US20210193848A1 - Electronic imaging detector with thermal conduction layer - Google Patents

Abstract

A solid state active pixel image sensor for back illumination by an electron beam is described. The image sensor comprises a thermal conduction layer for heat removal. The image sensor may also comprise a thinned silicon substrate on which an epitaxial layer is formed. The substrate may also be completely removed before or after application of the thermal conduction layer. The thermal conduction layer may comprise a metal, a metal compound, silicon, diamond or graphite.

Description

CROSS REFERENCE TO RELATED APPLICATION
• This application claims priority under 35 U.S.C. § 119, based on U.S. Provisional Application No. 62/952,852, filed Dec. 23, 2019, the disclosure of which is hereby incorporated by reference herein.
BACKGROUND
• Electron imaging detectors based on thinned transmission silicon active pixel sensors have revolutionized cryo-electron microscopy. These devices have enabled scientists to investigate the structure of large biological macromolecules at levels not achieved previously. Because these are transmission devices, electrons which have interacted with the detection layer ideally exit the sensor without being scattered back into the detection layer. The use of silicon as the sensor substrate minimizes the scatter of electrons within the sensor back into the detection layer. Active sensors maximize the signal to noise ratio for detecting positions of individual incoming electrons through amplification of electron signals.
• As shown inFIG. 1, anactive pixel sensor10 is built up in three layers: a substrate (SUB)layer12, an epitaxially grown detection (EPI)layer14, and a back-end-of-line (BEOL)layer16.SUB layer12 is inert from the standpoint of detecting electrons and is used as the base on which to form the detection layers.EPI layer14 includes a material that generates sensor electrons in response to incoming electron microscope electrons. These sensor electrons are collected.BEOL layer16 is provided aboveEPI layer14 and contains metal interconnects and oxide insulation for reading out the sensor.
• In some known electron imaging detectors,SUB layer12 is thick enough that no electrons pass all the way through it. Two example electron paths are shown inFIG. 1. Electrons paths A and B are scattered by the substrate back into theEPI detection layer14 and are detected a second time atlocations20,22, which are less correlated with the actual entry points of the backscattered electrons intoEPI layer14. This extra detection reduces imaging quality. ThinningSUB layer12 from the back can reduce backscatter and the secondary detections, as shown inFIG. 2, where electron A does not backscatter up into thedetection layer14.
• In the example image using the same electron paths, inFIG. 2, electron A, which penetrated the substrate layer to greater depth, is no longer scattered back to the detection layer. Electron B, which is scattered at a shallower depth, still returns to the detection layer. Backscatter can be minimized by minimizing the amount of substrate in this front-illuminated configuration.
• Thinning the substrate reduces the available material for removal of heat from the device. As the number of pixels per a given area is increased by advances in process technology, heat removal becomes an ever greater problem.
BRIEF DESCRIPTION OF THE DRAWINGS
• FIG. 1 is a cross section of a prior art silicon imaging detector;
• FIG. 2 is cross section of another prior art silicon imaging detector;
• FIG. 3 is a cross section of an exemplary silicon imaging detector according to implementations described herein;
• FIG. 4A is a graph showing detective quantum efficiency (DQE) for ideal, front, and back illuminated imaging sensors;
• FIG. 4B is a graph comparing DQE for front versus back illuminated imaging sensors to the ideal sensor DQE curve inFIG. 4A;
• FIGS. 5A-C are cross sections of processing stages for an exemplary silicon imaging detector according to embodiments described herein; and
• FIGS. 6A-C are cross sections of processing stages for an exemplary silicon imaging detector according to embodiments described herein.
DETAILED DESCRIPTION
• Those skilled in the art will recognize other detailed designs and methods that can be developed employing the teachings of the present invention. The examples provided here are illustrative and do not limit the scope of the invention, which is defined by the attached claims. The following detailed description refers to the accompanying drawings. The same reference numbers in different drawings may identify the same or similar elements.
• In accordance with embodiments described herein, as shown inFIG. 3, an active pixelsilicon imaging detector300 comprises aSUB layer310, anEPI layer312, aBEOL layer314, and a thermal conduction layer (“TCL”)316. TCL316 is applied to theBEOL layer314 after manufacture of the BEOL layer. Consistent with embodiments described herein,detector300 is exposed to incoming electrons initially from thesubstrate side310, i.e., the sensor is “back-illuminated.” The sensor is back-illuminated because some scattering also occurs in the BEOL, which, in a front-illuminated configuration, lies in front of the detection EPI layer. While pre-detection scatter by the BEOL has little or no effect on the number of detections per incoming electron, the scatter may reduce the spatial correlation between entry point and detection point and may therefore limit the ultimate resolution of the detector. The BEOL cannot be removed as it performs the necessary readout function of the detector. However, back-illumination places the BEOL after the EPI detection layer and eliminates the pre-detection scatter caused by the BEOL.
• As shown inFIG. 3, electrons A and B are detected in theEPI layer312 and then pass through theBEOL layer314. Thethermal conduction layer316 is designed both in thickness and material composition to have a high thermal conductivity but a low propensity to reflect electrons back into theEPI detection layer312. Prior art substrate thickness has been in the range of 10 um to 40 um yielding backscatter fractions from less than 2% to more than 10% for 200 kV and 300 kV electrons. It would be advantageous to reduce that backscatter fraction through reduced Z (atomic number) of the thermal conduction substrate or by reducing the thickness which would be possible with a higher thermal conductivity. In practice materials vary by both these parameters simultaneously. As shown inFIG. 3, Electron A, passes out of theTCL layer316 without being reflected back into the sensor. Electron B is reflected by the TCL layer and detected a second time in thedetection layer312. The thickness of the TCL layer and its composition determine the likelihood of electrons passing through the TCL layer or being reflected back into thesensor300.
• FIG. 4A shows simulated linear detective quantum efficiency (DQE) for three configurations: the solid curve is for an idealized epitaxial layer only (“just EPI”), the middle curve (large dashes) is for a back side illuminated device having a BEOL and epitaxial layer wherein the epitaxial layer is exposed to the electrons directly and the lower curve (short dashes) is for a front side illuminated device having a BEOL and an epitaxial layer (i.e., illuminated through the BEOL).FIG. 4B show simulated ratios of the DQE for the two sensors ofFIG. 4A having a BEOL, as compared to the idealized epitaxial layer only sensor curve ofFIG. 4A.
• Both graphs (FIGS. 4A, 4B) show performance as quantified by linear DQE vs. spatial frequency. Zero spatial frequency at the origin on the left of each graph corresponds to performance of the detector functioning as a whole. Spatial frequency of one times the Nyquist frequency at the right of each graph shows performance for modulations of image signal which go high and low every other pixel. This is the highest spatial modulation frequency that can be acquired by a pixelated detector without aliasing errors.
• FIGS. 4A and 4B show that while material on both the entrance and exit faces of the detector increases scatter at increasing levels of spatial frequency, the scatter that occurs post-detection from material mounted on the exit face (large dash curve in both graphs) is less damaging to high-resolution signal quality. The simulation results also imply that any material in front of the EPI detection layer should be minimized. Exposing the sensor from the back side as inFIG. 3 leaves substrate in front of the epitaxial layer. The conclusion fromFIGS. 4A and 4B is that anything in front of the EPI detection layer reduces DQE, which means that all or most of the substrate (leaving no more than 5 microns), now at the entrance surface, should be removed. Up to now this has been impractical due to the role played by the substrate in providing mechanical support and heat conduction for the sensor. Consistent with embodiments herein, a thermal conduction layer can support the EPI and BEOL layers from the BEOL layer side (i.e. the exit side in a back-side illuminated configuration). Supporting the device with a layer next to the BEOL layer enables complete removal of the original substrate layer. This in turn allows for direct exposure of the EPI layer, which heretofore has not been possible.
• Because the thermal conduction layer is not part of the original sensor fabrication (i.e. not part of the growth of the epitaxial layer or the deposition of the BEOL layer), there is an opportunity to find a thermal layer material better than silicon (which comprises the original substrate and most of the heat removal in prior art devices) for the purpose. The thermal conductivity layer material can be better than the original silicon substrate in two ways. It can have a better thermal conductivity and it can have a lower tendency to scatter electrons. The benefit of the combined effects is proportional to thermal conductivity κ and inversely proportional to the square of atomic number Z. A heuristic quality factor for the purpose of an electron-transmissive thermal conduction layer can be defined as Q=κ/Z². The following table summarizes estimates of κ, Z and Q for some representative materials. The estimates of κ and therefore also of Q are subject to manufacturing method, binder fraction, etc. The table is not meant to be exhaustive but illustrative of the principal used for identifying materials as more or less suited for an electron-transmissive thermal conductive layer as/than silicon.

• TABLE 1
  	min thermal	stoichiometric
  	conductivity	average atomic	quality factor
  Material	(W/mK)	number (Z)	Q = κ/Z2

  aluminum	170	13	1.01
  aluminum nitride	180	10	1.80
  diamond	1000	6	27.78
  pyrolized graphite	700	6	19.44
  beryllium	200	4	12.50
  beryllium oxide	265	6	7.36
  boron nitride	1700	6	47.22
  silicon	190	14	0.97

• Due to the fragility of the thin EPI detector layer, especially after removal of all substrate material, methods for attachment of a thermally conductive layer to the thin device must either be very low force/pressure or a robust temporary support for the thin layers must be provided as part of any higher pressure process step. Methods for affixing a thermal conduction layer to the BEOL of the back-illuminated sensor vary depending on the conduction material.
• Solid refractory dielectrics, including but not limited to boron nitride, beryllium oxide and diamond can be contact bonded onto the sensor BEOL either with or without temperature elevation and with or without applied pressure, followed by removal of excess thermal conduction layer material and also removal of the silicon substrate layer. Contact bonding is described in U.S. Pat. Nos. 5,852,622 and 5,441,803, which are incorporated by reference herein. The substrate is left intact at first, to allow pressure applied for contact bonding of the thermal layer to the BEOL.
• FIGS. 5A-5C show cross sections of the manufacturing process for an imaging sensor according to an aspect of the invention.FIG. 5A shows asensor510 comprising asilicon substrate512, anepitaxial layer514 and aBEOL516.FIG. 5A also shows athermal conduction layer520 supported by a thermalconduction layer substrate522. TheTCL substrate522 can be the same or different material as the TCL itself.FIG. 5B shows the bonding of theBEOL516 of thesensor510 to thethermal conduction layer520. At this stage, both theimaging sensor510 and the thermal conduction layer are supported bysubstrates512,522 to allow pressure to be applied in a contact bonding process. Note that contact bonding may be performed in some embodiments with or without pressure and with or without temperature elevation.FIG. 5C shows the completedimaging sensor510 with theoriginal sensor substrate512 removed and the thermalconduction layer substrate522 removed. Removal of substrate material or excess thermal conduction material can be accomplished by a variety of means including, but not limited to, polishing, chemo-mechanical polishing, ion milling, and laser ablation. The resulting sensor shown inFIG. 5C has an unhinderedepitaxial sensing layer514 that can be directly exposed to electrons without any initial scattering, plus athermal conduction layer520 to remove heat from the device as well as physically support the device.
• The thermal conduction layer to be contact bonded to the sensor can be derived from a variety of initial starting forms and processed in a variety of ways. Consistent with embodiments described herein, the TCL/SUB layer502/522 bonded to the BEOL can be made of a single material which is thicker than thefinal TCL520. The extra thickness is necessary for strength in the bonding process. The layer is contact bonded onto the BEOL layer of the sensor and the extra material is polished off. In this case the ultimate thickness of the thermal conduction layer is determined by close monitoring of the thickness during polishing.
• In a further embodiment, a single material thicker than the final thermal conduction layer is used as a starting material, but the starting material is ion-implanted on the side to be bonded to a predetermined depth. This ion implantation changes the etch rate for a chemical or chemo-mechanical thinning process without changing the thermal or scattering properties of the thermal conduction layer material. Once bonded to the BEOL layer, the thermal conduction material is thinned. The etch stop created by the ion implantation increases the reliability of achieving a given thickness thermal conduction layer.
• In a further embodiment, the thermal conduction layer is epitaxially grown or chemical vapor deposited onto a substrate of a different material than the grown or deposited layer. The substrate is used as a transfer layer. The combined layers are contact bonded to the BEOL layer as above. Once bonded to the BEOL layer the substrate material is removed by one or more of the processes described above.
• In a further embodiment, a thermally conductive powder layer is sintered onto a substrate of similar melting point and coefficient of thermal expansion as the powder. The substrate acting as a transfer layer. The combined layers are contact bonded to the BEOL layer, followed by complete removal of the substrate material after contact bonding.
• Metal layers can be sputtered onto the BEOL.FIGS. 6A-C show cross sections of an exemplary sputtering deposition of a thermal conduction layer616 onto a BEOL614.FIG. 6A shows a sensor610 comprising an epitaxial layer612 and a BEOL614. The original substrate on which the sensor was developed has already been removed in this embodiment.FIG. 6B shows the sputtering of material onto the BEOL to create a thermal conduction layer616.FIG. 6C shows a completed sensor with a fully deposited thermal conduction layer616,
• Powder-based materials can be applied by settling or slurry coating processes in a solvent-thinned binder such as is done for powder phosphor scintillators. The powder-binder mixture is applied to the BEOL layer by means including silk screening or gravitational settling. A liquid powder suspension may also be spin coated onto the BEOL layer. Exemplary binders include but are not limited to sodium silicate, ethyl cellulose, and ammonium polymethacrylate, and cellulose nitrate. While a binder sacrifices some of the thermal conductivity, given the extremely high conductivity of a graphite or boron nitride powder and given sufficiently low binder fraction, the net conductivity will still constitute an improvement over silicon.
• Powder-based thermal conductors can also be deposited directly onto the BEOL layer by spin-coating of a liquid powder suspension.
• In a further embodiment, the starting material for a thermal conductor layer is a flexible sheet comprising a flexible polymer embedding medium for powder heat conduction material. The flexible sheet material can be contact bonded in vacuum to prevent gas entrapment, with or without temperature elevation. The material should be affixed to the BEOL layer after all high-temperature processes are complete on the sensor itself. In this case attachment is performed on a fragile, thin final sensor with only BEOL and epitaxial layers remaining. Thus attachment will need to use only low forces/pressures. Possible low force attachment methods include but are not limited to: directing a gas jet at outer surface of the flexible layer to press and smooth the layer along with low temperature heating to maximize the flexibility and adhesion of the flexible layer. A warm gas jet combines the two effects of smoothing and heating. In a further embodiment, centrifugal force is used to flatten the flexible sheet during adhesion to the BEOL layer of the sensor. In a further embodiment electrostatic-dielectric attraction is used with due care to prevent electrostatic damage to the sensor. Some types of flexible sheets are conductive (graphite-containing for instance) and others are electrically insulating (boron-nitride for instance) and may require different handling in an electrostatic method of attachment.
• Powder-based thermal conductors can be deposited directly onto the BEOL layer by settling or slurry coating in a solvent-thinned binder as is done for powder phosphor scintillators. Exemplary binders include but are not limited to sodium silicate, ethyl cellulose, and ammonium polymethacrylate, and cellulose nitrate. While a binder sacrifices some of the thermal conductivity, given the extremely high conductivity of a graphite or boron nitride powder and given sufficiently low binder fraction, the net conductivity will still constitute an improvement over silicon.
• Powder-based thermal conductors can also be deposited directly onto the BEOL layer by spin-coating of a liquid powder suspension.
• Although the invention has been described in detail above, it is expressly understood that it will be apparent to persons skilled in the relevant art that the invention may be modified without departing from the spirit of the invention. Various changes of form, design, or arrangement may be made to the invention without departing from the spirit and scope of the invention. Therefore, the above-mentioned description is to be considered exemplary, rather than limiting, and the true scope of the invention is that defined in the following claims.
• No element, act, or instruction used in the description of the present application should be construed as critical or essential to the invention unless explicitly described as such. Also, as used herein, the article “a” is intended to include one or more items. Further, the phrase “based on” is intended to mean “based, at least in part, on” unless explicitly stated otherwise.

Claims (19)

What is claimed is:

1. A solid state active pixel image sensor for direct back-illuminated exposure to an electron beam, comprising:

an epitaxial layer;

a back end of line layer formed on the epitaxial layer; and

a thermal conduction layer adhered to or formed on the back end of line layer.

2. The solid state active pixel image sensor ofclaim 1, wherein said epitaxial layer is formed on a substrate comprising silicon, and wherein said substrate comprising silicon is thinned or removed after formation of said epitaxial layer.

3. The solid state active pixel image sensor ofclaim 2, wherein said thinning or removal is performed by polishing, chemo-mechanical polishing, ion milling or laser ablation.

4. The solid state active pixel image sensor ofclaim 2, wherein said substrate has a thickness of between 0 and 5 microns after said thinning or removal.

5. The solid state active pixel image sensor ofclaim 3, wherein said substrate has a thickness of between 0 and 5 microns after said thinning or removal.

6. The solid state active pixel image sensor ofclaim 1, wherein said thermal conduction layer comprises a metal, a metal compound, silicon, boron nitride, diamond or graphite.

7. The solid state active pixel image sensor ofclaim 1, wherein said thermal conduction layer is applied to said back end of line layer by sputtering, contact bonding, electrostatic bonding, as a powder in a solvent-thinned binder by slurry or settling or spin coating.

8. The solid state active pixel image sensor ofclaim 7, wherein said thermal conduction layer is thinned after being applied by polishing, chemo-mechanical polishing, ion milling or laser ablation.

9. A process for manufacture of a solid state active pixel image sensor comprising a thermal conduction layer comprising:

forming an epitaxial image sensing layer on a silicon substrate;

forming a back end of line layer comprising interconnects on top of said epitaxial image sensing layer; and

applying a thermal conduction layer to said back end of line layer.

10. The process ofclaim 9, wherein said thermal conduction layer comprises a metal, a metal compound, silicon, boron nitride, diamond or graphite.

11. The process ofclaim 9, further comprising, thinning said thermal conduction layer by polishing, chemo-mechanical polishing, ion milling, or laser ablation.

12. The process ofclaim 9, further comprising contact bonding said thermal conduction layer to said back end of line layer and then removing some or all of said substrate and a predetermined amount of said thermal conduction layer.

13. The process ofclaim 9, further comprising forming said thermal conduction layer of a first material on a thermal conduction layer substrate of a second material that is different than said first material and removing said thermal conduction layer substrate after said applying.

14. The process ofclaim 9, further comprising forming said thermal conduction layer of a first material, doping to a predetermined depth said thermal conduction layer to create doped and non-doped portions and removing said non-doped portion after said adhering.

15. The process ofclaim 9, further comprising removing some or all of said substrate and wherein said thermal conduction layer comprises a metal, a metal compound, silicon, boron nitride, diamond or graphite.

16. The process ofclaim 9, further comprising removing some or all of said substrate and thinning said thermal conduction layer by polishing, chemo-mechanical polishing, ion milling, or laser ablation.

17. The process ofclaim 9, further comprising removing some or all of said substrate and forming said thermal conduction layer of a first material, doping to a predetermined depth said thermal conduction layer to create doped and non-doped portions and removing said non-doped portion after said adhering.

18. The process ofclaim 9 further comprising removing some or all of said substrate to a thickness of between 0 and 5 microns.

19. The process ofclaim 18 wherein said removing of some or all of said substrate is performed by polishing, chemo-mechanical polishing, ion milling, or laser ablation.

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