US20170172445A1

Movatterモバイル変換

Info

Publication number: US20170172445A1
Application number: US14/975,913
Authority: US
Inventors: Bing Dang; Yang Liu; Steven L. Wright
Original assignee: International Business Machines Corp
Current assignee: International Business Machines Corp
Priority date: 2015-12-21
Filing date: 2015-12-21
Publication date: 2017-06-22
Also published as: US10638945B2; US20170175280A1

Abstract

An apparatus includes a substrate mechanically and electrically connected on one side of the substrate to multiple metallic probes in one or more arrays and includes the multiple metallic probes in the one or more arrays. In a method, multiple pits may be formed in an array on a first substrate. The pits have a pyramidal shape. A release layer is formed on the first substrate and covers surfaces of the pits. Probe tips are formed in the pits on the first substrate. The probe tips are formed from rigid conductive material. Multiple pillars are formed from rigid conductive material. The pillars are electrically and mechanically connected to a second substrate and to the probe tips. Release is caused of the probe tips from the first substrate, wherein the pillars and probe tips are connected to the second substrate and together form an array of rigid and conductive probes.

Description

BACKGROUND

The present invention relates to probes used for bio-sensing, and more particularly to transdermal sensing probes.

This section is intended to provide a background or context to the invention disclosed below. The description herein may include concepts that could be pursued, but are not necessarily ones that have been previously conceived, implemented or described. Therefore, unless otherwise explicitly indicated herein, what is described in this section is not prior art to the description in this application and is not admitted to be prior art by inclusion in this section. Abbreviations that may be found in the specification and/or the drawing figures are defined below, after the detailed description section.

There are a number of probes that are used for bio-sensing. For instance, ECG probes have been implemented in the following: (a) a chest harness; (b) a heart strap, (c) a noncontact vest, (d) a chair; (e) wireless bandages; and (f) a dry chest strap. EEG probes have been implemented in the following: (g) a Neurosky single channel headset; (h) a dry MEMS cap; (i) a fingered dry EEG harness; (j) a dry/noncontact EEG Headband; (k) a dry active electrode; and (1) an ENOBIO wireless dry sensor. See, e.g., Y. Chi, et al. “Dry-Contact And Noncontact Biopotential Electrodes: Methodological Review”, IEEE Reviews In Biomedical Engineering, VOL. 3, 2010.

The EEG circuit design, in particular, has been well understood for decades. Dry or non-contact electrodes are desirable for comfort. However, stable contact to skin is a challenge. Also, electrode-skin noise is not well studied.

There are a number of possible improvements in this area. For instance, miniaturization of electrodes could be improved. For EEG circuits, in particular, these tend to be quite large and bulky. Similarly, headset implementations could benefit from miniaturization of the headset. Is it possible to make to make the headset “invisible”? An improvement in electrode-skin contact is desirable, as is an improvement in signal-to-noise ratio.

SUMMARY

This section is intended to include examples and is not intended to be limiting.

In an exemplary embodiment, an apparatus comprises a substrate mechanically and electrically connected on one side of the substrate to a plurality of metallic probes in one or more arrays. The apparatus also comprises the plurality of metallic probes in the one or more arrays.

In another exemplary embodiment, a method comprises forming a plurality of pits in an array on a first substrate, the pits having a pyramidal shape, and forming a release layer on the first substrate and covering surfaces of the plurality of pits. The method also comprises forming in the pits probe tips on the first substrate, the probe tips formed from rigid conductive material; forming a plurality of pillars from rigid conductive material, and electrically and mechanically connecting the plurality of pillars to a second substrate. The method further comprises electrically and mechanically connecting the plurality of pillars to the plurality of probe tips, and causing release of the probe tips from the first substrate, wherein the pillars and probe tips are connected to the second substrate and together form an array of rigid and conductive probes.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

FIG. 1 illustrates an exemplary system for collecting, analyzing, and/or transmitting bio-sensed data using smart patches in an exemplary embodiment;

FIG. 2 is an example of a smart patch with transdermal sensing probes being used on human skin;

FIG. 3, which includesFIGS. 3A through 3F, illustrates a fabrication method for a smart patch in an exemplary embodiment;

FIG. 4, which includesFIGS. 4A through 4E, illustrates another fabrication method for the smart patch in an exemplary embodiment;

FIG. 5 illustrates an example of a breathable and/or heat spreading smart patch, in accordance with exemplary embodiments;

FIG. 6 illustrates an example of a smart patch with active circuits in the substrate, in accordance with exemplary embodiments;

FIG. 7 illustrates an example of a smart patch with elements attached to the substrate, in accordance with exemplary embodiments;

FIG. 8, which includesFIGS. 8A and 8B, illustrates another fabrication method for the smart patch in an exemplary embodiment; and

FIG. 9 is a flowchart illustrating a fabrication method for transdermal sensing probes in accordance with an exemplary embodiment.

DETAILED DESCRIPTION

The word “exemplary” is used herein to mean “serving as an example, instance, or illustration.” Any embodiment described herein as “exemplary” is not necessarily to be construed as preferred or advantageous over other embodiments. All of the embodiments described in this Detailed Description are exemplary embodiments provided to enable persons skilled in the art to make or use the invention and not to limit the scope of the invention which is defined by the claims.

As stated above, there are a number of possible improvements in this area. The instant exemplary embodiments provide some or all of these improvements. For instance, electrodes using the instant probes are further miniaturized, relative to conventional probes. In particular, headset implementations may be further miniaturized relative to conventional implementations, such that it is possible to make to make the headset almost “invisible”. Exemplary embodiments provide, relative to conventional probes, an improvement in electrode-skin contact and/or an improvement in signal-to-noise ratio.

The exemplary embodiments concern transdermal sensing probes. Such probes may have a set of relatively inflexible probes in a probe array. The probes in the array may have an anchor structure, which helps to provide a secured contact between the probes and skin, hair, fabric, or other materials.

An overview is first presented, and then additional detail regarding additional exemplary embodiments is presented.

FIG. 1 is used as part of the overview and illustrates anexemplary system101 for collecting, analyzing, and/or transmitting bio-sensed data usingsmart patches100 in an exemplary embodiment. In this example, there are three smart patches100-1,100-2, and100-3, which are placed proximate or touching a human being'shead110. The threesmart patches100 may be placed on the skin (not shown inFIG. 1), in the hair (not shown), or on fabric (not shown). For this example, thesmart patches100 are being used for EEG signals or other bio-electrical signals, and/or for stimulation.

A singlesmart patch100 is shown in block diagram form, and it is assumed that each of the smart patches100-1,100-2, and100-3 is similar, though need not be. Thesmart patch100 comprises one ormore processors150, one ormore memories155, one ormore network interfaces180, and aprobe array190, which may be a two-dimensional (2D) probe array (note that one single dimension arrays are illustrated in following figures). The one ormore memories155 comprisesignal collection module140,signal processing module145,data analysis module160,stimulation module165, andsignal data170.Signal data170 in one example is EEG signal data from theprobe array190. Thesignal collection module140 controls theprobe array190 and collects thesignal data190 at least in part. Thesignal processing module145 performs and/or controls signal processing, such as analog to digital conversion. Thedata analysis module160 performs and/or controls data analysis, such as determining starting points and ending points for waveforms, and/or abnormal electrical signals such as for seizures or convulsions. Thestimulation module165 performs and/or controls stimulation, such as acupuncture or electrical stimulation. The one ormore processors150, one ormore memories155, and one or more N/W I/Fs180 arecircuitry195.

The one or more network (N/W) interfaces (I/Fs)180 may be hardwired or wireless, and may operate over a number of different networks, such as serial networks (e.g., USB, universal serial bus), local area networks (such as Bluetooth or Wi-Fi), optical networks, or the like, as examples.

In an exemplary embodiment, thesmart patches100 wirelessly transmit, via awireless link115, information to the remote, wireless,movable device120, shown in this example as a smartphone. Thedevice120 could also be a tablet, personal computer, and the like. Thedevice120 wirelessly transmits, via awireless link125, the same or different information to the network130 (e.g., the Internet) and to theserver135.

In one exemplary embodiment, the

modules

140,145,160, and165 are implemented in part or completely as computer-readable code that, when executed by the one ormore processors150, causes the smart patch to collect, analyze, and/or transmit bio-sensed data. In another exemplary embodiment, the

modules

140,145,160, and165 are implemented in part or completely ascircuitry195 that causes the smart patch to collect, analyze, and/or transmit bio-sensed data. In other examples, there are no processor(s)150 or memory/memories155, and the

modules

140,145,160, and165 are implemented asdiscrete circuitry195, which may have their own memory or the smart patch may have itsown memory155, which could be shared by the

modules

140,145,160, and165, or both.

The

modules

140,145,160, and165, the memory/memories155, the processor(s)150, and the N/W IF(s)180 can be built internal to a substrate (shown, e.g., inFIG. 2) and/or external to the substrate and attached to the substrate (e.g., as an integrated circuit). If discrete components are used, there could be one or multiple discrete components.

There are many different ways to configure asystem101. For instance, there may be more or

fewer modules

140,145,160, and165. As an example, thesmart patch100 may be used solely for stimulation and none of the

other modules

140,145,160, anddata170 could be used (and the N/W IF(s)180 might also not be used, depending on implementation). Even for stimulation, however, the

modules

140,145,160 and thedata170 could be used, e.g., to determine the stimulation that is being applied to theprobe array190 under control of thestimulation module165. If there is no stimulation to be performed by theprobe array190, then thestimulation module165 would not be used. As a further example, thesmart patch100 may be only a signal collection tool, such that only thesignal collection module140 and thesignal processing module145 would be used to create thesignal data170, and thesignal collection module140 would control the N/W I/F180 to transmit thedata170. Theserver135 could perform some of thedata analysis160 in this example. Theserver135 could additionally or instead provide access to thesignal data170, e.g., by the human110 or a doctor. Still other examples are possible.

FIG. 2 shows asmart patch100 attached to a portion ofskin230. Theskin230 includes thestratum corneum232, the stratum lucidum234, thestratum granulosum236, thestratum spinosum238, and thestratum basale240. Thesubstrate210 of thesmart patch100 is attached to theprobe array190, illustrated by three probes220-1,220-2, and220-3. The probes220 are transdermal, meaning that the probes220 enter through and into at least part of the epidermis (e.g., illustrated at least by the stratum corneum232). In this example, the probes220 enter 50 μm into theskin230 from thesurface250 of theskin230. Each probe220 comprises apillar270 and atip275, which together form ananchor structure280. It is expected that thisdistance240 should not cause pain, but should provide a secure contact and lower impedance for human body electrical activity sensing or as a stimulation interface. Additionally, theheight252 of each probe is controlled for less intrusiveness. Theanchor structure280 also helps to provide a secure contact, as thetip275 in this example is shaped like a pyramid and thepillar270 is shaped like a cylinder, where thewidth290 of the cylinder is smaller than thewidth295 of the base (opposite the vertex) of the cone at ajunction291 between thepillar270 and thetip275. As examples, the width of pillar could be on the order of ˜50 μm and the height might be greater than 100 μm. The thickness ofregion251 could be less than 50 μm. Overall size of substrate can be variable from 1 mm to 100 mm. Theregion251 between thesurface250 of theskin230 and a “bottom”surface365 of thesubstrate210 may be completely or partially filled with a material such as an adhesive or a gel. The material may help with adhesion between thesmart patch100 and theskin230.

The probes220 are different from probes such as those formed using polymer films (e.g., PDMS), as each probe made with a polymer films is flexible, whereas each probe220 is inflexible. In particular, the probes used herein are rigid metallic or alloy probes because they are formed based on, e.g., electrolytic plating. Therefore, they are electrically conductive in comparison to probes such as those made from polymer films. If thesubstrate210 is inflexible, then the entiresmart patch100 will be inflexible. If thesubstrate210 is flexible, this will impart some amount of flexibility between the probes220, but each probe220 is still inflexible.

Theprobe array190 and thesmart patch100 may provide transferrable bio-sensing/stimulating probe arrays. That is, theprobe array190 may be used on manydifferent substrates210, including flexible and inflexible substrates. The anchor-shapedprobe tips275, creating theanchor structure280, are useful for a transdermal application. Other examples are possible, and one such example is shown inFIG. 8. In particular, thepatch100 is “self-sticking” on skin and always in contact. Furthermore, since the probes220 are inflexible, they are less susceptible to lateral displacement. Additionally, theprobe arrays190 adhere to a fabric surface and many other surfaces with ease.

Now that an introduction has been presented, more detailed examples are presented. The detailed examples start with some exemplary techniques for probe creation and transfer to a substrate.

Turning toFIG. 3, which includesFIGS. 3A through 3F, this figure illustrates a fabrication method for a smart patch in an exemplary embodiment. Additional examples of the processing that may occur forFIGS. 3A, 3B, and 3C may also be found in U.S. Publication No. 2012/0279287, by Paul Andry, Bing Dang, and Steven Wright, entitled “Transferable Probe Tips”, filed on May 5, 2011, and assigned to International Business Machines Corporation. The fabrication method starts inFIG. 3A, which illustrates a molding etching process. InFIG. 3A, thesubstrate300, which may be for instance a silicon substrate having a <100> orientation, has been etched (e.g., through anisotropic etching) to form pits310, of which pits310-1 through310-4 are shown. In U.S. Publication No. 2012/0279287, a hardmask layer is used to form the pits310, and such a technique may be used herein. This technique (and the hardmask layer) is not shown here. In fact,FIG. 3A shows thesubstrate300 after the hardmask layer has already been removed. The pits310 are of an inverse pyramidal shape in this example, but are not limited to this shape. Thesubstrate300 has asurface305. The anisotropic Si etch may use, for example, tetramethylammonium hydroxide (TMAH). Silicon anisotropic etchants have etch rates along (111) directions of the crystal lattice which are much slower than the etching that occurs in other directions.

FIG. 3B illustrates a result after aseed layer330 has been formed on thesurface305 of thesubstrate300. Theseed layer330 helps with, e.g., subsequent plating (FIG. 3C) and also release (FIG. 3F). Theseed layer330 may also be referred to as a delamination layer and be a low-adhesion or sacrificial layer.

FIG. 3C shows a result after a layer of metal has been formed on the surface of the substrate and subsequently removed, e.g., using CMP. The result formsmetal tips275, of which tips275-1 through275-4 are shown.FIG. 3D illustrates a result after a second metal layer has been formed on thesurface305 of thesubstrate300 and pillars270 (of which pillars270-1 through270-4 are shown) have been formed using lithographic and etching techniques. The metal in thepillars270 is similar to or the same as the metal in thetips275.Pillars270 are plated directly over thetips275 through a subsequent plating step. Since thepillars270 are the same metal or alloy (such as Cu), thepillars270 and thetips275 are intimately connected at thejunction291 between thepillars270 and thetips275.

Referring toFIG. 3E, this figure illustrates asubstrate210 that is about to be placed on and connected to the “top”surfaces360 of thepillars270. The “bottom”surface365 of thesubstrate210 mates with thetop surfaces360 at predetermined locations370 (such as at pads) on the substrate, e.g., where electrical and physical connections may be made between thesubstrate210 and thepillars270. As examples, a solder layer or conductive adhesive may be used to bond thesubstrate210 and thepillars280. Subsequent to the attachment of the substrate to thepillars270,FIG. 3F illustrates a release step, where thesubstrate210 andprobe array190 are pulled away (illustrated by reference380) from thesubstrate300. The probe array190 (each probe220 comprising apillar270 and atip275, and each probe220 has an anchor structure280) is therefore transferred to thesubstrate210. The U.S. Publication No. 2012/0279287 describes transferable probe tips, and the techniques described there may also be used herein. Theseed layer330 still remains on thesubstrate300 after release because of controlled low adhesion. The separation can be a mechanical peeling or pulling with vacuum chucks, as examples.

Thesubstrate210 may be flexible or inflexible. A flexible substrate can be anything active/passive suitable for wearing on a human body, such as a polymer-based flexible circuit, a thin semiconductor, a flexible electronic system, and the like.Inflexible substrates210 may be rigid multi-layer printed circuit boards, Si, ceramic, or glass based integrated circuits, and the like.

Turning toFIG. 4, which includesFIGS. 4A through 4E, this figure illustrates another fabrication method for a smart patch in an exemplary embodiment. Additional examples of the processing that may occur forFIGS. 4A, 4B, and 4C may also be found in U.S. Publication No. 2012/0279287, by Paul Andry, Bing Dang, and Steven Wright, entitled “Transferable Probe Tips”, filed on May 5, 2011, and assigned to International Business Machines Corporation.FIGS. 4A, 4B, and 4C are equivalent toFIGS. 3A, 3B, and 3C, respectively.

InFIG. 4D, this figure illustrates that thepillars270 may be mechanically and electrically connected to the substrate210 (e.g., at predetermined locations370) (at the junctions291) prior to the pillars being mechanically and electrically connected to thetips275. That is, thepillars270 are physically attached to the substrate210 (and subsequently to the tips275). For instance, thepillars270 may be formed on the substrate using lithography and electrolytic plating techniques. More particularly, dry film photoresist may be laminated on (e.g., flexible)substrate210. After mask exposure and development of the dry film photoresist, thepillars270 can be formed by electroplating. As withFIG. 3, thepillars270 are formed of one or more metals similar to or the same as the one or more metals in thetips275.

FIG. 4E shows asmart patch100 after thepillars270 are mechanically and electrically connected to thetips275, and after thetips275 have been released from the substrate300 (as indicated by reference380). The mechanical and electrical connections (e.g., at junctions291) may be made using many different techniques. For instance, solder alloy such as Sn and In may be used for bonding. Other materials such as conductive Ag epoxy may also be used to connect the tips. After release, the probes220 are formed, each having ananchor shape280.

Additional examples are presented inFIGS. 5-8.

Referring toFIG. 5, this figure illustrates an example of a breathable and/or heat spreadingsmart patch100, in accordance with exemplary embodiments. After release of thetips275 from the pits310, the probes220 are formed, each having ananchor shape280. In this example, there are a number of vias510, of which vias510-1,510-2, and510-3 are shown. The vias510 can be metallized for electrical function or just be mechanical vias (for instance, openings that are not metallized and left unfilled or filled with breathable material) for ventilation. In this example, thematerial500 may be a breathable material.

In another example, the vias510 and optional heat spreader500 (e.g., a heat-conducting fabric) could be used to transfer heat from theskin230. As another example, these concepts are combined, such that aheat spreader500 is used with an aligned pattern of the vias510 to allow ventilation. In an example, theheat spreader500 covers vias515 used for heat spreading but does not cover the vias515 used for ventilation. For instance, inregion530, thereference520 indicates in one example there is nomaterial500. In another example, theregion530 could be filled with abreathable material520. It may also be possible to use a heat spreading material that also is breathable, where thematerial500 would then cover all of the vias510. These techniques could allow thesmart patch100 to breathe and dissipate heat for extra comfort.

Turning toFIG. 6, this figure illustrates an example of asmart patch100 with active circuits in the substrate, in accordance with exemplary embodiments.FIG. 6 illustrates that thesubstrate210 is configured (reference610) to have active circuits (e.g., some or all of circuitry195) with one or more ofsignal collection140,signal processing145,data analysis160, data transfer (e.g., via N/W I/F(s)180), and/or stimulation165 (such as acupuncture or electrical stimulation). Regarding acupuncture, this may not apply to traditional acupuncture because theanchor structures280 and acupuncture needles are different. Traditional acupuncture uses a single needle at a critical point and the needles are much longer to penetrate through a deeper region. However, this invention may apply to the electroacupuncture, in which pairs of needles are used to pass continuous electric pulses using small clips. These devices are used to adjust the frequency and intensity of the impulse being delivered, depending on the condition being treated. This example also shows vias510, which in this case might be metallized (see reference620). Thesubstrate210 can therefore be a multi-layered substrate forming a multi-layered device formed using semiconductor processing techniques. Seereference620. Thesubstrate210 may therefore be an ultra-thin, ultra-small chip if desired. For instance, a thickness could be less than 50 μm for thesubstrate210 with a chip size less than 1 mm×1 mm. Of course, other sizes are possible.

FIG. 7 illustrates an example of asmart patch100 with elements710 attached to the substrate, in accordance with exemplary embodiments. The elements710 may be an alternative to the active circuits in the substrate as inFIG. 6 or may be used with the active circuits in the substrate inFIG. 6. The vias510 are shown, which as withFIG. 6 may be metallized. Thesubstrate210 further comprises two elements710-1 and710-2, each of which is mechanically and electrically connected to thesubstrate210. Each element may be an integrated circuit, MEMS, an optical element or a group of optical elements, an antenna, a heat spreader, an energy scavenging unit, a battery, and/or a capacitor, and the like. Energy scavenging may involve one or more piezoelectric materials or other materials that can be used to generate electricity, which can then be used to charge materials such as a supercapacitor or battery, for instance. The elements710-1 and710-2 can also perform the functionality incircuitry195 ofFIG. 1 or thereference610 ofFIG. 6.

Turning toFIG. 8, this figure, which includesFIGS. 8A and 8B, illustrates another fabrication method for thesmart patch100 in an exemplary embodiment. In this example, the pits310, of which pits310-1 through310-4 are shown, are partially filled pits (seeFIG. 8A) that can then form anchor shaped tips875 (of which tips875-1 through875-4 are shown). After release (indicated byreference880 inFIG. 8B), the probes220 are formed, each comprising apillar270 and a tip875. Additionally, each probe220 has ananchor structure280. The tips875 have an arrow shape due to the partially formed pits. The mechanical and electrical connections (e.g., at junctions291) may be made using many different techniques. For instance, solder alloy such as Sn and In may be used for bonding. Other materials such as conductive Ag epoxy may also be used to connect the tips. After release, the probes220 are formed, each having ananchor shape280.

As described herein, one or more embodiments of the embodiments can include one of multiple ways to remove a structure on top of a seed layer330 (also called a delamination layer), which may be a low-adhesion or sacrificial layer: 1) rely on a very low-adhesion layer, which allows the structure to be peeled off (e.g., essentially a mechanical delamination process), or 2) provide a layer (for example, a sacrificial layer) that either thermally decomposes or can be chemically dissolved, which also allows delamination.

In one or more embodiments of the invention, a metallic probe220 can include at least one of nickel (Ni), copper (Cu), tungsten (W), cobalt (Co), titanium (Ti), iron (Fe), tantalum (Ta), tantalum nitride (TaN), platinum (Pt), palladium (Pd), gold (Au), molybdenum (Mo), rhenium (Re), beryllium (Be), and silver (Ag). Also, aseed layer330 can include at least one of low-temperature silicon dioxide (SiO₂), sputtered copper (Cu), sputtered gold (Au), sputtered aluminum (Al), and spin-on polycarbonate. Further, a bonding alloy can include at least one of tin (Sn), gold-tin (AuSn), tin-silver (SnAg), tin-silver-copper (SnAgCu), indium (In), and tin-lead (SnPb).

Note that many or all of the patches above can also adhere to fabric, e.g., for a “smart dust” application. Smart dust is a system of many tiny sensors, robots, or other devices. These may include microelectromechanical systems (MEMS). As described previously, these patches may be placed on skin, in hair, or on fabric as examples.

Turning toFIG. 9, this figure is a flowchart illustrating a fabrication method for transdermal sensing probes in accordance with an exemplary embodiment.FIG. 9 is a restatement of some of the main steps for the methods corresponding toFIGS. 3, 4, 5, 6, 7, and 8. These steps have already been described above, but are restated here for ease of reference.

Inblock910, a plurality of pits310 are formed in an array on afirst substrate300. The pits320 (see, e.g.,FIGS. 3-8) have a pyramidal shape.Block920 concerns forming a release layer on the first substrate and covering surfaces of the plurality of pits. Inblock930, the operation is performed of forming in the pits10

probe tips

275 on thefirst substrate300. The probe tips are formed from rigid conductive material. Inblock940, a plurality ofpillars270 are formed from rigid conductive material. Inblock950, the plurality ofpillars270 are electrically and mechanically connected to asecond substrate210.Block960 entails electrically and mechanically connecting the plurality ofpillars270 to the plurality ofprobe tips275.Block970 includes causing release of theprobe tips275 from thefirst substrate300, wherein thepillars270 and probetips275 are connected to thesecond substrate210 and together form anarray190 of rigid and conductive probes220.

Another example is the method ofFIG. 9, wherein: forming a plurality of pillars from rigid conductive material and electrically and mechanically connecting the plurality of pillars to a second substrate further comprise forming the pillars on corresponding ones of the probe tips, one pillar per probe tip, wherein forming the pillars on corresponding ones of the probe tips also electrically and mechanically connects the plurality of pillars to the second substrate; and electrically and mechanically connecting the plurality of pillars to a second substrate further comprises electrically and mechanically connecting the plurality of pillars to the second substrate using one of a solder layer or a conductive adhesive to bond the second substrate and the plurality of the pillars, wherein electrically and mechanically connecting the plurality of pillars to the second substrate is performed after forming the plurality of pillars.

Another method is the example of the previous paragraph, wherein forming the pillars further comprises forming the pillars using lithographic and etching techniques.

Another example is the method ofFIG. 9, wherein: forming a plurality of pillars from rigid conductive material and electrically and mechanically connecting the plurality of pillars to a second substrate further comprise forming the pillars on the second substrate, wherein forming the pillars on the second substrate electrically and mechanically connects the plurality of pillars to the second substrate, wherein forming the pillars on the second substrate occurs before electrically and mechanically connecting the plurality of pillars to the plurality of probe tips; and electrically and mechanically connecting the plurality of pillars to the plurality of probe tips further comprises bonding the plurality of pillars to the plurality of probe tips.

A further example is a method of the previous paragraph, wherein: forming the pillars on the second substrate further comprises forming the pillars on the second substrate using lithography and electrolytic plating techniques; and bonding the plurality of pillars to the plurality of probe tips further comprises one of using a solder alloy for the bonding or using a conductive epoxy for the bonding.

Another example is the method ofFIG. 9, wherein: forming in the pits probe tips on the first substrate further comprises forming in the pits the probe tips such that a surface of the probe tips aligns with a surface of the first substrate.

Another example is the method ofFIG. 9, wherein: forming in the pits probe tips on the first substrate further comprises forming in the pits the probe tips such that a surface of the probe tips is beneath a surface of the first substrate.

The present invention may be a system, a method, and/or a computer program product. The computer program product may include a computer readable storage medium (or media) having computer readable program instructions thereon for causing a processor to carry out aspects of the present invention.

The computer readable storage medium can be a tangible device that can retain and store instructions for use by an instruction execution device. The computer readable storage medium may be, for example, but is not limited to, an electronic storage device, a magnetic storage device, an optical storage device, an electromagnetic storage device, a semiconductor storage device, or any suitable combination of the foregoing. A non-exhaustive list of more specific examples of the computer readable storage medium includes the following: a portable computer diskette, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or Flash memory), a static random access memory (SRAM), a portable compact disc read-only memory (CD-ROM), a digital versatile disk (DVD), a memory stick, a floppy disk, a mechanically encoded device such as punch-cards or raised structures in a groove having instructions recorded thereon, and any suitable combination of the foregoing. A computer readable storage medium, as used herein, is not to be construed as being transitory signals per se, such as radio waves or other freely propagating electromagnetic waves, electromagnetic waves propagating through a waveguide or other transmission media (e.g., light pulses passing through a fiber-optic cable), or electrical signals transmitted through a wire.

Computer readable program instructions described herein can be downloaded to respective computing/processing devices from a computer readable storage medium or to an external computer or external storage device via a network, for example, the Internet, a local area network, a wide area network and/or a wireless network. The network may comprise copper transmission cables, optical transmission fibers, wireless transmission, routers, firewalls, switches, gateway computers and/or edge servers. A network adapter card or network interface in each computing/processing device receives computer readable program instructions from the network and forwards the computer readable program instructions for storage in a computer readable storage medium within the respective computing/processing device.

Computer readable program instructions for carrying out operations of the present invention may be assembler instructions, instruction-set-architecture (ISA) instructions, machine instructions, machine dependent instructions, microcode, firmware instructions, state-setting data, or either source code or object code written in any combination of one or more programming languages, including an object oriented programming language such as Smalltalk, C++ or the like, and conventional procedural programming languages, such as the “C” programming language or similar programming languages. The computer readable program instructions may execute entirely on the user's computer, partly on the user's computer, as a stand-alone software package, partly on the user's computer and partly on a remote computer or entirely on the remote computer or server. In the latter scenario, the remote computer may be connected to the user's computer through any type of network, including a local area network (LAN) or a wide area network (WAN), or the connection may be made to an external computer (for example, through the Internet using an Internet Service Provider). In some embodiments, electronic circuitry including, for example, programmable logic circuitry, field-programmable gate arrays (FPGA), or programmable logic arrays (PLA) may execute the computer readable program instructions by utilizing state information of the computer readable program instructions to personalize the electronic circuitry, in order to perform aspects of the present invention.

Aspects of the present invention are described herein with reference to flowchart illustrations and/or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of the invention. It will be understood that each block of the flowchart illustrations and/or block diagrams, and combinations of blocks in the flowchart illustrations and/or block diagrams, can be implemented by computer readable program instructions.

These computer readable program instructions may be provided to a processor of a general purpose computer, special purpose computer, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, create means for implementing the functions/acts specified in the flowchart and/or block diagram block or blocks. These computer readable program instructions may also be stored in a computer readable storage medium that can direct a computer, a programmable data processing apparatus, and/or other devices to function in a particular manner, such that the computer readable storage medium having instructions stored therein comprises an article of manufacture including instructions which implement aspects of the function/act specified in the flowchart and/or block diagram block or blocks.

The computer readable program instructions may also be loaded onto a computer, other programmable data processing apparatus, or other device to cause a series of operational steps to be performed on the computer, other programmable apparatus or other device to produce a computer implemented process, such that the instructions which execute on the computer, other programmable apparatus, or other device implement the functions/acts specified in the flowchart and/or block diagram block or blocks.

The flowchart and block diagrams in the figures illustrate the architecture, functionality, and operation of possible implementations of systems, methods, and computer program products according to various embodiments of the present invention. In this regard, each block in the flowchart or block diagrams may represent a module, segment, or portion of instructions, which comprises one or more executable instructions for implementing the specified logical function(s). In some alternative implementations, the functions noted in the block may occur out of the order noted in the figures. For example, two blocks shown in succession may, in fact, be executed substantially concurrently, or the blocks may sometimes be executed in the reverse order, depending upon the functionality involved. It will also be noted that each block of the block diagrams and/or flowchart illustration, and combinations of blocks in the block diagrams and/or flowchart illustration, can be implemented by special purpose hardware-based systems that perform the specified functions or acts or carry out combinations of special purpose hardware and computer instructions.

The following abbreviations that may be found in the specification and/or the drawing figures are defined as follows:

CMP chemical-mechanical polishing

ECG electrocardiogram (also known as EKG)

EEG electroencephalography

ENOBIO a dry electrophysiology sensor employing nanotechnology

MEMS micro electro mechanical systems

PDMS polydimethylsiloxane

Claims

1. An apparatus, comprising:

a substrate mechanically and electrically connected on one side of the substrate to a plurality of metallic probes in one or more arrays; and

the plurality of metallic probes in the one or more arrays.

2. The apparatus ofclaim 1, wherein at least some of the plurality of metallic probes have an anchor structure.

3. The apparatus ofclaim 2, wherein the anchor structure for a probe comprises a pillar connected at a first end to the substrate and at a second end to a tip, and wherein a width of the pillar is less than a width of the tip at a junction where the pillar and tip are connected.

4. The apparatus ofclaim 3, wherein the tip has a pyramid shape with a vertex and a base, the junction is at the base and the width of the base is larger than the width of the pillar at the junction.

5. The apparatus ofclaim 3, wherein the tip has an arrow shape with a vertex and a base, the junction is at the base and the width of the base is larger than the width of the pillar at the junction.

6. The apparatus ofclaim 1, wherein at least some of the plurality of metallic probes comprise a pillar connected at a first end to the substrate and at a second end to a tip.

7. The apparatus ofclaim 1, wherein the substrate comprises a plurality of vias.

8. The apparatus ofclaim 7, wherein at least some of the plurality of vias are openings and the apparatus comprises a breathable material connected to the substrate on a side of the substrate opposite the side of the substrate connected to the plurality of metallic probes.

9. The apparatus ofclaim 8, wherein at least some of the plurality of vias are metallized and the apparatus comprises a heat spreading material connected to the substrate on a side of the substrate opposite the side of the substrate connected to the plurality of metallic probes.

10. The apparatus ofclaim 7, wherein at least some of the plurality of vias are metallized and the apparatus comprises a heat spreading material connected to the substrate on a side of the substrate opposite the side of the substrate connected to the plurality of metallic probes.

11. The apparatus ofclaim 7, wherein the substrate comprises a multi-layered device and at least some of the plurality of vias are metallized to electrically connect two or more of the layers.

12. The apparatus ofclaim 11, wherein the substrate comprises one or more active circuits embodied in the multi-layered device.

13. The apparatus ofclaim 12, wherein the one or more active circuits comprise circuitry for one or more of the following: signal collection, signal processing, data analysis, data transfer, or stimulation.

14. The apparatus ofclaim 11, further comprising one or more elements attached to the substrate, the one or more elements comprising one or more of the following: an integrated circuit, microelectromechanical systems, an optical element or a group of optical elements, an antenna, a semiconductor heat spreader, an energy scavenging unit, a battery, or a capacitor.

15. The apparatus ofclaim 14, wherein the substrate comprises one or more active circuits embodied in the multi-layered device.

16. The apparatus ofclaim 1, wherein the substrate comprises one or more active circuits embodied in the multi-layered device.

17. The apparatus ofclaim 16, wherein the one or more active circuits comprise circuitry for stimulation.

18. The apparatus ofclaim 17, wherein the substrate comprises one or more network interfaces.

19. The apparatus ofclaim 16, wherein the one or more active circuits comprise circuitry for one or more of the following: signal collection, signal processing, data analysis, or data transfer.

20. The apparatus ofclaim 16, further comprising one or more elements attached to the substrate, the one or more elements comprising one or more of the following: an integrated circuit, microelectromechanical systems, an optical element or a group of optical elements, an antenna, a semiconductor heat spreader, an energy scavenging unit, a battery, or a capacitor.

21. The apparatus ofclaim 1, further comprising one or more elements attached to the substrate, the one or more elements comprising one or more of the following: an integrated circuit, microelectromechanical systems, an optical element or a group of optical elements, an antenna, a semiconductor cooling unit, an energy scavenging unit, a battery, or a capacitor.

22. The apparatus ofclaim 1, further comprising signal collection circuitry and one or more network interfaces, the signal collection circuitry configured to collect signals from the plurality of probes and to cause data corresponding to the signals to be transmitted to a remote device over the one or more network interfaces.

23.-29. (canceled)