percent, by weight, solution of boric acid or ammonium oxalate is oversprayed onto thefilm 36 to form a ventilation-promoting coating (not shown). Then the panel is aluminized, as is known in the art, and baked at a temperature of about 425° C. for about 30 to 60 minutes or until the volatilizable organic constituents are driven from the screen assembly. The ventilation-promoting coating begins to bake-out at about 185° C. and produces small pin holes in thealuminum layer 24 which facilitate removal of the organic constituents without blistering the aluminum layer.
To ensure that electrical contact to theconductive layer 32 is established and maintained during the charging, developing and dry filming steps in the electrophotographic screening process and to monitor the deposition of the triboelectrically-changed materials, at least one novelconductive contact patch 38 is provided along an interior portion of thesidewall 20. Preferably, thecontact patch 38 extends from a peripheral portion of . the interior surface, adjacent to theviewing faceplate 18, to near the frit seal edge of the panel and has a substantially rectangular shape with a width of about 5 cm. Preferably, thecontact patch 38 is applied to thesidewall 20 before the solution which forms theconductive layer 32 is coated on the interior surface of thefaceplate 18. Thecontact patch 38 is insoluble in the solutions which form theconductive layer 32 and the photoconductive layer 34. Also, the contact patch is not removed by the 425° C. baking step which volatilizes thelayers 32, 34 and theresin film 36. Thecontact patch 38 includes afirst portion 38a which underlies at least a portion of theconductive layer 32 and is in electrical contact therewith, and asecond portion 38b which extends therefrom and makes electrical contact with one of thestuds 27 to provide a means for electrically interconnecting theshadow mask 25 and thealuminum layer 24 overlying thescreen 22.
Thecontact patch 38 may be formed of any suitable metal film, conductive epoxy, organic or water-based conductor which is resistant to abrasion from the electrical contacts and is insoluble in the solutions which form thelayers 32 and 34. Theconductive contact patch 38 may be applied by depositing an evaporated metal film, by painting, spraying or any other conventional means of deposition. The thickness of thecontact patch 38 thus depends on the material and method of application.
Thecontact patch 38, preferably, is formed by applying a solvent-based solution to two separate areas of thesidewall 20. One of the areas includes one of thestuds 27. The contact patch-forming solution is applied either by painting or spraying through a stencil and care is required to prevent the solution from extending into the viewing area of thefaceplate 18 or onto the edge of the panel which is sealed by theglass frit 21 to thefunnel 15. Typically, the solvent-basedcontact patch 38 has a thickness of about 8000 to 13,000Å and a resistance of less than 250 ohm and, preferably, within the range of 150 to 250 ohms.
A solvent-based or alternative water-based solution for making the conductive contact patch consists essentially of the following ingredients, in weight percent:
______________________________________ solvent 22 to 70 conductive material 62 to 19 other compatible additives balance. ______________________________________
In particular, a formulation for the contact patch-forming, solvent-based solution consists essentially of the following materials, in weight percent:
______________________________________ 5% o-phosphoric acid 1.0 to 3.0 tetraethylsilicate 5.2 to 11.2 toluene 3.2 to 13.2 acetone 5.2 to 11.2 amyl acetate 5.2 to 11.2 methanol 5.2 to 11.2 ethanol 2.0 to 8.0 conductive material 62 to 42. ______________________________________
A suitable conductive material is a graphite-based material, such as Acheson Dag 154 (trade name) manufactured by the Acheson Colloids Co., Port Huron, Mich.
The preferred formulation for the above-described solvent-based solution, in weight percent, is:
______________________________________ 5% o-phosphoric acid 2.0 tetraethylsilicate 8.2 toluene 8.2 acetone 8.2 amyl acetate 8.2 methanol 8.2 ethanol 5.0 Acheson Dag 154 52.0. ______________________________________
An alternative water-based solution for forming thecontact patch 38 consists essentially of the following materials, in weight percent:
______________________________________ surfactant 8 to 12 conductive material 39 to 19 water balance. ______________________________________
More specifically, the preferred aqueous solution consists essentially of the following materials, in weight percent:
______________________________________conductive material 29surfactant 10 pH adjuster 11 DI water 50 ______________________________________
The preferred conductive material is graphite containing a sufficient quantity of a colloidal silicon dioxide such as LUDOX (trade name) manufactured by E. I. duPont, Wilmington, Del., or its equivalent, to prevent aggregation. The surfactant is L-72 Pluronic (trade name), or its equivalent, manufactured by BASF Wyandotte Corp., Parsippany, N.J. The pH adjuster is ammonium hydroxide, and it is added to maintain a pH within the range of 3.5 to 7.5, 5.5 being preferred. When a water-based solution is used to form thecontact patch 38, the patch is formed after theconductive layer 32 is applied to the surface of the substrate, but before the photoconductive layer 34 is formed.