US20180144172A1 - Optical fingerprint sensor module and package thereof - Google Patents
Optical fingerprint sensor module and package thereofDownload PDFInfo
- Publication number
- US20180144172A1 US20180144172A1US15/843,107US201715843107AUS2018144172A1US 20180144172 A1US20180144172 A1US 20180144172A1US 201715843107 AUS201715843107 AUS 201715843107AUS 2018144172 A1US2018144172 A1US 2018144172A1
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- carrier
- image sensor
- emitting diode
- light emitting
- optical fingerprint
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- H01L23/00—Details of semiconductor or other solid state devices
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- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1318—Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
- H01L2924/1816—Exposing the passive side of the semiconductor or solid-state body
- H01L2924/18165—Exposing the passive side of the semiconductor or solid-state body of a wire bonded chip
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10151—Sensor
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/811—Interconnections
Definitions
- the present inventionrelates to an optical package structure, and more particularly to an optical fingerprint sensor module and its package thereof.
- Fingerprint recognitionhas been widely utilized in a variety of technical fields, especially in those fields when security verifications are needy.
- portable communication devicesi.e. mobile phone, a tablet PC
- financial transactionshome-based security and so on
- home-based securityall demand sophisticated fingerprint recognition apparatuses, and therefore making the fingerprint recognition apparatus an unique and standard manner of a person's distinctive identity verification.
- an optical type fingerprint recognitionis characterized by its optical imaging and optical sensing technique, in which at least one light source and an image sensor are certainly necessary.
- portable electronic devices nowadays, for example: smart phonesare usually equipped with at least one proximity optical sensing module in order to achieve the objectives of fingerprint recognition.
- the portable electronic devicereceives an input, for example a user's fingerprint, then the portable electronic device senses the fingerprint and determines if it is valid.
- a light emitting diodeLED
- the light sourceprovides enough lighting for helping the image sensor to acquire an image of the user's fingerprint.
- a comparison module in rear endis able to perform analysis and validation accordingly to determine if the fingerprint is certificated.
- the at least one light sourceare usually designed to surround the image sensor on a horizontal plane. And because of that, the side light of the at least one light source will produce various interferences with the image sensor, thereby affecting the accuracy and precision of the sensing and recognition results.
- the optical fingerprint apparatusis usually composed of an optical QFN (Quad-Flat-No-Lead) package therein
- thickness of the optical packageis also very critical.
- Various prior artshave made a lot of efforts on reducing the thickness for not only enhancing the accuracy and precision of the sensing result but also lowering its fabricating cost. Nevertheless, it is believed that so far those achievements are still limited and cannot be utilized extensively. Therefore, on account of above, to overcome the abovementioned problem, it should be obvious that there is indeed an urgent need for the professionals in the field for a new optical fingerprint sensor package to be developed that can effectively solve those above mentioned problem occurring in the prior design.
- one major objective in accordance with the present inventionis provided for a novel optical fingerprint sensor module and its package thereof.
- the optical fingerprint sensor module and its package of the present inventioncan be utilized so as to increase the accuracy and precision of the sensing and recognition results.
- the present inventionprovides an optical fingerprint sensor module, which comprises a carrier, at least one light emitting diode, and at least one image sensor.
- the at least one light emitted diodeis disposed on the carrier for providing at least one light source.
- the at least one image sensoris disposed on the carrier and being electrically connected with the carrier.
- a top emitting surface of the at least one light emitted diodeis higher than a top of the at least one image sensor.
- the carriercan be a substrate. In other embodiment of the present invention, the carrier alternatively can be a lead frame as well.
- the carriermay further comprise at least one protruding part, and the at least one light emitting diode is disposed on the at least one protruding part. Therefore, the top emitting surface of the light emitted diode is higher than the top of the at least one image sensor, and interferences from the side light of the light emitting diode with the image sensor will be successfully depressed.
- the at least one light emitting diodemay further be disposed on at least one lead frame, and the at least one lead frame is disposed on the carrier.
- the top emitting surface of the light emitted diodecan also be higher than the top of the at least one image sensor, and interferences from the side light of the light emitting diode with the image sensor will be successfully depressed as well.
- the at least one image sensoris connected with the carrier through a plurality of pads, and the at least one light emitting diode is connected with the carrier or the lead frame through at least one electrical bump.
- the light emitting diodeis flip-chip mounted upon the carrier or the lead frame through the at least one electrical bump.
- an optical fingerprint sensor package thereofcomprises a carrier, at least one light emitting diode, at least one image sensor, and a molding compound.
- the at least one light emitted diodeis disposed on the carrier for providing at least one light source.
- the at least one image sensoris disposed on the carrier and being electrically connected with the carrier.
- a top emitting surface of the at least one light emitted diodeis higher than a top of the at least one image sensor by disposing the at least one light emitting diode on either a protruding part of the carrier or on an additional lead frame.
- the molding compoundcovers the carrier, the at least one light emitting diode and the at least one image sensor, and the molding compound comprises a caved portion which is corresponding to the image sensor on a vertical plane.
- the molding compoundis made of light transparent material.
- the carrieris a substrate or alternatively is a lead frame.
- FIG. 1shows a cross sectional view of an optical fingerprint sensor module in accordance with a first embodiment of the present invention.
- FIG. 2shows a cross sectional view of an optical fingerprint sensor package in accordance with a second embodiment of the present invention.
- FIG. 3shows a detailed cross sectional view of an optical fingerprint sensor package according to FIG. 2 .
- FIG. 4shows a cross sectional view of an optical fingerprint sensor module in accordance with a third embodiment of the present invention.
- FIG. 5shows a cross sectional view of an optical fingerprint sensor package in accordance with a fourth embodiment of the present invention.
- FIG. 6shows a detailed cross sectional view of an optical fingerprint sensor package according to FIG. 5 .
- the present inventiondiscloses an optical fingerprint sensor module which can be utilized for eliminating interferences from the side light of light sources and meanwhile increasing both the light sensing and recognition efficiency.
- FIG. 1shows a cross sectional view of an optical fingerprint sensor module in accordance with a first embodiment of the present invention.
- the optical fingerprint sensor module 1 of the present inventioncomprises at least: a carrier 10 , at least one light emitting diode 20 , and at least one image sensor 30 .
- the light emitted diode 20is disposed on the carrier 10 for providing at least one light source.
- the image sensor 30is disposed on the carrier 10 and being electrically connected with the carrier 10 .
- the carrier 10can be a substrate or a lead frame.
- the image sensor 30is connected with the carrier 10 through pad 33 , and the light emitting diode 20 is connected with the carrier 10 through at least one electrical bump 24 .
- the light emitting diode 20is flip-chip mounted upon the carrier 10 through the at least one electrical bump 24 .
- how the image sensor 30 of the present invention is mounted upon the carrier 10is not limited, and should comprise both designs of Ball Grid Array (BGA) and Land Grid Array (LGA).
- BGABall Grid Array
- LGALand Grid Array
- the light emitting diode 20gives enough light source for lighting and helping the image sensor 30 to capture and sense an image of the fingerprint. Since the side light of the light emitting diode 20 will generate unexpected interferences with the image sensor 30 , thus affecting its sensing accuracy, one major objective of the present invention is to eliminate these interferences from the side light of the light emitting diode 20 .
- What the present invention proposesis to “raise” the position of the light emitting diode 20 , for example, using a protruding part 12 of the carrier 10 or alternatively comprising an additional lead frame (which will be discussed in the following embodiment of the present invention later).
- the light emitting diode 20is disposed on the protruding part 12 of the carrier 10 , and the top emitting surface of the light emitted diode 20 will be controlled to be higher than a top of the image sensor 30 . Therefore, the side light of the light emitting diode 20 will not be able to interact with the image sensor 30 . By employing this manner of design, it is apparent that interferences from the side light of the light emitting diode 20 with the image sensor 30 can be effectively avoided.
- the optical fingerprint sensor package 2 of the present inventioncomprises at least: a carrier 10 , at least one light emitting diode 20 , at least one image sensor 30 , and furthermore a molding compound 40 .
- the light emitted diode 20is disposed on the carrier 10 for providing at least one light source.
- the image sensor 30is disposed on the carrier 10 and being electrically connected with the carrier 10 .
- the image sensor 30is connected with the carrier 10 through pad 33 , and the light emitting diode 20 is connected with the carrier 10 through at least one electrical bump 24 .
- the light emitting diode 20is flip-chip mounted upon the carrier 10 through the at least one electrical bump 24 .
- how the image sensor 30 of the present invention is mounted upon the carrier 10is not limited, and should comprise both designs of Ball Grid Array (BGA) and Land Grid Array (LGA).
- the light emitting diode 20gives enough light source for lighting and helping the image sensor 30 to capture and sense an image of the fingerprint. Since the light emitting diode 20 is disposed on the protruding part 12 of the carrier 10 and the top emitting surface of the light emitted diode 20 is higher than a top of the image sensor 30 , interferences from the side light of the light emitting diode 20 with the image sensor 30 are prevented.
- the molding compound 40is configured to cover the carrier 10 , the light emitting diode 20 and the image sensor 30 , and the molding compound 40 comprises a caved portion 44 which is corresponding to the image sensor 30 on a vertical plane.
- a first structure 100is composed of the carrier 10 , the image sensor 30 and the molding compound 40
- a second structure 200is composed of the carrier 10 , the light emitting diode 20 and the molding compound 40 . Since the caved portion 44 of the molding compound 40 is formed upon the image sensor 30 on a vertical plane, a thickness D 1 of the first structure 100 is controlled to be thinner than a thickness D 2 of the second structure 200 . Therefore, the optical fingerprint sensor package 2 of the present invention achieves the thinnest optical fingerprint package and being much more competitive for not only lowering its manufacturing and fabrication cost, but also enhancing its sensing accuracy and precision.
- the molding compound 40is made of light transparent material.
- the optical fingerprint sensor package 2 of the present inventionemploys the QFN (Quad-Flat-No-Lead) process design, nevertheless, the present invention is certainly not limited thereto.
- the optical fingerprint sensor module 1 ′ of the present inventioncomprises at least: a carrier 10 ′, at least one light emitting diode 20 ′, and at least one image sensor 30 ′.
- the light emitted diode 20 ′is disposed on the carrier 10 ′ for providing at least one light source.
- the image sensor 30 ′is disposed on the carrier 10 ′ and being electrically connected with the carrier 10 ′.
- the carrier 10 ′can be a substrate or a lead frame, and the image sensor 30 ′ is connected with the carrier 10 ′ through pad 33 ′.
- how the image sensor 30 ′ of the present invention is mounted upon the carrier 10 ′is not limited, and should comprise both designs of Ball Grid Array (BGA) and Land Grid Array (LGA).
- BGABall Grid Array
- LGALand Grid Array
- the light emitting diode 20 ′gives enough light source for lighting and helping the image sensor 30 ′ to capture and sense an image of the fingerprint. Since the side light of the light emitting diode 20 ′ may generate unexpected interferences with the image sensor 30 ′, thus affecting its sensing accuracy, one major objective of the present invention is to eliminate these interferences from the side light of the light emitting diode 20 ′. In order to “raise” the position of the light emitting diode 20 ′, what we propose in this embodiment is to comprise at least one additional lead frame 60 .
- the lead frame 60is disposed on the carrier 10 ′, and the light emitting diode 20 ′ is disposed on the lead frame 60 through at least one electrical bump 24 ′.
- the light emitting diode 20 ′is flip-chip mounted upon the carrier 10 ′ through the at least one electrical bump 24 ′ and the lead frame 60 .
- the top emitting surface of the light emitted diode 20 ′will also be controlled to be higher than a top of the image sensor 30 ′. Therefore, the side light of the light emitting diode 20 ′ will not be able to interfere with the image sensor 30 ′. And by employing this manner of design, it is apparent that interferences from the side light of the light emitting diode 20 ′ with the image sensor 30 ′ is effectively suppressed.
- FIG. 5shows a cross sectional view of an optical fingerprint sensor package in accordance with another embodiment of the present invention.
- the optical fingerprint sensor package 2 ′ of the present inventioncomprises at least: a carrier 10 ′, at least one light emitting diode 20 ′, at least one image sensor 30 ′, and furthermore a molding compound 40 ′.
- the light emitted diode 20 ′is disposed on the carrier 10 ′ for providing at least one light source.
- the image sensor 30 ′is disposed on the carrier 10 ′ and being electrically connected with the carrier 10 ′.
- the image sensor 30 ′is connected with the carrier 10 ′ through pad 33 ′, and the light emitting diode 20 ′ is connected with the carrier 10 ′ through at least one electrical bump 24 ′ and at least one lead frame 60 .
- the light emitting diode 20 ′is flip-chip mounted upon the carrier 10 ′ through the at least one electrical bump 24 ′ and the lead frame 60 .
- how the image sensor 30 ′ of the present invention is mounted upon the carrier 10 ′is not limited, and should comprise both designs of Ball Grid Array (BGA) and Land Grid Array (LGA).
- the light emitting diode 20 ′gives enough light source for lighting and helping the image sensor 30 ′ to capture and sense an image of the fingerprint. Since the light emitting diode 20 ′ is disposed on the carrier 10 ′ through an additional dead frame 60 , the top emitting surface of the light emitted diode 20 ′ is higher than a top of the image sensor 30 ′, and therefore interferences from the side light of the light emitting diode 20 ′ with the image sensor 30 ′ are prevented.
- the molding compound 40 ′is configured to cover the carrier 10 ′, the light emitting diode 20 ,′ the lead frame 60 and the image sensor 30 ′, and the molding compound 40 ′ comprises a caved portion 44 ′ which is corresponding to the image sensor 30 ′ on a vertical plane.
- a first structure 100 ′is composed of the carrier 10 ′, the image sensor 30 ′ and the molding compound 40 ′
- a second structure 200 ′is composed of the carrier 10 ′, the light emitting diode 20 ′, the lead frame 60 and the molding compound 40 ′.
- the optical fingerprint sensor package 2 ′ of the present inventionachieves the thinnest optical fingerprint package and being much more competitive for not only lowering its manufacturing and fabrication cost, but also enhancing its sensing accuracy and precision.
- the molding compound 40 ′is made of light transparent material.
- the optical fingerprint sensor package 2 ′ of the present inventionemploys the QFN (Quad-Flat-No-Lead) process design, nevertheless, the present invention should be certainly not limited thereto as well.
- the present inventionindeed provides a novel and inventive optical fingerprint sensor module and package thereof which have never been seen or proposed ever before.
- the proposed inventionemploys an additional lead frame or a protruding part of the carrier so as to raise the position of the light emitting diode.
- the top emitting surface of the light emitting diodecan be successfully maintained to be higher than the top of the image sensor. And interferences from the side light of the light source with the image sensor are accordingly prevented, thereby enhancing sensing accuracy and precision of the optical fingerprint sensor module.
- the present inventionproposed an optical fingerprint sensor package, comprising a caved portion of the molding compound which is corresponding to the image sensor on a vertical plane.
- the proposed optical fingerprint sensor packageis advantageous of not only thin thickness and low fabrication cost, but also less complexity and area consuming.
- the present inventionis instinct, effective and highly competitive for incoming technology, industries and researches developed in the future and shall be patentable as well.
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Abstract
Description
- This patent application is based on U.S. Provisional Patent Application Ser. No. 62/425,715, filed 23 Nov. 2016.
- The present invention relates to an optical package structure, and more particularly to an optical fingerprint sensor module and its package thereof.
- Fingerprint recognition has been widely utilized in a variety of technical fields, especially in those fields when security verifications are needy. For example, portable communication devices (i.e. mobile phone, a tablet PC), financial transactions, home-based security and so on, all demand sophisticated fingerprint recognition apparatuses, and therefore making the fingerprint recognition apparatus an unique and standard manner of a person's distinctive identity verification.
- When speaking of mechanisms of fingerprint recognition technology, as far as we know, there are mainly two types of fingerprint recognition apparatuses used in recent technology, such as a semiconductor type and an optical type according to their different mechanism. However, since the structure of the semiconductor type is usually much more complicated and requires high complexity when being manufactured, the optical type is advantageous and profitable instead. In general, an optical type fingerprint recognition is characterized by its optical imaging and optical sensing technique, in which at least one light source and an image sensor are certainly necessary. Generally speaking, portable electronic devices nowadays, for example: smart phones, are usually equipped with at least one proximity optical sensing module in order to achieve the objectives of fingerprint recognition. In other words, when the above-mentioned electronic device (i.e. smart phones) receives an input, for example a user's fingerprint, then the portable electronic device senses the fingerprint and determines if it is valid. To be more specific, how the portable electronic device works is related to a light emitting diode (LED) which is utilized to emit a light source. Then, the light source provides enough lighting for helping the image sensor to acquire an image of the user's fingerprint. As such, a comparison module in rear end is able to perform analysis and validation accordingly to determine if the fingerprint is certificated. However, it should be noticed that problems arise when the at least one light source are usually designed to surround the image sensor on a horizontal plane. And because of that, the side light of the at least one light source will produce various interferences with the image sensor, thereby affecting the accuracy and precision of the sensing and recognition results.
- Besides, since the optical fingerprint apparatus is usually composed of an optical QFN (Quad-Flat-No-Lead) package therein, thickness of the optical package is also very critical. Various prior arts have made a lot of efforts on reducing the thickness for not only enhancing the accuracy and precision of the sensing result but also lowering its fabricating cost. Nevertheless, it is believed that so far those achievements are still limited and cannot be utilized extensively. Therefore, on account of above, to overcome the abovementioned problem, it should be obvious that there is indeed an urgent need for the professionals in the field for a new optical fingerprint sensor package to be developed that can effectively solve those above mentioned problem occurring in the prior design.
- In order to overcome the above-mentioned disadvantages, one major objective in accordance with the present invention is provided for a novel optical fingerprint sensor module and its package thereof. By employing the optical fingerprint sensor module and its package of the present invention, it can be utilized so as to increase the accuracy and precision of the sensing and recognition results.
- For achieving the above mentioned objectives, the present invention provides an optical fingerprint sensor module, which comprises a carrier, at least one light emitting diode, and at least one image sensor. The at least one light emitted diode is disposed on the carrier for providing at least one light source. The at least one image sensor is disposed on the carrier and being electrically connected with the carrier. Moreover, a top emitting surface of the at least one light emitted diode is higher than a top of the at least one image sensor. As such, when a user's fingerprint is generated for recognition, the at least one light source is provided for lighting and helping the at least one image sensor to capture and sense an image of said fingerprint, and interferences from the side light of the at least one light emitting diode with the image sensor can be effectively avoided.
- In one embodiment of the present invention, the carrier can be a substrate. In other embodiment of the present invention, the carrier alternatively can be a lead frame as well.
- Furthermore, according to one embodiment of the present invention, the carrier may further comprise at least one protruding part, and the at least one light emitting diode is disposed on the at least one protruding part. Therefore, the top emitting surface of the light emitted diode is higher than the top of the at least one image sensor, and interferences from the side light of the light emitting diode with the image sensor will be successfully depressed.
- According to another embodiment of the present invention, the at least one light emitting diode may further be disposed on at least one lead frame, and the at least one lead frame is disposed on the carrier. By employing this design, the top emitting surface of the light emitted diode can also be higher than the top of the at least one image sensor, and interferences from the side light of the light emitting diode with the image sensor will be successfully depressed as well.
- In one embodiment, the at least one image sensor is connected with the carrier through a plurality of pads, and the at least one light emitting diode is connected with the carrier or the lead frame through at least one electrical bump. The light emitting diode is flip-chip mounted upon the carrier or the lead frame through the at least one electrical bump.
- In another aspect of the present invention, an optical fingerprint sensor package thereof is provided. The optical fingerprint sensor package comprises a carrier, at least one light emitting diode, at least one image sensor, and a molding compound. The at least one light emitted diode is disposed on the carrier for providing at least one light source. The at least one image sensor is disposed on the carrier and being electrically connected with the carrier. A top emitting surface of the at least one light emitted diode is higher than a top of the at least one image sensor by disposing the at least one light emitting diode on either a protruding part of the carrier or on an additional lead frame. The molding compound covers the carrier, the at least one light emitting diode and the at least one image sensor, and the molding compound comprises a caved portion which is corresponding to the image sensor on a vertical plane. By such design rules, a thickness of a first structure composed of the carrier, the at least one image sensor and the molding compound is thinner than that of a second structure composed of the carrier, the at least one light emitting diode and the molding compound. As a result, a thickness of the optical fingerprint sensor package thereof the present invention is tremendously decreased, and the fabricating cost thereof can be reduced accordingly, meanwhile, enhancing the accuracy and precision of the sensing result of the present invention.
- In one embodiment of the present invention, the molding compound is made of light transparent material. In one embodiment of the present invention, the carrier is a substrate or alternatively is a lead frame.
- These and other objectives of the present invention will become obvious to those of ordinary skill in the art after reading the following detailed description of preferred embodiments.
- It is to be understood that both the foregoing general description and the following detailed description are exemplary, and are intended to provide further explanation of the invention as claimed.
- The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention. In the drawings:
FIG. 1 shows a cross sectional view of an optical fingerprint sensor module in accordance with a first embodiment of the present invention.FIG. 2 shows a cross sectional view of an optical fingerprint sensor package in accordance with a second embodiment of the present invention.FIG. 3 shows a detailed cross sectional view of an optical fingerprint sensor package according toFIG. 2 .FIG. 4 shows a cross sectional view of an optical fingerprint sensor module in accordance with a third embodiment of the present invention.FIG. 5 shows a cross sectional view of an optical fingerprint sensor package in accordance with a fourth embodiment of the present invention.FIG. 6 shows a detailed cross sectional view of an optical fingerprint sensor package according toFIG. 5 .- Reference will now be made in detail to the preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers are used in the drawings and the description to refer to the same or like parts.
- The embodiments described below are illustrated to demonstrate the technical contents and characteristics of the present invention and to enable the persons skilled in the art to understand, make, and use the present invention. However, it shall be noticed that, it is not intended to limit the scope of the present invention. Therefore, any equivalent modification or variation according to the spirit of the present invention is to be also included within the scope of the present invention.
- The present invention discloses an optical fingerprint sensor module which can be utilized for eliminating interferences from the side light of light sources and meanwhile increasing both the light sensing and recognition efficiency. Please refer to
FIG. 1 first, which shows a cross sectional view of an optical fingerprint sensor module in accordance with a first embodiment of the present invention. As shown inFIG. 1 , the opticalfingerprint sensor module 1 of the present invention comprises at least: acarrier 10, at least onelight emitting diode 20, and at least oneimage sensor 30. The light emitteddiode 20 is disposed on thecarrier 10 for providing at least one light source. Theimage sensor 30 is disposed on thecarrier 10 and being electrically connected with thecarrier 10. In one embodiment of the present invention, thecarrier 10 can be a substrate or a lead frame. Theimage sensor 30 is connected with thecarrier 10 throughpad 33, and thelight emitting diode 20 is connected with thecarrier 10 through at least oneelectrical bump 24. In other words, thelight emitting diode 20 is flip-chip mounted upon thecarrier 10 through the at least oneelectrical bump 24. - According to the embodiment of the present invention, how the
image sensor 30 of the present invention is mounted upon thecarrier 10 is not limited, and should comprise both designs of Ball Grid Array (BGA) and Land Grid Array (LGA). Practically, when a user's fingerprint is generated for recognition, for example, in portable communication devices (i.e. mobile phone, a tablet PC), financial transactions, or home-based security, thelight emitting diode 20 gives enough light source for lighting and helping theimage sensor 30 to capture and sense an image of the fingerprint. Since the side light of thelight emitting diode 20 will generate unexpected interferences with theimage sensor 30, thus affecting its sensing accuracy, one major objective of the present invention is to eliminate these interferences from the side light of thelight emitting diode 20. What the present invention proposes is to “raise” the position of thelight emitting diode 20, for example, using a protrudingpart 12 of thecarrier 10 or alternatively comprising an additional lead frame (which will be discussed in the following embodiment of the present invention later). - Thus, as shown in
FIG. 1 , thelight emitting diode 20 is disposed on the protrudingpart 12 of thecarrier 10, and the top emitting surface of the light emitteddiode 20 will be controlled to be higher than a top of theimage sensor 30. Therefore, the side light of thelight emitting diode 20 will not be able to interact with theimage sensor 30. By employing this manner of design, it is apparent that interferences from the side light of thelight emitting diode 20 with theimage sensor 30 can be effectively avoided. - Please refer to
FIG. 2 , which shows a cross sectional view of an optical fingerprint sensor package in accordance with a second embodiment of the present invention. As shown inFIG. 2 , the opticalfingerprint sensor package 2 of the present invention comprises at least: acarrier 10, at least onelight emitting diode 20, at least oneimage sensor 30, and furthermore amolding compound 40. The light emitteddiode 20 is disposed on thecarrier 10 for providing at least one light source. Theimage sensor 30 is disposed on thecarrier 10 and being electrically connected with thecarrier 10. Theimage sensor 30 is connected with thecarrier 10 throughpad 33, and thelight emitting diode 20 is connected with thecarrier 10 through at least oneelectrical bump 24. In general, thelight emitting diode 20 is flip-chip mounted upon thecarrier 10 through the at least oneelectrical bump 24. According to the embodiment of the present invention, how theimage sensor 30 of the present invention is mounted upon thecarrier 10 is not limited, and should comprise both designs of Ball Grid Array (BGA) and Land Grid Array (LGA). - Practically, when a user's fingerprint is generated for recognition, for example, in portable communication devices (i.e. mobile phone, a tablet PC), financial transactions, or home-based security, the
light emitting diode 20 gives enough light source for lighting and helping theimage sensor 30 to capture and sense an image of the fingerprint. Since thelight emitting diode 20 is disposed on the protrudingpart 12 of thecarrier 10 and the top emitting surface of the light emitteddiode 20 is higher than a top of theimage sensor 30, interferences from the side light of thelight emitting diode 20 with theimage sensor 30 are prevented. Moreover, themolding compound 40 is configured to cover thecarrier 10, thelight emitting diode 20 and theimage sensor 30, and themolding compound 40 comprises a cavedportion 44 which is corresponding to theimage sensor 30 on a vertical plane. Please refer toFIG. 3 , it is shown that afirst structure 100 is composed of thecarrier 10, theimage sensor 30 and themolding compound 40, and asecond structure 200 is composed of thecarrier 10, thelight emitting diode 20 and themolding compound 40. Since the cavedportion 44 of themolding compound 40 is formed upon theimage sensor 30 on a vertical plane, a thickness D1 of thefirst structure 100 is controlled to be thinner than a thickness D2 of thesecond structure 200. Therefore, the opticalfingerprint sensor package 2 of the present invention achieves the thinnest optical fingerprint package and being much more competitive for not only lowering its manufacturing and fabrication cost, but also enhancing its sensing accuracy and precision. - In one embodiment of the present invention, the
molding compound 40 is made of light transparent material. And, the opticalfingerprint sensor package 2 of the present invention employs the QFN (Quad-Flat-No-Lead) process design, nevertheless, the present invention is certainly not limited thereto. - Next, please refer to
FIG. 4 , which shows a cross sectional view of an optical fingerprint sensor module in accordance with another embodiment of the present invention. As shown inFIG. 4 , the opticalfingerprint sensor module 1′ of the present invention comprises at least: acarrier 10′, at least onelight emitting diode 20′, and at least oneimage sensor 30′. The light emitteddiode 20′ is disposed on thecarrier 10′ for providing at least one light source. Theimage sensor 30′ is disposed on thecarrier 10′ and being electrically connected with thecarrier 10′. In such embodiment of the present invention, thecarrier 10′ can be a substrate or a lead frame, and theimage sensor 30′ is connected with thecarrier 10′ throughpad 33′. According to the embodiment of the present invention, similarly, how theimage sensor 30′ of the present invention is mounted upon thecarrier 10′ is not limited, and should comprise both designs of Ball Grid Array (BGA) and Land Grid Array (LGA). - As such, when a user's fingerprint is generated for recognition, for example, in portable communication devices (i.e. mobile phone, a tablet PC), financial transactions, or home-based security, the
light emitting diode 20′ gives enough light source for lighting and helping theimage sensor 30′ to capture and sense an image of the fingerprint. Since the side light of thelight emitting diode 20′ may generate unexpected interferences with theimage sensor 30′, thus affecting its sensing accuracy, one major objective of the present invention is to eliminate these interferences from the side light of thelight emitting diode 20′. In order to “raise” the position of thelight emitting diode 20′, what we propose in this embodiment is to comprise at least oneadditional lead frame 60. - As shown in
FIG. 4 , it is clear that thelead frame 60 is disposed on thecarrier 10′, and thelight emitting diode 20′ is disposed on thelead frame 60 through at least oneelectrical bump 24′. According to the embodiment of the present invention, thelight emitting diode 20′ is flip-chip mounted upon thecarrier 10′ through the at least oneelectrical bump 24′ and thelead frame 60. By such arrangements, the top emitting surface of the light emitteddiode 20′ will also be controlled to be higher than a top of theimage sensor 30′. Therefore, the side light of thelight emitting diode 20′ will not be able to interfere with theimage sensor 30′. And by employing this manner of design, it is apparent that interferences from the side light of thelight emitting diode 20′ with theimage sensor 30′ is effectively suppressed. FIG. 5 shows a cross sectional view of an optical fingerprint sensor package in accordance with another embodiment of the present invention. As shown inFIG. 5 , the opticalfingerprint sensor package 2′ of the present invention comprises at least: acarrier 10′, at least onelight emitting diode 20′, at least oneimage sensor 30′, and furthermore amolding compound 40′. The light emitteddiode 20′ is disposed on thecarrier 10′ for providing at least one light source. Theimage sensor 30′ is disposed on thecarrier 10′ and being electrically connected with thecarrier 10′. Theimage sensor 30′ is connected with thecarrier 10′ throughpad 33′, and thelight emitting diode 20′ is connected with thecarrier 10′ through at least oneelectrical bump 24′ and at least onelead frame 60. In one embodiment, thelight emitting diode 20′ is flip-chip mounted upon thecarrier 10′ through the at least oneelectrical bump 24′ and thelead frame 60. According to the embodiment of the present invention, how theimage sensor 30′ of the present invention is mounted upon thecarrier 10′ is not limited, and should comprise both designs of Ball Grid Array (BGA) and Land Grid Array (LGA).- Practically, when a user's fingerprint is generated for recognition, for example, in portable communication devices (i.e. mobile phone, a tablet PC), financial transactions, or home-based security, the
light emitting diode 20′ gives enough light source for lighting and helping theimage sensor 30′ to capture and sense an image of the fingerprint. Since thelight emitting diode 20′ is disposed on thecarrier 10′ through an additionaldead frame 60, the top emitting surface of the light emitteddiode 20′ is higher than a top of theimage sensor 30′, and therefore interferences from the side light of thelight emitting diode 20′ with theimage sensor 30′ are prevented. - Moreover, in this embodiment, the
molding compound 40′ is configured to cover thecarrier 10′, thelight emitting diode 20,′ thelead frame 60 and theimage sensor 30′, and themolding compound 40′ comprises a cavedportion 44′ which is corresponding to theimage sensor 30′ on a vertical plane. Please refer toFIG. 6 , it is shown that afirst structure 100′ is composed of thecarrier 10′, theimage sensor 30′ and themolding compound 40′, and asecond structure 200′ is composed of thecarrier 10′, thelight emitting diode 20′, thelead frame 60 and themolding compound 40′. Since the cavedportion 44′ of themolding compound 40′ is formed upon theimage sensor 30′ on a vertical plane, it can be seen that a thickness D3 of thefirst structure 100′ is controlled to be thinner than a thickness D4 of thesecond structure 200′. Therefore, the opticalfingerprint sensor package 2′ of the present invention achieves the thinnest optical fingerprint package and being much more competitive for not only lowering its manufacturing and fabrication cost, but also enhancing its sensing accuracy and precision. - According to the embodiment of the present invention, the
molding compound 40′ is made of light transparent material. And, the opticalfingerprint sensor package 2′ of the present invention employs the QFN (Quad-Flat-No-Lead) process design, nevertheless, the present invention should be certainly not limited thereto as well. - Therefore, to sum up, the present invention indeed provides a novel and inventive optical fingerprint sensor module and package thereof which have never been seen or proposed ever before. The proposed invention employs an additional lead frame or a protruding part of the carrier so as to raise the position of the light emitting diode. As such, the top emitting surface of the light emitting diode can be successfully maintained to be higher than the top of the image sensor. And interferences from the side light of the light source with the image sensor are accordingly prevented, thereby enhancing sensing accuracy and precision of the optical fingerprint sensor module.
- Furthermore, as compared to the prior design, the present invention proposed an optical fingerprint sensor package, comprising a caved portion of the molding compound which is corresponding to the image sensor on a vertical plane. As a result, the proposed optical fingerprint sensor package is advantageous of not only thin thickness and low fabrication cost, but also less complexity and area consuming. Thus, it is believed that the present invention is instinct, effective and highly competitive for incoming technology, industries and researches developed in the future and shall be patentable as well.
- It will be apparent to those skilled in the art that various modifications and variations can be made to the present invention without departing from the scope or spirit of the invention. In view of the foregoing, it is intended that the present invention cover modifications and variations of this invention provided they fall within the scope of the invention and its equivalent.
Claims (21)
1. An optical fingerprint sensor module, comprising:
a carrier;
at least one light emitted diode, which is disposed on said carrier for providing at least one light source; and
at least one image sensor disposed on said carrier and being electrically connected with said carrier, wherein when a user's fingerprint is generated for recognition, said at least one light source is provided for lighting and helping said image sensor to capture and sense an image of said fingerprint, and a top emitting surface of said light emitted diode is higher than a top of said at least one image sensor.
2. The optical fingerprint sensor module ofclaim 1 , further comprising at least one lead frame, wherein said at least one lead frame is disposed on said carrier, and said at least one light emitting diode is disposed on said at least one lead frame, such that said top emitting surface of said light emitted diode is higher than said top of said at least one image sensor.
3. The optical fingerprint sensor module ofclaim 2 , further comprising a plurality of pads, which are in connection with said carrier and said at least one image sensor.
4. The optical fingerprint sensor module ofclaim 3 , further comprising at least one electrical bump, which is in connection with said lead frame and said at least one light emitting diode.
5. The optical fingerprint sensor module ofclaim 4 , wherein said at least one light emitting diode is flip-chip mounted upon said carrier through said at least one electrical bump and said at least one lead frame.
6. The optical fingerprint sensor module ofclaim 1 , wherein said carrier further comprises at least one protruding part, and said at least one light emitting diode is disposed on said at least one protruding part such that said top emitting surface of said light emitted diode is higher than said top of said at least one image sensor.
7. The optical fingerprint sensor module ofclaim 6 , further comprising a plurality of pads, which are in connection with said carrier and said at least one image sensor.
8. The optical fingerprint sensor module ofclaim 7 , further comprising at least one electrical bump, which is in connection with said protruding part of said carrier and said at least one light emitting diode.
9. The optical fingerprint sensor module ofclaim 8 , wherein said at least one light emitting diode is flip-chip mounted upon said carrier through said at least one electrical bump and said protruding part.
10. The optical fingerprint sensor module ofclaim 1 , wherein said carrier is a substrate or a lead frame.
11. The optical fingerprint sensor module ofclaim 1 , further comprising a molding compound, covering said carrier, said light emitting diode and said image sensor, wherein said molding compound comprises a caved portion which is corresponding to said image sensor such that a thickness of a first structure composed of said carrier, said image sensor and said molding compound is thinner than that of a second structure composed of said carrier, said light emitting diode and said molding compound.
12. The optical fingerprint sensor module ofclaim 11 , wherein said molding compound is made of light transparent material.
13. An optical fingerprint sensor package, comprising:
a carrier;
at least one light emitted diode, which is disposed on said carrier for providing at least one light source;
at least one image sensor disposed on said carrier and being electrically connected with said carrier, wherein when a user's fingerprint is generated for recognition, said at least one light source is provided for lighting and helping said image sensor to capture and sense an image of said fingerprint, and a top emitting surface of said light emitted diode is higher than a top of said at least one image sensor; and
a molding compound, covering said carrier, said at least one light emitting diode and said at least one image sensor, wherein said molding compound comprises a caved portion which is corresponding to said at least one image sensor such that a thickness of a first structure composed of said carrier, said at least one mage sensor and said molding compound is thinner than that of a second structure composed of said carrier, said at least one light emitting diode and said molding compound.
14. The optical fingerprint sensor package ofclaim 13 , wherein said molding compound is made of light transparent material.
15. The optical fingerprint sensor package ofclaim 13 , further comprising at least one lead frame, wherein said at least one lead frame is disposed on said carrier, and said at least one light emitting diode is disposed on said at least one lead frame, such that said top emitting surface of said light emitted diode is higher than said top of said at least one image sensor.
16. The optical fingerprint sensor package ofclaim 15 , further comprising at least one electrical bump, which is in connection with said lead frame and said at least one light emitting diode.
17. The optical fingerprint sensor package ofclaim 16 , wherein said at least one light emitting diode is flip-chip mounted upon said carrier through said at least one electrical bump and said at least one lead frame.
18. The optical fingerprint sensor package ofclaim 13 , wherein said carrier further comprises at least one protruding part, and said at least one light emitting diode is disposed on said at least one protruding part such that said top emitting surface of said light emitted diode is higher than said top of said at least one image sensor.
19. The optical fingerprint sensor package ofclaim 18 , further comprising at least one electrical bump, which is in connection with said protruding part of said carrier and said at least one light emitting diode.
20. The optical fingerprint sensor package ofclaim 19 , wherein said at least one light emitting diode is flip-chip mounted upon said carrier through said at least one electrical bump and said protruding part.
21. The optical fingerprint sensor package ofclaim 13 , wherein said carrier is a substrate or a lead frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US15/843,107US20180144172A1 (en) | 2016-11-23 | 2017-12-15 | Optical fingerprint sensor module and package thereof |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201662425715P | 2016-11-23 | 2016-11-23 | |
| US15/843,107US20180144172A1 (en) | 2016-11-23 | 2017-12-15 | Optical fingerprint sensor module and package thereof |
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| Publication Number | Publication Date |
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| US20180144172A1true US20180144172A1 (en) | 2018-05-24 |
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| US15/843,107AbandonedUS20180144172A1 (en) | 2016-11-23 | 2017-12-15 | Optical fingerprint sensor module and package thereof |
| US15/846,364AbandonedUS20180144174A1 (en) | 2016-11-23 | 2017-12-19 | Optical fingerprint sensor package |
| US15/869,323Expired - Fee RelatedUS10235555B2 (en) | 2016-11-23 | 2018-01-12 | Optical fingerprint recognition sensor package |
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| US15/846,364AbandonedUS20180144174A1 (en) | 2016-11-23 | 2017-12-19 | Optical fingerprint sensor package |
| US15/869,323Expired - Fee RelatedUS10235555B2 (en) | 2016-11-23 | 2018-01-12 | Optical fingerprint recognition sensor package |
Country Status (4)
| Country | Link |
|---|---|
| US (3) | US20180144172A1 (en) |
| CN (2) | CN106971984A (en) |
| TW (2) | TWM549446U (en) |
| WO (1) | WO2018094855A1 (en) |
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- 2016-12-21CNCN201611192412.5Apatent/CN106971984A/enactivePending
- 2016-12-21CNCN201621416030.1Upatent/CN206602107U/ennot_activeExpired - Fee Related
- 2017
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- 2017-03-14WOPCT/CN2017/000232patent/WO2018094855A1/ennot_activeCeased
- 2017-12-15USUS15/843,107patent/US20180144172A1/ennot_activeAbandoned
- 2017-12-19USUS15/846,364patent/US20180144174A1/ennot_activeAbandoned
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Also Published As
| Publication number | Publication date |
|---|---|
| US20180144175A1 (en) | 2018-05-24 |
| TWM549446U (en) | 2017-09-21 |
| WO2018094855A1 (en) | 2018-05-31 |
| US20180144174A1 (en) | 2018-05-24 |
| CN206602107U (en) | 2017-10-31 |
| US10235555B2 (en) | 2019-03-19 |
| CN106971984A (en) | 2017-07-21 |
| TW201820491A (en) | 2018-06-01 |
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