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US20110233098A1 - Packing box - Google Patents

Packing box
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Publication number
US20110233098A1
US20110233098A1US12/861,930US86193010AUS2011233098A1US 20110233098 A1US20110233098 A1US 20110233098A1US 86193010 AUS86193010 AUS 86193010AUS 2011233098 A1US2011233098 A1US 2011233098A1
Authority
US
United States
Prior art keywords
buffer
board
buffer part
folding line
opening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US12/861,930
Inventor
Sheng Ye
Ming-Ming Luo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hongfujin Precision Industry Shenzhen Co Ltd, Hon Hai Precision Industry Co LtdfiledCriticalHongfujin Precision Industry Shenzhen Co Ltd
Assigned to HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.reassignmentHONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD.ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).Assignors: LUO, Ming-ming, YE, SHENG
Publication of US20110233098A1publicationCriticalpatent/US20110233098A1/en
Abandonedlegal-statusCriticalCurrent

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Abstract

A packing box configured to pack an object and includes a body, a first buffer part, a second buffer part, a third buffer part, and a fourth buffer part. The first buffer part and the third buffer part are located at the bottom of the body. The second buffer part and the fourth buffer part are located at the top of the body. The body, the first buffer part, the second buffer part, the third buffer part, and the fourth buffer part are integrated. The object may be located between the first buffer part, the second buffer part, the third buffer part, and the fourth buffer part.

Description

Claims (11)

US12/861,9302010-03-232010-08-24Packing boxAbandonedUS20110233098A1 (en)

Applications Claiming Priority (2)

Application NumberPriority DateFiling DateTitle
CN2010201386957UCN201694533U (en)2010-03-232010-03-23 Packaging box and sheet material forming the packaging box
CN201020138695.72010-03-23

Publications (1)

Publication NumberPublication Date
US20110233098A1true US20110233098A1 (en)2011-09-29

Family

ID=43395775

Family Applications (1)

Application NumberTitlePriority DateFiling Date
US12/861,930AbandonedUS20110233098A1 (en)2010-03-232010-08-24Packing box

Country Status (3)

CountryLink
US (1)US20110233098A1 (en)
JP (1)JP2011195201A (en)
CN (1)CN201694533U (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US10810475B1 (en)2019-12-202020-10-20Capital One Services, LlcSystems and methods for overmolding a card to prevent chip fraud
US10817768B1 (en)2019-12-202020-10-27Capital One Services, LlcSystems and methods for preventing chip fraud by inserts in chip pocket
US10888940B1 (en)2019-12-202021-01-12Capital One Services, LlcSystems and methods for saw tooth milling to prevent chip fraud
US10977539B1 (en)2019-12-202021-04-13Capital One Services, LlcSystems and methods for use of capacitive member to prevent chip fraud
US11049822B1 (en)2019-12-202021-06-29Capital One Services, LlcSystems and methods for the use of fraud prevention fluid to prevent chip fraud
TWI747706B (en)*2021-01-112021-11-21和碩聯合科技股份有限公司Box structure
US11715103B2 (en)2020-08-122023-08-01Capital One Services, LlcSystems and methods for chip-based identity verification and transaction authentication
US20230271746A1 (en)*2022-02-252023-08-31Futaijing Precision Electronics (Yantai) Co., Ltd.Partition structure and packaging box using the same
US20240190607A1 (en)*2022-12-122024-06-13Apple Inc.Packaging with integrated cushioning supports
US12443821B2 (en)2024-04-152025-10-14Capital One Services, LlcSystems and methods for use of capacitive member to prevent chip fraud

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
TWI432367B (en)*2012-04-132014-04-01Au Optronics CorpCushion package structure
CN107187693A (en)*2017-06-142017-09-22威海职业学院A kind of computer display breakage-proof packaging device
CN112298730B (en)*2019-07-312023-12-29宝洁公司Integrated electronic commerce packaging system with buffer device
CN113060385B (en)*2021-04-282024-07-19东莞市美盈森环保科技有限公司Inner clamp of oven core

Citations (13)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US4134497A (en)*1977-08-101979-01-16Fidelity Container Corp.Shock absorbing carton insert
US4211356A (en)*1977-10-201980-07-08Trio Kabushiki KaishaBuffered package
US5145070A (en)*1991-09-041992-09-08Arvco Container CorporationOne-piece corrugated box with interior supports
US5372259A (en)*1992-06-091994-12-13Sanshin Kogyo Kabushiki KaishaPacking box for shipping protection
US5398808A (en)*1994-07-201995-03-21Umax Data System Inc.Buffer device for packings
US5752605A (en)*1996-05-021998-05-19Riverwood International CorporationTray and sleeve carton with double false walls
US5899336A (en)*1996-10-041999-05-04Chuo Pack Industry Co., Ltd.Sheet of corrugated paper for producing a package
US6685026B1 (en)*2000-11-092004-02-03Arvco Container CorporationOne-piece container with integral internal cushioning supports
US20070034548A1 (en)*2005-08-122007-02-15De Nola Robert CContainer for shipping a plurality of articles
US7303071B2 (en)*2004-03-122007-12-04Funai Electric Co., Ltd.Packing container for electronic instrument
US7424955B2 (en)*2004-07-302008-09-16Asustek Computer Inc.Packing structure and buffer device thereof
US20090173659A1 (en)*2008-01-042009-07-09Premier Image Technology(China) Ltd.Packaging box
US7806262B2 (en)*2006-01-102010-10-05Bayer Schering Pharma AgContainer

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
JP3118438B2 (en)*1997-09-172000-12-18中央紙器工業株式会社 Foldable packing box with buffer structure
JP2000318728A (en)*1999-05-102000-11-21Sony CorpPackaging box

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US4134497A (en)*1977-08-101979-01-16Fidelity Container Corp.Shock absorbing carton insert
US4211356A (en)*1977-10-201980-07-08Trio Kabushiki KaishaBuffered package
US5145070A (en)*1991-09-041992-09-08Arvco Container CorporationOne-piece corrugated box with interior supports
US5372259A (en)*1992-06-091994-12-13Sanshin Kogyo Kabushiki KaishaPacking box for shipping protection
US5398808A (en)*1994-07-201995-03-21Umax Data System Inc.Buffer device for packings
US5752605A (en)*1996-05-021998-05-19Riverwood International CorporationTray and sleeve carton with double false walls
US5899336A (en)*1996-10-041999-05-04Chuo Pack Industry Co., Ltd.Sheet of corrugated paper for producing a package
US6685026B1 (en)*2000-11-092004-02-03Arvco Container CorporationOne-piece container with integral internal cushioning supports
US7303071B2 (en)*2004-03-122007-12-04Funai Electric Co., Ltd.Packing container for electronic instrument
US7424955B2 (en)*2004-07-302008-09-16Asustek Computer Inc.Packing structure and buffer device thereof
US20070034548A1 (en)*2005-08-122007-02-15De Nola Robert CContainer for shipping a plurality of articles
US7806262B2 (en)*2006-01-102010-10-05Bayer Schering Pharma AgContainer
US20090173659A1 (en)*2008-01-042009-07-09Premier Image Technology(China) Ltd.Packaging box

Cited By (23)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US11989607B2 (en)2019-12-202024-05-21Capital One Services, LlcSystems and methods for use of capacitive member to prevent chip fraud
US11403503B2 (en)2019-12-202022-08-02Capital One Services, LlcSystems and methods for use of capacitive member to prevent chip fraud
US10888940B1 (en)2019-12-202021-01-12Capital One Services, LlcSystems and methods for saw tooth milling to prevent chip fraud
US10977539B1 (en)2019-12-202021-04-13Capital One Services, LlcSystems and methods for use of capacitive member to prevent chip fraud
US11049822B1 (en)2019-12-202021-06-29Capital One Services, LlcSystems and methods for the use of fraud prevention fluid to prevent chip fraud
US12350748B2 (en)2019-12-202025-07-08Capital One Services, LlcSystems and methods for saw tooth milling to prevent chip fraud
US11288560B2 (en)2019-12-202022-03-29Capital One Services, LlcSystems and methods for overmolding a card to prevent chip fraud
US11701725B2 (en)2019-12-202023-07-18Capital One Services, LlcSystems and methods for saw tooth milling to prevent chip fraud
US11699058B2 (en)2019-12-202023-07-11Capital One Services, LlcSystems and methods for overmolding a card to prevent chip fraud
US11682635B2 (en)2019-12-202023-06-20Capital One Services, LlcSystems and methods for the use of fraud prevention fluid to prevent chip fraud
US10817768B1 (en)2019-12-202020-10-27Capital One Services, LlcSystems and methods for preventing chip fraud by inserts in chip pocket
US11694056B2 (en)2019-12-202023-07-04Capital One Services, LlcSystems and methods for preventing chip fraud by inserts in chip pocket
US11361208B2 (en)2019-12-202022-06-14Capital One Services, LlcSystems and methods for preventing chip fraud by inserts in chip pocket
US12210922B2 (en)2019-12-202025-01-28Capital One Services, LlcSystems and methods for overmolding a card to prevent chip fraud
US12094839B2 (en)2019-12-202024-09-17Capital One Services, LlcSystems and methods for the use of fraud prevention fluid to prevent chip fraud
US10810475B1 (en)2019-12-202020-10-20Capital One Services, LlcSystems and methods for overmolding a card to prevent chip fraud
US12039391B2 (en)2019-12-202024-07-16Capital One Services, LlcSystems and methods for preventing chip fraud by inserts in chip pocket
US12118553B2 (en)2020-08-122024-10-15Capital One Services, LlcSystems and methods for chip-based identity verification and transaction authentication
US11715103B2 (en)2020-08-122023-08-01Capital One Services, LlcSystems and methods for chip-based identity verification and transaction authentication
TWI747706B (en)*2021-01-112021-11-21和碩聯合科技股份有限公司Box structure
US20230271746A1 (en)*2022-02-252023-08-31Futaijing Precision Electronics (Yantai) Co., Ltd.Partition structure and packaging box using the same
US20240190607A1 (en)*2022-12-122024-06-13Apple Inc.Packaging with integrated cushioning supports
US12443821B2 (en)2024-04-152025-10-14Capital One Services, LlcSystems and methods for use of capacitive member to prevent chip fraud

Also Published As

Publication numberPublication date
CN201694533U (en)2011-01-05
JP2011195201A (en)2011-10-06

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Legal Events

DateCodeTitleDescription
ASAssignment

Owner name:HON HAI PRECISION INDUSTRY CO., LTD., TAIWAN

Free format text:ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:YE, SHENG;LUO, MING-MING;REEL/FRAME:024876/0302

Effective date:20100729

Owner name:HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD

Free format text:ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:YE, SHENG;LUO, MING-MING;REEL/FRAME:024876/0302

Effective date:20100729

STCBInformation on status: application discontinuation

Free format text:ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION


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