US20190039941A1 - Shaping a glass substrate after cutting - Google Patents

Abstract

A method includes projecting a first energy beam onto an annular edge of a glass substrate. A first portion of the annular edge of the glass substrate is removed with the first energy beam. Removing the first portion increases the roundness of the annular edge of the glass substrate. A second energy beam is projected onto the annular edge of the glass substrate. A second portion of the annular edge of the glass substrate is removed with the second energy beam. Removing the second portion increases the roundness of the annular edge of the glass substrate.

Description

RELATED APPLICATIONS
• This application claims the benefit and priority to the U.S. Provisional Patent Application No. 62/542,216, filed on Aug. 7, 2017, U.S. Provisional Patent Application No. 62/542,232, filed on Aug. 7, 2017, and U.S. Provisional Patent Application No. 62/542,235, filed on Aug. 7, 2017, which are incorporated by reference herein in their entirety.
SUMMARY
• Provided herein is a method that includes projecting a first energy beam onto an annular edge of a glass substrate. A first portion of the annular edge of the glass substrate is removed with the first energy beam. Removing the first portion increases the roundness of the annular edge of the glass substrate. A second energy beam is projected onto the annular edge of the glass substrate. A second portion of the annular edge of the glass substrate is removed with the second energy beam. Removing the second portion increases the roundness of the annular edge of the glass substrate.
• These and other features and advantages will be apparent from a reading of the following detailed description.
BRIEF DESCRIPTION OF DRAWINGS
• FIGS. 1A-1E show a system configured to cut and shape a glass substrate according to one aspect of the present embodiments.
• FIGS. 2A-2B show a system including a Diffractive Optics, Micro-lens Arrays and Spatial Light Modulator (SLM) configured to cut and shape a glass substrate according to one aspect of the present embodiments.
• FIGS. 3A-3F shows a system including an optical multiplexer box configured to cut and shape a glass substrate according to one aspect of the present embodiments.
• FIG. 4 shows a system including an optical multiplexer box configured to chemically alter a glass substrate into a shape defined by the chemical alteration according to one aspect of the present embodiments.
• FIG. 5 shows an exemplary flow diagram in accordance with one aspect of the present embodiments.
• FIGS. 6A, 6B, and 6C show a system for shaping an exposed edge of a previously cut glass substrate according to one aspect of the present embodiments.
• FIGS. 7A and 7B show a system for shaping an exposed edge with an energy source that is tangential to the exposed edge according to one aspect of the present embodiments.
• FIG. 8 shows a system for shaping an exposed edge with plasma according to one aspect of the present embodiments.
• FIG. 9 shows another exemplary flow diagram in accordance with one aspect of the present embodiments.
• FIG. 10 shows an additional exemplary flow diagram in accordance with one aspect of the present embodiments.
DESCRIPTION
• Before various embodiments are described in greater detail, it should be understood that the embodiments are not limiting, as elements in such embodiments may vary. It should likewise be understood that a particular embodiment described and/or illustrated herein has elements which may be readily separated from the particular embodiment and optionally combined with any of several other embodiments or substituted for elements in any of several other embodiments described herein.
• It should also be understood that the terminology used herein is for the purpose of describing the certain concepts, and the terminology is not intended to be limiting. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood in the art to which the embodiments pertain.
• Unless indicated otherwise, ordinal numbers (e.g., first, second, third, etc.) are used to distinguish or identify different elements or steps in a group of elements or steps, and do not supply a serial or numerical limitation on the elements or steps of the embodiments thereof. For example, “first,” “second,” and “third” elements or steps need not necessarily appear in that order, and the embodiments thereof need not necessarily be limited to three elements or steps. It should also be understood that, unless indicated otherwise, any labels such as “left,” “right,” “front,” “back,” “top,” “middle,” “bottom,” “beside,” “forward,” “reverse,” “overlying,” “underlying,” “up,” “down,” or other similar terms such as “upper,” “lower,” “above,” “below,” “under,” “between,” “over,” “vertical,” “horizontal,” “proximal,” “distal,” and the like are used for convenience and are not intended to imply, for example, any particular fixed location, orientation, or direction. Instead, such labels are used to reflect, for example, relative location, orientation, or directions. It should also be understood that the singular forms of “a,” “an,” and “the” include plural references unless the context clearly dictates otherwise.
• As the technology of magnetic recording media reaches maturity, it becomes increasingly difficult to continue to increase the storage capacity of recording media (e.g. disk drive disks) or to reduce the size of recording media while maintaining storage capacity. Such challenges may be overcome by increasing the bit density on the recording media. New technology such as Heat Assisted Magnetic Recording (HAMR) in disk drives has offered higher areal density as well as backward compatibility and enhanced data retention. A glass substrate has been used in HAMR technology consistent with thermal transfer properties of the HAMR writing process. Similarly, perpendicular media recording (PMR) technology in disk drive may benefit from using a glass substrate because a glass substrate has modulus and density similar to that of aluminum used in most cloud storage products.
• Reducing the glass substrate thickness increases disk packing density, thereby increasing the drive capacity. In order to increase the drive capacity, the glass substrates used in HAMR and PMR have stringent surface roughness with tight dimensional precision. Unfortunately, the glass substrates are mechanically cut and grinded, causing fracturing and other surface anomalies. Moreover, mechanically cutting the glass substrate results in large dimensional errors, which require subsequent edging to bring the glass substrate within the final tolerances. Furthermore, subsequent grinding is not only costly but also time consuming, thereby adversely impacting the throughput.
• Accordingly, a need has arisen to avoid mechanical cutting and grinding of the glass substrate in technologies with stringent surface roughness and tight dimensional precision such as PMR and HAMR. In some embodiments, an apparatus cuts and shapes the glass substrate in a non-mechanical fashion. In some embodiments, laser technology is used to simultaneously cut and shape a glass substrate. For example, the apparatus may include a beam splitter and a plurality of mirrors. The beam splitter is positioned to receive a laser beam from a source and split the received laser beam to a first plurality of split laser beams and a second plurality of split laser beams. The plurality of mirrors is configured to direct the first plurality of split laser beams and further configured to direct the second plurality of split laser beams. The first plurality of split laser beams directed by the plurality of mirrors is configured to cut a glass substrate. The second plurality of split laser beams directed by the plurality of mirrors is configured to shape the glass substrate. It is appreciated that the apparatus may further include a Diffractive Optics, Micro-lens Arrays and Spatial Light Modulator (SLM) configured to receive a laser beam from the source, or from the plurality of mirrors, or from the beam splitter. The Diffractive Optics, Micro-lens Arrays and Spatial Light Modulator (SLM) is configured to bend the received laser beam that shapes the glass substrate. It is appreciated that in some embodiments, the Diffractive Optics, Micro-lens Arrays and Spatial Light Modulator (SLM) is configured to cut the glass substrate.
• Referring now toFIGS. 1A-1E, a system configured to cut and shape a glass substrate according to one aspect of the present embodiments is shown. More specifically, referring toFIG. 1A, asystem100A is shown. Thesystem100A includes alaser source110 and anoptical multiplexer box180. Thelaser source110 is configured to generate one or more laser beams, e.g.,laser beam112, that are received by theoptical multiplexer box180. Theoptical multiplexer box180 is positioned to manipulate the received laser beam to generate a modified laser beam(s), e.g.,laser beams126,133, and135. The modified laser beam(s) is emitted onto a glass substrate. The modified laser beam(s) cuts and/or shapes the glass substrate. In some embodiments, the glass substrate is cut and shaped simultaneously. It is appreciated that references made to the laser beam being modified is a reference to one or more of the angle (e.g., incident/reflection/diffraction/refraction) of the laser beam changing, the coherency of the laser beam changing, the polarization of the laser beam changing, the magnitude of the laser beam changing, the wavelength of the laser beam changing, the intensity of the laser beam changing, the spot diameter of the laser beam changing, the pulse duration of the laser beam changing, the pulse shape of the laser beam changing, etc.
• In some embodiments, theoptical multiplexer box180 includes abeam splitter120, and a plurality of mirrors, e.g., mirrors132 and134. Thebeam splitter120 is positioned to receive thelaser beam112 from thelaser source110. Thebeam splitter120 is configured to split the receivedlaser beam112 into more than one laser beam, e.g.,laser beams122,124, and126. It is appreciated that some of the split laser beams may be directed using themirrors132 and134. For example, splitlaser beams122 and124 are emitted onto themirrors132 and134 respectively at their respective incident angle. It is appreciated that the incident angles for thesplit laser beams122 and124 may or may not be the same. Themirrors132 and134 therefore reflect thesplit laser beams122 and124 at their respective angle of reflection, e.g., reflectedlaser beams133 and135. It is appreciated that some split laser beam(s) may not be directed using mirrors, e.g., splitlaser beam126. It is appreciated that the positioning of themirrors132 and/or134 may be fixed or it may be modifiable, e.g., one or more mirrors may be rotated to change the angle of incident and the angle of reflection.
• Thelaser beams126,133 and135 may be emitted from theoptical multiplexer box180 onto the glass substrate. As such, the glass substrate may be cut and shaped through means other than mechanical cutting and shaping. In some embodiments, thelaser beams126,133, and135 may cut and shape the glass substrate simultaneously.
• It is appreciated that a component, e.g., diffractive optics, micro-lens arrays, spatial light modulator (SLM) for phase, wave front, and polarization control over the transverse direction of the laser, highly silvered mirrors on a linear piezo stage, pitch and yaw rotation stage, beam expander, beam compression, pulse stretching device, pulse shortening device, polarizing filter, polarizing rotator, photo-detector, beam shaping device (without shortening/stretching the pulse), fiber optic couplers, etc., may be positioned prior to or after thebeam splitter120 receiving the laser beam in order to modify the received laser beam, e.g., changing the coherency of the laser beam, changing the polarization of the laser beam, changing the magnitude of the laser beam, changing the wavelength of the laser beam, changing the intensity of the laser beam, changing the spot diameter of the laser beam, changing the pulse duration of the laser beam, changing the pulse shape of the laser beam, etc. It is similarly appreciated that a component may be positioned prior to or after themirrors132 and/or134 receiving the split laser beams from thebeam splitter120 in order to modify the split laser beam, e.g., changing the coherency of the laser beam, changing the polarization of the laser beam, changing the magnitude of the laser beam, changing the wavelength of the laser beam, changing the intensity of the laser beam, changing the spot diameter of the laser beam, changing the pulse duration of the laser beam, changing the pulse shape of the laser beam, etc.
• Referring now toFIG. 1B, aglass substrate190 being cut/shaped is shown, as discussed inFIG. 1A. The modified laser beams, e.g.,laser beams126,133, and/or135, cut/shape theglass substrate190 simultaneously in some embodiments. It is appreciated that in some embodiments, the cutting and shaping may occur sequentially but shortly after one another.
• Referring now toFIG. 1C, asystem100C substantially similar to that ofFIG. 1A is shown. In this embodiment, thebeam splitter120 split the received laser beams into four split laser beams, e.g.,laser beams122,124,126, and128.Split laser beams126 and128 are emitted onto the glass substrate directly without being directed by a mirror.
• Referring now toFIG. 1D, asystem100D substantially similar to that ofFIG. 1C is shown. In this embodiment, thebeam splitter120 splits the received laser beams into a plurality ofsplit laser beams129. Moreover, themirror134 is replaced with amirror174 that has a plurality of mirrors. Similarly, themirror132 is replaced with amirror172 that includes a plurality of mirrors. Themirror172 receives a subset of the split laser beams and reflects a number of reflectedsplit laser beams136. Similarly, themirror174 receives a subset of the split laser beams and reflects a number of reflectedsplit laser beams137. Some of the split laser beams, e.g.,126 and128, may be emitted from thebeam splitter120 without being directed by a mirror. The split laser beams either being emitted from thebeam splitter120 and/or reflected from the mirrors are emitted from theoptical multiplexer box180, thereby cutting and/or shaping the glass substrate.
• Referring now toFIG. 1E, asystem100E substantially similar to that ofFIG. 1D is shown. In this embodiment, themirrors174 and172 may be controlled using control signals141-148. For example, thecontrol signal141 may control a mirror within themirror174 to move, therefore changing the angle of incident and as result changing the angle of reflection. Other mirrors may similarly be controlled. In some embodiments, the mirrors are controlled using the control signal using a microelectrical component, e.g., a micro-electro mechanical device, piezo electric components, etc. to change their position in order to control the angle of incident and reflection.
• Referring now toFIGS. 2A-2B, a system including a Diffractive Optics, Micro-lens Arrays and Spatial Light Modulator (SLM) configured to cut and shape a glass substrate according to one aspect of the present embodiments is shown.FIG. 2A shows asystem200A. Thesystem200A includes alaser source110 and anoptical multiplexer box280. Thelaser source110 is configured to generate one or more laser beams, e.g.,laser beam112, that are received by theoptical multiplexer box280. Theoptical multiplexer box280 is positioned to manipulate the received laser beam to generate a modified laser beam(s). The modified laser beam(s) is emitted onto a glass substrate. The modified laser beam(s) cuts and/or shapes the glass substrate. In some embodiments, the glass substrate is cut and shaped simultaneously. It is appreciated that references made to the laser beam being modified is a reference to the angle (e.g., incident/reflection/diffraction/refraction) of the laser beam changing, the coherency of the laser beam changing, the polarization of the laser beam changing, the magnitude of the laser beam changing, the wavelength of the laser beam changing, the intensity of the laser beam changing, the spot diameter of the laser beam changing, the pulse duration of the laser beam changing, the pulse shape of the laser beam changing, etc.
• In some embodiments, theoptical multiplexer box280 includes a Diffractive Optics, Micro-lens Arrays and Spatial Light Modulator (SLM)210. The Diffractive Optics, Micro-lens Arrays and Spatial Light Modulator (SLM)210 may bend the receivedlaser beam112, e.g.,laser beam212. It is appreciated that in some embodiments, the Diffractive Optics, Micro-lens Arrays and Spatial Light Modulator (SLM)210 may be configured to transmit the receivedlaser beam112 without bending it, e.g.,laser beam214. Thelaser beams212 and214 output from theoptical multiplexer box280 may cut and/or shape the substrate glass. It is appreciated that in some embodiments, thelaser beams212 and214 may cut and shape the substrate glass simultaneously. In some embodiments, the Diffractive Optics, Micro-lens Arrays and Spatial Light Modulator (SLM)210 may include a Gaussian diffractive optics, a Bessel diffractive optics, an Airy diffractive optics, or any combination thereof.
• Referring now toFIG. 2B, theglass substrate190 may be cut using twobended laser beams216 and218. Theglass substrate190 once cut and shaped is shown as theglass substrate192.
• Referring now toFIGS. 3A-3F, a system including an optical multiplexer box configured to cut and shape a glass substrate according to one aspect of the present embodiments is shown. Referring more specifically toFIG. 3A, a combination ofFIGS. 1A and 2A is shown.System300A includes alaser source110 and anoptical multiplexer box380. Thelaser source110 is configured to generate one or more laser beams, e.g.,laser beam112, that are received by theoptical multiplexer box380. Theoptical multiplexer box380 is positioned to manipulate the received laser beam(s) to generate a modified laser beam(s), e.g.,laser beams126,133,212, and135. The modified laser beam(s) is emitted onto a glass substrate. The modified laser beam(s) cuts and/or shapes the glass substrate. In some embodiments, the glass substrate is cut and shaped simultaneously. It is appreciated that references made to the laser beam being modified is a reference to the angle (e.g., incident/reflection/diffraction/refraction) of the laser beam changing, the coherency of the laser beam changing, the polarization of the laser beam changing, the magnitude of the laser beam changing, the wavelength of the laser beam changing, the intensity of the laser beam changing, the spot diameter of the laser beam changing, the pulse duration of the laser beam changing, the pulse shape of the laser beam changing, etc.
• Theoptical multiplexer box380 includes abeam splitter120, a Diffractive Optics, Micro-lens Arrays and Spatial Light Modulator (SLM)210, and a plurality of mirrors, e.g., mirrors132 and134. Thebeam splitter120 is positioned to receive thelaser beam112 from thelaser source110. Thebeam splitter120 is configured to split the receivedlaser beam112 into more than one laser beam, e.g.,laser beams122,124,126, and312. It is appreciated that some of the split laser beams may be directed using themirrors132 and134. For example, splitlaser beams122 and124 are emitted onto themirrors132 and134 respectively at their respective incident angle. It is appreciated that the incident angles for thesplit laser beams122 and124 may or may not be the same. Themirrors132 and134 therefore reflect thesplit laser beams122 and124 at their respective angle of reflection, e.g., reflectedlaser beams133 and135. It is appreciated that some split laser beam(s) may not be directed using mirrors, e.g., splitlaser beam126. It is appreciated that the positioning of themirrors132 and/or134 may be fixed or it may be modifiable, e.g., one or more mirrors may be rotated to change the angle of incident and the angle of reflection.
• Thesplit laser beam312 is emitted from thebeam splitter120 to the Diffractive Optics, Micro-lens Arrays and Spatial Light Modulator (SLM)210. Thediffractive optics array210 may bend the received splitlaser beam312 to generate abent laser beam212.
• Thelaser beams126,133,135, and212 may be emitted from theoptical multiplexer box380 onto the glass substrate. As such, the glass substrate may be cut and shaped through means other than mechanical cutting and shaping. In some embodiments, thelaser beams126,133,135, and212 may cut and shape the glass substrate simultaneously.
• It is appreciated that a component, e.g., diffractive optics, micro-lens arrays, spatial light modulator (SLM) for phase, wave front, and polarization control over the transverse direction of the laser, highly silvered mirrors on a linear piezo stage, pitch and yaw rotation stage, beam expander, beam compression, pulse stretching device, pulse shortening device, polarizing filter, polarizing rotator, photo-detector, beam shaping device (without shortening/stretching the pulse), fiber optic couplers, etc., may be positioned prior to or after thebeam splitter120 receiving the laser beam in order to modify the received laser beam, e.g., changing the coherency of the laser beam, changing the polarization of the laser beam, changing the magnitude of the laser beam, changing the wavelength of the laser beam, changing the intensity of the laser beam, changing the spot diameter of the laser beam, changing the pulse duration of the laser beam, changing the pulse shape of the laser beam, etc. It is similarly appreciated that a component may be positioned prior to or after themirrors132 and/or134 receiving the split laser beams from thebeam splitter120 in order to modify the split laser beam, e.g., changing the coherency of the laser beam, changing the polarization of the laser beam, changing the magnitude of the laser beam, changing the wavelength of the laser beam, changing the intensity of the laser beam, changing the spot diameter of the laser beam, changing the pulse duration of the laser beam, changing the pulse shape of the laser beam, etc. Moreover, it is appreciated that a component may be positioned prior to or after the Diffractive Optics, Micro-lens Arrays and Spatial Light Modulator (SLM)210 receiving the split laser beams from thebeam splitter120 in order to modify the split laser beam, e.g., changing the coherency of the laser beam, changing the polarization of the laser beam, changing the magnitude of the laser beam, changing the wavelength of the laser beam, changing the intensity of the laser beam, changing the spot diameter of the laser beam, changing the pulse duration of the laser beam, changing the pulse shape of the laser beam, etc.
• Referring now toFIG. 3B,system300B is shown that operates substantially similar to that ofFIG. 3A. In this embodiment, themirrors132 and134 are replaced with a plurality ofmirrors172 and174, similar tosystem100D discussed inFIG. 1D.
• Referring now toFIG. 3C,system300C is shown that operates substantially similar to that ofFIG. 3B. In this embodiment, themirrors174 and172 may be controlled using the control signals141-148, similar tosystem100E discussed inFIG. 1E.
• Referring now toFIG. 3D,system300D is shown that operates substantially similar to that ofFIG. 3A. In this embodiment, themirror134 emits the reflectedlaser beam135 to the Diffractive Optics, Micro-lens Arrays and Spatial Light Modulator (SLM)210 instead of emitting it onto the glass substrate. Thus, the reflectedlaser beam135 may be bent using the Diffractive Optics, Micro-lens Arrays and Spatial Light Modulator (SLM)210. The Diffractive Optics, Micro-lens Arrays and Spatial Light Modulator (SLM)210 may bend the reflectedlaser beam135 and output thebent laser beam219 onto the glass substrate. Thus, theoptical multiplexer box380 mayoutput laser beams126,133,212, and219 to cut and/or shape the glass substrate. In some embodiments, theoptical multiplexer box380 mayoutput laser beams126,133,212, and219 to cut and shape the glass substrate simultaneously.
• Referring now toFIG. 3E,system300E is shown that operates substantially similar to that ofFIG. 3D. In this embodiment, themirrors132 and134 are replaced withmirrors172 and174 where each may include a plurality of mirrors, as discussed insystem100D discussed inFIG. 1D.
• Referring now toFIG. 3F,system300F is shown that operates substantially similar to that ofFIG. 3E. In this embodiment, themirrors172 and174 may be controlled using the control signals141-148, similar tosystem100E discussed inFIG. 1E.
• Referring now toFIG. 4, a system including an optical multiplexer box configured to chemically alter a glass substrate into a shape defined by the chemical alteration according to one aspect of the present embodiments is shown. It is appreciated that a system including an optical multiplexer box, as discussed with respect toFIGS. 1A-3F, may be used to chemically alter the glass substrate into a shape defined by the chemical alteration rather than cut the glass substrate. In other words, the output of the optical multiplexer box may focus the emitted laser beams onto theglass substrate190 in order to alter the chemical properties of the glass substrate where the laser beam is focused. The chemical alteration delineates a desired cut/shape within the transparent glass substrate. Once theglass substrate190 is placed in achemical bath410, e.g., Potassium Hydroxide (KOH) ˜1 um/s with selectivity of 350, Sodium Hydroxide (NaOH), Hydrofluoric acid (HF) ˜1 um/s with selectivity of 100, etc., theglass substrate190 separates according to the shape defined by the chemical alteration. For example, in the embodiment shown inFIG. 4, theglass substrate190 separates at positioned on theglass substrate190 where the laser beam was focused. Thus, the glass substrate may be formed and shaped without using mechanical cutting and grinding.
• Referring now toFIG. 5, a flow diagram in accordance with one aspect of the present embodiments is shown. Atstep510, a laser beam is generated, e.g., by a laser source. Atstep520, the generated laser beam is received by theoptical multiplexer box520, e.g., as described inFIGS. 1A-4. Theoptical multiplexer box520 may manipulate the received laser beam, instep530, as described inFIGS. 1A-4. For example, atstep531, the laser beam may be split into multiple laser beams, e.g., using a beam splitter. Atstep532, the received laser beam or one or more of the split laser beams may be bent, e.g., using Diffractive Optics, Micro-lens Arrays and Spatial Light Modulator (SLM). In some embodiments, atstep533, the received laser beam and/or the split laser beam(s) and/or the bent laser beam(s) may be directed, e.g., using one or mirrors. It is appreciated that the mirrors may be controlled using one or more control signals, as described above. Atstep540, the manipulated laser beam(s) is emitted from theoptical multiplexer box520 onto a glass substrate. As such, the glass substrate may be cut and shaped without using mechanical cutting and grinding. Moreover, the glass substrate may be cut and shaped simultaneously. Furthermore, it is appreciated that in some embodiments, the optical multiplexer box may chemically alter the glass substrate into a shape defined by the chemical alteration rather than cut the glass substrate. In other words, the output of the optical multiplexer box may focus the emitted laser beams onto the glass substrate in order to alter the chemical properties of the glass substrate where the laser beam is focused. The chemical alteration delineates a desired cut/shape within the transparent glass substrate. Once the glass substrate is placed in a chemical bath, e.g., Aqueous solutions of Potassium Hydroxide (KOH) (concentrations of 5-20 mol/(dm)3, Sodium Hydroxide (NaOH) (concentrations of 5-20 mol/(dm)3), Hydrofluoric acid (HF) (concentrations of 1-10%), Muriatic acid (HCL) (concentrations of 10-80%). Bath times (5 min-100 min) and etch rates (1 um/min up to 20 um/min) can be adjusted by varying the chemical bath concentrations, bath temperature (between 20 and 90 degree Celsius), etc., theglass substrate190 separates according to the shape defined by the chemical alteration. Further enhancement of etch rates can be achieved by applying ultrasonic or megasonic waves to the chemical bath. Thus, the glass substrate may be formed and shaped without using mechanical cutting and grinding.
• Referring now toFIGS. 6A, 6B, and 6C, asystem600 for shaping an exposed edge of a previously cut glass substrate is shown according to one aspect of the present embodiments. Anenergy source602 is positioned to create an energy beam604 (e.g. laser, plasma, etc.) along an exposededge606 of aglass substrate608. Theenergy beam604 shapes the exposededge606 of theglass substrate608 by removing portions of the exposededge606 of theglass substrate608. In various embodiments, theglass substrate608 may have been previously cut (e.g. by mechanical, laser, chemical, etc.) into an annular shape (e.g. a disc), thereby forming the exposededge606. As such, the exposededge606 extends annularly around theglass substrate608. It is understood that theenergy beam604 may also be referred to as an energy column.
• In some embodiments, a number of energy sources may be used to shape the exposededge606. For example, anadditional energy source610 may also be positioned to create anadditional energy beam612 along the exposededge606 of theglass substrate608. Theadditional energy beam612 further shapes the exposededge606 of theglass substrate608 by removing additional portions of the exposededge606 of theglass substrate608. In further embodiments, any number of energy sources and energy beams may be used. In various embodiments, one or more of the energy sources may be stationary and theglass substrate608 may be rotatable. As such, theglass substrate608 may rotate through the energy beams, thereby rotating the exposededge606 through the energy beams.
• As previously described, a beam splitter may be positioned to create a number of energy beams from an energy source. For example, a beam splitter may be positioned between theenergy source602 and thesubstrate608. Theenergy source602 may project an incoming energy beam into the beam splitter. The beam splitter may then split the incoming energy beam into a first energy beam (e.g. energy beam604) and a second energy beam (e.g. additional energy beam612). It is understood that if a beam splitter is used to create theadditional energy beam612, theadditional energy source610 will not be needed. Also as previously described, one or more mirrors may be positioned to direct one or more of the energy beams along the exposededge606 of theglass substrate608.
• FIG. 6B illustrates a smooth and rounded exposededge606. As previously described, a number of energy beams may be directed along the exposededge606 of theglass substrate608. As the number of energy beams directed along the exposededge606 at different angles increases, the roundness of the exposededge606 may also increase. For example, after theglass substrate608 has been cut into the annular shape, the exposededge606 may be very angular (e.g. not round and pointed with corners), as illustrated byangular portion614. As the exposededge606 is shaped by one or more energy beams the roundness increases, as illustrated byrounded portion616.
• In further embodiments, the energy beams may be moved by one or more mirrors (as previously described) in order to increase the roundness of the exposededge606. In additional embodiments, one or more Diffractive Optics, Micro-lens Arrays and Spatial Light Modulator (SLM)s (as previously described) may be positioned to bend one or more energy beams to shape the exposededge606 of theglass substrate608. As previously described, theglass substrate608 may rotate through the bent portion of the one or more energy beams, thereby directing the removal of portions of theglass substrate608 along the exposededge606.
• FIG. 6C illustrates a complex shaped exposededge606. As previously described, energy beams may be used to create any number of shapes (both simple and complex) in the exposededge606 of theglass substrate608. In various embodiments, the exposededge606 may be shaped by any combination of linear energy beam(s) and/or bent energy beam(s). In further embodiments, the exposededge606 may include a uniform shape around the circumference of theglass substrate608, or the exposededge606 may include a non-uniform shape around the circumference of theglass substrate608.
• Referring toFIGS. 7A and 7B, asystem700 is shown for shaping an exposed edge with an energy source that is tangential to the exposed edge according to one aspect of the present embodiments. Anenergy source702 is positioned to create an energy beam704 (e.g. laser, plasma, etc.) along an exposededge706 of aglass substrate708. Theenergy beam704 is tangential to the exposededge706 of theglass substrate708. In various embodiments, theenergy source702 may also be positioned tangential to the exposededge706 of theglass substrate708. In further embodiments, theenergy source702 may be positioned anywhere and theenergy beam704 may be directed tangentially to the exposededge706 through the use of various components described above (e.g. mirror, beam splitter, special diffractive optics array, etc.).
• As previously discussed, theenergy beam704 shapes the exposededge706 of theglass substrate708 by removing portions of the exposededge706 of theglass substrate708. In various embodiments, theenergy source702 may include amask feature710 to shape a profile of theenergy beam704. As such theenergy beam704 may be shaped to create any shape in the exposededge706. For example, in some embodiments theenergy beam704 may form a simple rounded edge, as illustrated inFIG. 7A. In further embodiments, theenergy beam704 may form more complex shapes, as illustrated inFIG. 7B.
• Referring toFIG. 8, asystem800 is shown for shaping an exposed edge with plasma according to one aspect of the present embodiments.High voltage electrodes802 create a high density discharge804 (e.g. plasma). Thehigh density discharge804 interacts with an exposededge806 of aglass substrate808, removing any material extending into thehigh density discharge804. In various embodiments,lasers810 may be used to guide and shape thehigh density discharge804 into any shape. For example, the high density discharge may be formed into a curvature. In some embodiments, additional lasers may also be used to remove material from the exposededge806. For example, thehigh density discharge804 may remove some material from the exposededge806, and one or more additional lasers may also remove material from the exposededge806.
• Referring now toFIG. 9, another flow diagram in accordance with one aspect of the present embodiments is shown. Atstep910, an energy source generates an energy column, wherein the energy source is stationary. Atstep920, an edge of a glass substrate is rotated through the energy column. Atstep930, portions of the edge of the glass substrate are removed with the energy column.
• Referring now toFIG. 10, an additional flow diagram in accordance with one aspect of the present embodiments is shown. Atstep1010, a first energy beam is projected onto an annular edge of a glass substrate. Atstep1020, a first portion of the annular edge of the glass substrate is removed with the first energy beam, wherein the removing the first portion increases the roundness of the annular edge of the glass substrate. Atstep1030, a second energy beam is projected onto the annular edge of the glass substrate. Atstep1040, a second portion of the annular edge of the glass substrate is removed with the second energy beam, wherein the removing the second portion increases the roundness of the annular edge of the glass substrate.
• While the embodiments have been described and/or illustrated by means of particular examples, and while these embodiments and/or examples have been described in considerable detail, it is not the intention of the Applicants to restrict or in any way limit the scope of the embodiments to such detail. Additional adaptations and/or modifications of the embodiments may readily appear, and, in its broader aspects, the embodiments may encompass these adaptations and/or modifications. Accordingly, departures may be made from the foregoing embodiments and/or examples without departing from the scope of the concepts described herein. The implementations described above and other implementations are within the scope of the following claims.

Claims (20)

What is claimed is:

1. An apparatus comprising:

an energy source positioned to create an energy beam along an exposed edge of a glass substrate, wherein the energy beam shapes the exposed edge of the glass substrate by removing portions of the exposed edge of the glass substrate.

2. The apparatus ofclaim 1, wherein the energy beam is a laser beam or a plasma column.

3. The apparatus ofclaim 1, further comprising another energy source positioned to create an additional energy beam along the exposed edge of the glass substrate, wherein the additional energy beam further shapes the exposed edge of the glass substrate by removing additional portions of the exposed edge of the glass substrate.

4. The apparatus ofclaim 1, further comprising a beam splitter positioned to create an additional energy beam from the energy source, and

a mirror positioned to direct the additional energy beam along the exposed edge of the glass substrate, wherein the additional energy beam further shapes the exposed edge of the glass substrate by removing additional portions of the exposed edge of the glass substrate.

5. The apparatus ofclaim 1, further comprising a Diffractive Optics, Micro-lens Arrays and Spatial Light Modulator (SLM) positioned to bend the energy beam to shape the glass substrate.

6. The apparatus ofclaim 1, wherein the energy beam is a plasma column, and further comprising a laser source to create a laser to guide the plasma column.

7. The apparatus ofclaim 1, wherein the energy source is positioned tangential to the exposed edge of the glass substrate.

8. A method comprising:

generating an energy column with an energy source, wherein the energy source is stationary;

rotating an edge of a glass substrate through the energy column; and

removing portions of the edge of the glass substrate with the energy column.

9. The method ofclaim 8, wherein the energy column is a laser beam or a plasma column.

10. The method ofclaim 8, further comprising:

generating an additional energy column with an additional energy source;

rotating the edge of a glass substrate through the additional energy column; and

removing further portions of the edge of the glass substrate with the additional energy column.

11. The method ofclaim 8, further comprising:

splitting an additional energy column from the energy column;

rotating the edge of a glass substrate through the additional energy column; and

removing further portions of the edge of the glass substrate with the additional energy column.

12. The method ofclaim 11, further comprising:

moving the energy column with a first mirror; and

moving the additional energy column with a second mirror.

13. The method ofclaim 8, further comprising bending a portion of the energy column, wherein the edge of the glass substrate rotates through the bent portion of the energy column.

14. The method ofclaim 8, wherein the energy column is generated tangential to the edge of the glass substrate.

15. A method comprising:

projecting a first energy beam onto an annular edge of a glass substrate;

removing a first portion of the annular edge of the glass substrate with the first energy beam, wherein the removing the first portion increases the roundness of the annular edge of the glass substrate;

projecting a second energy beam onto the annular edge of the glass substrate; and

removing a second portion of the annular edge of the glass substrate with the second energy beam, wherein the removing the second portion increases the roundness of the annular edge of the glass substrate.

16. The method ofclaim 15, further comprising rotating the glass substrate through the first energy beam and the second energy beam.

17. The method ofclaim 15, further comprising projecting an incoming energy beam into a beam splitter, wherein the beam splitter splits the incoming energy beam into the first energy beam and the second energy beam.

18. The method ofclaim 15, further comprising bending the first energy beam and the second energy beam.

19. The method ofclaim 15, wherein the energy beam is a laser beam or a plasma column.

20. The method ofclaim 15, further comprising shaping a profile of the first energy beam with a mask feature.

Images