

| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US07/457,113US5081069A (en) | 1989-12-26 | 1989-12-26 | Method for depositing a Tio2 layer using a periodic and simultaneous tilting and rotating platform motion |
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US07/457,113US5081069A (en) | 1989-12-26 | 1989-12-26 | Method for depositing a Tio2 layer using a periodic and simultaneous tilting and rotating platform motion |
| Publication Number | Publication Date |
|---|---|
| US5081069Atrue US5081069A (en) | 1992-01-14 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US07/457,113Expired - LifetimeUS5081069A (en) | 1989-12-26 | 1989-12-26 | Method for depositing a Tio2 layer using a periodic and simultaneous tilting and rotating platform motion |
| Country | Link |
|---|---|
| US (1) | US5081069A (en) |
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| US5380551A (en)* | 1991-12-13 | 1995-01-10 | At&T Corp. | Vapor deposition process for coating articles of manufacture |
| US5352487A (en)* | 1992-08-31 | 1994-10-04 | Gte Products Corporation | Process for the formation of SiO2 films |
| US5376216A (en)* | 1993-03-31 | 1994-12-27 | Dainippon Screen Mfg. Co., Ltd. | Device for holding and rotating a substrate |
| US5777300A (en)* | 1993-11-19 | 1998-07-07 | Tokyo Electron Kabushiki Kaisha | Processing furnace for oxidizing objects |
| US6261648B1 (en)* | 1994-02-15 | 2001-07-17 | Japan Atomic Energy Research Institute | Plasma facing components of nuclear fusion reactors employing tungsten materials |
| US6610375B2 (en) | 1994-02-15 | 2003-08-26 | Japan Atomic Energy Research Institute | Plasma facing components of nuclear fusion reactors employing tungsten materials |
| US5759282A (en)* | 1994-10-17 | 1998-06-02 | United Microelectronics Corporation | Process for evenly depositing ions using a tilting and rotating platform |
| US5763020A (en)* | 1994-10-17 | 1998-06-09 | United Microelectronics Corporation | Process for evenly depositing ions using a tilting and rotating platform |
| US6596595B1 (en) | 1998-02-26 | 2003-07-22 | Micron Technology, Inc. | Forming a conductive structure in a semiconductor device |
| US6420644B1 (en)* | 1999-11-26 | 2002-07-16 | Mitsui High-Tec, Inc. | Solar battery and method of treating a board for a solar battery |
| US20040089232A1 (en)* | 2002-07-22 | 2004-05-13 | Koji Sasaki | Organic film formation apparatus |
| US6897085B2 (en) | 2003-01-21 | 2005-05-24 | Spheral Solar Power, Inc. | Method of fabricating an optical concentrator for a photovoltaic solar cell |
| US20040140001A1 (en)* | 2003-01-21 | 2004-07-22 | Hammerbacher Milfred Dale | Method of fabricating an optical concentrator for a photovoltaic solar cell |
| US7312097B2 (en) | 2003-01-21 | 2007-12-25 | Spheral Solar Power, Inc. | Method of fabricating an optical concentrator for a photovoltaic solar cell |
| US20060185715A1 (en)* | 2003-07-25 | 2006-08-24 | Hammerbacher Milfred D | Photovoltaic apparatus including spherical semiconducting particles |
| US20070281106A1 (en)* | 2006-05-30 | 2007-12-06 | Applied Materials, Inc. | Process chamber for dielectric gapfill |
| CN100405539C (en)* | 2006-07-27 | 2008-07-23 | 华中科技大学 | A micro pen for directly writing electronic/optoelectronic components and a device composed of it |
| US20090120464A1 (en)* | 2007-11-08 | 2009-05-14 | Applied Materials, Inc. | Multi-port pumping system for substrate processing chambers |
| US20090120368A1 (en)* | 2007-11-08 | 2009-05-14 | Applied Materials, Inc. | Rotating temperature controlled substrate pedestal for film uniformity |
| US20090120584A1 (en)* | 2007-11-08 | 2009-05-14 | Applied Materials, Inc. | Counter-balanced substrate support |
| US7964040B2 (en) | 2007-11-08 | 2011-06-21 | Applied Materials, Inc. | Multi-port pumping system for substrate processing chambers |
| US20090277587A1 (en)* | 2008-05-09 | 2009-11-12 | Applied Materials, Inc. | Flowable dielectric equipment and processes |
| US9144147B2 (en) | 2011-01-18 | 2015-09-22 | Applied Materials, Inc. | Semiconductor processing system and methods using capacitively coupled plasma |
| US8889566B2 (en) | 2012-09-11 | 2014-11-18 | Applied Materials, Inc. | Low cost flowable dielectric films |
| US9018108B2 (en) | 2013-01-25 | 2015-04-28 | Applied Materials, Inc. | Low shrinkage dielectric films |
| US9412581B2 (en) | 2014-07-16 | 2016-08-09 | Applied Materials, Inc. | Low-K dielectric gapfill by flowable deposition |
| US12009228B2 (en) | 2015-02-03 | 2024-06-11 | Applied Materials, Inc. | Low temperature chuck for plasma processing systems |
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| Date | Code | Title | Description |
|---|---|---|---|
| AS | Assignment | Owner name:TEXAS INSTRUMENTS INCORPORATED, TEXAS Free format text:ASSIGNMENT OF ASSIGNORS INTEREST.;ASSIGNOR:PARKER, SIDNEY G.;REEL/FRAME:005202/0983 Effective date:19891221 Owner name:TEXAS INSTRUMENTS INCORPORATED, TEXAS Free format text:ASSIGNMENT OF ASSIGNORS INTEREST.;ASSIGNOR:WOOD, JERRY;REEL/FRAME:005202/0982 Effective date:19891221 Owner name:TEXAS INSTRUMENTS INCORPORATED, TEXAS Free format text:ASSIGNMENT OF ASSIGNORS INTEREST.;ASSIGNOR:TURNER, ROBERT T.;REEL/FRAME:005202/0980 Effective date:19891221 | |
| AS | Assignment | Owner name:TEXAS INSTRUMENTS INCORPORATION, 13500 NORTH CENTR Free format text:ASSIGNMENT OF ASSIGNORS INTEREST.;ASSIGNOR:FISCHER, CRAIG A.;REEL/FRAME:005525/0232 Effective date:19900102 | |
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