US20150059204A1 - Segmented Insole for Support of Embedded Systems - Google Patents

Abstract

A two part insole having one part for housing smart systems embedded within an insole, and a second part for maintaining comfort of a cut-to-fit insole to increase the functionality of the overall product for the user.

Description

RELATED APPLICATIONS
• This application claims the benefit of U.S. Provisional Application Ser. No. 61/873,421, filed Sept. 4, 2013.
BACKGROUND OF THE INVENTION
• Smart footwear is defined as footwear having embedded mechanical and electrical systems for performing various functions. Embedded systems may be located anywhere on the shoe, but it is desirable, both for function and aesthetic reasons, that the embedded system be hidden in the insole of the shoe. Typical examples of such systems include energy harvesting devices, footwear-embedded GPS devices and step-logging (pressure sensing) devices. Devices hidden in the insole of the shoe require support material for the embedded device to prevent damage from impacts from the user's foot and from moisture that may be present within the shoe.
• Off-the-shelf after-market insoles are frequently made to be cut-to-fit. A range of sizes will be marked on the insole so that the user can cut the toe end of the insole to personalize the size. However, optimal fitting depends on user precision, and the insole can easily be ruined by user error, rendering the entire system unusable. For an insole without an embedded system, two insoles are typically offered for purchase in one package, or the user can buy another insole for a relatively low cost if the insole is ruined by user error.
• Insoles for smart footwear, however, have a much higher expected cost and cannot be repurchased as easily. Other problems related to embedded systems within insoles include added wear on those systems from machine washing, replacement of the soft (comfort-related) materials from wear, and the high cost of customization due to aesthetic desires like color. Therefore, it is desirable to provide an insole design that addresses these deficiencies, while supporting a wide variety of embedded systems.
SUMMARY OF THE INVENTION
• A novel two part insole is presented for use with any mechanical mechanism or electronic device located in the heel of an insole. The two part insole construction is designed for both stability and support of the embedded system present in smart footwear, as well as for comfort of the user, while still addressing the cut-to-fit and reusability constraints desirable for insoles.
• The insole is provided as a two-part construction having a bottom layer and a top layer. The bottom layer is a more rigid construction and provides stability and encasing for engineered systems. The top comfort layer is detachable from the bottom layer, is customizable by material, color, and size, and consists of a softer, more flexible material for the comfort of the user. The insole layers may be attached to each other using grooves, adhesives, or detachable materials like Velcro. The toe end of the top layer of the insole may be provided with a cut-to-fit pattern for user fitting, or maybe provided pre-sized from the factory.
BRIEF DESCRIPTION OF THE DRAWINGS
• FIG. 1 shows an exploded view of the segmented insole of the present invention.
DETAILED DESCRIPTION OF THE INVENTION
• Smart footwear having engineered devices embedded in the insole are best served by a two part insole where the cheaper,top comfort layer1 of the insole can be customizable and removable, while the lower, morerigid layer2 supports the embedded device. The present invention is a two part insole for this purpose. The system includes anupper insole layer1 for comfort, having cut-to-fit lines on the toe end thereof for customizability, and alower insole layer2 for support, having acavity5 of variable shape for embedding mechanical and electrical systems. An attachment method between thelower support2 and upper comfortinsole layer1 is provided. The insole may also feature treads on the base of the insole for inducing friction between the insole and the base of the shoe.
• The smart footwear insole of the present invention is shown inFIG. 1. Top,comfort layer1 is thin at the heel-end, becomes thicker under the arch at the arch point, and tapers to be thinner by the toe end. Anotch4 at the arch point is shaped to mate withbottom support layer2. Cut-to-fit lines3 are marked oncomfort layer1, such that the user can cutcomfort layer1 to their personal foot/shoe size along one of cut-to-fit lines3.
• Comfort layer1 is preferably made of a soft, shock-absorbing material, such as gels, fabrics, foams, recycled material, or plastic materials common to comfort-based, standard orthotics.Support layer2 provides stability for the user's foot, as well as support for the embedded device. It is preferably constructed of a structural material, such as hard plastics, composites, metals, foams, recycled material or any other structural material suitable for the base of an insole, and provides a step-down surface to protect any mechanical or electrical systems embedded within embeddedsystems cavity5. Embeddedsystems cavity5 may be of any shape depending on the design of the particular embedded system, and may include channels for antenna, wires or other parts which are required to be positioned external to the insole (not shown). In a second embodiment of the invention,support layer2 may comprise a two-part construction defining a cavity on the interior thereof such that the embedded system is completely encased by the rigid material ofsupport layer2. In such cases, the two parts ofsupport layer2 may be attached to each other using methods similar to those used to attach thewhole support layer2 tocomfort layer1. In other embodiments, the embedded systems may be manufactured already permanently or non-permanently encased insupport layer2, ready to be joined withcomfort layer1.
• The length ofsupport layer2 will preferably not exceed the length from the heel toarch point4.Comfort layer1 may be attached to the top side ofsupport layer2 using grooves, pegs, friction-inducing fixtures, adhesives or other fixtures in the materials. In the embodiment shown, twopads6 are shown to represent a hook and loop attachment method, such as Velcro®. The strips are orthogonal to the user's foot, but other embodiments could be in any arrangement on the outward faces ofsupport layer2 andcomfort layer1.
• In another embodiment,comfort layer1 would be thicker at the heel end with a separate pocket forsupport layer2.Support layer2 would then fit into a fabric pocket to be fastened to comfort layer1 (not shown). In this embodiment, the fabric pocket would replace the strips ofattachment material6 seen in the embodiment ofFIG. 1. In yet another embodiment,comfort layer1 may define a cavity in the heal portion thereof into whichsupport layer2 may be inserted (not shown).

Claims (18)

We claim:

1. A segmented insole comprising:

a bottom, support layer; and

a top, comfort layer, said top layer defining one or more surfaces designed to mate with said bottom layer;

wherein said bottom layer is composed of a semi-rigid structural material and defines a cavity therein for holding an embedded device; and further

wherein said top layer covers said bottom layer.

2. The segmented insole ofclaim 1 further comprising one or more attachment points wherein said bottom layer and said top layer are attached to each other.

3. The segmented insole ofclaim 1 further comprising an attachment method for attaching said bottom layer to said top layer at said one or more attachment points.

4. The segmented insoleclaim 3 wherein said attachment method comprises an attachable and detachable material.

5. The segmented insole ofclaim 3 wherein said attachment method comprises an adhesive.

6. The segmented insole ofclaim 3 wherein said attachment method comprises friction-inducing fixtures, grooves, or pegs.

7. The segmented insole ofclaim 1 wherein said top layer has cut-to-fit sizing lines.

8. The segmented insole ofclaim 1 wherein said bottom layer and the portion of said top layer not covering said bottom layer each define a bottom surface, said bottom surface defining treads for engaging the base of a shoe into which said insole is disposed.

9. The segmented insole ofclaim 1 wherein said top layer is composed of a shock-absorbing material.

10. The segmented insole ofclaim 9 wherein said top layer is composed of a material which is softer than said bottom layer.

11. The segmented insole ofclaim 9 wherein said shock-absorbing material is selected from a group consisting of gels, fabrics, foams, recycled materials and soft plastic materials.

12. The segmented insole ofclaim 1 wherein semi-rigid structural material is selected from a group consisting of hard plastics, composites, metals, foams and recycled materials.

13. The segmented insole ofclaim 3 wherein said attachment method consists of a cavity defined in said top layer for accepting insertion of said bottom layer therein.

14. The segmented in sole ofclaim 13 wherein said cavity is composed of the same material as said top layer.

15. The segmented insole ofclaim 13 wherein said cavity is composed of a fabric attached to said top layer.

16. The segmented insole ofclaim 1 wherein said bottom layer defines one or more grooves or channels therein to allow for exposure of portions of said embedded device external to said insole.

17. The segmented insole ofclaim 16 wherein said bottom layer comprises two parts which, when joined, encase said embedded system inside of said bottom layer.

18. The segmented insole ofclaim 17 wherein said bottom layer permanently encases said embedded system.

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