US20180165562A1 - Transaction card having internal lighting - Google Patents

Abstract

A transaction card construction and a method for making a transaction card are described. The transaction card construction comprises an inlay component and a housing component. The inlay component may comprise a light-penetrable layer and a backer layer. A light source may be disposed on or in the housing component, and the housing component and the inlay component may be joined such that light emitted by the light source passes through the inlay component.

Description

RELATED APPLICATIONS
• This application claims priority to U.S. Provisional Patent Application No. 62/432,154, filed Dec. 9, 2016. The contents of that application are hereby incorporated by reference in their entirety.
DESCRIPTIONTechnical Field
• The disclosed embodiments generally relate to transaction cards, and more particularly, to transaction cards having internal lighting.
BACKGROUND
• Transaction cards, such as credit and debit cards, have become a primary means for individuals to complete transactions involving data exchange. Traditional transaction cards are constructed in a sheeted laminate press. The shape of the card is die cut and then the card is personalized. Typically, transaction cards are cut from laminated sheets of polyvinyl chloride (PVC) or polycarbonate (PC), or other similar materials. After the overall shape of the card is formed, the card may be modified to add functional and/or visual features. For example, a magnetic strip and/or microchip may be affixed to one side, the card may be stamped with the card number and customer name, and color or a design may be added for appearance.
• In addition, as transaction cards increase in prevalence, expectations for transaction card quality have increased. Transaction cards have increasingly been made to meet higher standards regarding materials, durability, security, and appearance. Further, traditional card manufacturing methods, which have employed limited card construction techniques and materials, continue to utilize techniques and materials that restrict variations in card style and appearance.
• The present disclosure is directed to improvements in transaction cards.
SUMMARY
• The disclosed embodiments relate to a transaction card and a process/method for constructing the transaction card, wherein the transaction card includes an internal light source on or in a housing component.
• Consistent with a disclosed embodiment, a transaction card may include a housing component having a first housing surface, and a second housing surface opposite the first housing surface. The card may further include a light source disposed on or in the card housing. The card may further include an inlay component having a first inlay surface, and a second inlay surface opposite the first inlay surface. The housing and the inlay component may be joined at the first housing surface and the second inlay surface such that light emitted by the light source passes through the inlay component.
• Consistent with another disclosed embodiment, a method/process of manufacturing a transaction card may include forming a housing component having a first housing surface, and a second housing surface opposite the first housing surface. The method may further include providing a light source disposed on or in the housing component. The method may further include forming an inlay component having a first inlay surface, and a second inlay surface opposite the first inlay surface. The method may further include joining the housing component and the inlay component at the first housing surface and the second inlay surface such that light emitted by the light source passes through the inlay component.
• It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosed embodiments, as claimed.
BRIEF DESCRIPTION OF THE DRAWINGS
• The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate disclosed embodiments and, together with the description, serve to explain the disclosed embodiments. In the drawings:
• FIG. 1 is a block diagram of an exemplary transaction system, consistent with disclosed embodiments;
• FIG. 2A is a front view of an exemplary transaction card, consistent with disclosed embodiments;
• FIG. 2B is a back view of the exemplary transaction card ofFIG. 2A, consistent with disclosed embodiments;
• FIG. 3 is a front view of an exemplary transaction card showing section line4-4, consistent with disclosed embodiments;
• FIG. 4A is a cross-sectional view of the exemplary transaction card ofFIG. 3 along section line4-4, consistent with disclosed embodiments;
• FIG. 4B is another cross-sectional view of the exemplary transaction card ofFIG. 3 along section line4-4, consistent with disclosed embodiments;
• FIG. 5 is an exploded cross-sectional view of an exemplary transaction card, consistent with disclosed embodiments;
• FIG. 6 is another exploded cross-sectional view of an exemplary transaction card, consistent with disclosed embodiments;
• FIG. 7A is a front view of an exemplary transaction card showing section line7B-7B, consistent with disclosed embodiments;
• FIG. 7B is an exploded isometric cross-sectional view of the exemplary transaction card ofFIG. 7A taken along section line7B-7B, consistent with disclosed embodiments;
• FIG. 8 is an exploded cross-sectional view of an exemplary transaction card, consistent with disclosed embodiments;
• FIG. 9 is another exploded cross-sectional view of an exemplary transaction card, consistent with disclosed embodiments;
• FIG. 10 is a schematic illustration of an exemplary electrical circuit, consistent with disclosed embodiments;
• FIG. 11A is a front view of an exemplary transaction card showing section line11B-11B, consistent with disclosed embodiments;
• FIG. 11B is a cross-sectional view of the exemplary transaction card ofFIG. 11A taken along section line11B-11B, consistent with disclosed embodiments;
• FIG. 12 is a front and cross-sectional view illustration of an exemplary transaction card having a rechargeable power source, and a charging device, consistent with disclosed embodiments; and
• FIG. 13 is a flowchart showing an exemplary method for constructing a transaction card, consistent with the disclosed embodiments.
DETAILED DESCRIPTION
• Reference will now be made in detail to the disclosed embodiments, examples of which are illustrated in the accompanying drawings. Wherever convenient, the same reference numbers will be used throughout the drawings to refer to the same or like parts.
• The term “transaction card,” as used herein may refer to a physical card product that includes features to provide transaction information. As used herein, the term “personal information” may include information that is associated with a user of the card or information associated with an account of/for the card user. In some embodiments, personal information may include “transaction information,” such as financial information (e.g., card numbers, account numbers, expiration dates, etc.), quasi-financial information (e.g., rewards balance, discount information, etc.), individual-identifying information (e.g., name, address, etc.), bank information, and/or transaction network information. Examples of transaction cards include credit cards, debit cards, gift cards, rewards cards, frequent flyer cards, merchant-specific cards, discount cards, identification cards, membership cards, and driver's licenses, but are not limited thereto. The physical properties of the transaction card (e.g., size, flexibility, location of various components included in the card) may meet the various international standards, including, for example, ISO/IEC 7810, ISO/IEC 7811, ISO/IEC 7812, ISO/IEC 7813, ISO/IEC 7816, ISO 8583, ISO/IEC 4909, and ISO/IEC 14443. For example, a transaction card may have a dimension of 85.60 mm (width) by 53.98 mm (height) by 0.76 mm (thickness), as specified in ISO/IEC 7810.
• Disclosed embodiments include transaction cards and methods for manufacturing a transaction card. For example, disclosed embodiments include a transaction card having a housing component configured to house an inlay component, wherein the inlay component may include a light-penetrable layer and a backer layer joined to the light-penetrable layer. A light source or sources may be disposed on or in the housing component, and the housing component and inlay component may be joined such that light emitted by the light source(s) passes through the inlay component.
• The light source may be configured to emit light from the card. For example, the light source may be positioned on or in the card and configured to emit light outwardly or away from the card. In some embodiments, the light source may be configured to emit light through a light-penetrable component of the card. For example, the light source may be configured to emit light for passage through one or more transparent, translucent, or non-opaque component(s) or subcomponent(s) of the card. The light source may also or alternatively be configured to emit light from a space, cavity, or compartment defined by one or more components or features of the card.
• In some embodiments, the light source may be a light emitting diode. Additionally, in some embodiments, the light source may be disposed between the first housing surface and the inlay component to permit light emitted by the light source to pass through the inlay component.
• The inlay component may include a light-penetrable layer and a backer layer joined to the light-penetrable layer. The backer layer may provide structural support to the light-penetrable layer. In some embodiments, the light source may be disposed between the light-penetrable layer and the backer layer.
• The housing component may also include a cavity having a cavity wall. In some embodiments, the light source may be disposed between the cavity wall and the inlay component.
• In some embodiments, the card may further include a switch electronically connected to the light source. The switch may be configured to activate and deactivate the light source.
• The card may further include a power source disposed on or in the card housing. The power source may be configured to supply power to the light source. In some embodiments, the power source may be a rechargeable power source. In some embodiments, the light source may be a light emitting diode (LED). In other embodiments, the light source may be a photoluminescent material.
• The light-penetrable layer may comprise transaction information. In some embodiments, the transaction information may be visible to users when the light source is activated or when the light source is deactivated. The visibility and/or appearance of the transaction information may be enhanced or modified when the light source is activated.
• FIG. 1 illustrates anexemplary transaction system10.Transaction system10 may include a computing system configured to receive and send information between the components oftransaction system10 and components outside oftransaction system10.Transaction system10 may include a financialservice provider system12 and amerchant system14 communicating with each other through a network16.Transaction system10 may include additional and/or alternative components.
• Financialservice provider system12 may include one or more computer systems associated with an entity that provides financial services. For example, the entity may be a bank, credit union, credit card issuer, or other type of financial service entity that generates, provides, manages, and/or maintains financial service accounts for one or more customers. Financial service accounts may include, for example, credit card accounts, checking accounts, savings accounts, loan accounts, reward accounts, and other types of financial service accounts. Financial service accounts may be associated with physical financial service transaction cards, such as credit or debit cards that customers use to perform financial service transactions, such as purchasing goods and/or services online or at a point of sale (POS) terminal. Financial service accounts may also be associated with electronic financial products and services, such as a digital wallet or similar account that may be used to perform electronic transactions, such as purchasing goods and/or services online.
• Merchant system14 may include one or more computer systems associated with a merchant. For example,merchant system14 may be associated with an entity that provides goods and/or services (e.g., a retail store). The merchant may include brick-and-mortar location(s) that a customer may physically visit and purchase goods and services using the transaction cards. Such physical locations may include computing devices (e.g., merchant system14) that perform financial service transactions with customers (e.g., POS terminal(s), kiosks, etc.). Additionally or alternatively,merchant system14 may be associated with a merchant who provides an electronic shopping environment, such as a website or other online platform that consumers may access using a computer through a browser, a mobile application, or similar software.Merchant system14 may include a client device, such as a laptop computer, desktop computer, smart phone, or tablet, which a customer may operate to access the electronic shopping mechanism.
• Network16 may include any type of network configured to facilitate communications and data exchange between components oftransaction system10, such as, for example, financialservice provider system12 andmerchant system14. Network16 may include, but is not limited to, Local Area Networks (LANs) and Wide Area Networks (WANs), such as the Internet. Network16 may be a single network or a combination of networks. Network16 is not limited to the above examples andtransaction system10 may implement any type of network that allows entities (shown and not shown) oftransaction system10 to exchange data and information.
• Transaction system10 may be configured to conduct a transaction using atransaction card20. In some embodiments, financialservice provider system12 may providetransaction card20 to a customer for use in conducting transactions associated with a financial service account held by the customer. For example, the customer may usetransaction card20 at a merchant location to make a purchase. During the course of the purchase, information may be transferred fromtransaction card20 to merchant system14 (e.g., a point of sale device).Merchant system14 may communicate with financialservice provider system12 via network16 to verify the information and to complete or deny the transaction. For example,merchant system14 may receive account information fromtransaction card20.Merchant system14 may transmit the account information and a purchase amount, among other transaction information, to financialservice provider system12. Financialservice provider system12 may settle the transaction by transferring funds from the customer's financial service account to a financial service account associated with the merchant.
• Whiletransaction system10 andtransaction card20 are depicted and described in relation to transactions that involve customers, merchants, and financial service providers, it should be understood that these entities are used only as an example to illustrate one environment in whichtransaction card20 may be used.Transaction card20 is not limited to financial products and may be any physical card product that is configured to store and/or transmit information. For example,transaction card20 may be an identification card configured to provide information to a device in order to identify the holder of the card (e.g., a driver's license).
• In some embodiments,transaction card20 may further include adata storage component22 disposed on or in a transaction card frame (“frame”)24. As used herein, a “data storage component” may be one or more devices and/or elements configured to receive, store, process, provide, transfer, send, delete, and/or generate information. For example,data storage component22 may be a microchip (e.g., a Europay, MasterCard, and Visa (EMV) chip), a communication device (e.g., Near Field Communication (NFC) antenna, Bluetooth® device, WiFi device), a magnetic strip, a barcode, Quick Response (QR) code, etc.Data storage component22 may be secured (or affixed, attached) toframe24 in such a way that allowsframe24 to carrydata storage component22 while maintaining a utility of data storage component22 (i.e., allowingdata storage component22 to interact with merchant system14).Data storage component22 may be configured to ensure thatdata storage component22 functions properly during data storage and transmission; for example, ensuring that a card containing an RFID (radio frequency identification) device shielded by a material layer can still be properly read by an RFID reader through the material layer.
• FIGS. 2A and 2B are front and rear views, respectively, of anexemplary transaction card28 with a firstdata storage component22A (e.g., a microchip) and a second data storage component22B.FIG. 2A shows afront surface30 ofcard28 with a length defined as L_c, andFIG. 2B shows arear surface32 ofcard28, with data storage component22B exposed (i.e., a magnetic strip in this exemplary embodiment). The magnetic strip may have a length L_mwhich may be equal to or less than the card length L_c, and may be flush withrear surface32.
• In some embodiments, visual details, such as transaction information, aesthetic designs, images, etc., may be visible from afirst side30 ofcard28. For example, a customer name, an account number, date information, bank information, transaction system information (e.g. Visa, MasterCard, etc.), a design or logo, a signature associated with the customer, and/or other information may be visible fromfirst side30. In some embodiments, visual information may also or alternatively be visible fromsecond side32 ofcard28. Such visual details may be generated during a process of forming the card (e.g., pressing, laminating, injection molding, etc.) or during a process subsequent to card formation (e.g., milling, laser cutting, etching, stamping, etc.). In some embodiments, such visual details may be included on one or more surfaces oftransaction card28 and visible from first and/orsecond side30,32.
• FIG. 3 illustratescard28 with a section line4-4 along its length.FIG. 4A is a magnified cross-sectional view ofcard28 along line4-4. As shown,card28 may include a housing component (or “housing”)34, an inlay component (or “inlay”)36, one or morelight sources40, and apower source42 electronically connected to thelight sources40.Power source42 may be configured to supply electrical power tolight sources40, which may be configured to emit light throughinlay36.Housing34 and/orinlay36 may include arecess44 configured to house and exposedata storage device22A. As used herein, the term “inlay” may refer to material or a component set into a surface of another material or component.
• Housing34 may be made of PVC, PC, or other similar materials, and may be manufactured using a molding process, such as an injection-molding process or a compression-molding process. In other embodiments,housing34 may be formed of a resin mixture comprising one or more of a thermoplastic elastomer (TPE), polybutylene terephthalate (PBT), an acetal homopolymer, and/or other materials. In some embodiments, the TPE and/or other materials may be selected to providecard28 with a “soft-touch feel” (i.e., a haptic sensation that occurs when a person touches something that, for example, feels soft, smooth, and/or satiny). In some embodiments, the resin mixture may include a polyester elastomer, a block copolymer, a thermoplastic olefin, an elastomeric alloy, a thermoplastic polyurethane, a thermoplastic copolyester, or a thermoplastic polyamide. In some embodiments,housing34 may be non-opaque (e.g., translucent, transparent, clear, etc.). That is,housing34 may be formed of a material that is non-opaque after manufacturing is complete (e.g., after setting).
• Inlay36 may be a light-penetrable inlay. That is,inlay36 may be configured to allow light to pass therethrough (i.e., a device through which visible light may pass). In some embodiments,inlay36 may be clear, transparent, or translucent. In some embodiments, light passing throughinlay36 may be diffused to achieve desired aesthetic and/or operational requirements. That is,inlay36 may have light-diffusing properties or be a light-diffusing layer. In some embodiments,inlay36 may be backlit bylight sources40 to produce a desired aesthetic appearance of card28 (e.g., to causecard28 to appear “lit up” and/or to cause visual details oncard28 to become visible or appear differently when backlit or edge lit).
• Light diffusing properties ofinlay36 may function to spread light emitted bylight sources40 acrossinlay36 to create a more even distribution of light intensity, as seen by a card user throughinlay36. In this way, desired lighting characteristics may be achieved while reducing the appearance of localized higher-intensity light (or “hot spots”) caused by light sources40 (e.g., sources of direct light, such as LEDs). The light diffusing function ofinlay36 may also permit for edge-lighting of inlay36 (discussed further below), which may require fewerlight sources40 than backlighting configurations, thereby reducing the cost ofcard28 and improving its operating efficiency.
• As shown inFIG. 4A,housing34 may include afirst housing surface46, and asecond housing surface48 opposite thefirst housing surface46.Inlay36 may include afirst inlay surface50, and asecond inlay surface52 opposite thefirst inlay surface50.Light sources40 may disposed on or incard housing36 and configured to emit light through inlay36 (i.e., when energized or powered by power source42).Housing34 andinlay36 may be joined viafirst housing surface46 andsecond inlay surface52 such that light emitted by light source(s)40 passes throughinlay36. That is,first housing surface46 andsecond inlay surface52 may be adjacent and/or in contact with one another whenhousing34 andinlay36 are joined. For example,housing34 andinlay36 may be joined using an adhesive material, interconnecting features (e.g., snap fit, tongue and groove, etc.), fasteners (e.g., screws, nuts, bolts, rivets, etc.), and/or other joining mechanisms or techniques.
• Light source40 may be an electronic, photoluminescent (i.e., “glow in the dark”), or other type of device configured to emit light. For example, in some embodiments,light source40 may be a light emitting diode (LED). Suitable LEDs may be selected based on, among other factors, size limitations, color requirements, and power usage limitations. For instance,card28 may have an overall thickness of 0.030 inches (0.762 mm) (e.g., pursuant to ISO standards for transaction card thickness), and therefore a relatively small LED may be used aslight source40. For example, LEDs having a footprint of the standard size 0201 (0.002×0.001×0.001 inches) may be suitable for use incard28. It is noted that other LEDs of different sizes may be used, depending on the dimensions of the LED and/or the dimensions of the card components (e.g.,housing34,inlay36, etc.). It should be noted thatlight source40 may be or include other types of electronic light sources, such as light bulbs (e.g., incandescent, fluorescent, halogen, etc.). Size and power constraints may dictate the types of electronic light sources that can be used withcard28 aslight source40.
• In other embodiments, photoluminescent materials may be used aslight source40. For example,light source40 may be or include a photoluminescent coating, such as a photoluminescent epoxy or paint. In other embodiments, a photoluminescent pigment or other photoluminescent material may be added toinlay36 during its formation. Suitable photoluminescent materials may be those that store light photons when exposed to an external light source (e.g., ambient light, direct sunlight, another light source, etc.) and continue to emit light after exposure to the light source has ended.
• When multiplelight sources40 are used, one or more colors of light sources40 (i.e., light sources that emit different colors) may be implemented, depending on design and utility requirements. For example, in some embodiments,light sources40 may be all the same color (e.g., red, orange, yellow, green, blue, etc.). In other embodiments,light sources40 configured to emit different colors of light may be installed to generate desired patterns of colored light for aesthetic or functional purposes. For example, in some embodiments, LEDs of different colors may be configured to indicate the voltage or state of charge (SOC) ofpower source42. In an exemplary embodiment, an LED of a first color (e.g., green) may be configured to be energized whenpower source42 is above a first voltage or SOC. An LED of a second color (e.g., yellow) may be configured to be energized whenpower source42 is above a second and below the first voltage or SOC. An LED of a third color (e.g., red) may be configured to be energized whenpower source42 is below the second voltage or SOC. It is noted that other types of information may be indicated based on the location, color, flashing pattern, etc., oflight sources40.
• In some embodiments, as shown inFIG. 4A,inlay36 may be comprised of a single-layer. In other embodiments,inlay36 may be formed of multiple components (e.g., multiple layers). For example, as shown inFIG. 4B,inlay36 may include a light-penetrable layer54 and a backer layer56 (serving as structural backing support for layer54). Light-penetrable layer54 andbacker layer56 may be joined by a suitable joining or fastening mechanism that permits light to pass fromsecond inlay surface52 tofirst inlay surface50. For example, Light-penetrable layer54 andbacker layer56 may be joined by an adhesive layer (not shown), which may be, for example, 1 mil or greater in thickness (depending on the overall thickness ofcard28 and the thicknesses of light-penetrable layer54 andbacker layer56, and on the requirements of the adhesive).
• In some embodiments, light-penetrable layer54 may be or include a light diffuser material, such as a light diffuser film. For example, light-penetrable layer54 may be a one- or two-sided diffuser film configured to distribute light evenly across its surface. Each respective side of the light diffuser material may be clear, translucent, or have a matte finish. In some embodiments, the light diffuser material may comprise multiple layers, such as guide layers, diffusion layers, prism layers, etc.
• In other embodiments, light-penetrable layer54 may be clear, transparent, translucent, tinted, polarized, textured, hazed, colored, or otherwise configured to affect (or not affect) light passing therethrough. In some embodiments, light-penetrable layer54 may have a reflective backing. That is, light-penetrable layer54 may be adjacent a reflective material, such as a mirror, polished metal, metal-coated or metal-plated material, a coated or otherwise reflective glass or plastic material, etc. A reflective backing may reflect back light passing through light-penetrable layer54 to enhance or brighten the appearance ofcard28.
• The thickness of light-penetrable layer54 may be selected based on desired light-altering performance, the thickness ofbacker layer56, and/or structural requirements ofinlay34. For example, light-penetrable layer may be from 3 mils (i.e., 3/1000 of an inch) to 20 mils thick, depending on the thickness ofbacker layer56 and/or other components. Light-penetrable layer54 may be, for example, from 3 to 20 mils, from 3 to 15 mils, from 3 to 10 mils, from 3 to 5 mils, or less than 3 mils thick.
• In some embodiments, light-penetrable layer54 may be formed using a lamination, injection molding, compression injection, sheet forming, or other process. In some embodiments, light diffusing materials, such as acrylic, polycarbonate (PC), polyethylene terephthalate (PET), and/or other materials may be used to form light-penetrable layer54. In other embodiments, light-penetrable layer54 may be or include one or more commercially available materials. For example, light-penetrable layer54 may be cut from a roll or sheet of light-penetrable commercially available material. Cutting, stamping, milling, laser cutting, and/or other processes may be used to form light-penetrable layer54 from rolls or sheets of commercially available light-penetrable material.
• In some embodiments, light-penetrable layer54 may be configured to polarize light generated bylight source40 to alter the appearance of passing light and/or to provide a privacy function. For example, light-penetrable layer54 may be configured to restrict the angle at which visible light is emitted from inlay36 (e.g., to reduce visibility of details oncard28 from peripheral vantage points). To achieve polarizing functionality, light-penetrable layer54 may, for example, include polarizing materials or a polarizing layer.
• Backer layer56 may be a structural layer configured to support light-penetrable layer54 and facilitate the joining ofinlay36 tohousing34. In some embodiments,backer layer56 may be formed of particular materials or be sized to improve the mechanical properties ofcard28. For example,backer layer56 may be formed of stiffer, less flexible, and/or more dense materials than light-penetrable layer54.Backer layer56 may be formed of, for example, injection molded plastic, polycarbonate, acrylic, and/or other materials. The thickness ofbacker layer56 may be selected based on the overall thickness of card28 (e.g., 30 mils) and may range from 10-20 mils, depending on the thicknesses ofhousing34 and light-penetrable layer54. For example,backer layer56 may be less than 20 mils, 10-20 mils, 12-18 mils, 14-16 mils, 15 mils, or greater than 10 mils in thickness.
• With reference toFIG. 5, some embodiments ofcard28 may be configured such that light source(s)40 is/are disposed betweenhousing34 andinlay36. For example,FIG. 5 shows a partially disassembled, magnified cross-sectional view ofcard28, in whichlight sources40 are disposed betweenfirst housing surface46 and inlay36 (e.g.,second inlay surface52 of inlay36). In embodiments consistent with the example ofFIG. 5,backer layer56 may be non-opaque (i.e., formed of non-opaque material) to permit light to travel throughbacker layer56, and thus throughinlay36.
• In the configuration of the exemplary embodiment ofFIG. 5, visual details ofcard28, such as transaction information (e.g., card number, customer name, logos, etc.), may be included onbacker layer56, which may be visible by the user throughinlay36 and/or made more visible (or appear differently) when light source(s)40 is/are emitting light. For example, atop surface58 ofbacker layer56 may be etched, sanded, laser-etched, carved, printed, milled, stamped, or otherwise processed to include visual details that are configured to be or become visible throughinlay36 when light source(s)40 is/are energized. In embodiments consistent with the example ofFIG. 5, light-penetrable layer56 may also or alternatively be processed to include visual details.
• With reference toFIG. 6, some embodiments ofcard28 may be configured such that light source(s)40 is/are disposed between light-penetrable layer54 andbacker layer56. For example,FIG. 6 shows a partially disassembled, magnified cross-sectional view ofcard28, in whichlight sources40 are disposed betweentop surface58 ofbacker layer56 and a bottom surface60 of light-penetrable layer54. In embodiments consistent with the example ofFIG. 6,backer layer56 may be non-opaque, opaque, and/or reflective (i.e., is formed of or includes reflective material). For example,top surface58 ofbacker layer56 may include a reflective coating or be covered with a layer of reflective material (e.g., metal, metallic coating, reflective spray or film, etc.) to reflect light through light-penetrable layer54.
• In the configuration of the exemplary embodiment ofFIG. 6, visual details ofcard28, such as transaction information (e.g., card number, customer name, logos, etc.), may be included or formed on or in the top or bottom surface of light-penetrable layer54 (i.e., onfirst inlay surface50 or bottom surface60 of light-penetrable layer, respectively). In this way, visual details ofcard28 may be visible by the user throughinlay36 and/or made more visible (or appear differently) when light source(s)40 is/are energized (i.e., emitting light). Light-penetrable layer54 may be etched, sanded, laser-etched, carved, printed, milled, stamped, or otherwise processed to include visual details that are configured to be or become visible throughinlay36 when light source(s)40 is/are energized.
• FIG. 7A illustratescard28 with a section line7B-7B along its width.FIG. 7B is a magnified, partially disassembled, isometric cross-sectional view ofcard28 along line7B-7B. In embodiments consistent with the example ofFIG. 7B,housing34 may include acavity62 having acavity wall64.Inlay36 may be configured to fit into or be positioned withincavity62 such that aside portion66 of inlay36 (e.g., a side portion of light-penetrable layer54 and/or backer layer56) isadjacent cavity wall64. Light source(s)40 may also be positioned on or on or in (e.g., recessed into)cavity wall64. In this way, light source(s)40 may be configured to project (i.e., emit) light laterally throughinlay36. Laterally projected light from light source(s)40 may be distributed and/or scattered throughoutinlay36 to achieve a more even light distribution acrossfront surface30 ofcard28. In other words, light source(s)40 may be configured to edge-light inlay36. Edge-lighting may permit for fewerlight sources40 to be used, thereby reducing the cost and increasing the efficiency ofcard28.
• In some embodiments, as shown inFIGS. 8 and 9,card28 may include aswitch68 configured to activate and deactivate the light source(s)40. With reference toFIG. 8, in some embodiments, switch68 may be disposed between light-penetrable layer54 andbacker layer56. For example, switch68 may be disposed in arecess70 ontop surface58 ofbacker layer56. In other embodiments, switch68 may be disposed directly ontop surface56 of backer layer56 (i.e., not within a recess).Switch68 may be a pressure switch (i.e., a pressure-sensitive or pressure-activated switch) configured to activate light source(s)40 when a user presses on card28 (e.g., pressesinlay36 andhousing34 together). For instance, inlay36 (i.e., light-penetrable layer54 and/or backer layer56) may be configured to flex under pressure applied tocard28, thereby exerting a force onswitch68 sufficient to energize light source(s)40. In other embodiments, switch68 may be a touch sensor (e.g., a capacitive-type touch sensor) positioned at or sufficiently nearfirst inlay surface50 to detect when a user touches switch68 (i.e. to activate light source(s)40).
• In other embodiment, with reference toFIG. 9, switch68 may be disposed betweenhousing34 andinlay36. For example, switch38 may be disposed betweenfirst housing surface46 and the bottom of inlay36 (e.g., second inlay surface52). For example, switch68 may be disposed inrecess70 onsecond inlay surface52. In other embodiments, switch68 may be disposed directly on second inlay surface52 (i.e., not within a recess).
• FIG. 10 shows a schematic illustration of anexemplary circuit72 consistent with embodiments of the present disclosure. As shown,light source40 may be electrically connected to power source42 (e.g., via wires, flat wires, printed conductors, a circuit board, etc.).Switch68 may be electrically connected tolight source40 andpower source42, and may be configured to activate and deactivate the light source by connecting and disconnectinglight source40 frompower source42. It should be understood that other circuit components may also be included, such as capacitors, resistors, memory, a processor, etc.Light source40 may include a plurality of light sources (e.g., LEDs) connected in parallel to power source42 (e.g., by a bus or other conductive component). In other embodiments, one or more light sources may be connected in series.
• In some embodiments,power source42 may be or include one or more batteries. For example,power source42 may include a lithium-ion battery or other type of non-rechargeable or single-use battery. Batteries used inpower source42 may be thin and flexible. For example, commercially available flexible lithium batteries less than 2 mils thick may be used. Battery thickness may exceed 2 mils depending on the thickness ofcard28 and of its components (e.g.,inlay36 and housing34). The lifespan of a non-rechargeable battery may be determined by type and quantity oflight sources40 included incard28.
• In another embodiment, with reference toFIGS. 11A-11B,card28 may include arechargeable power source74.FIG. 11A illustratescard28 with a section line11B-11B along its width.FIG. 11B is a magnified cross-sectional view ofcard28 along line11B-11B. In embodiments consistent with the example ofFIG. 11B,rechargeable power source74 may be disposed on or inhousing34 and configured to supply power to the light source.Rechargeable power source74 may be or include, for example, a lithium polymer battery or other type of rechargeable or multiple-use battery. Batteries used inrechargeable power source74 may be thin and flexible. For example, commercially available flexible lithium polymer batteries less than 2 mils thick may be used. Battery thickness may exceed 2 mils depending on the thickness ofcard28 and of its components (e.g.,inlay36 and housing34).Rechargeable battery74 may include chargingelectrodes76 configured to conduct an electrical current from a charging device intorechargeable battery74.Charging electrodes76 may be configured to be exposed, for example, atfront surface30 ofcard28. In other embodiments, chargingelectrodes76 may be exposed at arear surface78 oppositefront surface30.
• FIG. 12 shows a schematic illustration of an exemplary charging device80 configured to receivecard28 for chargingrechargeable battery74. In the example ofFIG. 12, charging device80 may be configured to receivecard28 through an open end82. A charging terminal84 may be disposed on or in charging device80 and include chargingelectrodes86 configured to engage chargingelectrodes76 ofcard28. Charging device80 may include a charging circuit88 for conditioning electrical current from an external power source. It should be noted thatcard28 and charging device80 may be configured to utilize other configurations or types of charging systems, such as inductive charging systems, solar power systems (e.g., solar panel or thin-film solar power systems), and/or other types of charging systems.
• In some embodiments,card28 may include an internal power generator to chargerechargeable battery74. For example,card28 may include a kinetic generator, such as a micro-generator (e.g., a claw-pole generator, a lavet generator, an air coil generator, oscillating mass generator, piezoelectric material generator, etc.). In other embodiments,card28 may include a thermoelectric generator, such as a semiconductor-type thermoelectric generator configured to generate electricity from a temperature gradient. In such embodiments, a user may be able to place one side ofcard28 on a hot or cool surface (relative to the other side of card20) to chargebattery74. In other embodiments,card28 may include solar panels or thin-film solar cells (e.g., photovoltaic materials) for harvesting solar energy. In some embodiments, light-penetrable layer54 may comprise a transparent photovoltaic material configured to convert light energy into electricity while also allowing light to pass therethrough.
• FIG. 13 is a flowchart showing an exemplary method/process1300 for forming a transaction card according to some embodiments of the present disclosure. It is noted that the steps associated with method1300 may be performed in different orders than the order in which they are numbered and/or described. Method1300 may include forming a card housing component having a first housing surface, and a second housing surface opposite the first housing surface (Step1310). For example Step1310 may include forminghousing34 from PVC, PC, or other similar materials, using a manufacturing process, such as a molding process (e.g., an injection-molding process or a compression-molding process). In other embodiments,housing34 may be formed of a resin mixture comprising one or more of a thermoplastic elastomer (TPE), polybutylene terephthalate (PBT), an acetal homopolymer, and/or other materials. In some embodiments, the TPE and/or other materials may be selected to providecard28 with a “soft-touch feel” (i.e., a haptic sensation that occurs when a person touches something that, for example, feels soft, smooth, and/or satiny). In some embodiments, method1310 may include forminghousing34 from a resin mixture comprising a polyester elastomer, a block copolymer, a thermoplastic olefin, an elastomeric alloy, a thermoplastic polyurethane, a thermoplastic copolyester, or a thermoplastic polyamide. In some embodiments,housing34 may be non-opaque (e.g., translucent, transparent, clear, etc.). That is,housing34 may be formed of a material that is or becomes non-opaque after manufacturing is complete (e.g., after setting)
• Method1300 may further include forming light-penetrable inlay34 withfirst inlay surface50 andsecond inlay surface52 opposite first inlay surface50 (Step1320). In some embodiments,inlay34 may be formed as a unitary component, as shown inFIG. 4A, for example, using a molding process, a stamping process, a sheet forming process, or another manufacturing process. In other embodiments, Step1320 may include forminginlay34 by forming and joiningbacker layer56 and light-penetrable layer54.Backer layer56 and light-penetrable layer54 may each be respectively formed using a molding process, a stamping process, a sheet forming process, or another manufacturing process. Step1320 may also include joiningbacker layer56 and light-penetrable layer54, for example, using epoxy or a lamination process. In some embodiments, a reflective coating may also be provided onbacker layer56 during step1320 to allow light to be reflected through light-penetrable layer54. In some embodiments, step1320 may further include providing visual details ofcard28, such as personal information, on light-penetrable layer54 and/orbacker layer56, such as by etching, sanding, laser-etching, carving, printing, milling, stamping, etc.
• As used herein, the term “forming” with regard to steps of forming or manufacturing components or subcomponents ofcard28 may include providing such components or subcomponents (e.g., by providing commercially available or commissioned components).
• Method1300 may further include formingcavity62 within housing34 (Step1330). Step1330 may include formingcavity wall64. In some embodiments,cavity62 may be formed whenhousing34 is formed (i.e., formed during the forming process of housing34). In other embodiments, step1330 may be a separate process that includes subsequently formingcavity64 withinhousing34, such as by milling, laser cutting, etc.
• Method1300 may further include providinglight source40 and disposing it on or in card housing34 (Step1340). In some embodiments, step1340 may include providing an electronic, photoluminescent (i.e., “glow in the dark”), or other type of device configured to emit light from housing34 (e.g., from cavity62). For example, in some embodiments, step1340 may include providing one or more light emitting diodes (LED) or another type of electronic light source, such as an incandescent or fluorescent source. In other embodiments, step1340 may include providing a photoluminescent material, such as a photoluminescent coating (e.g., a photoluminescent epoxy or paint) on one or more offirst housing surface46,top surface58 ofbacker layer56, orsecond inlay surface52. Alternatively, a photoluminescent pigment or other photoluminescent material may be added toinlay36 during its formation. In some embodiments, step1340 may include providing multiplelight sources40, which may be configured to emit different colors of light.
• In some embodiments, with reference toFIG. 5, step1340 may include providing light source(s)40 betweeninlay36 and housing34 (e.g., betweenfirst housing surface46 and second inlay surface52). In other embodiments, with reference toFIG. 6, step1340 may include providing light source(s) betweentop surface58 ofbacker layer56 and a bottom surface60 of light-penetrable layer54. In other embodiments, step1340 may include providing light source(s)40 betweeninlay36 andhousing34 by disposing light source(s)40 on (e.g., directly on or in a recess on)cavity wall64, as shown inFIG. 7B.
• Method1300 may further include providing a power source (e.g.,non-rechargeable power source42 or rechargeable power source74) and disposing the power source on or in housing34 (step1350). The method may further include electronically connecting light source(s)40 to the power source (Step1360) via a bus or other conductor. In some embodiments, the method may further include electronically connectingswitch68 to light source40 (Step1370) (e.g., between light source(s)40 and the power source) for activating and deactivatinglight source40.
• Method1300 may further include joininghousing34 andinlay36 atfirst housing surface46 and thesecond inlay surface52 such that light emitted bylight source40 passes through inlay30 (Step1380). As described above, and with reference toFIGS. 4A-4B,housing34 andinlay36 may be joined with light source(s)40 betweeninlay36 andhousing34, or with light source(s)40 between light-penetrable layer54 andbacker layer56. In some embodiments, and with reference toFIG. 7B,housing34 andinlay36 may then be joined withlight sources40 betweeninlay36 andcavity wall64 ofhousing34.Inlay36 andhousing34 may be joined, for example, using an epoxy or other joining method, as described above.
• While illustrative embodiments have been described herein, the scope includes any and all embodiments having equivalent elements, modifications, omissions, combinations (e.g., of aspects across various embodiments), adaptations or alterations based on the present disclosure. For example, the order of the steps of the above exemplary method may be rearranged in any preferred or suitable order, or any step may be removed or added.
• The elements in the claims are to be interpreted broadly based on the language employed in the claims and not limited to examples described in the present specification or during the prosecution of the application, which examples are to be construed as non-exclusive. It is intended, therefore, that the specification and examples be considered as example only, with a true scope and spirit being indicated by the following claims and their full scope of equivalents.

Claims (20)

1. A transaction card, comprising:

a front outer surface;

a rear outer surface opposite the front outer surface;

a housing component having a first housing surface, and a second housing surface opposite the first housing surface;

a light source;

an inlay component having a first inlay surface, and a second inlay surface opposite the first inlay surface;

wherein the light source is disposed between the housing component and the inlay component; and

wherein the housing component and the inlay component are joined via the first housing surface and the second inlay surface such that light emitted by the light source passes through the inlay, the second housing surface being the rear outer surface, and the first inlay surface being the front outer surface of the transaction card.

2. The transaction card ofclaim 1, wherein the light source is disposed on or in the housing component.

3. The transaction card ofclaim 1, wherein the inlay component comprises:

a light-penetrable layer; and

a backer layer joined to the light-penetrable layer.

4. The transaction card ofclaim 3, wherein the light source is disposed between the light-penetrable layer and the backer layer.

5. The transaction card ofclaim 1, wherein:

the housing component includes a cavity having a cavity wall; and

the light source is disposed between the cavity wall and the inlay component.

6. The transaction card ofclaim 1, further comprising a switch electronically connected to the light source and configured to activate and deactivate the light source.

7. The transaction card ofclaim 1, further including a power source disposed within the card hosing and configured to supply power to the light source.

8. The transaction card ofclaim 7, wherein the power source is a rechargeable power source.

9. The transaction card ofclaim 1, wherein the light source is a light emitting diode.

10. The transaction card ofclaim 1, wherein the light source is a photoluminescent material.

11. A method of manufacturing a transaction card having a front outer surface and a rear outer surface opposite the front outer surface, comprising:

forming a housing component having a first housing surface, and a second housing surface opposite the first housing surface;

forming an inlay component having a first inlay surface, and a second inlay surface opposite the first inlay surface;

providing a light source disposed between the housing component and the inlay component; and

joining the housing component and the inlay component via the first hosing surface and the second inlay surface such that light emitted by the light source passes through the inlay component, the front outer surface of the transaction card being the first inlay surface, and the rear outer surface of the transaction card being the second housing surface.

12. The method ofclaim 11, wherein the light source is disposed on or in the housing component.

13. The method ofclaim 11, wherein forming the inlay component includes:

providing a light-penetrable layer and a backer layer; and

joining the light-penetrable layer and the backer layer.

14. The method ofclaim 13, wherein the light source is disposed between the light-penetrable layer and the backer layer.

15. The method ofclaim 11, further comprising forming a cavity within the card housing, wherein:

the cavity includes a cavity wall; and

the light source is disposed between the cavity wall and the inlay component.

16. The method ofclaim 11, further comprising connecting a switch to the light source, wherein the switch is configured to activate and deactivate the light source.

17. The method ofclaim 11, further comprising providing a power source disposed within the housing component, the power source being configured to supply power to the light source.

18. The method ofclaim 17, wherein the power source is a rechargeable power source.

19. The method ofclaim 11, wherein the light source is a light emitting diode.

20. The method ofclaim 11, wherein the light source is a photoluminescent material.

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