CROSS-REFERENCE TO RELATED APPLICATIONThis application claims priority under 35 U.S.C. 119 of Korean Patent Application 10-2010-0042869 filed on May 7, 2010, the entire contents of which are hereby incorporated by reference.
BACKGROUND OF THE INVENTION1. Field of the Invention
The present invention relates to an active matrix display apparatus and a method for fabricating the same, and more particularly, to an active matrix LED display apparatus having an active matrix consisting of a transistor and a light emitting diode (LED) and to a fabrication method thereof.
2. Description of the Related Art
So far, the display devices are known such as a cathode ray tube (CRT), a plasma display panel (PDP), a field emission display (FED), a thin film transistor-liquid crystal display (TFT-LCD), and an active-matrix organic light-emitting diode (AMOLED).
The advantages and disadvantages of the known display devices are as like as followings.
The CRT is used to create a color image by an electron beam and has the relatively good performance. However, the CRT has problems such as a heavy weight, a wide thickness, and a higher voltage and power consumption. Therefore, the CRT display has been preferably alternated with other thin flat panel display device due to the problem of the thickness.
The PDP is used to display a screen by a plasma discharge in spaces sealed with a front glass, a back glass and partition walls. However, the PDP has problems related to low image resolution and high driving voltage.
The FED uses a field emission cathode to provide electrons that strike colored phosphor to produce a color image. The FED has a high luminance and a high sense of color. However, the FED has problems such as a fast thermal degradation of the cathode and a stability of high vacuum state.
The TFT-LCD is consisted of a bottom plate with TFT element, an upper plate with color filter, and a liquid crystal locating between the bottom and the upper plates. The TFT-LCD controls an emitting light of a back light using a slope of the liquid crystal by a voltage difference. The TFT-LCD is used widely due to the some advantages such as a thin film, a high resolution, and a long life time. However, because the TFT-LCD is one of non-directly emitting elements, it shows bad in the properties of luminance, contrast, sight angle and response speed.
The AMOLED is used to drive an OLED device by TFT element and does not need a back light and a color filter. Therefore, the AMOLED has some advantages such as a simple fabrication, low power consumption, an ultrafine printing and a flexible display. However, the AMOLED has a short life time due to the using an organic electroluminescence diode and is not easy to make a large size due to the difficulty of molding.
The flat panel display (LCD, OLED, FED etc.) is divided to an active matrix and a passive matrix depending on the driving mode.
The passive matrix is consisted of grid of horizontal and vertical electrode lines. The intersection of grid is a pixel for emitting light. The passive matrix is a simple structure, but needs an instantly high luminance to recognize the pixel for short time. Therefore, the passive matrix has some disadvantages such as high power consumption due to the instant luminance, a difficulty in making large size due to the reduction of luminance by the increasing of the line number, and generally a reduction of life time.
On the other hand, the active matrix is consisted of one or more transistors in each pixel and capacitors to store an electric charge for emitting light. Therefore, the active matrix can be turned constantly on a driving state for one frame and be used to produce a display with good efficiency, low power consumption and large size.
The light emitting diode (LED) according to the present invention is a kind of solid element enabling to convert an electric energy into light and is used to an illuminator, a back light unit of LCD and a display apparatus.
Specifically, a non-organic LED is a light emitting element with some advantages such as high efficiency for reducing the power consumption, high color purity for producing the display with good color reproducing ratio, rapid light emitting property due to the using of electron and hole with very high electrical mobility, a long life time, a low environmental pollution due to the using of non-mercury material, and considerably high reliability.
Among display applications, TV is required the most long life time as more than 30,000 hours. The commercial LED is taken more than 50,000 hours of life time and so is sufficient to apply TV display.
Also, the commercial LED has over 100 lm/W of luminous efficiency which is enough to embody a display with an ultrahigh luminance and low power consumption against OLED. Additionally, compared to the TFT-LCD having a back light of LED, the LED can make a display with very thin and considerably low power consumption and without the luminance loss by a liquid crystal, a polarizing film and a color filter.
By the advanced properties of the LED, the AM-LED driving by active matrix can be displayed with some advantages such as a directly emitting light, a long life time against the AMOLED with organic light emitting diode, high luminance and low power consumption. Also, the LED can be displayed with high reliability by good stability in the infinitesimal quantity of water and oxygen which cause serious thermal degradation in the organic light emitting diode.
The personal and household display applications have a medium and small size of display such as a cellular phone, a digital camera, a video camera, a navigation device, a PDA, handheld PCs, a PMP and so on, and also have a medium and large size of display such as a monitor, a notebook, a TV and so on.
Presently, the LED has many advantages compare to the other displays excepting the commercial TFT-LCD and AMOLED. However, for personal and household applications, the conventional LED shows some disadvantages such as an impossibility of a monolithic process for producing one substrate with red, green and blue elements and an expensiveness of a compound semiconductor for molding a whole substrate.
Generally, the commercial LED display has an electric bulletin board apparatus consisted of the LED modules. However, because a display of the electric bulletin board device is formed through matching each LED board and drive board up by the module consisted of one LED element, each pixel of the display can not be miniaturized to apply to the personal and household applications.
The robotic pick-and-place system can be used to assemble hetero devices on a substrate which is not formed by monolithic method. In a micron size of the device, it shows that the efficiency is reducing and the cost of process is increasing.
Consequently, in order to overcome the mentioned problems, some methods, as like as a fluidic self-assembly (FSA) process (e.g., U.S. Pat. No. 5,545,291), are developed to assemble on one substrate with structures, devices, and subsystems needed the incompatible fabricating process using particular forces such as capillary force, gravity, electronic force, and pattern recognition.
SUMMARY OF THE INVENTIONTechnical ProblemThe present invention is disclosed to overcome the problems in the formation of circuit structure for driving LED display apparatus and in the assembly of general LED display. More specifically, because the miniaturization of pixel to apply to personal and household applications is difficult by the known method of LED display assembly, namely, an individual integration of the LED module consisted of one LED device to a board applied for an electric bulletin board apparatus, the objective of this present invention is to disclose an LED display apparatus having an active device to be assembled with hetero LED devices, switching devices, and driving devices on the same one substrate and a fabrication method thereof to overcome the above problems.
Technical SolutionTo achieve the mentioned objective, a first structure of an LED display apparatus according to the present invention, comprising: a buffer layer forming on a substrate; a switching transistor active layer and a driving transistor active layer formed separately from each other and having a source and a drain in both sides of the each active layer on the buffer layer in a color element unit; a first insulating layer formed to cover the switching and the driving transistor active layers on the substrate; a scan line formed across between the source and the drain of the switching transistor on the first insulating layer; a cathode line formed parallel to and separately from the scan line on the first insulating layer; a storage capacitor bottom electrode formed across between the source and the drain of the driving transistor and connected electrically to the drain of the switching transistor on the first insulating layer in a color element unit; a second insulating layer formed to cover the scan line, the cathode line and the storage capacitor bottom electrode on the first insulating layer; a data line formed vertically to the scan line and connected electrically to the source of the switching transistor on the second insulating layer; a power supply line formed parallel to and separately from the data line and connected electrically to the source of the driving transistor on the second insulating layer; a storage capacitor top electrode formed to overlap the storage capacitor bottom electrode and connected electrically to the power supply line on the second insulating layer in a color element unit; an anode contact layer formed between the data line and the power supply line and connected electrically to the drain of the driving transistor on the second insulating layer in a color element unit; an LED block receptor formed with a third insulating layer to cover at least one part of the data line, the power supply line, the storage capacitor top electrode and the anode contact layer on the second insulating layer in a color element unit; a cathode eutectic layer and an anode eutectic layer formed separately from each other and connected electrically to the cathode line and the anode contract layer, respectively, in the LED block receptor; and an LED block of the color element unit assembled into the LED block receptor through electrical connections of the cathode eutectic layer and the anode eutectic layer to a cathode electrode and an anode electrode of the LED block, respectively.
A second structure of an LED display apparatus according to the present invention, comprising: a data line, a scan line and a cathode line formed parallel to and separately from each other on a substrate; a storage capacitor bottom electrode formed between the scan line and the cathode line in a color element unit; a first insulating layer formed to cover the data line, the scan line, the cathode line and the storage capacitor bottom electrode on the substrate; a power supply line formed vertically to the data line on the first insulating layer; a storage capacitor top electrode formed to overlap the storage capacitor bottom electrode and connected electrically to the power supply line on the first insulating layer in a color element unit; an anode contact layer formed separately from the power supply line on the first insulating layer in a color element unit; a switching transistor receptor, a driving transistor receptor and an LED block receptor formed with a second insulating layer to cover at least one part of the power supply line, the storage capacitor top electrode and the anode contact layer on the first insulating layer in a color element unit; a source eutectic layer, a gate eutectic layer and a drain eutectic layer of a switching transistor formed separately from each other and connected electrically to the data line, the scan line and the storage capacitor bottom electrode, respectively, in the switching transistor receptor; a gate eutectic layer, a source eutectic layer and a drain eutectic layer of a driving transistor formed separately from each other and connected electrically to the storage capacitor bottom electrode, the power supply line and the anode contact layer, respectively, in the drive transistor receptor; a cathode eutectic layer and an anode eutectic layer formed separately from each other and connected electrically to the cathode line and the anode contact layer, respectively, in the LED block receptor; a switching transistor block of the color element unit assembled into the switching transistor receptor through electrical connections of the source eutectic layer, the gate eutectic layer and the drain eutectic layer of the switching transistor to a source electrode, a gate electrode and a drain electrode of the switching transistor block, respectively; a driving transistor block of the color element unit assembled into the driving transistor receptor through electrical connections of the source eutectic layer, the gate eutectic layer and the drain eutectic layer of the driving transistor to a source electrode, a gate electrode and a drain electrode of the driving transistor block, respectively; and an LED block of the color element unit assembled into the LED block receptor through electrical connections of the cathode eutectic layer and the anode eutectic layer to a cathode electrode and an anode electrode of the LED block, respectively.
A third structure of an LED display apparatus according to the present invention, comprising: a power supply line formed on a substrate; a storage capacitor bottom electrode connected electrically and vertically to the power supply line on the substrate in a color element unit; a first insulating layer formed to cover the power supply line and the storage capacitor bottom electrode on the substrate; a data line and a scan line formed parallel to each other and formed vertically to the power supply line on the first insulating layer; a storage capacitor top electrode formed to overlap the storage capacitor bottom electrode and formed near by the scan line on the first insulating layer in a color element unit; an anode contact layer formed separately from and near by the storage capacitor top electrode on the first insulating layer in a color element unit; a switching transistor receptor, a driving transistor receptor and an LED block receptor formed with a second insulating layer to cover at least one part of the data line, the scan line, the storage capacitor top electrode and the anode contact layer on the first insulating layer in a color element unit; a source eutectic layer, a gate eutectic layer and a drain eutectic layer of a switching transistor formed separately from each other and connected electrically to the data line, the scan line and the storage capacitor top electrode, respectively, in the switching transistor receptor; a gate eutectic layer, a source eutectic layer and a drain eutectic layer of a driving transistor formed separately from each other and connected electrically to the storage capacitor top electrode, the power supply line and the anode contact layer, respectively, in the driving transistor receptor; an anode eutectic layer connected electrically to the anode contact layer in the LED block receptor; a switching transistor block of the color element unit assembled into the switching transistor receptor through electrical connections of the source eutectic layer, the gate eutectic layer and the drain eutectic layer of the switching transistor to a source electrode, a gate electrode and a drain electrode of the switching transistor block, respectively; a driving transistor block of the color element unit assembled into the driving transistor receptor through electrical connections of the source eutectic layer, the gate eutectic layer and the drain eutectic layer of the driving transistor to a source electrode, a gate electrode and a drain electrode of the driving transistor block, respectively; an LED block of the color element unit assembled into the LED block receptor through electrical connection of the anode eutectic layer to an anode electrode of the LED block ; a color element defining layer formed with a third insulating layer to expose a part of the LED block on the substrate assembled with the each block; and a cathode line formed to connect electrically to the exposed part of the LED block on the color element defining layer.
A method for fabricating the first structure of an LED display apparatus according to the present invention, comprising: a first step, depositing a buffer layer on a display substrate and forming a switching transistor active layer and a driving transistor active layer in a color element unit; a second step, depositing sequentially a first insulating layer and a conductive material on a whole surface of the substrate and etching the conductive material to form a scan line, a cathode line and a storage capacitor bottom electrode; a third step, depositing sequentially a second insulating layer and a conductive material on a whole surface of the substrate and etching the conductive material to form a data line, a power supply line, a storage capacitor top electrode and an anode contact layer; a fourth step, depositing a third insulating layer on a whole surface of the substrate, etching the third insulating layer to form an LED block receptor in a color element unit and forming a cathode eutectic layer and an anode eutectic layer in the LED block receptor; and a fifth step, assembling an LED block of the color element unit into the LED block receptor by a fluidic self-assembly process.
A method for fabricating the second structure of an LED display apparatus according to the present invention, comprising: a first step, depositing a conductive material on a display substrate and etching the conductive material to form a data line, a scan line, a cathode line and a storage capacitor bottom electrode; a second step, depositing sequentially a first insulating layer and a conductive material on a whole surface of the substrate and etching the conductive material to form a power supply line, a storage capacitor top electrode and an anode contact layer; a third step, depositing a second insulating layer on a whole surface of the substrate, etching the second insulating layer to form a switching transistor block receptor, a driving transistor block receptor and an LED block receptor in a color element unit and forming eutectic layer in the each block receptor; and a fourth step, assembling a switching transistor block, a driving transistor block and an LED block into the each receptor by a fluidic self-assembly process.
A method for fabricating the third structure of an LED display apparatus according to the present invention, comprising: a first step, depositing a conductive material on a display substrate and etching the conductive material to form a power supply line and a storage capacitor bottom electrode; a second step, depositing sequentially a first insulating layer and a conductive material on a whole surface of the substrate and etching the conductive material to forma data line, a scan line, a storage capacitor top electrode and an anode contact layer; a third step, depositing a second insulating layer on a whole surface of the substrate, etching the second insulating layer to form a switching transistor block receptor, a driving transistor block receptor and an LED block receptor in a color element unit and forming eutectic layer in the each block receptor; a fourth step, assembling a switching transistor block, a driving transistor block and an LED block into the each receptor by a fluidic self-assembly process; a fifth step, depositing a third insulating layer on a whole surface of the substrate and etching the third insulating layer to form a color element defining layer for exposing the assembled LED block partially; and a sixth step, depositing a transparent or a semitransparent conductive material and forming a cathode contact layer to connect electrically to the exposed LED block.
Advantageous EffectAn LED display apparatus of the present invention enables to miniaturize pixel by a formation of wiring on bottom layer and an assembly of each block through each eutectic layer into each transistor block receptor and/or each LED block receptor formed according to each color element unit. Therefore, the LED display apparatus can apply to personal and household applications and can embody AM-LED display apparatus with high luminance, low power consumption, high reliability, and superior optical property by assembling a transistor block having high electron mobility.
And a fabricating method of an LED display apparatus according to the present invention comprises forming transistor block receptor and LED block receptor on a display substrate and assembling a prepared single-crystal silicon transistor block and a prepared LED block into the each block receptor by a fluidic self-assembly process. Consequently, the fabricating method of the present invention enables to make efficiently an AM-LED display apparatus at room temperature in a short time by using different shapes of receptor and block depending on the function of a transistor and on the color of an LED.
BRIEF DESCRIPTION OF THE DRAWINGSThe invention may be better understood by the drawings that are briefly described below and attached hereto, in the several figures of which identical reference numbers (if any) refer to identical or similar elements.
FIG. 1 is a circuit diagram for embodying an AM-LED display apparatus according to the present invention.
FIG. 2 is a cross-section view of a structure of a block assembled into a receptor through eutectic layer by a fluidic self-assembly process (FSA).
FIG. 3 is a plane view of structures of LED blocks assembled into LED block receptors which have different shapes depending on a color element R (Red), G (Green), or B (Blue) in an AM-LED display apparatus according to the present invention.
FIG. 4 is a layout to illustrate a structure of any one color element inFIG. 3.
FIG. 5 is a cross-section view of a line AA′ to illustrate a stacked structure and an LED block receptor according to the present invention.
FIGS. 6 and 7 are cross-section views to illustrate a structure of an LED block assembled into an LED block receptor according to the present invention.
FIG. 8 is a cross-section view to illustrate a structure of the LED block inFIG. 6 assembled into the LED block receptor inFIG. 5.
FIG. 9 is a flowchart for a first embodiment on a fabricating method of an AM-LED display apparatus according to the present invention.
FIG. 10 is a plane view of structures of LED blocks assembled into LED block receptors which have different shapes depending on a color element R, G, and B and structures of transistor blocks assembled into switching and driving transistor block receptors which have different shapes depending on the function of transistor in an AM-LED display apparatus according to the present invention.
FIG. 11 is a layout to illustrate a structure of any one color element inFIG. 10.
FIGS. 12 and 13 are cross-section views of lines BB′ and CC′ inFIG. 11 to illustrate a stacked structure, an LED block receptor, and each transistor block receptor according to the present invention.
FIGS. 14 to 17 are cross-section views to illustrate the each structure of the blocks assembled into each receptor inFIG. 12 orFIG. 13 in an AM-LED display apparatus according to the present invention.
FIGS. 18 and 19 are cross-section views to illustrate different fabricating methods of a transistor block according to the present invention.
FIG. 20 is a flowchart for a second embodiment on a fabricating method of an AM-LED display apparatus according to the present invention.
FIG. 21 is another layout to illustrate a structure of any one color element inFIG. 10.
FIG. 22 is cross-section view of a line DD′ inFIG. 21 to illustrate a stacked structure, an LED block receptor, and a transistor block receptor according to the present invention.
FIGS. 23 and 24 are cross-section views to illustrate one fabricating method of an LED block assembled into an LED block receptor inFIG. 22.
FIG. 25 is a cross-section view to illustrate another fabricating method of a LED block assembled into a LED block receptor inFIG. 22.
FIGS. 26 to 31 are cross-section views to illustrate the each structure of the blocks assembled into each receptor inFIG. 22 in an AM-LED display apparatus according to the present invention.
FIG. 32 is a flowchart for a third embodiment on a fabricating method of an AM-LED display apparatus according to the present invention.
In these drawings, the following reference numbers are used throughout: reference number1 indicates a color element,2 means a pixel,3 means a substrate,4 means an LED block of color element R,5 means an LED block of color element G,6 means an LED block of color element B,7 means a switching transistor block,8 means a driving transistor block,10 means a display substrate,20,40,70,72,72a,91,91a,92,93,93a,94, and95 mean a insulating layer,30 means a driving transistor active layer,41 means an LED block receptor,50 and85amean a storage capacity bottom electrode,50aand85 mean a storage capacity top electrode,60 and60amean a cathode line,71 means a switching transistor block receptor,80 and80amean a scan line,81 means a driving transistor block receptor,82 and82amean a power supply line,83,83aand83bmean a data line,84 and84amean a anode contact layer,96 means a color element defining layer,100 means a receptor,200,212,214,222,224,226,232,234,236,242,244 and246 mean an eutectic layer, and300 means a block.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTSA detailed description of preferred embodiments of the present invention is provided below with respect to the accompanying drawings.
The present invention, as shown inFIG. 1, is related to an active matrix (AM)-LED display apparatus, basically comprising: a data driving circuit and a scan line driving circuit; a data line and a scan line connected to the data driving circuit and the scan line driving circuit, respectively; an active matrix which is controlled by the each line and is consisted of a switching transistor Tr1, a driving transistor Tr2, a color element driving storage capacitor Cs and a light emitting diode LED in acolor element unit1; and a power supply line Vdd connected to a drain of the each driving transistor Tr2.
In order to drive a light emitting diode LED of onecolor element1 in an AM-LED display apparatus according to the present invention, when a select signal is transferred to a scan line, which crosses thecolor element1, a switching transistor Tr1 is turned on and then a data voltage of a data line through thecolor element1 is transferred to a gate of a driving transistor Tr2 and simultaneously charges a storage capacitor Cs.
At this time, the data voltage or the charged voltage of the storage capacitor Cs becomes a voltage between a source and a gate of the driving transistor Tr2 and then a current corresponded to the voltage flows from a power supply line Vdd through the driving transistor Tr2 to a light emitting diode LED of thecolor element1. Consequently, the LED emits light corresponding to the current.
Therefore, for controlling a light intensity of an LED, the voltage between a source and a gate of the driving transistor Tr2, namely, the voltage of the storage capacitor Cs can be regulated.
An AM-LED display apparatus according to the present invention is characterized by forming each transistor Tr1, Tr2 and/or an LED of acolor element unit1 inFIG. 1 into ablock300, respectively, and assembling the each transistor block and/or theLED block300 through aneutectic layer200 into areceptor100 formed to have each exposed wiring of a bottom layer on a display substrate as shown inFIG. 2.
Here, theeutectic layer200 is a material layer consisted of a metal or a molten alloy (i.e., a metal compound) with a melting point lower than those of the exposed wiring made of a conductive material such as a metal on the bottom of thereceptor100 and the each electrode made of a conductive material such as a metal of theblock300.
And, in the specification of the present invention, a color element is defined as a basic color of light, i.e., one of R (red), G (green) and B (blue), and apixel2 comprises three color elements R, G, and B as shown inFIGS. 3 and 10.
Referring toFIGS. 3 to 32, preferred embodiments of an AM-LED display apparatus and a fabricating method thereof according to the present invention are described in detail as follow:
First EmbodimentA structure of an AM-LED display apparatus according to a first embodiment of the present invention comprises basically, as shown inFIG. 3, a plurality ofpixels2 formed on thedisplay substrate3 and consisted of threecolor element units1, respectively. The eachcolor element unit1 comprises a switching transistor Tr1, a driving transistor Tr2 and an LED. Here, the switching transistor Tr1 and the driving transistor Tr2 are built in thedisplay substrate3. And the LED is formed by assembling anLED block4 made previously into a block receptor formed on thesubstrate3.
A plane structure of onecolor element unit1 according to the first embodiment is shown with a layout inFIG. 4. The structures formed on the same layer are marked with the same color inFIG. 4.
As shown inFIGS. 4 to 8, a structure according to the first embodiment is characterized by comprising: a buffer layer20 formed on a substrate10; a switching transistor Tr1 active layer (not shown) and a driving transistor Tr2 active layer30 formed separately from each other and having a source32 and a drain34 in both sides of the each active layer on the buffer layer20 in a color element unit1; a first insulating layer40 formed to cover the switching and the driving transistor active layers on the substrate10; a scan line80 formed across between the source and the drain of the switching transistor Tr1 on the first insulating layer40; a cathode line60 formed parallel to and separately from the scan line80 on the first insulating layer40; a storage capacitor bottom electrode50 formed across between the source and the drain of the driving transistor Tr2 and connected electrically to the drain of the switching transistor Tr1 on the first insulating layer40 in a color element unit1; a second insulating layer70 formed to cover the scan line80, the cathode line60 and the storage capacitor bottom electrode50 on the first insulating layer40; a data line83 formed vertically to the scan line80 and connected electrically to the source of the switching transistor Tr1 on the second insulating layer70; a power supply line82 formed parallel to and separately from the data line83 and connected electrically to the source32 of the driving transistor Tr2 on the second insulating layer70; a storage capacitor top electrode85 formed to overlap the storage capacitor bottom electrode50 and connected electrically to the power supply line82 on the second insulating layer70 in a color element unit1; an anode contact layer84 formed between the data line83 and the power supply line82 and connected electrically to the drain34 of the driving transistor Tr2 on the second insulating layer70 in a color element unit1; an LED block receptor41 formed with a third insulating layer92 or94 to cover at least one part of the data line83, the power supply line82, the storage capacitor top electrode85 and the anode contact layer84 on the second insulating layer70 in a color element unit1; a cathode eutectic layer214 and an anode eutectic layer212 formed separately from each other and connected electrically to the cathode line60 and the anode contact layer84, respectively, in the LED block receptor41; and an LED block4 or4aof the color element unit1 assembled into the LED block receptor41 through electrical connections of the cathode eutectic layer214 and the anode eutectic layer212 to a cathode electrode46 or46aand an anode electrode47 or47a,respectively.
Here, thebuffer layer20 can be a silicon oxide layer or a silicon nitride layer, and the switching transistor Tr1 active layer and the driving transistor Tr2active layer30 can be an amorphous silicon layer. But the driving transistor Tr2active layer30 is preferable to be a poly-silicon layer due to the operation of an LED by a driving current.
Additionally, thecathode eutectic layer214 and theanode eutectic layer212 are preferable to be a metal or a metal compound with a melting point lower than those of thescan line80, thecathode line60, the storagecapacitor bottom electrode50, thedata line83, thepower supply line82, the storagecapacitor top electrode85 and theanode contact layer84.
Also, on the substrate assembled with theLED block4 or4a,a thin film encapsulation layer (not shown) can be additionally formed.
In the structure according to the first embodiment, theLED block receptor41 has preferably a recessed region with different plane structure depending on acolor element1 as shown inFIG. 3 and theLED block4 or4aassembled into theLED block receptor41 has also preferably anLED substrate42 with a shape corresponded to the recessed region.
In this way, anLED display3 can be evenly embodied with a plurality ofpixels2 consisted of threecolor elements R4,G5 andB6, respectively.
More preferably, theLED block receptor41 is formed to have the recessed region as a wide opening and a narrow bottom as shown inFIG. 2 and theLED block4 or4ais formed to correspond to the shape of theLED block receptor41.
In this way, when each receptor receives each block by a self-shape recognition principle using gravity and/or fluid vibration, the mismatched blocks can be jumped out and the rightly received blocks are safely held by a capillary force.
On the other hand, theLED block4 or4aassembled into theLED block receptor41 can be formed to have a conventional LED structure. However, for corresponding to the shape of eachLED block receptor41, as shown inFIG. 6, theLED block4 can be formed to have a p-type nitrogencompound semiconductor layer43/nitrogencompound activation layer44/n-type nitrogencompound semiconductor layer45/cathode electrode46 and a p-type nitrogencompound semiconductor layer43/anode electrode47 near by in the same direction of each other on theLED substrate42, or as shown inFIG. 7, theLED block4acan be formed to have an n-type nitrogencompound semiconductor layer45a/nitrogencompound activation layer44a/p-type nitrogencompound semiconductor layer43a/anode electrode47aand an n-type nitrogencompound semiconductor layer45a/cathode electrode46anear by in the same direction of each other on theLED substrate42.
Here, theLED substrate42 can be a sapphire substrate. Depending on each color element, the nitrogen compound can be preferable to be MN, GaN, InN, or a compound of nitrogen and two or more elements of Al, Ga and In. Theanode electrode47 or47aand thecathode electrode46 or46acan be preferable to be Ti, W, Cr, Au, Ag, Ni, or a compound comprising one or more elements of Ti, W, Cr, Au, Ag and Ni.
Also, thecathode eutectic layer214 and theanode eutectic layer212 can be preferable to be a metal, more preferably one of Sn, Pb, Bi and In, a compound comprising one or more elements of Sn, Pb, Bi and In, or a metal compound comprising one element of Sn, Pb, Bi and In and one or more elements of Ag, Sb, Cu, Zn and Mg.
Next, with respect toFIGS. 1 to 9, a method for fabricating the structure of an AM-LED display apparatus according to a first embodiment of the present invention is described in detail.
First, as a first step S110, as shown inFIG. 8, abuffer layer20 is deposited on adisplay substrate10 and a switching transistor active layer (not shown) and a driving transistoractive layer30 is formed on thebuffer layer20 in a color element unit.
As a second step S120, as shown inFIGS. 4 and 8, a first insulatinglayer40 and a conductive material are deposited sequentially on a whole surface of the substrate and the conductive material is etched to form ascan line80, acathode line60 and a storagecapacitor bottom electrode50.
As a third step S130, a second insulatinglayer70 and a conductive material are deposited sequentially on a whole surface of the substrate and the conductive material is etched to form adata line83, apower supply line82, a storagecapacitor top electrode85 and ananode contact layer84.
Here, after depositing the second insulatinglayer70, via holes are formed for contacting a source of a switching transistor, asource32 and adrain34 of a driving transistor before depositing the conductive material on the second insulatinglayer70.
As a fourth step S140, as shown inFIG. 5, a third insulating layer is deposited on a whole surface of the substrate and etched to form anLED block receptor41 in a color element unit and acathode eutectic layer214 and ananode eutectic layer212 are formed in theLED block receptor41.
At this time, theLED block receptor41, as shown inFIG. 3, can be formed to have a different shape depending on a color element, and additionally, can be preferable to be formed to have a recessed region with a wide opening and a narrow bottom as shown inFIG. 2.
As a fifth step S150, as shown inFIG. 8, anLED block4 or4aof the color element unit is assembled into theLED block receptor41 by a fluidic self-assembly (FSA).
Here, theLED block4 or4ais fabricated by a separated process, which comprises forming a PN diode on an LED substrate (S210), forming an anode/a cathode electrode (S220) and forming anLED block4 or4acorresponded to the shape of anLED block receptor41 by dicing saw (S230).
By the separating process, theLED block4 or4ais also fabricated to have a different shape depending on a color element and is put onto a substrate formed with the correspondingLED block receptor41 and immersed in a fluid.
In the fluid, theLED block4 or4acan be moved by gravity and/or fluid vibration and can be safely received in the correspondingLED block receptor41 by a self-shape recognition principle or hydrophilic and hydrophobic properties.
When each LED block receptor is formed to have a recessed region with a wide opening and a narrow bottom as shown inFIG. 2 and theLED block4 or4ais formed to correspond to the eachLED block receptor41 as mentioned above, the mismatched blocks can be jumped out by gravity and/or fluid vibration and the rightly received blocks are safely held by a capillary force.
After theLED block4 or4ais safely received into theLED block receptor41, the temperature of the fluid is increased to the lowest melting point of theeutectic layers212 and214 and then decreased to completely assemble thecathode46 or46aand theanode47 or47aof the eachLED block4 or4awith the exposed wirings in theLED block receptor41.
The rate of assembly of the blocks into the each receptor can be increased by repeating the fifth step.
After the fluidic self-assembly (FSA) process in the fifth step, a vacant receptor in the entire pixels of display can be detected and saved with a coordinate site by using an automated optical inspection (AOI) and then can be assembled with the corresponded block by pick-and-place process using a robot.
The others, the undescribed parts, can be referred to the U.S. Pat. No. 5,545,291 related to the FSA process.
A further step S160, as an option, can be processed to form a thin film encapsulation layer on the substrate assembled with theLED block4 or4a.
Second EmbodimentA structure of an AM-LED display apparatus according to a second embodiment of the present invention comprises basically, as shown inFIG. 10, a plurality ofpixels2 formed on thedisplay substrate3 and consisted of threecolor element units1, respectively. The eachcolor element unit1 is formed by assembling a switchingtransistor block7, a drivingtransistor block8 and anLED block4 made previously into a switching transistor block receptor, a driving transistor block receptor and an LED block receptor, respectively, which are formed on thesubstrate3.
The plane structure of onecolor element unit1 according to the second embodiment is shown with a layout inFIG. 11. The structures formed on the same layer are marked with the same color inFIG. 11.
As shown inFIGS. 11 to 19, a structure according to the second embodiment is characterized by comprising: a data line83a,a scan line80 and a cathode line60 formed parallel to and separately from each other on a substrate10; a storage capacitor bottom electrode50 formed between the scan line80 and the cathode line60 in a color element unit; a first insulating layer72 formed to cover the data line83a,the scan line80, the cathode line60 and the storage capacitor bottom electrode50 on the substrate10; a power supply line82 formed vertically to the data line83aon the first insulating layer72; a storage capacitor top electrode85 formed to overlap the storage capacitor bottom electrode50 and connected electrically to the power supply line82 on the first insulating layer72 in a color element unit; an anode contact layer84 formed separately from the power supply line82 on the first insulating layer72 in a color element unit; a switching transistor receptor71, a driving transistor receptor81 and a LED block receptor41 formed with a second insulating layer91,91a,93,93aor95 to cover at least one part of the power supply line82, the storage capacitor top electrode85 and the anode contact layer84 on the first insulating layer72 in a color element unit; a source eutectic layer232, a gate eutectic layer234 and a drain eutectic layer236 of a switching transistor formed separately from each other and connected electrically to the data line83a,the scan line81 and the storage capacitor bottom electrode50, respectively, in the switching transistor receptor71; a gate eutectic layer224, a source eutectic layer222 and a drain eutectic layer226 of a driving transistor formed separately from each other and connected electrically to the storage capacitor bottom electrode50, the power supply line82 and the anode contact layer84, respectively, in the driving transistor receptor81; a cathode eutectic layer214 and an anode eutectic layer212 formed separately from each other and connected electrically to the cathode line60 and the anode contact layer84, respectively, in the LED block receptor41; a switching transistor block7 of the color element unit assembled into the switching transistor receptor71 through electrical connections of the source eutectic layer232, the gate eutectic layer234 and the drain eutectic layer236 of the switching transistor to a source electrode77, a gate electrode78 and a drain electrode79 of the switching transistor block, respectively; a driving transistor block8 of the color element unit assembled into the driving transistor receptor81 through electrical connections of the source eutectic layer222, the gate eutectic layer224 and the drain eutectic layer226 of the driving transistor to a source electrode807, a gate electrode808 and a drain electrode809 of the driving transistor block, respectively; and an LED block4 or4aof the color element unit assembled into the LED block receptor41 through electrical connections of the cathode eutectic layer214 and the anode eutectic layer212 to a cathode electrode46 or46aand an anode electrode47 or47aof the LED block, respectively.
Here, the switching transistor Tr1 and the driving transistor Tr2 can be formed on an amorphous or polycrystal semiconductor substrate, but the driving transistor Tr2 is preferable to be formed on a single-crystal silicon substrate due to the operation of an LED by a driving current.
Also, the eacheutectic layer212,214,222,224,226,232,234 or236 is preferable to be a metal or a metal compound with a meting point lower than those of thescan line80, thecathode line60, the storagecapacitor bottom electrode50, thepower supply line82, the storagecapacitor top electrode85, theanode contact layer84, the each source electrode77 or807, the eachgate electrode78 or808 and the eachdrain electrode79 or809.
As an optional step, as shown inFIG. 17, a thinfilm encapsulation layer99 can be formed on the substrate assembled with the switchingtransistor block7, the drivingtransistor block8 and theLED block4 or4a.
In the structure according to the second embodiment, theLED block receptor41, as shown inFIG. 10, has preferably a recessed region with different plane structure depending on the color element and theLED block4 or4aassembled into theLED block receptor41 has also preferably anLED substrate42 with a shape corresponded to the recessed region.
In this way, anLED display3 can be evenly embodied with a plurality ofpixels2 consisted of threecolor elements R4,G5 andB6, respectively.
Also, as shown inFIG. 10, the switchingtransistor block receptor71 has preferably a recessed region with different plane structure from the drivingtransistor block receptor81 and eachtransistor block7 or8 assembled into the eachtransistor block receptor71 or81 has also preferably atransistor substrate73 or803 with a shape corresponded to the recessed region.
In this way, as shown inFIGS. 16 and 17, when the height of theeutectic layers222,224,226,232,234 and236 contacted to each electrode of the each transistor is different each other, an only corresponding transistor can be selected to assemble. Also, only driving transistors Tr2 formed on a single-crystal silicon substrate can be selected and used to assemble.
More preferably, as shown inFIG. 2, theLED block receptor41 and thetransistor block receptors71 and81 can be formed to have the recessed region with a wide opening and a narrow bottom, and theblocks4,4a,7 and8 can be formed to correspond to the shape of the each receptor.
In this case, when the blocks are safely received to the each receptor by a self-shape recognition principle using gravity and/or fluid vibration, the mismatched blocks can be jumped out and the rightly received blocks are safely held by a capillary force.
On the other hand, theLED block4 or4aassembled into theLED block receptor41 can be formed to have a conventional LED structure. However, for corresponding to the shape of eachLED block receptor41, as shown inFIG. 6, theLED block4 can be formed to have a p-type nitrogencompound semiconductor layer43/nitrogencompound activation layer44/n-type nitrogencompound semiconductor layer45/cathode electrode46 and a p-type nitrogencompound semiconductor layer43/anode electrode47 near by in the same direction of each other on theLED substrate42, or as shown inFIG. 7, theLED block4acan be formed to have an n-type nitrogencompound semiconductor layer45a/nitrogencompound activation layer44a/p-type nitrogencompound semiconductor layer43a/anode electrode47aand an n-type nitrogencompound semiconductor layer45a/cathode electrode46anear by in the same direction of each other on theLED substrate42.
Also, the transistor blocks7 and8 assembled into the eachtransistor block receptor71 or81 can be formed to have a conventional transistor structure. However, for corresponding to the shape of the eachtransistor block receptor71 or81, as shown inFIGS. 18 and 19, the various structures of the transistor blocks can be formed and be used as followings:sources74 and804 and drains75 and805 are formed on theSOI substrates73 and803, respectively and then each source electrode77 or807 and eachdrain electrode79 or809 are connected to thesource74 or804 and thedrain75 or805, respectively and eachgate electrode78 or808 is formed on agate insulator76 or806 with a gate (inFIG. 18) or without a gate (inFIG. 19).
Here, theLED substrate42 can be a sapphire substrate. Depending on each color element, the nitrogen compound can be preferable to be MN, GaN, InN, or a compound of nitrogen and two or more elements of Al, Ga and In. The eachelectrode47,47a,46,46a,50,77,78,79,85,807,808 or809 can be preferable to be Ti, W, Cr, Au, Ag, Ni, or a compound comprising one or more elements of Ti, W, Cr, Au, Ag and Ni.
Also, the eacheutectic layer212,214,222,224,226,232,234 or236 can be preferable to be a metal, more preferably one of Sn, Pb, Bi and In, a compound comprising one or more elements of Sn, Pb, Bi and In, or a metal compound comprising one element of Sn, Pb, Bi and In and one or more elements of Ag, Sb, Cu, Zn and Mg.
Next, with respect toFIGS. 10 to 20, a method for fabricating the structure of an AM-LED display apparatus according to a second embodiment of the present invention is described in detail.
First, as a first step S310, as shown inFIG. 16, a conductive material is deposited on adisplay substrate10 and the conductive material is etched to form ascan line80, acathode line60 and a storagecapacitor bottom electrode50.
As a second step S320, as shown inFIG. 17, a first insulatinglayer72 and a conductive material are deposited sequentially on a whole surface of the substrate and the conductive material is etched to form apower supply line82, a storagecapacitor top electrode85 and ananode contact layer84.
As a third step S330, as shown inFIGS. 12 and 13, a second insulating layer is deposited on a whole surface of the substrate and etched to form a switchingtransistor block receptor71, a drivingtransistor block receptor81 and anLED block receptor41 in a color element unit, andeutectic layers212,214,222,224,226,232,234 and236 are formed in the each receptor.
At this time, as shown inFIG. 10, theLED block receptor41 can be formed to have a different shape depending on a color element and the eachtransistor block receptor71 or81 can be formed to have a different shape depending on the function. Additionally, all thereceptors41,71 and81 can be preferable to be formed to have a recessed region with a wide opening and a narrow bottom as shown inFIG. 2.
Also, after forming thereceptors41,71 and81, via holes are formed for connecting electrically to each wiring on the bottom layer before forming the eutectic layers.
As a fourth step S340, as shown inFIGS. 14 to 16, a switchingtransistor block7, a drivingtransistor block8 and anLED block4 are assembled into the eachreceptor41,71 or81 by a fluidic self-assembly (FSA).
Here, the eachtransistor block7 or8 is fabricated by a separated process, as shown inFIG. 18 or19, namely, which comprises forming asource74 or804/adrain75 or805 on aSOI substrate73 or803 consisted of abottom substrate70 or801/a buriedoxide layer72 or802/a top substrate (S410), formingcontact electrodes77,78 and79;807,808 and809 (S420), dividing the devices to have a different shape depending on the usage or function (S430) and etching the buriedoxide layer72 or802 by HF solution to form the eachtransistor block7 or8 (S440).
Also, theLED block4 or4ais fabricated by a separated process, which comprises forming a PN diode on an LED substrate (S510), forming an anode/a cathode electrode (S520) and forming anLED block4 or4acorresponded to the shape of anLED block receptor41 by dicing saw (S530).
By the separating process, the transistor blocks7 and8 and theLED block4 or4aare fabricated to have different shapes depending on the usage and the color element, respectively and are put onto a substrate formed with thecorresponding block receptors41,71 and81 and immersed in a fluid.
In the fluid, the blocks can be moved by gravity and/or fluid vibration and can be safely received in the each correspondingreceptor41,71 or81 by a self-shape recognition principle or hydrophilic and hydrophobic properties.
When thereceptors41,71 and81 are formed to have a recessed region with a wide opening and a narrow bottom, respectively, as shown inFIG. 2 and theblocks4,4a,7 and8 are formed to correspond to the eachreceptor41,71 or81, as mentioned above, the mismatched blocks can be jumped out by gravity and/or fluid vibration and the rightly received blocks are safely held by a capillary force.
After theblocks4,4a,7 and8 are safely received into the eachreceptor41,71 or81, the temperature of the fluid is increased to the lowest meting point of theeutectic layers212,214,222,224,226,232,234 and236 and then decreased to completely assemble the electrodes of the safely received block with the exposed wirings in the each receptor.
The rate of assembly of the blocks into the each receptor can be increased by repeating the fourth step.
After the fluidic self-assembly (FSA) process in the fourth step, a vacant receptor in the entire pixels of display can be detected and saved with a coordinate site by using an automated optical inspection (AOI) and then can be assembled with the corresponded block by pick-and-place process using a robot.
The others, the undescribed parts, can be referred to the U.S. Pat. No. 5,545,291 related to the FSA process.
An optional step S350, as shown inFIG. 17, can be further processed to form a thinfilm encapsulation layer99 on the substrate assembled with theblocks4,4a,7 and8.
Third EmbodimentA structure of an AM-LED display apparatus according to a third embodiment of the present invention comprises basically, as shown inFIG. 10, a plurality ofpixels2 formed on thedisplay substrate3 and consisted of threecolor element units1, respectively. The eachcolor element unit1 is formed by assembling a switchingtransistor block7, a drivingtransistor block8 and anLED block4 made previously into a switching transistor block receptor, a driving transistor block receptor and an LED block receptor, respectively, which are formed on thesubstrate3.
The plane structure of onecolor element unit1 according to the third embodiment is shown with a layout inFIG. 21. The structures formed on the same layer are marked with the same color inFIG. 21.
As shown inFIGS. 21 to 31, a structure according to the third embodiment is characterized by comprising: a power supply line82aformed on a substrate10; a storage capacitor bottom electrode85aconnected electrically and vertically to the power supply line82aon the substrate in a color element unit; a first insulating layer74 formed to cover the power supply line82aand the storage capacitor bottom electrode85aon the substrate; a data line83band a scan line80aformed parallel to each other and formed vertically to the power supply line82aon the first insulating layer; a storage capacitor top electrode50aformed to overlap the storage capacitor bottom electrode85aand near by the scan line80aon the first insulating layer in a color element unit; an anode contact layer84aformed separately from and near by the storage capacitor top electrode50aon the first insulating layer in a color element unit; a switching transistor block receptor (not shown), a driving transistor block receptor81 and an LED block receptor41 formed with a second insulating layer91,92 or94 to cover at least one part of the data line83b,the scan line80a,the storage capacitor top electrode50aand the anode contact layer84aon the first insulating layer in a color element unit; a source eutectic layer (not shown), a gate eutectic layer (not shown) and a drain eutectic layer (not shown) of the switching transistor formed separately from each other and connected electrically to the data line83b,the scan line80aand the storage capacitor top electrode50a,respectively, in the switching transistor block receptor (not shown); a gate eutectic layer244, a source eutectic layer242 and a drain eutectic layer246 of a driving transistor formed separately from each other and connected electrically to the storage capacitor top electrode50a,the power supply line82aand the anode contact layer84a, respectively, in the driving transistor block receptor81; an anode eutectic layer216 connected electrically to the anode contact layer84ain the LED block receptor41; a switching transistor block (not shown) of the color element unit assembled into the switching transistor block receptor (not shown) through electrical connections of the source eutectic layer (not shown), the gate eutectic layer (not shown) and the drain eutectic layer (not shown) of the switching transistor to a source electrode, a gate electrode and a drain electrode of the switching transistor block, respectively; a driving transistor block8 of the color element unit assembled into the driving transistor block receptor81 through electrical connections of the source eutectic layer242, the gate eutectic layer244 and the drain eutectic layer246 of the driving transistor to a source electrode, a gate electrode and a drain electrode of the driving transistor block, respectively; an LED block4bor4cof the color element unit assembled into the LED block receptor41 through electrical connection of the anode eutectic layer216 to an anode electrode47bor47cof the LED block; a color element defining layer96 formed with a third insulating layer to expose a part of the LED block4bor4con the substrate assembled with the each block; and a cathode contact layer, more preferably a cathode line,60aformed to connect electrically to the exposed part of the LED block4bor4con the color element defining layer96.
Here, the switching transistor Tr1 and the driving transistor Tr2 can be formed on an amorphous or polycrystal semiconductor substrate, but the driving transistor Tr2 is preferable to be formed on a single-crystal silicon substrate due to the operation of an LED by a driving current.
And the each eutectic layer is preferable to be a metal or a metal compound with a melting point lower than those of thepower supply line82, the storagecapacitor bottom electrode85a,thedata line83b,the scan line80a,the storagecapacitor top electrode50a,theanode contact layer84a,the each source electrode, the each gate electrode and the each drain electrode.
Also, as shown inFIGS. 29 to 31, theLED block4ccan be electrically connected to thecathode contact layer60athrough thecathode electrode46cformed on one side of the LED block.
In the structure according to the third embodiment, theLED block receptor41 has preferably a recessed region with different plane structure depending on the color element as shown inFIG. 10 and theLED block4bor4cassembled into theLED block receptor41 has also preferably a shape corresponded to the recessed region.
In this way, anLED display3 can be evenly embodied with a plurality ofpixels2 consisted of threecolor elements R4,G5 andB6, respectively.
Also, as shown inFIG. 10, the switching transistor block receptor has preferably a recessed region with different plane structure from the drivingtransistor block receptor81 and eachtransistor block7 or8 assembled into the each transistor block receptor has also preferably atransistor substrate73 or803 with a shape corresponded to the recessed region.
In this way, when the height of the eutectic layers contacted to each electrode of the each transistor is different each other, an only corresponding transistor can be selected to assemble. Also, only driving transistors Tr2 formed on a single-crystal silicon substrate can be selected and used to assemble.
More preferably, as shown inFIG. 2, theLED block receptor41 and thetransistor block receptors81 can be formed to have the recessed region with a wide opening and a narrow bottom, and theblocks4b,4c,7 and8 can be formed to correspond to the shape of the each receptor.
In this case, when the blocks are safely received to the each receptor by a self-shape recognition principle using gravity and/or fluid vibration, the mismatched blocks can be jumped out and the rightly received blocks are safely held by a capillary force.
On the other hand, the LED block assembled into theLED block receptor41 can be formed to have a conventional LED structure. However, for corresponding to the shape of eachLED block receptor41, the LED block, as shown inFIG. 24, can be stacked sequentially from the bottom to have an n-type compound semiconductor45b/compound activation layer44b/p-type compound semiconductor43bwith a shape of a wide bottom and a narrow top for reversely assembling in a receptor or the LED block, as shown inFIG. 25, can be stacked sequentially from the bottom to have ananode electrode47c/LED substrate asSiC42c/p-type compound semiconductor43c/compound activation layer44c/n-type compound semiconductor45c/cathode electrode46cwith a shape of a wide top and a narrow bottom for directly assembling in a receptor.
Also, the transistor blocks7 and8 assembled in the each transistor block receptor can be formed to have a conventional structure of transistor. However, for corresponding to the shape of the each transistor block receptor, the transistor blocks7 and8, as shown inFIGS. 18 and 19, can be formed and be used as followings:sources74 and804 and drains75 and805 are formed on theSOI substrates73 and803, respectively and then each source electrode77 or807 and eachdrain electrode79 or809 are connected to thesource74 or804 and thedrain75 or805, respectively and eachgate electrode78 or808 is formed on agate insulator76 or806 with a gate (inFIG. 18) or without a gate (inFIG. 19).
Here, theLED substrate42 can be a sapphire substrate. The compound semiconductor can be preferable to be GaAs, AlN, GaN, InN, or a compound of nitrogen and two or more elements of Al, Ga and In. The each electrode can be preferable to be Ti, W, Cr, Au, Ag, Ni, or a compound comprising one or more elements of Ti, W, Cr, Au, Ag and Ni.
Also, the each eutectic layer can be preferable to be a metal, more preferably one of Sn, Pb, Bi and In, a compound comprising one or more elements of Sn, Pb, Bi and In, or a metal compound comprising one element of Sn, Pb, Bi and In and one or more elements of Ag, Sb, Cu, Zn and Mg.
Next, with respect toFIGS. 21 to 32, a method for fabricating the structure of an AM-LED display apparatus according to a third embodiment of the present invention is described in detail.
First, as a first step S610, as shown inFIG. 22, a conductive material is deposited on adisplay substrate10 and the conductive material is etched to form apower supply line82aand a storagecapacitor bottom electrode85a.
As a second step S620, as shown inFIG. 21, a first insulating layer and a conductive material are deposited sequentially on a whole surface of the substrate and the conductive material is etched to form adata line83b,a scan line80a,a storagecapacitor top electrode50a,and ananode contact layer84a.
As a third step S630, as shown inFIG. 22, a second insulating layer is deposited on a whole surface of the substrate and etched to form a switching transistor block receptor (not shown), a drivingtransistor block receptor81 and anLED block receptor41 in a color element unit, andeutectic layers212,214,222,224,226,232,234 and236 are formed in the each receptor.
At this time, as shown inFIG. 10, theLED block receptor41 can be formed to have a different shape depending on a color element and the eachtransistor block receptor81 can be formed to have a different shape depending on the function. Additionally, all thereceptors41 and81 can be preferable to be formed to have a recessed region with a wide opening and a narrow bottom as shown inFIG. 2.
Also, after forming the receptors, via holes are formed for connecting electrically to each wiring on the bottom layer before forming the eutectic layers.
As a fourth step S640, as shown inFIGS. 26 to 29, a switchingtransistor block7, a drivingtransistor block8 and anLED block4bor4care assembled into the each corresponding receptor by a fluidic self-assembly (FSA).
Here, the eachtransistor block7 or8 is fabricated by a separated process, as shown inFIG. 18 or19, namely, which comprises forming asource74 or804/adrain75 or805 on aSOI substrate73 or803 consisted of abottom substrate70 or801/a buriedoxide layer72 or802/a top substrate (S710), forming thecontact electrodes77,78 and79;807,808 and809 (S720), dividing the devices to have a different shape depending on the usage or function (S730) and etching the buriedoxide layer72 or802 by HF solution to form the eachtransistor block7 or8 (S740).
Also, theLED block4bis fabricated by a separated process, as shown inFIGS. 23 and 24, which comprises depositing asacrificial layer42band forming a PN diode on anLED substrate42a(S810), forming ananode electrode47band dividing the devices to fit a shape of an LED block receptor (S820), and etching thesacrificial layer42bby wet etching to form theLED block4b(S830).
By the separating process, the transistor blocks7 and8 and theLED block4bor4care fabricated to have different shapes depending on the usage and the color element, respectively and are put onto a substrate formed with thecorresponding block receptors41 and81 and immersed in a fluid.
In the fluid, the blocks can be moved by gravity and/or fluid vibration and can be safely received in the each correspondingreceptor41 or81 by a self-shape recognition principle or hydrophilic and hydrophobic properties.
When thereceptors41 and81 are formed to have a recessed region with a wide opening and a narrow bottom, respectively, as shown inFIG. 2 and theblocks4b,4c,7 and8 are formed to correspond to the each receptor, as mentioned above, the mismatched blocks can be jumped out by gravity and/or fluid vibration and the rightly received blocks are safely held by a capillary force.
After theblocks4b,4c,7 and8 are safely received into the eachreceptor41 or81, the temperature of the fluid is increased to the lowest meting point of the eutectic layers and then decreased to completely assemble the electrodes of the safely received block with the exposed wirings in the each receptor.
The rate of assembly of the blocks into the each receptor can be increased by repeating the fourth step.
After the fluidic self-assembly (FSA) process in the fourth step, a vacant receptor in the entire pixels of display can be detected and saved with a coordinate site by using an automated optical inspection (AOI) and then can be assembled with the corresponded block by pick-and-place process using a robot.
The others, the undescribed parts can be referred to the U.S. Pat. No. 5,545,291 related to the FSA process.
As a fifth step S650, as shown inFIG. 27 or30, a third insulating layer is deposited on a whole surface of the substrate and etched to form a colorelement defining layer96 and a part of the assembledLED block4bor4cis exposed through ahole96aof the colorelement defining layer96.
As a sixth step S660, as shown inFIG. 28 or31, a transparent or semitransparent conductive material is deposited on a whole surface of the substrate to form a cathode contact layer, more preferably a cathode line,60aconnected electrically to the exposedLED block4bor4c.
By the above-mentioned, the concreted embodiments of an AM-LED display apparatus and a fabrication method thereof according to the present invention are described in detail. However, because it is described to be understood and practiced by a person with ordinary skill in the art, the expression of the source/drain of the each transistor can be expressed by change each other in the mentioned embodiments. Also, the stacking sequence of the LED and the place of the cathode and the anode electrodes in the mentioned embodiments can be allowed to change.