Movatterモバイル変換


[0]ホーム

URL:


US20110303392A1 - Flat heat pipe - Google Patents

Flat heat pipe
Download PDF

Info

Publication number
US20110303392A1
US20110303392A1US13/216,770US201113216770AUS2011303392A1US 20110303392 A1US20110303392 A1US 20110303392A1US 201113216770 AUS201113216770 AUS 201113216770AUS 2011303392 A1US2011303392 A1US 2011303392A1
Authority
US
United States
Prior art keywords
container
wick
heat pipe
working fluid
wires
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US13/216,770
Inventor
Yasuhiro Horiuchi
Toshiaki Mabuchi
Mohammad Shahed AHAMED
Masataka Mochizuki
Yuji Saito
Koichi Mashiko
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujikura Ltd
Original Assignee
Fujikura Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujikura LtdfiledCriticalFujikura Ltd
Assigned to FUJIKURA LTD.reassignmentFUJIKURA LTD.ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).Assignors: MABUCHI, TOSHIAKI, SAITO, YUJI, AHAMED, MOHAMMAD SHAHED, MASHIKO, KOICHI, MOCHIZUKI, MASATAKA, HORIUCHI, YASUHIRO
Publication of US20110303392A1publicationCriticalpatent/US20110303392A1/en
Abandonedlegal-statusCriticalCurrent

Links

Images

Classifications

Definitions

Landscapes

Abstract

A thin flat heat pipe capable of transporting heat even if it is bent is provided. The flat heat pipe comprises: a working fluid to be evaporated when heated and to be condensed when the heat dissipates; and a wick, which is formed by bundling a plurality of thin wires while twisting along a center axis thereof, and which is adapted to create a capillary pressure for returning the liquid phase working fluid to a portion where evaporation takes place. The wick is arranged over the entire length of the flat container while being in contact with both upper and lower inner faces of the container or with an inner side face of the container in a manner such that an inner space of the container for letting through an evaporated working fluid is not closed, and a contact portion between the wick and the container is fixed by sintering over the entire length of the wick.

Description

Claims (6)

1. A flat heat pipe, which transports heat by a working fluid to be evaporated when heated and to be condensed when the heat dissipates therefrom, comprising:
a container, which is flattened and in which the working fluid is encapsulated; and
a wick, which is formed by bundling a plurality of thin wires while twisting along a center axis thereof, and which is adapted to create a capillary pressure when the liquid phase working fluid penetrates thereto;
wherein the wick thus formed of the thin wires is arranged over the entire length of the container while being in contact with both an upper inner face and a lower inner face of the container or with an inner side face of the container in a manner not to close an inner space of the container for letting through an evaporated working fluid; and
any of a contact portion between the wick and the container is fixed by sintering over the entire length of the wick.
US13/216,7702009-02-242011-08-24Flat heat pipeAbandonedUS20110303392A1 (en)

Applications Claiming Priority (3)

Application NumberPriority DateFiling DateTitle
JP20090413292009-02-24
JP2009-0413292009-02-24
PCT/JP2010/052696WO2010098303A1 (en)2009-02-242010-02-23Flat heat pipe

Related Parent Applications (1)

Application NumberTitlePriority DateFiling Date
PCT/JP2010/052696ContinuationWO2010098303A1 (en)2009-02-242010-02-23Flat heat pipe

Publications (1)

Publication NumberPublication Date
US20110303392A1true US20110303392A1 (en)2011-12-15

Family

ID=42665510

Family Applications (1)

Application NumberTitlePriority DateFiling Date
US13/216,770AbandonedUS20110303392A1 (en)2009-02-242011-08-24Flat heat pipe

Country Status (4)

CountryLink
US (1)US20110303392A1 (en)
JP (1)JP5075273B2 (en)
CN (1)CN102326046A (en)
WO (1)WO2010098303A1 (en)

Cited By (21)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US20130112372A1 (en)*2011-11-082013-05-09Electronics And Telecommunications Research InstituteFlat heat pipe and fabrication method thereof
US20130175008A1 (en)*2012-01-102013-07-11Chien-Chih YehThin heat pipe
US20140060780A1 (en)*2012-08-292014-03-06Electronics And Telecommunications Research InstituteFlat heat pipe and fabrication method thereof
US8667684B2 (en)*2010-05-142014-03-11Furui Precise Component (Kunshan) Co., Ltd.Flat heat pipe and method for manufacturing the same
US20150013943A1 (en)*2012-04-162015-01-15Furukawa Electric Co., Ltd.Heat pipe
US20150176918A1 (en)*2013-12-242015-06-25Hao PaiCoaxial capillary structure and ultra-thin heat pipe structure having the same
US20160010927A1 (en)*2014-07-142016-01-14Fujikura Ltd.Heat transport device
US20160018166A1 (en)*2014-07-162016-01-21Fujikura Ltd.Flat heat pipe
US20160018165A1 (en)*2014-07-152016-01-21Fujikura Ltd.Heat pipe
US20160131436A1 (en)*2014-11-122016-05-12Asia Vital Components Co., Ltd.Heat pipe structure
US20160153722A1 (en)*2014-11-282016-06-02Delta Electronics, Inc.Heat pipe
WO2018045651A1 (en)*2016-09-122018-03-15合利亿股份有限公司Wireless charging coil structure having heat dissipation function
US9933212B2 (en)2014-01-172018-04-03Fujikura Ltd.Heat pipe
US20180106553A1 (en)*2016-10-132018-04-19Pimems, Inc.Thermal module charging method
US20180170553A1 (en)*2016-12-202018-06-21Qualcomm IncorporatedSystems, methods, and apparatus for passive cooling of uavs
US10850348B2 (en)2017-07-282020-12-01Dana Canada CorporationDevice and method for alignment of parts for laser welding
US20200378690A1 (en)*2019-05-272020-12-03Asia Vital Components (China) Co., Ltd.Heat dissipation unit with axial capillary structure
US11209216B2 (en)2017-07-282021-12-28Dana Canada CorporationUltra thin heat exchangers for thermal management
US20220196339A1 (en)*2020-12-222022-06-23Fujifilm Business Innovation Corp.Thermally conductive pipe, heat treatment device, and treatment system
US11454456B2 (en)2014-11-282022-09-27Delta Electronics, Inc.Heat pipe with capillary structure
US20220373265A1 (en)*2021-05-202022-11-24Euro Heat PipesHeat pipe with improved performance under diverse thermal load distributions

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
JP2012229879A (en)*2011-04-272012-11-22Fujikura LtdFlat heat pipe and method for manufacturing the same
JP5902404B2 (en)*2011-06-102016-04-13株式会社フジクラ Flat heat pipe and method of manufacturing the same
JP2013002641A (en)*2011-06-102013-01-07Fujikura LtdFlat heat pipe and method of manufacturing the same
JP5677267B2 (en)*2011-11-072015-02-25株式会社東芝 Shape memory alloy actuator
CN103292628B (en)*2012-03-022017-03-01联想(北京)有限公司Heat pipe and its processing method and the electronic equipment with this heat pipe
CN105258543B (en)*2014-06-062020-04-17奇鋐科技股份有限公司Cross-woven capillary structure and heat pipe structure thereof
CN104296570A (en)*2014-10-172015-01-21中国石油大学(华东)Heat pipe
JP2017141984A (en)*2016-02-082017-08-17株式会社フジクラ heat pipe
CN113720185B (en)*2017-05-082024-11-15开文热工科技公司 Thermal Management Plane
CN111788445A (en)*2018-03-122020-10-16株式会社藤仓Flat heat pipe
JP2020076522A (en)*2018-11-062020-05-21東芝ホームテクノ株式会社Sheet-shape heat pipe
JP7311057B2 (en)*2021-03-092023-07-19株式会社村田製作所 Heat spreading devices and electronics

Citations (3)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US20070039718A1 (en)*2005-08-172007-02-22Ming-Chih ChenHeat pipe and manufacturing method for the same
US20070234566A1 (en)*2006-03-312007-10-11Jaffe LimitedMethod for adhering a heat pipe wall and a wick structure
US7845394B2 (en)*2007-09-282010-12-07Foxconn Technology Co., Ltd.Heat pipe with composite wick structure

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
JPS5317179B2 (en)*1974-01-291978-06-06
JPH03113254U (en)*1990-03-061991-11-19
JPH08121982A (en)*1994-10-191996-05-17Okano Kogyo KkHeat radiation element and radiator
CN1145094C (en)*1994-11-092004-04-07藤仓电线株式会社Personal computer cooling device and process for mfg. container of heat pipe for the device
JP4382891B2 (en)*1998-08-282009-12-16古河電気工業株式会社 Flat heat pipe and manufacturing method thereof
KR100355275B1 (en)*1999-12-272002-10-11한국전자통신연구원Pressed type heat pipe having a woven-wired wick that is located at center of pipe
JP2003247791A (en)*2002-02-212003-09-05Fujikura Ltd heat pipe
JP3113254U (en)*2005-06-022005-09-02鼎緯熱傳科技股▲ふん▼有限公司 heat pipe

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US20070039718A1 (en)*2005-08-172007-02-22Ming-Chih ChenHeat pipe and manufacturing method for the same
US20070234566A1 (en)*2006-03-312007-10-11Jaffe LimitedMethod for adhering a heat pipe wall and a wick structure
US7845394B2 (en)*2007-09-282010-12-07Foxconn Technology Co., Ltd.Heat pipe with composite wick structure

Cited By (31)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US8667684B2 (en)*2010-05-142014-03-11Furui Precise Component (Kunshan) Co., Ltd.Flat heat pipe and method for manufacturing the same
US9179577B2 (en)*2011-11-082015-11-03Electronics And Telecommunications Research InstituteFlat heat pipe and fabrication method thereof
US20130112372A1 (en)*2011-11-082013-05-09Electronics And Telecommunications Research InstituteFlat heat pipe and fabrication method thereof
US20130175008A1 (en)*2012-01-102013-07-11Chien-Chih YehThin heat pipe
US20150013943A1 (en)*2012-04-162015-01-15Furukawa Electric Co., Ltd.Heat pipe
US10107561B2 (en)*2012-04-162018-10-23Furukawa Electric Co., Ltd.Heat pipe
US20140060780A1 (en)*2012-08-292014-03-06Electronics And Telecommunications Research InstituteFlat heat pipe and fabrication method thereof
US20150176918A1 (en)*2013-12-242015-06-25Hao PaiCoaxial capillary structure and ultra-thin heat pipe structure having the same
US9933212B2 (en)2014-01-172018-04-03Fujikura Ltd.Heat pipe
US20160010927A1 (en)*2014-07-142016-01-14Fujikura Ltd.Heat transport device
US20160018165A1 (en)*2014-07-152016-01-21Fujikura Ltd.Heat pipe
US10415890B2 (en)*2014-07-152019-09-17Fujikura, Ltd.Heat pipe
US20160018166A1 (en)*2014-07-162016-01-21Fujikura Ltd.Flat heat pipe
US20160131436A1 (en)*2014-11-122016-05-12Asia Vital Components Co., Ltd.Heat pipe structure
US10082340B2 (en)*2014-11-122018-09-25Asia Vital Components Co., Ltd.Heat pipe structure
US11892243B2 (en)2014-11-282024-02-06Delta Electronics, Inc.Heat pipe with capillary structure
US20160153722A1 (en)*2014-11-282016-06-02Delta Electronics, Inc.Heat pipe
US11454456B2 (en)2014-11-282022-09-27Delta Electronics, Inc.Heat pipe with capillary structure
WO2018045651A1 (en)*2016-09-122018-03-15合利亿股份有限公司Wireless charging coil structure having heat dissipation function
US11309122B2 (en)2016-09-122022-04-19Holygo CorporationWireless charging coil structure with function of heat dissipation
US20180106553A1 (en)*2016-10-132018-04-19Pimems, Inc.Thermal module charging method
US20180170553A1 (en)*2016-12-202018-06-21Qualcomm IncorporatedSystems, methods, and apparatus for passive cooling of uavs
US11975846B2 (en)2016-12-202024-05-07Qualcomm IncorporatedSystems, methods, and apparatus for passive cooling of UAVs
US11209216B2 (en)2017-07-282021-12-28Dana Canada CorporationUltra thin heat exchangers for thermal management
US10850348B2 (en)2017-07-282020-12-01Dana Canada CorporationDevice and method for alignment of parts for laser welding
US20200378690A1 (en)*2019-05-272020-12-03Asia Vital Components (China) Co., Ltd.Heat dissipation unit with axial capillary structure
US11874067B2 (en)*2019-05-272024-01-16Asia Vital Components (China) Co., LtdHeat dissipation unit with axial capillary structure
US20220196339A1 (en)*2020-12-222022-06-23Fujifilm Business Innovation Corp.Thermally conductive pipe, heat treatment device, and treatment system
US11982493B2 (en)*2020-12-222024-05-14Fujifilm Business Innovation Corp.Thermally conductive pipe, heat treatment device, and treatment system
US20220373265A1 (en)*2021-05-202022-11-24Euro Heat PipesHeat pipe with improved performance under diverse thermal load distributions
US12173967B2 (en)*2021-05-202024-12-24Euro Heat PipesHeat pipe with improved performance under diverse thermal load distributions

Also Published As

Publication numberPublication date
JP5075273B2 (en)2012-11-21
CN102326046A (en)2012-01-18
JPWO2010098303A1 (en)2012-08-30
WO2010098303A1 (en)2010-09-02

Similar Documents

PublicationPublication DateTitle
US20110303392A1 (en)Flat heat pipe
JP5750188B1 (en) heat pipe
JP5902404B2 (en) Flat heat pipe and method of manufacturing the same
US20110297355A1 (en)Heat-conducting module and heat-dissipating device having the same
US20160018166A1 (en)Flat heat pipe
WO2012147217A1 (en)Flat heat pipe and manufacturing method therefor
KR20170084023A (en)Heat pipe
JP2010054121A (en)Variable conductance heat pipe
JP2018004108A (en)Heat radiation module and method for manufacturing the same
US20140345137A1 (en)Method for manufacturing flat heat pipe with sectional differences
JP2013011363A (en)Flat heat pipe
US20140150263A1 (en)Manufacturing method of thin heat pipe
US20240361086A1 (en)Ultra-thin heat pipe and manufacturing method of the same
JP2013002641A (en)Flat heat pipe and method of manufacturing the same
JP5680872B2 (en) Flat heat pipe
US20160010927A1 (en)Heat transport device
JP2010025407A (en)Heat pipe container and heat pipe
JP4827042B2 (en) Heat pipe manufacturing method
JP2003247791A (en) heat pipe
TWI288224B (en)Manufacturing method of heat pipe
JP6694799B2 (en) Heat pipe and manufacturing method thereof
US20190072302A1 (en)Sorption heat transfer module
JP2004053186A (en) Flat heat pipe
JP6928860B1 (en) Vapor chamber
JP5622449B2 (en) heat pipe

Legal Events

DateCodeTitleDescription
ASAssignment

Owner name:FUJIKURA LTD., JAPAN

Free format text:ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:HORIUCHI, YASUHIRO;MABUCHI, TOSHIAKI;AHAMED, MOHAMMAD SHAHED;AND OTHERS;SIGNING DATES FROM 20110721 TO 20110727;REEL/FRAME:026833/0432

STCBInformation on status: application discontinuation

Free format text:ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION


[8]ページ先頭

©2009-2025 Movatter.jp