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US20120305221A1 - Heat pipe-attached heat sink - Google Patents

Heat pipe-attached heat sink
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Publication number
US20120305221A1
US20120305221A1US13/152,234US201113152234AUS2012305221A1US 20120305221 A1US20120305221 A1US 20120305221A1US 201113152234 AUS201113152234 AUS 201113152234AUS 2012305221 A1US2012305221 A1US 2012305221A1
Authority
US
United States
Prior art keywords
flat
bottom block
heat
radiation
heat pipe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US13/152,234
Inventor
Tsung-Hsien Huang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by IndividualfiledCriticalIndividual
Priority to US13/152,234priorityCriticalpatent/US20120305221A1/en
Publication of US20120305221A1publicationCriticalpatent/US20120305221A1/en
Abandonedlegal-statusCriticalCurrent

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Abstract

A heat pipe-attached heat sink includes a bottom block having an opening and locating grooves arranged on the flat bottom wall thereof, a radiation fin module consisting of first radiation fins and second radiation fins, each first radiation fin having extension abutment strip that has a flat bottom abutment edge and locating grooves located on the flat bottom abutment edge and dividing the flat bottom abutment edge into a plurality of spacer ribs, the extension abutment strips of the first radiation being tightly plugged into the opening of the bottom block, and heat pipes respectively press-fitted into the locating grooves of the bottom block and the locating grooves of the first radiation fins of the radiation fin module, each heat pipe having a planar peripheral side exposed outside the radiation fin module and the bottom block and kept in flush with the flat bottom abutment edge of the extension abutment strips for direct contact with an external heat source.

Description

Claims (17)

1. A heat pipe-attached heat sink, comprising:
a bottom block comprising an opening cut through opposing flat top and bottom walls thereof and a plurality of locating grooves arranged on the flat bottom wall and extended to said opening;
a radiation fin module fastened to said bottom block, said radiation fin module comprising a plurality of first radiation fins and second radiation fins arranged in a stack, each said first radiation fin comprising an extension abutment strip, said extension abutment strip comprising a flat bottom abutment edge and a plurality of locating grooves located on said flat bottom abutment edge and dividing said flat bottom abutment edge into a plurality of spacer ribs, the extension abutment strips of said first radiation fins forming a protruding block and being tightly plugged into the opening of said bottom block; and
a plurality of heat pipes respectively press-fitted into the locating grooves of said bottom block and the locating grooves of the extension abutment strips of said first radiation fins of said radiation fin module, each said heat pipe comprising a planar peripheral side exposed outside said radiation fin module and said bottom block for direct contact with an external heat source.
US13/152,2342011-06-022011-06-02Heat pipe-attached heat sinkAbandonedUS20120305221A1 (en)

Priority Applications (1)

Application NumberPriority DateFiling DateTitle
US13/152,234US20120305221A1 (en)2011-06-022011-06-02Heat pipe-attached heat sink

Applications Claiming Priority (1)

Application NumberPriority DateFiling DateTitle
US13/152,234US20120305221A1 (en)2011-06-022011-06-02Heat pipe-attached heat sink

Publications (1)

Publication NumberPublication Date
US20120305221A1true US20120305221A1 (en)2012-12-06

Family

ID=47260772

Family Applications (1)

Application NumberTitlePriority DateFiling Date
US13/152,234AbandonedUS20120305221A1 (en)2011-06-022011-06-02Heat pipe-attached heat sink

Country Status (1)

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US (1)US20120305221A1 (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US9593887B2 (en)2015-04-132017-03-14Tai-Sol Electronics Co., LtdHeat dissipation structure with heat pipes arranged in two spaced and partially overlapped layers
US20170231116A1 (en)*2016-02-052017-08-10Auras Technology Co., Ltd.Heat dissipating device
US20180088637A1 (en)*2016-09-232018-03-29Lenovo (Singapore) Pte. Ltd.Electronic apparatus
WO2018214096A1 (en)*2017-05-252018-11-29罗伯特·博世有限公司Cooling device
US20190254190A1 (en)*2018-02-132019-08-15Sy-Thermal Inc.Handheld communication device and thin heat dissipating structure thereof
US20210392787A1 (en)*2018-11-012021-12-16Samsung Electronics Co., Ltd.Heat dissipation structure and electronic device including same
US11266040B2 (en)*2019-05-092022-03-01Lenovo (Singapore) Pte LtdHeat transport device
US20230102571A1 (en)*2020-03-272023-03-30Sony Interactive Entertainment Inc.Heat radiating device and electronic apparatus
US12398959B2 (en)*2022-01-282025-08-26Asia Vital Components Co., Ltd.Thermal module

Citations (13)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US5472243A (en)*1994-05-171995-12-05Reynolds Metals CompanyFluted tube joint
US5829516A (en)*1993-12-151998-11-03Aavid Thermal Products, Inc.Liquid cooled heat sink for cooling electronic components
US6853555B2 (en)*2002-04-112005-02-08Lytron, Inc.Tube-in-plate cooling or heating plate
US20050073811A1 (en)*2003-10-072005-04-07Yaxiong WangHeat dissipating device for electronic component
US20060032617A1 (en)*2004-08-142006-02-16Hon Hai Precision Industry Co., Ltd.Heat sink electronic components
US20070215327A1 (en)*2006-03-152007-09-20Cheng-Tien LaiHeat dissipation device
US20080028610A1 (en)*2006-07-262008-02-07Shyh-Ming ChenMethod for assembling a vertical heat radiator
US20080047693A1 (en)*2006-08-222008-02-28Shyh-Ming ChenCooler
US20080060793A1 (en)*2006-09-082008-03-13Tsung-Hsien HuangCooler device
US20090166009A1 (en)*2007-12-292009-07-02Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.Heat dissipation device having heat pipes for supporting heat sink thereon
US20090178787A1 (en)*2008-01-112009-07-16Tsung-Hsien HuangCooler module without base panel
US20090242169A1 (en)*2008-03-272009-10-01Meyer Iv George AnthonyHeat-dissipating device with curved vapor chamber
US7597134B2 (en)*2007-03-072009-10-06Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.Heat dissipation device with a heat pipe

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US5829516A (en)*1993-12-151998-11-03Aavid Thermal Products, Inc.Liquid cooled heat sink for cooling electronic components
US5472243A (en)*1994-05-171995-12-05Reynolds Metals CompanyFluted tube joint
US6853555B2 (en)*2002-04-112005-02-08Lytron, Inc.Tube-in-plate cooling or heating plate
US20050073811A1 (en)*2003-10-072005-04-07Yaxiong WangHeat dissipating device for electronic component
US20060032617A1 (en)*2004-08-142006-02-16Hon Hai Precision Industry Co., Ltd.Heat sink electronic components
US20070215327A1 (en)*2006-03-152007-09-20Cheng-Tien LaiHeat dissipation device
US20080028610A1 (en)*2006-07-262008-02-07Shyh-Ming ChenMethod for assembling a vertical heat radiator
US20080047693A1 (en)*2006-08-222008-02-28Shyh-Ming ChenCooler
US20080060793A1 (en)*2006-09-082008-03-13Tsung-Hsien HuangCooler device
US7597134B2 (en)*2007-03-072009-10-06Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.Heat dissipation device with a heat pipe
US20090166009A1 (en)*2007-12-292009-07-02Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.Heat dissipation device having heat pipes for supporting heat sink thereon
US20090178787A1 (en)*2008-01-112009-07-16Tsung-Hsien HuangCooler module without base panel
US20090242169A1 (en)*2008-03-272009-10-01Meyer Iv George AnthonyHeat-dissipating device with curved vapor chamber

Cited By (12)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US9593887B2 (en)2015-04-132017-03-14Tai-Sol Electronics Co., LtdHeat dissipation structure with heat pipes arranged in two spaced and partially overlapped layers
US20170231116A1 (en)*2016-02-052017-08-10Auras Technology Co., Ltd.Heat dissipating device
US20180088637A1 (en)*2016-09-232018-03-29Lenovo (Singapore) Pte. Ltd.Electronic apparatus
CN107870661A (en)*2016-09-232018-04-03联想(新加坡)私人有限公司Electronic equipment
US10831247B2 (en)*2016-09-232020-11-10Lenovo (Singapore) Pte. Ltd.Electronic apparatus
WO2018214096A1 (en)*2017-05-252018-11-29罗伯特·博世有限公司Cooling device
US20190254190A1 (en)*2018-02-132019-08-15Sy-Thermal Inc.Handheld communication device and thin heat dissipating structure thereof
US20210392787A1 (en)*2018-11-012021-12-16Samsung Electronics Co., Ltd.Heat dissipation structure and electronic device including same
US11800688B2 (en)*2018-11-012023-10-24Samsung Electronics Co., Ltd.Heat dissipation structure and electronic device including same
US11266040B2 (en)*2019-05-092022-03-01Lenovo (Singapore) Pte LtdHeat transport device
US20230102571A1 (en)*2020-03-272023-03-30Sony Interactive Entertainment Inc.Heat radiating device and electronic apparatus
US12398959B2 (en)*2022-01-282025-08-26Asia Vital Components Co., Ltd.Thermal module

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Legal Events

DateCodeTitleDescription
STCBInformation on status: application discontinuation

Free format text:ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION


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