Movatterモバイル変換


[0]ホーム

URL:


US2457510A - Electroplating apparatus - Google Patents

Electroplating apparatus
Download PDF

Info

Publication number
US2457510A
US2457510AUS642921AUS64292146AUS2457510AUS 2457510 AUS2457510 AUS 2457510AUS 642921 AUS642921 AUS 642921AUS 64292146 AUS64292146 AUS 64292146AUS 2457510 AUS2457510 AUS 2457510A
Authority
US
United States
Prior art keywords
electrode
housing
work
switch
electroplating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US642921A
Inventor
Delbert G Van Ornum
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by IndividualfiledCriticalIndividual
Priority to US642921ApriorityCriticalpatent/US2457510A/en
Application grantedgrantedCritical
Publication of US2457510ApublicationCriticalpatent/US2457510A/en
Anticipated expirationlegal-statusCritical
Expired - Lifetimelegal-statusCriticalCurrent

Links

Images

Classifications

Definitions

Landscapes

Description

DEC. 28, 1948. V G VAN ORNUM 2,457,510
'I ELECTRPLATING APPARATUS Filed Jan/25, 194e y 2 sheen-sheet 1 Dec. 28, 1948. D. G. VAN ORNUM i ELECTROPLATING APPARATUS Filed Jan. 25, 1946v 2 Sheets-Sheet 2 lll vel/lor Patented Dec. 28, 1948 UNITED STATES PATENT OFFICE ELECTROPLATING APPARATUS Delbert G. .Van Ornum, Great Falls, Mont.
Application January 23, 1946, Serial No. .642,921
4 Claims. (Cl. 204-224) The present invention relates to new and useful improvements in electroplating apparatus and more particularly to a machine for accurately building up to exact dimensions various types of metal surfaces, such as shafts, internal or external cylinder walls, or flat surfaces by means of an electrode mounted for movement over the work and maintained in slightly spaced relation from the work While an electroplating solution bridges the space between the work and the electrode.
An important object of the invention is to provide a yieldable mounting for the electrode embodying spring means for holding the electrode in closely spaced relation with respect to the work and an electric switch operable to open a circuit connected to the electrode upon a building-up of the surface of the work to a predetermined thickness through a movement ofA the electrode by the building action.
A further object of the invention is to provide a device of this character adapted for operation while immersed in the electroplating solution, or in which the solution may be applied to the contacting end of the electrode and conned between the electrode and the surface of the work during the electroplating action.
A still further object is to provide a device of this character of simple and practical construction, which is eifcient and reliable in operation, relatively inexpensive to manufacture and otherwise well adapted for the purposes for which the same is intended.
Other objects and advantages reside in the details of construction and operation as more fully hereinafter described and claimed, reference being had to the accompanying drawings forming part hereof, wherein like numerals refer to like parts throughout, and in which:
Figure 1 is a perspective View.
Figure 2 is an enlarged plan view of the switch with the cover plate for the switch housing removed.
Figure 3 is a fragmentary longitudinal sectional view of the contacting end of the electrode.
Figure 4 is a transverse sectional view taken on a line 4 4 of Figure 2.
Figure 5 is an enlarged bottom plan View of the rear end of the electrode with the cover plate for the electrode housing removed.
Figure 6 is an enlarged longitudinal sectional View through the switch housing.
Figure 7 is a fragmentary side elevational view of the contacting end of the electrode showing an applicator attached thereto for the electroplating solution, and
Figures is a perspective view of the switchoperating arm. y
Referring now to the drawings in detail and first with respect to the form of invention illustrated in Figures 1 to 6 inclusive thenumeral 5 designates an elongated substantially flat housing of insulation material having its bottom surface formed with a longitudinally extending channel or groove 6 open at one end of thehousing and having an electrode in the form of a bar 'I slidably` mounted therein.
l The electrode 'I is projected forwardly at the frontend of thehousing 5 by means of a coil spring -8 positioned against the rear end `ofthe electrode at thechannel 6, the spring forming a conductor between the electrode and a terminal 9 extending outwardly through the top of the housing- 5 and designed to be connectedin an electric circuit in a manner and for a purpose presently clear.
The front outer end of the electrode 'l is bifurcated as shown at I0 and in which is rotatably mounted an/insulation non-conducting disk- II by means of a pin or rivet I2 and also rotatably mounted on the pin I2 at one side of the disk II is a disk I3 of conductive material and of a diameter less than the disk I I as shown to advantage in Figure 3 of the drawings.
One edge of the electrode 'I is formed with rack teeth I4 engaging a pinion I5 secured to the lower end of a shaft I6 journaled in thehousing 5 and projecting upwardly therefrom into a liquidtight switch housing I7 secured on top of the housing'E. An arm I8 is positioned in the switch housing and secured to the upper end of the shaft I6 for swinging the arm in one direction in accordance with a predetermined inward sliding movement of the electrode 1.
The arm I8 is of non-conductive material and engages one side of a Aresilient switch arm I9 `of conductive material which has one end anchored in a split post 2B of nom-conductive material rising in the housing` Il. The free end of the switch arm I9 is provided with a breaker point 2l adapted for movement into and out of engagement with :astationary breaker point 22, the switch arm vand thebreaker point 22 havingcircuit wires 23 and 24 -connected thereto and extending outwardly through adjacent ends of the housing II for a purpose presently seen. The switch housing I I is closed by a liquid-tight cover plate 25. The housing is designed to be partly immersed, that is, to the housing I'I, in an electroplating solution 3 with the insulation disk I I positioned to travel against the surface of work also immersed in the solution and thehousing 5 and electrode 'I are de-j signed to be moved in a xed path to travel along the surface of the work, by xing thehousing 5 in a lathe, or the like, not shown. The insulation disk I I is held against the surface of the work by the spring 8 which projects the electrode 'I outwardly of thehousing 5 therebyrreleasine the switch .arm Iza to close thebreaker points 2l and 22.
The electrode 'I is designed to be interposed in a suitable electric circuit, a diagrammatic representation of which has been shown in Fig-ure 1' with a battery I3 representing the source oi electrical energy and grounded as at 32 with -a line 33v to one side 34 0f a spring` opened solenoidac:
switch 35 remote from the device and outside of the solution, lsaidline 33 having a control switch 3E therein. Theother side 37 of said switch 35 is connected by a line 38A to the terminal'of the electrode l. Thewire 23 branches from theline 33 and thewire 24 extends to one sideaof thesolenoid 33 of said Iswitch 35 :and which is ground-` -ed-asat 461 to` be energized when the breaker `points ZI, 22 are closed and therebt7 operate the core dI to close said switch 35.
lThe dev-ice i-s moved, as bythe means previousM vl'ymentioned, over the-work, as shown'for instance at 29,- to be eleotroplated and the electrode l is Ynormally' extended outwardly of the housing y5 vby the spring 8 so thatthebreaker points 2l, 22
are closed. Therefore, with the switch 35 closed,
thesolenoid 39 will vbe energized to maintain the `s-olenoidao switch 35 closed and the electrode `I vwillbe energized. As they surface of thev work- 29, over which the. disks Il `and I3 travel, is built up, thev electrode 'If w-ill be' shoved inwardly *of the housing' 5 until a predetermined thickness of electroplati-ng isattained, whereupon, the Iarm Ils will be actuated by the raoliz'y I4 and. pinion I5 to move the switch arm I 9 to separate the breakerl points alg, 2.2, whereupon, thesolenoidv 39 willk be deener- 'goed to permit the soienoidac Switch at` to open and thereby deenergiie the electrode 1:, in a mannen-whiohwill b e clear.
As will be understood, when the brealierwpoints 2.1i, 22 are closed, or engagf'ed,I and the solenoidac Aswitch 35 closed', electric current will flow through the electrode 'l1 and solution, not shown, wherer by the Work 23:, as shown, will be electroplatedaccording to the usual Well known process, and when the. electrode. 'l is deenergized, in the manner described in the foregoing, the` electroplating processwill be stopped. 1
In Figure 7', I' have illustrated a modiiied form of lthe invention which comprises atube 26. secured to the outer end of the electrodey 1a, by a bracket 21. and attached' to. the-discharge end of the tube is a wick 2B positioned. beneath the tube and wiping against the work 29) immediately above the conductor disk I3 a and non-conductive disk I I', the tube beingy adapted to supply electro.- plating solution tothe wick for action thereon bfy the electrode to electroplate the` surface V0f the work.
vIn view of the foregoing descriptionL taken in conjunction withy the accompanying drawings it is believed; that a clear understanding-of the` Coni.-
structiOn, operation and advantages of the. device will be' kquite apparent to those skilled in this art. A more detailed description is accordinglydeemed unnecessary;
It is to. be understood, however, thatA even thoughr there. is herein shown and: described. .a
preferred embodiment of the invention the same is susceptible to certain changes fully comprehended by the spirit of the invention as herein described andthe scope of th-e appended claims.
Having thus described the invention, what is Y ing slidably mounted in said housing for retractiontherein;workeengaging means of insulation material secured to and extending beyond said electrode'for causing retraction of the electrode l i; intosaid housing as the thickness of the electroplating on the work increases, a switch carried b'y saidv housing for controlling an electric circuit in which the electrode is interposed, and means for opening said switch operative by retractionV of said electrode in a predetermined degree.,
2. Anfelectroplating device comprising a housing .of non-conductive material and adapted to be moved in a iixed path over a piece of work lto be electroplated,r an electrode projecting out vof said housing to traveltherewith with one end in close proximity to the work, said electrode being slidably mounted in .said housing for retraction therein, work-engaging means of insulation material secured to and extending beyond saidk electrode for-causing retraction ofthe electrodeinto said housing as the thickness of the eiectroplating on the work increases, a switch carried by said housing for controlling an electrio circuit in .which the electrode isr interposed,
means for opening said switch operative by rem traction of said electrode ina predetermined de- V,cg-roda terminal on said housing adapted to. be
interposed in said circuit',l and spring means for opposing retraction` of said electrode and forming an electrical lconductor between said electrode and terminal.
3.` -An electroplating device comprising a housing of nonconductive` material and adapted to be moved in a fixed path over a piece of work to be electroplated, anelectrode, projecting out of said housing to. travel `therewith with one endv in, close. proximity to the work,r said-electrode being: sldably, mounted in saidv housingk for retraction, therein,- work-engaging means of, insulationv material secured to and extending beyond f said electrode for causing retraction4 of" the electrede into. said housingas the thickness of the vto be electroplated, anhelectrode projectingv out of` said' housing to travel' therewith with one end in close proximity to the work, said Aelectrode be'- ing',K slidalolyA mounted` in said housing for retraco tionl therein, 'work-engaging means Y of insulation material secured sto andl extending beyond said electrode vfor causing retraction of the electrode into said housing;V as the thickness of the electroplating on thework increases', a switch carried 5 6 in which the electrode is interposed, means for opening said switch operative by retraction of REFERENCES CITED said electrode in a predetermined degreey and The following references are of record in the means on said electrode for supplying electrole of this patenti plating Solution between Said electrode and the 5 work.
DELBERT G. VAN ORNUM. Number Name Date 1,805,215 Hammond May 12, 1931 1,856,409 Bryce May 3, 1932 10 FOREIGN PATENTS Number Country Date 18,643 Great Britain 1899
US642921A1946-01-231946-01-23Electroplating apparatusExpired - LifetimeUS2457510A (en)

Priority Applications (1)

Application NumberPriority DateFiling DateTitle
US642921AUS2457510A (en)1946-01-231946-01-23Electroplating apparatus

Applications Claiming Priority (1)

Application NumberPriority DateFiling DateTitle
US642921AUS2457510A (en)1946-01-231946-01-23Electroplating apparatus

Publications (1)

Publication NumberPublication Date
US2457510Atrue US2457510A (en)1948-12-28

Family

ID=24578591

Family Applications (1)

Application NumberTitlePriority DateFiling Date
US642921AExpired - LifetimeUS2457510A (en)1946-01-231946-01-23Electroplating apparatus

Country Status (1)

CountryLink
US (1)US2457510A (en)

Cited By (26)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US2706173A (en)*1950-10-121955-04-12Harold R WellsApparatus for electro-plating crankshaft journals
US2782159A (en)*1953-06-291957-02-19Ernest V BerryElectroplating anode structure
US3008892A (en)*1957-09-101961-11-14United States Steel CorpApparatus for coating selected portions of the surface of a base material
US3276988A (en)*1959-10-061966-10-04Anocut Eng CoElectrolytic removal of work material
US3354073A (en)*1963-11-221967-11-21Gen Motors CorpElectrical stock removal apparatus
US3417008A (en)*1965-01-151968-12-17Udylite CorpSwitch for electrochemical processes
US4134819A (en)*1977-03-141979-01-16Schering AgArrangement for controlling the electric energy supply to an electroplating installation
US6979248B2 (en)2002-05-072005-12-27Applied Materials, Inc.Conductive polishing article for electrochemical mechanical polishing
US6988942B2 (en)2000-02-172006-01-24Applied Materials Inc.Conductive polishing article for electrochemical mechanical polishing
US6991528B2 (en)2000-02-172006-01-31Applied Materials, Inc.Conductive polishing article for electrochemical mechanical polishing
US7014538B2 (en)1999-05-032006-03-21Applied Materials, Inc.Article for polishing semiconductor substrates
US7029365B2 (en)2000-02-172006-04-18Applied Materials Inc.Pad assembly for electrochemical mechanical processing
US7059948B2 (en)2000-12-222006-06-13Applied MaterialsArticles for polishing semiconductor substrates
US7077721B2 (en)2000-02-172006-07-18Applied Materials, Inc.Pad assembly for electrochemical mechanical processing
US7084064B2 (en)2004-09-142006-08-01Applied Materials, Inc.Full sequence metal and barrier layer electrochemical mechanical processing
US7125477B2 (en)2000-02-172006-10-24Applied Materials, Inc.Contacts for electrochemical processing
US7137879B2 (en)2001-04-242006-11-21Applied Materials, Inc.Conductive polishing article for electrochemical mechanical polishing
US7278911B2 (en)2000-02-172007-10-09Applied Materials, Inc.Conductive polishing article for electrochemical mechanical polishing
US7303462B2 (en)2000-02-172007-12-04Applied Materials, Inc.Edge bead removal by an electro polishing process
US7303662B2 (en)2000-02-172007-12-04Applied Materials, Inc.Contacts for electrochemical processing
US7344432B2 (en)2001-04-242008-03-18Applied Materials, Inc.Conductive pad with ion exchange membrane for electrochemical mechanical polishing
US7374644B2 (en)2000-02-172008-05-20Applied Materials, Inc.Conductive polishing article for electrochemical mechanical polishing
US7427340B2 (en)2005-04-082008-09-23Applied Materials, Inc.Conductive pad
US7520968B2 (en)2004-10-052009-04-21Applied Materials, Inc.Conductive pad design modification for better wafer-pad contact
US7670468B2 (en)2000-02-172010-03-02Applied Materials, Inc.Contact assembly and method for electrochemical mechanical processing
US7678245B2 (en)2000-02-172010-03-16Applied Materials, Inc.Method and apparatus for electrochemical mechanical processing

Citations (3)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
GB189918643A (en)*1899-09-151900-08-18Frederick Hall SnyderImprovements relating to the Amalgamation and Coating of Metals or Alloys of Metals, with Metals or Alloys of Metals, by the Aid of Electricity, and to Apparatus therefor.
US1805215A (en)*1930-03-051931-05-12Hammond Frederick WilliamMeans for coating metallic articles, particularly the interiors of water mains
US1856409A (en)*1927-11-041932-05-03Dayton Scale CoWeighing sealing device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
GB189918643A (en)*1899-09-151900-08-18Frederick Hall SnyderImprovements relating to the Amalgamation and Coating of Metals or Alloys of Metals, with Metals or Alloys of Metals, by the Aid of Electricity, and to Apparatus therefor.
US1856409A (en)*1927-11-041932-05-03Dayton Scale CoWeighing sealing device
US1805215A (en)*1930-03-051931-05-12Hammond Frederick WilliamMeans for coating metallic articles, particularly the interiors of water mains

Cited By (33)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US2706173A (en)*1950-10-121955-04-12Harold R WellsApparatus for electro-plating crankshaft journals
US2782159A (en)*1953-06-291957-02-19Ernest V BerryElectroplating anode structure
US3008892A (en)*1957-09-101961-11-14United States Steel CorpApparatus for coating selected portions of the surface of a base material
US3276988A (en)*1959-10-061966-10-04Anocut Eng CoElectrolytic removal of work material
US3354073A (en)*1963-11-221967-11-21Gen Motors CorpElectrical stock removal apparatus
US3417008A (en)*1965-01-151968-12-17Udylite CorpSwitch for electrochemical processes
US4134819A (en)*1977-03-141979-01-16Schering AgArrangement for controlling the electric energy supply to an electroplating installation
US7014538B2 (en)1999-05-032006-03-21Applied Materials, Inc.Article for polishing semiconductor substrates
US7137868B2 (en)2000-02-172006-11-21Applied Materials, Inc.Pad assembly for electrochemical mechanical processing
US7303462B2 (en)2000-02-172007-12-04Applied Materials, Inc.Edge bead removal by an electro polishing process
US6988942B2 (en)2000-02-172006-01-24Applied Materials Inc.Conductive polishing article for electrochemical mechanical polishing
US7029365B2 (en)2000-02-172006-04-18Applied Materials Inc.Pad assembly for electrochemical mechanical processing
US7678245B2 (en)2000-02-172010-03-16Applied Materials, Inc.Method and apparatus for electrochemical mechanical processing
US7077721B2 (en)2000-02-172006-07-18Applied Materials, Inc.Pad assembly for electrochemical mechanical processing
US7670468B2 (en)2000-02-172010-03-02Applied Materials, Inc.Contact assembly and method for electrochemical mechanical processing
US7125477B2 (en)2000-02-172006-10-24Applied Materials, Inc.Contacts for electrochemical processing
US7569134B2 (en)2000-02-172009-08-04Applied Materials, Inc.Contacts for electrochemical processing
US7374644B2 (en)2000-02-172008-05-20Applied Materials, Inc.Conductive polishing article for electrochemical mechanical polishing
US7207878B2 (en)2000-02-172007-04-24Applied Materials, Inc.Conductive polishing article for electrochemical mechanical polishing
US7278911B2 (en)2000-02-172007-10-09Applied Materials, Inc.Conductive polishing article for electrochemical mechanical polishing
US7285036B2 (en)2000-02-172007-10-23Applied Materials, Inc.Pad assembly for electrochemical mechanical polishing
US6991528B2 (en)2000-02-172006-01-31Applied Materials, Inc.Conductive polishing article for electrochemical mechanical polishing
US7303662B2 (en)2000-02-172007-12-04Applied Materials, Inc.Contacts for electrochemical processing
US7344431B2 (en)2000-02-172008-03-18Applied Materials, Inc.Pad assembly for electrochemical mechanical processing
US7059948B2 (en)2000-12-222006-06-13Applied MaterialsArticles for polishing semiconductor substrates
US7344432B2 (en)2001-04-242008-03-18Applied Materials, Inc.Conductive pad with ion exchange membrane for electrochemical mechanical polishing
US7311592B2 (en)2001-04-242007-12-25Applied Materials, Inc.Conductive polishing article for electrochemical mechanical polishing
US7137879B2 (en)2001-04-242006-11-21Applied Materials, Inc.Conductive polishing article for electrochemical mechanical polishing
US6979248B2 (en)2002-05-072005-12-27Applied Materials, Inc.Conductive polishing article for electrochemical mechanical polishing
US7446041B2 (en)2004-09-142008-11-04Applied Materials, Inc.Full sequence metal and barrier layer electrochemical mechanical processing
US7084064B2 (en)2004-09-142006-08-01Applied Materials, Inc.Full sequence metal and barrier layer electrochemical mechanical processing
US7520968B2 (en)2004-10-052009-04-21Applied Materials, Inc.Conductive pad design modification for better wafer-pad contact
US7427340B2 (en)2005-04-082008-09-23Applied Materials, Inc.Conductive pad

Similar Documents

PublicationPublication DateTitle
US2457510A (en)Electroplating apparatus
SE8500714D0 (en) SWITCH WIRE SWITCH COVER
FR2382972A1 (en) DEVICE FOR CUTTING MACHINE BY EROSIVE SPARKLING
GB630165A (en)Improvements in or relating to electroplating
GB1436789A (en)Method of surface hardening a metal workpiece
GB625990A (en)Improvements in or relating to electroplating
EP0272618A3 (en)Insulating housing or part for an electrical contacting or coupling device
US2366548A (en)Arc-time recorder
GB1527391A (en)Method of determination of the position of a system of at least one sensing element situated on an area or in its proximity and a device for performing this method
ES454323A1 (en)Electrolytic device for marking metallic parts
SU973271A1 (en)Method of marking apparatus of conductive materials
GB1235127A (en)Electrophoretic-coating process
FR2422476A1 (en) DEVICE FOR MACHINING BY EROSIVE SPARKLING
US724721A (en)Electric-tool holder.
DE3781437D1 (en) POWER SUPPLY FOR A WIRE-SHAPED ELECTRODE OF AN ELECTRIC EDMING MACHINE.
US1549365A (en)Electric switch
US3601574A (en)Part structure for projection welding a nonmetallic body to a metal part
SU647155A1 (en)System of power supply to moving consumer
SU727716A1 (en)Electroplating bath current supply device
SU703286A1 (en)Electrochemical working apparatus
US2849392A (en)Voltage control system
US2432322A (en)Apparatus for electroplating articles having pockets or recesses therein
GB552187A (en)Improvements relating to window opening and closing mechanisms
JPS61183499A (en)Electropainting device
SE7506384L (en) KIT AND DEVICE FOR LOCAL ELECTROPLETATION OF BAND MATERIAL

[8]ページ先頭

©2009-2025 Movatter.jp