






______________________________________ Parameters Tolerances* ______________________________________ Average Power: 320 W (-60 W, +55 W) Preheating Temperature: 500° F. min. (-0° F., +540° F.) Defocusing: -0.050" (±0.020") Pulse On-time: 10 ms (-4ms, +2ms) Pulse Off-time: 10 ms (-8ms, +40ms) No. of Pulses: 4 (±1) ______________________________________ *Tolerances for individual parameter variation.
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US06/301,796US4441008A (en) | 1981-09-14 | 1981-09-14 | Method of drilling ultrafine channels through glass |
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US06/301,796US4441008A (en) | 1981-09-14 | 1981-09-14 | Method of drilling ultrafine channels through glass |
| Publication Number | Publication Date |
|---|---|
| US4441008Atrue US4441008A (en) | 1984-04-03 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US06/301,796Expired - Fee RelatedUS4441008A (en) | 1981-09-14 | 1981-09-14 | Method of drilling ultrafine channels through glass |
| Country | Link |
|---|---|
| US (1) | US4441008A (en) |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4604513A (en)* | 1985-05-07 | 1986-08-05 | Lim Basilio Y | Combination of a laser and a controller for trimming a metallized dielectric film capacitor |
| US4647476A (en)* | 1984-03-05 | 1987-03-03 | General Electric Company | Insulating glass body with electrical feedthroughs and method of preparation |
| US4710605A (en)* | 1985-04-08 | 1987-12-01 | American Telephone And Telegraph Company, At&T Bell Laboratories | Laser nibbling of optical waveguides |
| US5427825A (en)* | 1993-02-09 | 1995-06-27 | Rutgers, The State University | Localized surface glazing of ceramic articles |
| WO1997043077A1 (en)* | 1996-05-16 | 1997-11-20 | Sendx Medical, Inc. | Method for drilling micro-miniature through holes in a sensor substrate |
| US20030006220A1 (en)* | 2001-07-02 | 2003-01-09 | Michael Cummings | Method of ablating an opening in a hard, non-metallic substrate |
| US6630643B2 (en)* | 2001-07-30 | 2003-10-07 | Cypress Semiconductor Corporation | Method and structure for forming metallic interconnections using directed thermal diffusion |
| US20040245226A1 (en)* | 2001-08-08 | 2004-12-09 | Gert Callies | Method and device for creating holes in workpieces by using laser beams |
| US20070173346A1 (en)* | 2006-01-24 | 2007-07-26 | Fu Sheng Industrial Co., Ltd. | Golf club head having a surface-modified structure and a surface modifying method therefor |
| WO2016160391A1 (en)* | 2015-03-27 | 2016-10-06 | Corning Incorporated | Gas permeable window and method of fabricating the same |
| US9676167B2 (en) | 2013-12-17 | 2017-06-13 | Corning Incorporated | Laser processing of sapphire substrate and related applications |
| US20170189991A1 (en)* | 2014-07-14 | 2017-07-06 | Corning Incorporated | Systems and methods for processing transparent materials using adjustable laser beam focal lines |
| US9701563B2 (en) | 2013-12-17 | 2017-07-11 | Corning Incorporated | Laser cut composite glass article and method of cutting |
| JP2017186185A (en)* | 2016-04-01 | 2017-10-12 | 三菱電機株式会社 | Laser processing device and laser processing method |
| US9815730B2 (en) | 2013-12-17 | 2017-11-14 | Corning Incorporated | Processing 3D shaped transparent brittle substrate |
| US9815144B2 (en) | 2014-07-08 | 2017-11-14 | Corning Incorporated | Methods and apparatuses for laser processing materials |
| US9850159B2 (en) | 2012-11-20 | 2017-12-26 | Corning Incorporated | High speed laser processing of transparent materials |
| US9850160B2 (en) | 2013-12-17 | 2017-12-26 | Corning Incorporated | Laser cutting of display glass compositions |
| US10047001B2 (en) | 2014-12-04 | 2018-08-14 | Corning Incorporated | Glass cutting systems and methods using non-diffracting laser beams |
| US10144093B2 (en) | 2013-12-17 | 2018-12-04 | Corning Incorporated | Method for rapid laser drilling of holes in glass and products made therefrom |
| US10173916B2 (en) | 2013-12-17 | 2019-01-08 | Corning Incorporated | Edge chamfering by mechanically processing laser cut glass |
| US10233112B2 (en) | 2013-12-17 | 2019-03-19 | Corning Incorporated | Laser processing of slots and holes |
| US10252931B2 (en) | 2015-01-12 | 2019-04-09 | Corning Incorporated | Laser cutting of thermally tempered substrates |
| US10280108B2 (en) | 2013-03-21 | 2019-05-07 | Corning Laser Technologies GmbH | Device and method for cutting out contours from planar substrates by means of laser |
| US10335902B2 (en) | 2014-07-14 | 2019-07-02 | Corning Incorporated | Method and system for arresting crack propagation |
| US10377658B2 (en) | 2016-07-29 | 2019-08-13 | Corning Incorporated | Apparatuses and methods for laser processing |
| US10421683B2 (en) | 2013-01-15 | 2019-09-24 | Corning Laser Technologies GmbH | Method and device for the laser-based machining of sheet-like substrates |
| US10522963B2 (en) | 2016-08-30 | 2019-12-31 | Corning Incorporated | Laser cutting of materials with intensity mapping optical system |
| US10526234B2 (en) | 2014-07-14 | 2020-01-07 | Corning Incorporated | Interface block; system for and method of cutting a substrate being transparent within a range of wavelengths using such interface block |
| US10611667B2 (en) | 2014-07-14 | 2020-04-07 | Corning Incorporated | Method and system for forming perforations |
| US10626040B2 (en) | 2017-06-15 | 2020-04-21 | Corning Incorporated | Articles capable of individual singulation |
| US10688599B2 (en) | 2017-02-09 | 2020-06-23 | Corning Incorporated | Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines |
| US10730783B2 (en) | 2016-09-30 | 2020-08-04 | Corning Incorporated | Apparatuses and methods for laser processing transparent workpieces using non-axisymmetric beam spots |
| US10752534B2 (en) | 2016-11-01 | 2020-08-25 | Corning Incorporated | Apparatuses and methods for laser processing laminate workpiece stacks |
| WO2021041929A1 (en)* | 2019-08-30 | 2021-03-04 | Corning Incorporated | Method and apparatus for forming holes in brittle materials assisted by stress reduction through heating |
| US11062986B2 (en) | 2017-05-25 | 2021-07-13 | Corning Incorporated | Articles having vias with geometry attributes and methods for fabricating the same |
| US11078112B2 (en) | 2017-05-25 | 2021-08-03 | Corning Incorporated | Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same |
| US11114309B2 (en) | 2016-06-01 | 2021-09-07 | Corning Incorporated | Articles and methods of forming vias in substrates |
| US11111170B2 (en) | 2016-05-06 | 2021-09-07 | Corning Incorporated | Laser cutting and removal of contoured shapes from transparent substrates |
| US11186060B2 (en) | 2015-07-10 | 2021-11-30 | Corning Incorporated | Methods of continuous fabrication of holes in flexible substrate sheets and products relating to the same |
| US11194255B2 (en)* | 2017-10-04 | 2021-12-07 | Gigaphoton Inc. | Laser processing method and laser processing system |
| US11542190B2 (en) | 2016-10-24 | 2023-01-03 | Corning Incorporated | Substrate processing station for laser-based machining of sheet-like glass substrates |
| US11554984B2 (en) | 2018-02-22 | 2023-01-17 | Corning Incorporated | Alkali-free borosilicate glasses with low post-HF etch roughness |
| US11556039B2 (en) | 2013-12-17 | 2023-01-17 | Corning Incorporated | Electrochromic coated glass articles and methods for laser processing the same |
| US11774233B2 (en) | 2016-06-29 | 2023-10-03 | Corning Incorporated | Method and system for measuring geometric parameters of through holes |
| US11773004B2 (en) | 2015-03-24 | 2023-10-03 | Corning Incorporated | Laser cutting and processing of display glass compositions |
| DE102022203802A1 (en) | 2022-04-14 | 2023-10-19 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein | Method for processing a safety glass pane |
| US12180108B2 (en) | 2017-12-19 | 2024-12-31 | Corning Incorporated | Methods for etching vias in glass-based articles employing positive charge organic molecules |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3601576A (en)* | 1967-09-25 | 1971-08-24 | Laser Tech Sa | Method for boring workpieces by laser pulses |
| GB1261706A (en)* | 1968-05-31 | 1972-01-26 | British Oxygen Co Ltd | Cutting workpieces |
| US3742182A (en)* | 1971-12-27 | 1973-06-26 | Coherent Radiation | Method for scanning mask forming holes with a laser beam |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3601576A (en)* | 1967-09-25 | 1971-08-24 | Laser Tech Sa | Method for boring workpieces by laser pulses |
| GB1261706A (en)* | 1968-05-31 | 1972-01-26 | British Oxygen Co Ltd | Cutting workpieces |
| US3742182A (en)* | 1971-12-27 | 1973-06-26 | Coherent Radiation | Method for scanning mask forming holes with a laser beam |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4647476A (en)* | 1984-03-05 | 1987-03-03 | General Electric Company | Insulating glass body with electrical feedthroughs and method of preparation |
| US4710605A (en)* | 1985-04-08 | 1987-12-01 | American Telephone And Telegraph Company, At&T Bell Laboratories | Laser nibbling of optical waveguides |
| US4604513A (en)* | 1985-05-07 | 1986-08-05 | Lim Basilio Y | Combination of a laser and a controller for trimming a metallized dielectric film capacitor |
| US5427825A (en)* | 1993-02-09 | 1995-06-27 | Rutgers, The State University | Localized surface glazing of ceramic articles |
| US5595583A (en)* | 1993-02-09 | 1997-01-21 | Rutgers, The State University | Apparatus for localized surface glazing of ceramic articles |
| WO1997043077A1 (en)* | 1996-05-16 | 1997-11-20 | Sendx Medical, Inc. | Method for drilling micro-miniature through holes in a sensor substrate |
| EP1409192A4 (en)* | 2001-07-02 | 2008-08-06 | Virtek Laser Systems Inc | Method of ablating an opening in a hard, non-metallic substrate |
| US6864460B2 (en) | 2001-07-02 | 2005-03-08 | Virtek Laser Systems, Inc. | Method of ablating an opening in a hard, non-metallic substrate |
| US20030006220A1 (en)* | 2001-07-02 | 2003-01-09 | Michael Cummings | Method of ablating an opening in a hard, non-metallic substrate |
| US6630643B2 (en)* | 2001-07-30 | 2003-10-07 | Cypress Semiconductor Corporation | Method and structure for forming metallic interconnections using directed thermal diffusion |
| US20040245226A1 (en)* | 2001-08-08 | 2004-12-09 | Gert Callies | Method and device for creating holes in workpieces by using laser beams |
| US7294807B2 (en)* | 2001-08-08 | 2007-11-13 | Robert Bosch Gmbh | Method and device for drilling holes in workpieces by means of laser beams |
| US20070173346A1 (en)* | 2006-01-24 | 2007-07-26 | Fu Sheng Industrial Co., Ltd. | Golf club head having a surface-modified structure and a surface modifying method therefor |
| US9850159B2 (en) | 2012-11-20 | 2017-12-26 | Corning Incorporated | High speed laser processing of transparent materials |
| US11028003B2 (en) | 2013-01-15 | 2021-06-08 | Corning Laser Technologies GmbH | Method and device for laser-based machining of flat substrates |
| US11345625B2 (en) | 2013-01-15 | 2022-05-31 | Corning Laser Technologies GmbH | Method and device for the laser-based machining of sheet-like substrates |
| US10421683B2 (en) | 2013-01-15 | 2019-09-24 | Corning Laser Technologies GmbH | Method and device for the laser-based machining of sheet-like substrates |
| US11713271B2 (en) | 2013-03-21 | 2023-08-01 | Corning Laser Technologies GmbH | Device and method for cutting out contours from planar substrates by means of laser |
| US10280108B2 (en) | 2013-03-21 | 2019-05-07 | Corning Laser Technologies GmbH | Device and method for cutting out contours from planar substrates by means of laser |
| US10392290B2 (en) | 2013-12-17 | 2019-08-27 | Corning Incorporated | Processing 3D shaped transparent brittle substrate |
| US10183885B2 (en) | 2013-12-17 | 2019-01-22 | Corning Incorporated | Laser cut composite glass article and method of cutting |
| US9850160B2 (en) | 2013-12-17 | 2017-12-26 | Corning Incorporated | Laser cutting of display glass compositions |
| US11148225B2 (en) | 2013-12-17 | 2021-10-19 | Corning Incorporated | Method for rapid laser drilling of holes in glass and products made therefrom |
| US10144093B2 (en) | 2013-12-17 | 2018-12-04 | Corning Incorporated | Method for rapid laser drilling of holes in glass and products made therefrom |
| US10173916B2 (en) | 2013-12-17 | 2019-01-08 | Corning Incorporated | Edge chamfering by mechanically processing laser cut glass |
| US10179748B2 (en) | 2013-12-17 | 2019-01-15 | Corning Incorporated | Laser processing of sapphire substrate and related applications |
| US10442719B2 (en) | 2013-12-17 | 2019-10-15 | Corning Incorporated | Edge chamfering methods |
| US10233112B2 (en) | 2013-12-17 | 2019-03-19 | Corning Incorporated | Laser processing of slots and holes |
| US9676167B2 (en) | 2013-12-17 | 2017-06-13 | Corning Incorporated | Laser processing of sapphire substrate and related applications |
| US9815730B2 (en) | 2013-12-17 | 2017-11-14 | Corning Incorporated | Processing 3D shaped transparent brittle substrate |
| US10293436B2 (en) | 2013-12-17 | 2019-05-21 | Corning Incorporated | Method for rapid laser drilling of holes in glass and products made therefrom |
| US11556039B2 (en) | 2013-12-17 | 2023-01-17 | Corning Incorporated | Electrochromic coated glass articles and methods for laser processing the same |
| US10611668B2 (en) | 2013-12-17 | 2020-04-07 | Corning Incorporated | Laser cut composite glass article and method of cutting |
| US10597321B2 (en) | 2013-12-17 | 2020-03-24 | Corning Incorporated | Edge chamfering methods |
| US9701563B2 (en) | 2013-12-17 | 2017-07-11 | Corning Incorporated | Laser cut composite glass article and method of cutting |
| US11697178B2 (en) | 2014-07-08 | 2023-07-11 | Corning Incorporated | Methods and apparatuses for laser processing materials |
| US9815144B2 (en) | 2014-07-08 | 2017-11-14 | Corning Incorporated | Methods and apparatuses for laser processing materials |
| US11648623B2 (en)* | 2014-07-14 | 2023-05-16 | Corning Incorporated | Systems and methods for processing transparent materials using adjustable laser beam focal lines |
| US20170189991A1 (en)* | 2014-07-14 | 2017-07-06 | Corning Incorporated | Systems and methods for processing transparent materials using adjustable laser beam focal lines |
| US10526234B2 (en) | 2014-07-14 | 2020-01-07 | Corning Incorporated | Interface block; system for and method of cutting a substrate being transparent within a range of wavelengths using such interface block |
| US10611667B2 (en) | 2014-07-14 | 2020-04-07 | Corning Incorporated | Method and system for forming perforations |
| US10335902B2 (en) | 2014-07-14 | 2019-07-02 | Corning Incorporated | Method and system for arresting crack propagation |
| US11014845B2 (en) | 2014-12-04 | 2021-05-25 | Corning Incorporated | Method of laser cutting glass using non-diffracting laser beams |
| US10047001B2 (en) | 2014-12-04 | 2018-08-14 | Corning Incorporated | Glass cutting systems and methods using non-diffracting laser beams |
| US10252931B2 (en) | 2015-01-12 | 2019-04-09 | Corning Incorporated | Laser cutting of thermally tempered substrates |
| US11773004B2 (en) | 2015-03-24 | 2023-10-03 | Corning Incorporated | Laser cutting and processing of display glass compositions |
| US10525657B2 (en) | 2015-03-27 | 2020-01-07 | Corning Incorporated | Gas permeable window and method of fabricating the same |
| WO2016160391A1 (en)* | 2015-03-27 | 2016-10-06 | Corning Incorporated | Gas permeable window and method of fabricating the same |
| US11186060B2 (en) | 2015-07-10 | 2021-11-30 | Corning Incorporated | Methods of continuous fabrication of holes in flexible substrate sheets and products relating to the same |
| JP2017186185A (en)* | 2016-04-01 | 2017-10-12 | 三菱電機株式会社 | Laser processing device and laser processing method |
| US11111170B2 (en) | 2016-05-06 | 2021-09-07 | Corning Incorporated | Laser cutting and removal of contoured shapes from transparent substrates |
| US11114309B2 (en) | 2016-06-01 | 2021-09-07 | Corning Incorporated | Articles and methods of forming vias in substrates |
| US11774233B2 (en) | 2016-06-29 | 2023-10-03 | Corning Incorporated | Method and system for measuring geometric parameters of through holes |
| US10377658B2 (en) | 2016-07-29 | 2019-08-13 | Corning Incorporated | Apparatuses and methods for laser processing |
| US10522963B2 (en) | 2016-08-30 | 2019-12-31 | Corning Incorporated | Laser cutting of materials with intensity mapping optical system |
| US11130701B2 (en) | 2016-09-30 | 2021-09-28 | Corning Incorporated | Apparatuses and methods for laser processing transparent workpieces using non-axisymmetric beam spots |
| US10730783B2 (en) | 2016-09-30 | 2020-08-04 | Corning Incorporated | Apparatuses and methods for laser processing transparent workpieces using non-axisymmetric beam spots |
| US11542190B2 (en) | 2016-10-24 | 2023-01-03 | Corning Incorporated | Substrate processing station for laser-based machining of sheet-like glass substrates |
| US10752534B2 (en) | 2016-11-01 | 2020-08-25 | Corning Incorporated | Apparatuses and methods for laser processing laminate workpiece stacks |
| US10688599B2 (en) | 2017-02-09 | 2020-06-23 | Corning Incorporated | Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines |
| US11062986B2 (en) | 2017-05-25 | 2021-07-13 | Corning Incorporated | Articles having vias with geometry attributes and methods for fabricating the same |
| US11078112B2 (en) | 2017-05-25 | 2021-08-03 | Corning Incorporated | Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same |
| US11972993B2 (en) | 2017-05-25 | 2024-04-30 | Corning Incorporated | Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same |
| US10626040B2 (en) | 2017-06-15 | 2020-04-21 | Corning Incorporated | Articles capable of individual singulation |
| US11604416B2 (en) | 2017-10-04 | 2023-03-14 | Gigaphoton Inc. | Laser processing method and laser processing system |
| US11194255B2 (en)* | 2017-10-04 | 2021-12-07 | Gigaphoton Inc. | Laser processing method and laser processing system |
| US12180108B2 (en) | 2017-12-19 | 2024-12-31 | Corning Incorporated | Methods for etching vias in glass-based articles employing positive charge organic molecules |
| US11554984B2 (en) | 2018-02-22 | 2023-01-17 | Corning Incorporated | Alkali-free borosilicate glasses with low post-HF etch roughness |
| CN114667197A (en)* | 2019-08-30 | 2022-06-24 | 康宁股份有限公司 | Method and device for forming a hole in a brittle material with the aid of stress reduction by heating |
| WO2021041929A1 (en)* | 2019-08-30 | 2021-03-04 | Corning Incorporated | Method and apparatus for forming holes in brittle materials assisted by stress reduction through heating |
| US20220288723A1 (en)* | 2019-08-30 | 2022-09-15 | Corning Incorporated | Method and apparatus for forming holes in brittle materials assisted by stress reduction through heating |
| DE102022203802A1 (en) | 2022-04-14 | 2023-10-19 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein | Method for processing a safety glass pane |
| Publication | Publication Date | Title |
|---|---|---|
| US4441008A (en) | Method of drilling ultrafine channels through glass | |
| US11713271B2 (en) | Device and method for cutting out contours from planar substrates by means of laser | |
| US11884573B2 (en) | Method and device for separation of glass portions or glass ceramic portions | |
| US20190177203A1 (en) | Laser cutting of thermally tempered substrates | |
| TWI677394B (en) | Method of closed form release for brittle materials using burst ultrafast laser pulses | |
| KR102230762B1 (en) | Method of and device for the laser-based machining of sheet-like substrates using a laser beam focal line | |
| US6768081B2 (en) | Method and laser system for production of high quality laser-induced damage images by using material processing made before and after image creation | |
| KR102318041B1 (en) | Method and device for the laser-based working of two-dimensional, crystalline substrates, in particular semiconductor substrates | |
| US6143382A (en) | Glass substrate having fine holes | |
| US20120067855A1 (en) | Femtosecond laser pulse surface structuring methods and materials resulting therefrom | |
| Tokarev et al. | High-aspect-ratio microdrilling of polymers with UV laser ablation: experiment with analytical model | |
| JP2017511777A (en) | Edge chamfering method | |
| US20150246415A1 (en) | Method and apparatus for material processing using multiple filamentation of burst ultrafast laser pulses | |
| CN112839908B (en) | Laser processing of brittle material separation and release | |
| Mishchik et al. | Ultrashort pulse laser cutting of glass by controlled fracture propagation | |
| US20200061750A1 (en) | Mitigating low surface quality | |
| TWI762517B (en) | Electrochromic coated glass articles and methods for laser processing the same | |
| US20240335909A1 (en) | Method of and apparatus for cutting a substrate or preparing a substrate for cleaving | |
| CN110770180B (en) | Controlled separation of laser processed brittle materials | |
| Abramov et al. | Laser forming of holes in brittle materials assisted by stress reduction through heating | |
| Sen et al. | An experimental investigation into fibre laser micro-drilling of quartz | |
| US20230132480A1 (en) | Methods for laser cutting glass substrates through narrow apertures | |
| Kuriyama et al. | Microhole drilling on glass plates by femtosecond laser pulses | |
| Schneider et al. | New experimental approach to study laser matter interaction during drilling in percussion regime | |
| Jandeleit et al. | Investigation of laser-induced ablation processes and production of microstructures by picosecond laser pulses |
| Date | Code | Title | Description |
|---|---|---|---|
| AS | Assignment | Owner name:FORD MOTOR COMPANY,DEARBORN,MI. A CORP.OF DE. Free format text:ASSIGNMENT OF ASSIGNORS INTEREST.;ASSIGNOR:CHANG, UCK I.;REEL/FRAME:003931/0184 Effective date:19810909 | |
| MAFP | Maintenance fee payment | Free format text:PAYMENT OF MAINTENANCE FEE, 4TH YEAR, PL 96-517 (ORIGINAL EVENT CODE: M170); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY Year of fee payment:4 | |
| MAFP | Maintenance fee payment | Free format text:PAYMENT OF MAINTENANCE FEE, 8TH YEAR, PL 96-517 (ORIGINAL EVENT CODE: M171); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY Year of fee payment:8 | |
| FEPP | Fee payment procedure | Free format text:PAYOR NUMBER ASSIGNED (ORIGINAL EVENT CODE: ASPN); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY | |
| FEPP | Fee payment procedure | Free format text:MAINTENANCE FEE REMINDER MAILED (ORIGINAL EVENT CODE: REM.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY | |
| LAPS | Lapse for failure to pay maintenance fees | ||
| FP | Lapsed due to failure to pay maintenance fee | Effective date:19960403 | |
| STCH | Information on status: patent discontinuation | Free format text:PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362 |