US20150176800A1 - Supporting base for semiconductor chip - Google Patents
Supporting base for semiconductor chipDownload PDFInfo
- Publication number
- US20150176800A1 US20150176800A1US14/140,509US201314140509AUS2015176800A1US 20150176800 A1US20150176800 A1US 20150176800A1US 201314140509 AUS201314140509 AUS 201314140509AUS 2015176800 A1US2015176800 A1US 2015176800A1
- Authority
- US
- United States
- Prior art keywords
- semiconductor chip
- supporting base
- substrate
- chip according
- surrounding wall
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 239000004065semiconductorSubstances0.000titleclaimsabstractdescription58
- 239000000758substrateSubstances0.000claimsabstractdescription24
- 238000009413insulationMethods0.000claimsdescription19
- 239000002184metalSubstances0.000claimsdescription13
- 239000000919ceramicSubstances0.000claimsdescription4
- 239000011247coating layerSubstances0.000claimsdescription3
- 238000003780insertionMethods0.000claimsdescription3
- 230000037431insertionEffects0.000claimsdescription3
- 230000000694effectsEffects0.000abstractdescription5
- 238000005286illuminationMethods0.000abstractdescription4
- 230000017525heat dissipationEffects0.000description2
- 230000015572biosynthetic processEffects0.000description1
- 238000001746injection mouldingMethods0.000description1
- 239000000463materialSubstances0.000description1
- 238000009828non-uniform distributionMethods0.000description1
Images
Classifications
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V7/00—Reflectors for light sources
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
- H10H20/856—Reflecting means
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/858—Means for heat extraction or cooling
Definitions
- the present inventionis related to a semiconductor component, in particular, to a supporting base for a semiconductor chip.
- the semiconductor chipcan be a light emitting diode or an infrared chip, which is mainly used in a lighting fixture or an infrared sensor.
- the semiconductor chipSince the light emitted by the semiconductor chip has directions and fixed illumination angles, if the semiconductor chip is the light emitting diode, the situation of non-uniform distribution of light would occur, and the situation of improper sensing would occur if the semiconductor chip is the infrared chip; therefore, there is a need for an improvement to increase the range of the light emitted by the semiconductor chip.
- the present inventionis to provide a supporting base for a semiconductor chip, which utilizes a reflection plate configured to correspond with a cut-out portion and the semiconductor chip in order to allow the light emitted from the semiconductor chip to be reflected by the reflection plate such that the effect of increased illumination range can be achieved.
- the present inventionprovides a supporting base for a semiconductor chip, comprising a substrate, a surrounding wall and a reflection plate; the surrounding wall is formed on the substrate; an accommodating space is formed between the surrounding wall and the substrate, and is provided for receiving the semiconductor chip therein; the semiconductor chip is electrically connected to the substrate; the surrounding wall has one side formed of an cut-out portion; the reflection plate is arched from the substrate and formed within the cut-out portion; the reflection plate is configured to correspond with the semiconductor chip and is formed of an obtuse angle 31 with the substrate.
- the present inventionalso includes the following effects.
- First, the design of attaching the semiconductor to the heat dissipating portionis able to achieve the effect of heat dissipation of the semiconductor chip; second, by attaching each one of the first arched surfaces to each one of the second arched surfaces correspondingly, the insulation member and the metal board member can be of greater attachment strength.
- FIG. 1is a perspective view showing the outer appearance of the present invention
- FIG. 2is a bottom view of the present invention
- FIG. 3is a top view of the present invention with a semiconductor attached thereto;
- FIG. 4is a cross sectional view showing a state of use according to the present invention.
- FIG. 5is a perspective view of the formation of the metal board member being manufactured.
- FIG. 6is a top view of another embodiment according to the present invention.
- the present inventionprovides a supporting base 1 for a semiconductor chip, comprising a substrate 10 , a surrounding wall 20 and a reflection plate 30 .
- the substrate 10comprises a metal board member 11 and an insulation member 12 .
- the metal board member 11includes an opening slot 111 (as shown in FIG. 5 ); the insulation member 12 is fixed within the opening slot 111 and divides the metal board member 11 into a heat dissipating portion 112 and a conductive portion 113 .
- the opening slot 111 and the insulation member 12are of a W-resembling shape.
- the opening slot 111includes an inner wall having a plurality of different first corner surfaces 1111 ;
- the insulation member 12includes an outer circumferential surface having a plurality of different second corner surfaces 121 ; each second corner surface 121 is firmly attached to each corresponding first corner surface 111 .
- the insulation member 12is an insulation plastic unit.
- the surrounding wall 20is formed on the substrate 10 .
- An accommodating space 21is formed between the surrounding wall 20 and the substrate 10 and, is provided for receiving a semiconductor chip 9 therein.
- the surrounding wall 20can be formed on the metal board member 11 by an injection molding process and can be of the same material as the insulation member 12 .
- the heat dissipating portion 112 and a part of the conductive portion 113are exposed in the accommodating space 21 ; the surrounding wall 20 and the insulation member 12 separate the conductive portion 113 in the accommodating space 21 into a plurality of electrodes 1131 .
- the semiconductor 9is attached to the heat dissipating portion 112 and electrically connected to the electrodes 1131 .
- the surrounding wall 20includes a cut-out portion 22 formed on one side of the heat dissipating portion 112 away from the conductive portion 113 .
- the reflection plate 30is extended to be bent from one end edge of the heat dissipating portion 112 at the cut-out portion 22 ; the reflection plate 30 is configured to correspond with the cut-out portion 22 and the semiconductor chip 9 .
- An obtuse angle 31is formed between the reflection plate 30 and the substrate 10 .
- the obtuse angle 31is of an angle between 91 degrees and 179 degrees and preferably between 110 degrees and 160 degrees.
- the reflection board 30includes a surface facing to the accommodating space 21 and coated with a reflection coating layer 32 .
- a plurality of semiconductor chips 9are installed within the accommodating space 21 of the surrounding wall 91 and are thermally attached to the heat dissipating portion 112 of the metal board member 11 .
- a plurality of conductive wires 91are used to electrically connect the plurality of semiconductor chips 9 with each one of the electrodes 1131 ; wherein each one of the semiconductor chips 9 can be a light emitting diode or an infrared chip and etc.
- the semiconductor chips 9are driven to emit light, the light S emitted by the semiconductor chip 9 can be reflected by the reflection coating layer 32 coated on the reflection plate 30 such that the illumination range of the light S emitted from the semiconductor chip 9 can be increased.
- the opening slot 111having the inner wall formed of the plurality of first corner surfaces 1111 and the insulation member 12 having the outer circumferential surface formed of the plurality of second corner surfaces 121 as well as the design of having the first corner surfaces 1111 correspondingly secured with the second corner surfaces 121 , respectively, the unfavorable situation in which the insulation member 12 and the metal board member 11 disengage from each other due to external forces can be prevented.
- the heat dissipating portion 112is able to absorb the heat generated by the semiconductor chips 9 and to conduct the heat to the environment in order to achieve the effect of heat dissipation for the semiconductor chips 9 .
- the semiconductor chip 9 ′comprises a conductive ceramic plate 91 and two chip units 92 , 92 ′.
- the conductive ceramic plate 91is generally of a rectangular elongated body, which includes a flat top surface and a flat front surface with the chip unit 92 , 92 ′ attached thereon, respectively; wherein the chip unit 92 ′ at the front surface is configured to correspond to a location of the reflection plate 30 so that the reflection plate 30 can reflect the light emitted from the chip unit 92 ′.
- the conductive portion 113 ′ of the metal board member 11includes not only the aforementioned electrodes 1131 but also an insertion terminal 1132 extended from each electrode 1131 and protruded out of the surrounding wall 20 to engage with an insertion slot of a circuit board (not shown in the figure).
- the supporting base for a semiconductor chip according to the present inventionis of industrial applicability, novelty and inventive step.
- the structure of the present inventionis not seen in any similar products nor being disclosed publically, which complies with the patentability requirement for the grant of patent right and is applied legitimately.
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Led Device Packages (AREA)
Abstract
Description
- 1. Field of the Invention
- The present invention is related to a semiconductor component, in particular, to a supporting base for a semiconductor chip.
- 2. Description of Related Art
- During the use of a semiconductor component, it is often required to install a semiconductor chip onto a supporting based that is specially designed therefor and to connect a circuit board electrically via the supporting base in order to properly mount the semiconductor chip on the circuit board. The semiconductor chip can be a light emitting diode or an infrared chip, which is mainly used in a lighting fixture or an infrared sensor.
- Since the light emitted by the semiconductor chip has directions and fixed illumination angles, if the semiconductor chip is the light emitting diode, the situation of non-uniform distribution of light would occur, and the situation of improper sensing would occur if the semiconductor chip is the infrared chip; therefore, there is a need for an improvement to increase the range of the light emitted by the semiconductor chip.
- The present invention is to provide a supporting base for a semiconductor chip, which utilizes a reflection plate configured to correspond with a cut-out portion and the semiconductor chip in order to allow the light emitted from the semiconductor chip to be reflected by the reflection plate such that the effect of increased illumination range can be achieved.
- Accordingly, the present invention provides a supporting base for a semiconductor chip, comprising a substrate, a surrounding wall and a reflection plate; the surrounding wall is formed on the substrate; an accommodating space is formed between the surrounding wall and the substrate, and is provided for receiving the semiconductor chip therein; the semiconductor chip is electrically connected to the substrate; the surrounding wall has one side formed of an cut-out portion; the reflection plate is arched from the substrate and formed within the cut-out portion; the reflection plate is configured to correspond with the semiconductor chip and is formed of an
obtuse angle 31 with the substrate. - The present invention also includes the following effects. First, the design of attaching the semiconductor to the heat dissipating portion is able to achieve the effect of heat dissipation of the semiconductor chip; second, by attaching each one of the first arched surfaces to each one of the second arched surfaces correspondingly, the insulation member and the metal board member can be of greater attachment strength.
FIG. 1 is a perspective view showing the outer appearance of the present invention;FIG. 2 is a bottom view of the present invention;FIG. 3 is a top view of the present invention with a semiconductor attached thereto;FIG. 4 is a cross sectional view showing a state of use according to the present invention;FIG. 5 is a perspective view of the formation of the metal board member being manufactured; andFIG. 6 is a top view of another embodiment according to the present invention.- The following provides detailed description of embodiments of the present invention along with the accompanied drawings. It can, however, be understood that the accompanied drawings are provided for illustrative purposes only and shall not be treated as limitations to the present invention.
- Please refer to
FIGS. 1 to 3 . As shown in the figures, the present invention provides a supportingbase 1 for a semiconductor chip, comprising asubstrate 10, a surroundingwall 20 and areflection plate 30. - The
substrate 10 comprises ametal board member 11 and aninsulation member 12. Themetal board member 11 includes an opening slot111 (as shown inFIG. 5 ); theinsulation member 12 is fixed within theopening slot 111 and divides themetal board member 11 into aheat dissipating portion 112 and aconductive portion 113. Theopening slot 111 and theinsulation member 12 are of a W-resembling shape. Theopening slot 111 includes an inner wall having a plurality of differentfirst corner surfaces 1111; theinsulation member 12 includes an outer circumferential surface having a plurality of differentsecond corner surfaces 121; eachsecond corner surface 121 is firmly attached to each correspondingfirst corner surface 111. In addition, theinsulation member 12 is an insulation plastic unit. - The surrounding
wall 20 is formed on thesubstrate 10. Anaccommodating space 21 is formed between the surroundingwall 20 and thesubstrate 10 and, is provided for receiving asemiconductor chip 9 therein. The surroundingwall 20 can be formed on themetal board member 11 by an injection molding process and can be of the same material as theinsulation member 12. Theheat dissipating portion 112 and a part of theconductive portion 113 are exposed in theaccommodating space 21; the surroundingwall 20 and theinsulation member 12 separate theconductive portion 113 in theaccommodating space 21 into a plurality ofelectrodes 1131. Thesemiconductor 9 is attached to theheat dissipating portion 112 and electrically connected to theelectrodes 1131. The surroundingwall 20 includes a cut-outportion 22 formed on one side of theheat dissipating portion 112 away from theconductive portion 113. - The
reflection plate 30 is extended to be bent from one end edge of theheat dissipating portion 112 at the cut-outportion 22; thereflection plate 30 is configured to correspond with the cut-outportion 22 and thesemiconductor chip 9. Anobtuse angle 31 is formed between thereflection plate 30 and thesubstrate 10. Theobtuse angle 31 is of an angle between 91 degrees and 179 degrees and preferably between 110 degrees and 160 degrees. Thereflection board 30 includes a surface facing to theaccommodating space 21 and coated with areflection coating layer 32. - Please refer to
FIG. 4 . As shown in the figure, first, a plurality ofsemiconductor chips 9 are installed within theaccommodating space 21 of the surroundingwall 91 and are thermally attached to theheat dissipating portion 112 of themetal board member 11. In addition, a plurality ofconductive wires 91 are used to electrically connect the plurality ofsemiconductor chips 9 with each one of theelectrodes 1131; wherein each one of thesemiconductor chips 9 can be a light emitting diode or an infrared chip and etc. When thesemiconductor chips 9 are driven to emit light, the light S emitted by thesemiconductor chip 9 can be reflected by thereflection coating layer 32 coated on thereflection plate 30 such that the illumination range of the light S emitted from thesemiconductor chip 9 can be increased. - In addition, with the design of the
opening slot 111 having the inner wall formed of the plurality offirst corner surfaces 1111 and theinsulation member 12 having the outer circumferential surface formed of the plurality ofsecond corner surfaces 121 as well as the design of having thefirst corner surfaces 1111 correspondingly secured with thesecond corner surfaces 121, respectively, the unfavorable situation in which theinsulation member 12 and themetal board member 11 disengage from each other due to external forces can be prevented. - Furthermore, with the design of attaching the
semiconductors 9 to theheat dissipating portion 112, theheat dissipating portion 112 is able to absorb the heat generated by thesemiconductor chips 9 and to conduct the heat to the environment in order to achieve the effect of heat dissipation for thesemiconductor chips 9. - Please refer to
FIG. 6 . As shown in the figure, in addition the aforementioned embedment for the supporting base of the present invention, it can also be implemented differently in another embodiment; wherein thesemiconductor chip 9′ comprises a conductiveceramic plate 91 and twochip units ceramic plate 91 is generally of a rectangular elongated body, which includes a flat top surface and a flat front surface with thechip unit chip unit 92′ at the front surface is configured to correspond to a location of thereflection plate 30 so that thereflection plate 30 can reflect the light emitted from thechip unit 92′. Also, theconductive portion 113′ of themetal board member 11 includes not only theaforementioned electrodes 1131 but also aninsertion terminal 1132 extended from eachelectrode 1131 and protruded out of the surroundingwall 20 to engage with an insertion slot of a circuit board (not shown in the figure). - In view of the above, the supporting base for a semiconductor chip according to the present invention is of industrial applicability, novelty and inventive step. In addition, the structure of the present invention is not seen in any similar products nor being disclosed publically, which complies with the patentability requirement for the grant of patent right and is applied legitimately.
Claims (12)
1. A supporting base1 for a semiconductor chip, comprising:
a substrate (10);
a surrounding wall (20) formed on the substrate (10), an accommodating space (21) formed between the surrounding wall (20) and the substrate (10) and provided for receiving the semiconductor chip (9) therein, the semiconductor chip (9) electrically connected to the substrate (10), the surrounding wall (20) having one side formed of an cut-out portion (22); and
a reflection plate (30) extended to be bent from the substrate (10) and formed within the cut-out portion (22), the reflection plate (30) configured to correspond with the semiconductor chip (9) and formed of an obtuse angle (31) with the substrate (10).
2. The supporting base for a semiconductor chip according toclaim 1 , wherein the obtuse angle (31) is of an angle between 91 degrees and 179 degrees.
3. The supporting base for a semiconductor chip according toclaim 2 , wherein the obtuse angle (31) is of an angle between 110 degrees and 160 degrees.
4. The supporting base for a semiconductor chip according toclaim 1 , wherein the substrate (10) comprises a metal board member (11) and an insulation member (12); the metal board member (11) includes an opening slot (111); the insulation member (12) is fixed within the opening slot (111) and divides the metal board member (11) into a heat dissipating portion (112) and a conductive portion (113); the heat dissipating portion (112) and a part of the conductive portion (113) are exposed in the accommodating space (21); the semiconductor (9) is attached to the heat dissipating portion (112) and electrically connected to the conductive portion (113).
5. The supporting base for a semiconductor chip according toclaim 4 , wherein the surrounding wall (20) is fixed onto the metal board member (11) and the insulation member (12) the surrounding wall (20) and the insulation member (12) divide the conductive portion (113) within the accommodating space (21) into a plurality of electrodes (1131); the semiconductor (9) is electrically connected to each one of the electrodes (1131).
6. The supporting base for a semiconductor chip according toclaim 5 , wherein the conductive portion (113) includes an insertion terminal (1132) extended from each electrode (1131) and protruded out of the surrounding wall (20).
7. The supporting base for a semiconductor chip according toclaim 4 , wherein the cut-out portion (22) is at one side of the heat dissipating portion (112) away from the conductive portion (113); the reflection plate (30) is at one end of the heat dissipating portion (112) adjacent to the cut-out portion (22).
8. The supporting base for a semiconductor chip according toclaim 4 , wherein the opening slot (111) and the insulation member (12) are both of a W-resembling shape.
9. The supporting base for a semiconductor chip according toclaim 8 , wherein the opening slot (111) includes an inner wall having a plurality of first corner surfaces (1111); the insulation member (12) includes an outer circumferential surface having a plurality of second corner surfaces (121); each first corner surface (111) is firmly attached to each corresponding second corner surface (121).
10. The supporting base for a semiconductor chip according toclaim 4 , wherein the insulation member (12) is an insulation plastic unit.
11. The supporting base for a semiconductor chip according toclaim 1 , wherein the reflection board (30) includes a surface facing the accommodating space (21) and coated with a reflection coating layer (32).
12. The supporting base for a semiconductor chip according toclaim 1 , wherein the semiconductor chip (9′) comprises a conductive ceramic plate (91) and two chip units (92,92′); the conductive ceramic plate (91) is a rectangular elongated body, and the rectangular elongated body includes a flat top surface and a flat front surface with the chip units (92) attached thereon, respectively; the chip unit (92) at the front surface is configured to correspond to a location of the reflection plate (30).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14/140,509US20150176800A1 (en) | 2013-12-25 | 2013-12-25 | Supporting base for semiconductor chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14/140,509US20150176800A1 (en) | 2013-12-25 | 2013-12-25 | Supporting base for semiconductor chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US20150176800A1true US20150176800A1 (en) | 2015-06-25 |
Family
ID=53399586
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US14/140,509AbandonedUS20150176800A1 (en) | 2013-12-25 | 2013-12-25 | Supporting base for semiconductor chip |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | US20150176800A1 (en) |
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