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US20120031026A1 - Raised floor with improved structure - Google Patents

Raised floor with improved structure
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Publication number
US20120031026A1
US20120031026A1US12/923,459US92345910AUS2012031026A1US 20120031026 A1US20120031026 A1US 20120031026A1US 92345910 AUS92345910 AUS 92345910AUS 2012031026 A1US2012031026 A1US 2012031026A1
Authority
US
United States
Prior art keywords
metal base
adhesive layer
raised floor
improved structure
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US12/923,459
Inventor
Yao-Chung Chen
Shih-Jan Wang
Chien-Yu Chen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by IndividualfiledCriticalIndividual
Publication of US20120031026A1publicationCriticalpatent/US20120031026A1/en
Abandonedlegal-statusCriticalCurrent

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Abstract

A raised floor with improved structure comprises a metal base, an adhesive layer, and a hard material layer. The metal base is provided with a space therein and has a top and a bottom. The top of the metal base is provided with a plurality of holes and the internal wall of each hole is a binding part. The bottom of the metal base is provided with a plurality of upward recessed parts. The adhesive layer is coated on the top of the metal base. The hard material layer is adhered onto the adhesive layer. After the hard material layer is adhered to the adhesive layer, part of the adhesive in the adhesive layer will be pressed into the holes and attach onto the binding parts. Consequently, it is able to enhance the binding ability of the adhesive layer, so that the hard material layer can be attached more firmly to the metal base.

Description

Claims (7)

US12/923,4592010-08-052010-09-23Raised floor with improved structureAbandonedUS20120031026A1 (en)

Applications Claiming Priority (2)

Application NumberPriority DateFiling DateTitle
TW099215023UTWM396306U (en)2010-08-052010-08-05Improved structure of raised floor
TW0992150232010-08-05

Publications (1)

Publication NumberPublication Date
US20120031026A1true US20120031026A1 (en)2012-02-09

Family

ID=45087186

Family Applications (1)

Application NumberTitlePriority DateFiling Date
US12/923,459AbandonedUS20120031026A1 (en)2010-08-052010-09-23Raised floor with improved structure

Country Status (2)

CountryLink
US (1)US20120031026A1 (en)
TW (1)TWM396306U (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
TWI490395B (en)*2013-04-252015-07-01
US9328520B1 (en)*2015-07-172016-05-03Matthew KriserHigh strength in-floor decoupling membrane
ITUA20162209A1 (en)*2016-04-012017-10-01Progress Profiles Spa SUPPORT FOR HEATING ELEMENTS OF FLOORING AND RADIANT COVERINGS
JP2020153136A (en)*2019-03-202020-09-24紀陽産業株式会社 Adhesive panel
US10975582B2 (en)*2017-04-262021-04-13Ewald Dörken AgUncoupling strip

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
BRPI1100626A2 (en)*2011-01-312013-05-28Maxcasa S A modular raised floor

Citations (9)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US4142341A (en)*1978-01-161979-03-06Mult-A-Frame CorporationPanel construction for elevated floor systems
US5046291A (en)*1990-06-071991-09-10Unistrut CorporationFloor panel assembly
US5052161A (en)*1989-11-081991-10-01Whitacre Daniel CTile application structure
US5115621A (en)*1987-09-101992-05-26O M Kiki Co., Ltd.Free access floor panel
US6151854A (en)*1997-07-242000-11-28Gutjahr; WalterProfiled web for venting and draining floor tiles, particularly ceramic tiles, laid in a thin retaining layer
US6584739B2 (en)*2000-03-072003-07-01Maxcess Technologies, Inc.Applied edge trim
US7328667B1 (en)*2005-03-212008-02-12Epic Metals CorporationThree dimensional plated deck
US20100024326A1 (en)*2004-10-262010-02-04Turner Brian HUnderlayment for tile surface
US7874111B2 (en)*2006-04-072011-01-25Wigasol AgFloor system

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US4142341A (en)*1978-01-161979-03-06Mult-A-Frame CorporationPanel construction for elevated floor systems
US5115621A (en)*1987-09-101992-05-26O M Kiki Co., Ltd.Free access floor panel
US5052161A (en)*1989-11-081991-10-01Whitacre Daniel CTile application structure
US5046291A (en)*1990-06-071991-09-10Unistrut CorporationFloor panel assembly
US6151854A (en)*1997-07-242000-11-28Gutjahr; WalterProfiled web for venting and draining floor tiles, particularly ceramic tiles, laid in a thin retaining layer
US6584739B2 (en)*2000-03-072003-07-01Maxcess Technologies, Inc.Applied edge trim
US20100024326A1 (en)*2004-10-262010-02-04Turner Brian HUnderlayment for tile surface
US7328667B1 (en)*2005-03-212008-02-12Epic Metals CorporationThree dimensional plated deck
US7874111B2 (en)*2006-04-072011-01-25Wigasol AgFloor system

Cited By (6)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
TWI490395B (en)*2013-04-252015-07-01
US9328520B1 (en)*2015-07-172016-05-03Matthew KriserHigh strength in-floor decoupling membrane
ITUA20162209A1 (en)*2016-04-012017-10-01Progress Profiles Spa SUPPORT FOR HEATING ELEMENTS OF FLOORING AND RADIANT COVERINGS
EP3225763A1 (en)*2016-04-012017-10-04Progress Profiles SPASupport for heating elements of floors and of radiating claddings
US10975582B2 (en)*2017-04-262021-04-13Ewald Dörken AgUncoupling strip
JP2020153136A (en)*2019-03-202020-09-24紀陽産業株式会社 Adhesive panel

Also Published As

Publication numberPublication date
TWM396306U (en)2011-01-11

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Legal Events

DateCodeTitleDescription
STCBInformation on status: application discontinuation

Free format text:ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION


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