US20200323107A1

Movatterモバイル変換

Info

Publication number: US20200323107A1
Application number: US16/910,004
Authority: US
Inventors: Travis North; Steven BORNFIELD; Samuel Rodriguez
Original assignee: Chatsworth Products Inc
Current assignee: Chatsworth Products Inc
Priority date: 2011-12-09
Filing date: 2020-06-23
Publication date: 2020-10-08
Also published as: US20130149954A1; US20170231119A1; US10709039B2; US20230413491A1; US9655259B2

Abstract

A data processing equipment structure includes a plurality of sidewalls and a ceiling panel, which, together, define an enclosed space. The structure further includes at least one equipment enclosure and at least one cooling unit arranged in side-to-side relationship in a row within the enclosed space. At least one separation panel divides the enclosed space into a front plenum at a front side of the row and a rear plenum at a rear side of the row. Cool air in the front plenum is isolated from heated exhaust air in the rear plenum.

Description

CROSS REFERENCE TO RELATED APPLICATIONS

The present application is a U.S. continuation patent application of, and claims priority under 35 U.S.C. § 120 to, U.S. nonprovisional patent application Ser. No. 15/499,234, filed Apr. 27, 2017, which '234 application published as U.S. Patent Application Publication No. US 2017/0231119 A1 on Aug. 10, 2017 and issued as U.S. Pat. No. 10,709,039 on Jul. 7, 2020, which '234 application, the application publication thereof, and the patent issuing therefrom are each expressly incorporated by reference herein in their entirety, and which '234 application is a U.S. continuation patent application of, and claims priority under 35 U.S.C. § 120 to, U.S. nonprovisional patent application Ser. No. 13/707,521, filed Dec. 6, 2012, which '521 application published as U.S. Patent Application Publication No. US 2013/0149954 A1 on Jun. 13, 2013 and issued as U.S. Pat. No. 9,655,259 on May 16, 2017, which '521 application, the application publication thereof, and the patent issuing therefrom are each expressly incorporated by reference herein in their entirety, and which '521 application is a U.S. nonprovisional patent application of, and claims priority under 35 U.S.C. § 119(e) to, U.S. provisional patent application Ser . No. 61/568,692, filed Dec. 9, 2011, which '692 application is expressly incorporated by reference herein in its entirety.

APPENDIX AND INCORPORATION THEREOF BY REFERENCE

Each of the following U.S. patent applications is expressly incorporated by reference herein in its entirety:

- (a) U.S. provisional patent application Ser. No. 61/411,359, filed Nov. 8, 2010 and entitled “ADJUSTABLE WALL ASSEMBLY FOR HOT/COLD AISLE CONTAINMENT SYSTEM,” a copy of which is attached hereto as Appendix A, which is likewise expressly incorporated by reference herein in its entirety; and
- (b) U.S. nonprovisional patent application Ser. No. 13/291,861, filed Nov. 8, 2011 and entitled “HEADER PANEL ASSEMBLY FOR PREVENTING AIR CIRCULATION ABOVE ELECTRONIC EQUIPMENT ENCLOSURE,” published as U.S. Patent Application Publication No. US 2012/0112612 A1, which publication is likewise expressly incorporated by reference herein in its entirety.

The disclosure of each of the foregoing patent applications is intended to provide background and technical information with regard to the systems and environments of the inventions of the current provisional patent application.

COPYRIGHT STATEMENT

All of the material in this patent document is subject to copyright protection under the copyright laws of the United States and other countries. The copyright owner has no objection to the facsimile reproduction by anyone of the patent document or the patent disclosure, as it appears in official governmental records but, otherwise, all other copyright rights whatsoever are reserved.

BACKGROUNDField

The present invention relates generally to structures for housing data processing equipment, and, in particular, to data processing equipment structures that provide enhanced airflow solutions.

Background

Racks, frames and enclosures for mounting and storing computer and other electronic components or equipment have been well known for many years. Racks and frames are typically simple rectangular frameworks on which electronic components may be mounted, or on which other mounting members, such as shelves or brackets, may be mounted which in turn may support the electronic components. Enclosures are typically frames on which panels or doors, or both, are hung to provide aesthetic improvement, to protect the components from external influences, to provide security for the components stored inside, or for other reasons.

Racks, frames and enclosures have been built in many different sizes and with many different proportions in order to best accommodate the components which they are designed to support and store. Components stored in these enclosures may include audio and video equipment and the like, but quite frequently include computer equipment and related peripheral devices. These components typically include housings enclosing internal operative elements.

As is also well known, the electronic equipment mounted in these structures tends to generate large amounts of thermal energy that needs to be exhausted away from the equipment effectively in order to maintain the equipment in proper operating order or to prevent damage thereto. The problem can be especially significant when the components are enclosed in enclosures, because thermal energy generated thereby can concentrate within the equipment enclosure and cause the components to overheat and shut down. As equipment becomes more densely packed with electronics, the quantities of thermal energy have continued to increase in recent years, and thermal energy management has become a significant issue confronting today's rack, enclosure, frame and enclosure manufacturers, the manufacturers of the electronic equipment, and the users of such equipment.

Typically, multiple racks, frames, enclosures, and the like (sometimes collectively referred to hereinafter as “enclosures”) are housed together in a data center room. Because of the overheating problem, and particularly with multiple enclosures being placed in a single room, thermal management of the data center room is very important. A goal of data center thermal management is to maximize the performance, uptime and life expectancy of the active components being housed in the room. Toward this end, data center rooms are often arranged so as to increase efficiency and optimize performance.

One common way of organizing a data center room to meet these objectives involves arranging individual enclosures in rows, with the air intake of each enclosure facing toward one side of the row and the heated air exhaust of each enclosure facing toward the other side of the row. Rows of enclosures are arranged in back-to-back relationship so that enclosures of two separate rows exhaust heated air into a common “hot” aisle between the rows. Heated exhaust air from the hot aisle is then drawn into a cooling unit—often arranged as an in-line unit within the row of enclosures. The cooled air is then deposited back into the ambient space of the data center room to be re-used in the cooling process.

In such an arrangement, however, several drawbacks are known to exist. For instance, the establishment of a hot aisle between rows eliminates the possibility of having dedicated cooling units to manage the cooling process for each row individually. Additionally, under existing hot aisle methodology, the entire space of the data center room must be kept cool in order to provide a ready supply of cooled air available to the enclosure intakes. Due to its typically large volume, the data center room is generally incapable of being adequately pressurized.

Accordingly, a need exists for improvement in the arrangement of equipment enclosures within a data center room so as to further enhance efficiency and performance. This, and other needs, is addressed by one or more aspects of the present invention.

SUMMARY

Broadly defined, the present invention according to a first aspect includes a data processing equipment structure that includes a plurality of sidewalls and a ceiling panel, which, together, define an enclosed space. The structure further includes at least one equipment enclosure and at least one cooling unit arranged in side-to-side relationship in a row within the enclosed space. At least one separation panel divides the enclosed space into a front plenum at a front side of the row and a rear plenum at a rear side of the row. Cool air in the front plenum is isolated from heated exhaust air in the rear plenum.

In features of this aspect, the volume of the front plenum may be less than half of the volume of the enclosed space; and the front plenum may be pressurized.

In other features of this aspect, the at least one equipment enclosure may be a plurality of equipment enclosures; the at least one cooling unit may be located at an end of the row; the at least one cooling unit may be located intermediately within the row; the at least one cooling unit may be a plurality of cooling units; and the cooling units may be located within the row proximate to equipment enclosures that house electronic equipment that requires cooling.

In still another feature of this aspect, the data processing equipment structure further includes an internal sidewall for scaling the size of the enclosed space.

Broadly defined, the present invention according to a second aspect includes a data processing equipment structure substantially as shown and described.

Broadly defined, the present invention according to a third aspect includes a data processing equipment structure that includes at least one equipment enclosure and at least one cooling unit arranged in side-to-side relationship in a row. The structure further includes an overhead duct in fluid communication with the at least one equipment enclosure and the at least one cooling unit. The overhead duct is adapted for containing and directing airflow between the at least one equipment enclosure and the at least one cooling unit.

In features of this aspect, the overhead duct may contain heated air exhausted from the equipment enclosures; and the overhead duct may contain a supply of cool air.

Broadly defined, the present invention according to a fourth aspect includes a data processing equipment structure that includes a pair of rows of equipment enclosures defining an aisle between the rows and at least one cooling unit above the aisle. The equipment enclosures are arranged in side-to-side relationship within each row. The structure further includes an overhead duct in fluid communication with the equipment enclosures of each row and the at least one cooling unit. The overhead duct is adapted for containing and directing airflow between the equipment enclosures and the at least one cooling unit.

In features of this aspect, enclosures of each row may be arranged such that cool air intakes face toward the aisle; and the aisle may contain a supply of cool air.

In other features of this aspect, enclosures of each row may be arranged such that heated air is exhausted toward the aisle; and the aisle may contain heated air exhausted from the equipment enclosures.

Broadly defined, the present invention according to a fifth aspect includes a data processing equipment structure that includes at least one equipment enclosure and at least one cooling unit arranged in side-to-side relationship in a row. The structure further includes a duct arranged underneath, and in fluid communication with, each of the at least one equipment enclosure and the at least one cooling unit. The duct is adapted for containing and directing airflow between the at least one equipment enclosure and the at least one cooling unit.

In features of this aspect, the duct may contain heated air exhausted from the equipment enclosures; and the duct may contain a supply of cool air.

Broadly defined, the present invention according to a sixth aspect includes a data processing equipment structure that includes a pair of rows of equipment enclosures defining an aisle between the rows and at least one cooling unit beneath the aisle. The equipment enclosures are arranged in side-to-side relationship within each row. The structure further includes a duct arranged underneath, and in fluid communication with, the equipment enclosures of each row and the at least one cooling unit. The duct is adapted for containing and directing airflow between the equipment enclosures and the at least one cooling unit.

Broadly defined, the present invention according to a seventh aspect includes a data processing equipment structure that includes at least one equipment enclosure and at least one cooling unit arranged in side-to-side relationship in a row. The structure further includes a duct, arranged at a side of the row, in fluid communication with the at least one equipment enclosure and the at least one cooling unit. The duct is adapted for containing and directing airflow between the at least one equipment enclosure and the at least one cooling unit.

In features of this aspect, the duct may contain heated air exhausted from the equipment enclosures; the duct may contain a supply of cool air; the data processing equipment structure may further include an overhead duct in fluid communication with the at least one equipment enclosure and the at least one cooling unit; and the data processing equipment structure may further include an underneath duct in fluid communication with the at least one equipment enclosure and the at least one cooling unit.

Broadly defined, the present invention according to an eighth aspect includes a data processing equipment arrangement that includes a plurality of data processing equipment structures. Each data processing equipment structure includes at least one equipment enclosure and at least one cooling unit arranged in side-to-side relationship in a row. Each data processing equipment structure further includes a duct in fluid communication with the at least one equipment enclosure and the at least one cooling unit. The duct is adapted for containing and directing airflow between the at least one equipment enclosure and the at least one cooling unit.

In features of this aspect, the duct of each structure may be an overhead duct; the duct of each structure may be an underneath duct; the duct of each structure may be arranged at a side of each row; and adjacent data processing equipment structures may have a shared sidewall.

Broadly defined, the present invention according to a ninth aspect includes a data processing equipment arrangement, which includes a plurality of data processing equipment structures, substantially as shown and described.

Further areas of applicability of the present invention will become apparent from the detailed description provided hereinafter. It should be understood that the detailed description and specific examples, while indicating the preferred embodiment of the invention, are intended for purposes of illustration only and are not intended to limit the scope of the invention.

BRIEF DESCRIPTION OF THE DRAWINGS

Further features, embodiments, and advantages of the present invention will become apparent from the following detailed description with reference to the drawings, wherein:

FIG. 1 is a front orthogonal view of a data processing equipment structure, in accordance with one or more aspects of the present invention, shown with cooling units disposed at ends of a row of equipment enclosures;

FIG. 2 is a front orthogonal view of a data processing equipment structure, in accordance with one or more aspects of the present invention, shown with cooling units disposed at an end and intermediate of ends of a row of equipment enclosures;

FIGS. 3 and 4 are respective front and rear orthogonal views of the data processing equipment structure ofFIG. 2, shown with circulation lines or arrows illustrating airflow;

FIG. 5 is a sectional view of the data processing equipment structure ofFIG. 2, taken along line5-5;

FIG. 6 is a front orthogonal view of a data processing equipment structure, in accordance with one or more aspects of the present invention, shown with an internal sidewall to scale the size of the internal space for housing equipment enclosures;

FIG. 7 is an isometric view of a second embodiment of a data processing equipment structure in accordance with one or more aspects of the present invention;

FIG. 8 is an isometric view of a third embodiment of a data processing equipment structure in accordance with one or more aspects of the present invention;

FIG. 9 is an isometric view of a fourth embodiment of a data processing equipment structure in accordance with one or more aspects of the present invention;

FIG. 10 is an isometric view of a plurality of the data processing equipment structures ofFIG. 9, depicted in a side-to-side relationship;

FIG. 11 is an isometric view of a fifth embodiment of a data processing equipment structure in accordance with one or more aspects of the present invention;

FIG. 12 is an isometric view of a sixth embodiment of a data processing equipment structure in accordance with one or more aspects of the present invention;

FIG. 13 is an isometric view of a seventh embodiment of a data processing equipment structure in accordance with one or more aspects of the present invention; and

FIG. 14 is an isometric view of a plurality of the data processing equipment structures ofFIG. 13, depicted in a side-to-side relationship.

DETAILED DESCRIPTION

As a preliminary matter, it will readily be understood by one having ordinary skill in the relevant art (“Ordinary Artisan”) that the present invention has broad utility and application. Furthermore, any embodiment discussed and identified as being “preferred” is considered to be part of a best mode contemplated for carrying out the present invention. Other embodiments also may be discussed for additional illustrative purposes in providing a full and enabling disclosure of the present invention. Moreover, many embodiments, such as adaptations, variations, modifications, and equivalent arrangements, will be implicitly disclosed by the embodiments described herein and fall within the scope of the present invention.

Accordingly, while the present invention is described herein in detail in relation to one or more embodiments, it is to be understood that this disclosure is illustrative and exemplary of the present invention, and is made merely for the purposes of providing a full and enabling disclosure of the present invention. The detailed disclosure herein of one or more embodiments is not intended, nor is to be construed, to limit the scope of patent protection afforded the present invention, which scope is to be defined by the claims and the equivalents thereof. It is not intended that the scope of patent protection afforded the present invention be defined by reading into any claim a limitation found herein that does not explicitly appear in the claim itself.

Thus, for example, any sequence(s) and/or temporal order of steps of various processes or methods that are described herein are illustrative and not restrictive. Accordingly, it should be understood that, although steps of various processes or methods may be shown and described as being in a sequence or temporal order, the steps of any such processes or methods are not limited to being carried out in any particular sequence or order, absent an indication otherwise. Indeed, the steps in such processes or methods generally may be carried out in various different sequences and orders while still falling within the scope of the present invention. Accordingly, it is intended that the scope of patent protection afforded the present invention is to be defined by the appended claims rather than the description set forth herein.

Additionally, it is important to note that each term used herein refers to that which the Ordinary Artisan would understand such term to mean based on the contextual use of such term herein. To the extent that the meaning of a term used herein—as understood by the Ordinary Artisan based on the contextual use of such term—differs in any way from any particular dictionary definition of such term, it is intended that the meaning of the term as understood by the Ordinary Artisan should prevail.

Furthermore, it is important to note that, as used herein, “a” and “an” each generally denotes “at least one,” but does not exclude a plurality unless the contextual use dictates otherwise. Thus, reference to “a picnic basket having an apple” describes “a picnic basket having at least one apple” as well as “a picnic basket having apples.” In contrast, reference to “a picnic basket having a single apple” describes “a picnic basket having only one apple.”

When used herein to join a list of items, “or” denotes “at least one of the items,” but does not exclude a plurality of items of the list. Thus, reference to “a picnic basket having cheese or crackers” describes “a picnic basket having cheese without crackers,” “a picnic basket having crackers without cheese,” and “a picnic basket having both cheese and crackers.” Finally, when used herein to join a list of items, “and” denotes “all of the items of the list.” Thus, reference to “a picnic basket having cheese and crackers” describes “a picnic basket having cheese, wherein the picnic basket further has crackers,” as well as describes “a picnic basket having crackers, wherein the picnic basket further has cheese.”

Referring now to the drawings, in which like numerals represent like components throughout the several views, the preferred embodiments of the present invention are next described. The following description of one or more preferred embodiment(s) is merely exemplary in nature and is in no way intended to limit the invention, its application, or uses.

FIG. 1 is a front orthogonal view of a dataprocessing equipment structure10, in accordance with one or more aspects of the present invention, shown with coolingunits14 disposed at ends of a row ofequipment enclosures12.FIG. 2 is a front orthogonal view of a dataprocessing equipment structure10, in accordance with one or more aspects of the present invention, shown with coolingunits14 disposed at an end and intermediate of ends of a row ofequipment enclosures12. As used herein, the term “data processing equipment” refers to a wide range of electronic equipment as well as racks, frames, enclosures, and the like that are typically used to house such equipment.

As shown inFIGS. 1 and 2, the dataprocessing equipment structure10 generally includes

sidewalls

22,24 and aceiling panel28. Together, the

sidewalls

22,24 andceiling panel28 enclose a row ofenclosures12 resting on afloor surface40 in a data center room. In a preferred embodiment, the

sidewalls

22,24 andceiling panel28 are solid so as to prevent mixing of air from outside thestructure10 with the controlled environment within. Although not a required feature, thestructure10 may optionally include afloor panel26 resting on or above thefloor surface40 such that the row ofenclosures12 rests on thefloor panel26. InFIGS. 1 and 2, thefront sidewall24 andceiling panel28 are shown as being transparent in order to illustrate the row ofenclosures12 contained within thestructure10, while the other walls are shown as being opaque. In fact, any of the panels may be transparent or opaque as desired.

As further shown inFIGS. 1 and 2, one or more in-line cooling units14 are arranged within the row ofenclosures12. InFIG. 1, a coolingunit14 is disposed at each of the two ends of the row ofenclosures12. However, there may also be a need to include acooling unit14 intermediate of the ends of a row ofenclosures12, as shown inFIG. 2. While two coolingunits14 are depicted in each ofFIGS. 1 and 2, more or less coolingunits14 may be included, as might be appreciated by the Ordinary Artisan. Coolingunits14 are generally, though perhaps not always, disposed proximate toenclosures12 that house equipment in need of cooling. Because allenclosures12 may not be in use at all times, the location of the coolingunits14 within the row can be matched withenclosures12 that are in use.Enclosures12 house a wide variety of electronic equipment, including storage equipment, servers, switches and other like devices and equipment for data processing. Coolingunits14 embedded within the row may utilize a wide variety of cooling solutions, including DX cooling, chilled water cooling and other types of economized cooling solutions.

FIGS. 3 and 4 are respective front and rear orthogonal views of the dataprocessing equipment structure10 ofFIG. 2, shown with circulation lines or arrows illustrating airflow. Thefront sidewall24 andceiling panel28 inFIG. 3 and therear sidewall24 andceiling panel28 inFIG. 4 are shown as being transparent in order to illustrate the row ofenclosures12 contained within thestructure10.FIG. 5 is a sectional view of the data processing equipment structure ofFIG. 2, taken along line5-5. As collectively shown therein, thestructure10 is divided or compartmentalized to define afront plenum50 at or along the front side of the row ofenclosures12 and arear plenum60 at or along a rear side of the row ofenclosures12. In the arrangement shown, thefront plenum50 houses the cool air supply of thestructure10 provided by the coolingunits14 and is in fluid connection with the air intakes of thevarious enclosures12, while therear plenum60 contains heated exhaust air exhausted from equipment mounted within theenclosures12 and is in fluid connection with the air intakes of the coolingunits14. However, it will be appreciated that this arrangement may be reversed such that therear plenum60 houses the cool air supply and thefront plenum50 contains the heated exhaust air.

Thefront plenum50 andrear plenum60 are separated from one another by theenclosures12 and the coolingunits14 in combination with one or

more separation panels

16,18. As perhaps best shown inFIG. 5,separation panels16 extend from the tops of theair cooling units14 to theceiling panel28, andseparation panels18 extend from the tops of theenclosures12 to theceiling panel28.

Separation panels

16,18 thus ensure that the cool air supply of thefront plenum50 is isolated from the heated exhaust air of therear plenum60.

As shown inFIG. 3, cool air (represented by arrows shown in outline form) enters thefront plenum50 via the coolingunits14 and is dispersed within thefront plenum50.

Separation panels

16,18 prevent the cool air in thefront plenum50 from mixing with the heated exhaust air in therear plenum60. Cool air is then drawn into the air intakes of theenclosures12 to cool equipment mounted therein. Conveniently, the coolingunits14 may be arranged within the row at locations proximate toenclosures12 that house equipment to be cooled.

As shown inFIG. 4, heated exhaust air (represented by arrows shown in solid form) is exhausted from the rear sides of theenclosures12 into therear plenum60. Heated exhaust air is contained within therear plenum60, separate from both thefront plenum50 and any other rows of electronic equipment within the data center room. From therear plenum60, heated exhaust air is drawn into the air intakes of the coolingunits14 where it is cooled before being reintroduced into thefront plenum50 as cooled air.

FIG. 6 is a front orthogonal view of a dataprocessing equipment structure10, in accordance with one or more aspects of the present invention, shown with aninternal sidewall30 to scale the size of the internal space forhousing equipment enclosures12. InFIG. 6, thefront sidewall24 andceiling panel28 are once again shown as being transparent in order to illustrate the row ofenclosures12 contained within thestructure10. As shown inFIG. 6, thestructure10 is capable of easy modification in order to suit the particular needs of a data center. More particularly, if only afew enclosures12 are required for a particular data center, aninternal sidewall30 may be configured within thestructure10 to isolate any unneeded space (i.e., the space at the rightmost end of thestructure10 ofFIG. 6) from actively used space (i.e., the space at the leftmost end of thestructure10 ofFIG. 6) where electronic equipment is maintained. Theinternal sidewall30 may be located in any of a number of different positions within thestructure10 so as to permit scaling the size of thestructure10 to a preferred size to accommodate more orless equipment enclosures12. As such, the internal space of thestructure10 is capable of expansion or reduction in size to address particular needs of a data center.

In accordance with another aspect of the present invention, thestructure10 may be configured to provide additional scalability features. In particular,individual enclosures12 within the row may be fitted with active and passive louvers (not shown) such that eachindividual enclosure12 may be rendered active or inactive within thestructure10. Furthermore, it is also contemplated thatindividual enclosures12 within the row may include solid caps (not shown) capable of being fitted to the front or rear of therespective enclosure12, thereby covering the air intake or hot air exhaust of therespective enclosure12. In this regard,individual enclosures12 may be rendered inactive without the need of removing the enclosure from thestructure10.

As shown inFIGS. 1-6, thestructure10 provides an environment for thermal management of a row ofequipment enclosures12. Where the data center room includes multiple rows of equipment enclosures, thermal management of each individual row is possible in accordance with the present invention, as the supply of cool air in thefront plenum50 and heated exhaust air in therear plenum60 of a particular row can be effectively isolated from other rows. Each individual row ofequipment enclosures12 is capable of thermal management by one or morededicated cooling units14 within the row. As such, what is often a very complex air space within a data center room can be simplified in a manner such that each row is capable of being managed independently of other rows.

By limiting the air interaction between separate rows ofelectronic equipment12, the methodology of the present invention simplifies control of the thermal management process. Cooling needs for each individual row can be ascertained, which facilitates the application of simple control algorithms to manage the process and maximize airflow and cooling efficiency of each row in the data center room. With enhanced airflow efficiency, cooling units can operate at a lower power state, thus enhancing power consumption of thestructure10 as well.

Separation of thefront plenum50 from therear plenum60 further enhances the energy efficiency of thestructure10 by reducing or minimizing wasted airflow arising from recirculation or bypass, which can ultimately increase the rate of heated air exhausted into therear plenum60 during the cooling process. Such an increase facilitates an improvement in the efficiency of cooling coils of the coolingunits14, which allows for a reduction in cooling unit fan speed. In this regard, a reduction in fan speed can reduce power consumption and thereby enhance the energy efficiency of thestructure10.

Energy efficiency of thestructure10 is also enhanced by the relatively short airflow path afforded by thestructure10. Coolingunits14 can be located within the row to be proximate toenclosures12 that house electronic equipment. By coupling coolingunits14 withenclosures12, the airflow path can be direct and short, thus providing a ready supply of cool air in the vicinity of theenclosure12. Furthermore, as shown inFIGS. 1-6, the volume of thefront plenum50 is relatively small, which can facilitate a pressurized state. Such pressurization at the cool air intake ofenclosures12 can further enhance airflow through electronic equipment.

In accordance with various aspects of the present invention, power may be provided to the coolingunits14 and electronic equipment mounted within theenclosures12 by means of a busway. Power may also be provided to the coolingunits14 and electronic equipment mounted within theenclosures12 via conduit and junction boxes. In accordance with other aspects of the present invention, thestructure10 may be fitted with various integrated systems, such as security systems, fire suppression systems, lighting systems and general IT management operation systems. In this regard, thestructure10 of the present invention is capable of managing a multitude of functions for an individual row ofenclosures12, including thermal management, power, fire suppression and other critical functions.

It is further contemplated thatmultiple structures10 can be organized within a single data center room, with eachseparate structure10 being specifically configured to enhance or optimize thermal management with respect to equipment mounted therein.

FIG. 7 is an isometric view of a second embodiment of a dataprocessing equipment structure110 in accordance with one or more aspects of the present invention. As shown therein, the dataprocessing equipment structure110 generally includes a plurality ofequipment enclosures112 organized in a row and at least onecooling unit114. Although onecooling unit114 is shown, it is contemplated that multiple coolingunits114 may be implemented within the row. Thecooling unit114 includes or operates in conjunction with a coolingfan117 to assist in facilitating airflow during the cooling process. Thestructure110 further includes an overhead duct115 (shown as being transparent inFIG. 7) for containing and directing air during the cooling process. Theoverhead duct115 is in fluid communication with theenclosures112 and thecooling unit114.

In accordance with this embodiment, airflow can be directed such that cool air is drawn into theenclosures112 from the environment in which thestructure110 is organized. Cool air is utilized to cool equipment mounted in theenclosures112 and is then exhausted into theoverhead duct115 as heated exhaust air. From theoverhead duct115, heated exhaust air may be directed toward the in-line cooling unit114 where the heated exhaust air is cooled before being reintroduced to the supply of cool air outside of thestructure110.

Airflow can also be directed such that cool air is drawn intoenclosures112 from theoverhead duct115. In this arrangement, cool air is utilized to cool equipment mounted in theenclosures112 and is then exhausted into the environment outside thestructure110 as heated exhaust air. The in-line cooling unit114 then draws heated exhaust air from the exterior environment to be cooled before being reintroduced to the supply of cool air contained within theoverhead duct115.

FIG. 8 is an isometric view of a third embodiment of a dataprocessing equipment structure210 in accordance with one or more aspects of the present invention. As shown therein, the dataprocessing equipment structure210 generally includes a pair of rows ofequipment enclosures212 that are arranged in side-to-side relationship. Together, the rows ofenclosures212 define anaisle219 therebetween. The structure further includes a cooling unit/fan217 above the aisle and an overhead duct215 (shown as being transparent inFIG. 8) for containing and directing air during the cooling process. Theoverhead duct215 is in fluid communication with theenclosures212 and the cooling unit/fan217. Although one cooling unit/fan217 is shown, it is contemplated that multiple such units may be implemented above theaisle219. It is further contemplated that one or more doors may be utilized to seal ends of theaisle219 from the outside environment and provide access to theaisle219 when necessary.

In accordance with this embodiment, airflow can be directed such that cool air is drawn intoenclosures212 from theaisle219 between the rows. In this regard,enclosures212 of each row may be arranged such that cool air intakes face toward theaisle219, and theaisle219 between the rows operates as a “cold” aisle for containing a supply of cool air. Cool air is utilized to cool equipment mounted in theenclosures212 and is then exhausted into theoverhead duct215 as heated exhaust air. The cooling unit/fan217 above theaisle219 then draws heated exhaust air from theoverhead duct215 into the cooling unit/fan217, where the heated exhaust air is cooled before being reintroduced to the supply of cool air contained within theaisle219.

Airflow can also be directed such that cool air is drawn into theenclosures212 from theoverhead duct215. In this arrangement, cool air is utilized to cool equipment mounted in theenclosures212 and is then exhausted into the aisle between the rows ofenclosures212 as heated exhaust air. In this regard,enclosures212 of each row may be arranged such that heated air is exhausted toward theaisle219, and theaisle219 between the rows operates as a “hot” aisle for containing heated air exhausted from theenclosures212. From theaisle219 between the rows, heated exhaust air may be directed toward the cooling unit/fan217 above theaisle219 where the heated exhaust air is cooled before being reintroduced to the supply of cool air contained within theoverhead duct215.

FIG. 9 is an isometric view of a fourth embodiment of a dataprocessing equipment structure310 in accordance with one or more aspects of the present invention. As shown therein, the dataprocessing equipment structure310 generally includes a plurality ofequipment enclosures312 organized in a row and at least one in-line cooling unit314. Although just onecooling unit314 is shown, it is contemplated that multiple coolingunits314 may be implemented within the row. Thecooling unit314 includes or operates in conjunction with a coolingfan317 to assist in facilitating airflow during the cooling process. Thestructure310 further includes anoverhead duct315 and aseparate side duct319 arranged at a side of the row, each being in fluid communication with theenclosures312 and thecooling unit314.

In accordance with this embodiment, airflow can be directed such that cool air is drawn into theenclosures312 from theside duct319, which may be configured to function as a reservoir for cool air. Cool air is utilized to cool equipment mounted in theenclosures312 and is then exhausted into theoverhead duct315 at the side of the row as heated exhaust air. From theoverhead duct315, heated exhaust air may be directed toward the in-line cooling unit314 where the heated exhaust air is cooled before being reintroduced to the supply of cool air contained within theside duct319.

Airflow can also be directed such that cool air is drawn into theenclosures312 from theoverhead duct315, which may be configured to function as a reservoir for cool air. Cool air is utilized to cool equipment mounted in theenclosures312 and is then exhausted into theside duct319 as heated exhaust air. From theside duct319, heated exhaust air may be directed toward the in-line cooling unit314 where the heated exhaust air is cooled before being reintroduced to the supply of cool air contained within theoverhead duct315.

FIG. 10 is an isometric view of a plurality of dataprocessing equipment structures310 ofFIG. 9. As shown therein, multiple dataprocessing equipment structures310 may be arranged adjacent one another to define an overall arrangement within a data center room. In this regard,structures310 adjacent to one another within the data center room are capable of sharing common walls.

FIG. 11 is an isometric view of a fifth embodiment of a dataprocessing equipment structure410 in accordance with one or more aspects of the present invention. As shown therein, the dataprocessing equipment structure410 generally includes a plurality ofequipment enclosures412 organized in a row and at least onecooling unit414. Although onecooling unit414 is shown, it is contemplated that multiple coolingunits414 may be implemented within the row. Thecooling unit414 includes or operates in conjunction with a coolingfan417 to assist in facilitating airflow during the cooling process. Thestructure410 further includes aduct415 located beneath the row ofenclosures412 and the cooling unit414 (shown as being transparent inFIG. 11). Theduct415 is adapted to contain and direct air during the cooling process and is in fluid communication with theenclosures412 and thecooling unit414.

In accordance with this embodiment, airflow can be directed such that cool air is drawn into theenclosures412 from the environment in which thestructure410 is organized. Cool air is utilized to cool equipment mounted in theenclosures412 and is then exhausted into theduct415 beneath theenclosures412 as heated exhaust air. From theduct415, heated exhaust air may be directed toward the in-line cooling unit414 where the heated exhaust air is cooled before being reintroduced to the supply of cool air outside of thestructure410.

Airflow can also be directed such that cool air is drawn intoenclosures412 from theduct415 beneath theenclosures412. In this arrangement, cool air is utilized to cool equipment mounted in theenclosures412 and is then exhausted into the environment outside thestructure410 as heated exhaust air. The in-line cooling unit414 then draws heated exhaust air from the exterior environment to be cooled before being reintroduced to the supply of cool air contained within theduct415 beneath theenclosures412.

FIG. 12 is an isometric view of a sixth embodiment of a dataprocessing equipment structure510 in accordance with one or more aspects of the present invention. As shown therein, the dataprocessing equipment structure510 generally includes a pair of rows ofequipment enclosures512 that are arranged in side-to-side relationship. Together, the rows ofenclosures512 define anaisle519 therebetween. The structure further includes a cooling unit/fan517 beneath the aisle and aduct515 located beneath the rows of enclosures512 (shown as being transparent inFIG. 12). Theduct515 is adapted to contain and direct air during the cooling process and is in fluid communication with theenclosures512 and the cooling unit/fan517. Although one cooling unit/fan517 is shown, it is contemplated that multiple such units may be implemented beneath theaisle519. It is further contemplated that one or more doors may be utilized to seal ends of theaisle519 from the outside environment and provide access to theaisle519 when necessary.

In accordance with this embodiment, airflow can be directed such that cool air is drawn intoenclosures512 from theaisle519 between the rows. In this regard,enclosures512 of each row may be arranged such that cool air intakes face toward theaisle519, and theaisle519 between the rows operates as a “cold” aisle for containing a supply of cool air. Cool air is utilized to cool equipment mounted in theenclosures512 and is then exhausted into theduct515 beneath the rows ofenclosures512 as heated exhaust air. The cooling unit/fan517 beneath theaisle519 then draws heated exhaust air from theduct215 into the cooling unit/fan517, where the heated exhaust air is cooled before being reintroduced to the supply of cool air contained within theaisle519.

Airflow can also be directed such that cool air is drawn into theenclosures512 from theduct515 beneath the rows ofenclosures512. In this arrangement, cool air is utilized to cool equipment mounted in theenclosures512 and is then exhausted into theaisle519 between the rows ofenclosures512 as heated exhaust air. In this regard,enclosures512 of each row may be arranged such that heated air is exhausted toward theaisle519, and theaisle519 between the rows operates as a “hot” aisle for containing heated air exhausted from theenclosures512. From theaisle519 between the rows, heated exhaust air may be directed toward the cooling unit/fan517 beneath theaisle519 where the heated exhaust air is cooled before being reintroduced to the supply of cool air contained within theduct515 beneath the rows ofenclosures512.

FIG. 13 is an isometric view of a seventh embodiment of a dataprocessing equipment structure610 in accordance with one or more aspects of the present invention. As shown therein, the dataprocessing equipment structure610 generally includes a plurality ofequipment enclosures612 organized in a row and at least one in-line cooling unit614. Although just onecooling unit614 is shown, it is contemplated that multiple coolingunits614 may be implemented within the row. Thecooling unit614 includes or operates in conjunction with a coolingfan617 to assist in facilitating airflow during the cooling process. Thestructure610 further includes aduct615 arranged beneath the rows ofenclosures612 and thecooling unit614 and aseparate side duct619 arranged at a side of the row. Each of theunderneath duct615 and theside duct619 is in fluid communication with theenclosures612 and thecooling unit614.

In accordance with this embodiment, airflow can be directed such that cool air is drawn into theenclosures612 from theside duct619, which may be configured to function as a reservoir for cool air. Cool air is utilized to cool equipment mounted in theenclosures612 and is then exhausted into theduct615 beneath the rows ofenclosures612 and thecooling unit614 as heated exhaust air. From theunderneath duct615, heated exhaust air may be directed toward the in-line cooling unit614 where the heated exhaust air is cooled before being reintroduced to the supply of cool air contained within theside duct619.

Airflow can also be directed such that cool air is drawn into theenclosures612 from the underneathduct615, which may be configured to function as a reservoir for cool air. Cool air is utilized to cool equipment mounted in theenclosures612 and is then exhausted into theside duct619 as heated exhaust air. From theside duct619, heated exhaust air may be directed toward the in-line cooling unit614 where the heated exhaust air is cooled before being reintroduced to the supply of cool air contained within theunderneath duct615.

FIG. 14 is an isometric view of a plurality of the dataprocessing equipment structures610 ofFIG. 13, depicted in a side-to-side relationship. As shown therein, multiple dataprocessing equipment structures610 may be arranged adjacent one another to define an overall arrangement within a data center room. In this regard,structures610 adjacent to one another within the data center room are capable of sharing common walls.

Based on the foregoing information, it will be readily understood by those persons skilled in the art that the present invention is susceptible of broad utility and application. Many embodiments and adaptations of the present invention other than those specifically described herein, as well as many variations, modifications, and equivalent arrangements, will be apparent from or reasonably suggested by the present invention and the foregoing descriptions thereof, without departing from the substance or scope of the present invention.

Accordingly, while the present invention has been described herein in detail in relation to one or more preferred embodiments, it is to be understood that this disclosure is only illustrative and exemplary of the present invention and is made merely for the purpose of providing a full and enabling disclosure of the invention. The foregoing disclosure is not intended to be construed to limit the present invention or otherwise exclude any such other embodiments, adaptations, variations, modifications or equivalent arrangements; the present invention being limited only by the claims appended hereto and the equivalents thereof.