US20230090077A1 - Chemical mechanical planarization pad with a release liner comprising a pull tab - Google Patents

Abstract

A chemical mechanical polishing (CMP) pad with a release liner that has a pull tab is prepared by contacting the CMP pad to an adhesive layer with release liner. The adhesive layer sheet is cut along a first portion of a perimeter of the CMP pad. An extension of the adhesive layer is cut that extends beyond an edge of the CMP pad at the remaining portion of the perimeter of the CMP pad, thereby creating an extension of the adhesive layer sheet with the adhesive layer exposed. The exposed adhesive layer is cut to a depth not to extend into the release liner. The adhesive layer is removed from the exposed region leaving only the release liner pull tab as a continuous extension of the release liner material.

Description

TECHNICAL FIELD
• This disclosure generally relates to polishing pads used in chemical mechanical polishing, and more specifically to a chemical mechanical polishing pad with a release liner comprising a pull tab.
BACKGROUND
• An integrated circuit is typically formed on a substrate by the sequential deposition of conductive, semi-conductive, and/or insulative layers on a silicon wafer. A variety of fabrication processes require planarization of at least one of these layers on the substrate. For example, for certain applications (e.g., polishing of a metal layer to form vias, plugs, and lines in the trenches of a patterned layer), an overlying layer is planarized until the top surface of a patterned layer is exposed. In other applications (e.g., planarization of a dielectric layer for photolithography), an overlying layer is polished until a desired thickness remains over the underlying layer. Chemical-mechanical planarization (CMP) is one method of planarization. This planarization method typically involves a substrate being mounted on a carrier head. The exposed surface of the substrate is typically placed against a polishing pad that is attached to a rotating platen. The carrier head provides a controllable load (e.g., a downward force) on the substrate to push it against the rotating polishing pad. A polishing liquid, such as slurry with abrasive particles, can also be disposed on the surface of the polishing pad during polishing.
SUMMARY
• In order to perform planarization processes, the chemical mechanical polishing (CMP) pad must be physically attached to the platen of a CMP system. To achieve this attachment, the underside of the CMP pad may include a platen adhesive layer. A platen adhesive release liner, or release liner, may cover the platen adhesive to protect this platen adhesive during storage and transport of CMP pads until the time of their use. When a user wishes to attach a CMP pad to the platen, they must first remove the release liner. Previous release liners are the same shape (e.g., a circular shape) and can be difficult to remove from the underside of the CMP pad. In some cases, attempts to remove the release liner can result in damage to the CMP pad. CMP pads having multiple layers (e.g., a top polishing layer, a subpad layer, and any intermediate adhesive layers) may be particularly susceptible to damage during the removal of previous release liners. For example, certain combinations of pad layer materials may be susceptible to separation or delamination of the CMP pad layers when a conventional release liner is removed. This may be more problematic for CMP pads having interlayer adhesion strengths that are less than or at a similar magnitude to the adhesion strength between the release liner and the platen adhesive on the underside of the CMP pad. Furthermore, the additional bulk that results when a separate adhesive tape is added as a pull tab prevents efficient stacking of the pads, for example during shipping. The added bulk in a stack of pads can lead to deformities in the pad, which can result in damage and/or reduced performance of the pad.
• This disclosure provides a technical solution to the problems of previous CMP pad release liners, including those described above, by providing a CMP pad having a protective release liner with a pull tab. This CMP pad is better adapted for easy removal of the protective release liner. The pull tab is an extension of the release liner that extends beyond the edge of the CMP pad (see, e.g.,FIG.2A, described below). The pull tab includes only the release liner layer from the platen adhesive side of the pad such that a user can conveniently grasp and use the pull tab in order to remove the release liner more easily without damaging the CMP pad to which it was attached. This disclosure further provides an efficient and reliable process for preparing such pull tabs. In this method, an extension of the adhesive layer is controllably prepared in the release liner attached to a CMP pad. Adhesive layer(s) are then removed from the extension, such that a pull tab is prepared on the release liner itself. In some cases, a controlled cut may be performed to facilitate the controlled removal of adhesive layers from the extension, such that only the release liner layer remains to form the pull tab.
• In one embodiment, an article includes a chemical mechanical polishing (CMP) pad and a release liner. The CMP pad has a circular shape. The CMP pad includes a polishing layer and a platen adhesive layer. The release liner has a body portion and a pull tab. The body portion has substantially the same shape as the circularly shaped CMP pad. The body portion includes a release liner layer and an adhesive layer. The adhesive layer contacts the release liner layer of the CMP pad. The pull tab includes an extension of the release liner layer of the body portion that extends beyond an edge of the body portion (e.g., and beyond an edge of the CMP pad).
• In another embodiment, a method of preparing a pull tab in a release liner contacting a CMP pad includes contacting the CMP pad to an adhesive layer of a sheet of the release liner. The sheet of the release liner includes the adhesive layer and a non-release liner layer. The method includes cutting the release liner sheet along a first portion of a perimeter of the CMP pad. The method includes cutting an extension of the release liner that extends beyond an edge of the CMP pad at the remaining portion of the perimeter of the CMP pad, thereby creating an extension of the release liner sheet with the adhesive layer exposed. The method includes contacting a surface to the exposed adhesive layer of the created extension of the release liner. The method includes removing the contacted surface from the exposed region, thereby removing the adhesive layer from the exposed region.
BRIEF DESCRIPTION OF FIGURES
• To assist in understanding the present disclosure, reference is now made to the following description taken in conjunction with the accompanying drawings, in which:
• FIG.1 is a diagram of an example system for chemical mechanical polishing/planarization;
• FIG.2A is a diagram of an example polishing pad with a release liner that has a pull tab;
• FIG.2B is a cross sectional view of a portion of the CMP pad and release liner ofFIG.2A;
• FIG.2C is a diagram of a perspective view of the polishing pad with pull tab release liner shown inFIG.2A;
• FIGS.3A-3C are diagrams of various pull tab configurations for example release liners;
• FIG.4 is flowchart illustrating an example method of preparing a pull tab in a release liner of a chemical mechanical polishing pad;
• FIGS.5A-5D are diagrams illustrating various steps of the method ofFIG.4; and
• FIG.6 illustrates an example cutting guide for use in the example method ofFIG.4;
• FIGS.7A and7B are diagrams illustrating a partial cut for improving the removal of exposed adhesive for preparing a pull tab.
DETAILED DESCRIPTION
• It should be understood at the outset that, although example implementations of embodiments of the disclosure are illustrated below, the present disclosure may be implemented using any number of techniques, whether currently known or not. The present disclosure should in no way be limited to the example implementations, drawings, and techniques illustrated below. Additionally, the drawings are not necessarily drawn to scale.
• As described above, previous release liner technology can be difficult to remove from a CMP pad without damaging the CMP pad. This disclosure recognizes that attaching a separate material to the release liner to aid in removal of the release liner is unreliable and can still result in damage to the CMP pad. The unique continuous pull tab of this disclosure (see, e.g.,FIGS.3A-C, described below) may facilitate the removal of a release liner from multilayer CMP pads (e.g., molded or casted CMP pads) having a top polishing layer, a subpad layer, and other adhesive layers. For example, if an adhesion strength between the top polishing layer, the subpad layer, and/or any intermediate adhesive layer is less than the adhesion strength between the release liner and the underside of the CMP pad, the different layers of the CMP pad may be inadvertently pulled apart or delaminated when the liner is removed. This disclosure satisfies the long sought need for an improved approach to removing a protective liner from the underside of a CMP pad in order to expose platen adhesive and attach the CMP pad to the platen of a CMP system without inadvertently damaging the CMP pad.
Chemical Mechanical Planarization System
• FIG.1 illustrates apolishing system100 for performing chemical mechanical planarization.Polishing system100 includes a chemical mechanical polishing (CMP) pad102 (also referred to as a “chemical mechanical planarization pad” or a “polishing pad”) which is attached to aplaten104. For example, a platen adhesive layer (e.g., platenadhesive layer216 ofFIG.2B) may be used to attach theCMP pad102 to theplaten104. TheCMP pad102 generally has a circular or approximately cylindrical shape (i.e., with a top surface, a bottom surface, and a curved edge). TheCMP pad102 may be made of polyurethane or any other appropriate material along with any additives and/or filler materials.CMP pad102 may have any appropriate thickness and any appropriate diameter (e.g., orradius116 ofFIG.2A) to accommodate its use in polishingsystem100. For instance, the thickness of aCMP pad102 may range from about 0.5 millimeters to greater than 5 centimeters. The diameter (e.g.,radius116 ofFIG.2A) of theCMP pad102 is generally selected to match or be just smaller than, the diameter of theplaten104 of thepolishing system100 used.
• Theplaten104 can generally be rotated during chemical mechanical planarization. A wafer106 (e.g., a silicon wafer with or without conductive, semi-conductive, and/or insulative layers, as described above) is attached to ahead108 of a rotatable chuck. Thewafer106 may be attached using vacuum and/or a reversible adhesive (e.g., an adhesive that holds thewafer106 in place during chemical mechanical planarization but allows thewafer106 to be removed from thehead108 after chemical mechanical planarization). During CMP processing, aslurry110 may be provided on the surface of theCMP pad102 before and/or during chemical mechanical planarization. Theslurry110 generally includes a fluid and particles that may be abrasive and/or chemically reactive. Aconditioner112 is a device which is configured to condition the surface of theCMP pad102. Conditioning of the surface prepares theCMP pad102 to be used for chemical mechanical planarization. Theconditioner112 generally conditions the surface by contacting the surface of theCMP pad102 and removing a portion of the top layer of theCMP pad102 to improve its performance during chemical mechanical planarization.
• In order for these and other CMP processes to proceed according to expectations for a givenCMP pad102, the structure of theCMP pad102 should not be altered or damaged when thepad102 is being attached to theplaten104. A release liner is provided on theCMP pad102 to protect platen adhesive. The release liner is removed to expose the platen adhesive and allow a user to attach theCMP pad102 to theplaten104. Using previous technology there was a risk of damaging theCMP pad102 when the release liner was removed. This disclosure provides an improved release liner that includes a pull tab that is a continuous component of the release liner sheet or film, as described further below.
• Example CMP Pads with a Release Liner Having a Pull Tab
• FIGS.2A and2B show aCMP pad102 with arelease liner218 that has apull tab202.FIG.2A shows a top-side angled view of aCMP pad102 attached to a release liner (liner layer218 shown inFIG.2B) with apull tab202 extending from theedge114 of theCMP pad102. Thepull tab202 generally facilitates the removal, by a user of theCMP pad102, of therelease liner layer218, such that a platenadhesive layer216 of theCMP pad102 is exposed (see cross-section view ofFIG.2B). TheCMP pad102 may be any type of chemical mechanical polishing pad, such as a molded or casted pad. TheCMP pad102 may be formed of any appropriate materials for facilitating the planarization and/or polishing of a given substrate. For example, theCMP pad102 may be made of polyurethane with or without additives and/or fillers. TheCMP pad102 may have any appropriate texture and/or patterning to facilitate planarization/polishing. TheCMP pad102 may have any appropriate size. For example, theradius116 may be an appropriate size to use theCMP pad102 in a givenpolishing system100. The perimeter of theCMP pad102 is the distance around theedge114 of theCMP pad102 and is given by 2πr, where r is theradius116 of theCMP pad102. TheCMP pad102 may have a single layer of a material or may be multi-layered, as shown in the example ofFIG.2B. Examples ofCMP pads102 include those prepared by casting, molding, coating, extruding, printing, sintering, spraying, and the like.
• FIG.2B shows a cross-section through line A-B of the various possible layers of thearticle200 having aCMP pad102 with attachedrelease liner layer218, including thepull tab202.FIG.2B illustrates thearticle200 from a perspective view.FIGS.2B and2C are not drawn to scale. As shown in the example ofFIG.2B, theCMP pad102 includes atop polishing layer204, anadhesive layer206, asubpad layer208, and arelease liner210. Theadhesive layer206 attaches thepolishing layer204 to thesubpad layer208, and the platenadhesive layer210,218 release liner layer which protects the bottom surface of theCMP pad102. In other embodiments, theCMP pad102 may include more or fewer layers. For example, theCMP pad102 may include asingle polishing layer204 or may omit one or more layers in some cases.
• Thepolishing layer204 may include polyurethane and/or any additives/fillers to improve polishing/planarization performance. Thesubpad layer208 may be a foam or other more or less compressible layer. As an example, asubpad layer208 may include polyurethane and any additives/fillers. Theadhesive layer206 generally includes any adhesive material(s) that can adhere to each of the connecting layers. For instance,adhesive layer206 may include an adhesive material (e.g., glue, tape, etc.) that adheres to both thepolishing layer204 and thesubpad layer208. For instance, as shown in the example ofFIG.2B,adhesive layer206 includessublayers206a-c, wherelayer206ais a top pad adhesive,206bis a carrier film, and206cis a subpad adhesive. Similarly, the platenadhesive layer210 may include any appropriate number of sublayers, as illustrated by the topadhesive layer212,carrier film214, and platenadhesive layer216 inFIG.2B. For instance,adhesive layer212 includes an adhesive material (e.g., glue, tape, etc.) that adheres to both thesubpad layer208 of theCMP pad102 and thecarrier film214, while the platenadhesive layer216 includes the same or a different adhesive material (e.g., glue, tape, etc.) that adheres to both thecarrier film214 and therelease liner layer218. In some cases, the bottomadhesive layer216 may be a platen adhesive that is an adhesive material (e.g., glue, tape, etc.) that can reliably adhere (e.g., with a high adhesion strength) to the platen104 (seeFIG.1).
• Therelease liner layer218 includes thepull tab202, which is an extension of therelease liner layer218 that extends beyond theedge114 of the main body of the release liner210 (e.g.,edge310 illustrated inFIGS.3A-C) and the edge of the CMP pad102 (e.g., edge114 ofFIG.2A). Therelease liner layer218 may be a polyester film. Thepull tab202 is an extension of the release liner layer218 (e.g., from thebody portion302 of the example release liner configurations300,320,340 ofFIGS.3A-C, described further below) without theadhesive layers212,216 and thecarrier film layer214.
• As described further below, this disclosure recognizes that certainmulti-layered CMP pads102 may be particularly susceptible to damage (e.g., separation and/or delamination of layers) when conventional release liners are removed. For example, using previous technology, theCMP pad102 may separate at thepolishing layer204, thesubpad layer208, and/or any of theother layers206 and210. Thepull tab202 of this disclosure significantly reduces or eliminates occurrence of this type of inadvertent damage.
Example Release Liner Configurations
• FIGS.3A-C show different example configurations300,320,340 ofrelease liners210. The example configurations300,320,340show release liners218 with different numbers, shapes, and sizes ofpull tabs202. The example ofFIG.3A shows a configuration300 in which therelease liner218 includes acircular body portion302 with a single semicircle-shapedpull tab202 extending beyond theedge310 of thebody portion302. The example ofFIG.3B shows a configuration320 in which therelease liner218 includes acircular body portion302 with multiple rectangle-shapedpull tabs202 of different sizes extending beyond theedge310 of thebody portion302. The example ofFIG.3C shows a configuration340 in which therelease liner218 includes acircular body portion302 with multiple semicircle-shapedpull tabs202 of the same sizes extending beyond theedge310 of thebody portion302. These example configurations300,320,340 are not exhaustive. This disclosure contemplatesrelease liners218 having any number of pull tabs202 (i.e., with one or more pull tabs202), where thepull tabs202 have any size or shape.
• For each of the configurations300,320,340 shown inFIGS.3A-C, therelease liner218 includes acircular body portion302 with one ormore pull tabs202. Thepull tabs202 are a continuous extension of therelease liner layer218 from thebody portion302, such that thebody portion302 and pulltabs202 form a continuous sheet of material. Thecircular body portion302 has aradius308. Theradius308 is generally substantially the same as (e.g., within a threshold distance, such as a few millimeters, of) theradius116 of theCMP pad102 to which therelease liner218 is attached. As such thebody portion302 generally has substantially the same shape and size as the circularly shapedCMP pad102.
• For each of the configurations300,320,340 shown inFIGS.3A-C, thepull tabs202 have awidth304 along the perimeter of thebody portion302 and alength306 extending away from thebody portion302. Thewidth304 andlength306 may be any values that are appropriate for a given application. For example, thewidth304 andlength306 may be selected to ensure a user is able to grasp thepull tab202 in order to effectively remove therelease liner218 from theCMP pad102 to which it is attached. In some embodiments, thewidth304 and/orlength306 of thepull tabs202 may be determined based at least in part on the size of thebody portion302 of therelease liner218. For instance, thewidth304 and/orlength306 may be a predetermined fraction of a characteristic size (e.g., radius308) of thebody portion302 of the release liner218 (e.g., or on the size, such asradius116, of theCMP pad102 to which therelease liner218 is attached).
• Example Methods of Preparing CMP Pads with a Release Liner Having a Pull Tab
• FIG.4 illustrates anexample process400 for preparing aCMP pad102 with arelease liner218 that has apull tab202. Theprocess400 may begin with providing aCMP pad102. TheCMP pad102 may have been prepared using any appropriate method, such as casting, molding, or the like. Characteristics of theCMP pad102 are described in greater detail above with respect toFIGS.1-2B.
• Atstep404, theCMP pad102 is contacted to a sheet of the platen adhesive material (e.g., a sheet that includes the layers212-218 illustrated inFIG.2B but that is not yet transformed into a pull tab-containing release liner218). In particular, thesubpad layer208 of theCMP pad102 is contacted to the topadhesive layer212 of the sheet of the release liner material.FIG.5A shows a diagram500 illustrating aCMP pad102 that is contacted to asheet510 of the platen adhesive material. TheCMP pad102 is contacted to thesheet510 such that thesheet510 extends beyond theedge114 of theCMP pad102.
• Referring to bothFIGS.4 and5A, atstep406, aforce512 may be applied to the top surface of CMP pad102 (e.g., to thepolishing layer204 of the CMP pad102) and/or to the bottom surface of thesheet510 of the release layer material (e.g., to the release liner layer218).Force512 may be applied manually or using any appropriate instrument, such as a laminator (e.g., to provide a controlled force512). Application offorce512 may facilitate attachment of the CMP pad102 (at subpad layer208) to thesheet510 of the platen adhesive material.
• Atstep408, thebody portion302 of the adhesive layer510 (210) is cut from the sheet510 (seeFIGS.3A-C for reference). Referring to the example ofFIG.5A, this may be achieved by cutting theadhesive layer sheet510 along afirst portion504 of a perimeter of theCMP pad102. This cutting may be performed using anyappropriate cutting tool502. Thecutting tool502 may be a knife or blade that is controlled manually or may be an automated cutting tool, such as a computer numerical control (CNC) cutting machine. Cutting may be performed manually (e.g., using any blade, knife, etc.) by cutting along theedge114 of theCMP pad102 or automatically by cutting at predefined positions using anautomatic cutting tool502. Cutting alongportion504 of the CMP pad's perimeter may be performed the entire way through theadhesive layer sheet510 at a depth of224 (seeFIG.2B). For example, referring toFIG.2B, cutting alongperimeter portion504 may be performed to at least adepth224, such that each layer212-218 of theadhesive layer510 is cut through entirely.
• Referring to bothFIGS.4 and5A, atstep410, anextension514 is cut from therelease liner sheet510. Thepull tab202 may be formed by cutting theextension514 of theadhesive layer510 that extends beyond theedge114 of theCMP pad102 alongpath508.Path508 extends outward from theedge114 of theCMP pad102 along the remainingportion506 of the perimeter of theCMP pad102. As atstep408, cutting alongpath508 may be performed all the way through theadhesive layer510. For example, referring toFIG.2B, cutting alongpath508 may be performed to at least adepth224, such that each layer212-218 of theadhesive layer510 is cut through entirely. In some cases, theextension514 may be cut at the same time asportion504, such thatsteps408 and410 are combined. In some embodiments, theextension514 may be cut before theportion504 is cut, such thatstep410 is performed beforestep408.
• Theextension514 may be cut atstep410 manually or automatically using anautomated cutting tool502, as described with respect to step408 above. In embodiments in which theextension514 is cut manually, a cutting guide may be used. The cutting guide acts as a specialized stencil for cutting theextension514 that will form thepull tab202. Anexample cutting guide600 is shown inFIG.6. The cuttingguide600 includes anextension surface602, analignment edge604, a stabilizingsurface608, and anextension design edge612. Theextension surface602 defines a shape of the to-be-cut extension514 that will form the pull tab202 (e.g., whether theextension514 is semicircular as inFIGS.3A,3C, and5A-D, rectangular as inFIG.3B, or any other shape). For theexample cutting guide600, theextension surface602 has a semicircular shape that extends alength306 from thealignment edge604. Thealignment edge604 is configured to align with theedge114 of the CMP pad102 (e.g., along the remainingportion506 of the CMP pad's perimeter). Thewidth304 of thealignment edge604 may be the same or similar to thewidth304 of the to-be-cut extension514 (see alsoFIGS.3A-C). Theheight606 of thealignment edge604 may be similar to a height of theCMP pad102. The stabilizingsurface608 is generally configured to rest on the top surface of the CMP pad102 (e.g., the polishingsurface204 ofFIG.2A), such that the cuttingguide600 remains stable (i.e., does not inadvertently move) during its use. Thewidth610 of the stabilizingsurface608 may be any appropriate value to ensure the cuttingguide600 remains stable during its use. For example, thewidth610 may be on the order of a centimeter or so. Theextension design edge612 is the surface along which a user cuts to form theextension514 illustrated inFIG.5A. Referring to bothFIG.5A andFIG.6, theextension514 may be formed by contacting thealignment edge604 of the cuttingguide600 to theedge114 of theCMP pad102 at the remainingportion506 of the CMP pad's perimeter and manually cutting along the extension-design edge612 to create a cut alongpath508. Cutting may be performed at least to thedepth224 ofFIG.2B, such that the cut is entirely through all layers212-218 of theadhesive layer sheet510.
• Returning to step410 ofFIG.4, in some embodiments, an additional cut may be performed along the remainingportion506 of the CMP pad's perimeter to aid in the removal ofadhesive layers216,212 andcarrier film layer214 of the platen adhesive layer material at steps412-416. The length of the remainingportion506 corresponds to thewidth304 of the pull tab202 (seeFIGS.3A-C), and this length may be based at least in part on the size of theCMP pad102, as described above. The remainingportion506 of the CMP pad's perimeter may be cut at a decreased depth (e.g.,depth226 ofFIG.2B), such that therelease liner layer218 is not cut at all or is at least not cut entirely through. This ensures that thepull tab202 forms a continuous sheet of the release liner layer218 (seeFIGS.2B and2C). In some embodiments, cutting atsteps408 and410, including cutting at a decreaseddepth226 along the remainingportion506 of the CMP pad's perimeter, may be performed using anautomated cutting tool502. For further illustration,FIG.7A shows a crosssectional view700 of thecutting tool502 cutting through at least sublayers212-216 of the adhesive layer (FIG.7A), such that acut702 is made in these layers of theadhesive layer210, as illustrated insubsequent view710 ofFIG.7B.
• FIG.5B shows a diagram520 of theCMP pad102 with thecut extension514 of theadhesive layer sheet510 following the completion ofstep410. Theextension514 includes all layers212-218 of the adhesive layer material (seeFIG.2B) with theadhesive layer212 exposed (i.e., pointing upwards in the view ofFIG.5B). Steps412-416 facilitate the controlled removal of theadhesive layers212,216 andcarrier film layer214, such that only thepull tab202 withrelease liner layer218 remains. Referring to bothFIGS.4 and5B, atstep412, asurface522 is contacted to the exposed adhesive layer of the created extension of the adhesive layer. Thesurface522 may be any appropriate material (e.g., a sheet of paper, a residual portion of theadhesive layer sheet510, or the like).
• FIG.5C shows a diagram530 illustrating thesurface522 after it is contacted to (e.g., adhered to) theextension514. Referring to bothFIGS.4 and5C, atstep414, aforce534 may be applied to thesurface522 in order to facilitate attachment between thesurface522 and the exposedadhesive layer212 of theextension514. Atstep416, thesurface522 is removed, as illustrated by the arrow inFIG.5C. When thesurface522 is removed, theadhesive layers212,216 andcarrier film layer214 are carried along with it, such that only therelease liner layer218 remains.FIG.5D shows a diagram540 illustrating thefinal CMP pad102 with arelease liner218 that has apull tab202. The removed layers212,214, and216 from thecut extension514 are attached to thesurface522 that was removed at step416 (FIG.5B).
• Theunique pull tab202 achieved viaprocess400 and that is a continuous extension of therelease liner layer218 that is also protecting the platenadhesive layer216 of theCMP pad102 may aid in preventing or eliminating damage to theCMP pads102 when therelease liner layer218 is removed. Therelease liner layer218 withpull tab202 may particularly prevent damage toCMP pads102 that have interlayer adhesion strengths (e.g., between the layers204-208 of the CMP pad102) that are less than the adhesion strength between the platen adhesive212 on the underside of theCMP pad102 and therelease liner layer218. Thispull tab202 that is formed as a continuous extension of therelease liner layer218 that protects theCMP pad102 also facilitates improved storage and transportation of sets ofCMP pads102. For example,CMP pads102 havingrelease liners218 withcontinuous pull tabs202, as described in this disclosure, can be evenly or flatly stacked together without risk of damage. In contrast, if a separate pull tab were attached to the release liner, CMP pads would not stack evenly against each other. Instead, the added pull tabs would cause the CMP pads to stack at an angle relative to each other, resulting in an increased risk of damage during storage and transport.
• Modifications, additions, or omissions may be made to the systems, apparatuses, and methods described herein. The components of the systems and apparatuses may be integrated or separated. Moreover, the operations of the systems and apparatuses may be performed by more, fewer, or other components. The methods may include more, fewer, or other steps. Additionally, steps may be performed in any suitable order. Additionally, operations of the systems and apparatuses may be performed using any suitable logic. As used in this document, “each” refers to each member of a set or each member of a subset of a set.
• Herein, “or” is inclusive and not exclusive, unless expressly indicated otherwise or indicated otherwise by context. Therefore, herein, “A or B” means “A, B, or both,” unless expressly indicated otherwise or indicated otherwise by context. Moreover, “and” is both joint and several, unless expressly indicated otherwise or indicated otherwise by context. Therefore, herein, “A and B” means “A and B, jointly or severally,” unless expressly indicated otherwise or indicated otherwise by context.
• The scope of this disclosure encompasses all changes, substitutions, variations, alterations, and modifications to the example embodiments described or illustrated herein that a person having ordinary skill in the art would comprehend. The scope of this disclosure is not limited to the example embodiments described or illustrated herein. Moreover, although this disclosure describes and illustrates respective embodiments herein as including particular components, elements, feature, functions, operations, or steps, any of these embodiments may include any combination or permutation of any of the components, elements, features, functions, operations, or steps described or illustrated anywhere herein that a person having ordinary skill in the art would comprehend. Furthermore, reference in the appended claims to an apparatus or system or a component of an apparatus or system being adapted to, arranged to, capable of, configured to, enabled to, operable to, or operative to perform a particular function encompasses that apparatus, system, component, whether or not it or that particular function is activated, turned on, or unlocked, as long as that apparatus, system, or component is so adapted, arranged, capable, configured, enabled, operable, or operative. Additionally, although this disclosure describes or illustrates particular embodiments as providing particular advantages, particular embodiments may provide none, some, or all of these advantages.
• The use of the terms “a” and “an” and “the” and similar referents in the context of describing the invention (especially in the context of the following claims) are to be construed to cover both the singular and the plural, unless otherwise indicated herein or clearly contradicted by context. The terms “comprising,” “having,” “including,” and “containing” are to be construed as open-ended terms (i.e., meaning “including, but not limited to,”) unless otherwise noted. Recitation of ranges of values herein are merely intended to serve as a shorthand method of referring individually to each separate value falling within the range, unless otherwise indicated herein, and each separate value is incorporated into the specification as if it were individually recited herein. The use of any and all examples, or exemplary language (e.g., “such as”) provided herein, is intended merely to better explain the disclosure and does not pose a limitation on the scope of claims.

Claims (20)

What is claimed is:

1. An article, comprising:

a chemical mechanical polishing pad having a circular shape, the chemical mechanical polishing pad comprising a polishing layer; and

a release liner comprising:

a body portion having substantially the same shape as the circularly shaped chemical mechanical polishing pad, wherein the body portion comprises a release liner layer and an adhesive layer, wherein the adhesive layer is in contact with the chemical mechanical polishing pad; and

a pull tab comprising an extension of the release liner layer of the body portion that extends beyond an edge of the chemical mechanical polishing pad.

2. The article ofclaim 1, wherein:

the body portion further comprises:

a carrier film layer contacting the adhesive layer;

a secondary adhesive layer contacting the carrier film layer; and

the release liner layer is contacting the secondary adhesive layer.

3. The article ofclaim 2, wherein the pull tab comprises the extension of the release liner layer of the body portion without the adhesive layer, carrier film layer, and the secondary adhesive layer.

4. The article ofclaim 1, wherein the release liner layer of the body portion and the pull tab form a continuous sheet of material.

5. The article ofclaim 1, wherein the release liner layer comprises one of a polyester film, kraft paper, or any other material protecting the adhesive layer.

6. The article ofclaim 1, wherein the pull tab has a semicircular shape.

7. The article ofclaim 1, wherein the pull tab has a rectangular shape.

8. The article ofclaim 1, wherein the pull tab is configured to decrease occurrence of damage to the chemical mechanical polishing pad when the release liner layer is removed from the chemical mechanical polishing pad.

9. The article ofclaim 1, further comprising a plurality of pull tabs, each pull tab comprising an extension of the release liner layer of the body portion that extends beyond the edge of the body portion.

10. The article ofclaim 1, wherein the pull tab comprises a width along the edge of the body portion and a length directed away from the edge of the body portion, wherein the width and length are a predefined fraction of a characteristic size of the chemical mechanical polishing pad.

11. A method for preparing a pull tab in a release liner for a chemical mechanical polishing pad, the method comprising:

providing the chemical mechanical polishing pad;

contacting the chemical mechanical polishing pad to a sheet of adhesive material, the sheet of the adhesive material comprising an adhesive layer and a release liner layer;

cutting the sheet of adhesive material along a first portion of a perimeter of the chemical mechanical polishing pad;

cutting an extension of the adhesive material that extends beyond an edge of the chemical mechanical polishing pad at the remaining portion of the perimeter of the chemical mechanical polishing pad, thereby creating an extension of the adhesive material with the adhesive layer exposed;

contacting a surface to the exposed adhesive layer of the created extension of the adhesive material; and

removing the contacted surface from the exposed adhesive layer, thereby removing the adhesive layer from the extension of the release liner and forming the pull tab.

12. The method ofclaim 11, wherein a length of the remaining portion of the perimeter of the edge of the chemical mechanical polishing pad is a predefined fraction of a characteristic size of the chemical mechanical polishing pad.

13. The method ofclaim 11, further comprising, before contacting the surface to the exposed adhesive layer, cutting along the remaining portion of the perimeter of the chemical mechanical polishing pad at a decreased depth such that the release liner layer is not cut through along the remaining portion of the perimeter of the chemical mechanical polishing pad.

14. The method ofclaim 11, wherein steps of cutting the adhesive material along the first portion of the perimeter of the chemical mechanical polishing pad and cutting the extension of the adhesive material are performed using an automated cutting tool.

15. The method ofclaim 11, wherein the pull tab is configured to decrease occurrence of damage to the chemical mechanical polishing pad when the release liner layer is removed from the chemical mechanical polishing pad.

16. The method ofclaim 11, wherein cutting the adhesive material along the first portion of the perimeter of the chemical mechanical polishing pad comprises manually cutting along the edge of the chemical mechanical polishing pad.

17. The method ofclaim 16, wherein cutting the extension of the adhesive material that extends beyond the edge of the chemical mechanical polishing pad comprises:

providing a cutting guide comprising an alignment edge configured to align with the edge of the chemical mechanical polishing pad and an extension-design edge defining a shape of the to-be-cut extension of the adhesive material;

contacting the alignment edge of the cutting guide to the edge of the chemical mechanical polishing pad at the remaining portion of the perimeter of the chemical mechanical polishing pad; and

manually cutting along the extension-design edge of the cutting guide.

18. The method ofclaim 11, further comprising, prior to removing the contacted surface from the exposed adhesive material, applying force to the surface.

19. The method ofclaim 11, wherein the release liner layer is a polyester film, kraft paper, or other material protecting the adhesive material.

20. The method ofclaim 11, wherein:

the chemical mechanical polishing pad comprises a polishing layer and a subpad layer; and

an adhesion strength between the polishing layer and the subpad layer is less than an adhesion strength between the subpad layer and the adhesive layer of the adhesive material.

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