US20130336423A1 - Transmitter Utilizing a Leaky Wave Antenna - Google Patents
Transmitter Utilizing a Leaky Wave AntennaDownload PDFInfo
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- US20130336423A1 US20130336423A1US13/969,554US201313969554AUS2013336423A1US 20130336423 A1US20130336423 A1US 20130336423A1US 201313969554 AUS201313969554 AUS 201313969554AUS 2013336423 A1US2013336423 A1US 2013336423A1
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- leaky wave
- wave antenna
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S13/00—Systems using the reflection or reradiation of radio waves, e.g. radar systems; Analogous systems using reflection or reradiation of waves whose nature or wavelength is irrelevant or unspecified
- G01S13/02—Systems using reflection of radio waves, e.g. primary radar systems; Analogous systems
- G01S13/06—Systems determining position data of a target
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/02—Transmitters
- H04B1/04—Circuits
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K7/00—Methods or arrangements for sensing record carriers, e.g. for reading patterns
- G06K7/10—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation
- G06K7/10009—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation sensing by radiation using wavelengths larger than 0.1 mm, e.g. radio-waves or microwaves
- G06K7/10316—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation sensing by radiation using wavelengths larger than 0.1 mm, e.g. radio-waves or microwaves using at least one antenna particularly designed for interrogating the wireless record carriers
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
- H01Q13/20—Non-resonant leaky-waveguide or transmission-line antennas; Equivalent structures causing radiation along the transmission path of a guided wave
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
- H01Q13/20—Non-resonant leaky-waveguide or transmission-line antennas; Equivalent structures causing radiation along the transmission path of a guided wave
- H01Q13/22—Longitudinal slot in boundary wall of waveguide or transmission line
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q15/00—Devices for reflection, refraction, diffraction or polarisation of waves radiated from an antenna, e.g. quasi-optical devices
- H01Q15/0006—Devices acting selectively as reflecting surface, as diffracting or as refracting device, e.g. frequency filtering or angular spatial filtering devices
- H01Q15/006—Selective devices having photonic band gap materials or materials of which the material properties are frequency dependent, e.g. perforated substrates, high-impedance surfaces
- H01Q15/0066—Selective devices having photonic band gap materials or materials of which the material properties are frequency dependent, e.g. perforated substrates, high-impedance surfaces said selective devices being reconfigurable, tunable or controllable, e.g. using switches
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q15/00—Devices for reflection, refraction, diffraction or polarisation of waves radiated from an antenna, e.g. quasi-optical devices
- H01Q15/23—Combinations of reflecting surfaces with refracting or diffracting devices
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q19/00—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic
- H01Q19/06—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic using refracting or diffracting devices, e.g. lens
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/02—Transmitters
- H04B1/04—Circuits
- H04B1/0458—Arrangements for matching and coupling between power amplifier and antenna or between amplifying stages
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B7/00—Radio transmission systems, i.e. using radiation field
- H04B7/24—Radio transmission systems, i.e. using radiation field for communication between two or more posts
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q15/00—Devices for reflection, refraction, diffraction or polarisation of waves radiated from an antenna, e.g. quasi-optical devices
- H01Q15/0006—Devices acting selectively as reflecting surface, as diffracting or as refracting device, e.g. frequency filtering or angular spatial filtering devices
- H01Q15/006—Selective devices having photonic band gap materials or materials of which the material properties are frequency dependent, e.g. perforated substrates, high-impedance surfaces
Definitions
- Certain embodiments of the inventionrelate to wireless communication. More specifically, certain embodiments of the invention relate to a method and system for a subharmonic transmitter utilizing a leaky wave antenna.
- Mobile communicationshave changed the way people communicate and mobile phones have been transformed from a luxury item to an essential part of every day life.
- the use of mobile phonesis today dictated by social situations, rather than hampered by location or technology.
- White voice connectionsfulfill the basic need to communicate, and mobile voice connections continue to filter even further into the fabric of every day life, the mobile Internet is the next step in the mobile communication revolution.
- the mobile Internetis poised to become a common source of everyday information, and easy, versatile mobile access to this data will be taken for granted.
- a system and/or method for a sub-harmonic transmitter utilizing a leaky wave antennasubstantially as shown in and/or described in connection with at least one of the figures, as set forth more completely in the claims.
- FIG. 1is a block diagram of an exemplary wireless system with a sub-harmonic transmitter utilizing a leaky wave antenna, which may be utilized in accordance with an embodiment of the invention.
- FIG. 2is a block diagram illustrating an exemplary leaky wave antenna, in accordance with an embodiment of the invention.
- FIG. 3is a block diagram illustrating a plan view of exemplary partially reflective surfaces, in accordance with an embodiment of the invention.
- FIG. 4is a block diagram illustrating an exemplary phase dependence of a leaky wave antenna, in accordance with an embodiment of the invention.
- FIG. 5is a block diagram illustrating exemplary in-phase and out-of-phase beam shapes for a leaky wave antenna, in accordance with an embodiment of the invention.
- FIG. 6is a block diagram illustrating a leaky wave antenna with variable input impedance feed points, in accordance with an embodiment of the invention.
- FIG. 7is a block diagram illustrating exemplary sub-harmonic transmission utilizing a leaky wave antenna, in accordance with an embodiment of the invention.
- FIG. 8is a block diagram illustrating exemplary steps for a sub-harmonic transmitter utilizing a leaky wave antenna, in accordance with an embodiment of the invention.
- Certain aspects of the inventionmay be found in a method and system for a sub-harmonic transmitter utilizing a leaky wave antenna.
- Exemplary aspects of the inventionmay comprise transmitting wireless signals at a harmonic frequency of a source signal utilizing one or more leaky wave antennas in a wireless device comprising one or more transceivers on a chip.
- the one or more leaky wave antennasmay be configured with a resonant frequency at the harmonic frequency.
- the source signalmay be communicated to the one or more leaky wave antennas utilizing a power amplifier, which may be operated in a switching mode thereby generating a square wave from the source signal.
- the one or more leaky wave antennasmay be integrated on the chip, on a package to which the chip is affixed and/or on a printed circuit board to which the chip is affixed.
- the harmonic frequencymay be three times a frequency of the source signal.
- the transmitted wireless signalmay be amplitude modulated utilizing a bias voltage applied to the one or more leaky wave antennas.
- FIG. 1is a block diagram of an exemplary wireless system with a sub harmonic transmitter utilizing a leaky wave antenna, which may be utilized in accordance with an embodiment of the invention.
- the wireless device 150may comprise an antenna 151 , a transceiver 152 , a baseband processor 154 , a processor 156 , a system memory 158 , a logic block 160 , a chip 162 , leaky wave antennas 164 A, 164 B, and 164 C an external headset port 166 , and a package 167 .
- the wireless device 150may also comprise an analog microphone 168 , integrated hands free (IHF) stereo speakers 170 , a printed circuit board 171 , a hearing aid compatible (HAC) coil 174 , a dual digital microphone 176 , a vibration transducer 178 , a keypad and/or touchscreen 180 , and a display 182 .
- IHFintegrated hands free
- HAChearing aid compatible
- the transceiver 152may comprise suitable logic, circuitry, interface(s), and/or code that may be enabled to modulate and upconvert baseband signals to RF signals for transmission by one or more antennas, which may be represented generically by the antenna 151 .
- the transceiver 152may also be enabled to downconvert and demodulate received RF signals to baseband signals.
- the RF signalsmay be received by one or more antennas, which may be represented generically by the antenna 151 , or the leaky wave antennas 164 A and 164 B. Different wireless systems may use different antennas for transmission and reception.
- the transceiver 152may be enabled to execute other functions, for example, filtering the baseband and/or RF signals, and/or amplifying the baseband and/or RF signals.
- the transceiver 152may be implemented as a separate transmitter and a separate receiver.
- the plurality of transceivers, transmitters and/or receiversmay enable the wireless device 150 to handle a plurality of wireless protocols and/or standards including cellular, WLAN and PAN.
- Wireless technologies handled by the wireless device 150may comprise GSM, CDMA, CDMA2000, WCDMA, GMS, GPRS, EDGE, WIMAX, WLAN, 3GPP, UMTS, BLUETOOTH, and ZigBee, for example.
- the baseband processor 154may comprise suitable logic, circuitry, interface(s), and/or code that may be enabled to process baseband signals for transmission via the transceiver 152 and/or the baseband signals received from the transceiver 152 .
- the processor 156may be any suitable processor or controller such as a CPU, DSP, ARM, or any type of integrated circuit processor.
- the processor 156may comprise suitable logic, circuitry, and/or code that may be enabled to control the operations of the transceiver 152 and/or the baseband processor 154 .
- the processor 156may be utilized to update and/or modify programmable parameters and/or values in a plurality of components, devices, and/or processing elements in the transceiver 152 and/or the baseband processor 154 . At least a portion of the programmable parameters may be stored in the system memory 158 .
- Control and/or data informationwhich may comprise the programmable parameters, may be transferred from other portions of the wireless device 150 , not shown in FIG. 1 , to the processor 156 .
- the processor 156may be enabled to transfer control and/or data information, which may include the programmable parameters, to other portions of the wireless device 150 , not shown in FIG. 1 , which may be part of the wireless device 150 .
- the processor 156may utilize the received control and/or data information, which may comprise the programmable parameters, to determine an operating mode of the transceiver 152 .
- the processor 156may be utilized to select a specific frequency for a local oscillator, a specific gain for a variable gain amplifier, configure the local oscillator and/or configure the variable gain amplifier for operation in accordance with various embodiments of the invention.
- the specific frequency selected and/or parameters needed to calculate the specific frequency, and/or the specific gain value and/or the parameters, which may be utilized to calculate the specific gainmay be stored in the system memory 158 via the processor 156 , for example.
- the information stored in system memory 158may be transferred to the transceiver 152 from the system memory 158 via the processor 156 .
- the system memory 158may comprise suitable logic, circuitry, interface(s), and/or code that may be enabled to store a plurality of control and/or data information, including parameters needed to calculate frequencies and/or gain, and/or the frequency value and/or gain value.
- the system memory 158may store at least a portion of the programmable parameters that may be manipulated by the processor 156 .
- the logic block 160may comprise suitable logic, circuitry, interface(s), and/or code that may enable controlling of various functionalities of the wireless device 150 .
- the logic block 160may comprise one or more state machines that may generate signals to control the transceiver 152 and/or the baseband processor 154 .
- the logic block 160may also comprise registers that may hold data for controlling, for example, the transceiver 152 and/or the baseband processor 154 .
- the logic block 160may also generate and/or store status information that may be read by, for example, the processor 156 .
- Amplifier gains and/or filtering characteristics, for example,may be controlled by the logic block 160 .
- the BT radio/processor 163may comprise suitable circuitry, logic, interface(s), and/or code that may enable transmission and reception of Bluetooth signals.
- the BT radio/processor 163may enable processing and/or handling of BT baseband signals.
- the BT radio/processor 163may process or handle BT signals received and/or BT signals transmitted via a wireless communication medium.
- the BT radio/processor 163may also provide control and/or feedback information to/from the baseband processor 154 and/or the processor 156 , based on information from the processed BT signals.
- the BT radio/processor 163may communicate information and/or data from the processed BT signals to the processor 156 and/or to the system memory 158 .
- the BT radio/processor 163may receive information from the processor 156 and/or the system memory 158 , which may be processed and transmitted via the wireless communication medium a Bluetooth headset, for example
- the CODEC 172may comprise suitable circuitry, logic, interface(s), and/or code that may process audio signals received from and/or communicated to input/output devices.
- the input devicesmay be within or communicatively coupled to the wireless device 150 , and may comprise the analog microphone 168 , the stereo speakers 170 , the hearing aid compatible (HAC) coil 174 , the dual digital microphone 176 , and the vibration transducer 178 , for example.
- the CODEC 172may be operable to upconvert and/or downconvert signal frequencies to desired frequencies for processing and/or transmission via an output device.
- the CODEC 172may enable utilizing a plurality of digital audio inputs, such as 16 or 18 bit inputs, for example.
- the CODEC 172may also enable utilizing a plurality of data sampling rate inputs.
- the CODEC 172may accept digital audio signals at sampling rates such as 8 kHz, 11.025 kHz, 12 kHz, 16 kHz, 22.05 kHz, 24 kHz, 32 kHz, 44.1 kHz, and/or 48 kHz.
- the CODEC 172may also support mixing of a plurality of audio sources.
- the CODEC 172may support audio sources such as general audio, polyphonic ringer, I 2 S FM audio, vibration driving signals, and voice.
- the general audio and polyphonic ringer sourcesmay support the plurality of sampling rates that the audio CODEC 172 is enabled to accept, while the voice source may support a portion of the plurality of sampling rates, such as 8 kHz and 16 kHz, for example.
- the chip 162may comprise an integrated circuit with multiple functional blocks integrated within, such as the transceiver 152 , the processor 156 , the baseband processor 154 , the BT radio/processor 163 , the CODEC 172 , and the leaky wave antenna 164 A.
- the number of functional blocks integrated in the chip 162is not limited to the number shown in FIG. 1 . Accordingly, any number of blocks may be integrated on the chip 162 depending on chip space and wireless device 150 requirements, for example.
- the leaky wave antennas 164 A, 164 B, and 164 Cmay comprise a resonant cavity with a highly reflective surface and a lower reflectivity surface, and may be integrated in and/or on the chip 162 , the package 167 , and/or the printed circuit board 171 .
- the lower reflectivity surfacemay allow the resonant mode to “leak” out of the cavity.
- the lower reflectivity surface of the leaky wave antennas 164 A, 164 B, and 164 Cmay be configured with slots in a metal surface, or a pattern of metal patches, as described further in FIGS. 2 and 3 .
- the physical dimensions of the leaky wave antennas 164 A, 164 B, and 164 Cmay be configured to optimize bandwidth of transmission and/or the beam pattern radiated.
- the leaky wave antenna 164 Bmay be integrated in and/or on the package 167
- the leaky wave antenna 164 Cmay be integrated in and/or on the printed circuit board 171 to which the chip 162 may be affixed.
- the dimensions of the leaky wave antennas 164 B and 164 Cmay not be limited by the size of the chip 162 .
- the resonant cavity of the leaky wave antennas 164 A, 164 B, and/or 164 Cmay enable high gain of the antennas.
- the leaky wave antennas 164 A, 164 B, and/or 164 Cmay be operable to transmit the corresponding signals at the harmonic frequencies, which are applied to the leaky wave antennas 164 A, 164 B, and/or 164 C.
- the leaky wave antennas 164 A, 164 B, and/or 164 Cmay be configured at a resonance frequency that coincides with a harmonic of a supplied signal, which may comprise a square wave, for example.
- high frequency signalsmay be generated by the leaky wave antennas 164 A, 164 B, and/or 164 C without requiring electronics in the transceiver 152 to operate at the higher frequency.
- a source signal of 20 GHzmay be utilized to transmit a signal at 60 GHz by configuring the leaky wave antennas 164 A, 164 B, and/or 164 C with a resonant frequency at 60 GHz, the first harmonic of the fundamental frequency of 20 GHz.
- the external headset port 166may comprise a physical connection for an external headset to be communicatively coupled to the wireless device 150 .
- the analog microphone 168may comprise suitable circuitry, logic, interface(s), and/or code that may detect sound waves and convert them to electrical signals via a piezoelectric effect, for example.
- the electrical signals generated by the analog microphone 168may comprise analog signals that may require analog to digital conversion before processing.
- the package 167may comprise a ceramic package, a printed circuit board, or other support structure for the chip 162 and other components of the wireless device 150 .
- the chip 162may be bonded to the package 167 .
- the package 167may comprise insulating and conductive material, for example, and may provide isolation between electrical components mounted on the package 167 .
- the stereo speakers 170may comprise a pair of speakers that may be operable to generate audio signals from electrical signals received from the CODEC 172 .
- the HAG coil 174may comprise suitable circuitry, logic, and/or code that may enable communication between the wireless device 150 and a T-coil in a hearing aid, for example. In this manner, electrical audio signals may be communicated to a user that utilizes a hearing aid, without the need for generating sound signals via a speaker, such as the stereo speakers 170 , and converting the generated sound signals back to electrical signals in a hearing aid, and subsequently back into amplified sound signals in the user's ear, for example.
- the dual digital microphone 176may comprise suitable circuitry, logic, interface(s), and/or code that may be operable to detect sound waves and convert them to electrical signals.
- the electrical signals generated by the dual digital microphone 176may comprise digital signals, and thus may not require analog to digital conversion prior to digital processing in the CODEC 172 .
- the dual digital microphone 176may enable beamforming capabilities, for example.
- the vibration transducer 178may comprise suitable circuitry, logic, interface(s), and/or code that may enable notification of an incoming call, alerts and/or message to the wireless device 150 without the use of sound.
- the vibration transducermay generate vibrations that may be in synch with, for example, audio signals such as speech or music.
- control and/or data informationwhich may comprise the programmable parameters, may be transferred from other portions of the wireless device 150 , not shown in FIG. 1 , to the processor 156 .
- the processor 156may be enabled to transfer control and/or data information, which may include the programmable parameters, to other portions of the wireless device 150 , not shown in FIG. 1 , which may be part of the wireless device 150 .
- the processor 156may utilize the received control and/or data information, which may comprise the programmable parameters, to determine an operating mode of the transceiver 152 .
- the processor 156may be utilized to select a specific frequency for a local oscillator, a specific gain for a variable gain amplifier, configure the local oscillator and/or configure the variable gain amplifier for operation in accordance with various embodiments of the invention.
- the specific frequency selected and/or parameters needed to calculate the specific frequency, and/or the specific gain value and/or the parameters, which may be utilized to calculate the specific gainmay be stored in the system memory 158 via the processor 156 , for example.
- the information stored in system memory 158may be transferred to the transceiver 152 from the system memory 158 via the processor 156 .
- the CODEC 172 in the wireless device 150may communicate with the processor 156 in order to transfer audio data and control signals.
- Control registers for the CODEC 172may reside within the processor 156 .
- the processor 156may exchange audio signals and control information via the system memory 158 .
- the CODEC 172may upconvert and/or downconvert the frequencies of multiple audio sources for processing at a desired sampling rate.
- the leaky wave antennas 164 A, 164 B, and/or 164 Cmay be configured to transmit at a harmonic frequency of a signal received from the transceiver 152 .
- the leaky wave antennas 164 A, 164 B, and/or 164 Cmay be configured at a resonance frequency of 60 GHz.
- a 20 GHz signalmay be communicated from the transceiver 152 as a square wave, such as from a switching power amplifier.
- the leaky wave antennas 164 A, 164 B, and/or 164 Cmay transmit the first harmonic of the fundamental frequency of the source signal.
- the leaky wave antennas 164 A, 164 B, and/or 164 Cmay transmit a signal at 60 GHz from a source signal frequency of 20 GHz, since the first harmonic of the source signal may coincide with the resonance frequency of the leaky wave antennas 164 A, 164 B, and/or 164 C.
- FIG. 2is a block diagram illustrating an exemplary leaky wave antenna, in accordance with an embodiment of the invention.
- the leaky wave antenna 164 A, 164 B, and/or 164 Ccomprising a partially reflective surface 201 A, a reflective surface 201 B, and a feed point 203 .
- the space between the partially reflective surface 201 A and the reflective surface 201 Bmay be filled with dielectric material, for example, and the height, h, between the partially reflective surface 201 A and the reflective surface 201 B may be utilized to configure the frequency of transmission of the leaky wave antenna 164 A, 164 B, and/or 164 C.
- the feed point 203may comprise a input terminal for applying an input voltage to the leaky wave antenna 164 A, 164 B, and/or 164 C.
- the inventionis not limited to a single feed point 203 , as there may be any amount of feed points for different phases of signal, for example, to be applied to the leaky wave antenna 164 A, 164 B, and/or 164 C.
- the height, hmay be one-half the wavelength of the desired transmitted mode from the leaky wave antenna 164 A, 164 B, and/or 164 C.
- the phase of an electromagnetic mode that traverses the cavity twicemay be coherent with the input signal at the feed point 203 , thereby configuring a resonant cavity known as a Fabry-Perot cavity.
- the magnitude of the resonant modemay decay exponentially in the lateral direction from the feed point 203 , thereby reducing or eliminating the need for confinement structures to the sides of the leaky wave antenna 164 A, 164 B, and/or 164 C.
- the input impedance of the leaky wave antenna 164 A, 164 B, and/or 164 Cmay be configured by the vertical placement of the feed point 203 , as described further in FIG. 6 .
- a signal to be transmitted via a power amplifiermay be communicated to the feed point 203 of the leaky wave antennas 164 A, 164 B, and/or 164 C with a frequency f.
- the cavity height, hmay be configured to correlate to one half the wavelength of a harmonic of the signal of frequency f.
- the signalmay traverse the height of the cavity and may be reflected by the partially reflective surface 201 A, and then traverse the height back to the reflective surface 201 B. Since the wave will have travelled a distance corresponding to a full wavelength, constructive interference may result and a resonant mode may thereby be established.
- the leaky wave antennasmay enable the configuration of high gain antennas without the need for a large array of antennas which require a complex feed network and suffer from loss due to feed lines.
- the leaky wave antennas 164 A, 164 B, and/or 164 Cmay be integrated on or in a chip, package, or printed circuit board.
- the leaky wave antennas 164 A, 164 B, and/or 164 Cmay be configured at a harmonic of a signal communicated by a power amplifier, which may comprise a switching power amplifier, thereby generating a square wave.
- the leaky wave antennas 164 A, 164 B, and/or 164 Cmay transmit a signal at the desired harmonic frequency.
- the leaky wave antennas 164 A, 164 B, and/or 164 Cmay be configured at a resonance frequency of 60 GHz.
- a signal at 20 GHzmay be communicated from a power amplifier to the leaky wave antennas 164 A, 164 B, and/or 164 C, and a signal at the harmonic frequency of three times the fundamental frequency, or 60 GHz, may be transmitted.
- FIG. 3is a block diagram illustrating a plan view of exemplary partially reflective surfaces, in accordance with an embodiment of the invention.
- a partially reflective surface 300comprising periodic slots in a metal surface
- a partially reflective surface 320comprising periodic metal patches.
- the partially reflective surfaces 300 / 320may comprise different embodiments of the partially reflective surface 201 A described with respect to FIG. 2 .
- the spacing, dimensions, shape, and orientation of the slots and/or patches in the partially reflective surfaces 300 / 320may be utilized to configure the bandwidth, and thus Q-factor, of the resonant cavity defined by the partially reflective surfaces 300 / 320 and a reflective surface, such as the reflective surface 201 B, described with respect to FIG. 2 .
- the partially reflective surfaces 300 / 320may thus comprise frequency selective surfaces due to the narrow bandwidth of signals that may leak out of the structure as configured by the slots and/or patches.
- the spacing between the patches and/or slotsmay be related to wavelength of the signal transmitted and/or received, which may be somewhat similar to beamforming with multiple antennas.
- the length of the slots and/or patchesmay be several times larger than the wavelength of the transmitted and/or received signal or less, for example, since the leakage from the slots and/or regions surround the patches may add up, similar to beamforming with multiple antennas.
- the slots/patchesmay be configured via micro-electromechanical system (MEMS) switches to tune the Q of the resonant cavity.
- MEMSmicro-electromechanical system
- FIG. 4is a block diagram illustrating an exemplary phase dependence of a leaky wave antenna, in accordance with an embodiment of the invention.
- a leaky wave antennacomprising the partial reflective surface 201 A, the reflective surface 201 B, and the feed point 203 .
- In-phase condition 400illustrates the relative beam shape transmitted by the leaky wave antenna 164 A, 164 B, and/or 164 C when the frequency of the signal communicated to the feed point 203 matches that of the resonant cavity as defined by the cavity height, h, and the dielectric constant of the material between the reflective surfaces.
- out-of-phase condition 420illustrates the relative beam shape transmitted by the leaky wave antenna 164 A, 164 B, and/or 164 C when the frequency of the signal communicated to the feed point 203 does not match that of the resonant cavity.
- the resulting beam shapemay be conical, as opposed to a single main vertical node.
- FIG. 5is a block diagram illustrating exemplary in-phase and out-of-phase beam shapes for a leaky wave antenna, in accordance with an embodiment of the invention. Referring to FIG. 5 , there is shown a plot 500 of transmitted signal beam shape versus angle for the in-phase and out-of-phase conditions for a leaky wave antenna.
- the In-phase curve in the plot 500may correlate to the case where the frequency of the signal communicated to a leaky wave antenna matches the resonant frequency of the cavity. In this manner, a single vertical main node may result. In instances where the frequency of the signal at the feed point is not at the resonant frequency, a double, or conical-shaped node may be generated as shown by the Out-of-phase curve in the plot 500 .
- FIG. 6is a block diagram illustrating a leaky wave antenna with variable input impedance feed points, in accordance with an embodiment of the invention.
- a leaky wave antenna 600comprising the partially reflective surface 201 A and the reflective surface 201 B, There is also shown feed points 601 A- 601 C.
- the feed points 601 A- 601 Cmay be located at different positions along the height, h, of the cavity thereby configuring different impedance points for the leaky wave antenna.
- a leaky wave antennamay be utilized to couple to a plurality of power amplifiers with varying output impedances.
- a power amplifier with a higher output power and lower output impedancemay be coupled to a lower impedance feed point, such as the feed point 601 A.
- FIG. 7is a block diagram illustrating exemplary subharmonic transmission utilizing a leaky wave antenna, in accordance with an embodiment of the invention.
- a signal source 701a power amplifier (PA) 703 , and a leaky wave antenna 705 .
- PApower amplifier
- V DDsupply voltage
- the leaky wave antenna 705may be substantially similar to the leaky wave antennas 164 A, 164 B, and/or 1640 / 400 / 420 / 600 .
- the signal source 701may comprise suitable circuitry, logic, interfaces, and/or code that may be operable to generate a signal to be transmitted.
- the signal source 701may comprise a mixer or another PA that may communicate an RF signal to the PA 703 .
- the PA 703may comprise suitable circuitry, logic, interfaces, and/or code that may be operable to amplify a received signal.
- the PA 703may comprise a switching PA, thereby generating a square wave output from a sinusoidal input,
- the signal source 701may be operable to communicate a square wave to the PA 703 .
- the supply voltage V DDmay be coupled to a reflective surface of the leaky wave antenna 705 , such as the partially reflective surface 201 A or the reflective surface 201 B described with respect to FIG. 3 .
- V DDamplitude modulation of the signal transmitted by the leaky wave antenna 705 .
- the signal source 701may communicate a signal at a harmonic frequency f to the PA 703 .
- the PA 703may comprise a switching PA such that the output signal of the PA 703 may comprise a square wave.
- the signal source 701may generate a square wave signal to be amplified by the PA 703 .
- the leaky wave antenna 705may be configured with a resonance frequency at a harmonic of the fundamental frequency f, such as the first harmonic frequency of 3*f, for example. In this manner, the leaky wave antenna 705 may transmit a signal at a frequency that is the first harmonic of the source signal at frequency f.
- the leaky wave antenna 705may be configured with a resonance frequency of 60 GHz at the first harmonic of the source signal frequency, f, of 20 GHz.
- driving circuitry, such as the signal source 701 and the PA 703may be configured for 20 GHz operation while enabling 60 GHz transmission due to the high gain of the leaky wave antenna 705 .
- the PA 703may comprise a low noise amplifier for receiving signals from the leaky wave antenna 705 .
- signalsmay be received by the leaky wave antenna 705 at a harmonic of a transmitted signal.
- the 20 GHz harmonic of a 60 GHz signalmay be received by the leaky wave antenna 705 if configured for a 20 GHz resonant frequency.
- FIG. 8is a block diagram illustrating exemplary steps for a subharmonic transmitter utilizing a leaky wave antenna, in accordance with an embodiment of the invention.
- a signal sourcemay be configured at a fundamental frequency.
- a signalmay be generated and amplified at the fundamental frequency, followed by step 807 where a harmonic of the fundamental frequency may be transmitted by a leaky wave antenna with a resonant frequency at the harmonic of the fundamental frequency.
- the wireless device 150is to be powered down, the exemplary steps may proceed to end step 811 . In instances when the wireless device 150 is not to be powered down, the exemplary steps may proceed back to step 803 to configure the signal source.
- a method and systemfor transmitting wireless signals at a harmonic frequency of a source signal utilizing one or more leaky wave antennas 164 A, 164 B, 164 C, 400 , 420 , 600 , and 705 in a wireless device 150 comprising one or more transceivers 152 on a chip 162 .
- the one or more leaky wave antennas 164 A, 164 B, 164 C, 400 , 420 , 600 , and 705may be configured with a resonant frequency at the harmonic frequency.
- the source signalmay be communicated to the one or more of the leaky wave antennas 164 A, 164 B, 164 C, 400 , 420 , 600 , and 705 utilizing a power amplifier 703 , which may be operated in switching mode thereby generating a square wave from the source signal.
- the one or more leaky wave antennas 164 A, 164 B, 164 C, 400 , 420 , 600 , and 705may be integrated on the chip 162 , on a package 167 to which the chip 162 is affixed and/or on a printed circuit board 171 to which the chip 162 is affixed.
- the harmonic frequencymay be three times a frequency of the source signal.
- the transmitted wireless signalmay be amplitude modulated utilizing a bias voltage V DD applied to the one or more leaky wave antennas 164 A, 164 B, 164 C, 400 , 420 , 600 , and 705 .
- Another embodiment of the inventionmay provide a machine and/or computer readable storage and/or medium, having stored thereon, a machine code and/or a computer program having at least one code section executable by a machine and/or a computer, thereby causing the machine and/or computer to perform the steps as described herein for a subharmonic transmitter utilizing a leaky wave antenna.
- aspects of the inventionmay be realized in hardware, software, firmware or a combination thereof.
- the inventionmay be realized in a centralized fashion in at least one computer system or in a distributed fashion where different elements are spread across several interconnected computer systems. Any kind of computer system or other apparatus adapted for carrying out the methods described herein is suited.
- a typical combination of hardware, software and firmwaremay be a general-purpose computer system with a computer program that, when being loaded and executed, controls the computer system such that it carries out the methods described herein.
- One embodiment of the present inventionmay be implemented as a board level product, as a single chip, application specific integrated circuit (ASIC), or with varying levels integrated on a single chip with other portions of the system as separate components.
- the degree of integration of the systemwill primarily be determined by speed and cost considerations. Because of the sophisticated nature of modern processors, it is possible to utilize a commercially available processor, which may be implemented external to an ASIC implementation of the present system. Alternatively, if the processor is available as an ASIC core or logic block, then the commercially available processor may be implemented as part of an ASIC device with various functions implemented as firmware.
- the present inventionmay also be embedded in a computer program product, which comprises all the features enabling the implementation of the methods described herein, and which when loaded in a computer system is able to carry out these methods.
- Computer program in the present contextmay mean, for example, any expression, in any language, code or notation, of a set of instructions intended to cause a system having an information processing capability to perform a particular function either directly or after either or both of the following: a) conversion to another language, code or notation; b) reproduction in a different material form.
- other meanings of computer programwithin the understanding of those skilled in the art are also contemplated by the present invention.
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Abstract
Description
- This application makes reference to and claims priority to U.S. Provisional Application Ser. No. 61/246,618 filed on Sep. 29, 2009, and U.S. Provisional Application Ser. No. 61/185,245 filed on Jun. 9, 2009.
- This application also makes reference to:
- U.S. patent application Ser. No.______ (Attorney Docket No. 21181US02) filed on even date herewith;
- U.S. patent application Ser. No.______ (Attorney Docket No. 21205US02) filed on even date herewith;
- U.S. patent application Ser. No.______ (Attorney Docket No. 21211US02) filed on even date herewith;
- U.S. patent application Ser. No.______ (Attorney Docket No. 21214US02) filed on even date herewith;
- U.S. patent application Ser. No.______ (Attorney Docket No. 21227US02) filed on even date herewith;
- U.S. patent application Ser. No.______ (Attorney Docket No. 21231US02) filed on even date herewith;
- U.S. patent application Ser. No.______ (Attorney Docket No. 21232US02) filed on even date herewith; and
- U.S. patent application Ser. No.______ (Attorney Docket No. 21233US02) filed on even date herewith.
- Each of the above stated applications is hereby incorporated herein by reference in its entirety.
- [Not Applicable]
- [Not Applicable]
- Certain embodiments of the invention relate to wireless communication. More specifically, certain embodiments of the invention relate to a method and system for a subharmonic transmitter utilizing a leaky wave antenna.
- Mobile communications have changed the way people communicate and mobile phones have been transformed from a luxury item to an essential part of every day life. The use of mobile phones is today dictated by social situations, rather than hampered by location or technology. White voice connections fulfill the basic need to communicate, and mobile voice connections continue to filter even further into the fabric of every day life, the mobile Internet is the next step in the mobile communication revolution. The mobile Internet is poised to become a common source of everyday information, and easy, versatile mobile access to this data will be taken for granted.
- As the number of electronic devices enabled for wireline and/or mobile communications continues to increase, significant efforts exist with regard to making such devices more power efficient. For example, a large percentage of communications devices are mobile wireless devices and thus often operate on battery power. Additionally, transmit and/or receive circuitry within such mobile wireless devices often account for a significant portion of the power consumed within these devices. Moreover, in some conventional communication systems, transmitters and/or receivers are often power inefficient in comparison to other blocks of the portable communication devices. Accordingly, these transmitters and/or receivers have a significant impact on battery life for these mobile wireless devices.
- Further limitations and disadvantages of conventional and traditional approaches will become apparent to one of skill in the art, through comparison of such systems with the present invention as set forth in the remainder of the present application with reference to the drawings.
- A system and/or method for a sub-harmonic transmitter utilizing a leaky wave antenna, substantially as shown in and/or described in connection with at least one of the figures, as set forth more completely in the claims.
- Various advantages, aspects and novel features of the present invention, as well as details of an illustrated embodiment thereof, will be more fully understood from the following description and drawings.
FIG. 1 is a block diagram of an exemplary wireless system with a sub-harmonic transmitter utilizing a leaky wave antenna, which may be utilized in accordance with an embodiment of the invention.FIG. 2 is a block diagram illustrating an exemplary leaky wave antenna, in accordance with an embodiment of the invention.FIG. 3 is a block diagram illustrating a plan view of exemplary partially reflective surfaces, in accordance with an embodiment of the invention.FIG. 4 is a block diagram illustrating an exemplary phase dependence of a leaky wave antenna, in accordance with an embodiment of the invention.FIG. 5 is a block diagram illustrating exemplary in-phase and out-of-phase beam shapes for a leaky wave antenna, in accordance with an embodiment of the invention.FIG. 6 is a block diagram illustrating a leaky wave antenna with variable input impedance feed points, in accordance with an embodiment of the invention.FIG. 7 is a block diagram illustrating exemplary sub-harmonic transmission utilizing a leaky wave antenna, in accordance with an embodiment of the invention.FIG. 8 is a block diagram illustrating exemplary steps for a sub-harmonic transmitter utilizing a leaky wave antenna, in accordance with an embodiment of the invention.- Certain aspects of the invention may be found in a method and system for a sub-harmonic transmitter utilizing a leaky wave antenna. Exemplary aspects of the invention may comprise transmitting wireless signals at a harmonic frequency of a source signal utilizing one or more leaky wave antennas in a wireless device comprising one or more transceivers on a chip. The one or more leaky wave antennas may be configured with a resonant frequency at the harmonic frequency. The source signal may be communicated to the one or more leaky wave antennas utilizing a power amplifier, which may be operated in a switching mode thereby generating a square wave from the source signal. The one or more leaky wave antennas may be integrated on the chip, on a package to which the chip is affixed and/or on a printed circuit board to which the chip is affixed. In accordance with an exemplary embodiment of the invention, the harmonic frequency may be three times a frequency of the source signal. The transmitted wireless signal may be amplitude modulated utilizing a bias voltage applied to the one or more leaky wave antennas.
FIG. 1 is a block diagram of an exemplary wireless system with a sub harmonic transmitter utilizing a leaky wave antenna, which may be utilized in accordance with an embodiment of the invention. Referring toFIG. 1 , thewireless device 150 may comprise anantenna 151, atransceiver 152, abaseband processor 154, aprocessor 156, asystem memory 158, alogic block 160, achip 162,leaky wave antennas external headset port 166, and apackage 167. Thewireless device 150 may also comprise ananalog microphone 168, integrated hands free (IHF)stereo speakers 170, aprinted circuit board 171, a hearing aid compatible (HAC)coil 174, a dualdigital microphone 176, avibration transducer 178, a keypad and/ortouchscreen 180, and adisplay 182.- The
transceiver 152 may comprise suitable logic, circuitry, interface(s), and/or code that may be enabled to modulate and upconvert baseband signals to RF signals for transmission by one or more antennas, which may be represented generically by theantenna 151. Thetransceiver 152 may also be enabled to downconvert and demodulate received RF signals to baseband signals. The RF signals may be received by one or more antennas, which may be represented generically by theantenna 151, or theleaky wave antennas transceiver 152 may be enabled to execute other functions, for example, filtering the baseband and/or RF signals, and/or amplifying the baseband and/or RF signals. Although asingle transceiver 152 is shown, the invention is not so limited. Accordingly, thetransceiver 152 may be implemented as a separate transmitter and a separate receiver. In addition, there may be a plurality of transceivers, transmitters and/or receivers. In this regard, the plurality of transceivers, transmitters and/or receivers may enable thewireless device 150 to handle a plurality of wireless protocols and/or standards including cellular, WLAN and PAN. Wireless technologies handled by thewireless device 150 may comprise GSM, CDMA, CDMA2000, WCDMA, GMS, GPRS, EDGE, WIMAX, WLAN, 3GPP, UMTS, BLUETOOTH, and ZigBee, for example. - The
baseband processor 154 may comprise suitable logic, circuitry, interface(s), and/or code that may be enabled to process baseband signals for transmission via thetransceiver 152 and/or the baseband signals received from thetransceiver 152. Theprocessor 156 may be any suitable processor or controller such as a CPU, DSP, ARM, or any type of integrated circuit processor. Theprocessor 156 may comprise suitable logic, circuitry, and/or code that may be enabled to control the operations of thetransceiver 152 and/or thebaseband processor 154. For example, theprocessor 156 may be utilized to update and/or modify programmable parameters and/or values in a plurality of components, devices, and/or processing elements in thetransceiver 152 and/or thebaseband processor 154. At least a portion of the programmable parameters may be stored in thesystem memory 158. - Control and/or data information, which may comprise the programmable parameters, may be transferred from other portions of the
wireless device 150, not shown inFIG. 1 , to theprocessor 156. Similarly, theprocessor 156 may be enabled to transfer control and/or data information, which may include the programmable parameters, to other portions of thewireless device 150, not shown inFIG. 1 , which may be part of thewireless device 150. - The
processor 156 may utilize the received control and/or data information, which may comprise the programmable parameters, to determine an operating mode of thetransceiver 152. For example, theprocessor 156 may be utilized to select a specific frequency for a local oscillator, a specific gain for a variable gain amplifier, configure the local oscillator and/or configure the variable gain amplifier for operation in accordance with various embodiments of the invention. Moreover, the specific frequency selected and/or parameters needed to calculate the specific frequency, and/or the specific gain value and/or the parameters, which may be utilized to calculate the specific gain, may be stored in thesystem memory 158 via theprocessor 156, for example. The information stored insystem memory 158 may be transferred to thetransceiver 152 from thesystem memory 158 via theprocessor 156. - The
system memory 158 may comprise suitable logic, circuitry, interface(s), and/or code that may be enabled to store a plurality of control and/or data information, including parameters needed to calculate frequencies and/or gain, and/or the frequency value and/or gain value. Thesystem memory 158 may store at least a portion of the programmable parameters that may be manipulated by theprocessor 156. - The
logic block 160 may comprise suitable logic, circuitry, interface(s), and/or code that may enable controlling of various functionalities of thewireless device 150. For example, thelogic block 160 may comprise one or more state machines that may generate signals to control thetransceiver 152 and/or thebaseband processor 154. Thelogic block 160 may also comprise registers that may hold data for controlling, for example, thetransceiver 152 and/or thebaseband processor 154. Thelogic block 160 may also generate and/or store status information that may be read by, for example, theprocessor 156. Amplifier gains and/or filtering characteristics, for example, may be controlled by thelogic block 160. - The BT radio/
processor 163 may comprise suitable circuitry, logic, interface(s), and/or code that may enable transmission and reception of Bluetooth signals. The BT radio/processor 163 may enable processing and/or handling of BT baseband signals. In this regard, the BT radio/processor 163 may process or handle BT signals received and/or BT signals transmitted via a wireless communication medium. The BT radio/processor 163 may also provide control and/or feedback information to/from thebaseband processor 154 and/or theprocessor 156, based on information from the processed BT signals. The BT radio/processor 163 may communicate information and/or data from the processed BT signals to theprocessor 156 and/or to thesystem memory 158. Moreover, the BT radio/processor 163 may receive information from theprocessor 156 and/or thesystem memory 158, which may be processed and transmitted via the wireless communication medium a Bluetooth headset, for example - The
CODEC 172 may comprise suitable circuitry, logic, interface(s), and/or code that may process audio signals received from and/or communicated to input/output devices. The input devices may be within or communicatively coupled to thewireless device 150, and may comprise theanalog microphone 168, thestereo speakers 170, the hearing aid compatible (HAC)coil 174, the dualdigital microphone 176, and thevibration transducer 178, for example. TheCODEC 172 may be operable to upconvert and/or downconvert signal frequencies to desired frequencies for processing and/or transmission via an output device. TheCODEC 172 may enable utilizing a plurality of digital audio inputs, such as 16 or 18 bit inputs, for example. TheCODEC 172 may also enable utilizing a plurality of data sampling rate inputs. For example, theCODEC 172 may accept digital audio signals at sampling rates such as 8 kHz, 11.025 kHz, 12 kHz, 16 kHz, 22.05 kHz, 24 kHz, 32 kHz, 44.1 kHz, and/or 48 kHz. TheCODEC 172 may also support mixing of a plurality of audio sources. For example, theCODEC 172 may support audio sources such as general audio, polyphonic ringer, I2S FM audio, vibration driving signals, and voice. In this regard, the general audio and polyphonic ringer sources may support the plurality of sampling rates that theaudio CODEC 172 is enabled to accept, while the voice source may support a portion of the plurality of sampling rates, such as 8 kHz and 16 kHz, for example. - The
chip 162 may comprise an integrated circuit with multiple functional blocks integrated within, such as thetransceiver 152, theprocessor 156, thebaseband processor 154, the BT radio/processor 163, theCODEC 172, and theleaky wave antenna 164A. The number of functional blocks integrated in thechip 162 is not limited to the number shown inFIG. 1 . Accordingly, any number of blocks may be integrated on thechip 162 depending on chip space andwireless device 150 requirements, for example. - The
leaky wave antennas chip 162, thepackage 167, and/or the printedcircuit board 171. The lower reflectivity surface may allow the resonant mode to “leak” out of the cavity. The lower reflectivity surface of theleaky wave antennas FIGS. 2 and 3 . The physical dimensions of theleaky wave antennas leaky wave antenna 164B may be integrated in and/or on thepackage 167, and theleaky wave antenna 164C may be integrated in and/or on the printedcircuit board 171 to which thechip 162 may be affixed. In this manner, the dimensions of theleaky wave antennas chip 162. - The resonant cavity of the
leaky wave antennas leaky wave antennas leaky wave antennas leaky wave antennas leaky wave antennas transceiver 152 to operate at the higher frequency. For example, a source signal of 20 GHz may be utilized to transmit a signal at 60 GHz by configuring theleaky wave antennas - The
external headset port 166 may comprise a physical connection for an external headset to be communicatively coupled to thewireless device 150. Theanalog microphone 168 may comprise suitable circuitry, logic, interface(s), and/or code that may detect sound waves and convert them to electrical signals via a piezoelectric effect, for example. The electrical signals generated by theanalog microphone 168 may comprise analog signals that may require analog to digital conversion before processing. - The
package 167 may comprise a ceramic package, a printed circuit board, or other support structure for thechip 162 and other components of thewireless device 150. in this regard, thechip 162 may be bonded to thepackage 167. Thepackage 167 may comprise insulating and conductive material, for example, and may provide isolation between electrical components mounted on thepackage 167. - The
stereo speakers 170 may comprise a pair of speakers that may be operable to generate audio signals from electrical signals received from theCODEC 172. TheHAG coil 174 may comprise suitable circuitry, logic, and/or code that may enable communication between thewireless device 150 and a T-coil in a hearing aid, for example. In this manner, electrical audio signals may be communicated to a user that utilizes a hearing aid, without the need for generating sound signals via a speaker, such as thestereo speakers 170, and converting the generated sound signals back to electrical signals in a hearing aid, and subsequently back into amplified sound signals in the user's ear, for example. - The dual
digital microphone 176 may comprise suitable circuitry, logic, interface(s), and/or code that may be operable to detect sound waves and convert them to electrical signals. The electrical signals generated by the dualdigital microphone 176 may comprise digital signals, and thus may not require analog to digital conversion prior to digital processing in theCODEC 172. The dualdigital microphone 176 may enable beamforming capabilities, for example. - The
vibration transducer 178 may comprise suitable circuitry, logic, interface(s), and/or code that may enable notification of an incoming call, alerts and/or message to thewireless device 150 without the use of sound. The vibration transducer may generate vibrations that may be in synch with, for example, audio signals such as speech or music. - In operation, control and/or data information, which may comprise the programmable parameters, may be transferred from other portions of the
wireless device 150, not shown inFIG. 1 , to theprocessor 156. Similarly, theprocessor 156 may be enabled to transfer control and/or data information, which may include the programmable parameters, to other portions of thewireless device 150, not shown inFIG. 1 , which may be part of thewireless device 150. - The
processor 156 may utilize the received control and/or data information, which may comprise the programmable parameters, to determine an operating mode of thetransceiver 152. For example, theprocessor 156 may be utilized to select a specific frequency for a local oscillator, a specific gain for a variable gain amplifier, configure the local oscillator and/or configure the variable gain amplifier for operation in accordance with various embodiments of the invention. Moreover, the specific frequency selected and/or parameters needed to calculate the specific frequency, and/or the specific gain value and/or the parameters, which may be utilized to calculate the specific gain, may be stored in thesystem memory 158 via theprocessor 156, for example. The information stored insystem memory 158 may be transferred to thetransceiver 152 from thesystem memory 158 via theprocessor 156. - The
CODEC 172 in thewireless device 150 may communicate with theprocessor 156 in order to transfer audio data and control signals. Control registers for theCODEC 172 may reside within theprocessor 156. Theprocessor 156 may exchange audio signals and control information via thesystem memory 158. TheCODEC 172 may upconvert and/or downconvert the frequencies of multiple audio sources for processing at a desired sampling rate. - The
leaky wave antennas transceiver 152. For example, theleaky wave antennas transceiver 152 as a square wave, such as from a switching power amplifier. Theleaky wave antennas leaky wave antennas leaky wave antennas FIG. 2 is a block diagram illustrating an exemplary leaky wave antenna, in accordance with an embodiment of the invention. Referring toFIG. 2 , there is shown theleaky wave antenna reflective surface 201A, areflective surface 201B, and afeed point 203. The space between the partiallyreflective surface 201A and thereflective surface 201B may be filled with dielectric material, for example, and the height, h, between the partiallyreflective surface 201A and thereflective surface 201B may be utilized to configure the frequency of transmission of theleaky wave antenna - The
feed point 203 may comprise a input terminal for applying an input voltage to theleaky wave antenna single feed point 203, as there may be any amount of feed points for different phases of signal, for example, to be applied to theleaky wave antenna - In an embodiment of the invention, the height, h, may be one-half the wavelength of the desired transmitted mode from the
leaky wave antenna feed point 203, thereby configuring a resonant cavity known as a Fabry-Perot cavity. The magnitude of the resonant mode may decay exponentially in the lateral direction from thefeed point 203, thereby reducing or eliminating the need for confinement structures to the sides of theleaky wave antenna leaky wave antenna feed point 203, as described further inFIG. 6 . - In operation, a signal to be transmitted via a power amplifier may be communicated to the
feed point 203 of theleaky wave antennas reflective surface 201A, and then traverse the height back to thereflective surface 201B. Since the wave will have travelled a distance corresponding to a full wavelength, constructive interference may result and a resonant mode may thereby be established. - The leaky wave antennas may enable the configuration of high gain antennas without the need for a large array of antennas which require a complex feed network and suffer from loss due to feed lines. The
leaky wave antennas leaky wave antennas leaky wave antennas leaky wave antennas leaky wave antennas FIG. 3 is a block diagram illustrating a plan view of exemplary partially reflective surfaces, in accordance with an embodiment of the invention. Referring toFIG. 3 , there is shown a partiallyreflective surface 300 comprising periodic slots in a metal surface, and a partiallyreflective surface 320 comprising periodic metal patches. The partiallyreflective surfaces 300/320 may comprise different embodiments of the partiallyreflective surface 201A described with respect toFIG. 2 .- The spacing, dimensions, shape, and orientation of the slots and/or patches in the partially
reflective surfaces 300/320 may be utilized to configure the bandwidth, and thus Q-factor, of the resonant cavity defined by the partiallyreflective surfaces 300/320 and a reflective surface, such as thereflective surface 201B, described with respect toFIG. 2 . The partiallyreflective surfaces 300/320 may thus comprise frequency selective surfaces due to the narrow bandwidth of signals that may leak out of the structure as configured by the slots and/or patches. - The spacing between the patches and/or slots may be related to wavelength of the signal transmitted and/or received, which may be somewhat similar to beamforming with multiple antennas. The length of the slots and/or patches may be several times larger than the wavelength of the transmitted and/or received signal or less, for example, since the leakage from the slots and/or regions surround the patches may add up, similar to beamforming with multiple antennas.
- In an embodiment of the invention, the slots/patches may be configured via micro-electromechanical system (MEMS) switches to tune the Q of the resonant cavity.
FIG. 4 is a block diagram illustrating an exemplary phase dependence of a leaky wave antenna, in accordance with an embodiment of the invention. Referring toFIG. 4 , there is shown a leaky wave antenna comprising the partialreflective surface 201A, thereflective surface 201B, and thefeed point 203. In-phase condition 400 illustrates the relative beam shape transmitted by theleaky wave antenna feed point 203 matches that of the resonant cavity as defined by the cavity height, h, and the dielectric constant of the material between the reflective surfaces.- Similarly, out-of-
phase condition 420 illustrates the relative beam shape transmitted by theleaky wave antenna feed point 203 does not match that of the resonant cavity. The resulting beam shape may be conical, as opposed to a single main vertical node. These are illustrated further with respect toFIG. 5 . FIG. 5 is a block diagram illustrating exemplary in-phase and out-of-phase beam shapes for a leaky wave antenna, in accordance with an embodiment of the invention. Referring toFIG. 5 , there is shown aplot 500 of transmitted signal beam shape versus angle for the in-phase and out-of-phase conditions for a leaky wave antenna.- The In-phase curve in the
plot 500 may correlate to the case where the frequency of the signal communicated to a leaky wave antenna matches the resonant frequency of the cavity. In this manner, a single vertical main node may result. In instances where the frequency of the signal at the feed point is not at the resonant frequency, a double, or conical-shaped node may be generated as shown by the Out-of-phase curve in theplot 500. FIG. 6 is a block diagram illustrating a leaky wave antenna with variable input impedance feed points, in accordance with an embodiment of the invention. Referring toFIG. 6 , there is shown aleaky wave antenna 600 comprising the partiallyreflective surface 201A and thereflective surface 201B, There is also shown feed points601A-601C. The feed points601A-601C may be located at different positions along the height, h, of the cavity thereby configuring different impedance points for the leaky wave antenna.- In this manner, a leaky wave antenna may be utilized to couple to a plurality of power amplifiers with varying output impedances. For example, in instances where a higher harmonic is to be transmitted by the
leaky wave antenna 600, a power amplifier with a higher output power and lower output impedance may be coupled to a lower impedance feed point, such as thefeed point 601A. FIG. 7 is a block diagram illustrating exemplary subharmonic transmission utilizing a leaky wave antenna, in accordance with an embodiment of the invention. Referring toFIG. 7 , there is shown asignal source 701, a power amplifier (PA)703, and a leaky wave antenna705. There is also shown a supply voltage VDD. The leaky wave antenna705 may be substantially similar to theleaky wave antennas - The
signal source 701 may comprise suitable circuitry, logic, interfaces, and/or code that may be operable to generate a signal to be transmitted. For example, thesignal source 701 may comprise a mixer or another PA that may communicate an RF signal to thePA 703. - The
PA 703 may comprise suitable circuitry, logic, interfaces, and/or code that may be operable to amplify a received signal. In an embodiment of the invention, thePA 703 may comprise a switching PA, thereby generating a square wave output from a sinusoidal input, In another embodiment of the invention, thesignal source 701 may be operable to communicate a square wave to thePA 703. - The supply voltage VDDmay be coupled to a reflective surface of the leaky wave antenna705, such as the partially
reflective surface 201A or thereflective surface 201B described with respect toFIG. 3 . By varying the voltage VDD, amplitude modulation of the signal transmitted by the leaky wave antenna705. - In operation, the
signal source 701 may communicate a signal at a harmonic frequency f to thePA 703. In an embodiment of the invention, thePA 703 may comprise a switching PA such that the output signal of thePA 703 may comprise a square wave. In another embodiment of the invention, thesignal source 701 may generate a square wave signal to be amplified by thePA 703. - The leaky wave antenna705 may be configured with a resonance frequency at a harmonic of the fundamental frequency f, such as the first harmonic frequency of 3*f, for example. In this manner, the leaky wave antenna705 may transmit a signal at a frequency that is the first harmonic of the source signal at frequency f. For example, the leaky wave antenna705 may be configured with a resonance frequency of 60 GHz at the first harmonic of the source signal frequency, f, of 20 GHz. Thus, driving circuitry, such as the
signal source 701 and thePA 703 may be configured for 20 GHz operation while enabling 60 GHz transmission due to the high gain of the leaky wave antenna705. - In another embodiment of the invention, the
PA 703 may comprise a low noise amplifier for receiving signals from the leaky wave antenna705. In this manner, signals may be received by the leaky wave antenna705 at a harmonic of a transmitted signal. For example, the 20 GHz harmonic of a 60 GHz signal may be received by the leaky wave antenna705 if configured for a 20 GHz resonant frequency. FIG. 8 is a block diagram illustrating exemplary steps for a subharmonic transmitter utilizing a leaky wave antenna, in accordance with an embodiment of the invention. Referring toFIG. 8 , instep 803 afterstart step 801, a signal source may be configured at a fundamental frequency. Instep 805, a signal may be generated and amplified at the fundamental frequency, followed bystep 807 where a harmonic of the fundamental frequency may be transmitted by a leaky wave antenna with a resonant frequency at the harmonic of the fundamental frequency. If, instep 809, thewireless device 150 is to be powered down, the exemplary steps may proceed to endstep 811. In instances when thewireless device 150 is not to be powered down, the exemplary steps may proceed back to step803 to configure the signal source.- In an embodiment of the invention, a method and system are disclosed for transmitting wireless signals at a harmonic frequency of a source signal utilizing one or more
leaky wave antennas wireless device 150 comprising one ormore transceivers 152 on achip 162. The one or moreleaky wave antennas leaky wave antennas power amplifier 703, which may be operated in switching mode thereby generating a square wave from the source signal. The one or moreleaky wave antennas chip 162, on apackage 167 to which thechip 162 is affixed and/or on a printedcircuit board 171 to which thechip 162 is affixed. In an exemplary embodiment of the invention, the harmonic frequency may be three times a frequency of the source signal. The transmitted wireless signal may be amplitude modulated utilizing a bias voltage VDDapplied to the one or moreleaky wave antennas - Another embodiment of the invention may provide a machine and/or computer readable storage and/or medium, having stored thereon, a machine code and/or a computer program having at least one code section executable by a machine and/or a computer, thereby causing the machine and/or computer to perform the steps as described herein for a subharmonic transmitter utilizing a leaky wave antenna.
- Accordingly, aspects of the invention may be realized in hardware, software, firmware or a combination thereof. The invention may be realized in a centralized fashion in at least one computer system or in a distributed fashion where different elements are spread across several interconnected computer systems. Any kind of computer system or other apparatus adapted for carrying out the methods described herein is suited. A typical combination of hardware, software and firmware may be a general-purpose computer system with a computer program that, when being loaded and executed, controls the computer system such that it carries out the methods described herein.
- One embodiment of the present invention may be implemented as a board level product, as a single chip, application specific integrated circuit (ASIC), or with varying levels integrated on a single chip with other portions of the system as separate components. The degree of integration of the system will primarily be determined by speed and cost considerations. Because of the sophisticated nature of modern processors, it is possible to utilize a commercially available processor, which may be implemented external to an ASIC implementation of the present system. Alternatively, if the processor is available as an ASIC core or logic block, then the commercially available processor may be implemented as part of an ASIC device with various functions implemented as firmware.
- The present invention may also be embedded in a computer program product, which comprises all the features enabling the implementation of the methods described herein, and which when loaded in a computer system is able to carry out these methods. Computer program in the present context may mean, for example, any expression, in any language, code or notation, of a set of instructions intended to cause a system having an information processing capability to perform a particular function either directly or after either or both of the following: a) conversion to another language, code or notation; b) reproduction in a different material form. However, other meanings of computer program within the understanding of those skilled in the art are also contemplated by the present invention.
- While the invention has been described with reference to certain embodiments, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted without departing from the scope of the present invention. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the present invention without departing from its scope. Therefore, it is intended that the present invention not be limited to the particular embodiments disclosed, but that the present invention will include all embodiments falling within the scope of the appended claims.
Claims (19)
1-20. (canceled)
21. A wireless communication system comprising:
a circuit comprising one or more transmitters, said circuit integrated on a chip, wherein:
said circuits is operable to transmit wireless signals at a harmonic frequency of a source signal, said wireless signals generated by a leaky wave antenna;
said circuits is operable to amplitude modulate said wireless signals utilizing a bias voltage applied to said leaky wave antenna.
22. The wireless communication system ofclaim 21 , wherein said leaky wave antennas is configured with a resonant frequency at said harmonic frequency.
23. The wireless communication system ofclaim 21 , wherein said circuit comprises a power amplifier, said circuit being operable to communicate said source signal to said leaky wave antenna utilizing said power amplifier.
24. The wireless communication system ofclaim 23 , wherein said circuit operates said power amplifier in switching mode.
25. The wireless communication system ofclaim 24 , wherein said circuit is operable to generate a square wave from said source signal utilizing said power amplifier operating in said switching mode.
26. The wireless communication system ofclaim 21 , wherein said leaky wave antenna is integrated on said chip.
27. The wireless communication system ofclaim 21 , wherein said leaky wave antenna is integrated on a package to which said chip is affixed.
28. The wireless communication system ofclaim 21 , wherein said leaky wave antenna is integrated on a printed circuit board to which said chip is affixed.
29. The wireless communication system ofclaim 21 , wherein said wireless communication system is configured to utilize a wireless communication standard selected from the group consisting of GSM, CDMA, CDMA2000, WCDMA, GMS, GPRS, EDGE, WIMAX, WLAN, 3GPP, UMTS, BLUETOOTH, and ZigBee, wireless communication standards.
30. A method for wireless communication, said method comprising:
in a chip comprising one or more transmitters, transmitting wireless signals at a harmonic frequency of a source signal, said wireless signals generated by a leaky wave antenna; and
amplitude modulating said wireless signals utilizing a bias voltage applied to said leaky wave antenna.
31. The method ofclaim 30 , wherein said leaky wave antennas is configured with a resonant frequency at said harmonic frequency.
32. The method ofclaim 30 , wherein said circuit comprises a power amplifier, said circuit being operable to communicate said source signal to said leaky wave antenna utilizing said power amplifier.
33. The method ofclaim 32 , wherein said circuit operates said power amplifier in switching mode.
34. The method ofclaim 33 , wherein said circuit is operable to generate a square wave from said source signal utilizing said power amplifier operating in said switching mode.
35. The method ofclaim 30 , wherein said leaky wave antenna is integrated on said chip.
36. The method ofclaim 30 , wherein said leaky wave antenna is integrated on a package to which said chip is affixed.
37. The method ofclaim 30 , wherein said leaky wave antenna is integrated on a printed circuit board to which said chip is affixed.
38. The method ofclaim 30 comprising utilizing a wireless communication standard selected from the group consisting of GSM, CDMA, CDMA2000, WCDMA, GMS, GPRS, EDGE, WIMAX, WLAN, 3GPP, UMTS, BLUETOOTH, and ZigBee, wireless communication standards.
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| US12/650,292Expired - Fee RelatedUS8285231B2 (en) | 2009-06-09 | 2009-12-30 | Method and system for an integrated leaky wave antenna-based transmitter and on-chip power distribution |
| US12/650,295Expired - Fee RelatedUS8422967B2 (en) | 2009-06-09 | 2009-12-30 | Method and system for amplitude modulation utilizing a leaky wave antenna |
| US12/650,192Expired - Fee RelatedUS8301092B2 (en) | 2009-06-09 | 2009-12-30 | Method and system for a low noise amplifier utilizing a leaky wave antenna |
| US12/650,246Expired - Fee RelatedUS8295788B2 (en) | 2009-06-09 | 2009-12-30 | Method and system for an N-phase transmitter utilizing a leaky wave antenna |
| US12/650,324Expired - Fee RelatedUS8447250B2 (en) | 2009-06-09 | 2009-12-30 | Method and system for an integrated voltage controlled oscillator-based transmitter and on-chip power distribution network |
| US12/650,176Expired - Fee RelatedUS8521106B2 (en) | 2009-06-09 | 2009-12-30 | Method and system for a sub-harmonic transmitter utilizing a leaky wave antenna |
| US12/650,277Expired - Fee RelatedUS8457581B2 (en) | 2009-06-09 | 2009-12-30 | Method and system for receiving I and Q RF signals without a phase shifter utilizing a leaky wave antenna |
| US12/708,366Active2032-12-17US8743002B2 (en) | 2009-06-09 | 2010-02-18 | Method and system for a 60 GHz leaky wave high gain antenna |
| US12/751,777Active2031-09-05US9329261B2 (en) | 2009-06-09 | 2010-03-31 | Method and system for dynamic control of output power of a leaky wave antenna |
| US12/751,782Expired - Fee RelatedUS8787997B2 (en) | 2009-06-09 | 2010-03-31 | Method and system for a distributed leaky wave antenna |
| US12/751,759AbandonedUS20100311369A1 (en) | 2009-06-09 | 2010-03-31 | Method and system for communicating via leaky wave antennas within a flip-chip bonded structure |
| US12/751,792AbandonedUS20100309076A1 (en) | 2009-06-09 | 2010-03-31 | Method and system for communicating via leaky wave antennas on high resistivity substrates |
| US12/751,550Expired - Fee RelatedUS9088075B2 (en) | 2009-06-09 | 2010-03-31 | Method and system for configuring a leaky wave antenna utilizing micro-electro mechanical systems |
| US12/751,751AbandonedUS20100309074A1 (en) | 2009-06-09 | 2010-03-31 | Method and system for a leaky wave antenna on an integrated circuit package |
| US12/751,593AbandonedUS20100309073A1 (en) | 2009-06-09 | 2010-03-31 | Method and system for cascaded leaky wave antennas on an integrated circuit, integrated circuit package, and/or printed circuit board |
| US12/751,772AbandonedUS20100309077A1 (en) | 2009-06-09 | 2010-03-31 | Method and system for wireless communication utilizing leaky wave antennas on a printed circuit board |
| US12/751,768AbandonedUS20100309075A1 (en) | 2009-06-09 | 2010-03-31 | Method and system for an on-chip leaky wave antenna |
| US12/797,177Expired - Fee RelatedUS8242957B2 (en) | 2009-06-09 | 2010-06-09 | Method and system for dynamic tracking utilizing leaky wave antennas |
| US12/796,841Expired - Fee RelatedUS8618937B2 (en) | 2009-06-09 | 2010-06-09 | Method and system for controlling cavity height of a leaky wave antenna for RFID communications |
| US12/797,254Active2032-03-26US8929841B2 (en) | 2009-06-09 | 2010-06-09 | Method and system for a touchscreen interface utilizing leaky wave antennas |
| US12/797,133AbandonedUS20100309056A1 (en) | 2009-06-09 | 2010-06-09 | Method and system for scanning rf channels utilizing leaky wave antennas |
| US12/797,162Active2030-12-14US8849194B2 (en) | 2009-06-09 | 2010-06-09 | Method and system for a mesh network utilizing leaky wave antennas |
| US12/797,068AbandonedUS20100311324A1 (en) | 2009-06-09 | 2010-06-09 | Method and system for wireless communication utilizing on-package leaky wave antennas |
| US12/796,975AbandonedUS20100309824A1 (en) | 2009-06-09 | 2010-06-09 | Method and system for a duplexing leaky wave antenna |
| US12/797,316Expired - Fee RelatedUS8432326B2 (en) | 2009-06-09 | 2010-06-09 | Method and system for a smart antenna utilizing leaky wave antennas |
| US12/797,232AbandonedUS20100308767A1 (en) | 2009-06-09 | 2010-06-09 | Method and system for distributed battery charging utilizing leaky wave antennas |
| US12/797,203Expired - Fee RelatedUS8577314B2 (en) | 2009-06-09 | 2010-06-09 | Method and system for dynamic range detection and positioning utilizing leaky wave antennas |
| US12/797,029Active2032-11-02US8995937B2 (en) | 2009-06-09 | 2010-06-09 | Method and system for controlling power for a power amplifier utilizing a leaky wave antenna |
| US12/797,041Active2033-05-01US9013311B2 (en) | 2009-06-09 | 2010-06-09 | Method and system for a RFID transponder with configurable feed point for RFID communications |
| US12/796,862ActiveUS8849214B2 (en) | 2009-06-09 | 2010-06-09 | Method and system for point-to-point wireless communications utilizing leaky wave antennas |
| US12/797,273AbandonedUS20100308885A1 (en) | 2009-06-09 | 2010-06-09 | Method and system for clock distribution utilizing leaky wave antennas |
| US12/797,214Active2031-02-13US8843061B2 (en) | 2009-06-09 | 2010-06-09 | Method and system for power transfer utilizing leaky wave antennas |
| US12/796,822Active2031-04-15US8761669B2 (en) | 2009-06-09 | 2010-06-09 | Method and system for chip-to-chip communication via on-chip leaky wave antennas |
| US13/646,297ActiveUS8660505B2 (en) | 2009-06-09 | 2012-10-05 | Integrated transmitter with on-chip power distribution |
| US13/655,868ActiveUS8666335B2 (en) | 2009-06-09 | 2012-10-19 | Wireless device with N-phase transmitter |
| US13/860,826ActiveUS8831540B2 (en) | 2009-06-09 | 2013-04-11 | Amplitude modulation utilizing a leaky wave antenna |
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| US14/737,895Expired - Fee RelatedUS9417318B2 (en) | 2009-06-09 | 2015-06-12 | Method and system for configuring a leaky wave antenna utilizing micro-electro mechanical systems |
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| US12/650,176Expired - Fee RelatedUS8521106B2 (en) | 2009-06-09 | 2009-12-30 | Method and system for a sub-harmonic transmitter utilizing a leaky wave antenna |
| US12/650,277Expired - Fee RelatedUS8457581B2 (en) | 2009-06-09 | 2009-12-30 | Method and system for receiving I and Q RF signals without a phase shifter utilizing a leaky wave antenna |
| US12/708,366Active2032-12-17US8743002B2 (en) | 2009-06-09 | 2010-02-18 | Method and system for a 60 GHz leaky wave high gain antenna |
| US12/751,777Active2031-09-05US9329261B2 (en) | 2009-06-09 | 2010-03-31 | Method and system for dynamic control of output power of a leaky wave antenna |
| US12/751,782Expired - Fee RelatedUS8787997B2 (en) | 2009-06-09 | 2010-03-31 | Method and system for a distributed leaky wave antenna |
| US12/751,759AbandonedUS20100311369A1 (en) | 2009-06-09 | 2010-03-31 | Method and system for communicating via leaky wave antennas within a flip-chip bonded structure |
| US12/751,792AbandonedUS20100309076A1 (en) | 2009-06-09 | 2010-03-31 | Method and system for communicating via leaky wave antennas on high resistivity substrates |
| US12/751,550Expired - Fee RelatedUS9088075B2 (en) | 2009-06-09 | 2010-03-31 | Method and system for configuring a leaky wave antenna utilizing micro-electro mechanical systems |
| US12/751,751AbandonedUS20100309074A1 (en) | 2009-06-09 | 2010-03-31 | Method and system for a leaky wave antenna on an integrated circuit package |
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| US12/751,772AbandonedUS20100309077A1 (en) | 2009-06-09 | 2010-03-31 | Method and system for wireless communication utilizing leaky wave antennas on a printed circuit board |
| US12/751,768AbandonedUS20100309075A1 (en) | 2009-06-09 | 2010-03-31 | Method and system for an on-chip leaky wave antenna |
| US12/797,177Expired - Fee RelatedUS8242957B2 (en) | 2009-06-09 | 2010-06-09 | Method and system for dynamic tracking utilizing leaky wave antennas |
| US12/796,841Expired - Fee RelatedUS8618937B2 (en) | 2009-06-09 | 2010-06-09 | Method and system for controlling cavity height of a leaky wave antenna for RFID communications |
| US12/797,254Active2032-03-26US8929841B2 (en) | 2009-06-09 | 2010-06-09 | Method and system for a touchscreen interface utilizing leaky wave antennas |
| US12/797,133AbandonedUS20100309056A1 (en) | 2009-06-09 | 2010-06-09 | Method and system for scanning rf channels utilizing leaky wave antennas |
| US12/797,162Active2030-12-14US8849194B2 (en) | 2009-06-09 | 2010-06-09 | Method and system for a mesh network utilizing leaky wave antennas |
| US12/797,068AbandonedUS20100311324A1 (en) | 2009-06-09 | 2010-06-09 | Method and system for wireless communication utilizing on-package leaky wave antennas |
| US12/796,975AbandonedUS20100309824A1 (en) | 2009-06-09 | 2010-06-09 | Method and system for a duplexing leaky wave antenna |
| US12/797,316Expired - Fee RelatedUS8432326B2 (en) | 2009-06-09 | 2010-06-09 | Method and system for a smart antenna utilizing leaky wave antennas |
| US12/797,232AbandonedUS20100308767A1 (en) | 2009-06-09 | 2010-06-09 | Method and system for distributed battery charging utilizing leaky wave antennas |
| US12/797,203Expired - Fee RelatedUS8577314B2 (en) | 2009-06-09 | 2010-06-09 | Method and system for dynamic range detection and positioning utilizing leaky wave antennas |
| US12/797,029Active2032-11-02US8995937B2 (en) | 2009-06-09 | 2010-06-09 | Method and system for controlling power for a power amplifier utilizing a leaky wave antenna |
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| US12/796,862ActiveUS8849214B2 (en) | 2009-06-09 | 2010-06-09 | Method and system for point-to-point wireless communications utilizing leaky wave antennas |
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| US14/661,322Expired - Fee RelatedUS9442190B2 (en) | 2009-06-09 | 2015-03-18 | Method and system for a RFID transponder with configurable feed point for RFID communications |
| US14/737,895Expired - Fee RelatedUS9417318B2 (en) | 2009-06-09 | 2015-06-12 | Method and system for configuring a leaky wave antenna utilizing micro-electro mechanical systems |
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