US20120061356A1 - Laser machining device and laser machining method - Google Patents

Abstract

The controllability of modified spots is improved. A laser processing apparatus100 comprises a first laser light source101 for emitting a first pulsed laser light L1, a second laser light source102 for emitting a second pulsed laser light L2, half-wave plates104, 105 for respectively changing directions of polarization of the pulsed laser light L1, L2, polarization beam splitters106, 107 for respectively polarization-separating the pulsed laser light L1, L2 having changed the directions of polarization, and a condenser lens112 for converging the polarization-separated pulsed laser light L1, L2 at an object to be processed1. When the directions of polarization of the pulsed laser light L1, L2 changed by the half-wave plates104, 105 are varied by a light intensity controller121 in the laser processing apparatus100, the ratios of the pulsed laser light L1, L2 polarization-separated by the polarization beam splitters106, 107 are altered, whereby the respective intensities of the pulsed laser light L1, L2 are adjusted.

Description

TECHNICAL FIELD
• The present invention relates to a laser processing apparatus and laser processing method for forming a modified region in an object to be processed.
BACKGROUND ART
• Known as a conventional laser processing apparatus is one which converges first and second laser light having wavelengths different from each other at an object to be processed, so as to cut the object. For example, the followingPatent Literature 1 discloses a laser processing apparatus which ablates a portion of a substrate by using a first radiation pulse of a first ultraviolet wavelength and a second radiation pulse of a second ultraviolet wavelength longer than the first ultraviolet wavelength. For example, the following Patent Literature 2 discloses a laser processing apparatus which cuts an object to be processed by using an oscillated wave of laser light and its harmonic.
• On the other hand, a laser processing apparatus has recently been developed, which converges pulsed laser light at an object to be processed, so as to form a plurality of modified spots within the object along a line to cut and cause the plurality of modified spots to produce a modified region as disclosed in the followingPatent Literature 3, for example.
CITATION LISTPatent Literature
• Patent Literature 1: Japanese Patent Application Laid-Open No. 2-182389
• Patent Literature 2: Japanese Patent Publication No. 2604395
• Patent Literature 3: Japanese Patent Application Laid-Open No. 2004-337903
SUMMARY OF INVENTIONTechnical Problem
• Laser processing apparatus such as those mentioned above have been required to improve their controllability of modified spots. That is, it has been desired for them to accurately control the size of modified spots and the length of fractures generated from the modified spots (hereinafter simply referred to as “fracture length”) according to the thickness, material, and the like of the object, for example.
• It is therefore an object of the present invention to provide a laser processing apparatus and laser processing method which can improve the controllability of modified spots.
Solution to Problem
• For achieving the above-mentioned object, the laser processing apparatus in accordance with one aspect of the present invention is a laser processing apparatus for converging a plurality of pulsed laser light at an object to be processed, so as to form a plurality of modified spots within the object along a line to cut and cause the plurality of modified spots to produce a modified region, the apparatus comprising a first laser light source for emitting a first pulsed laser light having a first wavelength, a second laser light source for emitting a second pulsed laser light having a second wavelength different from the first wavelength, a first half-wave plate for changing a direction of polarization of the first pulsed laser light, a second half-wave plate for changing a direction of polarization of the second pulsed laser light, polarization separation means for polarization-separating the first pulsed laser light having the direction of polarization changed by the first half-wave plate and the second pulsed laser light having the direction of polarization changed by the second half-wave plate, a condenser lens for converging at the object the first and second pulsed laser light polarization-separated by the polarization separation means, and light intensity control means for controlling an intensity of the first and second pulsed laser light by varying the directions of polarization of the first and second pulsed laser light changed by the first and second half-wave plates.
• The laser processing apparatus in accordance with another aspect of the present invention is a laser processing apparatus for converging a plurality of pulsed laser light at an object to be processed, so as to form a plurality of modified spots within the object along a line to cut and cause the plurality of modified spots to produce a modified region, the apparatus comprising a first laser light source for emitting a first pulsed laser light having a first wavelength, a nonlinear optical crystal for receiving the first pulsed laser light and emitting the first pulsed laser light and a second pulsed laser light having a second wavelength different from the first wavelength, a first half-wave plate for changing a direction of polarization of the first pulsed laser light, a second half-wave plate for changing a direction of polarization of the second pulsed laser light, polarization separation means for polarization-separating the first pulsed laser light having the direction of polarization changed by the first half-wave plate and the second pulsed laser light having the direction of polarization changed by the second half-wave plate, a condenser lens for converging at the object the first and second pulsed laser light polarization-separated by the polarization separation means, and light intensity control means for controlling an intensity of the first and second pulsed laser light by varying the directions of polarization of the first and second pulsed laser light changed by the first and second half-wave plates.
• In these aspects of the present invention, when the directions of polarization of the first and second pulsed laser light changed by the first and second half-wave plates are varied by the light intensity control means, the ratios of the first and second pulsed laser light polarization-separated by the polarization separation means are altered. As a result, the respective intensities of the first and second pulsed laser light can be adjusted. Therefore, the respective intensities of the first and second pulsed laser light can be controlled desirably without greatly changing the pulse widths of the first and second pulsed laser light, for example. Hence, high-quality modified spots having favorable sizes and fracture lengths can be formed accurately. That is, the present invention can improve the controllability of modified spots.
• Preferably, the laser processing apparatus further comprises pulse width control means for controlling a pulse width of the first pulsed laser light emitted from the first laser light source, while the pulse width control means changes the pulse width of the first pulsed laser light, so as to lower a harmonic conversion efficiency of the nonlinear optical crystal such that the nonlinear optical crystal emits no second pulsed laser light. This makes it possible to converge the first pulsed laser light alone at the object, so as to form the modified spots.
• Preferably, the laser processing apparatus further comprises concentering means for making the first and second pulsed laser light concentric with each other. This can simplify the structure of optical systems concerning the first and second pulsed laser light.
• The polarization separation means may include a first polarization beam splitter for polarization-separating the first pulsed laser light having the direction of polarization changed by the first half-wave plate and a second polarization beam splitter for polarization-separating the second pulsed laser light having the direction of polarization changed by the second half-wave plate.
• Preferably, the light intensity control means has a greater width of controllability for the first pulsed laser light than for the second pulsed laser light. This can favorably form high-quality modified spots in the object.
• Preferably, the light intensity control means makes the intensity of the first pulsed laser light lower than an intensity threshold at which the modified spots are formed when the first pulsed laser light is converged alone at the object. In this case, for forming the modified spots, the first and second pulsed laser light act as auxiliary and main pulsed laser light, respectively. In addition, the first pulsed laser light acts favorably so as not to affect the second pulsed laser light. As a result, high-quality modified spots can be formed in the object.
• The laser processing apparatus in accordance with still another aspect of the present invention is a laser processing apparatus for converging a plurality of pulsed laser light at an object to be processed, so as to form a plurality of modified spots within the object along a line to cut and cause the plurality of modified spots to produce a modified region, the apparatus comprising a first laser light source for emitting a first pulsed laser light having a first wavelength, a second laser light source for emitting a second pulsed laser light having a second wavelength different from the first wavelength, and a condenser lens for converging the first and second pulsed laser light at the object; wherein the first pulsed laser light has an intensity made lower than an intensity threshold at which the modified spots are formed when the first pulsed laser light is converged alone at the object.
• The laser processing apparatus in accordance with a further aspect of the present invention is a laser processing apparatus for converging a plurality of pulsed laser light at an object to be processed, so as to form a plurality of modified spots within the object along a line to cut and cause the plurality of modified spots to produce a modified region, the apparatus comprising a first laser light source for emitting a first pulsed laser light having a first wavelength, a nonlinear optical crystal for receiving the first pulsed laser light and emitting the first pulsed laser light and a second pulsed laser light having a second wavelength different from the first wavelength, and a condenser lens for converging the first and second pulsed laser light at the object; wherein the first pulsed laser light has an intensity made lower than an intensity threshold at which the modified spots are formed when the first pulsed laser light is converged alone at the object.
• The laser processing method in accordance with a still further aspect of the present invention is a laser processing method of converging a plurality of pulsed laser light at an object to be processed, so as to form a plurality of modified spots within the object along a line to cut and cause the plurality of modified spots to produce a modified region; the method comprising the step of converging a first pulsed laser light having a first wavelength and a second pulsed laser light having a second wavelength different from the first wavelength at the object through a condenser lens; wherein the step makes the first pulsed laser light have an intensity lower than an intensity threshold at which the modified spots are formed when the first pulsed laser light is converged alone at the object.
• In these aspects of the present invention, the first and second pulsed laser light are converged at the object, so as to form a plurality of modified spots and cause the modified spots to produce a modified region. Here, the intensity of the first pulsed laser light is lower than the intensity threshold at which the modified spots are formed when the first pulsed laser light is converged alone at the object. Hence, for forming the modified spots in this case, the first and second pulsed laser light act as auxiliary and main pulsed laser light, respectively. In addition, the first pulsed laser light acts favorably so as not to affect the second pulsed laser light. As a result, high-quality modified spots can be formed in the object.
• The first pulsed laser light may have a wavelength longer than that of the second pulsed laser light.
ADVANTAGEOUS EFFECTS OF INVENTION
• The present invention can improve the controllability of modified spots.
BRIEF DESCRIPTION OF DRAWINGS
• FIG. 1 is a plan view illustrating an example of an object to be processed for which a modified region is formed;
• FIG. 2 is a sectional view of the object taken along the line ofFIG. 1;
• FIG. 3 is a plan view of the object after laser processing;
• FIG. 4 is a sectional view of the object taken along the line IV-IV ofFIG. 3;
• FIG. 5 is a sectional view of the object taken along the line V-V ofFIG. 3;
• FIG. 6 is a chart for explaining relationships between the intensity of pulsed laser light and modified spots;
• FIG. 7 is a chart illustrating examples of modified spots formed in the object by using first and second laser light;
• FIG. 8 is a schematic structural diagram illustrating the laser processing apparatus in accordance with a first embodiment of the present invention;
• FIG. 9 is a schematic structural diagram illustrating a main part of the laser processing apparatus ofFIG. 8;
• FIG. 10 is a flowchart illustrating operations of a laser processing method using the laser processing apparatus ofFIG. 8;
• FIG. 11 is a schematic structural diagram illustrating a main part of the laser processing apparatus in accordance with a second embodiment of the present invention;
• FIG. 12 is a schematic structural diagram illustrating a main part of the laser processing apparatus in accordance with a third embodiment of the present invention; and
• FIG. 13 is a schematic structural diagram illustrating a main part of the laser processing apparatus in accordance with a fourth embodiment of the present invention.
DESCRIPTION OF EMBODIMENTS
• In the following, preferred embodiments of the present invention will be explained in detail with reference to the drawings. In the drawings, the same or equivalent constituents will be referred to with the same signs while omitting their overlapping descriptions.
• In the laser processing apparatus and laser processing method in accordance with the embodiments, a plurality of pulsed laser light are simultaneously converged at an object to be processed, so as to form a plurality of modified spots within the object and cause the plurality of modified spots to produce a modified region which becomes a cutting start point. Therefore, the forming of the modified region will firstly be explained with reference toFIGS. 1 to 5.
• As illustrated inFIG. 1, an object to be processed1 has a line to cut5 set for cutting theobject1. Theline5 is a virtual line extending straight. When forming a modified region within theobject1, the laser light L is relatively moved along the line5 (i.e., in the direction of arrow A inFIG. 1) while locating a converging point P within theobject1 as illustrated inFIG. 2. This forms a modifiedregion7 within theobject1 along theline5 as illustrated inFIGS. 3 to 5, whereby the modifiedregion7 formed along theline5 becomes a cuttingstart region8.
• A glass substrate is used as theobject1, for which a semiconductor material, a piezoelectric material, or the like is employable. The converging point P is a position at which the laser light L is converged. Theline5 may be curved instead of being straight and may be a line actually drawn on thefront face3 of theobject1 without being restricted to the virtual line. The modifiedregion7 may be formed either continuously or intermittently. The modifiedregion7 may also be formed into rows or dots. It will be sufficient if the modifiedregion7 is formed at least within theobject1. There are cases where fractures are formed from the modifiedregion7 acting as a start point, and the fractures and modifiedregion7 may be exposed at outer surfaces (the front face, rear face, and outer peripheral face) of theobject1.
• Here, the laser light L is absorbed in particular in the vicinity of the converging point within theobject1 while being transmitted therethrough, whereby the modifiedregion7 is formed in the object1 (internal absorption type laser processing). Therefore, thefront face3 of theobject1 hardly absorbs the laser light L and thus does not melt. In the case of forming a removing part such as a hole or groove by melting it away from thefront face3, the processing region gradually progresses from thefront face3 side to the rear face side in general (surface absorption type laser processing).
• The modified region formed in this embodiment means regions whose physical characteristics such as density, refractive index, and mechanical strength have attained states different from those of their surroundings. Examples of the modified region include molten processed regions, crack regions, dielectric breakdown regions, refractive index changed regions, and their mixed regions. Further examples of the modified region include an area where the density of the modified region has changed from that of an unmodified region in the material of the object and an area formed with a lattice defect (which can collectively be referred to as a high-density transitional region).
• The molten processed regions, refractive index changed regions, areas where the modified region has a density different from that of the unmodified region, and areas formed with a lattice defect may further incorporate a fracture (cut or microcrack) therewithin or at an interface between the modified and unmodified regions. The incorporated fracture may be formed over the whole surface of the modified region or in only a part or a plurality of parts thereof.
• This embodiment produces the modifiedregion7 by forming a plurality of modified spots (processing scars) along theline5. A plurality of modified spots, each of which is a modified part formed by a shot of one pulse of the pulsed laser light (i.e., one pulse of laser irradiation), gather to form the modifiedregion7. Examples of the modified spot include crack spots, molten processed spots, refractive index changed spots, and those mixed with at least one of them.
• For the modified spots, it is preferred to control their size and the length of fractures occurring therefrom (hereinafter also referred to as “fracture length”) appropriately in view of the required cutting accuracy, flatness of cut sections, thickness, kind, and crystal orientation of the object, and the like.
• That is, when the modified spots are too large or the fracture length is too long, fluctuations in the size of modified spots and fracture length become greater, thereby lowering the accuracy in cutting theobject1 along theline5. This also enhances irregularities on a cut section of theobject1, thereby worsening the flatness of the cut section. When the modified spots are too small, on the other hand, the object is harder to cut.
• When the size of modified spots and fracture length are made appropriate, they can be formed uniformly, while deviations from theline5 can be suppressed. This can also improve the accuracy in cutting theobject1 along theline5 and the flatness of the cut section.
• FIG. 6 is a chart for explaining relationships between the intensity of pulsed laser light and modified spots. As illustrated inFIG. 6, modified spots S can be controlled by regulating the intensity (power) of pulsed laser light. Specifically, the size of modified spots S and the length of fractures C can be made smaller when the intensity of the pulsed laser light is lowered. On the other hand, the size of modified spots S and the length of fractures C can be made greater when the intensity of the pulsed laser light is enhanced. The intensity of pulsed laser light can be represented by the peak power density per pulse, the energy (J) per pulse, or the average output (W) determined by multiplying the energy per pulse by the frequency of the pulsed laser light, for example.
• In the case where pulsed laser light (hereinafter referred to as first pulsed laser light) having a wavelength of 1064 nm is converged alone at theobject1 here, a modified spot S1 is formed when the intensity of the first pulsed laser light is at an intensity threshold a or greater. In the case where pulsed laser light (hereinafter referred to as second pulsed laser light) having a wavelength of 532 nm which is shorter than the wavelength of the first pulsed laser light is converged alone at theobject1, a modified spot S2 is formed when the intensity of the second pulsed laser light is at an intensity threshold β or greater, for example.
• For example, there is a case where the intensity thresholds a and β are 15 μJ and 6 μJ, respectively. The intensity threshold is an intensity of laser light at which a modified region is formed in theobject1. Here, forming the modified spots S is meant to appropriately form modified spots constituting a modified region to become a cutting start region (ditto in the following).
• In the case where the first and second pulsed laser light are simultaneously converged at theobject1, a modified spot S3 is also formed at an intensity lower than any of the respective intensities at which the first and second pulsed laser light are converged alone. This modified spot S3 has a characteristic feature similar to that of a modified spot formed by converging pulsed laser light having an ultrashort pulse (e.g., of several psec), i.e., the fractures C attain an appropriate length (a half cut or full cut occurs) with a relatively small modified spot.
• FIG. 7 is a chart illustrating examples of modified spots formed in the object by using the first and second laser light. Each photograph in the chart is an enlarged plan view illustrating theobject1 formed with the modified spots S. Here, the first and second pulsed laser light each have a pulse pitch of 50 μm, while their directions of polarization lie in their scanning direction (the vertical direction on the chart). The first pulsed laser light at the intensity of 0 μJ means that it is not converged at the object1 (i.e., the object is irradiated with the second pulsed laser light alone). The second pulsed laser light at the intensity of 0 μJ means that it is not converged at the object1 (i.e., the object is irradiated with the first pulsed laser light alone). As theobject1, a glass slide is employed.
• When the intensity of the second pulsed laser light is 0 μJ, as illustrated inFIG. 7, no modified spots S are formed in the object, whereby processing is impossible. When the intensity of the second pulsed laser light is 6 μJ or less, the modified spots S cannot be formed continuously with a favorable accuracy, whereby a so-called shot miss phenomenon occurs. When the intensity of the second pulsed laser light is 4 μJ in particular, the shot miss phenomenon occurs greatly depending on the intensity of the first pulsed laser light (when the intensity of the first pulsed laser light is 0 to 10 μJ). This shows that controlling the intensity of the second pulsed laser light can suppress the shot miss phenomenon in particular. That is, the second pulsed laser light having a wavelength shorter than that of the first pulsed laser light is used as a main element concerning the forming of the modified spots S.
• It is also seen that, as the intensity of the first pulsed laser light is higher, the size of modified spots S becomes greater, a greater number of fractures C occur, and the fracture length increases. Hence, it is seen that controlling the intensity of the first pulsed laser light can adjust the size of modified spots S in particular. Using the first pulsed laser light within a range where its laser intensity is lower than the intensity threshold of theobject1 for this laser light (i.e., the intensity threshold of theobject1 when irradiated with this laser light alone) makes it easier to control the size of modified spots S.
First Embodiment
• The first embodiment of the present invention will now be explained.FIG. 8 is a schematic structural diagram illustrating the laser processing apparatus in accordance with the first embodiment of the present invention. As illustrated inFIG. 8, thelaser processing apparatus100 comprises ahousing111 for accommodating optical systems concerning the first and second pulsed laser light, acondenser lens112 for converging the first and second pulsed laser light at theobject1, a support table113 for supporting theobject1 irradiated with the pulsed laser light L1, L2 converged by thecondenser lens112, astage114 for moving the support table113 along X, Y, and Z axes, and astage controller115 for controlling the movement of thestage114.
• Thelaser processing apparatus100 also comprises anautofocus unit116 in order to converge the pulsed laser light L1, L2 accurately at a predetermined position within theobject1, so as to form the modifiedregion7. This allows thelaser processing apparatus100 to control the pulsed laser light L1, L2 accurately such that they converge at a fixed position from thefront face3 or rear face of theobject1, for example.
• FIG. 9 is a schematic structural diagram illustrating a main part of the laser processing apparatus ofFIG. 8. As illustrated inFIG. 9, thelaser processing apparatus100 comprises first and second pulsedlaser light sources101,102, a laserlight source controller103, half-wave plates104,105, andpolarization beam splitters106,107.
• The first pulsed laser light source (first laser light source)101 emits the first pulsed laser light L1 having a wavelength of 1064 nm with a pulse width of 23 nsec, for example. The second pulsed laser light source (second laser light source)102 emits the second pulsed laser light L2 having a wavelength of 532 nm with a pulse width of 15 nsec, for example, as a pulsed laser light having a wavelength shorter than that of the first pulsed laser light L1. Here, the pulsedlaser light sources101,102 respectively emit the pulsed laser light L1, L2 whose directions of polarization lie in the vertical direction on the drawing sheet. Fiber lasers, for example, can be used as the pulsedlaser light sources101,102.
• The laserlight source controller103 is connected to the first pulsedlaser light source101, so as to adjust the pulse width, pulse timing, and the like of the pulsed laser light L1 emitted from the first pulsedlaser light source101. The laserlight source controller103 is also connected to the second pulsedlaser light source102, so as to adjust the pulse timing and the like of the pulsed laser light L2. The laserlight source controller103 regulates the adjustment of the respective pulse timings of the pulsedlaser light sources101,102.
• The half-wave plates104,105 are arranged behind the pulsedlaser light sources101,102 on the optical axes (optical paths) of the pulsed laser light L1, L2, respectively. The half-wave plate (first half-wave plate)104 changes the direction of polarization of the first pulsed laser light L1 emitted from the first pulsedlaser light source101. The half-wave plate (second half-wave plate)105 changes the direction of polarization of the second pulsed laser light L2 emitted from the second pulsedlaser light source102.
• The polarization beam splitter (first polarization beam splitter)106 is arranged behind the half-wave plate104 on the optical axis of the first pulsed laser light L1. Thepolarization beam splitter106 polarization-separates the first pulsed laser light L1 having the direction of polarization changed by the half-wave plate104. Specifically, in the first pulsed laser light L1, thepolarization beam splitter106 transmits therethrough a constituent polarized in the vertical direction on the drawing sheet, but reflects a constituent polarized in the direction normal to the drawing sheet.
• The polarization beam splitter (second polarization beam splitter)107 is arranged behind the half-wave plate105 on the optical axis of the second pulsed laser light L2. Thepolarization beam splitter107 polarization-separates the second pulsed laser light L2 having the direction of polarization changed by the half-wave plate105. Specifically, in the second pulsed laser light L2, thepolarization beam splitter107 transmits therethrough a constituent polarized in the vertical direction on the drawing sheet, but reflects a constituent polarized in the direction normal to the drawing sheet.
• Thelaser processing apparatus100 further comprises alight intensity controller121. Thelight intensity controller121 controls the angles of rotation of the half-wave plates104,105 by actuators and the like, so as to vary the directions of polarization of the pulsed laser light L1, L2 changed by the half-wave plates104,105.
• In thelight intensity controller121, the range in which the direction of polarization of the first pulsed laser light L1 changed by the half-wave plate104 is variable is greater than the range in which the direction of polarization of the second pulsed laser light L2 changed by the half-wave plate105 is variable. Therefore, in thelight intensity controller121, the width by which the intensity of the first pulsed laser light L1 is controllable is greater than the width by which the intensity of the second pulsed laser light L2 is controllable.
• A laser processing method using thus constructedlaser processing apparatus100 will now be explained with reference to a flowchart illustrated inFIG. 10.
• In thelaser processing apparatus100 of this embodiment, as illustrated inFIGS. 8 and 9, theobject1, which is a glass substrate or sapphire substrate, having an expandable tape attached to therear face21 thereof, is mounted on thestage114 at first. Subsequently, theobject1 is simultaneously irradiated with the pulsed laser light L1, L2 from the respective pulsedlaser light sources101,102, while using thefront face3 as a laser light irradiation surface and locating the converging point P within theobject1. Here, the laserlight source controller103 regulates the pulse timings such that the respective pulses of the pulsed laser light L1, L2 overlap each other at least partly.
• The first pulsed laser light L1 emitted from the first pulsedlaser light source101 passes through the half-wave plate104, so as to be adjusted in terms of polarization, and then is polarization-separated by the polarization beam splitter106 (S2, S3). Subsequently, the first pulsed laser light L1 transmitted through thepolarization beam splitter106 is reflected bydichroic mirrors108 to110 in sequence, so as to be made incident on thecondenser lens112.
• The second pulsed laser light L2 emitted from the second pulsedlaser light source102 passes through the half-wave plate105, so as to be adjusted in terms of polarization, and then is polarization-separated by the polarization beam splitter107 (S2, S3). Subsequently, the second pulsed laser light L2 transmitted through thepolarization beam splitter107 passes through thedichroic mirror109, so as to become concentric with the first pulsed laser light L1, and is reflected by thedichroic mirror110 while in this concentric state, so as to be made incident on thecondenser lens112. This converges the pulsed laser light L1, L2 into theobject1, while their directions of polarization lie in the scanning direction (S4). Thedichroic mirror110 is desired to be used for transmitting therethrough the light reflected by theobject1 so as to observe it with a camera device (not depicted) in order to study theobject1. When there is no camera device, a simple reflecting mirror may be used.
• Together with such irradiation with the pulsed laser light L1, L2, thestage114 is driven, so as to move (scan) theobject1 along theline5 relative to the pulsed laser light L1, L2, thereby forming a plurality of modified spots S within theobject1 along theline5 and producing the modifiedregion7 by the modified spots S (S5, S6). Thereafter, the expandable tape is expanded, so as to cut theobject1 along theline5 from the modifiedregion7 acting as a cutting start region.
• Here, thelaser processing apparatus100 of this embodiment is equipped with thelight intensity controller121. Therefore, by actuating thelight intensity controller121, so as to vary the directions of polarization of the pulsed laser light L1, L2 transmitted through the half-wave plates104,105, thelaser processing apparatus100 can change the ratios of the pulsed laser light L1, L2 polarization-separated by thepolarization beam splitters106,107. As a result, in the pulsed laser light L1, L2, the ratios of polarization direction constituents transmitted through thepolarization beam splitters106,107 are adjusted appropriately. Hence, the respective intensities of the pulsed laser light L1, L2 converged by thecondenser lens112 are adjusted as desired.
• In this regard, when controlling the intensities of the pulsed laser light L1, L2 by adjusting their inputs, for example, as in the conventional laser processing apparatus, their input ranges are hard to adjust greatly because of structures of the pulsedlaser light sources101,102.
• By contrast, as mentioned above, this embodiment can control the respective intensities of the pulsed laser light L1, L2 as desired without greatly changing the input ranges of the pulsed laser light L1, L2. Therefore, this embodiment can accurately form high-quality modified spots S having favorable sizes and fracture lengths in theobject1, thereby improving the controllability of modified spots S.
• In particular, as mentioned above, this embodiment forms the modified spots S by simultaneously converging the two pulsed laser light L1, L2 having different wavelengths. This can make the total intensity of pulsed laser light lower than that in the case where the modified spots S are formed by converging one of the pulsed laser light L1, L2 alone (seeFIG. 6).
• For forming the modified spots S by converging one of the pulsed laser light L1, L2 alone, it has conventionally been necessary for them to have an ultrashort pulse width (e.g., several psec), which may need special laser light sources for the pulsed laser light sources. By contrast, this embodiment can reduce not only the necessity for minimizing the pulse widths of the pulsed laser light L1, L2, but also the need for special laser light sources, whereby typical common laser light sources can be used. This can lower the cost and enhance the reliability and versatility.
• In general, for accurately forming the modified spots S by simultaneously converging the pulsed laser light L1, L2, it is preferred to change the intensity of the first pulsed laser light L1 more greatly than the intensity of the second pulsed laser light L2 (seeFIG. 7). In this regard, the controllable width of intensity of the first pulsed laser light L1 is greater than the controllable width of intensity of the second pulsed laser light L2 in this embodiment as mentioned above. This can perform favorable laser processing in conformity to the relationship between the intensities of the pulsed laser light L1, L2 at the time of forming the modified spots S, thereby favorably producing high-quality modified spots S in theobject1.
• Since the pulsed laser light L1, L2 are made concentric with each other as mentioned above, this embodiment can simplify the structure of optical systems concerning the pulsed laser light L1, L2.
• Since the second pulsed laser light L2 is used as a main element for forming the modified spots S as mentioned above, it is preferred for the second pulsed laser light L2 to have a pulse width shorter than that of the first pulsed laser light L1 as in this embodiment.
• When converging the pulsed laser light L1, L2 at theobject1 upon irradiation in this embodiment, at least one of thelight intensity controller121 and laserlight source controller103 may be actuated such that the intensity of the first pulsed laser light L1 is lower than the intensity threshold a (seeFIG. 6).
• Specifically, the intensity of the first pulsed laser light L1 may be made lower than the intensity threshold a at which the modified spots S are formed when the first pulsed laser light L1 is converged alone at theobject1. In other words, the intensity of the first pulsed laser light L1 may be within a predetermined intensity range where the modified spots S are not formed when the first pulsed laser light L1 is converged alone at theobject1.
• For forming the modified spots S in this case, the first and second pulsed laser light L1, L2 act as auxiliary and main pulsed laser light, respectively. In addition, the first pulsed laser light L1 acts favorably so as not to affect the second pulsed laser light L2. As a result, high-quality modified spots S can be formed in theobject1. That is, this enables excellent laser processing under multi-wavelength simultaneous irradiation with the pulsed laser light L1, L2 cooperating with each other.
• In general, the wavelength, pulse width, peak power, and the like of pulsed laser light required for forming the modified spots S within theobject1 by converging the pulsed laser light vary depending on the kind of theobject1 and the like. When forming the modified spots S in theobject1 that is a silicon substrate, for example, it is preferred for the pulsed laser light to have a wavelength of 1064 nm and a relatively long pulse width (100 to 200 nsec). When forming the modified spots S in theobject1 that is a glass substrate or sapphire substrate as in this embodiment, it is preferred for the pulsed laser light to have a shorter pulse width so as to enhance the intensity (peak energy).
• In this regard, thelaser processing apparatus100 of this embodiment can accurately form the modified spots S not only in theobject1 that is a glass substrate or sapphire substrate as mentioned above, but also in theobject1 that is a silicon substrate. Specifically, a filter or the like is placed on the optical axis of the second pulsed laser light L2 so that the second pulsed laser light L2 is not converged at theobject1. At the same time, the first pulsed laser light L1 having a pulse width of 200 nsec, for example, is converged at theobject1.
• Therefore, this embodiment allows the singlelaser processing apparatus100 to be used as a processing apparatus for various substrates. The singlelaser processing apparatus100 can also easily handle theobject1 such as a bonded substrate constituted by silicon and glass substrates.
• In this embodiment, as in the foregoing, thepolarization beam splitters106,107 constitute the polarization separation means, while thelight intensity controller121 does the light intensity control means. The dichroic mirrors108,109 constitute the concentering means, while the laserlight source controller103 does the pulse width control means.
Second Embodiment
• The second embodiment of the present invention will now be explained. This embodiment will be explained mainly in terms of differences from the above-mentioned first embodiment.
• FIG. 11 is a schematic structural diagram illustrating a main part of the laser processing apparatus in accordance with the second embodiment of the present invention. As illustrated inFIG. 11, thelaser processing apparatus200 of this embodiment differs from the above-mentionedlaser processing apparatus100 in that it has apolarization beam splitter201 in place of thepolarization beam splitters106,107 (seeFIG. 9) and further comprises a half-wave plate202.
• The polarization beam splitter (first and second polarization beam splitter)201 is arranged behind the half-wave plate104 on the optical axis of the first pulsed laser light L1 and behind the half-wave plate105 on the optical axis of the second pulsed laser light L2. Thepolarization beam splitter201 is adapted to handle two wavelengths, so as to polarization-separate the first pulsed laser light L1 having the direction of polarization changed by the half-wave plate104 and the second pulsed laser light L2 having the direction of polarization changed by the half-wave plate105.
• Specifically, in the first pulsed laser light L1, thepolarization beam splitter201 transmits therethrough a constituent polarized in the vertical direction on the drawing sheet as it is, but reflects a constituent polarized in the direction normal to the drawing sheet. In the second pulsed laser light L2, thepolarization beam splitter201 transmits therethrough a constituent polarized in the vertical direction on the drawing sheet as it is, while making it concentric with the first pulsed laser light L1, but reflects a constituent polarized in the direction normal to the drawing sheet.
• The half-wave plate202 is arranged behind thepolarization beam splitter201 on the optical axis of the first pulsed laser light L1. The half-wave plate202 changes the direction of polarization of the first pulsed laser light L1 reflected by thepolarization beam splitter201 but transmits therethrough the second pulsed laser light L2 passed through thepolarization beam splitter201 as it is. Here, the half-wave plate202 changes the direction of polarization of the first pulsed laser light L1 from the direction normal to the drawing sheet to the vertical direction on the drawing sheet.
• In thus constructedlaser processing apparatus200, the first pulsed laser light L1 emitted from the first pulsedlaser light source101 is transmitted through the half-wave plate104, where its polarization is adjusted, and then reflected by thedichroic mirror203, so as to be polarization-separated by thepolarization beam splitter201. The first pulsed laser light L1 reflected by thepolarization beam splitter201 is transmitted through the half-wave plate202, where its polarization is adjusted, and then reflected by thedichroic mirror110, so as to be made incident on thecondenser lens112.
• The second pulsed laser light L2 emitted from the second pulsedlaser light source102 is transmitted through the half-wave plate105, where its polarization is adjusted, and then polarization-separated by thepolarization beam splitter201. The second pulsed laser light L2 transmitted through thepolarization beam splitter201 is made concentric with the first pulsed laser light L1 and passes through the half-wave plate202 as it is while in this concentric state. Thereafter, the second pulsed laser light L2 is reflected by thedichroic mirror110, so as to be made incident on thecondenser lens112. As a consequence, the pulsed laser light L1, L2 are converged into theobject1, while their directions of polarization lie in the scanning direction.
• As in the foregoing, this embodiment is effective in improving the controllability of the modified spots S as with the one mentioned above. This embodiment also allows the singlelaser processing apparatus200 to be used as a processing apparatus for various substrates as in the above-mentioned first embodiment.
• In this embodiment, as in the foregoing, thepolarization beam splitter201 constitutes the polarization separation means, while thepolarization beam splitter201 anddichroic mirror203 do the concentering means.
Third Embodiment
• The third embodiment of the present invention will now be explained. This embodiment will be explained mainly in terms of differences from the above-mentioned first embodiment.
• FIG. 12 is a schematic structural diagram illustrating a main part of the laser processing apparatus in accordance with the third embodiment of the present invention. As illustrated inFIG. 12, thelaser processing apparatus300 of this embodiment mainly differs from the above-mentionedlaser processing apparatus100 equipped with the two pulsedlaser light sources101,102 in that it has one pulsed laser light source. Specifically, thelaser processing apparatus300 is not equipped with the second pulsedlaser light source102 but further comprises a nonlinearoptical crystal301.
• The nonlinearoptical crystal301, for which a KTP crystal as a second harmonic generator (SHG crystal) for generating an optical harmonic is used here, performs a wavelength conversion of the pulsed laser light L1.
• Specifically, when the first pulsed laser light L1 having a wavelength of 1064 nm as a fundamental wave is incident on the nonlinearoptical crystal301, the latter emits the second pulsed laser light L2 having a wavelength of 532 nm as a second harmonic concentrically with the first pulsed laser light L1. Here, the first pulsed laser light L1 whose direction of polarization tilts by 45° from the vertical direction of the drawing sheet is made incident on the nonlinearoptical crystal301, whereby the first pulsed laser light L1 and the second pulsed laser light L2 whose direction of polarization lies in the direction normal to the drawing sheet are emitted concentrically with each other.
• A half-wave plate302 for changing the direction of polarization of the first pulsed laser light L1 is disposed in front of the nonlinearoptical crystal301 on the optical axis of the first pulsed laser light L1. The half-wave plate302 changes the direction of polarization of the first pulsed laser light L1 incident on the half-wave plate302 from the vertical direction on the drawing sheet to the direction tilted by 45° from the vertical direction of the drawing sheet.
• When forming the modified spots S within theobject1 that is a glass substrate or sapphire substrate by thelaser processing apparatus300, the first pulsed laser light L1 emitted from the first pulsedlaser light source101 is transmitted through the half-wave plate302, where its polarization is adjusted, and then made incident on the nonlinearoptical crystal301, so as to be wavelength-converted. Subsequently, the nonlinearoptical crystal301 emits the pulsed laser light L1, L2 concentrically with each other.
• The first pulsed laser light L1 emitted from the nonlinearoptical crystal301 is transmitted through adichroic mirror303, a quarter-wave plate144, where elliptical polarization is turned into linear polarization, and the half-wave plate104, where the polarization is adjusted, and then polarization-separated by thepolarization beam splitter106. The first pulsed laser light L1 transmitted through thepolarization beam splitter106 is reflected by thedichroic mirrors108,109 in sequence, so as to be made incident on thecondenser lens112.
• The second pulsed laser light L2 emitted from the nonlinearoptical crystal301 is reflected by thedichroic mirrors303,304 in sequence and transmitted through the half-wave plate105, where its polarization is adjusted, and then polarization-separated by thepolarization beam splitter107. The second pulsed laser light L2 transmitted through thepolarization beam splitter201 passes through thedichroic mirror109, so as to become concentric with the first pulsed laser light L1, and is reflected by thedichroic mirror110 while in this concentric state, so as to be made incident on thecondenser lens112. As a consequence, the pulsed laser light L1, L2 are converged into theobject1, while their directions of polarization lie in the scanning direction.
• As in the foregoing, this embodiment is effective in improving the controllability of the modified spots S as with those mentioned above. Since the pulsed laser light L1, L2 are converged at theobject1 by using the single first pulsedlaser light source101, this embodiment makes it easier to set pulse timings such that the respective pulses of the pulsed laser light L1, L2 overlap each other.
• Thelaser processing apparatus300 of this embodiment can accurately form the modified spots S not only in theobject1 that is a glass substrate or sapphire substrate, but also in theobject1 that is a silicon substrate.
• Specifically, the laserlight source controller103 changes the pulse width of the first pulsed laser light L1 emitted from the first pulsedlaser light source101. Here, the first pulsed laser light L1 has a pulse width (e.g., 20 nsec) longer than that in the case of forming the modified spots S in theobject1 such as a glass or sapphire substrate. This lowers the harmonic conversion efficiency of the nonlinearoptical crystal301 so that only the first pulsed laser light L1 is emitted from the nonlinear optical crystal301 (i.e., the second pulsed laser light L2 is not substantially emitted therefrom). As a result, the pulsed laser light L1 is converged alone into theobject1, so as to form the modified spots S.
• Therefore, this embodiment allows the singlelaser processing apparatus300 to be used as a processing apparatus for various substrates. The singlelaser processing apparatus300 can also easily handle theobject1 such as a bonded substrate constituted by silicon and glass substrates.
• In this embodiment, as in the foregoing, the nonlinearoptical crystal301 anddichroic mirrors108,109 constitute the concentering means.
Fourth Embodiment
• The fourth embodiment of the present invention will now be explained. This embodiment will be explained mainly in terms of differences from the above-mentioned third embodiment.
• FIG. 13 is a schematic structural diagram illustrating a main part of the laser processing apparatus in accordance with the fourth embodiment of the present invention. As illustrated inFIG. 13, thelaser processing apparatus400 of this embodiment mainly differs from the above-mentionedlaser processing apparatus300 in that the optical axes of the pulsed laser light L1, L2 are kept concentric (completely concentric) with each other. Specifically, thelaser processing apparatus400 comprises a nonlinearoptical crystal401 in place of the nonlinear optical crystal301 (seeFIG. 12), and apolarization beam splitter402 in place of thepolarization beam splitters106,107 (seeFIG. 12).
• The nonlinearoptical crystal401, for which a BBO crystal is used here, performs a wavelength conversion of the pulsed laser light L1. When the first pulsed laser light L1 is made incident on the nonlinearoptical crystal401, the latter emits the first and second pulsed laser light L1, L2 concentrically with each other. When the first pulsed laser light L1 whose direction of polarization lies in the vertical direction on the drawing sheet is made incident on the nonlinearoptical crystal401 here, the latter emits the first pulsed laser light L1 and the second pulsed laser light L2 whose direction of polarization lies in the direction normal to the drawing sheet concentrically with each other.
• The polarization beam splitter (first and second polarization beam splitter)402, which is adapted to handle two wavelengths, is arranged behind the half-wave plates104,105 on the optical axis of the pulsed laser light L1, L2. Thepolarization beam splitter402 polarization-separates each of the pulsed laser light L1, L2 having their directions of polarization changed by the half-wave plates104,105. Specifically, in each of the pulsed laser light L1, L2, thepolarization beam splitter402 transmits therethrough a constituent polarized in the vertical direction on the drawing sheet as it is, but reflects a constituent polarized in the direction normal to the drawing sheet.
• In thus constructedlaser processing apparatus400, the first pulsed laser light L1 emitted from the first pulsedlaser light source101 is made incident on the nonlinearoptical crystal401, so as to be wavelength-converted, and the nonlinearoptical crystal401 emits the pulsed laser light L1, L2 concentrically with each other.
• The first pulsed laser light L1 emitted from the nonlinearoptical crystal401 is transmitted through the half-wave plate104, where its polarization is adjusted, and then the half-wave plate105 as it is, so as to be polarization-separated by thepolarization beam splitter402. On the other hand, the second pulsed laser light L2 emitted from the nonlinearoptical crystal401 is transmitted through the half-wave plate104 as it is and then the half-wave plate105, where its polarization is adjusted, so as to be polarization-separated by thepolarization beam splitter402. The pulsed laser light L1, L2 transmitted through thepolarization beam splitter402 are reflected by thedichroic mirror110, so as to be made incident on thecondenser lens112. As a consequence, the pulsed laser light L1, L2 are converged into theobject1, while their directions of polarization lie in the scanning direction.
• As in the foregoing, this embodiment is effective in improving the controllability of the modified spots S as with those mentioned above. This embodiment also allows the singlelaser processing apparatus400 to be used as a laser processing apparatus for various substrates as with the above-mentioned third embodiment.
• Since this embodiment is constructed such that the optical axes of the pulsed laser light L1, L2 are kept concentric with each other as mentioned above, the structure of optical systems concerning the pulsed laser light L1, L2 can be made much simpler, while it becomes further easier to set pulse timings such that the respective pulses of the pulsed laser light L1, L2 overlap each other.
• In this embodiment, as in the foregoing, thepolarization beam splitter402 and nonlinearoptical crystal401 constitute the polarization separation means and concentering means, respectively.
• While preferred embodiments of the present invention have been explained in the foregoing, the laser processing apparatus in accordance with the present invention is not limited to the above-mentionedlaser processing apparatus100,200,300,400 in accordance with the embodiments, and the laser processing method is not restricted to the above-mentioned laser processing methods in accordance with the embodiments. The present invention may also be those modified or applied to others within the scope not deviating from gist set forth in each claim.
INDUSTRIAL APPLICABILITY
• The present invention can improve the controllability of modified spots.
REFERENCE SIGNS LIST
• 1 . . . object to be processed;5 . . . line to cut;7 . . . modified region;100,200,300,400 . . . laser processing apparatus;101 . . . first pulsed laser light source (first laser light source);102 . . . second pulsed laser light source (second laser light source);103 . . . laser light source controller (pulse width control means);104 . . . half-wave plate (first half-wave plate);105 . . . half-wave plate (second half-wave plate);106 . . . polarization beam splitter (first polarization beam splitter, polarization separation means);107 . . . polarization beam splitter (second polarization beam splitter, polarization separation means);112 . . . condenser lens;108,109,203 . . . dichroic mirror (concentering means);121 . . . light intensity controller (light intensity control means);201 . . . polarization beam splitter (first and second polarization beam splitter, polarization separation means, concentering means);301,401 . . . nonlinear optical crystal (concentering means);402 . . . polarization beam splitter (first and second polarization beam splitter, polarization separation means); L1 . . . first pulsed laser light; L2 . . . second pulsed laser light; S . . . modified spot; α . . . intensity threshold

Claims (19)

1. A laser processing apparatus for converging a plurality of pulsed laser light at an object to be processed, so as to form a plurality of modified spots within the object along a line to cut and cause the plurality of modified spots to produce a modified region, the apparatus comprising:

a first laser light source for emitting a first pulsed laser light having a first wavelength;

a second laser light source for emitting a second pulsed laser light having a second wavelength different from the first wavelength;

a first half-wave plate for changing a direction of polarization of the first pulsed laser light;

a second half-wave plate for changing a direction of polarization of the second pulsed laser light;

polarization separation portion for polarization-separating the first pulsed laser light having the direction of polarization changed by the first half-wave plate and the second pulsed laser light having the direction of polarization changed by the second half-wave plate;

a condenser lens for converging at the object the first and second pulsed laser light polarization-separated by the polarization separation portion; and

light intensity control portion for controlling an intensity of the first and second pulsed laser light by varying the directions of polarization of the first and second pulsed laser light changed by the first and second half-wave plates.

2. A laser processing apparatus for converging a plurality of pulsed laser light at an object to be processed, so as to form a plurality of modified spots within the object along a line to cut and cause the plurality of modified spots to produce a modified region, the apparatus comprising:

a first laser light source for emitting a first pulsed laser light having a first wavelength;

a nonlinear optical crystal for receiving the first pulsed laser light and emitting the first pulsed laser light and a second pulsed laser light having a second wavelength different from the first wavelength;

a first half-wave plate for changing a direction of polarization of the first pulsed laser light;

a second half-wave plate for changing a direction of polarization of the second pulsed laser light;

polarization separation portion for polarization-separating the first pulsed laser light having the direction of polarization changed by the first half-wave plate and the second pulsed laser light having the direction of polarization changed by the second half-wave plate;

a condenser lens for converging at the object the first and second pulsed laser light polarization-separated by the polarization separation portion; and

light intensity control portion for controlling an intensity of the first and second pulsed laser light by varying the directions of polarization of the first and second pulsed laser light changed by the first and second half-wave plates.

3. A laser processing apparatus according toclaim 2, further comprising pulse width control portion for controlling a pulse width of the first pulsed laser light emitted from the first laser light source;

wherein the pulse width control portion changes the pulse width of the first pulsed laser light so as to lower a harmonic conversion efficiency of the nonlinear optical crystal such that the nonlinear optical crystal emits no second pulsed laser light.

4. A laser processing apparatus according toclaim 1, further comprising concentering portion for making the first and second pulsed laser light concentric with each other.

5. A laser processing apparatus according toclaim 1, wherein the polarization separation portion includes:

a first polarization beam splitter for polarization-separating the first pulsed laser light having the direction of polarization changed by the first half-wave plate; and

a second polarization beam splitter for polarization-separating the second pulsed laser light having the direction of polarization changed by the second half-wave plate.

6. A laser processing apparatus according toclaim 1, wherein the light intensity control portion has a greater width of controllability for the first pulsed laser light than for the second pulsed laser light.

7. A laser processing apparatus according toclaim 1, wherein the light intensity control portion makes the intensity of the first pulsed laser light lower than an intensity threshold at which the modified spots are formed when the first pulsed laser light is converged alone at the object.

8. A laser processing apparatus for converging a plurality of pulsed laser light at an object to be processed, so as to form a plurality of modified spots within the object along a line to cut and cause the plurality of modified spots to produce a modified region, the apparatus comprising:

a first laser light source for emitting a first pulsed laser light having a first wavelength;

a second laser light source for emitting a second pulsed laser light having a second wavelength different from the first wavelength; and

a condenser lens for converging the first and second pulsed laser light at the object;

wherein the first pulsed laser light has an intensity made lower than an intensity threshold at which the modified spots are formed when the first pulsed laser light is converged alone at the object.

9. A laser processing apparatus for converging a plurality of pulsed laser light at an object to be processed, so as to form a plurality of modified spots within the object along a line to cut and cause the plurality of modified spots to produce a modified region, the apparatus comprising:

a first laser light source for emitting a first pulsed laser light having a first wavelength;

a nonlinear optical crystal for receiving the first pulsed laser light and emitting the first pulsed laser light and a second pulsed laser light having a second wavelength different from the first wavelength; and

a condenser lens for converging the first and second pulsed laser light at the object;

wherein the first pulsed laser light has an intensity made lower than an intensity threshold at which the modified spots are formed when the first pulsed laser light is converged alone at the object.

10. A laser processing apparatus according toclaim 1, wherein the first pulsed laser light has a wavelength longer than that of the second pulsed laser light.

11. A laser processing method of converging a plurality of pulsed laser light at an object to be processed, so as to form a plurality of modified spots within the object along a line to cut and cause the plurality of modified spots to produce a modified region;

the method comprising the step of converging a first pulsed laser light having a first wavelength and a second pulsed laser light having a second wavelength different from the first wavelength at the object through a condenser lens;

wherein the step makes the first pulsed laser light have an intensity lower than an intensity threshold at which the modified spots are formed when the first pulsed laser light is converged alone at the object.

12. A laser processing method according toclaim 11, wherein the first pulsed laser light has a wavelength longer than that of the second pulsed laser light.

13. A laser processing apparatus according toclaim 2, further comprising concentering portion for making the first and second pulsed laser light concentric with each other.

14. A laser processing apparatus according toclaim 2, wherein the polarization separation portion includes:

a first polarization beam splitter for polarization-separating the first pulsed laser light having the direction of polarization changed by the first half-wave plate; and

a second polarization beam splitter for polarization-separating the second pulsed laser light having the direction of polarization changed by the second half-wave plate.

15. A laser processing apparatus according toclaim 2, wherein the light intensity control portion has a greater width of controllability for the first pulsed laser light than for the second pulsed laser light.

16. A laser processing apparatus according toclaim 2, wherein the light intensity control portion makes the intensity of the first pulsed laser light lower than an intensity threshold at which the modified spots are formed when the first pulsed laser light is converged alone at the object.

17. A laser processing apparatus according toclaim 2, wherein the first pulsed laser light has a wavelength longer than that of the second pulsed laser light.

18. A laser processing apparatus according toclaim 8, wherein the first pulsed laser light has a wavelength longer than that of the second pulsed laser light.

19. A laser processing apparatus according toclaim 9, wherein the first pulsed laser light has a wavelength longer than that of the second pulsed laser light.

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