US20210148876A1 - System and method for in-line monitoring of airborne contamination and process health - Google Patents

Abstract

The disclosure describes embodiments of an airborne molecular contamination (AMC) monitoring apparatus. The AMC apparatus includes a manifold having a plurality of inlets and one or more outlets. A sampling tube bus fluidly is coupled to the manifold, the sampling tube bus comprising a plurality of individual sampling tubes, each individual sampling tube being fluidly coupled to one of the plurality of inlets. One or more analyzers are each fluidly coupled to one of the one or more outlets of the manifold to analyze fluid drawn into the manifold through one or more of the plurality of individual sampling tubes. A control and communication system coupled to the one or more analyzers. Other embodiments are described and claimed.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS
• This application is a continuation under 35 U.S.C. § 120 of U.S. application Ser. No. 15/496,931, filed 25 Apr. 2017 and still pending, which in turn claims priority under 35 U.S.C. § 119(e) to U.S. Provisional App. No. 62/329,791, filed 29 Apr. 2016. Both priority applications are hereby incorporated by reference in their entirety.
TECHNICAL FIELD
• The disclosed embodiments relate generally to air-borne contamination monitoring and in particular, but not exclusively, to a system and method for in-line monitoring of airborne contamination and process health.
BACKGROUND
• Air quality and airborne molecular contamination (AMC) have been gaining increasing attention in the semiconductor, memory, and other similar high-tech industries (e.g., display) as their processes advance. In these industries, among others, AMC has been identified as major contribution to fabrication failure rate, and the effects of AMC on manufacturing process yield just get worse as the fabrication technology becomes capable of smaller component sizes. Prolonged exposure to AMC has also been identified as a possible risk to human health.
• Manufacturers have been putting significant efforts into on-site continuous monitoring and into controlling facility ambient cleanliness using on-site or off-line AMC sensing equipment. Detailed studies and on-going improvements have been implemented to identify contamination sources and preventive procedures to reduce AMC in a facility's ambient air.
• But although significant efforts have been made to control facility ambient air quality, the cleanliness inside manufacturing equipment such as process equipment modules and movable carriers (e.g., Front Opening Unified Pods (FOUPs) used as substrate/wafer transport containers in the semiconductor industry) are not well-studied. Specific process equipment modules or movable carriers can also contribute to AMC, but in most situations the process equipment modules and substrates have their own enclosed microenvironments, meaning that on-site facility ambient monitoring cannot capture AMC-related problems associated with process equipment modules or movable carriers. Furthermore, when one process equipment module or one movable carrier is contaminated, AMC cross-contamination can occur over a fabrication line, with the movable carrier serving as an AMC carrier that spreads contamination to various locations. As a result, it becomes extremely difficult to trace the source of contamination, even if AMC is later found in one movable carrier or process equipment module.
BRIEF DESCRIPTION OF THE DRAWINGS
• Non-limiting and non-exhaustive embodiments are described with reference to the following figures, in which like reference numerals refer to like parts throughout the various views unless otherwise specified.
• FIGS. 1A-1B are drawings of an embodiment of a manufacturing process used for semiconductor fabrication.
• FIG. 2 is a drawing illustrating an embodiment of an in-line monitoring application of a Total Airborne Molecular Contamination (TAMC) apparatus in semiconductor fabrication.
• FIG. 3A is a block diagram of an embodiment of a TAMC apparatus.
• FIGS. 3B-3D are block diagrams of embodiments of manifolds that can be used in the embodiment of a TAMC apparatus shown inFIG. 3A.
• FIG. 4 is a block diagram of another embodiment of an in-line monitoring application using an embodiment of a TAMC apparatus.
• FIG. 5 is a block diagram of another embodiment of an in-line monitoring application using an embodiment of a TAMC apparatus.
• FIG. 6 is a block diagram of another embodiment of an in-line monitoring application using an embodiment of a TAMC apparatus.
• FIG. 7 is a block diagram of another embodiment of an in-line monitoring application using an embodiment of a TAMC apparatus.
• FIG. 8 is a block diagram of another embodiment of an in-line monitoring application using an embodiment of a TAMC apparatus.
• FIG. 9 is a block diagram of another embodiment of an in-line monitoring application using an embodiment of a TAMC apparatus.
DETAILED DESCRIPTION OF THE ILLUSTRATED EMBODIMENTS
• Embodiments are described of a system and method for in-line monitoring of airborne contamination and process health. Specific details are described to provide an understanding of the embodiments, but one skilled in the relevant art will recognize that the invention can be practiced without one or more of the described details or with other methods, components, materials, etc. In some instances, well-known structures, materials, connections, or operations are not shown or described in detail but are nonetheless encompassed within the scope of the invention.
• Reference throughout this specification to “one embodiment” or “an embodiment” means that a described feature, structure, or characteristic can be included in at least one described embodiment, so that appearances of “in one embodiment” or “in an embodiment” do not necessarily refer to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.
• FIGS. 1A-1B illustrate an embodiment of amanufacturing line100.Manufacturing line100 can be used in semiconductor fabrication, for instance, but in other embodiments could be used for other purposes and with different equipment than shown.
• Manufacturing line100 is positioned in anenclosure102, which can be a building, a room or bay within a building, or some other type of enclosure. One or moreprocess equipment modules104 are positioned withinenclosure102. Eachprocess equipment module104 includes a load port and can include one or more chambers, each of which performs different functions related to the manufacturing steps carried out by that particular process equipment module.
• Manufacturing processes generally involve many steps, and each process equipment module performs only some of the steps in the overall manufacturing process. As a result, the items being manufactured onmanufacturing line100—semiconductor wafers with processors, memories, MEMS chips, optical chips, etc., in a semiconductor manufacturing facility—must be moved from one process equipment module to another until all the steps in the process are performed. Moving the items being manufactured is accomplished usingmovable carriers106 that carry the items being manufactuned inside, often in a sealed micro environment. In a semiconductor facility embodiment such as the one shown,movable carriers106 are called Front-Opening Unified Pods (FOUPs), wafer containers, or substrate containers, because they are used to transport semiconductor wafers. But in other embodiments other types of movable carrier can be used.
• A transport system carries eachmovable carrier106 from the load port of oneprocess equipment module104 to the load port of another, so that different steps can be performed on the items being manufactured that are carried inside the movable carrier. In the illustrated embodiment, the transport system is an overhead track-and-hoist system. Wheeled and motorizedcarriages110 run along atrack108. Ahoist112 is mounted to eachwheeled carriage110 to liftmovable carriers106 in the z direction and also potentially move them in the y direction (i.e., into and out of the page) so thatmovable carriers106 can be placed on load ports that can accommodate multiple carriers.
• As best seen inFIG. 1B,track108 winds throughfacility102 to transport themovable carriers106—and hence the items being manufactured, which are carried inside the movable carriers—to multiple process equipment modules; the illustrated embodiment has seven processing equipment modules P1-P7, but other embodiments can have a different number. After the items being manufactured move through all theprocess equipment modules104 in aparticular enclosure102, the transportsystem exits enclosure102 with the movable carrier.
• Significant effort and studies have been done to control the facility ambient air quality inenclosure102, but the cleanliness of the environment insideprocess equipment modules104 and insidemovable carriers106 are not well-studied. In addition to the facility ambient contaminants—that is, contaminants that come from the facility's overall air handling systems such as ventilation and air conditioning—process equipment modules104 or movable carriers/FOUPs106 can contribute Airborne Molecular Contamination (AMC). Because theprocess equipment modules104 andmovable carriers106 include closed chambers with their own internal micro-environments, on-site overall facility ambient monitoring cannot capture AMC problems associated with process equipment modules or movable carriers. For instance, when one process equipment module or one movable carrier is contaminated, cross-contamination can spread AMC over the fabrication line, with themovable carrier106 serving as an AMC carrier that transmits AMC to various locations. But with existing overall facility ambient monitoring it is extremely difficult to trace the source of contamination even if AMC is later found in one movable carrier or process equipment module.
• An alternative method is to install an on-site movable-carrier-only AMC monitoring system. In such systems, when wafers are finished in one process equipment module and stored in a movable carrier for transport to another, the movable carrier is detoured from its normal process sequence and sent to the on-site AMC movable carrier monitoring system for analysis on the air inside. But although such an AMC monitoring system can be an on-site monitoring tool, it is actually an off-process monitoring method because the movable carrier no longer follows the regular process sequence. And since the movable carrier must be detoured from normal fabrication to be analyzed, the approach introduces additional uncertainties due to interference in the normal process sequence. Moreover, in such an approach, the on-site movable-carrier-only AMC monitoring system has limited capacity and can only test a limited number of movable carriers (also, this way it will not significantly impact the process throughput). And even if the monitoring system can increase its screening capacity, the need to detour movable carriers still adds extra process sequence to the fabrication, which in turn slows down process throughput. Therefore, such an approach is limited only to screening movable carriers. It does not serve the purpose of in-line AMC monitoring on movable carriers and process equipment modules.
• FIG. 2 illustrates an embodiment of an in-line monitoring system200 using a Total Airborne Molecular Contamination (TAMC)apparatus226 fluidly coupled to aprocess equipment module202. In the illustrated embodiment,process equipment module202 includes aload port204 on which one or more movable carriers206 (FOUPs in this embodiment) can be loaded; the illustrated embodiment shows a load port capable of receiving four movable carriers, but in other embodiments the load port can accommodate a different number of movable carriers than shown.Process equipment module202 includes three chambers in addition to load port204: afront interface208 is next to loadport204, a processload lock chamber210 is next tofront interface208 and, finally, aprocess chamber212, where the relevant manufacturing steps are performed on the items being manufactured, is next to loadlock chamber210.
• Individual sampling tubes are fluidly coupled to each chamber withinprocess equipment module202. As used herein, when components are “fluidly coupled” it means that they are coupled in such a way that fluid can flow from one to or through the other.Individual sampling tube216 is fluidly coupled to processchamber212,individual sampling tube218 is fluidly coupled to loadlock chamber210, andindividual sampling tube220 is fluidly coupledfront interface208.Individual sampling tubes216,218, and220 form asampling tube bus214.Individual sampling tubes222 are fluidly coupled to loadport204—or, more specifically, to the components withinload port204 that will fluidly couple to the interiors ofmovable carriers206. In the illustrated embodiment there are fourindividual sampling tubes222 becauseload port204 can accommodate four movable carriers, but in other embodiments the number of individual sampling tubes can match the number of movable carriers that the load port can accommodate. Samplingtube bus214 andindividual sampling tubes222 then form a furthersampling tube bus224 that is fluidly coupled toTAMC226.
• TAMC226 is communicatively coupled, by wire or wirelessly, to a remote data/control server228.Process equipment module202 is also communicatively coupled, by wire or wirelessly, to remotedata control server228 and/or directly toTAMC226. Remotedata control server228 can also be communicatively coupled, by wire or wirelessly, directly toprocess equipment module202.
• In operation of in-line monitoring system200, the movable carriers/FOUPs are transferred to the load port, such that their bottom air inlets and outlets fluidly coupled to mating inlets/outlets in the load ports that will purge either N2 or clean air (XCDA) to flush air/AMC out from the interior ofmovable carriers206 to an exhaust outlet under the load port. In one embodiment,individual sampling tubes222 can be connected to the exhaust of the load port purging system, where they can then collect, analyze, and report the purged air cleanliness from eachmovable carrier206. The exhaust air cleanliness represents the contamination level of the micro-environment in each movable carrier, which can be linked to the cleanliness of their previous process at another location. After the short purge process, the movable carrier's front door is opened and the wafers inside are transferred into the other chambers of the process equipment module—front interface208,load lock210, andprocess chamber212, in that sequence—for the required fabrication steps.
• In addition to monitoring AMC insidemovable carriers206,system200 can, additionally or simultaneously, monitor AMC in the interiors of front interface (FI)chamber208, theload lock chamber210, or theprocess chamber212, which can be sampled and analyzed by theTAMC apparatus226 to understand the cleanliness of each chamber. While waiting for each wafer (typically 25 wafers in a FOUP) to be processed in the chambers ofprocess equipment module202,TAMC apparatus226 can continue sampling and analysis of air collected from each channel (i.e., each individual sampling tube) to record changes in AMC levels. Such an AMC monitoring process provides in-line real time AMC results for specific process steps and locations, but without altering existing fabrication procedures because the system can directly collect air sample from the specific target via the corresponding tube channel in-line without interfering the normal manufacturing process sequence. Withsystem200 there is no need to pull the movable carriers/FOUPs206 from their normal process for AMC analysis.
• One or both ofTAMC226 andprocess equipment module202 can communicate wired or wirelessly with a remote data/control server228, so that they can receive commands on when and which channel (i.e., individual sampling tube) to sample and analyze. Meanwhile,TAMC226 can report test results back toremote server228 as feedback for fabrication process control, whichserver228 can then communicate to theprocess equipment module202, by wire or wirelessly, to cause adjustments such as modification of the fabrication recipe. In another embodiment,TAMC apparatus226 can be programmed to directly communicate with the process equipment, by wire or wirelessly, to control the fabrication process based on the in-line AMC results measured by the TAMC apparatus. Sampling and analysis at theload port204,front interface208,load lock210, orprocess chamber212 can be in time sequence or in parallel, and can either be pre-programmed in theTAMC apparatus226 or accomplished with commands sent from remote data/control server228.
• FIGS. 3A-3D together illustrate embodiments of aTAMC apparatus300 that can be used in an in-line monitoring system and method for airborne contamination and process health monitoring, such as shown inFIGS. 2 and 4-9.FIG. 3A is a block diagram of an embodiment ofTAMC apparatus300, which comprises a combination of several devices to collect, analyze, and report AMC detection results.
• TAMC300 is housed within ahousing302, which can be fixed or movable. For instance,housing302 can be a fixed or movable cabinet, or in some embodiments it can be a movable carrier such as movable carriers206 (see, e.g.,FIG. 9).TAMC300 includes a manifold304 with inlets that are fluidly coupled to the individual sampling tubes from sampling tube bus224 (seeFIGS. 3B-3C).Manifold304 also includes one or more outlets fluidly coupled to a variety of analyzers viatubes306.Tubes306 includevalves307 so that output from the manifold can be selectively directed to any analyzer or combination of analyzers.Tubes306 are inert to all AMC compounds and do not attract AMC compounds either. They can be a passivated or coated metal tube, or an inert plastic tube (e.g., PFA or Teflon).
• Analyzers308-328 can include sensors or sensor arrays for their particular type of detection, but in some embodiments they can also include additional components including gas chromatographs, pre-concentrators, traps, filters, valves, and so forth. Various gas analyzers (VOCs, acids, bases, etc.), particle counter, humidity sensor, temperature sensor, ions analyzers can be used in different embodiments. Among others, and without being limited to the listed analyzers, embodiments ofTAMC300 can include one or more of the following types of analyzers:
• • An analyzer to collect and analyze the concentrations of specific (individual) volatile organic compounds (VOCs), such as IPA and/or detect total concentration of VOCs.
  • An analyzer to collect and analyze the concentrations of specific (individual) acid compounds (e.g., HF, H₂SO₄, HCL, etc.) and/or detect total concentration of acids.
  • An analyzer to collect and analyze the concentrations of specific (individual) base compounds (e.g., NH₄OH, NaOH, etc.) and/or detect total concentration of bases.
  • An analyzer to collect and analyze the concentrations of specific (individual) Sulfide compounds and/or detect total concentration of Sulfides.
  • An analyzer to collect and analyze the concentrations of specific (individual) Amine compounds and/or detect total concentration of Amines.
  • An analyzer that is connected to the manifold apparatus to detect air particle or aerosol counts.
  • An analyzer to detect sample humidity.
  • An analyzer to detect the sample temperature.
  • An analyzer to detect fluoride compounds, such as chemical coolant agents (e.g., Carbon Fluoride compounds (CxF)) or dry etching chemicals (e.g., CxFy), and/or detect total concentration of chemical cooling agents such as Carbon Fluorides or total concentration of dry etching agents.
  • An analyzer to collect and analyze the concentrations of specific (individual) Anions (negatively-charged ions), such as F—, Cl—, PO43-, NOx-, SO22-, and/or detect total concentration of Anions.
  • An analyzer to collect and analyze the concentrations of specific (individual) Cations (positively-charged ions), such NH4+, and/or detect total concentration of Cations.
  • An analyzer to collect and analyze the concentrations of specific (individual) Metal ions and/or detect total concentration of Metal Ions.
  • An analyzer to collect and analyze the concentrations of specific (individual) silicon doping ions and/or detect total concentration of dopants.
• Analyzers308-328 are communicatively coupled to control andcommunication system332, which integrates the operation of all the analyzers and apparatus included in theTAMC apparatus300. Control andcommunication system332 is used to receive, process, and/or interpret data received from analyzers308-328, and each analyzer and its associatedvalve307 can be controlled by the control and communication system for sample analysis. In one embodiment, the hardware of control andcommunication system332 can be a general-purpose computer including a processor, memory, storage, and so on, together with software having instructions that cause the listed hardware to perform the required functions. In other embodiments, however, control andcommunication system332 can be a special-purpose computer such as an application specific integrated circuit (ASIC), also with software having instructions that cause it to perform the required functions.
• Control andcommunication system332 can be communicatively coupled, by wire or wirelessly, to one or more process equipment modules, and/or to a remote data/control server (see, e.g.,FIG. 2) that gathers data from each TAMC and that can control each TAMC and the process equipment to which it is coupled. The TAMC system can thus receive and transmit real-time test results update or receive operation commands from the server, such as the specific sampling channel (i.e., a specific individual sampling tube) on which to perform in-line AMC analysis.
• As shown and discussed elsewhere (seeFIGS. 2 and 4-9), one ormore TAMCs300 can be used to monitor multiple movable carriers/FOUPs, multiple chambers in of one or more process equipment modules, or combinations of the movable carriers and process equipment modules. Use ofTAMC300 provides a method of direct in-line monitoring without interfering with the normal manufacturing process.
• FIG. 3B illustrates an embodiment of a manifold350 that can be used inTAMC system300.Manifold350 includes one ormore inlet tubes354 fluidly coupled, via three-way valves356, to individual sampling tubes352. The illustrated embodiment has five individual sampling tubes352a-352ewith corresponding valves356a-356e,but other embodiments can be configured with a different number of individual sampling tubes and a different number of valves, and not every sampling tube need have a valve.
• In the illustrated embodiment,inlet tube354 has a design that eliminates dead space that can trap contaminants in the inlet tube. Each three-way valve356 has an additional port that can be used as a flush port for its individual sampling tube, but in other embodiments other types of valves can be used instead of three-way valves356.
• Abuffer tank360 is fluidly coupled toinlet tube354 via a three-way valve358. Buffer tank allowsTAMC system300 to collect a large volume of sample within a short period of time (e.g., 20 liters within 5 seconds). In some situations, the AMC contamination level may change after less than 10 seconds.Valves358 and270 (which can be three-way valves or switch valves) are placed at the inlet and outlet ofbuffer tank360; these valves open when air sampling is needed and close when air sample is collected.Buffer tank360 also allows collection of transient AMC from the outlet of specific location for the analyzers to measure the contamination level later on.
• Buffer tank360 has a clean air inlet fluidly coupled to its interior viapressure controller362 andvalve364, as well as a clean air outlet fluidly coupled to the interior of thebuffer tank360 byvalve366. The clean air inlet and clean air outlet provide the ability to flush the interior ofbuffer tank360 to clean any sample that remains inside the buffer tank or sampling tubes.Buffer tank360 can also optionally have inambient air inlet372 coupled fluidly coupled to the interior ofbuffer tank360 byvalve374.
• Anoptional sampling pump368 can be fluidly coupled to the interior ofbuffer tank360 viavalve370. When present,sampling pump368 can be used to draw samples received atinlet tube354 into the intenor ofbuffer tank360.Sampling pump368 reduces pressure inbuffer tank360 to extract the air from the outlets of load port exhaust, FI, load lock, or process chamber. In embodiments where the outputs of the load port exhaust, FI chamber, load lock chamber, or process chamber, and hence individual sampling tubes352, have positive pressure/flow,sampling pump368 might not be required.
• One or more analyzers, up to N analyzers, can be fluidly coupled to the outlet ofbuffer tank360 viavalves376; these analyzers correspond to analyzers308-328 shown inFIG. 3A. A non-exclusive list of the types of analyzers that can be used in different embodiments is provided above in connection withFIG. 3A.
• FIG. 3C illustrates an embodiment of a manifold375 that can be used inTAMC300.Manifold375 is similar in most respects themanifold350. The primary difference betweenmanifolds375 and350 is that that in some instances it may be useful to analyze samples before they go intobuffer tank360. Some analyzers/sensors have fast sensing response or contain internal fast sampling modules which do not need to be connected to the buffer tank to share the collected sample. To accommodate that,manifold375 has adiverter380 fluidly coupled intube354 upstream of three-way valve358.Diverter380 is in turn fluidly coupled to one or more analyzers such as a temperature/humidity analyzer382 or some other type ofanalyzer384. In such an embodiment, the analyzer/sensor does not consume the sample collected inbuffer tank360.
• FIG. 3D illustrates another embodiment of amanifold390.Manifold390 is similar in most respects tomanifolds350 and370. The primary difference is thatmanifold390 does not includebuffer tank360. In embodiments where a buffer tank is not needed to collect and preserve large sample volumes,buffer tank360 can be replaced by atube392 with fluid couplings to individual analyzers. For instance, in oneembodiment tube392 could be coupled to the N analyzers using multiple diverters (e.g., likediverter380 in one embodiment) connected in series totube392 to divert sample fluid to one or more of the N individual analyzers.
• FIG. 4 illustrates an embodiment of an in-line monitoring system400 that uses an embodiment of a TAMC apparatus such asTAMC300. Inmonitoring system400, one or more process equipment modules are positioned in a manufacturing facility. The illustrated embodiment has twoprocess equipment modules402 and404, but other embodiments can include more or less process equipment modules than shown. A transport system moves movable carriers, FOUPs in this embodiment, from one process equipment module to the other.
• Process equipment module402 has asampling tube bus408 coupled to one or more of its chambers, andprocess equipment module404 similarly has asampling tube bus410 coupled to one or more of its chambers. Samplingtube buses408 and410 are shown in a simplified form to avoid cluttering the drawing, but in an embodimentsampling tube buses408 and410 can each include a set of individual sampling tubes and tube buses fluidly coupled toprocess equipment module402 as shown inFIG. 2.
• TAMC406 is movable and can be quickly connected and disconnected from samplingtube buses408 and410. With the ability to quickly connect and disconnect fromtube buses408 and410,TAMC406 can be easily moved betweenprocess equipment module402 andprocess equipment module404, for instance by housing it in a rolling cabinet.TAMC apparatus406 can first be fluidly coupled toprocess equipment module402 for a certain period of time to in-line monitor the process equipment cleanliness and also monitor FOUPs that are transferred to it. TAMC system can then be moved and fluidly coupled toprocess equipment module404 for subsequent AMC monitoring of its cleanliness and the cleanliness inside FOUPs that are transferred to it.
• FIG. 5 illustrates another embodiment of an in-line monitoring system500. Insystem500, multiple TAMCs can be connected to aprocess equipment module502 to focus on independently monitoring specific chambers within the process equipment module.
• In the illustrated embodiment,process equipment module502 has multiple chambers; as before, it has a load port where one or more movable carriers such as a FOUP can be mated, and in the illustrated embodiment it also has a front interface, a process load lock chamber, and a process chamber. Different TAMCs are fluidly coupled to different chambers within process equipment module502: in the illustrated embodiment oneTAMC504 is fluidly coupled to the load port, anotherTAMC506 is fluidly coupled to the front interface, and athird TAMC508 is fluidly coupled to both the load lock chamber and the process chamber. In other embodiments, the fluid connections can be different than shown. Although not shown in the figure, TAMCs504-508, as well asprocess equipment module502, can be communicatively coupled as shown inFIG. 2, by wire or wirelessly, to each other, to a central server, or both to each other and to a central server.
• FIG. 6 illustrates another embodiment of an in-line monitoring system600.System600 includes a plurality of process equipment modules; the illustrated embodiment has16 process equipment modules labeled L1-L16, but other embodiments can have more or less process equipment modules than shown. The system includes two separatesampling tube buses602 and604. Samplingtube bus602 has one or more individual sampling tubes fluidly coupled to every process equipment module L1-L16, andsampling tube bus604 also has one or more individual sampling tubes fluidly coupled to every process equipment module L1-L16.
• Various sampling tube bus arrangements are possible in different embodiments ofsystem600. In one embodiment, for instance,sampling tube bus602 can have all its individual sampling tubes coupled to one type of process equipment module chamber while samplingtube bus604 can have its individual sampling tubes coupled to another type of chamber. For instance,sampling tube bus602 can have its individual sampling tubes coupled to the load ports of process equipment modules L1-L16, while samplingtube bus604 has its individual sampling tubes coupled to the process chambers of process equipment modules L1-L16. In another embodiment,bus602 can have its individual sampling tubes coupled to one combination of chambers on each process equipment module, whilebus604 has its individual sampling tubes coupled to another combination of chambers in each process equipment module. In still another embodiment, bothbuses602 and604 can have all of their individual sampling tubes coupled to all chambers of every process equipment module, as shown for instance inFIG. 2.
• A TAMC is fluidly coupled to each sampling tube bus to collect and analyze samples collected from each individual sampling tube: TAMC606 is coupled tosampling tube bus602 and TAMC608 is fluidly coupled tosampling tube bus604, so there is a one-to-one correspondence of TAMCs to sampling tube buses. In other embodiments, however,sampling tube buses602 and604 could be separated and directed to a greater or lesser number of TAMCs that shown. As in other illustrated embodiments, TAMCs602-608, as well as individual process equipment modules L1-L16, can be communicatively coupled, by wire or wirelessly, to each other and/or to a central to a remote server/control center610, as shown inFIG. 2. The communication connection between process equipment modules L1-L16 and server610 are not shown to avoid cluttering the drawing.
• With in-line monitoring system600, a combination of different in-line TAMC systems may be used to cover the same process region. One or more in-line TAMC system may be fluidly coupled and focused on monitoring the load port FOUP exhaust, while another in-line TAMC system may be fluidly coupled and focused on monitoring FI chamber of all equipment within the targeted process region. Likewise for additional in-line TAMC systems for all load lock chambers and/or process chambers within the targeted process region in the fab.
• FIG. 7 illustrates another embodiment of an in-line monitoring system700.System700 includes a plurality of process equipment modules; the illustrated embodiment has16 process equipment modules labeled L1-L16, but other embodiments can have more or less process equipment modules than shown. The system includes two separatesampling tube buses702 and704. Samplingtube bus702 has one or more individual sampling tubes fluidly coupled to chambers of a subset of the process equipment modules—modules L1-L4 and L9-L12 in this embodiment—andsampling tube bus704 also has one or more individual sampling tubes fluidly coupled to the chambers of a different subset of process equipment modules—L5-L8 and L13-L16 in this embodiment.
• Various sampling tube bus arrangements are possible in different embodiments ofsystem700. In one embodiment, for instance,sampling tube bus702 can have all its individual sampling tubes coupled to one type of process equipment module chamber while samplingtube bus704 can have its individual sampling tubes coupled to another type of chamber. For instance,sampling tube bus702 can have its individual sampling tubes coupled to the load ports of process equipment modules L1-L4 and L9-L12, while samplingtube bus704 has its individual sampling tubes coupled to the process chambers of process equipment modules L5-L8 and L13-L16. In another embodiment,bus702 can have its individual sampling tubes coupled to one combination of chambers on each process equipment module in its subset, whilebus704 has its individual sampling tubes coupled to another combination of chambers in each process equipment module in its subset. In still another embodiment, bothbuses702 and704 can have all of their individual sampling tubes coupled to all chambers of every process equipment module in their subset, as shown for instance inFIG. 2.
• A TAMC is fluidly coupled to each sampling tube bus to collect and analyze samples collected from each individual sampling tube:TAMC706 is coupled tosampling tube bus702 andTAMC708 is fluidly coupled tosampling tube bus704, but in other embodiments samplingtube buses702 and704 could be separated and directed to a greater or lesser number of TAMCs that shown. As in other illustrated embodiments, TAMCs702-708, as well as individual process equipment modules L1-L16, can be communicatively coupled, by wire or wirelessly, to each other and/or to a central to a remote server/control center710, as shown inFIG. 2. The communication connection between process equipment modules L1-L16 and server710 are not shown to avoid cluttering the drawing.
• With in-line monitoring system700,TAMCs706 and708 can be used and connected to multiple process equipment/modules through expanded manifold design (i.e., more sampling channels) to cover certain process region inside the manufacturing facility. Each in-line TAMC can be configured to monitor the FOUP load port exhaust, FI, load lock, or process chamber) for specific amount of process equipment (and FOUPs).
• FIG. 8 illustrates another embodiment of an in-line monitoring system800.System800 includes a plurality of process equipment modules; the illustrated embodiment has16 process equipment modules labeled L1-L16, but other embodiments can have more or less process equipment modules than shown. The system includes two separatesampling tube buses802 and804. Samplingtube bus802 has one or more individual sampling tubes fluidly coupled to chambers of a subset of the process equipment modules—modules L1-L4 and L9-L12 in this embodiment—andsampling tube bus804 also has one or more individual sampling tubes fluidly coupled to the chambers of a different subset of process equipment modules—L5-L8 and L13-L16 in this embodiment.
• Various sampling tube bus arrangements are possible in different embodiments ofsystem800. In one embodiment, for instance,sampling tube bus802 can have all its individual sampling tubes coupled to one type of process equipment module chamber while samplingtube bus804 can have its individual sampling tubes coupled to another type of chamber. For instance,sampling tube bus802 can have its individual sampling tubes coupled to the load ports of process equipment modules L1-L4 and L9-L12, while samplingtube bus804 has its individual sampling tubes coupled to the process chambers of process equipment modules L5-L8 and L13-L16. In another embodiment,bus802 can have its individual sampling tubes coupled to one combination of chambers on each process equipment module in its subset, whilebus804 has its individual sampling tubes coupled to another combination of chambers in each process equipment module in its subset. In still another embodiment, bothbuses802 and804 can have all of their individual sampling tubes coupled to all chambers of every process equipment module in their subset, as shown for instance inFIG. 2.
• In the illustrated embodiment, amovable TAMC806 is fluidly coupled to each sampling tube bus at a different time to collect and analyze samples collected from each individual sampling tube in that bus. With the ability to quickly connect and disconnect fromsampling tube buses802 and804,TAMC806 can be easily moved between sampling tube buses, for instance by housing it in a rolling cabinet.TAMC806 is first coupled tosampling tube bus802. When finished monitoring that corresponding subset of process equipment modules,TAMC806 is then uncoupled fromsampling tube bus802 and fluidly coupled tosampling tube bus804. As in other illustrated embodiments,TAMC806, as well as individual process equipment modules L1-L16, can be communicatively coupled, by wire or wirelessly, to each other and/or to a central to a remote server/control center810, as shown inFIG. 2. The communication connection between process equipment modules L1-L16 and server810 are not shown to avoid cluttering the drawing.
• With in-line monitoring system800, the single inline TAMC system is connected to multiple process equipment/modules through expanded manifold design (more sampling channels) to cover certain process region inside the manufacturing facility. In-line TAMC may be moved from location A to location B covering AMC monitoring in location B region with multiple process equipment. In another embodiment, the single in-line TAMC system connected to multiple process equipment/modules through expanded manifold design (more sampling channels) to cover certain process region inside the manufacturing facility can be movable. The in-line TAMC may be moved from location A to location B covering AMC monitoring in location B region with multiple process equipment.
• FIG. 9 illustrates another embodiment of an in-line monitoring system900.Monitoring system900 is in most respects similar tomonitoring system200 shown inFIG. 2: the fluid couplings betweenTAMC226 and the different chambers of process equipment module as substantially202 are substantially the same, and the communicative couplings betweenTAMC226,process equipment module202, and remote data/control server228 are also substantially the same.
• The primary difference betweensystem900 andsystem200 is that insystem900TAMC226 includes itsown load port902 to whichmovable carriers904 can be mated for analysis, just as movable carriers can be mated to loadport204 ofprocess equipment module202. In one embodiment,load port902 provides additional locations wheremovable carriers904 and206 can be docked for analysis. In another embodiment,load port902 allowsTAMC226 to serve as a base station for purpose-specificmovable carriers904. For example, amovable carrier904 can be a special process health monitoring FOUP that carries battery-powered sensors or sampling collectors inside the FOUP (instead of the semiconductor wafers it would normally carry) to perform further detailed TAMC analysis, FOUP cleaning, or in-FOUP battery charging. Purpose-specific movable carriers/FOUPs can also be transferred to loadport204, the same as a regular process FOUP.Load port902 can also be used to perform AMC analysis directly on the standard movable carriers or process FOUPs, with or without wafers inside.
• The above description of embodiments, including what is described in the abstract, is not intended to be exhaustive or to limit the invention to the described forms. Specific embodiments of, and examples for, the invention are described herein for illustrative purposes, but various equivalent modifications are possible within the scope of the invention in light of the above detailed description, as those skilled in the relevant art will recognize. In-line TAMC system with load port design for direct FOUP docking and analysis.
• The terms used in the following claims should not be interpreted to limit the invention to the specific embodiments disclosed in the specification and the claims. Rather, the scope of the invention is to be determined entirely by the following claims, which are to be interpreted using established claim interpretation doctrines.

Claims (19)

What is claimed is:

1. An airborne molecular contamination (AMC) monitoring apparatus comprising:

a manifold including one or more inlet tubes that reduce or eliminate dead space and one or more outlets fluidly connected to the one or more inlet tubes;

a sampling tube bus fluidly coupled to the one or more inlet tubes, the sampling tube bus comprising a plurality of individual sampling tubes, at least one sampling tube being fluidly coupled to the one or more inlet tubes of the manifold by a multi-way valve;

two or more analyzers, each fluidly coupled to one of the one or more outlets of the manifold to analyze fluid drawn into the manifold through one or more of the plurality of individual sampling tubes; and

a control and communication system coupled to the two or more analyzers.

2. The AMC monitoring apparatus ofclaim 1 wherein each individual sampling tube is coupled to a chamber of a process equipment station.

3. The AMC monitoring apparatus ofclaim 1 wherein the each of the two or more analyzers can include an individual or total volatile organic compounds (VOC) detector, an acid compound detector, a base compound detector, a sulfide compound detector, an amine compound detector, an air particle or aerosol count detector, a humidity detector, a temperature detector, a chemical coolant detector, an anion detector, a cation detector, a metal ion detector, or a doping ion detector.

4. The AMC monitoring apparatus ofclaim 1 wherein the manifold further comprises:

a buffer tank fluidly coupled by a multi-way valve to the one or more outlets of the one or more inlet tubes; and

a clean air inflow and a clean air outflow coupled to the buffer tank to flush out the interior of the buffer tank.

5. The AMC monitoring apparatus ofclaim 4 wherein the manifold further comprises a pump fluidly coupled to the interior of the buffer tank.

6. The AMC monitoring apparatus ofclaim 5, further comprising one or more analyzers coupled to the one or more inlet tubes upstream of the multi-way valve that couples the one or more outlets of the one or more inlet tubes to the buffer tank.

7. The AMC monitoring apparatus ofclaim 6 wherein the one or more analyzers coupled to the one or more inlet tubes upstream of the multiway valve include a temperature analyzer or a humidity analyzer.

8. The AMC monitoring apparatus ofclaim 4, further comprising a pump fluidly coupled to the multi-way valve that couples the one or more inlet tubes to the buffer tank.

9. The AMC monitoring apparatus ofclaim 1 wherein the control and communication system is communicatively coupled, wirelessly or by wire, to a remote server, to a process equipment module, or to both a remote server and a process equipment module.

10. The AMC monitoring apparatus ofclaim 1, further comprising a load port attached to the AMC monitoring apparatus and fluidly coupled to at least one individual sampling tube.

11. An environmental monitoring system comprising:

a sampling bus comprising a plurality of sampling tubes, wherein each sampling tube is fluidly coupled to one or more chambers of at least one process equipment module;

one or more airborne molecular contamination (AMC) apparatuses fluidly coupled to the sampling bus, each airborne contamination apparatuses comprising:

a manifold including one or more inlet tubes that reduce or eliminate dead space and one or more outlets fluidly connected to the one or more inlet tubes,

a sampling tube bus fluidly coupled to the one or more inlet tubes, the sampling tube bus comprising a plurality of individual sampling tubes, at least one sampling tube being fluidly coupled to the one or more inlet tubes of the manifold by a multi-way valve,

two or more analyzers, each fluidly coupled to one of the one or more outlets of the manifold to analyze fluid drawn into the manifold through one or more of the plurality of individual sampling tubes, and

a control and communication system coupled to the two or more analyzers; and

a remote server communicatively coupled, wirelessly or by wire, to the control and communication system.

12. The system ofclaim 11 wherein each process equipment module includes a load port to receive a moveable carrier carrying items being manufactured.

13. The system ofclaim 12 wherein at least one individual sampling tube is fluidly coupled to each load port to sample the environment inside the movable carrier when the movable carrier is placed on the load port.

14. The system ofclaim 12 wherein individual sampling tubes are fluidly coupled to an interface chamber, a lock load chamber, and a process chamber of the process equipment module to sample the environment within each chamber.

15. The system ofclaim 11 wherein the at least one process equipment module comprises a plurality of process equipment modules grouped into two or more sets, each set having its own sampling bus and its own AMC apparatus coupled to the sampling bus.

16. The system ofclaim 11 wherein the at least one process equipment module comprises a plurality of process equipment modules grouped into two or more sets, each set having its own sampling bus, and wherein a single movable AMC apparatus is connected and disconnected from each sampling bus to monitor each set.

17. The system ofclaim 11 wherein the at least one process equipment module comprises a plurality of process equipment modules, wherein each process equipment module is coupled to a pair of sampling buses and wherein each of the pair of sampling buses is connected to its own environmental monitoring apparatus.

18. The system ofclaim 11 wherein the control and communication system is communicatively coupled, wirelessly or by wire, to a remote server, to the at least one process equipment module, or to both the remote server and the at least one process equipment module.

19. The system ofclaim 11, further comprising a load port attached to at least one of the one or more AMC apparatuses and fluidly coupled to at least one individual sampling tube of the AMC apparatus to which it is attached.

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