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US20190144975A1 - Alloys and processes for making and using same - Google Patents

Alloys and processes for making and using same
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Publication number
US20190144975A1
US20190144975A1US15/814,086US201715814086AUS2019144975A1US 20190144975 A1US20190144975 A1US 20190144975A1US 201715814086 AUS201715814086 AUS 201715814086AUS 2019144975 A1US2019144975 A1US 2019144975A1
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alloy
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total weight
astm
chromium
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US15/814,086
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Manuel Marya
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Schlumberger Technology Corp
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Schlumberger Technology Corp
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Priority to US17/810,143prioritypatent/US12365964B2/en
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Abstract

Alloys and processes for making and using same. In some examples, an alloy can include greater than 50 wt % to less than 65 wt % bismuth; greater than 35 wt % to less than 50 wt % tin; about 0.01 wt % to about 2.5 wt % indium; and at least one of: about 0.01 wt % to about 2.5 wt % antimony, about 0.01 wt % to about 0.5 wt % gallium, about 0.01 wt % to about 4 wt % zinc, and about 0.01 wt % to about 2.5 wt % chromium, with all weight percent values based on a total weight of the alloy. In other examples, an alloy can include greater than 50 wt % to less than 65 wt % bismuth; greater than 35 wt % to less than 50 wt % tin; about 0.01 wt % to about 2.5 wt % indium, and less than 1 wt % of lead, with all weight percent values based on a total weight of the alloy.

Description

Claims (20)

What is claimed is:
1. An alloy, comprising:
greater than 50 wt % to less than 65 wt % bismuth;
greater than 35 wt % to less than 50 wt % tin;
about 0.01 wt % to about 2.5 wt % indium; and
at least one of:
about 0.01 wt % to about 2.5 wt % antimony,
about 0.01 wt % to about 0.5 wt % gallium,
about 0.01 wt % to about 4 wt % zinc, and
about 0.01 wt % to about 2.5 wt % chromium,
wherein all weight percent values are based on a total weight of the alloy.
2. The alloy ofclaim 1, further comprising at least one of:
about 0.01 wt % to about 3 wt % copper, and
about 0.01 wt % to about 1 wt % nickel, based on the total weight of the alloy.
3. The alloy ofclaim 1, wherein the alloy comprises about 1.5 wt % to about 6.5 wt % of a combined amount of antimony, gallium, zinc, and chromium, based on the total weight of the alloy.
4. The alloy ofclaim 1, wherein the alloy comprises at least 90 wt % of a combined amount of bismuth and tin, based on the total weight of the alloy.
5. The alloy ofclaim 1, wherein the alloy comprises about 0.1 wt % to about 0.5 wt % gallium, about 0.1 wt % to about 2 wt % zinc, and about 0.1 wt % to about 1.5 wt % chromium, based on the total weight of the alloy.
6. The alloy ofclaim 1, wherein the alloy comprises about 0.1 wt % to about 2.5 wt % antimony, about 0.1 wt % to about 0.5 wt % gallium, about 0.1 wt % to about 4 wt % zinc, and about 0.1 wt % to about 2.5 wt % chromium, based on the total weight of the alloy.
7. The alloy ofclaim 1, wherein the alloy comprises about 0.1 wt % to about 2.5 wt % antimony and about 0.1 wt % to about 2.5 wt % chromium, based on the total weight of the alloy.
8. The alloy ofclaim 1, wherein the alloy has a melting point of about 115° C. to about 137° C., as measured according to ASTM E794-06 (2012).
9. The alloy ofclaim 1, wherein the alloy has a melting point of about 115° C. to about 130° C., as measured according to ASTM E794-06 (2012).
10. The alloy ofclaim 1, wherein the alloy has a Vickers Hardness number of greater than 16, as measured according to ASTM E384-17 with a 50 gram indentation load applied for 60 seconds.
11. The alloy ofclaim 1, wherein the alloy has a Vickers hardness number of greater than 20, as measured according to ASTM E384-17 with a 50 gram indentation load applied for 60 seconds.
12. The alloy ofclaim 1, wherein the alloy has a latent heat of fusion of greater than 45 J/g, as measured according to ASTM E793-06 (2012).
13. A process for sealing a void in a downhole environment, comprising:
introducing an alloy into a wellbore, wherein the alloy comprises greater than 50 wt % to less than 65 wt % bismuth, greater than 35 wt % to less than 50 wt % tin, and about 0.01 wt % to about 2.5 wt % indium, and wherein all weight percent values are based on a total weight of the alloy;
melting the alloy to produce a liquid alloy;
flowing the liquid alloy into a void; and
solidifying the liquid alloy to produce a sealed void.
14. The process ofclaim 13, wherein the void is the wellbore, is located within a subterranean formation, is a fluid passage located in a downhole tool, or is an annular cavity between a pair of co-axial well tubulars.
15. An alloy, comprising:
greater than 50 wt % to less than 65 wt % bismuth;
greater than 35 wt % to less than 50 wt % tin;
about 0.01 wt % to about 2.5 wt % indium, and
less than 1 wt % of lead, wherein all weight percent values are based on a total weight of the alloy.
16. The alloy ofclaim 15, wherein the alloy comprises about 0.1 wt % to less than 2 wt % indium, based on the total weight of the alloy.
17. The alloy ofclaim 15, wherein the alloy is free of lead.
18. The alloy ofclaim 15, further comprising at least one of:
about 0.1 wt % to about 3 wt % antimony,
about 0.1 wt % to about 0.5 wt % gallium,
about 0.1 wt % to about 4 wt % zinc,
about 0.1 wt % to about 2.5 wt % chromium,
about 0.1 wt % to about 3 wt % copper, and
about 0.1 wt % to about 1 wt % nickel,
wherein all weight percent values are based on the total weight of the alloy.
19. The alloy ofclaim 15, further comprising about 0.1 wt % to about 0.5 wt % gallium, about 0.1 wt % to about 4 wt % zinc, and about 0.1 wt % to about 2.5 wt % chromium, wherein all weight percent values are based on the total weight of the alloy.
20. The alloy ofclaim 15, further comprising about 0.1 wt % to about 3 wt % antimony, about 0.1 wt % to about 0.5 wt % gallium, about 0.1 wt % to about 4 wt % zinc, and about 0.1 wt % to about 2.5 wt % chromium, wherein all weight percent values are based on the total weight of the alloy.
US15/814,0862017-11-152017-11-15Alloys and processes for making and using sameAbandonedUS20190144975A1 (en)

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US15/814,086US20190144975A1 (en)2017-11-152017-11-15Alloys and processes for making and using same
US17/810,143US12365964B2 (en)2017-11-152022-06-30Alloys and processes for making and using same

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US17/810,143Active2039-03-27US12365964B2 (en)2017-11-152022-06-30Alloys and processes for making and using same

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
CN112522537A (en)*2020-11-192021-03-19有研工程技术研究院有限公司Low-melting-point high-latent-heat phase change energy storage material and preparation method thereof
US20210262313A1 (en)*2018-06-252021-08-26Rawwater Engineering LimitedImproved well sealing material and method of producing a plug
US20230111798A1 (en)*2021-10-072023-04-13Mk Electron Co., Ltd.Lead-free solder alloy and method of manufacturing electronic device using the same
GB2620688B (en)*2022-07-142024-12-18Isol8 Holdings LtdPlug barrier material
US12365964B2 (en)2017-11-152025-07-22Schlumberger Technology CorporationAlloys and processes for making and using same

Citations (1)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US20120055586A1 (en)*2010-08-262012-03-08Dynajoin CorporationVariable melting point solders

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US5242658A (en)1992-07-071993-09-07The Indium Corporation Of AmericaLead-free alloy containing tin, zinc and indium
US6384389B1 (en)2000-03-302002-05-07Tesla Industries Inc.Eutectic metal sealing method and apparatus for oil and gas wells
MY130896A (en)2001-06-052007-07-31Shell Int ResearchIn-situ casting of well equipment
KR20030012963A (en)*2001-08-062003-02-14이도재Lead free solder composed of Sn-Bi-Zn-In
JP4230194B2 (en)*2002-10-302009-02-25内橋エステック株式会社 Alloy type thermal fuse and wire for thermal fuse element
US7290609B2 (en)2004-08-202007-11-06Cinaruco International S.A. Calle Aguilino De La GuardiaSubterranean well secondary plugging tool for repair of a first plug
US20060144591A1 (en)2004-12-302006-07-06Chevron U.S.A. Inc.Method and apparatus for repair of wells utilizing meltable repair materials and exothermic reactants as heating agents
US20080047708A1 (en)2006-06-242008-02-28Spencer Homer LMethod and apparatus for plugging perforations
JP2011526838A (en)2008-06-232011-10-20マテリオン アドバンスト マテリアルズ テクノロジーズ アンド サービシーズ インコーポレイティド Gold-tin-indium solder for processing compatible with lead-free tin solder
GB201223055D0 (en)2012-12-202013-02-06Carragher PaulMethod and apparatus for use in well abandonment
US20190144975A1 (en)2017-11-152019-05-16Schlumberger Technology CorporationAlloys and processes for making and using same

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US20120055586A1 (en)*2010-08-262012-03-08Dynajoin CorporationVariable melting point solders

Cited By (7)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US12365964B2 (en)2017-11-152025-07-22Schlumberger Technology CorporationAlloys and processes for making and using same
US20210262313A1 (en)*2018-06-252021-08-26Rawwater Engineering LimitedImproved well sealing material and method of producing a plug
US12000237B2 (en)*2018-06-252024-06-04Rawwater Engineering LimitedWell sealing material and method of producing a plug
CN112522537A (en)*2020-11-192021-03-19有研工程技术研究院有限公司Low-melting-point high-latent-heat phase change energy storage material and preparation method thereof
US20230111798A1 (en)*2021-10-072023-04-13Mk Electron Co., Ltd.Lead-free solder alloy and method of manufacturing electronic device using the same
US12030140B2 (en)*2021-10-072024-07-09Mk Electron Co., Ltd.Lead-free solder alloy and method of manufacturing electronic device using the same
GB2620688B (en)*2022-07-142024-12-18Isol8 Holdings LtdPlug barrier material

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US12365964B2 (en)2025-07-22

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