US20130321785A1 - Exposure apparatus and device fabricating method - Google Patents

Abstract

An exposure apparatus can suppress the occurrence of residual liquid. An exposure apparatus includes: a first stage that holds the substrate and is movable; a second stage that is movable independently of the first stage; and a liquid immersion mechanism that forms a liquid immersion region of a liquid on an upper surface of at least one stage of the first stage and the second stage; wherein, a recovery port that is capable of recovering the liquid is provided to the upper surface of the second stage.

Description

• This is a Divisional of U.S. patent application Ser. No. 12/007,348, filed Jan. 9, 2008, which in turn is a Divisional of U.S. patent application Ser. No. 11/666,420, which is the U.S. National Stage of International Application No. PCT/JP2005/020020 filed Oct. 31, 2005. The disclosure of each of the above-identified applications is incorporated herein by reference in its entirety. The present application claims priority to Japanese Patent Application No. 2004-318017 filed on Nov. 1, 2004, and the contents thereof are incorporated herein by reference.
TECHNICAL FIELD
• The present invention relates to an exposure apparatus that exposes a substrate through a projection optical system, and a device fabricating method.
BACKGROUND ART
• The process of photolithography, which is one of the processes for manufacturing a microdevice such as a semiconductor device and a liquid crystal display device, uses an exposure apparatus that projects the image of a pattern formed on a mask onto a photosensitive substrate. This exposure apparatus comprises a mask stage that supports a mask as well as a substrate stage that supports a substrate, and projects an image of the pattern of the mask onto the substrate through a projection optical system while successively moving the mask stage and the substrate stage. In addition, there are exposure apparatuses that are designed, for example, to improve throughput by providing two independently moveable stages on the image plane side of the projection optical system. In microdevice fabrication, there is a demand to increase the fineness of the patterns formed on substrates in order to increase device density. To meet this demand, it is preferable to further increase the resolution of exposure apparatuses. As one means to achieve this increase in resolution, an immersion exposure apparatus has been proposed, as disclosed in Patent Document 1 below, that forms a liquid immersion region by filling a liquid between the projection optical system and the substrate, and performs an exposure process through the liquid of that liquid immersion region.
• Patent Document 1 : PCT International Publication No. WO 99/49504
DISCLOSURE OF INVENTIONProblems to be Solved by the Invention
• In an immersion exposure apparatus, there are cases (for example, during maintenance) wherein it is desired to recover all of the liquid of the liquid immersion region. In such a case, if the liquid is not fully recovered and some remains, then there is a possibility that the residual liquid will scatter to the various equipment that constitute the exposure apparatus and adversely affect that equipment. In addition, there is a risk that the residual liquid will cause fluctuations in the environment (for example, its humidity) wherein the exposure apparatus is disposed, and thereby adversely affect, for example, exposure and measurement accuracies.
• A purpose of some aspects of the invention is to provide an exposure apparatus that can maintain a desired performance by suppressing the occurrence of residual liquid, and a device fabricating method.
Means for Solving the Problem
• A first aspect of the present invention provides an exposure apparatus that exposes a substrate through a projection optical system, comprising: a first stage that holds the substrate and is movable within a two dimensional plane on the image plane side of the projection optical system that is substantially parallel to the image plane; a second stage that is movable independently of the first stage within a two dimensional plane on the image plane side of the projection optical system that is substantially parallel to the image plane; and a liquid immersion mechanism that forms a liquid immersion region of a liquid on an upper surface of at least one stage of the first stage and the second stage; wherein, a recovery port that is capable of recovering the liquid is provided to or in the vicinity of the upper surface of the second stage.
• According to the first aspect of the invention, the recovery port that recovers the liquid is provided to or in the vicinity of the upper surface of the second stage, which is disposed on the image plane side of the projection optical system, and it is therefore possible to satisfactorily recover the liquid and to suppress the occurrence of residual liquid.
• A second aspect of the present invention provides a device fabricating method, wherein an exposure apparatus according to the above aspect is used.
• According to the second aspect of the invention, it is possible to fabricate a device with an exposure apparatus that maintains a desired performance.
Effects of the Invention
• According to the present invention, it is possible to suppress the occurrence of residual liquid, and to perform the exposure process and the measurement process with good accuracy.
BRIEF DESCRIPTION OF THE DRAWINGS
• FIG. 1 is a schematic block diagram that shows the exposure apparatus according to a first embodiment.
• FIG. 2 is a cross sectional view of a substrate stage.
• FIG. 3 is a plan view of the substrate stage.
• FIG. 4 is a cross sectional view of a measurement stage.
• FIG. 5 is a plan view of the measurement stage.
• FIG. 6 is a plan view of the substrate stage and the measurement stage, viewed from above.
• FIG. 7A is for explaining the operation of the substrate stage and the measurement stage.
• FIG. 7B is for explaining the operation of the substrate stage and the measurement stage.
• FIG. 8A is for explaining the operation of the substrate stage and the measurement stage.
• FIG. 8B is for explaining the operation of the substrate stage and the measurement stage.
• FIG. 9 is for explaining the state wherein the liquid immersion area is moving.
• FIG. 10 is for explaining the state wherein the liquid of the liquid immersion area is being recovered.
• FIG. 11 shows the exposure apparatus according to a second embodiment.
• FIG. 12 shows the exposure apparatus according to a third embodiment.
• FIG. 13 shows the exposure apparatus according to a fourth embodiment.
• FIG. 14 shows the exposure apparatus according to a fifth embodiment.
• FIG. 15 is a flow chart diagram that depicts one example of a process for fabricating a microdevice.
BEST MODE FOR CARRYING OUT THE INVENTION
• The following explains the embodiments of the present invention, referencing the drawings, but the present invention is not limited thereto.
First Embodiment
• FIG. 1 is a schematic block diagram that shows an exposure apparatus according to a first embodiment. InFIG. 1, an exposure apparatus EX comprises: a movable mask stage MST that holds a mask M; a movable substrate stage ST1 that holds a substrate P; a movable measurement stage ST2 on which measuring instruments that perform measurements related to an exposure process are mounted; an illumination optical system IL that illuminates the mask M supported by the mask stage MST with exposure light EL; a projection optical system PL, which projects an image of the pattern of the mask M illuminated by the exposure light EL onto the substrate P held by the substrate stage ST1; and a control apparatus CONT that performs supervisory control of the entire operation of the exposure apparatus EX. The substrate stage ST1 and the measurement stage ST2, which are each movably supported on a base member BP, are independently movable. A gas bearing141 that noncontactually supports the substrate stage ST1 on an upper surface13T of the base member BP is provided to a lower surface U1 of the substrate stage ST1. Likewise, a gas bearing142 for noncontactually supporting the measurement stage ST2 on the upper surface BT of the base member BP is provided to a lower surface U2 of the measurement stage ST2. The substrate stage ST1 and the measurement stage ST2 are each independently movable within a two dimensional plane (XY plane) on the image plane side of the projection optical system PL that is substantially parallel to that image plane.
• The exposure apparatus EX of the present embodiment is a liquid immersion exposure apparatus that adapts the liquid immersion method to substantially shorten the exposure wavelength, improve the resolution, as well as substantially increase the depth of focus, and comprises a liquid immersion mechanism1 for forming a liquid immersion region LR of a liquid LQ on the image plane side of the projection optical system PL. The liquid immersion mechanism1 comprises: anozzle member70, which is provided in the vicinity of the image plane side of the projection optical system PL, hassupply ports12 that supply the liquid LQ andrecovery ports22 that recover the liquid LQ; aliquid supply mechanism10 that supplies the liquid LQ to the image plane side of the projection optical system PL through thesupply ports12 provided to thenozzle member70; and aliquid recovery mechanism20 that recovers the liquid LQ on the image plane side of the projection optical system PL through therecovery ports22 provided to thenozzle member70. Thenozzle member70 is annularly formed so that it surrounds a tip portion of the projection optical system PL on the image plane side. At least during the projection of the image of the pattern of the mask M onto the substrate P, the liquid immersion mechanism I uses the liquid LQ that is supplied by theliquid supply mechanism10 to locally faun the liquid immersion region LR of the liquid LQ, which is larger than a projection area AR and smaller than the substrate P, on one part of the substrate P that includes the projection area AR of the projection optical system PL. Specifically, the exposure apparatus EX employs a local liquid immersion system that fills the liquid LQ in the space of the optical path that is between a lower surface LSA of a first optical element LS1, which is closest to the image plane of the projection optical system PL, and one part of the upper surface of the substrate P that is disposed on the image plane side of the projection optical system PL, and then exposes the substrate P by projecting a pattern of the mask M onto the substrate P by irradiating such with the exposure light EL that passes through the mask M via the projection optical system PL and the liquid LQ that forms the liquid immersion region LR.
• In addition, the liquid immersion mechanism1 can locally form the liquid immersion region LR of the liquid LQ not just on the upper surface of the substrate P, but also on at least one of an upper surface F1 of the substrate stage ST1 and an upper surface F2 of the measurement stage ST2. Furthermore,recovery ports51 that can recover at least part of the liquid LQ of the liquid immersion region LR are provided to the measurement stage ST2.
• Furthermore, the liquid immersion mechanism1 is not limited to the one disclosed in the present embodiment, and various aspects can be employed. For example, it is possible to employ the liquid immersion mechanism disclosed in, for example, U.S. Patent Publication No. 2004/0160582.
• The present embodiment will now be explained as exemplified by a case wherein a scanning type exposure apparatus (a so-called scanning stepper) is used as the exposure apparatus EX that projects an image of the pattern formed on the mask M onto the substrate P while synchronously moving the mask M and the substrate P in mutually different scanning directions (reverse directions). In the following explanation, the directions in which the mask M and the substrate P synchronously move within the horizontal plane are the X axial directions (scanning directions), the directions orthogonal to the X axial directions within the horizontal plane are the Y axial directions (non-scanning directions), and the directions that are perpendicular to the X and Y axial directions and that coincide with an optical axis AX of the projection optical system PL are the Z axial directions. In addition, the rotational (inclined) directions about the X, Y, and Z axial directions and the θX, θY, and θZ directions, respectively. Furthermore, “substrate” herein includes one wherein the substrate, for example, a semiconductor wafer is coated with a photosensitive material (photoresist), and “mask” includes a reticle wherein a device pattern is formed that is reduction projected onto the substrate.
• The substrate stage ST1 and the measurement stage ST2 are each movable by the drive of a drive mechanism SD that includes, for example, a linear motor. By controlling the drive mechanism SD, the control apparatus CONT can move the substrate stage ST1 and the measurement stage ST2 together in the XY plane while maintaining a prescribed state, wherein the upper surface F1 of the substrate stage ST1 and the upper surface F2 of the measurement stage ST2 are proximate (close) to or in contact with one another in a prescribed area that includes the area directly below the projection optical system PL. By moving the substrate stage ST1 together with the measurement stage ST2, the control apparatus CONT can move the liquid immersion region LR between the upper surface F1 of the substrate stage ST1 and the upper surface F2 of the measurement stage ST2 in a state wherein the liquid LQ is retained between the projection optical system PL and at least one of the upper surface F1 of the substrate stage ST1 and the upper surface F2 of the measurement stage ST2.
• In addition, a protruding portion (overhanging portion) H1, which projects toward the measurement stage ST2, is provided on the +Y side of the substrate stage ST1, and a recessedportion54 that corresponds to the overhanging portion H1 is provided on the −Y side of the measurement stage ST2. Furthermore, the overhanging portion H1 is also provided on the −Y side of the substrate stage ST1. Furthermore, the +Y side area of the upper surface of the substrate stage ST1 and the −Y side area of the upper surface of the measurement stage ST2 are proximate to or in contact with one another. In the present embodiment, because the overhanging portion H1 is provided on the +Y side of the substrate stage ST1 and the recessedportion54 is provided on the −Y side of the measurement stage ST2, the area of the upper surface of the substrate stage ST1 in the vicinity of the overhanging portion Hi and the area of the upper surface of the measurement stage ST2 in the vicinity of the recessedportion54 are proximate to or in contact with one another. Furthermore, therecovery ports51 are provided in the vicinity of the area where the upper surfaces of the measurement stage ST2 and the substrate stage ST1 are proximate to or in contact with one another; specifically, therecovery ports51 are provided to the inner side of the recessedportion54.
• Here, the “proximate state” between the substrate stage ST1 and the measurement stage ST2 means the state when the liquid immersion region LR has moved between the upper surface F1 of the substrate stage ST1 and the upper surface F2 of the measurement stage ST2, and the substrate stage ST1 and the measurement stage ST2 have approached one another to the extent that the liquid LQ does not leak out from between them; furthermore, the permissible value of the spacing between both stages ST1, ST2 differs depending on, for example, the material properties and the surface treatment of both stages, and the type of the liquid LQ.
• The illumination optical system IL comprises: an exposure light source; an optical integrator that uniformizes the luminous flux intensity of the light beam emitted from the exposure light source; a condenser lens that condenses the exposure light EL from the optical integrator; a relay lens system; and a field stop that sets an illumination region on the mask M illuminated by the exposure light EL. The illumination optical system IL illuminates the prescribed illumination region on the mask M with the exposure light EL, which has a uniform luminous flux intensity distribution. Examples of light that can be used as the exposure light EL emitted from the illumination optical system IL include: deep ultraviolet (DUV) light such as the bright lines (g-rays, h-rays, and i-rays) emitted from a mercury lamp and the like, and KrF excimer laser light (248 nm wavelength); and vacuum ultraviolet (VUV) light such as ArF excimer laser light (193 nm wavelength) and F₂laser light (157 nm wavelength). ArF excimer laser light is used in the present embodiment.
• In the present embodiment, pure water (purified water) is used as the liquid LQ. Pure water is capable of transmitting not only ArF excimer laser light, but also DUV light such as the bright lines (g-rays, h-rays, and i-rays) emitted from a mercury lamp and the like, and KrF excimer laser light (248 nm wavelength).
• The movable mask stage MST holds the mask M. The mask stage MST holds the mask M via vacuum chucking (or electrostatic chucking). The mask stage MST, in a state wherein it is holding the mask M, is movable in two dimensions within a plane perpendicular to the optical axis AX of the projection optical system PL, i.e., within the XY plane, and is finely rotatable in the OZ directions by the drive of a drive mechanism MD, which includes a linear motor that is controlled by the control apparatus CONT.Movable mirrors31 are provided on the mask stage MST. In addition, alaser interferometer32 is provided at a position opposing eachmovable mirror31. Thelaser interferometers32 measure in real time the position in the two dimensional directions, as well as the rotational angle in the θZ directions (depending on the case, including the rotational angles in the θX and θY directions) of the mask M on the mask stage MST. The measurement results of thelaser interferometers32 are outputted to the control apparatus CONT. Based on the measurement results of thelaser interferometers32, the control apparatus CONT controls the position of the mask M, which is held on the mask stage MST, by driving the drive mechanism MD.
• The projection optical system PL, which projects the pattern of the mask M onto the substrate P at a prescribed projection magnification β, comprises a plurality of optical elements that are held by a lens barrel PK. In the present embodiment, the projection optical system PL is a reduction system that has a projection magnification β of, for example, ¼, ⅕, or ⅛. Furthermore, the projection optical system PL may also be a unity magnification system or an enlargement system. In addition, the projection optical system PL may be: a dioptric system that does not include reflecting optical elements; a catoptric system that does not include refracting optical elements; or a catadioptric system that includes both reflecting optical elements and refracting optical elements. Among the plurality of optical elements that constitute the projection optical system PL, the first optical element LS1, which is the closest to the image plane of the projection optical system PL, protrudes from the lens barrel PK.
• The substrate stage ST1 comprises a substrate holder PH, which holds the substrate P, and a plate member T that is held by the substrate holder PH, which is movable on the image plane side of the projection optical system PL. The substrate holder PH holds the substrate P via, for example, vacuum chucking. The substrate stage ST1, in a state wherein it is holding the substrate P via the substrate holder PH, is movable in two dimensions within the XY plane that is substantially parallel to the image plane of the projection optical system PL on the image plane side of the projection optical system PL, and can be finely rotated in the θZ directions by the drive of the drive mechanism SD, which includes a linear motor that is controlled by the control apparatus CONT. Furthermore, the substrate stage ST1 is also movable in the Z axial directions and the θX and θY directions. Accordingly, the upper surface of the substrate P held by the substrate stage ST1 is movable in the directions of six degrees of freedom, i.e., the X, Y, and Z axial directions and the θX, θY, and θZ directions.Movable mirrors33 are each provided to a side surface of the substrate stage ST1. In addition, alaser interferometer34 is provided at a position opposing eachmovable mirror33. Thelaser interferometers34 measure in real time the position in the two dimensional directions as well as the rotational angle of the substrate P on the substrate stage ST1. In addition, the exposure apparatus EX comprises an oblique incidence type focus leveling detection system (not shown) that detects surface position information of the upper surface of the substrate P that is supported by the substrate stage ST1 as disclosed in, for example, Japanese Unexamined Patent Application, Publication No. H08-37149. The focus leveling detection system detects the surface position information (positional information in the Z axial directions, and inclination information in the θX and θY directions of the substrate P) of the upper surface of the substrate P. Furthermore, the focus leveling detection system may also employ a system that uses an electrostatic capacitance type sensor. The measurement results of thelaser interferometers34 are output to the control apparatus CONT. The detection results of the focus leveling detection system are also output to the control apparatus CONT. Based on the detection results of the focus leveling detection system, the control apparatus CONT aligns the upper surface of the substrate P with the image plane of the projection optical system PL by driving the drive mechanism SD and controlling the focus position (Z position) and inclination angle (θX and θY) of the substrate P; in addition, based on the measurement results of thelaser interferometers34, the control apparatus CONT controls the position of the substrate P in the X and Y axial directions and the θZ directions.
• The measurement stage ST2 mounts various measuring instruments (including a measuring member) that perform measurements related to the exposure process, and is movable on the image plane side of the projection optical system PL. Examples of such measuring instruments include: a fiducial mark plate whereon a plurality of fiducial (reference) marks are formed as disclosed in, for example, Japanese Unexamined Patent Application, Publication No. H5-21314; a nonuniformity sensor for measuring the luminous flux intensity nonuniformity as disclosed in, for example, Japanese Unexamined Patent Application, Publication No. S57-117238 and for measuring the amount of fluctuations in the transmittance of a projection optical system PL for exposure light EL as disclosed in Japanese Unexamined Patent Application, Publication No. 2001-267239; an aerial image measuring sensor as disclosed in Japanese Unexamined Patent Application, Publication No. 2002-14005; and an irradiance sensor (luminous flux intensity sensor) as disclosed in Japanese Unexamined Patent Application, Publication No. H11-16816. Like the upper surface F1 of the substrate stage ST1, the upper surface F2 of the measurement stage ST2 is a flat surface (flat portion).
• In the present embodiment, to perform immersion exposure, in which the substrate P is exposed with the exposure light EL through the projection optical system PL and the liquid LQ, the abovementioned nonuniformity sensor, aerial image measuring sensor, and irradiance sensor, which are employed in measurements that use the exposure light EL, receive the exposure light EL through the projection optical system PL and the liquid LQ. Furthermore, for example, one part of the optical system of each sensor may be mounted on the measurement stage ST2, or the entire sensor may be disposed thereon.
• In a state wherein the measuring instruments are mounted, the measurement stage ST2 can be moved in two dimensions within the XY plane that is substantially parallel to the image plane of the projection optical system PL on the image plane side thereof, and can be finely rotated in the θZ directions by the drive of the drive mechanism SD, which includes a linear motor that is controlled by the control apparatus CONT. Furthermore, the measurement stage ST2 is also movable in the Z axial directions and the θX and θY directions. Namely, like the substrate stage ST1, the measurement stage ST2 is movable in the directions of six degrees of freedom, i.e., the X, Y, and Z axial directions and the θX, θY, and θZ directions.Movable mirrors37 are each provided to a side surface of the measurement stage ST2. In addition, alaser interferometer38 is provided at a position opposing eachmovable mirror37. Thelaser interferometers38 measure in real time the position in the two dimensional directions and the rotational angle of the measurement stage ST2.
• An off axis alignment system ALG, which detects alignment marks on the substrate P and fiducial marks on the fiducial mark plate, is provided in the vicinity of the tip of the projection optical system PL. With the alignment system ALG of the present embodiment, a FIA (Field Image Alignment) system of the type disclosed in, for example, Japanese Unexamined Patent Application, Publication No. H4-65603 is employed that irradiates a target mark on the substrate P with a broadband detection light beam that does not photosensitize the photosensitive material on the substrate P; uses an imaging device (e.g., a CCD) to capture an image of an index (an index pattern on an index plate provided in the alignment system ALG), which is not shown, and an image of the target mark that is imaged on a light receiving surface by the light reflected from that target mark; and measures the position of the mark by image processing these imaging signals.
• In addition, two mask alignment systems RAa, RAb, each of which comprises a TTR type alignment system, are provided in the vicinity of the mask stage MST spaced apart in the Y axial directions by a prescribed spacing, wherein light of the exposure light wavelength is used to simultaneously observe an alignment mark on the mask M and a corresponding fiducial mark on the fiducial mark plate through the projection optical system PL. The mask alignment system of the present embodiment employs a VRA (Visual Reticle Alignment) system that detects the position of a mark by irradiating the mark with light and image processing the image data of the mark imaged by, for example, a CCD camera, as disclosed in, for example, Japanese Unexamined Patent Application, Publication No. H7-176468.
• Theliquid supply mechanism10 and theliquid recovery mechanism20 of the liquid immersion mechanism1 will now be explained. Theliquid supply mechanism10 supplies the liquid LQ to the image plane side of the projection optical system PL and comprises aliquid supply section11, which is capable of feeding the liquid LQ, as well as asupply pipe13, which has one end portion that is connected to theliquid supply section11. The other end portion of thesupply pipe13 is connected to thenozzle member70. An internal passageway (supply passageway) that connects thesupply ports12 and the other end portion of thesupply pipe13 is formed inside thenozzle member70. Theliquid supply section11 comprises, for example, a tank that stores the liquid LQ, a pressure pump, and a filter unit that removes foreign matter from the liquid LQ. The control apparatus CONT controls the liquid supply operation of theliquid supply section11. Furthermore, the tank, the pressure pump, and the filter unit do not all need to be provided to theliquid supply mechanism10 of the exposure apparatus EX, and at least one of them can be substituted with equipment at, for example, the plant where the exposure apparatus EX is installed.
• Theliquid recovery mechanism20 recovers the liquid LQ on the image plane side of the projection optical system PL and comprises: aliquid recovery section21 that is capable of recovering the liquid LQ; and arecovery pipe23, one end portion of which is connected to theliquid recovery section21. The other end portion of therecovery pipe23 is connected to thenozzle member70. An internal passageway (recovery passageway) that connects therecovery ports22 with the other end portion of therecovery pipe23 is formed inside thenozzle member70. Theliquid recovery section21 is provided with, for example: a vacuum system (a suction apparatus) such as a vacuum pump; a gas-liquid separator that separates the recovered liquid LQ and gas; and a tank that stores the recovered liquid LQ. Furthermore, the tank, the vacuum system, and the gas-liquid separator do not all need to be provided to theliquid recovery mechanism20 of the exposure apparatus EX, and at least one of them can be substituted with equipment at, for example, the plant where the exposure apparatus EX is installed.
• Thesupply ports12, which supply the liquid LQ, and therecovery ports22, which recover the liquid LQ, are folioed in alower surface70A of thenozzle member70. Thelower surface70A of thenozzle member70 is provided at a position that opposes the upper surface of the substrate P and the upper surfaces F1, F2 of the stages ST1, ST2. Thenozzle member70 is an annular member that is provided so that it surrounds a side surface of the first optical element LS1, and a plurality of thesupply ports12 are provided in thelower surface70A of thenozzle member70 so that it surrounds the first optical element LS1 of the projection optical system PL (the optical axis AX of the projection optical system PL). In addition, therecovery ports22 are provided in thelower surface70A of thenozzle member70 spaced apart from the outer side of thesupply ports12 with respect to the first optical element LS1, and are provided so that they surround the first optical element LS1 and thesupply ports12.
• Furthermore, the control apparatus CONT locally forms the liquid immersion region LR of the liquid LQ on the substrate P by using theliquid supply mechanism10 to supply a prescribed amount of the liquid LQ onto the substrate F, and by using theliquid recovery mechanism20 to recover a prescribed amount of the liquid LQ on the substrate P. When forming the liquid immersion region LR of the liquid LQ, the control apparatus CONT drives theliquid supply section11 and theliquid recovery section21. When the liquid LQ is sent from theliquid supply section11 under the control of the control apparatus CONT, the liquid LQ sent from theliquid supply section11 flows through thesupply pipe13 and then is supplied through the supply passageway of thenozzle member70 to the image plane side of the projection optical system PL from thesupply ports12. In addition, when theliquid recovery section21 is driven under the control of the control apparatus CONT, the liquid LQ on the image plane side of the projection optical system PL flows into the recovery passageway of thenozzle member70 through therecovery ports22, flows through therecovery pipe23, and is then collected by theliquid recovery section21.
• The following explains the substrate stage ST1 (substrate holder PH), referencingFIG. 2 andFIG. 3.FIG. 2 is a side cross sectional view of the substrate holder PH in a state wherein the substrate P and the plate member T are vacuum chucked, andFIG. 3 is a plan view of the substrate stage ST1 viewed from above.
• InFIG. 2, the substrate holder PH comprises a base material PHB, a first holding portion PH1, which is formed in the base material PHB and vacuum chucks the substrate P, and a second holding portion PH2, which is formed in the base material PHB and detachably holds the plate member T, wherein an upper surface Ta is formed that is substantially flush with an upper surface Pa of the substrate P, at the circumference of the substrate P held by the first holding portion PH1. The plate member T is different from the base material PHB, and is provided so that it can be detached (i.e., it is replaceable) from the base material PHB of the substrate holder PH. In addition, as shown inFIG. 3, the plate member T is a substantially annular member, and a substantially circular hole TH, wherein the substrate P can be disposed, is formed at the center portion thereof. Furthermore, the plate member T held by the second holding portion PH2 is disposed so that it surrounds the circumference of the substrate P that is held by the first holding portion PHI. In the present embodiment, the substrate stage ST1 refers to the state wherein the plate member T is vacuum chucked to the base material PHB.
• The plate member T is liquid repellent with respect to the liquid LQ. The plate member T is made of a liquid repellent material, for example, a fluororesin such as polytetrafluoroethylene (Teflon™), or an acrylic resin. Furthermore, the plate member T may be made of, for example, a metal and its surface may be coated with a liquid repellent material such as a fluororesin.
• InFIG. 2, the upper surface Ta and a lower surface Tb of the plate member T are each a flat surface (flat portion). In addition, the plate member T has substantially the same thickness as the substrate P. Furthermore, the upper surface (flat surface) Ta of the plate member T that is held by the second holding portion PH2 is substantially flush with the upper surface Pa of the substrate P that is held by the first holding portion PH1. Namely, at the circumference of the substrate P that is held by the first holding portion PH1, the plate member T that is held by the second holding portion PH2 forms the flat surface Ta, which is substantially flush with the upper surface Pa of that substrate P. In the present embodiment, the upper surface of the substrate stage ST1 is formed so that, when the substrate P is held thereon, the substantially entire area of that upper surface of the substrate stage ST1, including the upper surface Pa of the held substrate P, forms a flat surface (full flat surface).
• The external form of the plate member T is rectangular in a plan view, and is formed so that it is larger than the external form of the base material PHB. Namely, a peripheral edge portion of the plate member T that is held by the second holding portion PH2 forms the overhanging portion (protruding portion) H1, which projects from the side surface to the outer side of the base material PHB. The area of the overhanging portion H1 on the +Y side forms a protruding portion that projects toward the measurement stage ST2. In the present embodiment, the upper surface Ta of the plate member T, which includes the upper surface of the overhanging portion H1, forms the upper surface F1 of the substrate stage ST1. Furthermore, the area of the upper surface F1 of the substrate stage ST1 on the +Y side, i.e., the +Y side upper surface F1 (Ta) of the overhanging portion H1, and the area of the upper surface F2 of the measurement stage ST2 on the −Y side are proximate to or in contact with one another.
• In the present embodiment, themovable mirrors33 are provided in an area below the overhanging portion H1. Thereby, even if the liquid LQ flows out from the upper surface F1 (Ta), the overhanging portion H1 can prevent the liquid LQ from adhering to themovable minors33.
• As shown inFIG. 2 andFIG. 3, the first holding portion PH1 of the substrate holder PH comprises protrudingfirst support portions46, which are formed on the base material PHB, and an annular firstcircumferential wall portion42, which is formed on the base material PHB so that it surrounds thefirst support portions46. Thefirst support portions46 support a lower surface Pb of the substrate P, and a plurality offirst support portions46 are uniformly formed on the inner side of the firstcircumferential wall portion42. In the present embodiment, thefirst support portions46 comprise a plurality of support pins. In accordance with the shape of the substrate P, the firstcircumferential wall portion42 is formed substantially annular in a plan view, and anupper surface42A of the firstcircumferential wall portion42 is formed so that it opposes a circumferential edge area (edge area) of the lower surface Pb of the substrate P. Afirst space131, which is surrounded by the base material PHB, the firstcircumferential wall portion42, and the lower surface Pb of the substrate P, is formed on the lower surface Pb side of the substrate P held by the first holding portion PH1.
• First suction ports41 are formed on the base material PHB on the inner side of the firstcircumferential wall portion42. Thefirst suction ports41 are for vacuum chucking the substrate P, and a plurality offirst suction ports41 are provided at prescribed positions on the upper surface of the base material PHB, excluding the areas where thefirst support portions46 are provided, on the inner side of the firstcircumferential wall portion42. In the present embodiment, the plurality offirst suction ports41 are uniformly disposed on the inner side of the firstcircumferential wall portion42. Eachfirst suction port41 is connected to afirst vacuum system40 through apassageway45. Thefirst vacuum system40 is for negatively pressurizing thefirst space131, which is surrounded by the base material PHB, the firstcircumferential wall portion42, and the lower surface Pb of the substrate P, and includes a vacuum pump. As discussed above, thefirst support portions46 comprise support pins, and the first holding portion PH1 according to the present embodiment constitutes one part of a so-called pin chuck mechanism. The firstcircumferential wall portion42 functions as an outer wall portion that surrounds the outer side of thefirst space131, which includes thefirst support portions46, and the control apparatus CONT vacuum chucks the substrate P to thefirst support portions46 by driving thefirst vacuum system40 so that it suctions gas (air) out of the interior of thefirst space131 that is surrounded by the base material PHB, the firstcircumferential wall portion42, and the substrate P, thereby negatively pressurizing thefirst space131.
• The second holding portion PH2 of the substrate holder PH comprises a substantially annular secondcircumferential wall portion62, which is formed on the base material PHB so that it surrounds the firstcircumferential wall portion42 of the first holding portion PH1, an annular thirdcircumferential wall portion63, which is provided on the outer side of the secondcircumferential wall portion62 and is formed on the base material PHB so that it surrounds the secondcircumferential wall portion62, and protrudingsecond support portions66, which are formed on the base material PHB between the secondcircumferential wall portion62 and the thirdcircumferential wall portion63. Thesecond support portions66 support the lower surface Tb of the plate member T, and a plurality ofsecond support portions66 are uniformly formed between the secondcircumferential wall portion62 and the thirdcircumferential wall portion63. Like thefirst support portions46, thesecond support portions66 in the present embodiment comprise a plurality of support pins. The secondcircumferential wall portion62 is provided on the outer side of the firstcircumferential wall portion42 with respect to thefirst space131, and the thirdcircumferential wall portion63 is provided farther on the outer side of the secondcircumferential wall portion62 with respect to thefirst space131. In addition, the secondcircumferential wall portion62 is formed in accordance with the shape of the hole TH of the plate member T so that it is substantially annular in a plan view. The thirdcircumferential wall portion63 is formed substantially rectangular in a plan view on the inner side of an edge portion on the outer side of the plate member T. Anupper surface62A of the secondcircumferential wall portion62 is formed so that it opposes an inner edge area (an inner side edge area) of the lower surface Tb of the plate member T in the vicinity of the hole TH. Anupper surface63A of the thirdcircumferential wall portion63 is formed so that it opposes an area of the lower surface Tb of the plate member T that is slightly on the inner side of the outer edge area (the outer side edge area). Asecond space132, which is surrounded by the base material PHB, the second and thirdcircumferential wall portions62,63, and the lower surface Tb of the plate member T, is formed on the lower surface Tb side of the plate member T held by the second holding portion PH2.
• Second suction ports61 are formed on the base material PHB between the secondcircumferential wall portion62 and the thirdcircumferential wall portion63. Thesecond suction ports61 are for vacuum chucking the plate member T, and a plurality of thesecond suction ports61 are provided between the secondcircumferential wall portion62 and the thirdcircumferential wall portion63 at prescribed positions on the upper surface of the base material PHB, excluding the areas of thesecond support portions66. In the present embodiment, the plurality ofsecond suction ports61 are uniformly disposed between the secondcircumferential wall portion62 and the thirdcircumferential wall portion63.
• Each of thesecond suction ports61 is connected to asecond vacuum system60 through apassageway65. Thesecond vacuum system60 is for negatively pressurizing thesecond space132, which is surrounded by the base material PHB, the second and thirdcircumferential wall portions62,63, and the lower surface Tb of the plate member T, and includes a vacuum pump. As discussed above, thesecond support portions66 comprise support pins, and, like the first holding portion PH1, the second holding portion PH2 according to the present embodiment constitutes one part of the so-called pin chuck mechanism. The second and thirdcircumferential wall portions62,63 function as outer wall portions that enclose the outer sides of thesecond space132, which includes thesecond support portions66, and the control apparatus CONT vacuum chucks the plate member T to thesecond support portions66 by driving thesecond vacuum system60 so as to suction the gas (air) out of the interior of thesecond space132 that is surrounded by the base material PHB, the second and thirdcircumferential wall portions62,63, and the plate member T, thereby negatively pressurizing thesecond space132.
• Furthermore, although a pin chuck mechanism is employed when vacuum chucking the substrate P in the present embodiment, other chuck mechanisms may be employed. Likewise, although a pin chuck mechanism is employed when vacuum chucking the plate member T, other chuck mechanisms may be employed. In addition, although vacuum chuck mechanisms are employed when vacuum chucking the substrate P and the plate member T in the present embodiment, at least one of them may use another mechanism such as an electrostatic chuck mechanism.
• Thefirst vacuum system40 that negatively pressurizes thefirst space131 and thesecond vacuum system60 that negatively pressurizes thesecond space132 are mutually independent. The control apparatus CONT can separately control the operation of thefirst vacuum system40 and thesecond vacuum system60, and the operation of suctioning thefirst space131 by thefirst vacuum system40 and the operation of suctioning thesecond space132 by thesecond vacuum system60 can be performed independently. In addition, the control apparatus CONT controls thefirst vacuum system40 and thesecond vacuum system60, and can make the pressure of thefirst space131 and the pressure of thesecond space132 different from one another.
• As shown inFIG. 2 andFIG. 3, a gap A of approximately 0.1-1.0 mm is formed between the edge portion on the outer side of the substrate P held by the first holding portion PH1 and the edge portion on the inner side (hole TH side) of the plate member T provided at the circumference of the substrate P. In the present embodiment, the gap A is approximately 0.3 mm. In addition, as shown inFIG. 3, a notched portion NT, which is a notch for alignment, is fainted in the substrate P in the present embodiment. The shape of the plate member T is set in accordance with the external form (shape of the notched portion NT) of the substrate P so that the gap in the notched portion NT between the substrate P and the plate member T is also approximately 0.1 to 1.0 mm. Specifically, aprojection portion150 that projects toward the inner side of the hole TH is provided to the plate member T so that it corresponds to the shape of the notched portion NT of the substrate P. Thereby, the gap A of approximately 0.1 to 1.0 mm is secured between the plate member T and the entire area of the edge portion of the substrate P, which includes the notched portion NT. In addition, a protrudingportion62N that corresponds to the shape of theprojection portion150 of the plate member T is formed in the secondcircumferential wall portion62 of the second holding portion PH2 and itsupper surface62A. In addition, a recessedportion42N that corresponds to the shape of the protrudingportion62N of the secondcircumferential wall portion62 and the notched portion NT of the substrate P is formed in the firstcircumferential wall portion42 of the first holding portion PH1 and itsupper surface42A. The recessedportion42N of the firstcircumferential wall portion42 is provided at a position that opposes the protrudingportion62N of the secondcircumferential wall portion62, and a prescribed gap is formed between the recessedportion42N and the protrudingportion62N.
• Furthermore, although the above explained an example of using the notched portion NT as the notch of the substrate P, the prescribed gap A between the substrate P and the plate member T that surrounds such may be secured in cases such as when there is no notch, or when an orientation flat portion is formed in the substrate P as the notch by shaping the plate member T, the firstcircumferential wall portion42, and the secondcircumferential wall portion62 in accordance with the external form of the substrate P.
• The following explains the measurement stage ST2, referencingFIG. 4 andFIG. 5. As discussed above, the measurement stage ST2 mounts the measuring instruments that perform measurements related to the exposure process, and its upper surface F2 fauns a flat surface. InFIG. 5, a fiducial mark plate FM wherein a plurality of fiducial marks are formed, anonuniformity sensor300, and an aerialimage measuring sensor400 are schematically shown as examples of measuring instruments (measuring members).
• The measurement stage ST2 comprises arecovery mechanism50 that is capable of recovering the liquid LQ. Therecovery mechanism50 comprises therecovery ports51, which are provided to the measurement stage ST2 and are capable of recovering the liquid LQ, and apassageway52, which is connected to thoserecovery ports51 and to avacuum system53. Furthermore, a gas-liquid separator (not shown) that separates gas from the recovered liquid LQ is provided along thepassageway52 between therecovery ports51 and thevacuum system53. Therecovery mechanism50 is capable of recovering the liquid LQ through therecovery ports51 by the drive of thevacuum system53. The liquid LQ recovered by therecovery ports51 flows through thepassageway52 and then is stored in a tank (not shown).
• The measurement stage ST2 comprises a recessedportion54 that corresponds to the overhanging portion H1 of the substrate stage ST1. The recessedportion54 is formed in an area (−Y side area) of the upper surface of the measurement stage ST2 that is proximate to or in contact with the substrate stage ST1, and is formed as a notch in one part of the upper surface F2 of the measurement stage ST2 on the −Y side. Furthermore, agroove portion55, which extends in the X axial directions, is formed on the inner side of the recessedportion54 of the measurement stage ST2. Therecovery ports51 are provided in thegroove portion55 formed in the recessedportion54. As shown inFIG. 5, therecovery ports51 are substantially circular in a plan view, and a plurality thereof are provided lined up in the X axial directions in abottom surface55B of thegroove portion55. Furthermore, each of the plurality ofrecovery ports51 is connected to thevacuum system53 through thepassageway52. Here, thebottom surface55B of thegroove portion55 is a flat surface that faces the +Z side.
• The recessed portion54 (groove portion55) is formed in the area (−Y side area) of the upper surface of the measurement stage ST2 that is proximate to or in contact with the substrate stage ST1, and therefore therecovery ports51, which are formed on the inner side of that recessed portion54 (groove portion55), are provided in the vicinity of the area of the measurement stage ST2 that is proximate to or in contact with the substrate stage ST1.
• An area of the upper surface F2 of the measurement stage ST2 that is proximate to or in contact with the overhanging portion H1 of the substrate stage ST1 (plate member T) is formed by aliquid repellent member56. Theliquid repellent member56 may be made of a material, for example a fluororesin such as polytetrafluoroethylene (Teflon™), or an acrylic resin, that is liquid repellent with respect to the liquid LQ. In addition, theliquid repellent member56 also forms a wall surface that faces the −Y side of the inner edge area of the recessedportion54. Theliquid repellent member56 is detachable from the measurement stage ST2 (i.e., it is replaceable).
• FIG. 6 is a plan view of the substrate stage ST1 and the measurement stage ST2, viewed from above. InFIG. 6, the drive mechanism SD compriseslinear motors80,81,82,83,84,85 for driving the substrate stage ST1 and the measurement stage ST2. The drive mechanism SD comprises a pair of Y axis linear guides91,93 that each extend in the Y axial directions. The Y axis linear guides91,93 are disposed spaced apart by a prescribed spacing in the X axial directions. Each of the Y axis linear guides91,93 comprises a magnet unit with a built-in permanent magnet group that consists of multiple sets of north pole magnets and south pole magnets that are disposed alternately and at prescribed intervals along, for example, the Y axial directions. Moreover, twosliders90,94 are supported on the Y axislinear guide91 so that they are movable in the Y axial directions in a noncontactual state. Likewise, twosliders92,95 are supported on the other Y axislinear guide93 so that they are movable in the Y axial directions in a noncontactual state. Each of thesliders90,92,94,95 comprises a coil unit with built-in armature coils disposed at prescribed intervals along, for example, the Y axis. Namely, in the present embodiment, thesliders90,94, which each comprise a coil unit, and the Y axislinear guide91, which comprises a magnet unit, constitute the moving coil type Y axislinear motors82,84. Likewise, thesliders92,95 and the Y axislinear guide93 constitute the moving coil type Y axislinear motors83,85.
• One end portion and the other end portion of each of thesliders90,92, which constitute the Y axislinear motors82,83, are fixed in the longitudinal direction of an X axislinear guide87, which extends in the X axial directions. In addition, one end portion and the other end portion of each of thesliders94,95, which constitute the Y axislinear motors84,85, are fixed in the longitudinal direction of an X axislinear guide89, which extends in the X axial directions. Accordingly, the X axislinear guide87 is movable in the Y axial directions by the Y axislinear motors82,83, and the X axislinear guide89 is movable in the Y axial directions by the Y axislinear motors84,85.
• The X axislinear guides87,89 each comprise a coil unit that has built-in armature coils, which, for example, are disposed at prescribed intervals along the X axial directions. The X axislinear guide89 is provided in a state wherein it is inserted in an opening that is formed in the substrate stage ST1. Amagnet unit88, which comprises a permanent magnet group that consists of multiple sets of north pole magnets and south pole magnets disposed alternately and at prescribed intervals along, for example, the X axial directions, is provided in the inner portion of the opening of the substrate stage ST1. Themagnet unit88 and the X axislinear guide89 constitute the moving magnet type X axislinear motor81 that drives the substrate stage ST1 in the X axial directions. Likewise, the X axislinear guide87 is provided in a state wherein it is inserted in an opening formed in the measurement stage ST2. Amagnet unit86 is provided the opening of the measurement stage ST2. Themagnet unit86 and the X axislinear guide87 constitute the moving magnet type X axislinear motor80 that drives the measurement stage ST2 in the X axial directions.
• Furthermore, making the thrust generated by each of the two Y axislinear motors84,85 (or82,83) slightly different makes it possible to control the substrate stage ST1 (or the measurement stage ST2) in the θZ directions. In addition, the substrate stage ST1 and the measurement stage ST2 are each shown in the drawings as single stages, but they each actually comprise an XY stage, which is driven by its respective Y axis linear motor, and a Z tilt stage, which is mounted to an upper portion of the XY stage via a Z leveling drive mechanism (e.g., a voice coil motor) and is finely driven relative to the Z axial directions and the θX and θY directions with respect to the XY stage. Furthermore, the substrate holder PH (refer toFIG. 1), which holds the substrate P, is supported by the Z tilt stage.
• The following explains a parallel process operation that uses the substrate stage ST1 and the measurement stage ST2, referencingFIG. 6 throughFIG. 8B.
• As shown inFIG. 6, when performing immersion exposure of the substrate P, the control apparatus CONT makes the measurement stage ST2 stand by at a prescribed stand-by position where it will not collide with the substrate stage ST1. Furthermore, in a state wherein the substrate stage ST1 and the measurement stage ST2 are spaced apart, the control apparatus CONT performs a step-and-scan type immersion exposure of the substrate P, which is held by the substrate stage ST1. When performing the immersion exposure of the substrate P, the control apparatus CONT uses the liquid immersion mechanism1 to form the liquid immersion region LR of the liquid LQ on the substrate stage ST1.
• After completing the immersion exposure of the substrate P on the substrate stage ST1, the control apparatus CONT uses the drive mechanism SD to drive at least one of the substrate stage ST1 and the measurement stage ST2, and, as shown inFIG. 7A, causes the upper surface F2 of the measurement stage ST2 to be in contact with (or proximate to) the upper surface F1 of the substrate stage ST1. In greater detail, the linear edge of the upper surface F1 (plate member T) of the substrate stage ST1 on the +Y side and the linear edge of the upper surface F2 (liquid repellent member56) of the measurement stage ST2 on the −Y side are caused to be in contact with (or proximate to) one another.
• Next, the control apparatus CONT uses the drive mechanism SD to simultaneously move the substrate stage ST1 and the measurement stage ST2 in the −Y direction, while maintaining the relative positional relationship of the substrate stage ST1 and the measurement stage ST2 in the Y axial directions. Namely, while maintaining a prescribed state wherein the upper surface F1 of the substrate stage ST1 and the upper surface F2 of the measurement stage ST2 contact (or are proximate to) one another, the control apparatus CONT moves them together in the −Y direction within a prescribed area that includes a position that is directly below the projection optical system PL.
• By moving the substrate stage ST1 and the measurement stage ST2 together, the control apparatus CONT moves the liquid LQ, which is retained between the substrate P and the first optical element LS1 of the projection optical system PL, from the upper surface F1 of the substrate stage ST1 to the upper surface F2 of the measurement stage ST2. With the movement of the substrate stage ST1 and the measurement stage ST2 in the −Y direction, the liquid immersion region LR of the liquid LQ, which is formed between the substrate P and the first optical element LS1 of the projection optical system PL, moves to the upper surface of the substrate P, the upper surface F1 of the substrate stage ST1, and the upper surface F2 of the measurement stage ST2, in that order. Furthermore, along the way of moving from the upper surface F1 of the substrate stage ST1 to the upper surface F2 of the measurement stage ST2, the liquid immersion region LR of the liquid LQ spans the upper surface F1 of the measurement stage ST1 and the upper surface F2 of the measurement stage ST2, as shown inFIG. 7B.
• When the substrate stage ST1 and the measurement stage ST2 further move together a prescribed distance in the −Y direction from the state shown inFIG. 7B, they transition to a state wherein the liquid LQ is held between the measurement stage ST2 and the first optical element LS1 of the projection optical system PL, as shown inFIG. 8A. Namely, the liquid immersion region LR of the liquid LQ is disposed on the upper surface F2 of the measurement stage ST2.
• Next, the control apparatus CONT uses the drive mechanism SD to move the substrate stage ST1 to a prescribed substrate exchange position and exchanges the substrate P. In addition, in parallel therewith, prescribed measurement processes that use the measurement stage ST2 are performed as needed. An example of such a measurement process is the baseline measurement of the alignment system ALG. Specifically, the control apparatus CONT uses the mask alignment systems RAa, RAb, which were discussed above, to simultaneously detect a pair of first fiducial marks on the fiducial mark plate FM that is provided on the measurement stage ST2 and corresponding mask alignment marks on the mask M, and thereby detects the positional relationship between the first fiducial marks and the corresponding mask alignment marks. Simultaneous therewith, by detecting a second fiducial mark on the fiducial mark plate FM with the alignment system ALG, the control apparatus CONT detects the positional relationship between the second fiducial mark and a detection reference position of the alignment system ALG. Furthermore, based on the positional relationship between the abovementioned first fiducial marks and the corresponding mask alignment marks, the positional relationship between the second fiducial mark and the detection reference position of the alignment system ALG, and the already known positional relationship between the first fiducial marks and the second fiducial mark, the control apparatus CONT derives the distance (positional relationship) between the center of the projection of the mask pattern projected by the projection optical system PL and the detection reference position of the alignment system ALG, i.e., it derives baseline information of the alignment system ALG.FIG. 8B shows the state at this time.
• Furthermore, the detection of the first fiducial marks by the mask alignment system and the detection of the second fiducial mark by the alignment system ALG do not necessarily need to be performed simultaneously, and may be performed in a sequential time series; in addition, the position of the measurement stage ST2 when detecting the first fiducial marks and the position of the measurement stage ST2 when detecting the second fiducial mark may be different.
• Furthermore, after completing the process discussed above on both stages ST1, ST2, the control apparatus CONT performs the alignment process on the exchanged substrate P by, for example, causing the upper surface F2 of the measurement stage ST2 and the upper surface F1 of the substrate stage ST1 to be in contact with (or proximate to) one another and, in a state wherein that relative positional relationship is maintained, moves them within the XY plane. Specifically, the control apparatus CONT uses the alignment system ALG to detect the alignment marks on the exchanged substrate P and determines the positional coordinates (array coordinates) of each of the plurality of shot regions provided on the substrate P.
• Subsequently, in the reverse sequence of that described earlier, the control apparatus CONT moves both stages ST1, ST2 together in the +Y direction while maintaining the relative positional relationship of the substrate stage ST1 and the measurement stage ST2 in the Y axial directions, and, after moving the substrate stage ST1 (substrate P) to below the projection optical system PL, retracts the measurement stage ST2 to a prescribed position. Thereby, the liquid immersion region LR is disposed on the upper surface F1 of the substrate stage ST1. Also, when moving the liquid immersion region LR of the liquid LQ from the upper surface F2 of the measurement stage ST2 to the upper surface F1 of the substrate stage ST1, the liquid immersion region LR spans the upper surface F1 of the substrate stage ST1 and the upper surface F2 of the measurement stage ST2.
• Subsequently, the control apparatus CONT performs a step-and-scan type immersion exposure operation on the substrate P and sequentially transfers the pattern of the mask M to each of the plurality of shot regions on the substrate P. Furthermore, the alignment of each of the shot regions on the substrate P with the mask M is performed based on the positional coordinates of the plurality of shot regions on the substrate P, which were obtained as a result of the substrate alignment process discussed above, and the baseline information, which was measured immediately beforehand.
• Furthermore, the alignment process may be executed in a state wherein the substrate stage ST1 and the measurement stage ST2 are spaced apart, or one part of the alignment process may be executed in a state wherein the substrate stage ST1 and the measurement stage ST2 are spaced apart and the remaining part may be executed in a state wherein the substrate stage ST1 and the measurement stage ST2 are in contact with (or proximate to) one another. In addition, the measurement operation is not limited to the baseline measurement discussed above; for example, the measurement stage ST2 may be used to perform, for example, luminous flux intensity measurement, luminous flux intensity nonuniformity measurement, or aerial image measurement in parallel with, for example, substrate exchange, and the process of, for example, calibrating the projection optical system PL may be performed based on those measurement results, which are taken into account when subsequently exposing the substrate P.
• In the present embodiment, after the exposure of one substrate P is complete, it is possible to start the next exposure of another substrate P without going through the process of recovering all of the liquid LQ and then resupplying such, which makes it possible to improve throughput. In addition, various measurement operations are performed at the measurement stage ST2 during the substrate exchange operation with the substrate stage ST1, and those measurement results can be taken into account in the exposure operation of the subsequent substrate P, which makes it possible to perform highly accurate exposure operation without leading to a decline in throughput attendant with the measurement operations. In addition, the liquid LQ is always present on the image plane side of the projection optical system PL, which makes it possible to effectively prevent the occurrence of adhered residue (a so-called watermark) of the liquid LQ.
• FIG. 9 shows a state wherein the substrate stage ST1 and the measurement stage ST2 are moved together while maintaining a first state wherein the upper surface F1 of the substrate stage ST1 and the upper surface F2 of the measurement stage ST2 are proximate to (or in contact with) one another. When the substrate stage ST1 and the measurement stage ST2 are in the state (first state) shown inFIG. 9, the overhanging portion H1 of the substrate stage ST1 is disposed over the recessedportion54 of the measurement stage ST2. Thereby, in the first state, therecovery ports51 provided on the inner side of the recessedportion54 transition to a state wherein they are closed by the overhanging portion H1. In addition, the vicinity of the areas wherein the upper surface F1 of the substrate stage ST1 and the upper surface F2 of the measurement stage ST2 are mutually proximate to (or in contact with) one another are formed by the plate member T and theliquid repellent member56, respectively, and are liquid repellent. Accordingly, even if the liquid LQ of the liquid immersion region LR is disposed on a gap GI between the upper surface F1 of the substrate stage ST1 (plate member T) and the upper surface F2 of the measurement stage ST2 (liquid repellent member56), the surface tension of the liquid LQ can suppress the occurrence of a problem wherein the liquid LQ leaks out through the gap G1. Furthermore, the plate member T and theliquid repellent member56 are replaceably provided, which makes it possible to provide the stages ST1, ST2 with a plate member T and aliquid repellent member56 that are made of a material that has physical properties that are optimal for the type (physical properties) of the liquid LQ used so that the liquid LQ does not leak out from the gap G1. In addition, if the liquid repellency performance of a member deteriorates, it can be replaced.
• In addition, in the prescribed state wherein the upper surface F1 of the substrate stage ST1 and upper surface F2 of the measurement stage ST2 are proximate to (or in contact with) one another, the upper surface F1 of the substrate stage ST1 and the upper surface F2 of the measurement stage ST2 are substantially flush with one another, which makes it possible to satisfactorily move the liquid immersion region LR of the liquid LQ between the upper surface F1 of the substrate stage ST1 and the upper surface F2 of the measurement stage ST2.
• Furthermore, by moving the substrate stage ST1 and the measurement stage ST2 together in a state wherein therecovery ports51 are closed by the overhanging portion H1, the control apparatus CONT moves the liquid immersion region LR between the upper surface F1 of the substrate stage ST1 and the upper surface F2 of the measurement stage ST2 in a state wherein the liquid LQ is held between the projection optical system PL and at least one of the upper surface F1 of the substrate stage ST1 and the upper surface F2 of the measurement stage ST2.
• In addition, even if the liquid LQ leaks out of the gap G1 when the liquid immersion region LR is moved in the first state, thegroove portion55 is provided on the lower side of the gap G1, and the liquid LQ that leaks out is consequently trapped by thegroove portion55. Accordingly, it is possible to prevent the occurrence of the problem wherein the liquid LQ flows out, for example, to the outer sides of the stages ST1, ST2 or onto the base member BP. In addition, because therecovery ports51 of therecovery mechanism50 are provided on the inner side of thegroove portion55, the liquid LQ that leaks out from the gap G1 can be recovered through therecovery ports51.
• FIG. 10 shows a state (second state) wherein the liquid LQ is being recovered through therecovery ports51. For example, in cases when all of the liquid LQ of the liquid immersion region LR is recovered, such as when maintenance of the exposure apparatus EX is performed, the control apparatus CONT sets the relative positional relationship between the substrate stage ST1 and the measurement stage ST2 to the second state shown inFIG. 10, which is different from the first state. Namely, the control apparatus CONT controls the drive of the drive mechanism SD to form a gap G2 between the upper surface F1 of the substrate stage ST1 and the upper surface F2 of the measurement stage ST2, thereby exposing thegroove portion55 and therecovery ports51 provided on the inner side thereof. At this time, one part of the lower surface Tb of the overhanging portion H1 (plate member T) is disposed so that it overlaps anupper surface58 above thegroove portion55, which is an area of one part of the recessedportion54 of the measurement stage ST2. A prescribed gap G3 is formed between the lower surface Tb of the plate member T and theupper surface58. Furthermore, in the second state wherein the gap G2 is formed between the upper surface F1 of the substrate stage ST1 and the upper surface F2 of the measurement stage ST2 and therecovery ports51 are exposed, the liquid LQ is recovered by therecovery ports51 of the measurement stage ST2 while moving the substrate stage ST1 and the measurement stage ST2 together. By moving the substrate stage ST1 and the measurement stage ST2 and disposing the gap G2 below the projection optical system PL, the liquid LQ held below the projection optical system PL flows into thegroove portion55 through the gap G2 by the force of gravity, and is collected through therecovery ports51. In addition, when the gap G2 is formed and the liquid LQ is being recovered, the prescribed gap G3 formed between the lower surface Tb of the plate member T and theupper surface58 makes it possible to suppress the flow of the liquid LQ, which flowed in from the gap G2, out through the gap G3 by the surface tension of the liquid LQ. Furthermore, in the state shown inFIG. 10, therecovery mechanism50 may recover the liquid LQ in a state wherein the substrate stage ST1 and the measurement stage ST2 are stopped.
• In addition, control apparatus CONT performs the operation of recovering the liquid LQ via therecovery ports51 provided to the measurement stage ST2 in parallel with the operation of recovering the liquid via therecovery ports22 of thenozzle member70 of the liquid immersion mechanism1. For example, when the liquid immersion region LR is on the upper surface F1 of the substrate stage ST1 or on the upper surface F2 of the measurement stage ST2, the control apparatus CONT uses the drive mechanism SD to move the stages ST1, ST2 while recovering the liquid LQ via therecovery ports22 of thenozzle member70, and thereby moves the liquid immersion region LR to the gap G2. Furthermore, when the liquid LQ of the liquid immersion region LR begins to flow into the groove portion55 (or before it begins to flow in, or after a prescribed time has elapsed since it began to flow in), the control apparatus CONT drives therecovery mechanism50 and starts the operation of recovering the liquid LQ via therecovery ports51 that are provided to the measurement stage ST2. At this time, the operation of recovering the liquid via therecovery ports22 of thenozzle member70 of the liquid immersion mechanism1 continues. Therecovery ports22 of the liquid immersion mechanism1 recover the liquid LQ from above the measurement stage ST2. The liquid LQ of the liquid immersion region LR flows into thegroove portion55 by the force of gravity, and is recovered by therecovery ports51 of the measurement stage ST2 and by therecovery ports22 of the liquid immersion mechanism1, which are provided above the measurement stage ST2.
• As explained above, therecovery ports51 that are provided to the measurement stage ST2 can satisfactorily recover the liquid LQ. Providing therecovery ports51 to the measurement stage ST2 disposed on the image plane side of the projection optical system PL makes it possible to rapidly and satisfactorily recover the liquid LQ by the force of gravity. In addition, because therecovery ports51 are provided to the measurement stage ST2, it is possible to suppress adverse effects upon the substrate stage ST1 when recovering the liquid LQ.
• In addition, according to the present embodiment, it is possible to switch between one state, wherein the liquid immersion region LR moves between the upper surface F1 of the substrate stage ST1 and the upper surface F2 of the measurement stage ST2, and another state, wherein the liquid LQ is recovered using therecovery ports51, merely by changing the relative positional relationship between the substrate stage ST1 and the measurement stage ST2, and it is also possible, with a simple configuration, to rapidly recover the liquid LQ while preventing it from leaking out.
Second Embodiment
• The following explains the second embodiment, referencingFIG. 11. In the explanation below, constituent parts that are identical or equivalent to those in the embodiments discussed above are assigned identical symbols, and the explanations thereof are therefore abbreviated or omitted.
• The distinctive feature of the second embodiment is that aliquid recovery member57 is disposed on the inner side of thegroove portion55. Theliquid recovery member57 is disposed on therecovery ports51. Theliquid recovery member57 comprises a sponge member that consists of, for example, a ceramic porous member or a synthetic resin. The liquid LQ can be satisfactorily held by disposing theliquid recovery member57 in this manner. In addition, disposing theliquid recovery member57 in thegroove portion55 makes it possible to omit therecovery mechanism50, which includes therecovery ports51. Because the liquid LQ is held by theliquid recovery member57 even if therecovery mechanism50 is omitted, it is possible to prevent the problem wherein the liquid LQ flows out, for example, onto the base member BP. In addition, making theliquid recovery member57 replaceable makes it possible to replace the one that holds the liquid LQ or a contaminated one with a new one.
Third Embodiment
• The following explains the third embodiment, referencingFIG. 12. The distinctive feature of the third embodiment is that therecovery ports51 are provided to the upper surface F2 of the measurement stage ST2. Namely, in the present embodiment, therecovery ports51 are not formed on the inner side of the recessedportion54. Furthermore, the recessedportion54 that corresponds to the overhanging portion H1 of the substrate stage ST1 is formed on the −Y side area of the upper surface of the measurement stage ST2. Furthermore, in the third embodiment as well, a plurality of therecovery ports51 can be provided along the X directions.
• When recovering the liquid LQ, the control apparatus CONT disposes the liquid immersion region LR on the upper surface F2 of the measurement stage ST2 and recovers the liquid LQ through therecovery ports51 that are formed in that upper surface F2. In the present embodiment, because therecovery ports51 and the liquid LQ directly contact one another, the liquid LQ can be satisfactorily recovered. Furthermore, in the third embodiment, it is also possible to omit the overhanging portion (protruding portion) H1 of the substrate stage ST1 and the recessedportion54 of the measurement stage ST2.
Fourth Embodiment
• The following explains the fourth embodiment, referencingFIG. 13. The distinctive feature of the fourth embodiment is that a protruding portion H1′, which projects from the substrate stage ST1 toward the measurement stage ST2, is provided at substantially the center portion of the side surface of the substrate stage ST1 in the Z axial directions. Namely, in the present embodiment, the protruding portion H1′ does not form the upper surface F1 of the substrate stage ST1. In addition, a recessedportion54′ that corresponds to the protruding portion H1′ is formed in the measurement stage ST2.
Fifth Embodiment
• FIG. 14 shows the fifth embodiment. As shown inFIG. 14, the protruding portion H1′ may be provided at substantially the center portion of the side surface of the measurement stage ST2 in the Z axial directions, and the recessedportion54′ may be provided in the substrate stage ST1. Furthermore, thegroove portion55 may be formed in the protruding portion H1′ and therecovery ports51 may be provided on the inner side of thatgroove portion55. In addition, in the present embodiment, when moving the liquid immersion region LR between the upper surface F1 of the substrate stage ST1 and the upper surface F2 of the measurement stage ST2, the substrate stage ST1 and the measurement stage ST2 may approach one another and the protruding portion H1′ may be disposed on the inner side of the recessedportion54′.
• Furthermore, in the second through fifth embodiments discussed above, it is also possible to jointly use therecovery ports22 of the liquid immersion mechanism1 when recovering all of the liquid LQ.
• In addition, in the first and second embodiments discussed above, thegroove portion55 of the measurement stage ST2 is continuously formed from one end to the other end of the measurement stage ST2 in the X axial directions, but may be provided at just one part in the X axial directions, or may be discontinuously formed.
• In addition, in the first and fifth embodiments discussed above, therecovery ports51 are disposed in the bottom surface of thegroove portion55, but, instead of forming the recovery ports, at least one thin tube that has micropores that form the recovery ports may be disposed inside thegroove portion55. In this case, the thin tube itself constitutes one part of thepassageway52.
• In addition, in the first, second and fifth embodiments discussed above, the bottom surface of thegroove portion55 is a flat surface, but it may be inclined with respect to the XY plane. In this case, at least onerecovery port51 may be disposed in the vicinity below that inclined bottom surface. In addition, making that inclined bottom surface liquid repellent in advance makes it possible to recover the liquid inside thegroove portion55 more reliably.
• In addition, in the first through fifth embodiments discussed above, the number and arrangement of the recovery ports of the measurement stage ST2 can be suitably modified.
• In addition, in the first through fifth embodiments discussed above, the recovery ports can also be made movable in the Z axial directions.
• In addition, in the first through fifth embodiments discussed above, the recovery ports can also be formed with a lyophilic material (e.g., a metal such as titanium).
• In addition, in the first through fifth embodiments discussed above, if a plurality of therecovery ports51 is provided along the X axial directions, then a lyophilic fine groove (e.g., having a width of approximately 0.5 mm) may be formed in, for example, the bottom surface of thegroove portion55, wherein the plurality ofrecovery ports51 are formed, or in the stage upper surface F2 so as to connect adjoining recovery ports. In this case, the liquid inside that fine groove is collected by the capillary phenomenon, and can be efficiently recovered from therecovery ports51.
• In addition, in the first through fifth embodiments discussed above, moving the recovery ports51 (groove portion55) when recovering the liquid in the space of the optical path on the image plane side of the projection optical system PL from the recovery ports51 (groove portion55) makes it possible to recover the liquid more reliably. For example, the liquid can be recovered from the recovery ports51 (groove portion55) while, for example, alternately moving the measurement stage ST2 (substrate stage ST1) in the +Y and the −Y directions.
• In addition, in the first through fifth embodiments discussed above, the plate member T of the substrate stage ST1 is detachably configured, but it does not necessarily need to be detachable, and may be integrally formed with the base material PHB.
• In addition, in the first through fifth embodiments discussed above, therecovery ports51 are provided to the measurement stage ST2, but they may be provided to the substrate stage ST1 instead of the measurement stage ST2, or they may be provided to each of the two stages.
• In addition, in the first through fifth embodiments discussed above, it is preferable to provide in advance a buffer space of a prescribed volume, for example, along therecovery pipe23 between the vacuum system (suction system) and therecovery ports22 of theliquid recovery mechanism20, or along thepassageway52 between the vacuum system (suction system)53 and therecovery ports51. The provision of such a buffer space makes it possible to continue the suction (recovery) of the liquid inside, for example, therecovery pipe23 or the groove portion55 (passageway52) for a prescribed time because that buffer space is negatively pressurized even if the air intake (exhaust air) operation by the vacuum system is stopped due to, for example, a power failure.
• In addition, each of the embodiments discussed above comprises a plurality of (e.g., two) movable substrate stages that hold the substrate P, as disclosed in, for example, Japanese Unexamined Patent Application, Publication No. H10-163099, Japanese Unexamined Patent Application, Publication No. H10-214783, and Published Japanese Translation No. 2000-505958 of the PCT International Application, and can also be adapted to a so-called multistage type exposure apparatus.
• As discussed above, the liquid LQ in the present embodiment is pure water. Pure water is advantageous because it can be easily obtained in large quantities at, for example, a semiconductor fabrication plant, and does not adversely impact, for example, the optical element (lens) and the photoresist on the substrate P. In addition, because pure water does not have an adverse impact on the environment and has an extremely low impurity content, it can also be expected to have the effect of cleaning the upper surface of the substrate P and the tip surface of the optical element of the projection optical system PL. Furthermore, the exposure apparatus may be provided with an ultrapure water manufacturing apparatus if the pure water supplied from, for example, the plant is of low purity.
• Further, the refractive index n of pure water (water) with respect to the exposure light EL that has a wavelength of approximately 193 nm is said to be substantially 1.44; therefore, the use of ArF excimer laser light (193 nm wavelength) as the light source of the exposure light EL shortens the wavelength on the substrate P to 1/n, i.e., approximately 134 nm, and thereby a high resolution is obtained. Furthermore, because the depth of focus increases approximately n times, i.e., approximately 1.44 times, that of in air, the numerical aperture of the projection optical system PL can be further increased if it is preferable to ensure a depth of focus that is approximately the same as that when used in air, and the resolution is also improved from this standpoint.
• The projection optical system of the embodiments discussed above fills the liquid in the space of the optical path on the image plane side of the tip optical element, but it is also possible to employ a projection optical system that also fills the liquid in the space of the optical path on the mask side of the tip optical element, as disclosed in PCT International Publication No. WO2004/019128.
• Furthermore, although the liquid LQ in the present embodiment is water, it may be a liquid other than water; for example, if the light source of the exposure light EL is an F₂laser, then this F₂laser light will not transmit through water, so it would be acceptable to use as the liquid LQ a fluorine based fluid that is capable of transmitting F₂laser light, such as perfluorinated polyether (PFPE) or fluorine based oil. In this case, the parts (components) that make contact with the liquid LQ are treated in order to make them lyophilic by forming a thin film with, for example, a substance that has a molecular structure that contains fluorine and that has low polarity. In addition, it is also possible to use as the liquid LQ a liquid (e.g., cedar oil) that is transparent to the exposure light EL, has the highest possible refractive index, and is stable with respect to the projection optical system PL and the photoresist coated on the front surface of the substrate P. In this case as well, the surface treatment is performed in accordance with the polarity of the liquid LQ used.
• Furthermore, the substrate P in each of the abovementioned embodiments is not limited to a semiconductor wafer for fabricating semiconductor devices; for example, a glass substrate for a display device, a ceramic wafer for a thin film magnetic head, a mask or the original plate of a reticle (synthetic quartz, silicon wafer) used by an exposure apparatus can be employed as the substrate P.
• The exposure apparatus EX can also be adapted to a step-and-scan type scanning exposure apparatus (scanning stepper) that scans and exposes the pattern of the mask M by synchronously moving the mask M and the substrate P, as well as to a step-and-repeat type projection exposure apparatus (stepper) that performs full field exposure of the pattern of the mask M with the mask M and the substrate P in a stationary state, and sequentially steps the substrate P.
• In addition, the exposure apparatus EX can also be adapted to an exposure apparatus that uses a projection optical system (e.g., a dioptric projection optical system, which does not include a reflecting element, with a ⅛ reduction magnification) to perform full field exposure of a reduced image of a first pattern onto the substrate P in a state wherein the first pattern and the substrate P are substantially stationary. In this case, the exposure apparatus EX can also be adapted to a stitching type full field exposure apparatus that subsequently further uses that projection optical system to perform full field exposure of a reduced image of a second pattern, in a state wherein the second pattern and the substrate P are substantially stationary, onto the substrate P so that the second pattern partially overlaps the first. In addition, the stitching type exposure apparatus can also be adapted to a step-and-stitch type exposure apparatus that transfers at least two patterns onto the substrate P so that they partially overlap, and sequentially steps the substrate P.
• The type of exposure apparatus EX is not limited to semiconductor device fabrication exposure apparatuses that expose the pattern of a semiconductor device on the substrate P, but can also be widely adapted to exposure apparatuses for fabricating liquid crystal devices or displays, and exposure apparatuses for fabricating, for example, thin film magnetic heads, imaging devices (CCDs), or reticles and masks.
• The exposure apparatus EX of the embodiments in the present application is manufactured by assembling various subsystems, including each constituent element recited in the claims of the present application, so that prescribed mechanical, electrical, and optical accuracies are maintained. To ensure these various accuracies, adjustments are performed before and after this assembly, including an adjustment to achieve optical accuracy for the various optical systems, an adjustment to achieve mechanical accuracy for the various mechanical systems, and an adjustment to achieve electrical accuracy for the various electrical systems. The process of assembling the exposure apparatus from the various subsystems includes the mutual mechanical connection of the various subsystems, the wiring and connection of electrical circuits, the piping and connection of the atmospheric pressure circuit, and the like. Naturally, before the process of assembling the exposure apparatus from these various subsystems, there are also the processes of assembling each individual subsystem. When the process of assembling the exposure apparatus from the various subsystems is complete, a comprehensive adjustment is performed to ensure the various accuracies of the exposure apparatus as a whole. Furthermore, it is preferable to manufacture the exposure apparatus in a clean room wherein, for example, the temperature and the cleanliness level are controlled.
• As shown inFIG. 15, a micro-device, such as a semiconductor device, is manufactured by: astep201 that designs the functions and performance of the micro-device; astep202 that fabricates a mask (reticle) based on this design step; astep203 that fabricates a substrate, which is the base material of the device; asubstrate processing step204 that includes a process wherein the exposure apparatus EX of the embodiments discussed above exposes a pattern of the mask onto the substrate; a device assembling step205 (comprising a dicing process, a bonding process, and a packaging process); an inspectingstep206; and the like.

Claims (19)

1. A lithographic apparatus comprising:

a substrate stage configured to support a substrate and a second stage;

a liquid confinement system configured to at least partly confine liquid in a space between a projection system and the substrate stage, a substrate supported by the substrate stage, or both;

the substrate stage and the second stage constructed and arranged for mutual cooperation to perform a joint movement wherein the liquid in the liquid confinement structure is transferred from being confined by the substrate or the substrate stage or both to being confined by the second stage, the liquid crossing an edge of the substrate stage and an opposing edge of the second stage,

wherein the substrate stage, the second stage, or both, comprises a channel system in fluid communication with an opening defined by the edge of the stage, the channel system constructed and arranged to generate a fluid flow along the edge during the joint movement, the fluid flow including liquid from the liquid confinement structure.

2. A lithographic apparatus comprising:

a substrate stage configured to support a substrate and a second stage;

a liquid confinement system configured to at least partly confine liquid in a space between a projection system and the substrate stage, a substrate supported by the substrate stage, or both;

the substrate stage and the second stage constructed and arranged for mutual cooperation to perform a joint movement wherein the liquid in the liquid confinement structure is transferred from being confined by the substrate or the substrate stage or both to being confined by the second stage, the liquid crossing an edge of the substrate stage and an opposing edge of the second stage,

wherein the substrate stage, the second stage, or both, comprises a gutter located under the edge of the respective stage, the gutter constructed and arranged to collect liquid from the liquid confinement structure flowing down one or both edges during the joint movement.

3. A lithographic apparatus comprising:

a substrate stage configured to support a substrate and a second stage;

a liquid confinement system configured to at least partly confine liquid in a space between a projection system and the substrate stage, a substrate supported by the substrate stage, or both;

the substrate stage and the second stage constructed and arranged for mutual cooperation to perform a joint movement wherein the liquid in the liquid confinement structure is transferred from being confined by the substrate or the substrate stage or both to being confined by the second stage, the liquid crossing an edge of the substrate stage and an opposing edge of the second stage,

wherein the substrate stage, the second stage, or both, comprises a fluid extraction system constructed and arranged to collect liquid flowing between the edges during the joint movement.

4. A lithographic apparatus comprising:

a substrate stage configured to support a substrate, the substrate stage having an edge;

a further stage having a corresponding edge, the corresponding edge constructed and arranged to mutually co-operate with the edge when the substrate stage and the further stage are arranged adjacently to define a gap; and

a liquid confinement structure configured to at least partly confine immersion liquid in a space between a projection system and a substrate, the substrate stage, or both,

wherein, during a joint movement of the substrate stage and the further stage, confinement of liquid in the space by the substrate stage, the substrate or both is replaced by the further stage, and

the substrate stage, the further stage, or both, comprises a fluid extraction system constructed and arranged to collect immersion liquid in the gap during the joint movement.

5. The lithographic apparatus ofclaim 4, wherein the fluid extraction system comprises a gutter constructed and arranged to collect immersion liquid under the substrate stage, the further stage or both flowing from the gap before, during and/or after joint movement.

6. The lithographic apparatus ofclaim 5, wherein the gutter is attached to the substrate stage and/or the further stage.

7. The lithographic apparatus ofclaim 6, wherein the gutter is located under the edge of the stage to which it is attached.

8. The lithographic apparatus ofclaim 4, wherein the fluid extraction system comprises a channel system comprised in the substrate stage, the further stage or both and which is in fluid communication with an opening defined in the edge, the corresponding edge or both, the channel system constructed and arranged to generate a fluid flow along the gap during the joint movement.

9. The lithographic apparatus ofclaim 8, wherein the fluid flow comprises liquid and gas away from the gap.

10. The lithographic apparatus ofclaim 4, further comprising a positioning system comprising a motor to move the substrate stage and/or the further stage and constructed and arranged to control the motor during the joint movement so that the distance between the edge and the corresponding edge is controlled.

11. The lithographic apparatus ofclaim 10, wherein the distance between the edge and the corresponding edge is controlled to be in the range of 0 to 1 mm.

12. The lithographic apparatus ofclaim 10, wherein the positioning system comprises an interferometer system comprising a mirror located on the edge or the corresponding edge.

13. The lithographic apparatus ofclaim 12, wherein the mirror is on a surface staggered away from the edge or the corresponding edge.

14. The lithographic apparatus ofclaim 12, wherein the mirror is located in a protective niche defined in the edge or the corresponding edge.

15. The lithographic apparatus ofclaim 12, wherein the mirror is located underneath the fluid extraction system.

16. The lithographic apparatus ofclaim 4, wherein the further stage is a substrate stage configured to support a further substrate.

17. The lithographic apparatus ofclaim 4, wherein the further stage is an actuated closing stage.

18. A device manufacturing method, comprising:

supporting a substrate on a substrate table, wherein the substrate table is laterally movable with respect to an adjacent table;

at least partly confining immersion liquid in a space between a projection system and the substrate table, the substrate or both;

jointly moving the substrate table with the adjacent table, the adjoining edges of the substrate table and the adjacent table mutually cooperating to define a gap, so that the liquid in the space is contained by the adjacent table instead of the substrate table; and

collecting immersion liquid in the gap during joint movement using a fluid extraction system.

19. The lithographic apparatus according toclaim 12, wherein the mirror is in a niche of the stage in order to protect the mirror.

Images