US20120298346A1

Movatterモバイル変換

Info

Publication number: US20120298346A1
Application number: US13/518,689
Authority: US
Inventors: Jang-Hyung Cho
Original assignee: CEDIC CO Ltd
Current assignee: CEDIC CO Ltd
Priority date: 2009-12-24
Filing date: 2010-12-13
Publication date: 2012-11-29
Also published as: WO2011078507A3; KR100970747B1; WO2011078507A2

Abstract

Disclosed is a bent-type dissipater, including one or a plurality of heat sinks which are adapted with cooling apertures; one or a plurality of cooling pins which are bent in structure, and which are integrated to the heat sinks, and a central heat passage for combining heat moving in one direction with ambient air, and discharging the heat in the opposite direction.

Description

TECHNICAL FIELD

The present invention relates to a bent-type heat dissipater, particularly a bent-type heat dissipater that can improve easiness of manufacturing, weight reduction, and heat transfer performance by integrally forming a plurality of heat dissipation fins to be bent, and improve the operational performance of a device with a heat-generating unit by ensuring paths through which heat can flow.

BACKGROUND ART

In general, light emitting diode lamps (hereafter, referred to as ‘LED lighting device’) have the advantage in that economical efficiency is excellent because the efficiency of light to unit power is remarkably high in comparison to incandescent lamps and fluorescent lamps that are presently used.

That is, LEDs have the advantage in that they are eco-friendly and have a long life span because they generate a small amount of carbon and a small amount of heat, in addition to obtaining a desired amount of light from low voltage. Therefore, LEDs have been widely used for lighting devices, which can replace incandescent lamps and fluorescent lamps.

LED lighting devices have a problem in that it is difficult to obtain a desired amount of light due to heat from a plurality of LEDs when being used for a predetermined period of time due to the features and the life span of the LEDs rapidly decreases due to a gradual increase in the amount of generated heat when being continuously used.

In order to solve the problem, LED lighting devices have been configured to dissipate heat to the outside by attaching a heat sink made of metal (for example, aluminum) to the rear side of a substrate equipped with LEDs, in the related art. In this configuration, a plurality of heat dissipation fins for dissipating heat and a plurality of holes (also called discharge holes or convection holes) for passing external air and internal heat are formed at the outer side of the heat sink.

However, since the heat sink of the related art is made of not a single material, but a mixture of several materials, and is manufactured by die casting, performance of heat transfer is not good. Further, there is a problem in that the heat sink is heavy and this makes it difficult to reduce the weight of the device, and the cost increases due to a complicate manufacturing process.

Further, the heat sink has a structure in which the heat generated by the heat-generating unit transfers to the heat sink simply through only a contact type, without an inpassage, that is a passage, for external air which connects the heat-generating unit with the heat sink.

According to the structure, natural convection becomes slow locally only around the holes of the heat sink and the heat generated from the heat-generating units stops and cannot be quickly discharged.

Therefore, the heat generated from the heat-generating unit is not quickly discharged to the outside, such that it is impossible to prevent the heat-generating unit from continuously increasing in temperature, and accordingly, the life span or the function of the LEDs and the parts around are decreased, thus deteriorating the operational performance of the device.

DISCLOSURETechnical Problem

Therefore, the present invention has been made in an effort to solve the problems in the related art and the first object of the present invention is to provide a bent-type heat dissipater that can be more easily manufactured and can improve heat transfer performance, by forming integral heat dissipation fins by machining one thin metal plate from a single material, and by bending up the integral heat dissipation fins to make the heat dissipater in one structure.

Further, the second object of the present invention is to provide a bent-type heat dissipater that allows heat generated from a heat-generating unit to be quickly discharged to the outside by ensuring a passage through which the heat generated from the heat-generating unit can be discharged outside together with external air.

Technical Solution

In order to achieve the object, a bent-type heat dissipater of the present invention includes: a heat dissipation plate having one or a plurality of cooling holes that form passages to discharge heat, which transfers in one direction, together with external air in the opposite direction; and one or a plurality of heat dissipation fins integrally bent from the heat dissipation plate.

The cooling hole is preferably formed at the center of the heat dissipation plate. Further, it is preferable that the cooling hole is formed in a size of 20 to 80% of the size of the heat dissipation plate. Further, it is preferable that the cooling hole further has a plurality of sub-cooling grooves along the inner circumference.

In this configuration, it is preferable that the heat dissipation fins are inclined at a predetermined angle toward the center with respect to the top of the heat dissipation plate. It is preferable that the inclination angles of the heat dissipation fins are changed by selectively bending.

Further, it is preferable that the heat dissipation fins further have one or a plurality of sub-holes to pass heat, which flows inside from the cooling hole, to the outside.

It is preferable that the heat dissipation fins are integrally bent up along the edge of the heat dissipation plate and have a predetermined length upward.

Meanwhile, it is preferable that the heat dissipation fins are formed at regular intervals, and a plurality of sub-heat dissipation fins is further disposed at the regular gaps between the heat dissipation fins, along the edge of the heat dissipation plate in order to increase a heat dissipation area.

In this configuration, it is preferable that the sub-heat dissipation fins are formed in any one of a shape bent in one direction to have a plurality of steps and a zigzag shape alternately bent in two directions to have a plurality of steps.

Advantageous Effects

As described above, according to the present invention, since the heat dissipation fins are implemented by one thin metal plate made of one material, it is possible to easily manufacture the heat dissipater, reduce the weight, and improve heat transfer performance.

Further, as the sub-heat dissipation fins are further provided, the area coming in contact with air increases, such that the cooling performance can be further improved, and the heat dissipater can function as a main body simultaneously with cooling, such that it is possible to simplify the structure of the LED lighting device. Further, as passages through which the heat generated from the heat-generating unit can be discharged together with the external air to the outside are ensured, the discharge speed of heat is high in a device including a heat-generating unit, such that the performance of the device can be improved.

DESCRIPTION OF DRAWINGS

FIG. 1 is a perspective view showing a bent-type heat dissipater according to the present invention.

FIG. 2 is a perspective view showing when heat dissipation fins of the bent-type heat dissipater according to the present invention are deployed.

FIG. 3 is a bottom view showing sub-cooling grooves formed around a cooling hole of the bent-type heat dissipater according to the present invention.

FIG. 4A is a perspective view showing when the heat dissipation plate of the bent-type heat dissipater according to the present invention is further provided with sub-heat dissipation fins.

FIG. 4B is a perspective view showing the shapes of the sub-heat dissipation fins ofFIG. 4A bent in one direction to have a plurality of steps.

FIG. 4C is a perspective view showing the shapes of the sub-heat dissipation fins ofFIG. 4A alternately bent in two directions to have a plurality of steps.

FIG. 5 is a disassembly view showing the installation state of the bent-type heat dissipater according to the present invention.

FIG. 6 is a plan view showing the installation state of the bent-type heat dissipater according to the present invention.

FIG. 7 is a front cross-sectional view showing the installation state of the bent-type heat dissipater according to the present invention, taken along line A-A.

FIG. 8A is a view schematically showing temperature distribution according to the diameter of the cooling hole when heat is discharged by the bent-type heat dissipater according to the present invention.

FIG. 8B is a view schematically showing velocity distribution according to the diameter of the cooling hole when heat is discharged by the bent-type heat dissipater according to the present invention.

BEST MODE

Preferred embodiments of the present invention will be described hereafter in detail with reference to the accompanying drawings.

Terminologies defined in description of the present invention are defined in consideration of the functions in the present invention and should not be construed as limiting the technical components of the present invention.

FIG. 1 is a perspective view showing a bent-type heat dissipater according to the present invention.FIG. 2 is a perspective view showing when heat dissipation fins of the bent-type heat dissipater according to the present invention are deployed.FIG. 3 is a bottom view showing sub-cooling grooves formed around a cooling hole of the bent-type heat dissipater according to the present invention.FIG. 4A is a perspective view showing when the heat dissipation plate of the bent-type heat dissipater according to the present invention is further provided with sub-heat dissipation fins.FIG. 4B is a perspective view showing the shapes of the sub-heat dissipation fins ofFIG. 4A bent in one direction to have a plurality of steps.FIG. 4C is a perspective view showing the shapes of the sub-heat dissipation fins ofFIG. 4A alternately bent in two directions to have a plurality of steps.FIG. 5 is a disassembly view showing the installation state of the bent-type heat dissipater according to the present invention.FIG. 6 is a plan view showing the installation state of the bent-type heat dissipater according to the present invention.FIG. 7 is a front cross-sectional view showing the installation state of the bent-type heat dissipater according to the present invention, taken along line A-A.

FIG. 8A is a view schematically showing temperature distribution according to the diameter of the cooling hole when heat is discharged by the bent-type heat dissipater according to the present invention.FIG. 8B is a view schematically showing velocity distribution according to the diameter of the cooling hole when heat is discharged by the bent-type heat dissipater according to the present invention.

As shown inFIGS. 1 and 2, a bent-type heat dissipater100 of the present invention includes aheat dissipation plate110 having one or a plurality ofcooling holes111 that form passages to discharge heat, which is generated in one direction, together with external air in the opposite direction, and a plurality ofheat dissipation fins120 integrally bending up along the edge of theheat dissipation plate110 and having a predetermined length upward. It is preferable to use aluminum for the material of the heat dissipater of the present invention.

It is preferable that the cooling holes111 are disposed at the center of the heat dissipation plate. Further, theheat dissipation fins120 may be arranged at predetermined distances or in contact with each other.

That is, when theheat dissipation fins120 may be arranged at predetermined distances, the air and heat flowing inside from the outside can be discharged through the upper portions and sides of theheat dissipation fins120. On the contrary, when theheat dissipation fins120 are in contact with each other, only the heat can be discharged through the sides of theheat dissipation fins120.

In this case, one or a plurality ofsub-holes123 may be further formed at theheat dissipation fins120 to pass the heat, which flows inside through the cooling hole, to the outside. That is, thesub-holes123 allow the heat and the external air flowing upward through thecooling hole111 to be easily discharged outside.

Further, insertion holes121 are vertically formed through the tops of theheat dissipation fins120 such that a power module300 (described below) can be combined. Preferably, it may be possible to bend the upper ends of theheat dissipation fins120 toward the center of theheat dissipation plate110 to form flat surfaces and then vertically form the insertion holes121 through the flat surfaces.

Meanwhile, it is preferable to form thecooling hole111 at the center of theheat dissipation plate110. Further, thecooling hole111 may be shaped in any one of a circle, an ellipse, and a polygon. Further, it is preferable to size thecooling hole111 to be 20 to 80% of the size of theheat dissipation plate110.

Meanwhile, as shown inFIG. 3, a plurality of sub-cooling grooves111amay be formed along the circumference of thecooling hole111.

The sub-cooling grooves111amay be selectively arranged in accordance with the installation direction ofLEDs211, and the length and width of the sub-cooling grooves111amay depend on the amount of heat generated by theLEDs211. That is, the sub-cooling grooves111ahave orientation to the portions where theLEDs211 are disposed, such that they have an effect of intensively cooling the portions where a large amount of heat is generated.

It is preferable that theheat dissipation fins120 are inclined at a predetermined angle toward the center with respect to the top of theheat dissipation plate110. Further, it is preferable to selectively change the inclination angles of theheat dissipation fins120 by bending.

The reason of inclining theheat dissipation fins120 is for further improving heat dissipation performance by concentrating the heat to the upper portion, simultaneously with increasing the contact areas between air and theheat dissipation fins120 while the air flows upward through thecooling hole111.

Meanwhile, theheat dissipation fins120 are formed at regular intervals and a plurality ofsub-heat dissipation fins122 are further disposed at the regular gaps between theheat dissipation fins120 along the edge of theheat dissipation plate110 to increase the heat dissipation area.

As shown inFIGS. 4A to 4C, thesub-heat dissipation fins122 may be formed in any one of a shape bent in one direction to have a plurality of steps and a zigzag shape alternately bent in two directions to have a plurality of steps.

The bent-type heat dissipater100 is formed in a single structure by integrally forming theheat dissipation fins120 by machining one plate member, and then bending up theheat dissipation fins120, as shown inFIG. 2. That is, since theheat dissipater100 is formed in one integral body, heat easily transfers and the heat dissipation performance is improved.

Further, it is preferable that the inner diameter of thecooling hole111 is 6.5% to 80% of the outer diameter of theheat dissipation plate110.

For example,FIGS. 8A and 8B show when the inner diameters of threecooling holes112,122, and131 are set at 6.5%, 22%, 37%, 52%, and 80% of the outer diameter of theheat dissipation plate110 and then external air flowing inside through the cooling holes and heat generated from a heat-generating unit are discharged upward.

The red parts are where temperature is the highest and velocity is the highest and the blue parts are where temperature is the lowest and velocity is the lowest.

That is, referring toFIG. 8A, it can be seen that as the external air flows inside through the cooling hole formed at the center while air and heat is discharged, the temperature rapidly decreases toward the upper portion. Further, referring toFIG. 8B, it can be seen that the velocity increases toward the upper portion.

The bent-type heat dissipater100 described above, in accordance with the present invention, can be formed into one lighting device by organically combining anLED module200 equipped with a plurality ofLEDs211 with apower module300 supplying power to theLED module200.

Obviously, the configurations described herein are only examples of preferable installation states of the bent-type heat dissipater100 and it should be understood that the present invention may be achieved in various ways without being limited thereto.

First, theLED module200 includes anLED substrate210 equipped with a plurality ofLEDs211 arranged on the underside and having a firstlower cooling hole212 vertically formed through the center, and a condensinglens unit220 coupled to the underside of theLED substrate210, diffusing light generated from theLEDs211 throughlenses221, and having a secondlower cooling hole222 vertically formed to be connected with the firstlower cooling hole212.

Further, alens cover230 may be further disposed under the condensinglens unit220. On the other hand, as shown inFIG. 10, it should be understood that the condensinglens unit220 may function as both a lens and a cover by being coupled to the underside of theLED substrate210 by a cover-fastening member232 which is described below.

Thelens cover230 has seatingholes233 vertically formed to seat thelenses221 through the seating holes233, and a thirdlower cooling hole231 vertically formed to be connected (communicate) with the secondlower cooling hole222 of the condensinglens unit220. That is, the first, second, and third lower cooling holes212,222, and231 and thecooling hole111 formed at theheat dissipation plate110 form one vertical passage such that external air can flow inside from below and be discharged upward.

The seating holes233 may be formed to have a diameter the same or larger than the circumferences of the lenses21 such that the lenses21 can pass through them.

Further, the cover-fastening member232 extending upward and surrounding the thirdlower cooling hole231 may be formed on the top of thelens cover230. A plurality of first lockingprotrusions232ais formed along the circumference at the upper end of the cover-fastening member232 to protrude outward.

Thefirst locking protrusions232aare locked on thecooling hole111 formed at theheat dissipation plate110, through the secondlower cooling hole222 and the firstlower cooling hole212. Accordingly, theLED substrate210, the condensinglens unit220, and thelens cover230 can be integrally fixed to the underside of theheat dissipation plate110.

Further, thelens cover230, the condensinglens unit220, and theLED substrate210 may be fastened to theheat dissipation plate110 by several fasteners B. That is, when the cover-fastening member232 is mounted on thelens cover230, the space inside the cover-fastening member232 becomes the thirdlower cooling hole231 and the space inside the thirdlower cooling hole231 forms one vertical passage for taking external air inside and discharging heat.

For this configuration, it is preferable that the outer diameter of the cover-fastening member232 is the same as the diameters of the first, second, and third lower cooling holes212,222, and231 and thecooling hole111 formed at theheat dissipation plate110, which are described above.

Thepower module300 includes anupper holder310 havingterminal holes311 at the upper portion and seated on the upper ends of theheat dissipation fins120, apower substrate320 fitted in theupper holder310 from below such thatconnection terminals321 disposed at the upper portion are inserted in the terminal holes311 to be exposed upward, and alower holder330 fitted on the lower portion of theupper holder310 and supporting and preventing thepower substrate320 from being separated outward.

In this structure, a plurality of second lockingprotrusions330 protrudes outward from the sides of theupper holder310. Further, inclined surfaces (not given a reference number) that are inclined upward and outward from the ends connected to theupper holder310 may be formed on the undersides of thesecond locking protrusions312.

Further, a plurality of lockingholes331 is horizontally formed through the upper portion of thelower holder330 that is fitted on theupper holder310 to fit the second lockingprotrusions312 therein.

Further, a plurality ofinsertion protrusions313, which protrude outward above and adjacent to the second lockingprotrusions312 and then extend downward, is further formed on the sides of theupper holder310.

That is, the upper ends with the locking holes331 of thelower holder330 open outward while sliding on the inclined surfaces formed on the undersides of the second lockingprotrusions312 and are restored by elastic restoring force at the ends of the inclined surfaces, such that the second lockingprotrusions312 are fitted. Therefore, theupper holder310 and thelower holder330 can be firmly combined.

Further, when thepower module300 is fixed on the upper portions of theheat dissipation fins120, theinsertion protrusions313 of theupper holder310 are inserted into the insertion holes121 formed at the tops of theheat dissipation fins120.

Meanwhile, at least one ormore cable holes332 may be formed through bottom of thelower holder330 to pass cables (not shown). That is, cables (not shown) extending from thepower substrate320 are electrically connected to theLED substrate210 through the cable holes332.

Guide surfaces333 narrowing downward may be formed on the underside of thelower holder330 to guide the flow of air. That is, the guide surfaces333 are narrow at the lower ends, such that the air flowing from below can be guided to quickly flow upward without stopping.

As a result, according to the present invention, since the heat dissipation fins are implemented by one thin metal plate made of one material, it is possible to easily manufacture the heat dissipater, reduce the weight, and improve heat transfer performance. Further, as the sub-heat dissipation fins are further provided, the area coming in contact with air increases, such that the cooling performance can be further improved, and theheat dissipater100 can function as a main body simultaneously with cooling, such that it is possible to simplify the structure of the LED lighting device. Further, as passages through which the heat generated from the heat-generating unit can be discharged together with the external air to the outside are ensured, the discharge speed of heat is high in a device including a heat-generating unit, such that the performance of the device can be improved.

Although the spirit of the bent-type heat dissipater100 according to the present invention is described above with reference to the accompanying drawings, this is an example for describing the most preferable embodiment of the present invention and does not limit the present invention.

Therefore, it is apparent that the present invention may be modified and copied in dimensions, shape, and structure by those skilled in the art without departing from the scope of the present invention and those modifications and copies are included in the scope of the present invention.

Claims

1. A bent-type heat dissipater comprising:

a heat dissipation plate having one or a plurality of cooling holes that form passages to discharge heat, which transfers in one direction, together with external air in the opposite direction; and

one or a plurality of heat dissipation fins integrally bending from the heat dissipation plate.

2. The bent-type heat dissipater ofclaim 1, wherein the cooling hole is formed at the center of the heat dissipation plate.

3. The bent-type heat dissipater of claim ofclaim 1, wherein the cooling hole is shaped in any one of a circle, an ellipse, and a polygon.

4. The bent-type heat dissipater ofclaim 1, wherein the inner diameter of the cooling hole is 6.5 to 80% of the outer diameter of the heat dissipation plate.

5. The bent-type heat dissipater ofclaim 1, wherein the cooling hole further has a plurality of sub-cooling grooves along the inner circumference.

6. The bent-type heat dissipater ofclaim 1, wherein the heat dissipation fins are integrally bent up along the edge of the heat dissipation plate and have a predetermined length upward.

7. The bent-type heat dissipater ofclaim 6, wherein the heat dissipation fins are inclined at a predetermined angle toward the center with respect to the top of the heat dissipation plate.

8. The bent-type heat dissipater ofclaim 7, wherein the inclination angle of the heat dissipation fins is changed by selectively bending.

9. The bent-type heat dissipater ofclaim 1, wherein the heat dissipation fins further have one or a plurality of sub-holes to pass heat, which flows inside from the cooling hole, to the outside.

10. The bent-type heat dissipater ofclaim 1, wherein the heat dissipation fins are formed at regular intervals, and

a plurality of sub-heat dissipation fins is further disposed at the gaps between the heat dissipation fins, along the regular edge of the heat dissipation plate in order to increase a heat dissipation area.

11. The bent-type heat dissipater ofclaim 10, wherein the sub-heat dissipation fins are formed in any one of a shape bent in one direction to have a plurality of steps and a zigzag shape alternately bent in two directions to have a plurality of steps.